CN114446807A - Abutting component and chip testing equipment - Google Patents

Abstract

The invention discloses a pressing component and chip testing equipment. The chip testing device comprises a pressing component. The abutting assembly is fixedly arranged on the cover body, the cover body is used for covering one side of the chip tray suite, and the chip tray suite is used for bearing a plurality of chips. When the cover body is arranged on one side of the chip tray suite, the pressing parts of the pressing components press the surfaces of the chips, and the elastic parts connected with the pressing parts are in a pressed state. When the cover body is arranged on one side of the chip tray suite, a closed space is formed between the cover body and the chip tray suite, and the vacuumizing device of the chip testing equipment can suck air from the closed space so as to enable the closed space to be in a negative pressure state.

Description

Abutting component and chip testing equipment

Technical Field

The present invention relates to a pressing assembly and a chip testing device, and more particularly, to a pressing assembly and a chip testing device suitable for high frequency testing of a chip.

Background

In the conventional IC chip testing apparatus, especially the testing apparatus for performing high frequency testing on the IC chip, during the process of mounting the IC chip, some IC chips may not be correctly electrically connected to the related probes of the testing apparatus due to various factors, and thus, the IC chips which are not correctly mounted cannot be correctly tested.

Because the existing IC chip testing device basically does not check whether the IC chip is correctly installed in the testing device again after the IC chip is installed in the testing device, related personnel often wait until the entire batch of IC chips is tested and find that a part of the IC chips are incorrectly detected because the IC chips are incorrectly installed.

Disclosure of Invention

The invention discloses a pressing component and chip testing equipment, which are mainly used for improving the problem that the IC chip is not correctly detected because the IC chip is not correctly installed in the testing equipment in the conventional IC chip testing equipment.

One embodiment of the present invention discloses a pressing component, which is fixedly arranged on a cover body, a concave part on one side of the cover body is provided with a containing groove, the pressing component is positioned in the containing groove, the cover body is used for covering one side of a chip tray suite, the pressing component is used for pressing a chip carried by one chip fixing piece of the chip tray suite, the chip tray suite comprises a tray and a plurality of chip fixing pieces, the tray comprises a plurality of tray through holes, each tray through hole penetrates through the tray, a chip fixing piece is arranged in each tray through hole, each chip fixing piece comprises at least one fixing through hole and at least one chip containing groove, the fixing through holes penetrate through the chip fixing pieces, each chip containing groove is used for carrying one chip, and a part of the chip arranged in the chip containing groove is exposed out of the fixing piece, the pressing component comprises: a base, which is used for being fixedly arranged on the cover body; the pressing piece comprises a contact part, the contact part is provided with a contact surface, one part of the contact part can extend into one of the fixing through holes, and the contact surface is used for pressing one surface of the chip arranged in one of the chip accommodating grooves; at least one elastic piece, two ends of which are respectively fixed on the base and the pressing piece; when the pressing piece presses against the surface of the chip, the elastic piece elastically deforms, and when the pressing piece does not press against the surface of the chip any more, the elastic piece is pressed to generate elastic restoring force, so that the pressing piece is restored to the state of not pressing against the chip.

Preferably, the pressing piece further comprises a pressing part; when the cover body is arranged on one side of the tray in a covering mode, and the abutting portion abuts against one top face of the tray, one part of the contact portion extends into one of the chip containing grooves, and the contact face can abut against the surface of the chip arranged in the chip containing groove.

Preferably, the pressing component includes at least two elastic members, each elastic member is a compression spring, the pressing part of the pressing component has at least two first grooves, the base has at least two second grooves, each first groove faces one second groove, and two ends of each elastic member are respectively clamped in the first groove and the second groove.

Preferably, the pressing part has two through holes, each through hole of the pressing part is communicated with each first groove, the pressing component further comprises at least two guiding parts and at least two fixing external members, the two fixing external members are fixedly arranged in the two first grooves, each fixing external member has a through hole, one end of each guiding part is fixed on the base, and the other end of each guiding part passes through the through hole of each fixing external member; when the pressing piece moves relative to the base, each fixing sleeve piece can move relative to each guide piece, and the two guide pieces and the two fixing sleeve pieces can limit the moving direction of the pressing piece relative to the base together.

Preferably, the pressing member further includes a pressing portion, the pressing assembly further includes at least one fixing structure and at least one limiting member, the fixing structure is fixed to the base, the limiting member is detachably fixed to the fixing structure, a portion of the limiting member is used for pressing against the pressing portion of the pressing member, and the limiting member and the fixing structure can limit a moving range of the pressing member relative to the base.

Preferably, the position-limiting member includes an accommodating notch for accommodating a portion of the contact portion.

Preferably, the pressing component further includes a heat conducting member, the limiting member is disposed on the base, the heat conducting member is connected to the pressing member and the base, the heat conducting member is located between the pressing member and the base, and the heat conducting member is used to assist the mutual heat energy transfer between the pressing member and the base.

One embodiment of the present invention discloses a chip testing apparatus for testing a plurality of chips carried by a chip tray kit, the chip tray kit comprising a tray and a plurality of chip fixing members, the tray comprising a plurality of tray through holes, each tray through hole penetrating the tray, each chip fixing member disposed in the tray, and each chip fixing member located in each tray through hole, each chip fixing member comprising at least one fixing through hole and at least one chip accommodating groove, the fixing through hole penetrating the chip fixing member, each chip accommodating groove for carrying one chip, a part of the chip disposed in the chip accommodating groove being exposed from the chip fixing member, the chip testing apparatus comprising: a cover body, one side of which is concave and provided with a containing groove, and the cover body is used for covering one side of the tray; a plurality of support and press the subassembly, it sets up in the lid, and each supports and press the subassembly to be located the appearance groove of lid, and a plurality of support and press the subassembly to be used for supporting a plurality of chips that a plurality of chip mounting of pressing chip tray external member bore, each supports and presses the subassembly to contain: a base, which is used for being fixedly arranged on the cover body; the pressing piece comprises a contact part, the contact part is provided with a contact surface, one part of the contact part can extend into one of the fixing through holes, and the contact surface is used for pressing one surface of the chip arranged in one of the chip accommodating grooves; at least one elastic piece, two ends of which are respectively fixed on the base and the pressing piece; when the pressing piece presses against the surface of the chip, the elastic piece elastically deforms, and when the pressing piece does not press against the surface of the chip any more, the elastic restoring force generated by pressing of the elastic piece restores the pressing piece to the state of not pressing against the chip; the testing machine table is used for being connected with the chip tray suite, electrically connecting the testing machine table with a plurality of chips borne by the chip tray suite, and testing the chips arranged in the chip accommodating grooves.

Preferably, the chip testing apparatus further comprises a temperature adjusting device connected to the plurality of pressing components, wherein the temperature adjusting device is used for enabling the temperature of each pressing component to reach a predetermined temperature.

Preferably, when the cover body is arranged on one side of the tray, the cover body, the tray, the plurality of chip fixing pieces and the plurality of chips form a closed space together; the chip testing equipment also comprises a vacuum-pumping device which is used for pumping the air in the closed space so as to make the closed space in a negative pressure state.

Preferably, the cover body comprises a body and a conducting structure, the temperature adjusting device is connected with the conducting structure, the temperature adjusting device is used for enabling the temperature of the conducting structure to rise or fall, each base is detachably fixed on the conducting structure, and the conducting structure can mutually transmit heat energy with the plurality of pressing pieces through the plurality of bases and the plurality of elastic pieces so that the temperature of each pressing piece reaches the preset temperature.

Preferably, at least one flow channel is formed in the conducting structure, and the temperature regulating device can provide a fluid to the flow channel so as to raise or lower the temperature of the conducting structure.

Preferably, the temperature adjusting device comprises a temperature controller and a heating coil, the temperature controller is electrically connected with the heating coil, the heating coil is arranged in the conducting structure, and the temperature controller can enable the heating coil to be actuated so as to enable the temperature of the conducting structure to rise.

Preferably, the temperature adjusting device comprises a temperature controller and a refrigeration chip, the temperature controller is electrically connected with the refrigeration chip, the refrigeration chip is arranged in the conduction structure, and the temperature controller can actuate the refrigeration chip to lower the temperature of the conduction structure.

Preferably, each pressing component further comprises a heat conducting member, the heat conducting member is connected with the pressing member and the base, the heat conducting member is located between the pressing member and the base, and the heat conducting member is used for assisting heat energy transmission between the pressing member and the base.

Preferably, the chip testing apparatus further includes a plurality of auxiliary inserts, the plurality of auxiliary inserts are fixed to one side of the tray, each auxiliary insert includes a body and at least one protrusion, the protrusion is formed by protruding from one side of the body, the protrusion is configured to be disposed in the fixing through hole, the auxiliary insert has an insertion through hole, the insertion through hole penetrates through the body and the protrusion, a hole diameter of the insertion through hole is larger than an outer diameter of the contact portion, a portion of the contact portion can penetrate through the insertion through hole and be exposed to one side of the auxiliary insert, and the insertion through hole is smaller than a hole diameter of the chip accommodating groove.

Preferably, when the cover body is arranged on one side of the tray, the cover body, the tray, the plurality of chip fixing pieces, the plurality of auxiliary insertion pieces and the plurality of chips form a closed space together; the chip testing equipment also comprises a vacuum-pumping device which is used for pumping the air in the closed space so as to make the closed space in a negative pressure state.

Preferably, the chip testing apparatus further comprises a chip tray kit.

Preferably, a plurality of first accommodating grooves are formed in the side wall of each chip fixing member, a plurality of second accommodating grooves are formed in the side wall forming each tray through hole, a plurality of elastic members are arranged between each chip fixing member and the side wall forming the tray through hole, and two ends of each elastic member between each chip fixing member and the side wall forming the tray through hole are correspondingly clamped and arranged in one of the first accommodating grooves and one of the second accommodating grooves.

Preferably, each pressing piece further comprises a pressing part; when the cover body is arranged on one side of the tray in a covering mode, and each abutting portion abuts against one top face of the tray, one part of each contact portion extends into one chip containing groove, and each contact face can abut against the surface of a chip arranged in the chip containing groove.

Preferably, each abutting assembly comprises at least two elastic pieces, each elastic piece is a compression spring, the abutting portion of each abutting piece is provided with at least two first grooves, each base is provided with at least two second grooves, each first groove is arranged to face one second groove, and two ends of each elastic piece are respectively clamped in the first grooves and the second grooves.

Preferably, each pressing piece is provided with two through holes, and each through hole of each pressing piece is communicated with each first groove; each pressing component also comprises at least two guide pieces and at least two fixing external members, the two fixing external members are fixedly arranged in the two first grooves, each fixing external member is provided with a through hole, one end of each guide piece is fixed on the base, and the other end of each guide piece penetrates through the through hole of each fixing external member; when each pressing piece moves relative to the base, each fixing sleeve piece can move relative to each guide piece, and the two guide pieces and the two fixing sleeve pieces can limit the moving direction of the pressing pieces relative to the base together.

Preferably, each pressing member further includes a pressing portion, each pressing assembly further includes at least one fixing structure and at least one limiting member, the fixing structure is fixed to the base, the limiting member is detachably fixed to the fixing structure, a part of the limiting member is used for pressing against the pressing portion of the pressing member, and the limiting member and the fixing structure can limit the moving range of the pressing member relative to the base together.

Preferably, each of the position-limiting members includes an accommodating notch for accommodating a portion of the contact portion.

Preferably, each pressing component further comprises a heat conducting member, the heat conducting member is connected with the pressing member and the base, the heat conducting member is located between the pressing member and the base, and the heat conducting member is used for assisting heat energy transmission between the pressing member and the base.

In summary, the pressing component of the invention and the pressing component included in the chip testing apparatus of the invention are mainly used for pressing the chip disposed in the chip accommodating slot, and when a relevant person wants to test the chip, the pressing component can press the surface of the chip, so that the chip can be tightly electrically connected with the testing machine, thereby ensuring that the chip can be correctly tested.

Drawings

FIG. 1 is a schematic diagram of a chip testing apparatus according to the present invention.

Fig. 2 is a partially enlarged schematic view of fig. 1.

Fig. 3 and 4 are partially enlarged views of different viewing angles of the chip tray assembly according to the present invention.

Fig. 5 and 6 are partially exploded views of the chip tray assembly according to the present invention from different viewing angles.

Fig. 7 is a partially exploded cross-sectional view of a chip tray kit according to the present invention.

Fig. 8 is a partial cross-sectional view of the chip tray assembly of the present invention with a chip.

Fig. 9 is a partially exploded view of the chip tray assembly of the present invention.

Fig. 10 to 12 are schematic views illustrating the operation of fixing the auxiliary insert and the chip fixing member of the chip tray kit according to the present invention.

Fig. 13 is a partially enlarged schematic view of fig. 1.

Fig. 14 is a partially exploded view of the pressing member of the present invention.

Fig. 15 is a partial cross-sectional view of the pressing member of the present invention.

Fig. 16 is a cross-sectional view of the cover and the chip tray set separated from each other according to the present invention.

Fig. 17 is a cross-sectional view of the cover and the chip tray set assembled with each other according to the present invention.

Fig. 18 is a partially enlarged schematic view of fig. 17.

Figure 19 is a cross-sectional view of a different embodiment of the pressing assembly of the present invention.

Detailed Description

In the following description, reference is made to or shown in the accompanying drawings for the purpose of illustrating the subject matter described herein, and in which is shown by way of illustration only, and not by way of limitation, specific reference may be made to the drawings.

Referring to fig. 1 to 8, the chip testing apparatus a of the present invention is used for testing a plurality of chips C (as shown in fig. 8) carried by a chip tray set 1. The chip C referred to in this specification may be any IC chip, memory, etc. The chip test apparatus a includes: a testing machine 2, a cover 3, a plurality of pressing components 4 and a temperature adjusting device 5. The testing machine 2 and the cover 3 are used to hold a chip tray set 1 together.

As shown in fig. 1 and fig. 2, the testing machine 2 can be connected to the chip tray assembly 1, and the testing machine 2 is used to electrically connect to a plurality of chips C (as shown in fig. 8) carried by the chip tray assembly 1 and test the plurality of chips C, and the content of the test performed by the testing machine 2 on each chip C can be designed according to the type and requirement of the actual chip C, which is not limited herein. In practical applications, the testing machine 2 may include a machine body 21, a control module 22 and a plurality of probe bases 23, the control module 22 is disposed on the machine body 21, each probe base 23 includes a plurality of probes (not shown), the probes of each probe base 23 are used for electrically connecting to the chip C to be tested, and the control module 22 can execute a related testing program to perform a related test on the chips C to be tested (as shown in fig. 8) through the probe bases 23. In practical applications, the machine body 21 may have a structure or a mechanism (not shown) for fixing with the chip tray assembly 1, and the machine body 21 or each probe seat 23 may have a structure or a mechanism (not shown) for assisting in restraining the chip C, which is not limited herein. The control module 22 may include, for example, a circuit board, a microprocessor, a control circuit, etc.

As shown in fig. 1, 3 to 8, the chip tray assembly 1 may include a tray 11 and 24 chip fasteners 12. The tray 11 includes 24 tray penetration holes 111, and each tray penetration hole 111 penetrates the tray 11. The number of the tray through holes 111 of the tray 11, the shape and arrangement of the tray through holes 111, etc. are not limited to those shown in the drawings. The number of the chip holder 12 corresponds to the number of the tray penetration holes 111. Each chip fixing member 12 is detachably and fixedly disposed on the tray 11, and each chip fixing member 12 is correspondingly and fixedly disposed in the tray through hole 111.

In practical applications, the chip tray set 1 may further include a plurality of auxiliary fixing members 13, wherein a portion of the auxiliary fixing members 13 is detachably (for example, by engaging with at least one screw) fixedly disposed on one side surface of the tray 11, and another portion of the auxiliary fixing members 13 is detachably and fixedly disposed on another side surface of the tray 11. In the drawings of the present embodiment, each of the chip fasteners 12 may be fastened to the tray 11 by 10 auxiliary fasteners 13, and two opposite sides of the tray 11 are respectively provided with 4 auxiliary fasteners 13 and 6 auxiliary fasteners 13, and the chip fasteners 12 are to be fixedly disposed in the tray through holes 111 by the arrangement of 10 auxiliary fasteners 13. The shape of the auxiliary fixing member 13 and how many auxiliary fixing members 13 the single chip fixing member 12 is fixed to the tray 11 are not limited to those shown in the drawings.

As shown in fig. 5 to 8, each chip fixing member 12 includes 16 fixing through holes 121, 16 chip receiving grooves 122 and a plurality of limiting structures 123. The number of the fixing through holes 121, the chip receiving slots 122 and the limiting structures 123 included in each chip fixing member 12 is not limited to the number shown in the drawings. Each fixing through hole 121 is disposed through the chip fixing member 12, the chip accommodating slot 122 is communicated with the fixing through hole 121, each chip accommodating slot 122 is configured to bear a chip C to be tested, a plurality of electrical connection portions (not shown, such as various pins) of the chip C disposed in the chip accommodating slot 122 are exposed out of the chip fixing member 12, and the electrical connection portions can be connected with the probe seats 23 of the testing machine 2, so that the testing machine 2 (as shown in fig. 1) can be electrically connected with the chip C.

The side walls forming the chip accommodating grooves 122 extend in the direction of the chip accommodating grooves 122 to form the limiting structures 123, and the limiting structures 123 located in the same chip accommodating groove 122 are used for limiting the moving range of the chip C located in the chip accommodating groove 122 together so as to limit the chip C arranged in the chip accommodating groove 122 to leave the chip accommodating groove 122. In the present embodiment, the chip C disposed in the chip accommodating slot 122 is limited by 4 limiting structures 123, but the number, forming position, shape, etc. of the limiting structures 123 are not limited to those shown in the drawings. Of course, the position-limiting structure 123 cannot block the electrical connection portion of the chip C disposed in the chip accommodating slot 122 from being connected to the probe seat 23 of the testing machine 2.

As shown in fig. 7, in practical applications, the chip holder 12 may further include a guiding structure 124 inside, and the guiding structure 124 may be, for example, an inclined surface inclined toward the chip receiving slot 122. Through the design of the guiding structure 124, even if the chip C is placed in a slightly different position in the chip accommodating slot 122 through the fixing through hole 121, the chip C is still guided by the guiding structure 124 and is smoothly placed in the chip accommodating slot 122.

As described above, by the design of detachably fixing the chip fixing member 12 on the tray 11, the user can selectively replace the chip fixing member 12 having the chip receiving slot 122 and the fixing through hole 121 with different shapes and sizes according to the different types, shapes and sizes of the chips C to be tested.

As shown in fig. 5 and fig. 6, in a preferred application, the chip tray assembly 1 may further include a plurality of elastic members 14, one end of each elastic member 14 is fixedly disposed in a first receiving groove 1121 formed in the sidewall 112 of each tray through hole 111, and the other end of each elastic member 14 is correspondingly disposed in a second receiving groove 1251 formed in the sidewall 125 of the chip holder 12. In the embodiment where the exterior of the chip holder 12 is substantially rectangular, at least one elastic member 14 may be disposed between each sidewall 125 of the chip holder 12 and the sidewall 125 forming the tray through-hole 111.

When the chip fixing member 12 is fixedly disposed in the tray through hole 111, the elastic members 14 are in a pressed state, and the elastic force generated by the pressing of each elastic member 14 pushes against the chip fixing member 12, so that the chip fixing member 12 can be stably disposed in the tray through hole 111. Since the elastic members 14 are disposed between the side wall 125 of the chip fixing member 12 and the side wall 112 forming the tray through hole 111, and the auxiliary fixing members 13 are fixed on two opposite wide sides of the tray 11, when a user detaches the auxiliary fixing members 13 from the tray 11, the chip fixing member 12 is still continuously disposed on the tray 11 due to the pushing of the elastic members 14, so that the problem of falling to the ground when the auxiliary fixing members 13 are detached from the tray 11 can be avoided. In addition, by the arrangement of the elastic members 14, when the chip tray set 1 is fixed on one side of the testing machine 2 (as shown in fig. 1), the chip holder 12 can move slightly relative to the tray 11, so that the chips C carried by the chip holder 12 can be more easily connected to the probe seats 23 (as shown in fig. 2) of the testing machine 2.

As shown in fig. 1, 5 to 9, the chip tray set 1 may further include 24 auxiliary inserts 15. The number of the auxiliary insertion pieces 15 is corresponding to the number of the chip holder 12, and the number of the auxiliary insertion pieces 15 is not limited to that shown in the drawings. Each auxiliary insertion member 15 is detachably provided to one side of each chip fixing member 12.

Each auxiliary insert 15 includes a body 151 and a plurality of protrusions 152, the protrusions 152 are formed by protruding one side of the body 151, and the number of the protrusions 152 corresponds to the number of the fixing through holes 121 of each chip fixing member 12. The die holder 12 may further have a plurality of receiving grooves 126, each receiving groove 126 is communicated with each die receiving groove 122, an aperture W1 of the receiving groove 126 is larger than the aperture W2 of the die receiving groove 122, and the receiving groove 126 is used for receiving the protrusion 152 of the auxiliary insert 15.

The auxiliary insert 15 has an insertion through hole 153, the insertion through hole 153 penetrates the body 151 and the protrusion 152, an aperture W3 of the insertion through hole 153 is larger than an outer diameter W4 of a contact portion 421 (as shown in fig. 18 and described in detail later) of the pressing member 42, and a portion of the contact portion 421 can pass through the insertion through hole 153 and be exposed to one side of the auxiliary insert 15 (as shown in fig. 18). Aperture W3 of insertion through-hole 153 is smaller than aperture W2 of chip pocket 122. The height of the protrusion 152 may be substantially equal to the depth of the receiving groove 126, and when the protrusion 152 is located in the receiving groove 126, the body 151 of the auxiliary insert 15 is correspondingly abutted against the top surface 128 of the chip holder 12 (as shown in fig. 8).

As shown in fig. 7 and 8, in order to make the protrusion 152 enter the fixing through hole 121 quickly and correctly, the protrusion 152 may further include a plurality of guiding inclined planes 1521, and the plurality of guiding inclined planes 1521 are used to make the protrusion 152 enter the fixing through hole 121 more easily. As shown in fig. 8, in practical applications, when the chip accommodating groove 122 is provided with the chip C and the protruding portion 152 is located in the accommodating groove 126, a gap G is formed between the protruding portion 152 and the surface C1 of the chip C, and the protruding portion 152 does not contact the surface C1 of the chip C. When the chip holder 12 and the auxiliary interposition member 15 are fixedly installed on the tray 11, the chips C installed in the chip accommodating grooves 122 of the chip holder 12 are commonly restrained by the chip holder 12 and the auxiliary interposition member 15 at the same time, and the respective chips C are hardly separated from the chip holder 12 basically.

The manner in which each auxiliary insert 15 is detachably disposed on one side of each chip holder 12 is not limited herein, and any manner in which each auxiliary insert 15 can be detachably disposed on each chip holder 12 falls within the scope of the present embodiment. For example, in one embodiment, the auxiliary insertion members 15 and the chip fasteners 12 may be disposed in the tray through holes 111 of the tray 11, and the auxiliary fasteners 13 may be used to limit the moving range of the auxiliary insertion members 15 and the chip fasteners 12 relative to the tray 11, that is, the auxiliary insertion members 15 and the chip fasteners 12 are disposed in the tray through holes 111 of the tray 11 through the auxiliary fasteners 13.

In view of the above, as shown in fig. 1, 5, 6, 9 to 12, in one preferred embodiment, the chip tray set 1 may further include a plurality of quick release assemblies 16, at least one quick release assembly 16 is disposed between each auxiliary insert 15 and each chip fixing member 12, and each auxiliary insert 15 can be quickly mounted on one side of the chip fixing member 12 or quickly dismounted from one side of the chip fixing member 12 by at least one quick release assembly 16. For example, each die holder 12 may be provided with two quick release assemblies 16, and each quick release assembly 16 may include: two position-limiting members 161 and two elastic members 162. The chip fixing member 12 may further have a groove 127, one end of each of the two elastic members 162 is fixedly disposed on a sidewall forming the groove 127, the other end of each of the two elastic members 162 is fixed to one of the position-limiting members 161, and the two position-limiting members 161 of each quick release assembly 16 are disposed in one of the grooves 127.

Each limiting member 161 can be pushed to move in the groove 127 and correspondingly press the elastic member 162 connected thereto, and the pressed elastic member 162 can correspondingly generate an elastic restoring force; when the position-limiting element 161 is no longer pushed, the elastic member 162 is pressed to generate an elastic restoring force to restore the position-limiting element 161 to the non-pushed position. When the two limiting members 161 are disposed in the groove 127, a gap P is formed between the two limiting members 161.

Each of the position-limiting members 161 may have a slot 1611, each slot 1611 divides the position-limiting member 161 into a pushing portion 16A and a locking portion 16B, a guiding inclined surface 16A1 is formed at an end of the pushing portion 16A opposite to the elastic member 162, and a locking inclined surface 16B1 is formed at an end of the locking portion 16B facing the pushing portion 16A.

As shown in fig. 10, each auxiliary insert 15 may be formed with a through hole 155, and each auxiliary insert 15 is provided with two engaging members 154, the two engaging members 154 are located at two ends of the through hole 155, and an engaging inclined surface 1541 is formed at an end of each engaging member 154 opposite to the through hole 155. The aperture 155 of the auxiliary insert 15 is provided to allow an insert R to extend therethrough. The insert R is used to push against two position-limiting members 161 disposed on the chip fixing member 12. In practice, the insert R may be fixed to an associated robot arm or the like for fixing the auxiliary insert 15 to the chip holder 12.

As shown in fig. 10 to 11, the auxiliary insertion member 15 and the insertion member R are engaged with each other, and the fixing process to the chip holder 12 may be: first, the insert R passes through the through hole 155 of the auxiliary insert 15 and enters the gap P formed between the two stoppers 161, and since the outer diameter of the insert R is larger than the width of the gap P, when the insert R enters the groove 127, the insert R will push against the pushing portions 16A of the two stoppers 161, and each stopper 161 will move in the direction of the elastic member 162, and each elastic member 162 is pressed and elastically deformed.

As shown in fig. 11, when the end of the insert R abuts against the bottom of the groove 127, each engaging member 154 is correspondingly disposed in the corresponding engaging groove 1611 of each limiting member 161, the engaging inclined surface 1541 of each engaging member 154 is disposed opposite to the engaging inclined surface 16B1 of the engaging portion 16B of the adjacent limiting member 161, and each engaging inclined surface 1541 and the adjacent engaging inclined surface 16B1 are not in contact with each other. Next, as shown in fig. 12, when the insert R is moved out of the groove 127, the two stoppers 161 will move toward each other by the elastic restoring force generated by the two elastic members 162 located in the groove 127 under pressure, and finally, the inclined engaging surface 16B1 of the engaging portion 16B of each stopper 161 will abut against the inclined engaging surface 1541 of the adjacent engaging member 154, so that the auxiliary insert 15 is engaged and fixed to the chip holder 12.

As shown in fig. 12, when the auxiliary insert 15 is fixed to the chip holder 12 through the engaging member 154 and the quick release assembly 16, the mechanism such as the related robot arm can pass the insert R through the through hole 155 of the auxiliary insert 15 and enter the gap P between the two limiting members 161 to push against the two limiting members 161, at this time, the two limiting members 161 will be changed from the state of fig. 12 to the state of fig. 11, in the state of fig. 11, the engaging inclined surface 16B1 of each limiting member 161 will not contact with the engaging inclined surface 1541 of the adjacent engaging member 154, and the mechanism such as the related robot arm can hold the auxiliary insert 15 and pull the auxiliary insert 15 away from the chip holder 12, so that the auxiliary insert 15 and the chip holder 12 are separated from each other.

As shown in fig. 3 and 5, it is worth mentioning that in the embodiment where each auxiliary insert 15 is fixed to one side of the chip holder 12 by the quick release assembly 16, each auxiliary insert 15 may be formed with a plurality of avoiding holes 156, each avoiding hole 156 is used to avoid the auxiliary holder 13, so that the auxiliary holder 13 does not limit the moving range of the auxiliary insert 15.

Referring to fig. 1, 13 and 16, the cover 3 may have a main body 31 and a conductive structure 32, wherein a receiving slot 311 is formed in a concave portion of one side of the main body 31, the conductive structure 32 is formed on one side of the main body 31, and the conductive structure 32 is located in the receiving slot 311. The pressing components 4 are disposed on the cover 3, and each pressing component 4 is located in the containing slot 311 of the cover 3. It should be noted that, in fig. 16 of the present embodiment, the pressing components 4 are illustrated as protruding from one end of the cover 3, but not limited thereto, in different embodiments, the pressing components 4 may not protrude from the cover 3, and each pressing component 4 is completely located in the accommodating groove 311 of the cover 3. In other words, the sum of the thickness of the conductive structure 32 and the height of each pressing element 4 may be greater than, equal to, or less than the depth of the receiving slot 311 of the cover 3.

The cover 3 is disposed on one side of the tray 11. When the cover 3 is disposed on one side of the tray 11, the pressing members 4 disposed on the cover 3 will correspondingly press against the surface C1 of the chip C disposed in the chip holder 12 of the tray 11 (as shown in fig. 18). In different embodiments, when the cover 3 is disposed on one side of the tray 11, the pressing members 4 may not contact the chips C until the enclosed space formed by the cover 3 and the tray 11 is evacuated, and the pressing members 4 do not press against the surfaces C1 of the chips C. The size and shape of the cover 3 and the number of the pressing components 4 disposed on the conductive structure 32 of the cover 3 are not limited to those shown in the drawings.

In practical applications, the cover 3 and the tray 11 may have guiding structures 33, 113 that can be engaged with each other, for example, each guiding structure 33 of the cover 3 may have a blind hole, each guiding structure 113 of the tray 11 may have a column structure, and when the cover 3 is disposed on one side of the tray 11, the column structure of the tray 11 is engaged with the blind hole of the cover 3. Through the design of the guiding structure 33 of the cover 3 and the guiding structure 113 of the tray 11, the cover 3 can be quickly and correctly covered on one side of the tray 11, and accordingly, each pressing component 4 can be quickly and correctly located on one side of the chip C in the chip accommodating slot 122. The number, shape, etc. of the guiding structure 33 of the cover 3 and the guiding structure 113 of the tray 11 are not limited to those shown in the figures.

As shown in fig. 13 to 18, each pressing member 4 includes: a base 41, a pressing member 42 and two elastic members 43. In the embodiment, the 16 pressing components 4 share the same base 41, but not limited thereto, and in different embodiments, the pressing components 4 may not share the same base 41. The base 41 may be a conductive structure 32 detachably fixed to the cover 3. In various embodiments, the base 41 may be integrally formed with the conducting structure 32. In the embodiment where the base 41 is detachably fixed to the cover 3, the related personnel can easily replace and maintain the pressing component 4.

Each pressing member 42 includes a contact portion 421 and a pressing portion 422. The contact portion 421 has a contact surface 4211, an outer diameter W4 of the contact portion 421 is smaller than an aperture W3 of the insertion through hole 153 (as shown in fig. 8), a portion of the contact portion 421 can extend into the insertion through hole 153 (as shown in fig. 18), and the contact surface 4211 can press against a surface C1 of the chip C. The contact portion 421 is mainly used to press the surface C1 of the chip C, so that the chip C can be stably connected to the testing machine 2 (as shown in fig. 1), thereby preventing the chip C from being separated from the probes of the probe socket 23 (as shown in fig. 2) during the testing process of the testing machine 2.

The abutting portion 422 is connected to the contact portion 421, and the abutting portion 422 is used for limiting the moving range of the abutting member 42 relative to the auxiliary insertion member 15, so as to avoid the contact portion 421 excessively abutting against the chip C. As shown in fig. 18, when the cover 3 is disposed on one side of the tray 11, the abutting portion 422 of each pressing member 42 is located on one side of the auxiliary insertion member 15, the contact portion 421 of the pressing member 42 is correspondingly located in the insertion through hole 153, and the contact surface 4211 is correspondingly located on one side of the surface C1 of the chip C.

Both ends of each elastic member 43 are fixed to the base 41 and the pressing member 42. When the contact surface 4211 of the pressing member 42 contacts the uneven surface C1 of the chip C, at least one elastic member 43 is in a compressed state, and the elastic restoring force generated by the compression of the elastic member 43 can make the contact surface 4211 still tightly contact the surface C1 of the chip C. The number of the elastic members 43 included in each pressing component 4 is not limited to two, and in different embodiments, a single pressing component 4 may include only one elastic member 43 or more than 3 elastic members 43.

As shown in fig. 14 and 15, in practical applications, the elastic member 43 may be a compression spring, for example. The pressing component 4 may include two compression springs (elastic members 43), and the pressing component 4 may further include two guiding members 44 and two fixing sleeves 45. The abutting portion 422 of the abutting member 42 may have two first grooves 4221, the base 41 has two second grooves 411, each first groove 4221 faces one second groove 411, and two ends of each compression spring are respectively engaged with the first groove 4221 and the second groove 411.

The abutting portion 422 of the abutting member 42 may further have two through holes 4222, each through hole 4222 is communicated with each first groove 4221, two fixing sleeves 45 are fixedly disposed in the two through holes 4222, each fixing sleeve 45 has a through hole 451, one end of each guiding member 44 is fixed to the base 41, and the other end of each guiding member 44 passes through the through hole 451 of each fixing sleeve 45. When the pressing element 42 moves relative to the base 41, each fixing sleeve 45 can move relative to each guide 44, and the two guides 44 and the two fixing sleeves 45 can jointly limit the moving direction of the pressing element 42 relative to the base 41. By the design of the two guides 44 and the fixing sleeve 45, the pressing element 42 can be effectively limited from moving substantially along the axis L (as shown in fig. 18) perpendicular to the surface of the base 41, so that when the pressing element 42 presses against the surface C1 of the chip C, the contact portion 421 of the pressing element 42 will contact the entire contact surface 4211 with the surface C1 of the chip C.

Referring to fig. 14 again, each pressing component 4 may further include at least one fixing structure 46 and at least one limiting member 47, the limiting member 47 is detachably fixed to the fixing structure 46, a part of the limiting member 47 abuts against the abutting portion 422 of the pressing member 42, and the limiting member 47 and the fixing structure 46 can limit the moving range of the pressing member 42 relative to the base 41. For example, the base 41 may have 24 fixing structures 46, wherein 4 fixing structures 46 are arranged in a row on the base 41, 6 fixing structures 46 and 2 limiting members 47 limit 4 pressing members 42 together, and 24 fixing structures 46 are matched with 8 limiting members 47, so that 16 pressing members 42 are arranged on the base 41. Each fixing structure 46 may have a lock hole 461, each limiting member 47 has 3 through holes 471, and 3 screws S can be mutually matched with 3 fixing structures 46 and 3 through holes 471 of one limiting member 47, so that a single limiting member 47 and 3 fixing structures 46 are mutually fixed, and the single limiting member 47 is correspondingly pressed against the abutting portion 422 of 4 pressing members 42.

In practical applications, the position-limiting member 47 may further include an accommodating notch 472, and the accommodating notch 472 is configured to accommodate a portion of the contact portion 421. In the drawings of the present embodiment, therefore, a single limiting element 47 abuts against the abutting portions 422 of the 4 limiting elements 47 at the same time, so that the limiting element 47 may have 4 accommodating notches 472 correspondingly, and the 4 accommodating notches 472 are part of the contact portion 421 correspondingly accommodating the 4 limiting elements 47. By designing the receiving notch 472, the moving direction of the pressing element 42 relative to the base 41 can be limited, and the pressing element 42 can move along a direction substantially perpendicular to the axis L (shown in fig. 18) of the base 41.

In the embodiment where each pressing component 4 has the guiding element 44, the limiting element 47 has at least one avoiding through hole 473, and each avoiding through hole 473 is used for allowing the guiding element 44 to pass through, that is, when the pressing element 42 moves towards the base 41, a part of the guiding element 44 passes through the avoiding through hole 473. The shape of the escape through hole 473 is not limited to that shown in the figures.

Referring to fig. 1, 13, 16 to 18, the temperature adjusting device 5 may be connected to the pressing members 4 through the cover 3, and the temperature adjusting device 5 is used to make the temperature of each pressing member 42 reach a predetermined temperature. By the arrangement of the temperature adjustment device 5, when the chip C disposed on the chip fixing member 12 is connected to the testing machine 2 and the tested machine 2 is tested, the pressing member 42 reaching the predetermined temperature will press against the surface C1 (shown in fig. 8) of the chip C (shown in fig. 8), so that the chip C can be tested in the environment of the predetermined temperature. In a preferred embodiment, the pressing member 42 is made of a metal material with high thermal conductivity, for example.

In the conventional common chip testing operation, a plurality of chips are placed in a large-scale freezing chamber or an oven for testing, and because the temperatures of various regions of the freezing chamber or the oven are difficult to be completely the same, the plurality of chips cannot be tested at the same temperature, and thus, the testing result is unreliable. In contrast, in the chip testing apparatus a of the present invention, during the testing of the chips C by the testing machine 2, the contact surface 4211 of each pressing member 42 reaching the predetermined temperature is pressed against the surface C1 of each chip C, so that the plurality of chips C are tested at substantially the same temperature.

In practical applications, the temperature adjustment device 5 may be used to make the temperature of each pressing element 42 reach the predetermined temperature in any way according to requirements, and is not limited herein. For example, the temperature adjustment device 5 may be connected to the conducting structure 32 of the cover 3, and each base 41 is fixed to the conducting structure 32, the temperature adjustment device 5 can raise or lower the temperature of the conducting structure 32, and the conducting structure 32 can mutually transmit heat energy to the pressing members 42 through the bases 41 and the elastic members 43, so as to make the temperature of each pressing member 42 reach a predetermined temperature. The conductive structure 32 is a structure made of a material having a high thermal conductivity. In the embodiment in which the body 31 of the cover 3 and the conductive structure 32 are integrally formed, the temperature adjustment device 5 transfers heat energy between the cover 3 and the pressing components 4. In the embodiment where the conducting structure 32 is not integrally formed with the body 31 of the cover 3, the temperature adjustment device 5 may be directly connected to the conducting structure 32.

In one embodiment, the conducting structure 32 may include at least one flow channel (not shown), and the temperature adjustment device 5 can provide a fluid to the flow channel to raise or lower the temperature of the conducting structure 32. Such as various high temperature fluids or low temperature fluids. In one embodiment, the temperature adjustment device 5 may include a temperature controller (not shown) and a heating coil (not shown), the temperature controller is electrically connected to the heating coil, the heating coil is disposed in the conducting structure 32, and the temperature controller can actuate the heating coil to raise the temperature of the conducting structure 32. In the embodiment where the temperature adjustment device 5 includes a temperature controller, the temperature adjustment device 5 may further include a refrigeration chip (not shown), the temperature controller is electrically connected to the refrigeration chip, the refrigeration chip is disposed in the conducting structure 32, and the temperature controller enables the refrigeration chip to operate so as to lower the temperature of the conducting structure 32. In practical applications, the conducting structure 32 may also be provided with a cooling chip and a heating coil, which is not limited herein.

As shown in fig. 14, in order to make it easier for the temperature of the pressing member 42 to reach the predetermined temperature, each pressing member 4 may further include a heat-conducting member 48. The heat conducting member 48 is located between the pressing member 42 and the base 41, and the heat conducting member 48 is connected to the pressing member 42 and the base 41, and the heat conducting member 48 is used for assisting heat energy transfer between the pressing member 42 and the base 41. The heat conduction member 48 may include, for example, two elastic arms 481, and one ends of the two elastic arms 481 are connected to each other. When the pressing element 42 moves towards the base 41, the two elastic arms 481 are pressed by the pressing element 42 and elastically deformed, and when the pressing element 42 moves away from the base 41, the elastic restoring force generated by the pressing of the elastic arms 481 restores the elastic arms 481 to the non-pressed state, so that the heat energy between the pressing element 42 and the conducting structure 32 can be well transferred to each other through the heat conducting element 48 no matter the pressing element 42 is stationary or moves relative to the base 41. It should be noted that the guiding element 44 and the fixing sleeve 45 may also be made of a material with high thermal conductivity, and the guiding element 44 and the fixing sleeve 45 may also be used for conducting heat energy among the pressing element 42, the base 41 and the conducting structure 32.

Referring to fig. 1, 16 to 19, in practical applications, the chip testing apparatus a may further include a vacuum device 6, a moving device 7 and a processing device 8. The processing device 8 is electrically connected to the testing machine 2, the vacuum-pumping device 6 and the moving device 7, and the processing device 8 can control the testing machine 2, the vacuum-pumping device 6 and the moving device 7 to operate. The processing device 8 is, for example, various computers, various servers, and the like.

The moving device 7 is connected to the cover 3, and the moving device 7 can drive the cover 3 to move toward or away from the tray 11. The moving device 7 is mainly used to move the cover 3 and the tray 11 close to or away from each other, so in different embodiments, the moving device 7 may be connected to the tray 11, and the moving device 7 drives the tray 11 to move toward or away from the cover 3.

When the moving device 7 drives the cover 3 to move toward the tray 11, and the cover 3 covers one side of the tray 11, and one side of the tray 11 opposite to the cover 3 is fixed to the testing machine 2, the contact surface 4211 of each pressing member 42 will abut against the surface C1 of the chip C, one side of the chip C is connected to the probe seat 23 of the testing machine 2, and the cover 3, the chip fixing member 12, the tray 11 and the chips C together form a closed space SP. At this time, the processing device 8 controls the operation of the vacuum-pumping device 6, so that the vacuum-pumping device 6 pumps the air in the closed space SP, thereby making the closed space SP in a negative pressure state.

It should be noted that the chip testing apparatus a may further include at least one detector (not shown), the detector is electrically connected to the processing device 8, the detector is used for detecting whether the cover 3 is covered on one side of the tray 11, and when the processing device 8 determines that the cover 3 is covered on one side of the tray 11 according to the detection result of the detector, the processing device 8 controls the vacuum-pumping device 6 to operate.

The design that the gas in the closed space SP is pumped out through the vacuumizing device 6 to enable the closed space SP to be in a negative pressure state can effectively avoid the temperature in the closed space SP from being influenced by the environment outside the closed space SP, so that the humidity of the closed space SP can be effectively controlled, and the problem of condensation on the surface C1 of the low chip C can be greatly solved.

Referring to fig. 8 and 18, since the aperture W3 of the insertion through hole 153 of each auxiliary insert 15 is smaller than the aperture W2 of the chip accommodating slot 122, when the closed space SP is changed from the negative pressure state to the normal pressure state and the moving device 7 moves in the direction away from the tray 11, if the chip C is stuck to the pressing member 42, the chip C is pushed by one end of the protruding portion 152 of the auxiliary insert 15 close to the chip accommodating slot 122 and separated from the contact portion 421 in the process that the contact portion 421 leaves the auxiliary insert 15 along the insertion through hole 153. That is, by providing the auxiliary insertion member 15 on the tray 11 and making the aperture W3 of the insertion through hole 153 smaller than the aperture W2 of the chip accommodating groove 122, it is ensured that the chip C sticks to the contact portion 421 when the cover 3 and the pressing members 4 move in the direction away from the tray 11.

The chip testing apparatus a of the present invention may include, but is not limited to, the testing machine 2, the cover 3, the plurality of pressing components 4, the temperature adjusting device 5, and the processing device 8 during manufacturing and selling, and in different embodiments, the chip testing apparatus a of the present invention may further include at least one of the chip tray set 1, the vacuum pumping device 6, and the moving device 7 during manufacturing and selling. The chip tray set 1 of the present invention may be manufactured and sold separately.

Please refer to fig. 19, which is a schematic cross-sectional view illustrating a pressing assembly according to another embodiment of the present invention. The pressing component of the present embodiment is different from the previous embodiments in the following point: the heat conduction member 48 may be a cylinder structure, one end of the heat conduction member 48 is fixed in a groove 423 of the pressing member 42, one end of the heat conduction member 48 is movably disposed in a groove 412 of the base 41, and the other end of the heat conduction member 48 is fixed to the pressing member 42. When the pressing member 42 moves relative to the base 41, the heat conducting member 48 moves in the accommodating groove 412 corresponding to the base 41, and the heat conducting member 48 is in contact with the sidewall forming the accommodating groove 412 at any time, and the temperature adjusting device 5 and the pressing member 42 mutually transfer heat energy through the base 41 and the heat conducting member 48 in a cylindrical structure.

In summary, the pressing component of the present invention can be applied to a chip testing device, and the pressing component can press the surface of the chip being tested, so that the chip can be stably connected to the related electrical connection socket during the testing process; the pressing component of the invention can also be connected with a temperature adjusting device, and the temperature of the pressing component can reach a preset temperature, so that the pressing component pressed on the surface of the chip being tested can enable the chip to be tested in a state of the preset temperature. According to the chip testing equipment, through the design of the abutting component and the temperature adjusting device, the chip can be abutted by the abutting part to be stably connected with the testing machine table in the testing process of the tested machine table, and the abutting part reaching the preset temperature can also enable the chip to be tested by the tested machine table under the condition of the preset temperature; the chip testing equipment can also be provided with a vacuumizing device, and the chip and the pressing piece reaching the preset temperature can be prevented from being influenced by the external environment easily through the arrangement of the vacuumizing device.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, so that all equivalent technical changes made by using the contents of the present specification and the accompanying drawings are included in the scope of the present invention.

Claims (25)

1. A pressing component is fixedly arranged on a cover body, a containing groove is formed in one side of the cover body in a concave mode, the pressing component is located in the containing groove, the cover body is used for covering one side of a chip tray suite, the pressing component is used for pressing a chip carried by one chip fixing piece of the chip tray suite, the chip tray suite comprises a tray and a plurality of chip fixing pieces, the tray comprises a plurality of tray through holes, each tray through hole penetrates through the tray, one chip fixing piece is arranged in each tray through hole, each chip fixing piece comprises at least one fixing through hole and at least one chip containing groove, each fixing through hole penetrates through the chip fixing piece, each chip containing groove is used for carrying one chip, and part of the chip arranged in the chip containing groove is exposed out of the chip fixing piece, the pressing component comprises:

a base for fixing the cover;

a pressing member, including a contact portion having a contact surface, a portion of the contact portion being capable of extending into one of the fixing through holes, the contact surface being configured to press against a surface of the chip disposed in one of the chip accommodating grooves;

at least one elastic piece, two ends of which are respectively fixed on the base and the pressing piece; when the pressing part presses against the surface of the chip, the elastic part is elastically deformed, and when the pressing part does not press against the surface of the chip any more, the elastic restoring force generated by pressing of the elastic part enables the pressing part to restore to the state of not pressing against the chip.

2. The pressing assembly as claimed in claim 1, wherein said pressing member further comprises a pressing portion; when the cover body is arranged on one side of the tray in a covering mode, and the abutting portion abuts against one top face of the tray, one part of the contact portion extends into one of the chip containing grooves, and the contact face can abut against the surface of the chip arranged in the chip containing groove.

3. The pressing assembly as claimed in claim 2, wherein the pressing assembly comprises at least two elastic members, each of the elastic members is a compression spring, the pressing portion of the pressing member has at least two first grooves, the base has at least two second grooves, each of the first grooves faces one of the second grooves, and both ends of each of the elastic members are respectively engaged with the first groove and the second groove.

4. A pressing assembly as claimed in claim 3, wherein said pressing member has two through holes, each of said through holes of said pressing member is communicated with each of said first grooves, said pressing assembly further comprises at least two guiding members and at least two fixing sleeve members, two of said fixing sleeve members are fixedly disposed in two of said first grooves, each of said fixing sleeve members has a through hole, one end of each of said guiding members is fixed to said base, and the other end of each of said guiding members passes through said through hole of each of said fixing sleeve members; when the pressing piece moves relative to the base, each fixing sleeve can move relative to each guide piece, and the two guide pieces and the two fixing sleeves can jointly limit the moving direction of the pressing piece relative to the base.

5. An abutting assembly according to claim 1, wherein the abutting member further comprises an abutting portion, the abutting assembly further comprises at least one fixing structure and at least one limiting member, the fixing structure is fixed to the base, the limiting member is detachably fixed to the fixing structure, a portion of the limiting member is configured to abut against the abutting portion of the abutting member, and the limiting member and the fixing structure can jointly limit a moving range of the abutting member relative to the base.

6. A pressing assembly according to claim 5, wherein the retaining member includes a receiving recess for receiving a portion of the contact portion.

7. The pressing assembly as claimed in claim 5, further comprising a heat conducting member connected to the pressing member and the base, wherein the heat conducting member is located between the pressing member and the base, and the heat conducting member is configured to assist the mutual heat transfer between the pressing member and the base.

8. The utility model provides a chip test equipment, its characterized in that, chip test equipment is used for testing a plurality of chips that a chip tray external member bore, chip tray external member contains a tray and a plurality of chip mounting, the tray contains a plurality of tray perforation, each the tray perforation runs through the tray, each the chip mounting set up in the tray, and each the chip mounting is located each the tray is perforated, each the chip mounting contains at least one fixed perforation and at least one chip and holds the groove, fixed perforation runs through the chip mounting sets up, each the chip holds the groove and is used for bearing one the chip, set up in the chip holds in the groove a part of the chip expose in the chip mounting, chip test equipment contains:

the cover body is concave at one side and provided with an accommodating groove, and the cover body is used for covering one side of the tray;

a plurality of abutting assemblies, which are arranged on the cover body, wherein each abutting assembly is positioned in the containing groove of the cover body, the plurality of abutting assemblies are used for abutting against a plurality of chips borne by a plurality of chip fixing pieces of the chip tray suite, and each abutting assembly comprises:

a base for fixing the cover;

a pressing member, including a contact portion having a contact surface, a portion of the contact portion being capable of extending into one of the fixing through holes, the contact surface being configured to press against a surface of the chip disposed in one of the chip accommodating grooves;

at least one elastic piece, two ends of which are respectively fixed on the base and the pressing piece; when the pressing piece presses against the surface of the chip, the elastic piece elastically deforms, and when the pressing piece does not press against the surface of the chip any more, the elastic restoring force generated by pressing of the elastic piece enables the pressing piece to restore to a state of not pressing against the chip;

the test machine is used for being electrically connected with the plurality of chips borne by the chip tray suite, and is used for testing the plurality of chips arranged in the plurality of chip accommodating grooves.

9. The apparatus for testing chips as claimed in claim 8, further comprising a temperature adjusting device connected to a plurality of said pressing members, said temperature adjusting device being adapted to allow the temperature of each of said pressing members to reach a predetermined temperature.

10. The chip testing apparatus according to claim 8, wherein when the cover is disposed on one side of the tray, the cover, the tray, the plurality of chip fixing members and the plurality of chips together form a closed space; the chip testing equipment also comprises a vacuumizing device, wherein the vacuumizing device is used for extracting air in the closed space so as to enable the closed space to be in a negative pressure state.

11. The apparatus for testing chips as defined in claim 9, wherein said cover includes a body and a conductive structure, said temperature adjustment device being connected to said conductive structure, said temperature adjustment device being adapted to raise or lower the temperature of said conductive structure, each of said bases being detachably secured to said conductive structure, said conductive structure being capable of transferring heat energy to and from said plurality of pressing members via said plurality of bases and said plurality of resilient members, so as to bring the temperature of each of said pressing members to said predetermined temperature.

12. The apparatus of claim 11, wherein the conductive structure has at least one flow channel formed therein, and the temperature adjustment device is capable of providing a fluid to the flow channel to raise or lower the temperature of the conductive structure.

13. The apparatus of claim 11, wherein the temperature adjustment device comprises a temperature controller and a heating coil, the temperature controller is electrically connected to the heating coil, the heating coil is disposed in the conducting structure, and the temperature controller enables the heating coil to be activated to raise the temperature of the conducting structure.

14. The apparatus according to claim 11, wherein the temperature adjustment device comprises a temperature controller and a cooling chip, the temperature controller is electrically connected to the cooling chip, the cooling chip is disposed in the conducting structure, and the temperature controller enables the cooling chip to operate to lower the temperature of the conducting structure.

15. The apparatus of claim 11, wherein each of the pressing members further comprises a heat conducting member, the heat conducting member is connected to the pressing member and the base, and the heat conducting member is located between the pressing member and the base, and the heat conducting member is used to assist the mutual heat transfer between the pressing member and the base.

16. The apparatus of claim 8, further comprising a plurality of auxiliary inserts fixed to one side of the tray, each of the auxiliary inserts including a body and at least one protrusion protruding from one side of the body, the protrusion being configured to be disposed in the fixing through hole, the auxiliary insert having an insertion through hole penetrating the body and the protrusion, the insertion through hole having a diameter larger than an outer diameter of the contact, and a portion of the contact being capable of passing through the insertion through hole and being exposed to one side of the auxiliary insert, the insertion through hole being smaller than a diameter of the chip receiving slot.

17. The apparatus for testing chips of claim 16, wherein the cover, the tray, the plurality of chip fasteners, the plurality of auxiliary inserts, and the plurality of chips together form a closed space when the cover is disposed on one side of the tray; the chip testing equipment also comprises a vacuumizing device, wherein the vacuumizing device is used for extracting air in the closed space so as to enable the closed space to be in a negative pressure state.

18. The chip testing apparatus according to claim 8, wherein said chip testing apparatus further comprises said chip tray kit.

19. The apparatus for testing chips as claimed in claim 18, wherein a plurality of first receiving slots are formed on a sidewall of each of said chip fixing members, a plurality of second receiving slots are formed on a sidewall of each of said tray through holes, a plurality of elastic members are disposed between each of said chip fixing members and the sidewall of each of said tray through holes, and both ends of each of said elastic members disposed between each of said chip fixing members and the sidewall of each of said tray through holes are correspondingly engaged with one of said first receiving slots and one of said second receiving slots.

20. The chip testing apparatus according to claim 8, wherein each of said pressing members further comprises a pressing portion; when the cover body covers one side of the tray and each abutting part abuts against one top surface of the tray, one part of each contact part extends into one chip containing groove, and each contact surface can abut against the surface of the chip arranged in the chip containing groove.

21. The apparatus for testing chips as claimed in claim 20, wherein each of the pressing members includes at least two elastic members, each of the elastic members is a compression spring, the abutting portion of each of the pressing members has at least two first grooves, each of the bases has at least two second grooves, each of the first grooves faces one of the second grooves, and both ends of each of the elastic members are engaged with the first grooves and the second grooves, respectively.

22. The chip testing apparatus according to claim 20, wherein each of the pressing members has two through holes, and each of the through holes of each of the pressing members is communicated with each of the first grooves; each abutting assembly further comprises at least two guide pieces and at least two fixing external members, the two fixing external members are fixedly arranged in the two first grooves, each fixing external member is provided with a through hole, one end of each guide piece is fixed on the base, and the other end of each guide piece penetrates through the through hole of each fixing external member; when each pressing piece moves relative to the base, each fixing sleeve can move relative to each guide piece, and the two guide pieces and the two fixing sleeves can jointly limit the moving direction of the pressing pieces relative to the base.

23. The apparatus for testing chips as defined in claim 8, wherein each of said pressing members further comprises a pressing portion, each of said pressing members further comprises at least one fixing structure and at least one limiting member, said fixing structure is fixed to said base, said limiting member is detachably fixed to said fixing structure, a portion of said limiting member is adapted to abut against said pressing portion of said pressing member, and said limiting member and said fixing structure can jointly limit the range of movement of said pressing member relative to said base.

24. The apparatus for testing chips of claim 22 wherein each of said retainers includes a receiving recess for receiving a portion of said contact.

25. The apparatus according to claim 8, wherein each of the pressing members further comprises a heat conducting member, the heat conducting member is connected to the pressing member and the base, and the heat conducting member is located between the pressing member and the base, and the heat conducting member is used to assist the mutual heat transfer between the pressing member and the base.

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