CN114446663A - Multilayer ceramic capacitor - Google Patents
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- CN114446663A CN114446663A CN202210110902.5A CN202210110902A CN114446663A CN 114446663 A CN114446663 A CN 114446663A CN 202210110902 A CN202210110902 A CN 202210110902A CN 114446663 A CN114446663 A CN 114446663A
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 54
- 239000000919 ceramic Substances 0.000 claims abstract description 142
- 230000007704 transition Effects 0.000 claims description 3
- 230000005684 electric field Effects 0.000 abstract description 8
- 239000003990 capacitor Substances 0.000 abstract description 2
- 239000002002 slurry Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 238000007639 printing Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000010344 co-firing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention relates to the technical field of capacitors, and discloses a multilayer ceramic capacitor which comprises a ceramic body and end electrodes arranged on two end surfaces of the ceramic body, wherein the ceramic body also comprises inner electrodes, dielectric layers and additional electrodes, the inner electrodes are arranged in parallel, the dielectric layers are arranged between two adjacent inner electrodes, the additional electrodes are arranged at two ends of the side surface of the ceramic body and are exposed on the side surface of the ceramic body, the additional electrodes are connected with the end electrodes and have a distance with the inner electrodes, the additional electrodes are positioned between the tail ends of the inner electrodes and the tail ends of the end electrodes positioned on the side surface of the ceramic body, and the surfaces of the additional electrodes facing the inner electrodes are curved surfaces. The invention provides a multilayer ceramic capacitor, wherein an additional electrode is arranged between the tail end of a terminal electrode and the tail end of an inner electrode, and the surface of the additional electrode facing the inner electrode is a curved surface, so that the charge concentration of the tail end of the terminal electrode is eliminated, and the electric field concentration can be obviously reduced.
Description
Technical Field
The invention relates to the technical field of capacitors, in particular to a multilayer ceramic capacitor.
Background
Referring to fig. 1 and fig. 2, which are cross-sectional views of a multilayer ceramic capacitor in the prior art, two end surfaces 16 ' of a ceramic body 1 ' are provided with terminal electrodes 2 ', and the terminal electrodes 2 ' further extend to an upper surface 14 ', a lower surface 15 ' and two side surfaces 17 ' of the ceramic body 1 ', the end portions of the terminal electrodes 2 ' extending to the upper and lower surfaces and the side surfaces of the ceramic body are marked as the ends of the terminal electrodes 2 ', the ceramic body includes a plurality of dielectric layers 12 ' stacked in a thickness direction of the ceramic body and internal electrodes 11 ' disposed between two adjacent dielectric layers 12 ', and one end of the internal electrode 11 ' away from an end surface connected thereto is marked as the end of the internal electrode 11 '.
In the prior art, the terminal electrode is formed by impregnating a ceramic body with an electrode paste. The terminal electrode extends to the end of ceramic body upper and lower surface respectively, can form the closed angle shape at the end because of the rheology that the electrode thick liquids received gravity influence, and this closed angle shape still can correspond with the end of inner electrode is oblique towards the direction at inner electrode place, consequently leads to the concentrated degree of this place electric field to aggravate, and multilayer ceramic capacitor has the risk of being punctured and burning out.
Disclosure of Invention
The purpose of the invention is: provided is a multilayer ceramic capacitor which can improve the problem of electric field concentration and reduce the risk of breakdown and burning.
In order to achieve the above object, the present invention provides a multilayer ceramic capacitor, including a ceramic body and terminal electrodes disposed on two end surfaces of the ceramic body, the terminal electrodes further extending to an upper surface, a lower surface and two side surfaces of the ceramic body, and ends of the two terminal electrodes being disposed opposite to each other with a distance therebetween, the ceramic body further including internal electrodes, dielectric layers and additional electrodes, the internal electrodes being disposed in parallel with each other with the dielectric layers disposed between adjacent two of the internal electrodes, the additional electrodes being disposed at two ends of the side surfaces of the ceramic body and exposed on the side surfaces of the ceramic body, the additional electrodes being connected to the terminal electrodes with a distance therebetween, the additional electrodes being disposed between ends of the internal electrodes and ends of the terminal electrodes disposed on the side surfaces of the ceramic body, the surface of the additional electrode facing the inner electrode is a curved surface.
Preferably, a recess is provided on a side of the ceramic body, the additional electrode being disposed in the recess.
Preferably, the additional electrode also extends to the upper surface of the ceramic body.
Preferably, the additional electrode also extends to a lower surface of the ceramic body.
Preferably, the edge of the tip of the inner electrode is provided as a circular arc transition.
Preferably, the distance between the end of the additional electrode and the end face of the ceramic body close to the additional electrode is d1, the distance between the end of the terminal electrode on the side face and the end face of the ceramic body corresponding to the terminal electrode is d2, and d1 > d 2.
Preferably, the distance between the tip of the internal electrode and the end face of the ceramic body not connected thereto is recorded as d3, d1 > d 3.
Preferably, d1 is 10% -25% of the length of the multilayer ceramic capacitor.
Preferably, d3 is 5% -15% of the length of the multilayer ceramic capacitor.
Preferably, a distance between the additional electrode and the upper surface of the ceramic body is smaller than a distance between the internal electrode and the upper surface of the ceramic body.
The invention provides a multilayer ceramic capacitor, compared with the prior art, the multilayer ceramic capacitor has the beneficial effects that:
the invention relates to a multilayer ceramic capacitor, which comprises a ceramic body and terminal electrodes arranged on two end faces of the ceramic body, wherein the terminal electrodes further extend to the upper surface, the lower surface and two side faces of the ceramic body, the tail ends of the two terminal electrodes are oppositely arranged, a distance is reserved between the tail ends of the two terminal electrodes, the ceramic body further comprises internal electrodes, dielectric layers and additional electrodes, the internal electrodes are arranged in parallel, the dielectric layers are arranged between the two adjacent internal electrodes, the additional electrodes are arranged at two ends of the side faces of the ceramic body, the additional electrodes are exposed on the side faces of the ceramic body, the additional electrodes are connected with the terminal electrodes, a distance is reserved between the additional electrodes and the internal electrodes, the additional electrodes are positioned between the tail ends of the internal electrodes and the tail ends of the terminal electrodes positioned on the side faces of the ceramic body, and the faces, facing the internal electrodes, of the additional electrodes are curved surfaces. By such a structure, the additional electrode is arranged between the tail end of the terminal electrode and the tail end of the internal electrode, the surface of the additional electrode facing the internal electrode is a curved surface, the charge concentration of the tail end of the terminal electrode is eliminated, the electric field concentration can be obviously relieved, and even if the distance between the tail end of the internal electrode and the tail end of the terminal electrode is reduced by increasing the area of the internal electrode for obtaining high capacitance, the multilayer ceramic capacitor can be ensured to have good voltage resistance.
Drawings
Fig. 1 is a side sectional view of a prior art multilayer ceramic capacitor.
Fig. 2 is a top sectional view of a prior art multilayer ceramic capacitor.
Fig. 3 is a schematic structural diagram of an embodiment of the present invention.
Fig. 4 is a side cross-sectional view of a first embodiment of the present invention.
Fig. 5 is a top sectional view of the first embodiment of the present invention.
Fig. 6 is a top sectional view of a second embodiment of the present invention.
Fig. 7 is a top sectional view of a third embodiment of the present invention.
In the figure, 1, a ceramic body; 2. a terminal electrode; 11. an inner electrode; 12. a dielectric layer; 13. an additional electrode; 14. an upper surface of the ceramic body; 15. a lower surface of the ceramic body; 16. an end face of the ceramic body; 17. the side of the ceramic body.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example one
Referring to fig. 3 to 5, a multilayer ceramic capacitor according to a preferred embodiment of the present invention includes a ceramic body 1 and terminal electrodes 2 disposed on two end surfaces 16 of the ceramic body 1, the terminal electrodes 2 further extend to an upper surface 14, a lower surface 15 and two side surfaces 17 of the ceramic body 1, ends of the two terminal electrodes 2 are disposed opposite to each other with a distance therebetween, the ceramic body 1 further includes internal electrodes 11, dielectric layers 12 and additional electrodes 13, the internal electrodes 11 are disposed in parallel, a dielectric layer 12 is disposed between two adjacent internal electrodes 11, the additional electrodes 13 are disposed at two ends of the side surfaces 17 of the ceramic body 1, the additional electrodes 13 are exposed on the side surfaces 17 of the ceramic body 1, the additional electrodes 13 are connected to the terminal electrodes 2 with a distance therebetween, the additional electrodes 13 are disposed between the ends of the internal electrodes 11 and the ends of the terminal electrodes 2 disposed on the side surfaces 17 of the ceramic body 1, the surface of the additional electrode 13 facing the internal electrode 11 is curved. The shape of the curved surface is not particularly limited, and only needs to be smooth and avoid forming sharp corners. In this embodiment, the curved surface is parabolic in profile in a lateral cross-section, and in other embodiments, other shapes may be provided.
The multilayer ceramic capacitor has a length ranging from 0.6mm to 1.6mm, a width ranging from 0.3mm to 0.8mm, and a thickness ranging from 0.3mm to 0.8 mm.
In the multilayer ceramic capacitor according to the embodiment of the present invention, the additional electrode 13 is provided between the end of the terminal electrode 2 and the end of the internal electrode 11, and the surface of the additional electrode 13 facing the internal electrode 11 is a curved surface, so that the charge concentration at the end of the terminal electrode 2 is eliminated, the electric field concentration can be significantly reduced, and the multilayer ceramic capacitor can be ensured to have good voltage resistance even if the distance between the end of the internal electrode 11 and the end of the terminal electrode 2 is reduced by increasing the area of the internal electrode 11 to obtain high capacitance.
The number of the internal electrodes 11 is preferably 20 or more. The inner electrode 11 is preferably a rectangular thin layer for greater volume utilization and ease of production. The thickness of the internal electrode 11 is preferably 1 μm to 3 μm. In addition, the internal electrodes 11 are spaced apart from the upper surface 14, the lower surface 15, and both side surfaces 17 of the ceramic body 1 by a certain distance in order to prevent moisture and mechanical damage.
The number of the additional electrodes 13 is four, and are respectively disposed at four corners of the ceramic body 1. The additional electrode 13 is provided in a columnar shape on the side surface 17 of the ceramic body 1.
In this embodiment, the inner electrode 11 and the additional electrode 13 are made of the same material, and may be made of nickel or copper for co-firing.
The terminal electrode 2 is made of copper and has a thickness of 20-60 μm. If the thickness is less than 20 μm, it is difficult to prepare the terminal electrode 2 by dipping, and if the thickness is more than 60 μm, the thickness of the multilayer ceramic capacitor 200 is excessively increased.
In this embodiment, a recess is provided on the side 17 of the ceramic body 1, and the additional electrode 13 is provided in the recess. With this arrangement, the additional electrode 13 does not occupy an excessive space on the surface of the ceramic body 1, and an excessive size of the multilayer ceramic capacitor is avoided.
In this embodiment, the additional electrode 13 does not extend to the upper surface 14 and the lower surface 15 of the ceramic body 1, and in other embodiments, the additional electrode 13 also extends to the upper surface 14 of the ceramic body 1. The additional electrode 13 also extends to the lower surface 15 of the ceramic body 1.
In the present embodiment, the distance between the end of the additional electrode 13 and the end face 16 of the ceramic body 1 adjacent thereto is denoted as d1, and the distance between the end of the terminal electrode 2 located on the side face 17 and the end face 16 of the ceramic body 1 corresponding to the terminal electrode 2 is denoted as d2, with d1 > d 2. With this arrangement, the concentration of electric charges at the end of the terminal electrode 2 can be eliminated. The distance between the tip of the internal electrode 11 and the end face 16 of the ceramic body 1 not connected thereto is denoted as d3, d1 > d 3. Thereby, the end of the internal electrode 11 and the end of the additional electrode 13 are offset from each other in the length direction of the multilayer ceramic capacitor to reduce the degree of electric field concentration and also facilitate obtaining a high capacitance.
d1 is 10% -25% of the length of the multilayer ceramic capacitor. If d1 is less than 10% of the length of the multilayer ceramic capacitor, it is inconvenient to solder the multilayer ceramic capacitor, and if d1 is greater than 25% of the length of the multilayer ceramic capacitor, the multilayer ceramic capacitor soldered to the circuit board is susceptible to breakage due to large mechanical stress.
d3 is 5% -15% of the length of the multilayer ceramic capacitor. If d3 is less than 5% of the length of the multilayer ceramic capacitor, the process margin is insufficient, which tends to cause short-circuiting between the internal electrode 11 and the terminal electrode 2 not connected thereto, and if d3 is greater than 15% of the length of the multilayer ceramic capacitor, it is difficult to obtain a high capacitance.
The edge of the end of the internal electrode 11 is set to be in arc transition, so that the charge concentration degree of the internal electrode 11 can be reduced, and the voltage resistance of the multilayer ceramic capacitor can be further improved.
The distance between the additional electrode 13 and the upper surface 14 of the ceramic body 1 is smaller than the distance between the internal electrode 11 and the upper surface 14 of the ceramic body 1. Similarly, the distance between the additional electrode 13 and the lower surface 15 of the ceramic body 1 is smaller than the distance between the internal electrode 11 and the lower surface 15 of the ceramic body 1. With such a configuration, an effect of reducing the electric field concentration is obtained relatively sufficiently.
The embodiment also provides a preparation method of the multilayer ceramic capacitor, which comprises the following steps:
the method comprises the following steps: ceramic slurry is used as a raw material to prepare the ceramic membrane.
Mixing ceramic powder, adhesive and organic solvent, uniformly dispersing by adopting a ball milling or sanding method to obtain ceramic slurry, and casting the ceramic slurry into a ceramic membrane.
The ceramic powder can be a ceramic material commonly used for multilayer ceramic capacitors such as barium titanate, calcium zirconate, calcium titanate and the like.
Step two: laminating a plurality of ceramic films to form a bottom ceramic protecting cover, printing metal slurry and ceramic slurry on the bottom ceramic protecting cover in a certain sequence to obtain an inner electrode 11 pattern, an additional electrode 13 pattern and a dielectric layer 12, and then laminating the plurality of ceramic films to form a top ceramic protecting cover to obtain a ceramic substrate.
And (3) laminating the ceramic films obtained in the first step to form the bottom ceramic protecting cover with a certain thickness. The bottom surface of the bottom ceramic shield corresponds to the lower surface 15 of the ceramic body 1, and the thickness of the bottom ceramic shield corresponds to the distance from the additional electrode 13 to the lower surface 15. And printing metal slurry and ceramic slurry on the bottom ceramic protective cover by using a silk screen according to a certain sequence. In this embodiment, a metal paste is printed on the bottom ceramic cover and dried to form a pattern of the additional electrode 13, and then a ceramic paste is printed and dried to form a ceramic layer that completely covers the region other than the pattern of the additional electrode 13 but does not overlap the pattern of the additional electrode 13. Alternately printing metal paste and ceramic paste repeatedly and drying until additional electrode 13 patterns and ceramic layers with required thickness are obtained, then printing the metal paste on the ceramic layers and drying to form the inner electrode 11 patterns, wherein the inner electrode 11 patterns are spaced from the additional electrode 13 patterns, then printing the ceramic paste on the inner electrode 11 patterns and drying to form the ceramic layers, and the ceramic layers completely cover the inner electrode 11 patterns but not the additional electrode 13 patterns. After that, the order of forming the internal electrode 11 patterns, the additional electrode 13 patterns and the ceramic layers is not particularly limited as long as it is ensured that the adjacent internal electrode 11 patterns are spaced apart by the ceramic layers and the additional electrode 13 patterns are communicated up and down to form the pillar structure.
The ceramic slurry obtained in step one of screen printing may also be used to form the bottom ceramic cap and the top ceramic cap.
It is preferable that the patterns of the internal electrodes 11 are reciprocally misaligned in a direction corresponding to the length of the multilayer ceramic capacitor so that the patterns of the internal electrodes 11 are divided into two sets of patterns respectively corresponding to the internal electrodes 11, in order to obtain high capacitance. After all the patterns of the internal electrodes 11 are formed, the formation of the ceramic layers and the patterns of the additional electrodes 13 may be continued so that the distance from the additional electrodes 13 to the upper surface 14 is smaller than the distance from the internal electrodes 11 to the upper surface 14, and the distance from the additional electrodes 13 to the lower surface 15 is smaller than the distance from the internal electrodes 11 to the lower surface 15. And finally, laminating the ceramic films obtained in the first step on the ceramic layer and the additional electrode 13 pattern to form a top ceramic protecting cover with a certain thickness, thereby obtaining the ceramic substrate. The top surface of the top ceramic shield corresponds to the upper surface 14 of the ceramic body 1, and the thickness of the top ceramic shield corresponds to the shortest distance of the additional electrode 13 to the upper surface 14.
The metal in the metal paste is preferably nickel or copper. Preferably, the same metal paste is used for patterning the internal electrodes 11 and the additional electrodes 13 to maintain uniform sintering characteristics, facilitate co-firing, and ensure good densification of the ceramic body 1.
Step three: the ceramic substrate was cut to obtain a plurality of ceramic green sheets.
The ceramic substrate is cut into a plurality of rectangular parallelepiped ceramic green sheets in a desired length and width, and edge portions of the internal electrodes 11 and the additional electrodes 13 are exposed on the cut surfaces. Specifically, on each ceramic green sheet, the internal electrodes 11 are exposed on two cut surfaces corresponding to the two end surfaces 16 of the ceramic body 1, and the additional electrodes 13 are exposed on four cut surfaces corresponding to the two end surfaces 16 and the two side surfaces 17 of the ceramic body 1.
Step four: the ceramic green sheet is sintered to obtain a ceramic body 1.
The ceramic green sheet is heated to 950 ℃ to 1300 ℃ to be sintered to obtain a ceramic body 1. After firing, the internal electrodes 11 are patterned into the internal electrodes 11, the additional electrodes 13 are patterned into the additional electrodes 13, and the ceramic layers are formed into the dielectric layers 12.
If necessary, the ceramic green sheet may be subjected to a heat treatment to remove organic components in the ceramic green sheet before the ceramic green sheet is sintered, thereby improving the mechanical properties and dielectric properties of the ceramic body 1.
Step five: and soaking the two ends of the ceramic body 1 in copper slurry, and sintering the copper slurry to form the terminal electrode 2, thus obtaining the multilayer ceramic capacitor.
And (2) dipping the two ends of the ceramic body 1 in copper slurry, then heating the copper slurry to 950-1300 ℃ for sintering, and forming two end electrodes 2 by the sintered copper slurry to obtain the multilayer ceramic capacitor. The dipping depth of the copper paste is controlled so that d2 is less than d 1.
If necessary, after the sintering process of step four, the ceramic body 1 may be barrel-polished to round the corners of the ceramic body 1 and prevent mechanical damage.
Example two
The difference between the multilayer ceramic capacitor provided in the second embodiment and the first embodiment is that, referring to fig. 6, the end of the additional electrode 13 is semicircular in cross section in the top direction, and the connection point between one end of the additional electrode 13 and the terminal electrode 2 is located on the end face 16 of the ceramic body 1.
EXAMPLE III
The difference between the multilayer ceramic capacitor provided in the third embodiment and the first embodiment is that, referring to fig. 7, the additional electrode 13 is not connected to the two end faces 16, and the two ends of the additional electrode 13 are arc-shaped.
To sum up, the embodiment of the present invention provides a multilayer ceramic capacitor, in which an additional electrode 13 is disposed between the end of a terminal electrode 2 and the end of an internal electrode 11, the surface of the additional electrode 13 facing the internal electrode 11 is a curved surface, so that the charge concentration at the end of the terminal electrode 2 is eliminated, the electric field concentration can be significantly reduced, and even if the distance between the end of the internal electrode 11 and the end of the terminal electrode 2 is reduced by increasing the area of the internal electrode 11 to obtain a high capacitance, the multilayer ceramic capacitor can have a good withstand voltage performance.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (10)
1. A multilayer ceramic capacitor is characterized by comprising a ceramic body and terminal electrodes arranged on two end faces of the ceramic body, wherein the terminal electrodes further extend to the upper surface, the lower surface and two side faces of the ceramic body, and the ends of the two terminal electrodes are oppositely arranged with a distance therebetween, the ceramic body further comprises an inner electrode, a dielectric layer and an additional electrode, the internal electrodes are arranged in parallel, the dielectric layer is arranged between two adjacent internal electrodes, the additional electrodes are arranged at two ends of the side surface of the ceramic body, and the additional electrode is exposed on the side surface of the ceramic body, the additional electrode is connected with the terminal electrode and has a distance with the internal electrode, the additional electrode is positioned between the tail end of the inner electrode and the tail end of the end electrode positioned on the side surface of the ceramic body, and the surface of the additional electrode facing the inner electrode is a curved surface.
2. The multilayer ceramic capacitor according to claim 1, wherein a recess is provided on a side surface of the ceramic body, and the additional electrode is provided in the recess.
3. The multilayer ceramic capacitor according to claim 1, wherein the additional electrode further extends to an upper surface of the ceramic body.
4. The multilayer ceramic capacitor according to claim 1, wherein the additional electrode further extends to a lower surface of the ceramic body.
5. The multilayer ceramic capacitor according to claim 1, wherein the edge of the tip of the inner electrode is provided as a circular arc transition.
6. The multilayer ceramic capacitor according to claim 1, wherein the distance between the end of the additional electrode and the end face of the ceramic body adjacent thereto is denoted as d1, and the distance between the end of the terminal electrode on the side face and the end face of the ceramic body corresponding to the terminal electrode is denoted as d2, and d1 > d 2.
7. The multilayer ceramic capacitor as claimed in claim 6, wherein the distance between the end of the internal electrode and the end face of the ceramic body not connected thereto is denoted as d3, d1 > d 3.
8. The multilayer ceramic capacitor of claim 6, wherein d1 is 10% -25% of the length of the multilayer ceramic capacitor.
9. The multilayer ceramic capacitor of claim 7, wherein d3 is 5% -15% of the length of the multilayer ceramic capacitor.
10. The multilayer ceramic capacitor according to claim 1, wherein a distance between the additional electrode and the upper surface of the ceramic body is smaller than a distance between the internal electrode and the upper surface of the ceramic body.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210110902.5A CN114446663A (en) | 2022-01-29 | 2022-01-29 | Multilayer ceramic capacitor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210110902.5A CN114446663A (en) | 2022-01-29 | 2022-01-29 | Multilayer ceramic capacitor |
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| CN114446663A true CN114446663A (en) | 2022-05-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115458331A (en) * | 2022-08-29 | 2022-12-09 | 广东风华高新科技股份有限公司 | Multilayer ceramic capacitor and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115458331A (en) * | 2022-08-29 | 2022-12-09 | 广东风华高新科技股份有限公司 | Multilayer ceramic capacitor and preparation method thereof |
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