CN114446537A - High-current-density armored superconducting tape structure and preparation method thereof - Google Patents
High-current-density armored superconducting tape structure and preparation method thereof Download PDFInfo
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- CN114446537A CN114446537A CN202210186787.XA CN202210186787A CN114446537A CN 114446537 A CN114446537 A CN 114446537A CN 202210186787 A CN202210186787 A CN 202210186787A CN 114446537 A CN114446537 A CN 114446537A
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- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
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Abstract
The invention discloses a high-current-density armored superconducting tape structure and a preparation method thereof, and belongs to the technical field of superconducting tapes. The armored superconducting tape structure with high current density prepared by the invention can improve the critical current density of engineering while ensuring the mechanical property of the superconducting tape.
Description
Technical Field
The invention belongs to the technical field of superconducting tapes, and particularly relates to a high-current-density armored superconducting tape structure and a preparation method thereof.
Background
In recent years, with the development of superconducting technology, research on superconducting power equipment mainly based on superconduction has been rapidly developed, and remarkable results have been obtained in the fields of superconducting energy storage, superconducting motors, superconducting cables, superconducting current limiters, superconducting transformers, superconducting synchronous phase modulators, and the like, and in many applications, superconducting coils are core components thereof.
The engineering critical current density of a conventional superconducting coil is one of its most important indicators. The critical current density of a superconducting material manufacturer and a superconducting application party is usually improved by different methods, and at present, the superconducting material manufacturer can reduce the cross section area of a superconducting strip by using a thinner hastelloy base strip so as to increase the critical current density. In 2011, haen proposes a concept of a superconducting uninsulated coil, and in the coil, turn-to-turn insulation of the coil is banned, that is, no insulating substance is sprayed on the surface of a superconducting strip for preparing the coil, so that the turn-to-turn distance of the superconducting wire is reduced, and the current density is improved.
While increasing the current density, the mechanical properties, fatigue resistance, etc. of the superconducting tape are of great concern in engineering applications. In the engineering use process, if the attenuation of critical current occurs due to the mechanical performance, fatigue resistance and the like of the superconducting tape, the indexes of products can be directly influenced. In order to improve the mechanical properties of the superconducting tape, the most common method is armoring, except for silver plating and copper plating, but the most common problems of armoring are poor centering along the length direction and a decrease in current density. Therefore, there is an urgent need for a high current density armored superconducting tape structure and a method for manufacturing the same, which can solve the above problems.
Disclosure of Invention
Aiming at the technical problems, the invention provides a high-current-density armored superconducting tape structure and a preparation method thereof, which can ensure the mechanical property of the superconducting tape and can also improve the engineering critical current density.
The technical scheme of the invention is as follows:
the high-current-density armored superconducting tape structure comprises a superconducting composite layer, wherein the superconducting composite layer comprises a metal base band, a buffer layer and a superconducting layer which are sequentially arranged, metal coating layers are wrapped around the superconducting composite layer, and the metal coating layers close to one surface of the superconducting layer are welded with armor layers.
Preferably, the metal coating layer comprises a silver layer and a copper layer which are arranged from inside to outside in sequence, and the superconducting composite layer and the metal coating layer form a copper-plated superconducting strip.
Preferably, the width of the armor layer is greater than that of the copper-plated superconducting tape, and fillet welds are arranged between the edges of the two ends of the armor layer and the two sides of the copper-plated superconducting tape in the width direction.
Preferably, the armor layer comprises a main body clad layer and bending clad layers positioned on two sides of the main body clad layer, and the bending clad layers are clad on two sides of the copper-plated superconducting strip in the width direction.
Preferably, the coating length of the bending coating layer is consistent with the thickness of the copper-plated superconducting strip.
Preferably, the coating length of the bent coating layer exceeds the joint surface of the metal base band and the buffer layer and is smaller than the thickness of the copper-plated superconducting strip, and a fillet weld is arranged between the edge of the bent coating layer and the copper-plated superconducting strip.
Preferably, the armor layer is one of a copper strip, a brass strip and a stainless steel strip.
A preparation method of a high-current-density armored superconducting tape structure comprises the following steps:
s1, growing a buffer layer on the metal base band, and preparing a superconducting layer on the buffer layer to form a superconducting composite layer;
s2, plating a silver layer and a copper layer on the periphery of the superconducting composite layer to form a copper-plated superconducting strip;
and S3, welding an armor layer on one side of the copper-plated superconducting strip close to the superconducting layer.
Preferably, the armor is subjected to a pre-forming bending process prior to welding the armor in step S3.
The invention has the beneficial effects that:
the invention provides an armored superconducting tape with high critical current density, which can improve the engineering critical current density while ensuring the mechanical property of the superconducting tape; the superconducting layer is arranged in the middle of the armored superconducting strip, so that when the armored superconducting strip is bent in the winding process, the superconducting layer is in the middle, the compressive stress and the tensile stress of the superconducting layer are far smaller than those of a common superconducting strip, and the engineering bending diameter of the superconducting layer has absolute advantage.
Drawings
The invention is further described with reference to the following figures and examples:
FIG. 1 is a cross-sectional view in the width direction of a high current density sheathed superconducting tape in example 1;
FIG. 2 is a longitudinal sectional view of a high current density sheathed superconducting tape according to example 1;
FIG. 3 is a cross-sectional view in the width direction of a high current density sheathed superconducting tape according to example 2;
FIG. 4 is a cross-sectional view in the width direction of a high current density sheathed superconducting tape according to example 3;
FIG. 5 is a schematic structural view of a conventional armoured superconducting tape structure;
FIG. 6 is a schematic view showing the structure of a copper-coated superconducting tape.
1, armor layer; 11. a main body coating layer; 12. bending the coating layer; 2. a copper layer; 3. a silver layer; 4. a superconducting layer; 5. a buffer layer; 6. a metal base band; 7. a welding zone; 8. a fillet weld.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
Example 1
As shown in figures 1 and 2, a high current density armored superconducting tape structure comprises a superconducting composite layer, the superconducting composite layer comprises a metal base band 6, a buffer layer 5 and a superconducting layer 4 which are sequentially arranged, a metal coating layer is wrapped around the superconducting composite layer, the metal coating layer comprises a silver coating layer 3 and a copper coating layer 2 which are sequentially arranged from inside to outside, and the superconducting composite layer and the metal coating layer form a plated layerCopper superconducting tape, the armor layer 1 is welded to the metal clad layer on the side close to the superconducting layer 4, and the corresponding weld zone 7 is shown in fig. 1 and 2. The armor layer 1 comprises a main body coating layer 11 and bending coating layers 12 positioned on two sides of the main body coating layer 11, the bending coating layers 12 are coated on two sides of a copper-plated superconducting strip in the width direction, the coating length of the bending coating layers 12 is consistent with the thickness of the copper-plated superconducting strip, and the bending coating layers 12 play a role in protecting the superconducting layer 4, wherein a metal base band can be selected from Ni-based alloy, Cu-Ni alloy or Ni-W alloy and the like, Ni-based C276 Hastelloy is preferred in the embodiment, a buffer layer is made of oxide materials, can be a single-layer oxide film or a multi-layer oxide film, is preferred to be a multi-layer oxide film, and the preferred multi-layer oxide film in the embodiment comprises Al films which are sequentially arranged along the metal base band from near to far2O3Film, Y2O3Thin film, MgO thin film and LaMnO3The film, the superconducting layer being of superconducting material, preferably YBa2Cu3O7-x、GdBa2Cu3O7-xOr GdaYbBa2Cu3O7-x(a + b is 1), YBa is preferred in this embodiment2Cu3O7-x(0 < x < 0.5), and the armor layer can be made of copper strips, brass strips or stainless steel strips, and the copper strips are preferred in the embodiment.
The preparation method of the high-current-density armored superconducting tape structure comprises the following steps of: plating a buffer layer 5 and a superconducting layer 4 on a flat metal base band 6 by adopting a physical or chemical method to form a superconducting composite layer; plating a silver layer 3 around the superconducting composite layer by using a magnetron sputtering silver plating or evaporation silver plating mode, and continuously plating a copper layer 2 by using an electrochemical or other appropriate mode to form a copper-plated superconducting strip; and after the armor layer 1 is preformed and bent, welding the copper layer 2 on one side of the copper-plated superconducting strip close to the superconducting layer 4 with the armor layer 1.
Taking the high critical current density superconducting tape shown in FIG. 1 as an example, a 4.2mm wide and 20 μm thick armor layer 1, a 4mm wide and 80 μm thick copper-plated superconducting tape was used, and the width was about 4.05mm and the thickness was about 0.1mm after the armor. A conventional armoured superconducting tape shown in fig. 5 was used as a comparative example 1, and the conventional armoured superconducting tape is different from example 1 in that double armouring was used, specifically, a double-sided 4.8mm wide and 20 μm thick armoured layer 1, a 4mm wide and 80 μm thick copper-plated superconducting tape was used, and the width after armouring was about 4.8mm and the thickness was about 0.12 mm. Meanwhile, a copper-coated superconducting tape alone as shown in FIG. 6 was used as a comparative example 2, and the copper-coated superconducting tape was 4mm wide and 0.1mm thick, which was different from example 1 in that the armor layer 1 was not welded and the thickness of the copper layer 2 on both sides of the copper-coated superconducting tape was increased. Example 1 and two comparative examples were subjected to performance testing to give table 1.
TABLE 1 critical current density enhancement of sheathed superconducting tapes for high critical current density
As can be seen from table 1, the critical current density of the high critical current density superconducting tape of the present example is 98.8% of that of the copper-clad superconducting tape of comparative example 2, and is almost uniform, and is 142.2% of that of the conventional armoured superconducting tape of comparative example 1.
Example 2
As shown in fig. 3, compared with embodiment 1, the high current density armored superconducting tape structure of the present embodiment has a shorter cladding length of the bent cladding layer 12, and the sectional view of the high current density armored superconducting tape of the present embodiment in the length direction is the same as that in fig. 2, in the present embodiment, the cladding length of the bent cladding layer 12 exceeds the joint surface of the metal base tape 6 and the buffer layer 5, and is smaller than the thickness of the copper-plated superconducting tape, so as to exceed half of the thickness of the metal base tape 6, and ensure the protection of the superconducting layer 4, and the cladding length of the edge of the armored layer 1 is shorter, and a fillet weld 8 can be formed to increase the welding performance. The high current density armored superconducting tape structure of the present example was fabricated by the method of example 1.
Example 3
As shown in fig. 4, compared with embodiment 1, the armor layer 1 of the high current density armored superconducting tape structure of the present embodiment does not need to be bent, the width of the armor layer 1 is larger than the width of the copper-plated superconducting tape, fillet welds 8 are also provided between the two end edges of the armor layer 1 and the two sides of the corresponding copper-plated superconducting tape in the width direction, and the sectional view of the high current density armored superconducting tape in the length direction of the embodiment is the same as that in fig. 2.
The preparation method of the high-current-density armored superconducting tape structure comprises the following steps of: plating a buffer layer 5 and a superconducting layer 4 on a flat metal base band 6 by adopting a physical or chemical method to form a superconducting composite layer; plating a silver layer 3 around the superconducting composite layer by using a magnetron sputtering silver plating or evaporation silver plating mode, and continuously plating a copper layer 2 by using an electrochemical or other appropriate mode to form a copper-plated superconducting strip; and welding the copper layer 2 on one side of the copper-plated superconducting strip close to the superconducting layer 4 with the armor layer 1.
Taking the high critical current density superconducting tape shown in FIG. 4 as an example, a 4.5mm wide and 20 μm thick armor layer 1, a 4mm wide and 80 μm thick copper-plated superconducting tape was used, and the width was about 4.5mm and the thickness was about 0.1mm after the armor. Using comparative example 1 and comparative example 2 mentioned in example 1, example 3 and both comparative examples were subjected to performance tests, resulting in table 2.
TABLE 2 critical current density enhancement of armored superconducting tape with high critical current density
As can be seen from table 2, the critical current density of the high critical current density superconducting tape of the present example is 97.6% of that of the copper-clad superconducting tape of comparative example 2, and is almost uniform, and is 140.5% of that of the conventional armoured superconducting tape of comparative example 1.
According to the invention, the copper-plated superconducting strip and the armor layer 1 are welded together, so that the sealing property and the mechanical strength of the edge of the superconducting strip can be greatly improved compared with a single copper-plated superconducting strip shown in fig. 6, in addition, compared with a traditional armored superconducting strip structure (double-sided armor) shown in fig. 5, the mechanical strength of the armored superconducting strip is not reduced, and the heat dissipation performance of the armored superconducting strip is not reduced because the heat dissipation is mainly conducted by the armor layer close to the superconducting surface. In addition, compared with the traditional armored superconducting tape structure and a single copper-plated superconducting tape, the superconducting layer 4 is positioned at a more central position of the superconducting tape, so that when the superconducting tape is bent, the superconducting layer 4 is prevented from being subjected to larger tensile stress and strain and compressive stress and strain from a microscopic angle analysis, and the critical current can be ensured to be resistant to a smaller bending diameter when not attenuated.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (9)
1. The high-current-density armored superconducting tape structure is characterized by comprising a superconducting composite layer, wherein the superconducting composite layer comprises a metal base band, a buffer layer and a superconducting layer which are sequentially arranged, a metal coating layer is wrapped around the superconducting composite layer, and an armor layer is welded on the metal coating layer close to one surface of the superconducting layer.
2. The high current density armored superconducting tape structure of claim 1, wherein the metal clad comprises a silver layer and a copper layer sequentially disposed from inside to outside, and the superconducting composite layer and the metal clad constitute a copper-clad superconducting tape.
3. The high current density armored superconducting tape structure of claim 2, wherein the width of the armor is greater than that of the copper-plated superconducting tape, and fillet welds are provided between the two end edges of the armor and the two corresponding sides of the copper-plated superconducting tape in the width direction.
4. The high current density armored superconducting tape structure of claim 2, wherein the armor comprises a main body clad and bent clad layers on both sides of the main body clad, and the bent clad layers are clad on both sides of the copper-clad superconducting tape in the width direction.
5. The high current density armored superconducting tape structure of claim 4, wherein the cladding length of the bending cladding layer is consistent with the thickness of the copper-plated superconducting tape.
6. The high current density armored superconducting tape structure of claim 4, wherein the cladding length of the bending cladding exceeds the bonding surface of the metal base tape and the buffer layer and is less than the thickness of the copper-plated superconducting tape, and a fillet weld is arranged between the edge of the bending cladding and the copper-plated superconducting tape.
7. The high current density armored superconducting tape structure of claim 1, wherein the armor layer is one of copper tape, brass tape and stainless steel tape.
8. A preparation method of a high-current-density armored superconducting tape structure is characterized by comprising the following steps:
s1, growing a buffer layer on the metal base band, and preparing a superconducting layer on the buffer layer to form a superconducting composite layer;
s2, plating a silver layer and a copper layer on the periphery of the superconducting composite layer to form a copper-plated superconducting strip;
and S3, welding an armor layer on one side of the copper-plated superconducting strip close to the superconducting layer.
9. The method for preparing a high current density armored superconducting tape structure according to claim 8, wherein the armor is subjected to a preformed bending treatment before the armor is welded in step S3.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115171974A (en) * | 2022-07-22 | 2022-10-11 | 上海超导科技股份有限公司 | Copper alloy reinforced superconducting tape, reinforcing method, superconducting coil, and superconducting cable |
| CN115171973A (en) * | 2022-06-30 | 2022-10-11 | 上海超导科技股份有限公司 | Copper-silver alloy reinforced superconducting tape, reinforcing method and superconducting coil |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115171973A (en) * | 2022-06-30 | 2022-10-11 | 上海超导科技股份有限公司 | Copper-silver alloy reinforced superconducting tape, reinforcing method and superconducting coil |
| CN115171973B (en) * | 2022-06-30 | 2023-03-03 | 上海超导科技股份有限公司 | Copper-silver alloy reinforced superconducting tape, reinforcing method and superconducting coil |
| CN115171974A (en) * | 2022-07-22 | 2022-10-11 | 上海超导科技股份有限公司 | Copper alloy reinforced superconducting tape, reinforcing method, superconducting coil, and superconducting cable |
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