CN114429922A - Wafer conveying and processing system and method with real-time particulate matter monitoring function - Google Patents
Wafer conveying and processing system and method with real-time particulate matter monitoring function Download PDFInfo
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- CN114429922A CN114429922A CN202011186498.7A CN202011186498A CN114429922A CN 114429922 A CN114429922 A CN 114429922A CN 202011186498 A CN202011186498 A CN 202011186498A CN 114429922 A CN114429922 A CN 114429922A
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- 238000000034 method Methods 0.000 title claims abstract description 59
- 239000013618 particulate matter Substances 0.000 title claims abstract description 58
- 238000012545 processing Methods 0.000 title claims abstract description 36
- 238000012544 monitoring process Methods 0.000 title claims abstract description 26
- 238000001514 detection method Methods 0.000 claims abstract description 18
- 235000012431 wafers Nutrition 0.000 claims description 111
- 238000012546 transfer Methods 0.000 claims description 20
- 238000003860 storage Methods 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000003672 processing method Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 description 19
- 238000004458 analytical method Methods 0.000 description 5
- 238000007664 blowing Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000003915 air pollution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/06—Investigating concentration of particle suspensions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- Condensed Matter Physics & Semiconductors (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses a wafer conveying and processing system and method with a real-time particulate matter monitoring function. The system comprises: a process chamber for processing a wafer; the equipment front end module is arranged adjacent to the process chamber and used for transferring the wafer into the process chamber; the sensors are arranged in the equipment front-end module and the process chamber and are used for detecting the concentration of the particulate matters; and the host is used for receiving and analyzing the particulate matter concentration detection data sent by the sensor. The wafer conveying and processing system with the real-time particulate matter monitoring function provided by the embodiment of the disclosure can realize the real-time monitoring of the particulate matter concentration of each region in the wafer conveying and processing environment, does not need to consume a wafer, can rapidly determine the position where the particulate matter is generated, is helpful for controlling the particulate matter concentration in the wafer conveying and processing environment, and improves the working efficiency.
Description
Technical Field
The disclosure relates to the technical field of semiconductor manufacturing, in particular to a wafer transmission and processing system and method with a real-time particulate matter monitoring function.
Background
In a manufacturing process of a semiconductor device, a wafer is processed in a clean room to improve yield and quality. However, in the present day in which high integration of devices, miniaturization of circuits, and upsizing of wafers have been advanced, it is difficult to completely control small particles in a clean room as a whole in terms of both cost and technology. In semiconductor manufacturing facilities, there is a need for effective management of particulate Monitoring (Particle Monitoring) processes in MI (metrology) facilities. When the problem that the particulate matters exceed the standard occurs in the particulate matter monitoring process, the equipment stops running and carries out reason analysis, and the time from the reason analysis to the final treatment completion is longer.
The rate of occurrence of the out-of-standard on average per week in the semiconductor FAB is about that of the inspection equipment (9%), the film thickness analysis (8%), the CD (15%), and the time required from the reason analysis to the completion of the treatment is about 8 hours on average. The processing process of the problem that the particulate matters exceed the standard is totally divided into 5 stages, wherein the stage 1 is a whole sheet conveying test, the stage 2 is an interval partition test, the stage 3 is a problem occurrence position checking and cleaning, the stage 4 is a particulate matter checking and processing stage, and the stage 5 is equipment detection and re-operation and checking. After the problem that the particulate matters exceed the standard occurs, because a lot of time is needed from reason analysis to treatment, the monitoring is really carried out in advance, the reason is found out and is rapidly treated, the delay of the efficiency management of the equipment and the subsequent process monitoring is avoided, and yield influencing factors caused by a measuring machine are prevented from being generated. These phenomena cause problems in the original equipment management, the first is that when the particulate matter exceeding problem occurs, it is difficult to grasp the position of the problem, and the second is that it takes too long time to find the root cause. In the prior art, a particle measurement machine is used for testing particle values before and after a wafer enters and exits equipment, whether the particle values exceed the standard or not is judged by taking the number of increased particles as a reference, and the equipment is determined to continue to run or stop. The prior art has the defects that a certain amount of wafers are consumed by regular monitoring, and a longer time is probably needed for testing by using a particle measuring machine; moreover, because the process is not carried out in real time, the problem of excessive particulate matter is not known when the process occurs.
Disclosure of Invention
The present disclosure provides a wafer transferring and processing system and method with real-time particle monitoring. The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview and is intended to neither identify key/critical elements nor delineate the scope of such embodiments. Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.
According to an aspect of the embodiments of the present disclosure, a wafer transferring and processing system with real-time particulate monitoring function is provided, which includes:
a process chamber for processing a wafer;
the equipment front end module is arranged adjacent to the process chamber and used for transferring the wafer into the process chamber;
the sensors are arranged in the equipment front-end module and the process chamber and are used for detecting the concentration of the particulate matters;
and the host is used for receiving and analyzing the particulate matter concentration detection data sent by the sensor.
According to an aspect of the embodiments of the present disclosure, a wafer transferring and processing method with real-time particulate matter monitoring function is provided, the method includes:
the equipment front end module transfers the wafer into the process chamber;
the process chamber processes a wafer;
the sensors detect particulate matter concentrations in the equipment front end module and the process chamber;
the host computer receives and analyzes the particulate matter concentration detection data sent by the sensor.
The technical scheme provided by one aspect of the embodiment of the disclosure can have the following beneficial effects:
the wafer conveying and processing system with the real-time particulate matter monitoring function provided by the embodiment of the disclosure can realize real-time monitoring of the particulate matter concentration of each region in the wafer conveying and processing environment in real time, does not need to consume a wafer, can rapidly determine the position where the particulate matter is generated, is beneficial to managing and controlling the particulate matter concentration in the wafer conveying and processing environment, and improves the working efficiency.
Additional features and advantages of the disclosure will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the embodiments of the disclosure. The objectives and other advantages of the disclosure may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present disclosure, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic diagram of a wafer transfer and processing system with real-time particulate monitoring according to one embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a wafer transfer and processing system with real-time particulate monitoring according to another embodiment of the present disclosure;
FIG. 3 shows a cake plot of particle fraction for each region obtained by analyzing the particle concentration measurement data by the host computer according to one embodiment of the disclosure.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed.
As shown in fig. 1, one embodiment of the present application provides a wafer transfer and processing system with real-time particulate monitoring, comprising:
a process chamber 5 for processing wafers;
the equipment front end module is arranged adjacent to the process chamber 5 and used for transferring the wafer into the process chamber 5;
the sensors 8 are arranged in the front-end module of the equipment and the process chamber 5 and are used for detecting the concentration of the particulate matters;
and the host 7 is used for receiving and analyzing the particulate matter concentration detection data sent by the sensor 8.
The process chamber 5 comprises a chamber body and a wafer stage 6 arranged in the chamber body, wherein the wafer stage 6 is used for processing wafers.
In some embodiments, the process chamber 5 further comprises a valve, and a wall of the chamber body is provided with an air inlet, a wafer outlet, and an air outlet; the valve is arranged at the wafer inlet and the wafer outlet of the chamber body and used for opening or closing the wafer inlet and the wafer outlet.
The equipment front end module comprises a loading port 1, a wafer carrying chamber 2 and a mechanical arm 3; the mechanical arm 3 is arranged in the wafer carrying chamber 2; the loading port 1 is arranged on the outer side wall of the wafer carrying chamber 2; the robot arm 3 is used to transfer wafers on the load port 1 into the process chamber 5 through the wafer transfer chamber 2. In this embodiment, there may be two load ports 1.
In some embodiments, the equipment front end module further comprises a positioner 4, the positioner 4 being disposed within the wafer handling chamber 2. The positioner 4 is disposed on a sidewall of the wafer transfer chamber 2.
In some embodiments, the wafer transfer and processing system further comprises a wafer storage container for holding wafers, the wafer storage container being placed on the load port 1.
The wafer storage container in this embodiment employs a FOUP. FOUP, Front-Opening Unified Pod, is a wafer storage container for holding and transporting wafers.
In some embodiments, the wafer storage container is a front-end-opening wafer cassette, and includes a front wall plate having an opening, a rear wall plate opposite to the front wall plate, side wall plates at both sides, a top plate and a bottom plate, wherein an inlet pipe extending from the bottom plate to the top plate is disposed at an inner side of one of the side wall plates, an outlet pipe extending from the bottom plate to the top plate is disposed at an inner side of the other side wall plate, a plurality of inlet ports are formed in the inlet pipe from top to bottom, and a plurality of outlet ports are formed in the outlet pipe from top to bottom.
In some embodiments, the host 7 is configured to receive and analyze the particulate matter concentration detection data sent by the sensor 8, and includes:
the host 7 is used for: the particle concentration detection data sent by the receiving sensor 8 are processed to obtain processed particle concentration data, and the region where particles are generated in the wafer conveying and processing system and the reason for generating the particles are analyzed and judged according to the particle concentration data.
In some embodiments, sensors 8 are provided within the wafer handling chamber 2, FOUP, process chamber 5, and on the load port 1, robot 3, positioner 4, and stage 6, which are wirelessly connected to a host computer 7; the sensor 8 is used for counting the particulate matters in the air in real time and sending the detected particulate matter information to the host 7, so that the particulate matters are monitored. The load port 1 is provided adjacent to the wafer transfer chamber 2. The load port 1, wafer handling chamber 2, robot arm 3 and positioner 4 comprise an EFEM. EFEM is Equipment Front End Module. The wafer is transferred from the wafer storage container onto the stage 6 of the process chamber 5 by the robot arm 3 of the EFEM transferring the wafer between the wafer storage container and the process chamber 5.
In some embodiments, the door portion provided in the load port 1 is brought into close contact with the door provided in the front surface of the FOUP, and the door portion and the door are opened at the same time, so that the wafer in the FOUP can be taken out into the wafer transfer chamber 2 by the robot 3 provided in the wafer transfer chamber 2, and the robot 3 can grasp the processed wafer on the stage 6 and then store the processed wafer into the FOUP on the load port 1 via the wafer transfer chamber 2.
The wafer is arranged in a front-end opening wafer box, the front-end opening wafer box with the wafer is placed in a loading port 1, the mechanical arm 3 grabs the wafer in the front-end opening wafer box, the wafer is conveyed into a process chamber 5 after passing through a wafer conveying chamber 2, and the wafer is placed on a wafer carrying table 6 for next processing.
The sensor 8 can measure the amount of particles in the air through the inhaled air, and the pollution degree of each area can be measured in real time. In some embodiments, the particulate matter condition in the measuring machine system can be controlled by allocating a SVID code (Subsystem Vendor ID) to the data detected by the sensors 8 in different areas and uploading the data after allocating the SVID code to the host 7 (the host 7 may be an automated upper TC server).
For example, the SVID O (Idle),1(Spec out),2(Error) …, etc. are distinguished, and the equipment stops running when the data is 1, so that the defects caused by the equipment are avoided, the air pollution degree of each area can be rapidly mastered through the particulate matter data in each area, the cleaning operation is correspondingly carried out, and the equipment is convenient to control and manage.
The sensor 8 detects the particulate matter in each region and transmits a detection data status code to the host 7, and the host 7 analyzes the particulate matter generation source and takes measures such as cleaning. For example:
- > SVID transport code definition
0:Spec in(idle)
1:Spec out
2:Error
3: others
The FOUP in the embodiment of the application comprises a front wall plate provided with an opening, a rear wall plate opposite to the front wall plate, side wall plates on two sides, a top plate and a bottom plate, wherein an air inlet pipe extending from the bottom plate to the top plate is arranged on the inner side of one side wall plate, an air outlet pipe extending from the bottom plate to the top plate is arranged on the inner side of the other side wall plate, a plurality of air inlets are formed in the air inlet pipe from top to bottom, and a plurality of air outlets are formed in the air outlet pipe from top to bottom.
In addition, in some embodiments, the FOUP further comprises an air blowing device and a gas collecting device, one end of the air inlet pipe is connected with the air blowing device and used for blowing air into the FOUP, and the other end of the air inlet pipe is closed. One end of the gas outlet pipe is connected with the gas collecting device and used for collecting gas blown out of the interior of the FOUP, and the other end of the gas outlet pipe is closed. The air inlet pipe is uniformly provided with a plurality of air inlets from top to bottom and used for uniformly blowing air into the longitudinal space inside the FOUP. The air outlet pipe is uniformly provided with a plurality of air outlets from top to bottom and is used for uniformly exhausting air to the longitudinal space inside the FOUP. The end of the air inlet pipe connected with the blowing device is also provided with a sealing valve, and the end of the air outlet pipe connected with the gas collecting device is also provided with a sealing valve.
The process chamber 5 of the embodiment comprises a chamber body, a wafer stage 6 and a valve, wherein the wafer stage and the valve are arranged in the chamber body; the valve is arranged at the wafer inlet and the wafer outlet of the chamber body and used for opening or closing the wafer inlet and the wafer outlet.
FIG. 2 is a schematic diagram of a wafer transfer and processing system with real-time particle monitoring, according to another embodiment of the present invention, showing the load port 1, the wafer transfer chamber 2, the process chamber 5, the robot 3, the positioner 4, the stage 6, the host 7, the FOUP9, and the 6 sensors in FIG. 2
And
the wafer conveying and processing system with the real-time particulate matter monitoring function of this application embodiment can realize the real-time supervision to particulate matter concentration, need not consume the wafer, helps carrying out the management and control to the particulate matter in wafer conveying and the processing environment, can confirm the position that the particulate matter produced rapidly, can carry out particulate matter monitoring to each region in wafer conveying and the processing environment in real time.
Another embodiment of the present application provides a wafer transferring and processing method with real-time particulate monitoring function, which is implemented by the system of the above embodiment; the method comprises the following steps:
the equipment front end module transfers the wafer into the process chamber 5;
the process chamber 5 processes the wafer;
a plurality of sensors 8 detect the concentration of particulate matter in the equipment front end module and the process chamber 5;
the host 7 receives and analyzes the particulate matter concentration detection data sent by the sensor 8.
Analyzing the particulate matter concentration detection data sent by the sensor 8 includes:
processing the particulate matter concentration detection data to obtain processed particulate matter concentration data;
and analyzing and judging the area and the reason for generating the particles in the wafer conveying and processing system according to the particle concentration data. The staff takes relevant measures in time according to the particulate matter information analyzed by the host 7.
As shown in fig. 3, which is a pie chart of the proportion of the particulate matter in each region obtained by analyzing the particulate matter concentration detection data by the host computer 7 in one embodiment, it can be seen that the particulate matter on the slide stage accounts for 60% of the total particulate matter amount, which is the region with the largest proportion.
In the above description, the technical details of patterning, etching, and the like of each layer are not described in detail. It will be appreciated by those skilled in the art that layers, regions, etc. of the desired shape may be formed by various technical means. In addition, in order to form the same structure, those skilled in the art can also design a method which is not exactly the same as the method described above. In addition, although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination.
The embodiments of the present disclosure have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present disclosure, and such alternatives and modifications are intended to be within the scope of the present disclosure.
Claims (10)
1. A wafer transfer and processing system with real-time particulate monitoring, comprising:
a process chamber for processing a wafer;
the equipment front end module is arranged adjacent to the process chamber and used for transferring the wafer into the process chamber;
the sensors are arranged in the equipment front-end module and the process chamber and are used for detecting the concentration of the particulate matters;
and the host is used for receiving and analyzing the particulate matter concentration detection data sent by the sensor.
2. The system of claim 1, wherein the process chamber comprises a chamber body and a stage disposed within the chamber body, the stage configured to process a wafer.
3. The system of claim 2, wherein the process chamber further comprises a valve, and a wall of the chamber body defines an inlet, a wafer outlet, and an outlet; the valve is arranged at the wafer inlet and the wafer outlet of the chamber body and used for opening or closing the wafer inlet and the wafer outlet.
4. The system of claim 1, wherein the equipment front end module comprises a load port, a wafer handling chamber, and a robot arm; the mechanical arm is arranged in the wafer carrying chamber; the loading port is arranged on the outer side wall of the wafer carrying chamber; the robot arm is configured to transfer the wafer from the load port into the process chamber through the wafer transfer chamber.
5. The system of claim 4, wherein the equipment front end module further comprises a positioner disposed within the wafer handling chamber.
6. The system of claim 4, further comprising a wafer storage container for holding wafers, the wafer storage container being placed on the load port.
7. The system as claimed in claim 6, wherein the wafer storage container is a front-end-opening wafer cassette, and comprises a front wall plate with an opening, a rear wall plate opposite to the front wall plate, two side wall plates, a top plate and a bottom plate, wherein an air inlet pipe extending from the bottom plate to the top plate is arranged on the inner side of one side wall plate, an air outlet pipe extending from the bottom plate to the top plate is arranged on the inner side of the other side wall plate, the air inlet pipe is provided with a plurality of air inlets from top to bottom, and the air outlet pipe is provided with a plurality of air outlets from top to bottom.
8. The system of claim 1,
the host is used for: and receiving the particulate matter concentration detection data sent by the sensor, processing the particulate matter concentration detection data to obtain processed particulate matter concentration data, and analyzing and judging the region for generating the particulate matter in the wafer transmission and processing system and the reason for generating the particulate matter according to the particulate matter concentration data.
9. A wafer transfer and processing method with real-time particulate monitoring, wherein the method is implemented by the system of any one of claims 1-8; the method comprises the following steps:
the equipment front end module transfers the wafer into the process chamber;
the process chamber processes a wafer;
the sensors detect particulate matter concentrations in the equipment front end module and the process chamber;
the host computer receives and analyzes the particulate matter concentration detection data sent by the sensor.
10. The method of claim 9, wherein analyzing the particulate matter concentration detection data transmitted by the sensor comprises:
and processing the particulate matter concentration detection data to obtain processed particulate matter concentration data, and analyzing and judging the region for generating the particulate matter in the wafer transmission and processing system and the reason for generating the particulate matter according to the particulate matter concentration data.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011186498.7A CN114429922A (en) | 2020-10-29 | 2020-10-29 | Wafer conveying and processing system and method with real-time particulate matter monitoring function |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011186498.7A CN114429922A (en) | 2020-10-29 | 2020-10-29 | Wafer conveying and processing system and method with real-time particulate matter monitoring function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114904692A (en) * | 2022-05-27 | 2022-08-16 | 苏州光宝科技股份有限公司 | High accuracy wafer spraying equipment with self-discriminant self-detection effect |
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2020
- 2020-10-29 CN CN202011186498.7A patent/CN114429922A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114904692A (en) * | 2022-05-27 | 2022-08-16 | 苏州光宝科技股份有限公司 | High accuracy wafer spraying equipment with self-discriminant self-detection effect |
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