CN114423170A - Automobile exterior trimming part heating circuit manufacturing structure and manufacturing method thereof - Google Patents
Automobile exterior trimming part heating circuit manufacturing structure and manufacturing method thereof Download PDFInfo
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- CN114423170A CN114423170A CN202210030287.7A CN202210030287A CN114423170A CN 114423170 A CN114423170 A CN 114423170A CN 202210030287 A CN202210030287 A CN 202210030287A CN 114423170 A CN114423170 A CN 114423170A
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000009966 trimming Methods 0.000 title claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 64
- 239000002184 metal Substances 0.000 claims abstract description 64
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000007747 plating Methods 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000005240 physical vapour deposition Methods 0.000 claims abstract description 14
- 238000004140 cleaning Methods 0.000 claims abstract description 13
- 238000005530 etching Methods 0.000 claims abstract description 9
- 238000001746 injection moulding Methods 0.000 claims abstract description 9
- 238000005507 spraying Methods 0.000 claims abstract description 7
- 238000011161 development Methods 0.000 claims abstract description 6
- 239000002253 acid Substances 0.000 claims description 12
- 239000000243 solution Substances 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 10
- 239000003513 alkali Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 238000001704 evaporation Methods 0.000 claims description 8
- 230000008020 evaporation Effects 0.000 claims description 8
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 8
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000002994 raw material Substances 0.000 claims description 7
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 7
- 229910001887 tin oxide Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910003437 indium oxide Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 4
- 239000002585 base Substances 0.000 claims description 3
- 230000000295 complement effect Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 229910000846 In alloy Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 229910001922 gold oxide Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0019—Circuit arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention belongs to the technical field of automobile heating circuits, and provides a structure for manufacturing an automobile exterior trimming part heating circuit and a manufacturing method thereof, wherein the structure comprises a substrate, a metal conducting layer is formed on the substrate, the substrate is divided into a conducting circuit area and a non-conducting circuit area, a photoresist layer for preventing the metal conducting layer from being removed in etching is arranged on the surface of the metal conducting layer on the conducting circuit area, and the manufacturing is carried out by utilizing the steps of injection molding, PVD (physical vapor deposition) metal-plating conducting layer, photoresist spraying, exposure, development, etching, cleaning and the like, so that the production cost can be reduced by more than 30%, the process is simple, and a circuit can be directly formed on a product with a 3D complex structure without the traditional IML process.
Description
Technical Field
The invention belongs to the technical field of automobile heating circuits, and relates to an automobile exterior trimming part heating circuit manufacturing structure and a manufacturing method thereof.
Background
With the iterative update of the automobile industry, people have higher and higher requirements on automobiles, various new energy automobiles, automatic driving automobiles and intelligent automobiles are gradually on the market, various large automobile host plants and automobile accessory suppliers increase research and development investment, compete for future market share, wherein the radar function of the automobile is indispensable for future automobiles, in order to ensure that the radar function of the automobile can normally play a role in various complicated weather conditions or environments, the radar waves are not blocked by rain, snow and frost to cause the condition that the radar function cannot be used, the prior art has complex structure, mainly comprises six processes of scraping and burying the conductive wires, laminating, thermoforming, punching, secondary injection molding and surface hardening, so that the conductive wires can be seen on the luminous product, the appearance is influenced, the yield of mass production is low, the requirement on production environment is high, and the circuit is easily broken due to the stretching of the membrane during the forming of the IML process.
Disclosure of Invention
The invention aims to solve the technical problem and provides a manufacturing structure of an automobile exterior trimming part heating circuit and a manufacturing method thereof, wherein the manufacturing structure is used for directly forming a circuit on a product with a complex structure and has a simple process.
The technical scheme adopted by the invention for solving the technical problems is as follows: the heating circuit manufacturing structure for the automobile exterior trimming part comprises a substrate and is characterized in that a metal conducting layer is formed on the substrate, the substrate is divided into a conducting circuit area and a non-conducting circuit area, and a photoresist layer used for preventing the metal conducting layer from being removed in etching is arranged on the surface of the metal conducting layer on the conducting circuit area.
In foretell automobile exterior trim part heating circuit manufacture structure, the metal conducting layer plate with magnetron sputtering for adopting PVD evaporation, the metal that the metal conducting layer plated is copper, silver, gold, aluminium or indium oxide + tin oxide alloy, the thickness of metal conducting layer be 1-2 um.
In the above structure for manufacturing the heating circuit of the automobile exterior trimming part, the thickness of the photoresist layer is 6-10 um.
In the above structure for manufacturing the heating circuit of the automobile exterior trimming part, the photoresist layer on the surface of the metal conductive layer of the conductive circuit region is removed after cleaning, and then the photoresist layer is exposed to form a reserved metal conductive layer.
A manufacturing method of an automobile exterior trimming part heating circuit is characterized by comprising the following steps:
step one, injection molding: melting the raw materials of the plastic particles by an injection molding machine and then injecting a base material;
step two, PVD metal plating conductive layer: plating a uniform metal conducting layer on the substrate by adopting PVD evaporation plating and magnetron sputtering plating;
step three, spraying photoresist: coating photoresist on the surface of the metal conductive layer uniformly in the conductive circuit area by spraying;
step four, exposure: using laser direct writing equipment to generate UV light to enable the photoresist to be changed into a new substance which is easy to dissolve in acid or alkali through exposure, and simultaneously transferring a circuit arrangement route pattern on the photomask/film onto the photoresist;
step five, developing: dissolving a new substance which is easily dissolved in acid or alkali under the UV light by using an acid solution or an alkali solution, and dissolving or retaining the substance subjected to chemical reaction by using a solvent to form a circuit layout circuit pattern which is the same as or complementary to the photomask/film;
step six, etching: completely removing the metal conductive layer of the non-conductive circuit area exposed in the air after development by using a strong acid solution, and only remaining the metal conductive layer of the conductive circuit area under the protection of the photoresist layer;
step seven, cleaning: cleaning and removing the photoresist layer to enable the metal conducting layer of the reserved circuit to be displayed;
step eight: drying: and drying after the cleaning is finished.
In the above method for manufacturing the heating circuit of the automobile exterior trimming part, in the second step, the metal plated by the PVD evaporation plating and the magnetron sputtering plating is copper, silver, gold, aluminum or an alloy of indium oxide and tin oxide, and the thickness of the metal conducting layer is 1-2 um.
In the above method for manufacturing the heating circuit of the automobile exterior trimming part, the thickness of the photoresist layer in the third step is 6-10um, and the viscosity of the photoresist layer is 10-15 mpa.s.
Compared with the prior art, the heating circuit has the advantages that the heating circuit has high transmittance of vehicle-mounted radar waves, and has a transparent effect of visible light, the heating circuit has extremely low resistance (the square resistance of the electric resistance is less than 100 omega), and high heating efficiency (more than 1000W), the production cost can be reduced by more than 30%, the process is simple, the circuit can be directly formed on a product with a 3D complex structure, and the traditional IML process is not needed.
Drawings
FIG. 1 is a schematic view of the heating circuit of the exterior trimming part of the present invention
FIG. 2 is a schematic view showing a state in which a heating circuit for an automobile exterior part is plated with a metal conductive layer and a photoresist layer;
FIG. 3 is a schematic view showing a state of the heating circuit for automobile exterior parts during development
FIG. 4 is a schematic diagram of the state of the heating circuit of the automobile exterior trimming part during etching;
fig. 5 is a final schematic diagram of the heating circuit of the automobile exterior trimming part.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments. It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "central," "lateral," "longitudinal," "front," "rear," "left," "right," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the invention and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be considered limiting to the scope of the present invention.
In the figure, a substrate 100; a metal conductive layer 200; the metal conductive layer 201 is remained; a dissolved metal conductive layer 202; a conductive circuit region 300; a non-conductive circuit region 400; 500 of an acid solution; dissolved photoresist region material 600; a photoresist layer 700.
As shown in fig. 1, the structure for manufacturing a heating circuit of an automobile exterior trimming part includes a substrate 100, a metal conductive layer 200 is formed on the substrate 100, and the substrate 100 is divided into a conductive circuit region 300 and a non-conductive circuit region 400, wherein a photoresist layer 700 for preventing the metal conductive layer 200 from being removed during etching is formed on the surface of the metal conductive layer 200 on the conductive circuit region 300, the metal conductive layer 200 is formed by PVD evaporation plating and magnetron sputtering plating, the metal plated on the metal conductive layer 200 is copper, silver, gold, aluminum or an indium oxide + tin oxide alloy, the thickness of the metal conductive layer 200 is 1-2um, the thickness of the photoresist layer 700 is 6-10um, and the photoresist layer 700 on the surface of the metal conductive layer 200 on the conductive circuit region 300 is removed after being cleaned to expose and form a remaining metal conductive layer 201.
The patent also provides a manufacturing method of the heating circuit of the automobile exterior trimming part, which mainly comprises the following steps:
injection molding: the injection molding machine melts the raw materials of the plastic particles and then injects the molten raw materials into the base material 100, wherein the cancellation molding is a processing process of melting the raw materials of the plastic particles by the injection molding machine, applying pressure to inject the melted raw materials into a mold with a temperature, cooling and solidifying the melted raw materials to form a plastic product with a shape consistent with that of the mold cavity, and the detailed description is omitted;
as shown in fig. 2, PVD is used to plate a metal conductive layer, PVD can be divided into evaporation plating and magnetron sputtering, and in this patent, copper, silver, gold, aluminum with better conductivity and indium oxide + tin oxide alloy with a certain transparency are mainly plated, in the PVD process, a uniform metal conductive layer 200 is plated on a substrate 100, the thickness of the metal conductive layer 200 can be adjusted according to the requirement of the product on the resistance, the thicker the metal conductive layer 200 is, the smaller the resistance is, or vice versa, the thicker the metal conductive layer 200 is, the thickness of the metal conductive layer 200 is generally between 1-2um, if the transparent metal conductive layer 200 is needed to be larger, the transparency of the metal conductive layer 200 is related to the alloy ratio of indium oxide and tin oxide, then a photoresist is sprayed, the photoresist is uniformly coated on the surface of the metal conductive layer 200 by spraying on the substrate 100 with a 3D complex structure, the thickness is 6-10um, and the viscosity of the photoresist layer 700 is 10-15 mpa.s.
As shown in fig. 3, exposure: the technology used here is photolithography (lithographics), the material used here is photoresist, here because the photoresist layer 700 has unique characteristics, the exposure apparatus used in the present invention is a laser direct writing apparatus, that is, under the action of UV light, the photoresist layer 700 will undergo a chemical reaction to become a new substance easily soluble in acid or alkali, the PH values of the two substances depend on the chemical properties of the photoresist, finally the circuit layout pattern on the Mask/film (Mask) is first transferred onto the photoresist layer 700, so that the exposure can be directly completed on the 3D product, without the assistance of the conventional Mask, the area exposure can be intelligently selected according to the circuit layout pattern, and then development is performed, in this embodiment, the photoresist layer 700 under UV light is changed into a new substance easily soluble in acid or alkali by using an acid solution 500 (e.g., HNO3) or an alkali solution to dissolve, also called dissolved photoresist region material 600, and the developing process is to use the photolithography technique and then dissolve or retain the material after chemical reaction with solvent to form the circuit layout circuit pattern which is the same as or complementary to the photomask/film; as shown in fig. 4, etching: the metal conductive layer 200 of the non-conductive circuit area 400 exposed to the air after development is completely removed by using a strong alkaline solution (such as sodium hydroxide), also called a dissolved metal conductive layer 202, and only the metal conductive layer of the conductive circuit area under the protection of the photoresist layer 700, also called a metal conductive layer 201, is remained, as shown in fig. 5, and is cleaned: the photoresist layer 700 which does not have chemical reaction under the irradiation of UV light is cleaned and removed, and is shown by the metal conducting layer of the reserved circuit, a multi-groove cleaning device is used in the cleaning process, firstly, a neutral cleaning agent is used for cleaning, and finally, pure water is used for spraying and flushing, wherein the ultrasonic function, the wind cutting function and the heating surface drying function are required, so that the circuit layout circuit pattern which is designed before is basically achieved in the process, after the cleaning is completed, because the plastic material has strong water absorption, the plastic material is finally dried for 1 hour in the environment of 90 ℃, and then the next circuit protection process is carried out, wherein (for example, the surface UV varnish is hardened), the problem that the circuit is oxidized or is easily damaged by external force is prevented.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the described embodiments may be made by those skilled in the art without departing from the scope and spirit of the invention as defined by the accompanying claims.
Claims (7)
1. The heating circuit manufacturing structure for the automobile exterior trimming part comprises a substrate and is characterized in that a metal conducting layer is formed on the substrate, the substrate is divided into a conducting circuit area and a non-conducting circuit area, and a photoresist layer used for preventing the metal conducting layer from being removed in etching is arranged on the surface of the metal conducting layer on the conducting circuit area.
2. The heating circuit manufacturing structure for automobile exterior parts according to claim 1, wherein the metal conductive layer is formed by PVD evaporation plating and magnetron sputtering plating, the metal plated on the metal conductive layer is copper, silver, gold, aluminum or an alloy of indium oxide and tin oxide, and the thickness of the metal conductive layer is 1-2 um.
3. The heating circuit structure of automobile exterior trimming parts according to claim 2, wherein the photoresist layer has a thickness of 6-10 um.
4. The automobile exterior trimming part heating circuit manufacturing structure according to claim 3, wherein the photoresist layer on the surface of the metal conductive layer of the conductive circuit region is removed after cleaning to expose and form a remaining metal conductive layer.
5. A manufacturing method of an automobile exterior trimming part heating circuit is characterized by comprising the following steps:
step one, injection molding: melting the raw materials of the plastic particles by an injection molding machine and then injecting a base material;
step two, PVD metal plating conductive layer: plating a uniform metal conducting layer on the substrate by adopting PVD evaporation plating and magnetron sputtering plating;
step three, spraying photoresist: coating photoresist on the surface of the metal conductive layer uniformly in the conductive circuit area by spraying;
step four, exposure: using laser direct writing equipment to generate UV light to enable the photoresist to be changed into a new substance which is easy to dissolve in acid or alkali through exposure, and simultaneously transferring a circuit arrangement route pattern on the photomask/film onto the photoresist;
step five, developing: dissolving a new substance which is easily dissolved in acid or alkali under the UV light by using an acid solution or an alkali solution, and dissolving or retaining the substance subjected to chemical reaction by using a solvent to form a circuit layout circuit pattern which is the same as or complementary to the photomask/film;
step six, etching: completely removing the metal conductive layer of the non-conductive circuit area exposed in the air after development by using a strong acid solution, and only remaining the metal conductive layer of the conductive circuit area under the protection of the photoresist layer;
step seven, cleaning: cleaning and removing the photoresist layer to enable the metal conducting layer of the reserved circuit to be displayed;
step eight: drying: and drying after the cleaning is finished.
6. The method for manufacturing a heating circuit of an automobile exterior trimming part according to claim 5, wherein in the second step, the metal subjected to PVD evaporation plating and magnetron sputtering plating is copper, silver, gold, aluminum or indium oxide + tin oxide alloy, and the thickness of the metal conductive layer is 1-2 um.
7. The method as claimed in claim 6, wherein the photoresist layer has a thickness of 6-10um and a viscosity of 10-15 mpa.s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210030287.7A CN114423170A (en) | 2022-01-12 | 2022-01-12 | Automobile exterior trimming part heating circuit manufacturing structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210030287.7A CN114423170A (en) | 2022-01-12 | 2022-01-12 | Automobile exterior trimming part heating circuit manufacturing structure and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN114423170A true CN114423170A (en) | 2022-04-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210030287.7A Pending CN114423170A (en) | 2022-01-12 | 2022-01-12 | Automobile exterior trimming part heating circuit manufacturing structure and manufacturing method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040075528A1 (en) * | 2002-10-22 | 2004-04-22 | Oak-Mitsui, Inc. | Printed circuit heaters with ultrathin low resistivity materials |
| CN102285299A (en) * | 2010-06-21 | 2011-12-21 | 圣维可福斯(广州)电子科技有限公司 | Object surface metallized decoration method |
| JP2013125820A (en) * | 2011-12-14 | 2013-06-24 | Chuan-Ling Hu | Method for manufacturing plastic metalization three-dimensional wiring |
| CN108293275A (en) * | 2015-11-17 | 2018-07-17 | 大日本印刷株式会社 | The manufacturing method of heating electrode device, electrified regulation glass, heating board, the vehicles, building window, the piece with electric conductor, conductive pattern piece, electric conductivity heater, laminated glass and electric conductivity heater |
| CN217936112U (en) * | 2022-01-12 | 2022-11-29 | 宁波信泰机械有限公司 | Automobile exterior trimming part heating circuit manufacturing structure |
-
2022
- 2022-01-12 CN CN202210030287.7A patent/CN114423170A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040075528A1 (en) * | 2002-10-22 | 2004-04-22 | Oak-Mitsui, Inc. | Printed circuit heaters with ultrathin low resistivity materials |
| CN102285299A (en) * | 2010-06-21 | 2011-12-21 | 圣维可福斯(广州)电子科技有限公司 | Object surface metallized decoration method |
| JP2013125820A (en) * | 2011-12-14 | 2013-06-24 | Chuan-Ling Hu | Method for manufacturing plastic metalization three-dimensional wiring |
| CN108293275A (en) * | 2015-11-17 | 2018-07-17 | 大日本印刷株式会社 | The manufacturing method of heating electrode device, electrified regulation glass, heating board, the vehicles, building window, the piece with electric conductor, conductive pattern piece, electric conductivity heater, laminated glass and electric conductivity heater |
| CN217936112U (en) * | 2022-01-12 | 2022-11-29 | 宁波信泰机械有限公司 | Automobile exterior trimming part heating circuit manufacturing structure |
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