CN114420868A - Display panel - Google Patents
Display panel Download PDFInfo
- Publication number
- CN114420868A CN114420868A CN202210031455.4A CN202210031455A CN114420868A CN 114420868 A CN114420868 A CN 114420868A CN 202210031455 A CN202210031455 A CN 202210031455A CN 114420868 A CN114420868 A CN 114420868A
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- Prior art keywords
- retaining wall
- flexible substrate
- layer
- barrier
- display area
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
Abstract
The application provides a display panel, it includes: a flexible substrate including a display area and a non-display area surrounding the display area; a planarization layer disposed on a surface of the flexible substrate; a light emitting device layer disposed on the planarization layer of the display region; the retaining wall structure is arranged in the non-display area of the flexible substrate and surrounds the display area, wherein the retaining wall at least comprises a barrier body formed on the flexible substrate, and the barrier body is made of metal; and the thin film packaging layer covers the light-emitting device layer and the retaining wall structure.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel.
Background
With the rapid increase in demand for portable mobile devices, wearable display products, and the like, flexible display technology has advanced greatly in recent years. Among Display technologies capable of realizing flexible Display, an OLED (Organic Light Emitting diode Display) is considered as one of the most promising technologies in the flexible Display technologies because of its excellent performance such as fast response speed, wide viewing angle, Light weight, low power consumption, and high brightness.
In a flexible display panel, the OLEDs in the OLED light emitting layer are themselves very sensitive to moisture and oxygen, and the OLEDs contacting moisture and oxygen have poor operation stability and a reduced lifetime. Therefore, it is necessary to use an effective encapsulation film to prevent moisture and oxygen from penetrating, thereby prolonging the service life of the OLED. At present, the packaging film is composed of an inorganic material layer, an organic material layer and an inorganic material layer which are stacked, and an OLED device is packaged in the packaging film to achieve the purposes of water resistance and oxygen resistance, so that the OLED device is protected. However, the periphery of the display device is a portion where water vapor is easy to enter, and the retaining wall located in the non-display area is usually made of resin material, the intermolecular gap of the resin material is large, and the blocking capability is weak, and if water and oxygen penetrate through the encapsulation film including the inorganic layer, the resin material has no effective blocking capability, so that the lateral water and oxygen blocking capability of the flexible encapsulation needs to be improved, and the service life of the OLED device needs to be prolonged.
Therefore, the prior art has defects which need to be solved urgently.
Disclosure of Invention
The application provides a display panel, can solve the problem of flexible encapsulation's side direction separation water oxygen.
In order to solve the above problems, the technical solution provided by the present application is as follows:
a display panel, comprising:
the flexible substrate comprises a display area and a non-display area surrounding the display area;
a planarization layer disposed on the surface of the flexible substrate;
a light emitting device layer disposed on the planarization layer of the display region;
the retaining wall structure is arranged in the non-display area of the flexible substrate and surrounds the display area, wherein the retaining wall structure at least comprises a barrier body formed on the flexible substrate, and the barrier body is made of metal; and
and the thin film packaging layer covers the light-emitting device layer and the retaining wall.
In some embodiments of the invention, the retaining wall structure further includes an inner wall formed on the flexible substrate, the material of the inner wall is the same as that of the planarization layer, and the blocking body covers the surface of the inner wall.
In some embodiments of the present invention, the material of the barrier is selected from any one of lead, tin, chromium, tungsten, and nickel, or/and an alloy corresponding to the above metals.
In some embodiments of the present invention, the height of the retaining wall structure is 5 to 10 μm.
In some embodiments of the present invention, the thin film encapsulation layer includes a first inorganic layer, an organic layer and a second inorganic layer covering the light emitting device layer and the barrier structure, an area of an orthographic projection of the organic layer on the flexible substrate is larger than an area of the display region, and an orthographic projection of the second inorganic layer on the flexible substrate completely covers the first inorganic layer.
A display panel, comprising:
the flexible substrate comprises a display area and a non-display area surrounding the display area;
a planarization layer disposed on the surface of the flexible substrate;
a light emitting device layer disposed on the planarization layer of the display region;
the first retaining wall is arranged in the non-display area of the flexible substrate and surrounds the display area;
the second retaining wall is formed on the flexible substrate, surrounds the first retaining wall and is spaced from the first retaining wall; and
a thin film encapsulation layer covering the light emitting device layer with the first retaining wall and the second retaining wall, at least one of the first retaining wall and the second retaining wall including being formed on the barrier on the flexible substrate, just the density of the material of the barrier is greater than the density of the material of the thin film encapsulation layer.
In some embodiments of the present invention, the first retaining wall and the second retaining wall have the same structure, the first retaining wall further includes an inner wall formed on the flexible substrate, the inner wall is covered by the barrier, and the density of the barrier is greater than the density of the material forming the thin film encapsulation layer.
In some embodiments of the present invention, the material of the barrier is metal.
In some embodiments of the present invention, the material of the barrier is selected from any one of lead, tin, chromium, tungsten, and nickel, or/and an alloy corresponding to the above metals.
In some embodiments of the present invention, the height of the second retaining wall is not less than the height of the first retaining wall.
The beneficial effect of this application does: the application provides a display panel, because flexible substrate the non-display area just encircles the display area sets up a barricade structure, barricade structure at least including forming in barrier on the flexible substrate, barrier is the metal material or be the density of barrier's material is greater than the formation the density of film packaging layer material is greater than the formation through the material that makes barrier for the metal or the density that makes barrier's material the density of film packaging layer material to make barrier's rete density high, when barrier and combine with flexible substrate, the microcosmic hole between its and the flexible substrate is little and enough barrier self's molecular density is high, consequently can reach the purpose of fine side direction separation water oxygen.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic plan view of a display panel according to a first embodiment of the present application;
FIG. 2 is a cross-sectional view of the display panel of FIG. 1 taken along direction II-II;
FIG. 3 is a flowchart illustrating a method for fabricating the display panel shown in FIG. 2;
fig. 4 is a schematic cross-sectional view of a display panel according to a second embodiment of the invention;
fig. 5 is a flowchart of a method for manufacturing the display panel shown in fig. 4.
Description of the reference numerals
100. 200-a display panel; 1-a flexible substrate; 2-a planarization layer;
3-a light emitting device layer; 4-retaining wall structure; 5-a thin film encapsulation layer;
101-a display area; 103-non-display area; 401-a barrier;
40-a first retaining wall; 42-a second retaining wall; 51-a first inorganic layer;
53-organic layer; 55-a second inorganic layer; 403-inner wall.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "longitudinal," "lateral," "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," and the like are used in the orientation or positional relationship indicated in the drawings, which are based on the orientation or positional relationship shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be considered as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
The present application may repeat reference numerals and/or letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed. The display panel of the present application is described in detail with reference to specific embodiments.
Referring to fig. 1-2, fig. 1 and fig. 2 are a plan view and a cross-sectional view of a display panel 100 according to the present invention, respectively. The display panel 100 includes a flexible substrate 1, a planarization layer 2, a light emitting device layer 3, a barrier structure 4, and a thin film encapsulation layer 5.
The flexible substrate 1 includes a display area 101 and a non-display area 103 surrounding the display area 101. The flexible substrate 1 includes a substrate and a pixel circuit array. The substrate may be made of PI (Polyimide Film).
The planarization layer 2 is disposed on the surface of the flexible substrate 1 to cover the pixel circuit array.
The light emitting device layer 3 is disposed on the planarization layer 2 of the display region 101. The light emitting device layer 3 includes an anode layer, an organic light emitting layer, a cathode layer, and the like. The light emitting device layer 3 may be an OLED light emitting device layer 3. The light emitting device layer 3 includes a plurality of OLED light emitting cells arranged in an array. As will be understood by those skilled in the art, the display region 101 is a region covered by the light emitting cell array, and the non-display region 103 is a region on the substrate where no light emitting cell is disposed.
The retaining wall structure 4 is disposed on the flexible substrate 1 in the non-display area 103 and surrounding the display area 101, wherein the retaining wall structure 4 at least includes a blocking body 401 formed on the flexible substrate 1. The material of the barrier 401 is metal or the density of the material of the barrier 401 is greater than that of the thin film encapsulation layer 5. By making the material of the barrier 401 be metal or making the density of the barrier 401 be greater than the density of the film packaging layer 5, in this way, compared with the film packaging layer 5, the arrangement between the molecules of the barrier 401 is tighter, so that the film layer density of the barrier 401 is high, and when the barrier 401 is combined with the flexible substrate 1, the microscopic pores between the barrier 401 and the flexible substrate 1 are small, so that the purpose of well laterally blocking water and oxygen can be achieved.
In this embodiment, the material of the barrier 401 is preferably a metal which is stable in properties in an ambient temperature environment and does not chemically react with water and oxygen.
In this embodiment, the material of the barrier 401 is selected from any one of lead, tin, chromium, tungsten, and nickel, and/or an alloy corresponding to the above metals. Because the materials are stable in nature in the normal-temperature environment, the materials cannot react with water oxygen chemically.
In this embodiment, the height of the retaining wall structure 4 is 5 to 10 micrometers. This height range is better at blocking the overflow of the material of the organic layer 53 comprised by the thin-film encapsulation layer 5.
The retaining wall structure 4 may be formed by Deposition, and the Deposition process may be Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), or the like. The retaining wall structure 4 may include a plurality of retaining walls in the shape of a frame, and referring to fig. 2, alternatively, the retaining wall structure 4 includes a first retaining wall 40 and a second retaining wall 42, the second retaining wall 42 surrounds the first retaining wall 40, and the height of the second retaining wall 42 is not less than the height of the first retaining wall 40. When the organic layer 53 included in the thin film encapsulation layer 5 flows to the outside of the first retaining wall 40 closest to the display region 101, the second retaining wall 42 relatively far away from the display region 101 can further prevent the material of the organic layer 53 included in the thin film encapsulation layer 5 from overflowing, that is, by arranging the retaining wall structure 4 including a plurality of frame-shaped bodies, the material of the organic layer 53 is further prevented from overflowing, thereby ensuring a good encapsulation effect. It should be noted that the retaining wall structure 4 includes, but is not limited to, two retaining walls shown in fig. 2, and the embodiment of the present invention is not limited thereto.
In the embodiment, the first retaining wall 40 and the second retaining wall 42 are made of the same material, that is, the first retaining wall 40 and the second retaining wall 42 only include the blocking body 401 formed on the flexible substrate 1, that is, the first retaining wall 40 and the second retaining wall 42 are formed by using the blocking body 401 made of a metal material, so that a better lateral water and oxygen blocking effect can be achieved.
It is understood that in other embodiments, only one of the first retaining wall 40 and the second retaining wall 42 may be the barrier 401 formed on the flexible substrate 1, and the other of the first retaining wall 40 and the second retaining wall 42 is made of an inorganic material, and more preferably, the second retaining wall 42 formed at the outermost periphery is made of metal, and the first retaining wall 40 formed at the inner side of the second retaining wall 42 is made of an inorganic material, so as to prevent water and oxygen from permeating into the display panel 100 from the side surface.
The thin film encapsulation layer 5 covers the light emitting device layer 3 and the retaining wall structure 4, and prevents moisture or oxygen from penetrating along the front surface of the display panel 100. Specifically, the thin film encapsulation layer 5 includes a first inorganic layer 51, an organic layer 53 and a second inorganic layer covering the light emitting device layer 3 and the retaining wall structure 4An inorganic layer 55. The area of the organic layer 53 projected forward on the flexible substrate 1 is larger than the area of the display area 101, so as to realize forward sealing of the display area 101. The second inorganic layer 55 completely covers the first inorganic layer 51 in an orthographic projection of the flexible substrate 1. The first inorganic layer 51 is made of an inorganic material having a good water-blocking property, so that the first inorganic layer 51 has a good water-oxygen blocking effect. The inorganic material may be silicon nitride (SiNx) or silicon dioxide (SiO)2) Or aluminum oxide (Al)2O3)。
The first inorganic layer 51 is formed by Deposition, which may be Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), or the like.
The organic layer 53 may be made of an organic material having good flexibility and a good flexible buffer function, and the organic material may be one or a combination of polyvinyl alcohol, a polyurethane acrylate polymer, and a polyimide resin. The organic layer 53 may be formed by, but not limited to, inkjet printing (IJP), vapor deposition, or the like.
The second inorganic layer 55 is made of an inorganic material having good water-blocking property, so that the second inorganic layer 55 has a good water-oxygen blocking effect. The second inorganic layer 55 completely covers the first inorganic layer 51. The material of the second inorganic layer 55 may be silicon nitride (SiNx), silicon oxide (SiO)2) Or aluminum oxide (Al)2O3)。
Alternatively, the second inorganic layer 55 may be formed by Deposition, and the Deposition process may be Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), or the like. In the present embodiment, the organic layer 53 covers only the light emitting device layer 3 of the display region 101 and does not cover the first banks 40 of the non-display region 103, so that the organic layer 53 is blocked by the first banks 40, the organic layer 53 is used to increase the flow path of the penetrated foreign substances, and even if the penetrated foreign substances are, the organic layer 53 has a sufficient thickness to keep the surface of the first inorganic layer 51 flat.
That is, in order to prevent moisture or oxygen from penetrating along the side of the display panel 100, the display panel 100 includes a metal barrier structure 4 in the non-display region 103, and in order to prevent moisture or oxygen from penetrating along the front surface of the display panel 100, the display panel 100 includes a film encapsulation layer 5, and the film encapsulation layer 5 covers the light emitting device layer 3 of the display region 101 and also covers a portion of the barrier structure 4 of the non-display region 103.
Referring to fig. 3, fig. 3 is a flowchart illustrating a method for manufacturing a display panel 100 according to the present invention, which includes the following steps.
Step S1: providing a flexible substrate 1, wherein the flexible substrate 1 comprises a display area 101 and a non-display area 103 surrounding the display area 101, the flexible substrate 1 comprises a substrate and a pixel circuit array, and a planarization layer 2 is formed on the flexible substrate 1 to cover the pixel circuit array on the flexible substrate 1.
Step S2: the non-display area 103 of the flexible substrate 1 is formed with a retaining wall structure 4 made of metal material in a deposition mode, and the retaining wall structure 4 is spaced from the display area 101.
Step S3: a light emitting device layer 3 is formed on the surface of the planarization layer 2.
Step S4: a thin film packaging layer 5 is formed on the surface of the light-emitting device layer 3, the thin film packaging layer 5 is used for sealing the light-emitting device layer 3 on the flexible substrate 1, and the thin film packaging layer 5 also covers the retaining wall structure 4.
In the present embodiment, the dam structures 4 are already formed before the light emitting device layer 3 is formed, so that the side surfaces of the light emitting device layer are completely sealed by the planarization layer 2 and the dam structures 4, the probability of water and oxygen from entering the inside of the display panel from the lateral direction is further reduced, and the lateral sealing of the display panel 100 is better achieved.
Referring to fig. 4, fig. 4 is a display panel 200 according to a second embodiment of the present invention. The display panel 200 of the second embodiment is substantially the same as the display panel 100 of the first embodiment, except that in this embodiment, the first retaining wall 40 and the second retaining wall 42 each further include an inner wall 403 formed on the flexible substrate 1. That is to say, in this embodiment, the retaining wall structure 4 includes a first retaining wall 40 and a second retaining wall 42 spaced apart from the first retaining wall 40, the first retaining wall 40 and the second retaining wall 42 have the same structure, and the first retaining wall 40 includes an inner wall 403 formed on the flexible substrate 1 and a blocking body 401 covering the entire surface of the inner wall 403.
The material of the inner wall 403 is the same as that of the planarization layer 2, and the barrier 401 covers the surface of the inner wall 403. The height of the first retaining wall 40 and the second retaining wall 42 is still within the range of 5-10 microns, the thickness of the barrier 401 is 1-5 microns, and the difference between the thicknesses of the first retaining wall 40 and the barrier 401 is the height of the inner wall 403.
Because the height of the retaining wall structure 4 needs to be within the range of 5-10 micrometers to achieve the blocking effect on the organic layer 53 material included in the thin film encapsulation layer 5, and it is time-consuming to form the metal barrier 401 having a height within the range of 5-10 micrometers, in this embodiment, an inner wall 403 is formed on the surface of the flexible substrate 1, and the inner wall 403 is covered by the barrier 401, so that not only the lateral blocking capability for water and oxygen can be achieved, but also the manufacturing process can be saved, and preferably, the inner wall 403 and the planarization layer 2 can be formed together.
Referring to fig. 5, fig. 5 is a manufacturing method of a display panel 200 according to the present invention, which includes the following steps.
Step S1: providing a flexible substrate 1, wherein the flexible substrate 1 comprises a display area 101 and a non-display area 103 surrounding the display area 101, the flexible substrate 1 comprises a substrate and a pixel circuit array, a planarization layer 2 is formed on the flexible substrate 1 to cover the pixel circuit array on the flexible substrate 1, an inner wall 403 is formed on the non-display area 103 of the flexible substrate, and the inner wall 403 is spaced from the display area 101.
Step S2: and forming a barrier 401 made of a metal material on the surface of the inner wall 403 by adopting a deposition mode, wherein the barrier 401 completely covers the inner wall 403.
Step S3: a light emitting device layer 3 is formed on the surface of the planarization layer 2.
Step S4: a thin film packaging layer 5 is formed on the surface of the light-emitting device layer 3, the thin film packaging layer 5 is used for sealing the light-emitting device layer 3 on the flexible substrate 1, and the thin film packaging layer 5 also covers the retaining wall structure 4.
In summary, the display panels 100 and 200 provided by the present application have a retaining wall structure 4 disposed in the non-display area 103 and surrounding the display area 101 of the flexible substrate 1, the retaining wall at least comprises a blocking body 401 formed on the flexible substrate 1, the blocking body 401 is made of metal or the density of the material of the blocking body 401 is greater than that of the material of the thin film packaging layer 5, by making the material of the barrier 401 metal or making the material of the barrier 401 have a density greater than that of the material forming the thin film encapsulation layer 5, so that the film layer of the barrier 401 has high density, and when the barrier 401 is combined with the flexible substrate 1, the microcosmic pores between the flexible substrate 1 and the barrier body 401 are small, and the barrier body is made of metal, so that the molecular density of the film layer made of metal is high, and the purpose of good lateral barrier to water and oxygen can be achieved.
In summary, although the present application has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application shall be determined by the appended claims.
Claims (10)
1. A display panel, comprising:
the flexible substrate comprises a display area and a non-display area surrounding the display area;
a planarization layer disposed on the surface of the flexible substrate;
a light emitting device layer disposed on the planarization layer of the display region;
the retaining wall structure is arranged in the non-display area of the flexible substrate, surrounds the display area and is spaced from the display area, wherein the retaining wall structure at least comprises a barrier body formed on the flexible substrate, and the barrier body is made of metal; and
and the thin film packaging layer covers the light-emitting device layer and the retaining wall.
2. The display panel of claim 1, wherein the retaining wall structure further comprises an inner wall formed on the flexible substrate, the inner wall is made of the same material as the planarization layer, and the blocking body covers the surface of the inner wall.
3. The display panel according to claim 2, wherein the height of the dam structure is 5-10 μm, and the thickness of the barrier is 1-5 μm.
4. The display panel according to claim 1, wherein the material of the barrier is selected from any one of lead, tin, chromium, tungsten, and nickel, and/or an alloy corresponding to the above metal.
5. The display panel of claim 1, wherein the thin film encapsulation layer comprises a first inorganic layer, an organic layer and a second inorganic layer covering the light emitting device layer and the barrier structure, an area of the organic layer in the orthographic projection of the flexible substrate is larger than an area of the display area, and an area of the second inorganic layer in the orthographic projection of the flexible substrate completely covers the first inorganic layer.
6. A display panel, comprising:
the flexible substrate comprises a display area and a non-display area surrounding the display area;
a planarization layer disposed on the surface of the flexible substrate;
a light emitting device layer disposed on the planarization layer of the display region;
the first retaining wall is arranged in the non-display area of the flexible substrate, surrounds the display area and is spaced from the display area;
the second retaining wall is formed on the flexible substrate, surrounds the first retaining wall and is spaced from the first retaining wall; and
a thin film encapsulation layer covering the light emitting device layer with the first retaining wall and the second retaining wall, at least one of the first retaining wall and the second retaining wall including being formed on the barrier on the flexible substrate, just the density of the material of the barrier is greater than the density of the material of the thin film encapsulation layer.
7. The display panel according to claim 6, wherein the first retaining wall and the second retaining wall have the same structure, the first retaining wall further comprises an inner wall formed on the flexible substrate, the inner wall is covered by the barrier, and the density of the barrier is greater than that of the thin film encapsulation layer.
8. The display panel according to claim 7, wherein the barrier is made of metal.
9. The display panel according to claim 8, wherein the material of the barrier is selected from any one of lead, tin, chromium, tungsten, and nickel, and/or an alloy corresponding to the above metal.
10. The display panel according to claim 6, wherein the height of the second retaining wall is not less than the height of the first retaining wall.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210031455.4A CN114420868A (en) | 2022-01-12 | 2022-01-12 | Display panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210031455.4A CN114420868A (en) | 2022-01-12 | 2022-01-12 | Display panel |
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| CN114420868A true CN114420868A (en) | 2022-04-29 |
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| CN202210031455.4A Pending CN114420868A (en) | 2022-01-12 | 2022-01-12 | Display panel |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140231767A1 (en) * | 2013-02-18 | 2014-08-21 | Innolux Corporation | Organic light emitting diode display device and manufacturing method thereof |
| CN106158881A (en) * | 2015-05-12 | 2016-11-23 | 三星显示有限公司 | Organic light-emitting display device |
| CN106783926A (en) * | 2016-12-28 | 2017-05-31 | 上海天马有机发光显示技术有限公司 | A kind of display panel and its device |
| CN108172604A (en) * | 2018-01-03 | 2018-06-15 | 京东方科技集团股份有限公司 | A kind of OLED encapsulating structures, packaging method, display device |
| WO2021017010A1 (en) * | 2019-08-01 | 2021-02-04 | 京东方科技集团股份有限公司 | Display substrate and display apparatus |
-
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- 2022-01-12 CN CN202210031455.4A patent/CN114420868A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140231767A1 (en) * | 2013-02-18 | 2014-08-21 | Innolux Corporation | Organic light emitting diode display device and manufacturing method thereof |
| CN106158881A (en) * | 2015-05-12 | 2016-11-23 | 三星显示有限公司 | Organic light-emitting display device |
| CN106783926A (en) * | 2016-12-28 | 2017-05-31 | 上海天马有机发光显示技术有限公司 | A kind of display panel and its device |
| CN108172604A (en) * | 2018-01-03 | 2018-06-15 | 京东方科技集团股份有限公司 | A kind of OLED encapsulating structures, packaging method, display device |
| WO2021017010A1 (en) * | 2019-08-01 | 2021-02-04 | 京东方科技集团股份有限公司 | Display substrate and display apparatus |
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