CN114420577B - Novel gold wire bonding equipment for integrated circuit chip - Google Patents

Novel gold wire bonding equipment for integrated circuit chip Download PDF

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Publication number
CN114420577B
CN114420577B CN202210056735.0A CN202210056735A CN114420577B CN 114420577 B CN114420577 B CN 114420577B CN 202210056735 A CN202210056735 A CN 202210056735A CN 114420577 B CN114420577 B CN 114420577B
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China
Prior art keywords
fixedly connected
plate
rod
arc
limiting plate
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CN202210056735.0A
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Chinese (zh)
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CN114420577A (en
Inventor
刘欣
钱满满
孙伟
唐贵
汪康胜
荣振昭
孙家默
刘军
彭朱容
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Qingdao Zhiteng Science And Technology Co ltd
QINGDAO ZHITENG MICROELECTRONICS CO Ltd
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Qingdao Zhiteng Science And Technology Co ltd
QINGDAO ZHITENG MICROELECTRONICS CO Ltd
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Priority to CN202210056735.0A priority Critical patent/CN114420577B/en
Publication of CN114420577A publication Critical patent/CN114420577A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/789Means for monitoring the connection process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/789Means for monitoring the connection process
    • H01L2224/78925Vibration adjusting means, e.g. sensors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Clamps And Clips (AREA)

Abstract

The invention discloses a novel integrated circuit chip gold wire bonding device, which belongs to the technical field of electronic equipment and can play a role of clamping a chip product through the matching of a limiting plate and a top plate, so that not only can the chip products of different types be fixed, but also the chip product can be prevented from shifting and shaking due to mechanical vibration.

Description

Novel gold wire bonding equipment for integrated circuit chip
Technical Field
The invention relates to the technical field of electronic equipment, in particular to novel gold wire bonding equipment for an integrated circuit chip.
Background
The chip belongs to the precision device, and self intensity is fragile, breakable, because the chip receives mechanical vibration and pressure when carrying out bonding process, if not fixing, the chip can irregularly move when carrying out the bonding, beats even.
However, the self-contained fixing seat of the full-automatic gold wire bonding equipment is few in applicable product types, and cannot be suitable for bonding all the existing products of a company, the existing company has various product types, and if one bonding equipment is configured for each type of chip product, the consumption is too large; even if a tool is processed for each type of chip, the investment is large.
However, according to the requirements of chip products of companies, each full-automatic gold wire bonding device is suitable for all chip products, and the existing devices in the current market cannot meet the requirements of the companies, so that the tool is designed and researched according to the actual production requirements under the conditions of convenience in operation, low price, high qualification rate and the like.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide novel gold wire bonding equipment for an integrated circuit chip, which has the function of clamping the chip product through the matching of a limiting plate and a top plate, so that not only can the chip products of different types be fixed, but also the chip products can be prevented from shifting and shaking due to the mechanical vibration, along with the increase of the service time, when the limiting plate shifts due to the mechanical vibration, a push plate is driven by the restoring force of a spring so as to continuously clamp the chip product, and the shaking amplitude of the chip product is effectively reduced through the matching arrangement of an expansion top ball and a clamping tooth ring plate.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
The utility model provides a novel integrated circuit chip gold wire bonding equipment, lateral wall fixedly connected with frock base on the equipment base, sliding connection has the roof on the frock base, install the clamp plate that is located the roof upside on the frock base, the chip product has been placed on the frock base, frock base is located the equal sliding connection in chip product both sides and has the limiting plate, it has two removal sliding holes to cut a hole on the limiting plate, frock base is located the equal threaded connection of two limiting plate downside and has the bolt, and the bolt runs through and removes the sliding hole setting, the limiting plate is located spring one side and all pegs graft and have the inserted bar, the inserted bar is close to chip product one end fixedly connected with push pedal, the inserted bar is located the inside fixedly connected with of limiting plate and removes the spring plate, fixedly connected with spring between limiting plate inner wall and the removal spring plate, be provided with the extrusion bag between bolt and the limiting plate, fixedly connected with connecting hose between extrusion bag and the inserted bar, the inserted bar is kept away from push pedal one end and is installed the inflation summit has two arc hinge poles, two relative fixedly connected with connecting rod of a lateral wall fixedly connected with connecting rod, two relative to the relative side wall of arc hinge pole, two relative one side wall relative fixedly connected with connecting rod is provided with the swivel plate around the limiting plate.
Further, inflation kicking ball includes the elastic ball, fixedly connected with inserts a section of thick bamboo on the elastic ball lateral wall, and inserts a section of thick bamboo and peg graft inside the inserted bar, insert the inside fixedly connected with montant of a section of thick bamboo, montant fixedly connected with horizontal pole, and the horizontal pole runs through the elastic ball setting, pulling stay cord that can be better, the stability of reinforcing structure.
Furthermore, two the relative one end of connecting rod is articulated with the commentaries on classics board respectively, and two commentaries on classics boards and elastic ball fixed connection, can be convenient for the expansion of arc hinge pole.
Further, the limiting plate is internally provided with a cavity, the cavity is connected with a trigger plate in a sliding mode, a stay cord is fixedly connected between the trigger plate and the cross rod, the cavity is located above the trigger plate and provided with a switch button, the limiting plate side wall is provided with a buzzer, the buzzer is electrically connected with the switch button, an alarm can be triggered, and a worker can be prompted to perform corresponding processing.
Furthermore, the elastic ball is made of elastic materials, can expand the two arc-shaped hinge rods and can provide elastic force for the two arc-shaped hinge rods.
Furthermore, fixedly connected with limit ring piece on the inserted bar, and limit ring piece and arc hinge rod contact, can play spacing effect to the arc hinge rod to make the inflation kickball can only remove to a direction, thereby reduced the purpose of chip product amplitude of rocking.
Further, the radian of the inner wall of the latch ring plate is matched with the arc-shaped hinge rod, and the surface of the arc-shaped hinge rod is subjected to polishing treatment, so that the friction force between the arc-shaped hinge rod and the latch ring plate can be reduced, and the phenomenon of blocking is avoided.
Furthermore, a sliding hole is dug in the limiting plate, and the connecting hose penetrates through the sliding hole to facilitate the movement of the limiting plate.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) This scheme can be through the cooperation of limiting plate and roof, play the effect of a centre gripping to the chip product, not only can play fixed effect to the chip product of different grade type like this, can also avoid the chip product to take place the skew and rock because of mechanical vibration, increase along with live time, when the limiting plate takes place the skew because of mechanical vibration, utilize the restoring force of spring to drive the push pedal, make it can continue to play the clamping action to the chip product, and set up through the cooperation of inflation knob and latch ring board, the range of rocking of chip product has effectively been reduced, in addition, appear not hard up because of mechanical vibration at the bolt, also can utilize the restoring force of spring, the pulling triggers the board, trigger bee calling organ's alarm, make the staff take corresponding processing, thereby improve the stability of chip product bonding.
(2) The inflation kickball includes the elastic ball, and fixedly connected with inserts a section of thick bamboo on the elastic ball lateral wall, and inserts a section of thick bamboo and peg graft inside the inserted bar, inserts the inside fixedly connected with montant of a section of thick bamboo, montant fixedly connected with horizontal pole, and the horizontal pole runs through the elastic ball setting, the pulling stay cord that can be better, the stability of reinforcing structure.
(3) The opposite ends of the two connecting rods are respectively hinged with the rotating plates, and the two rotating plates are fixedly connected with the elastic ball, so that the arc-shaped hinged rod can be conveniently unfolded.
(4) The limiting plate is internally provided with a cavity, the cavity is internally and slidably connected with a trigger plate, a stay cord is fixedly connected between the trigger plate and the cross rod, the cavity is positioned above the trigger plate and provided with a switch button, the side wall of the limiting plate is provided with a buzzer, the buzzer is electrically connected with the switch button, the alarm can be triggered, and a worker is prompted to perform corresponding treatment.
(5) The elastic ball is made of elastic materials, can expand the two arc-shaped hinge rods and can provide elastic force for the two arc-shaped hinge rods.
(6) Fixedly connected with spacing ring piece on the inserted bar, and spacing ring piece contacts with the arc hinge pole, can play spacing effect to the arc hinge pole to make the inflation kickball can only remove to a direction, thereby reduced chip product amplitude of rocking's purpose.
(7) The radian of the inner wall of the latch ring plate is matched with the arc-shaped hinge rod, and the surface of the arc-shaped hinge rod is subjected to grinding and polishing treatment, so that the friction force between the arc-shaped hinge rod and the latch ring plate can be reduced, and the phenomenon of blocking is avoided.
(8) The limiting plate is provided with a sliding hole in a chiseling mode, and the connecting hose penetrates through the sliding hole to be arranged, so that the limiting plate can move conveniently.
Drawings
FIG. 1 is a top view of the present invention;
FIG. 2 is a top view of the invention at a limiting plate;
FIG. 3 is a three-dimensional perspective view of the invention at a limiting plate;
FIG. 4 is a front sectional view of the invention at a position of a limiting plate;
FIG. 5 is a schematic view of the structure of the present invention at the position of the insertion rod;
FIG. 6 is a schematic view of the structure at the location of the expansion dome of the present invention;
FIG. 7 is a diagram of a limiting plate of the present invention holding a chip product;
FIG. 8 is a diagram illustrating the position of the position limiting plate;
FIG. 9 is an enlarged view taken at A in FIG. 8;
FIG. 10 is a view of the position of the retainer plate when the bolt is loosened in accordance with the present invention;
fig. 11 is an enlarged view at B in fig. 10.
The reference numbers in the figures illustrate:
1 equipment base, 2 tooling base, 3 top plate, 4 pressing plate, 5 limiting plates, 51 moving slide hole, 52 bolt, 53 inserted rod, 54 pushing plate, 55 moving spring plate, 56 spring, 561 extrusion bag, 57 expanding top ball, 571 elastic ball, 572 inserted cylinder, 573 vertical rod, 574 horizontal rod, 58 arc-shaped hinge rod, 581 limiting ring block, 59 connecting rod, 510 rotating plate, 511 connecting hose, 512 latch ring plate, 513 pull rope, 514 trigger plate, 515 switch button, 516 buzzer and 6 chip product.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1-9, a novel gold wire bonding apparatus for integrated circuit chips comprises an apparatus base 1, a tool base 2 fixedly connected to the upper side wall of the apparatus base 1, a top plate 3 slidably connected to the tool base 2, a pressing plate 4 mounted on the upper side of the top plate 3 on the tool base 2, a chip product 6 placed on the tool base 2, a limiting plate 5 slidably connected to both sides of the chip product 6 on the tool base 2, two movable sliding holes 51 drilled on the limiting plate 5, bolts 52 screwed to the lower sides of the two limiting plates 5 on the tool base 2, and bolts 52 passing through the movable sliding holes 51, an inserting rod 53 inserted into one side of the limiting plate 5 on the spring 56, a push plate 54 fixedly connected to one end of the inserting rod 53 close to the chip product 6, a movable spring plate 55 fixedly connected to the inner wall of the limiting plate 5 and the movable spring plate 55, an extruding bag 561 arranged between the bolt 52 and the limiting plate 5, a connecting hose 511 fixedly connected between the extruding bag 561 and the inserting rod 53, an expanding push ball 57 mounted on one end of the inserting rod 53 far from the push plate 54, two arc springs 53, and a rotating hinge plates 59 connected to the chip product, when the chip product is moved, two rotating pins 5, a pulling force is applied to the chip 5, and the chip 5, a pulling force is applied to the limiting plate 510, subsequently, the top plate 3 is moved, the pressing plate 4 can be utilized to fix the top plate 3 by rotating the bolts on the pressing plate 4, so that the chip is prevented from irregularly moving due to mechanical vibration when being bonded, when the bolts 52 are screwed down to fix the limiting plate 5, the bolts 52 extrude the extrusion bag 561, the elastic balls 571 are expanded, the elastic balls 571 push the two arc-shaped hinge rods 58 to expand, and the following two conditions can occur along with the lapse of service time: firstly, under the effect that bolt 52 has fixedly to limiting plate 5, limiting plate 5 can be because the vibration of machinery, lead to two limiting plate 5 to the centre gripping pretightning force of chip product 6 diminish gradually, even lead to two limiting plate 5 to take place the skew because of mechanical vibration, arouse chip product 6 to rock between two limiting plate 5, when taking place this kind of condition, as shown in fig. 8-9, under the effect of spring 56 restoring force, pulling removes spring plate 55, make push pedal 54 can continue to play the effect of centre gripping to chip product 6, inflation knob 57 passes through inserted bar 53 and takes place the removal in step simultaneously, elastic ball 571 adopts the elasticity material to make arc hinge bar 58 cause the extrusion to elastic ball 571, and move to second latch ring plate 512, thereby the stability of chip product 6 centre gripping has been improved, make chip product 6 can not appear rocking by a relatively large margin.
Referring to fig. 6-11, the expandable top ball 57 includes an elastic ball 571, the sidewall of the elastic ball 571 is fixedly connected with an inserting tube 572, the inserting tube 572 is inserted into the inserting rod 53, the inside of the inserting tube 572 is fixedly connected with a vertical rod 573, the vertical rod 573 is fixedly connected with a cross rod 574, and the cross rod 574 penetrates through the elastic ball 571, and when the bolt 52 loosens due to mechanical vibration, as shown in fig. 10-11, the fixing plate 5 loses the fixing of the bolt 52, so that the fixing plate 5 does not have a clamping force on the chip product 6, and therefore, under the action of the spring 56, the whole fixing plate 5 reversely moves when pushing the chip product 6.
Referring to fig. 4, a cavity is drilled in the limiting plate 5, a trigger plate 514 is slidably connected in the cavity, a pull rope 513 is fixedly connected between the trigger plate 514 and the cross rod 574, an opening Guan Anniu is installed above the trigger plate 514 in the cavity, a buzzer 516 is installed on the side wall of the limiting plate 5, the buzzer 516 is electrically connected with the switch button 515, at this time, under the restoring force of the spring 56, the pull rope 513 is pulled by the cross rod 574, so that the trigger plate 514 moves upward, and the switch button 515 is pressed, so that the buzzer 516 gives an alarm to inform a worker that the bolt 52 is loosened, and the worker is prompted to take corresponding measures.
Referring to fig. 6, the opposite ends of the two connecting rods 59 are hinged to the rotating plates 510, and the two rotating plates 510 are fixedly connected to the elastic balls 571, so that the elastic balls 571 can expand to drive the two arc-shaped hinge rods 58 to unfold.
Referring to fig. 6, a limit ring block 581 is fixedly connected to the insert rod 53, and the limit ring block 581 contacts with the arc-shaped hinge rod 58 to limit the arc-shaped hinge rod 58, so that the expansion top ball 57 can only move in one direction, thereby reducing the shaking range of the chip product 6, the radian of the inner wall of the latch ring plate 512 is matched with that of the arc-shaped hinge rod 58, and the surface of the arc-shaped hinge rod 58 is polished to reduce the friction between the arc-shaped hinge rod 58 and the latch ring plate 512, thereby avoiding the blocking phenomenon.
Referring to fig. 3-4, the limiting plate 5 is drilled with a sliding hole, and the connection hose 511 is disposed through the sliding hole to facilitate the movement of the limiting plate 5.
The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by the equivalent or modified embodiments and the modified concepts of the present invention.

Claims (8)

1. The utility model provides a novel integrated circuit chip gold wire bonding equipment, includes equipment base (1), its characterized in that: the fixture comprises an equipment base (1), a tooling base (2) is fixedly connected to the side wall of the equipment base (1), a top plate (3) is connected to the tooling base (2) in a sliding mode, a pressing plate (4) located on the upper side of the top plate (3) is installed on the tooling base (2), chip products (6) are placed on the tooling base (2), limiting plates (5) are arranged on two sides of the chip products (6) in a sliding mode, two movable sliding holes (51) are formed in each limiting plate (5), bolts (52) are connected to the lower sides of the two limiting plates (5) in a threaded mode, the bolts (52) penetrate through the movable sliding holes (51), inserting rods (53) are inserted into one sides of the limiting plates (5), the inserting rods (53) are close to one end fixedly connected with a push plate (54) of the chip products (6), the inserting rods (53) are located inside the limiting plates (5) and fixedly connected with movable spring plates (55), fixed springs (56) are connected between the inner walls of the limiting plates (5) and the movable spring plates (55), a pressing bag (561) is arranged between the bolt (52) and the pressing bag (561), and a hose (561) is connected with the pressing bag (511), push pedal (54) one end is kept away from in inserted bar (53) and expansion knob (57) is installed, inserted bar (53) are close to that expansion knob (57) one end articulates there are two arc hinge bars (58), two the equal fixedly connected with connecting rod (59) of the relative lateral wall of arc hinge bar (58), two the relative one end of connecting rod (59) all is connected with commentaries on classics board (510), limiting plate (5) are located and are provided with a plurality of latch ring boards (512) around expansion knob (57), limiting plate (5) inside is opened there is the cavity, and the inside sliding connection of cavity has trigger plate (514), fixedly connected with stay cord (513) between trigger plate (514) and horizontal pole (574), the cavity is located and triggers board (514) top and installs switch button (515), install bee calling organ (516) on limiting plate (5) the lateral wall, and bee calling organ (516) and switch button (515) electric connection chisel.
2. The apparatus of claim 1, wherein: the expansion top ball (57) comprises an elastic ball (571), an insertion tube (572) is fixedly connected to the side wall of the elastic ball (571), and the insertion tube (572) is inserted into the insertion rod (53).
3. The apparatus of claim 2, wherein: a vertical rod (573) is fixedly connected to the inner part of the insert barrel (572), a cross rod (574) is fixedly connected to the vertical rod (573), and the cross rod (574) penetrates through the elastic ball (571) to be arranged.
4. The apparatus of claim 1, wherein: the opposite ends of the two connecting rods (59) are respectively hinged with the rotating plates (510), and the two rotating plates (510) are fixedly connected with the elastic balls (571).
5. The apparatus as claimed in claim 4, wherein: the elastic ball (571) is made of elastic material.
6. The apparatus of claim 1, wherein: the insert rod (53) is fixedly connected with a limit ring block (581), and the limit ring block (581) is in contact with the arc-shaped hinge rod (58).
7. The apparatus of claim 1, wherein: the radian of the inner wall of the latch ring plate (512) is matched with that of the arc-shaped hinge rod (58), and the surface of the arc-shaped hinge rod (58) is polished.
8. The apparatus as claimed in claim 1, wherein: the limiting plate (5) is provided with a sliding hole, and the connecting hose (511) penetrates through the sliding hole.
CN202210056735.0A 2022-01-18 2022-01-18 Novel gold wire bonding equipment for integrated circuit chip Active CN114420577B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210056735.0A CN114420577B (en) 2022-01-18 2022-01-18 Novel gold wire bonding equipment for integrated circuit chip

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Application Number Priority Date Filing Date Title
CN202210056735.0A CN114420577B (en) 2022-01-18 2022-01-18 Novel gold wire bonding equipment for integrated circuit chip

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CN114420577B true CN114420577B (en) 2022-12-30

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5579985A (en) * 1993-07-26 1996-12-03 Kabushiki Kaisha Shinkawa Chip bonding method and apparatus
CN212887147U (en) * 2020-05-28 2021-04-06 湖北嘉烜科技有限公司 Clamping device for automatic lead bonding machine
CN113161271A (en) * 2021-03-17 2021-07-23 刘光桐 Can deposit strorage device for chip of different specifications

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1310986A1 (en) * 2001-11-08 2003-05-14 F & K Delvotec Bondtechnik GmbH Transfer mechanism for a die presentation package
CN212859602U (en) * 2020-05-21 2021-04-02 深圳市佰誉科技有限公司 Cutting device is used in chip production
CN212461611U (en) * 2020-05-25 2021-02-02 北京华芯微半导体有限公司 Clamp for chip gold wire bonding

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5579985A (en) * 1993-07-26 1996-12-03 Kabushiki Kaisha Shinkawa Chip bonding method and apparatus
CN212887147U (en) * 2020-05-28 2021-04-06 湖北嘉烜科技有限公司 Clamping device for automatic lead bonding machine
CN113161271A (en) * 2021-03-17 2021-07-23 刘光桐 Can deposit strorage device for chip of different specifications

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