CN114420577A - Novel gold wire bonding equipment for integrated circuit chip - Google Patents
Novel gold wire bonding equipment for integrated circuit chip Download PDFInfo
- Publication number
- CN114420577A CN114420577A CN202210056735.0A CN202210056735A CN114420577A CN 114420577 A CN114420577 A CN 114420577A CN 202210056735 A CN202210056735 A CN 202210056735A CN 114420577 A CN114420577 A CN 114420577A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/789—Means for monitoring the connection process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/789—Means for monitoring the connection process
- H01L2224/78925—Vibration adjusting means, e.g. sensors
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Clamps And Clips (AREA)
Abstract
The invention discloses a novel gold wire bonding device for an integrated circuit chip, which belongs to the technical field of electronic equipment and can play a role of clamping a chip product through the matching of a limiting plate and a top plate, thus not only fixing different types of chip products, but also avoiding the chip product from deviating and shaking due to mechanical vibration, and as the service life increases, when the limiting plate deviates due to the mechanical vibration, a push plate is driven by the restoring force of a spring so as to continuously play a role of clamping the chip product, and the shaking amplitude of the chip product is effectively reduced through the matching arrangement of an expansion top ball and a latch ring plate, in addition, when a bolt loosens due to the mechanical vibration, the restoring force of the spring can also be utilized to pull a trigger plate to trigger the alarm of a buzzer so as to prompt a worker to adopt corresponding treatment, therefore, the stability of chip product bonding is improved.
Description
Technical Field
The invention relates to the technical field of electronic equipment, in particular to novel gold wire bonding equipment for an integrated circuit chip.
Background
The chip belongs to the precision device, and self intensity is fragile, breakable, because the chip receives mechanical vibration and pressure when carrying out bonding process, if not fixing, the chip can irregularly move when carrying out the bonding, beats even.
However, the self-contained fixing seat of the full-automatic gold wire bonding equipment is few in applicable product types, and cannot be suitable for bonding all the existing products of a company, the existing company has various product types, and if one bonding equipment is configured for each type of chip product, the consumption is too large; even if a tool is processed for each type of chip, the investment is large.
However, according to the requirements of chip products of companies, each full-automatic gold wire bonding device is suitable for all chip products, and the existing devices in the current market cannot meet the requirements of the companies, so that the tool is designed and researched according to the actual production requirements under the conditions of convenience in operation, low price, high qualification rate and the like.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a novel gold wire bonding device for an integrated circuit chip, which can play a role in clamping the chip product through the matching of a limiting plate and a top plate, so that not only can the chip products of different types be fixed, but also the chip products can be prevented from shifting and shaking due to the mechanical vibration, and as the service life is prolonged, when the limiting plate shifts due to the mechanical vibration, a push plate can be driven by the restoring force of a spring to continuously clamp the chip product, and the shaking amplitude of the chip product is effectively reduced through the matching arrangement of an expansion top ball and a latch annular plate, in addition, when a bolt looses due to the mechanical vibration, the restoring force of the spring can be used for pulling a trigger plate to trigger the alarm of a buzzer to prompt a worker to adopt corresponding treatment, therefore, the stability of chip product bonding is improved.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A novel integrated circuit chip gold wire bonding device is characterized in that a tool base is fixedly connected to the upper side wall of the device base, a top plate is connected to the tool base in a sliding mode, a pressing plate located on the upper side of the top plate is installed on the tool base, a chip product is placed on the tool base, limiting plates are connected to the two sides of the chip product in a sliding mode, two moving sliding holes are formed in the limiting plates, bolts are connected to the lower sides of the two limiting plates in a threaded mode and penetrate through the moving sliding holes, inserting rods are inserted into the limiting plates located on one sides of springs, a push plate is fixedly connected to one ends, close to the chip product, of the inserting rods, moving spring plates are fixedly connected to the inner portions, located inside the limiting plates, of the inserting rods, springs are fixedly connected to the inner walls of the limiting plates and the moving spring plates, and extrusion bags are arranged between the bolts and the limiting plates, fixedly connected with coupling hose between extrusion bag and the inserted bar, the inserted bar is kept away from push pedal one end and is installed inflation kickball, the inserted bar is close to inflation kickball one end and articulates there are two arc hinge rods, two the equal fixedly connected with connecting rod of the relative lateral wall of arc hinge rod, two the relative one end of connecting rod all is connected with the commentaries on classics board, the limiting plate is located and is provided with a plurality of latch ring boards around the inflation kickball.
Further, inflation kicking ball includes the elastic ball, fixedly connected with inserts a section of thick bamboo on the elastic ball lateral wall, and inserts a section of thick bamboo and peg graft inside the inserted bar, insert the inside fixedly connected with montant of a section of thick bamboo, montant fixedly connected with horizontal pole, and the horizontal pole runs through the elastic ball setting, pulling stay cord that can be better, the stability of reinforcing structure.
Furthermore, two the relative one end of connecting rod is articulated with changeing the board respectively, and two commentaries on classics board and elastic ball fixed connection, can be convenient for the expansion of arc hinge pole.
Further, the limiting plate is internally provided with a cavity, the cavity is connected with a trigger plate in a sliding mode, a stay cord is fixedly connected between the trigger plate and the cross rod, the cavity is located above the trigger plate and provided with a switch button, the limiting plate side wall is provided with a buzzer, the buzzer is electrically connected with the switch button, an alarm can be triggered, and a worker can be prompted to perform corresponding processing.
Furthermore, the elastic ball is made of elastic materials, can expand the two arc-shaped hinge rods and can provide elastic force for the two arc-shaped hinge rods.
Furthermore, fixedly connected with limit ring piece on the inserted bar, and limit ring piece and arc hinge rod contact, can play spacing effect to the arc hinge rod to make the inflation kickball can only remove to a direction, thereby reduced the purpose of chip product amplitude of rocking.
Further, the radian of the inner wall of the latch ring plate is matched with the arc-shaped hinge rod, and the surface of the arc-shaped hinge rod is subjected to polishing treatment, so that the friction force between the arc-shaped hinge rod and the latch ring plate can be reduced, and the phenomenon of blocking is avoided.
Furthermore, a sliding hole is drilled in the limiting plate, and the connecting hose penetrates through the sliding hole so as to facilitate movement of the limiting plate.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) this scheme can be through the cooperation of limiting plate and roof, play the effect of a centre gripping to the chip product, not only can play fixed effect to the chip product of different grade type like this, can also avoid the chip product to take place the skew and rock because of mechanical vibration, increase along with live time, when the limiting plate takes place the skew because of mechanical vibration, utilize the restoring force of spring to drive the push pedal, make it can continue to play the clamping action to the chip product, and set up through the cooperation of inflation knob and latch ring board, the range of rocking of chip product has effectively been reduced, in addition, appear not hard up because of mechanical vibration at the bolt, also can utilize the restoring force of spring, the pulling triggers the board, trigger bee calling organ's alarm, make the staff take corresponding processing, thereby improve the stability of chip product bonding.
(2) The inflation kickball includes the elastic ball, and fixedly connected with inserts a section of thick bamboo on the elastic ball lateral wall, and inserts a section of thick bamboo and peg graft inside the inserted bar, inserts the inside fixedly connected with montant of a section of thick bamboo, montant fixedly connected with horizontal pole, and the horizontal pole runs through the elastic ball setting, the pulling stay cord that can be better, the stability of reinforcing structure.
(3) The opposite ends of the two connecting rods are respectively hinged with the rotating plates, and the two rotating plates are fixedly connected with the elastic ball, so that the arc-shaped hinge rod can be conveniently unfolded.
(4) The limiting plate is internally provided with a cavity, the cavity is internally and slidably connected with a trigger plate, a stay cord is fixedly connected between the trigger plate and the cross rod, the cavity is positioned above the trigger plate and provided with a switch button, the side wall of the limiting plate is provided with a buzzer, the buzzer is electrically connected with the switch button, the alarm can be triggered, and a worker is prompted to perform corresponding treatment.
(5) The elastic ball is made of elastic materials, can expand the two arc-shaped hinge rods and can provide elastic force for the two arc-shaped hinge rods.
(6) Fixedly connected with spacing ring piece on the inserted bar, and spacing ring piece contacts with the arc hinge pole, can play spacing effect to the arc hinge pole to make the inflation kickball can only remove to a direction, thereby reduced chip product amplitude of rocking's purpose.
(7) The radian of the inner wall of the latch ring plate is matched with the arc-shaped hinge rod, and the surface of the arc-shaped hinge rod is subjected to polishing treatment, so that the friction force between the arc-shaped hinge rod and the latch ring plate can be reduced, and the phenomenon of blocking is avoided.
(8) A sliding hole is drilled in the limiting plate, and the connecting hose penetrates through the sliding hole so as to facilitate the movement of the limiting plate.
Drawings
FIG. 1 is a top view of the present invention;
FIG. 2 is a top view of the invention at a limiting plate;
FIG. 3 is a three-dimensional perspective view of the invention at a limiting plate;
FIG. 4 is a front sectional view of the invention at a limiting plate;
FIG. 5 is a schematic view of the structure of the present invention at the position of the insertion rod;
FIG. 6 is a schematic view of the structure at the location of the expansion dome of the present invention;
FIG. 7 is a diagram of a limiting plate of the present invention holding a chip product;
FIG. 8 is a diagram illustrating the position of the position limiting plate;
FIG. 9 is an enlarged view taken at A in FIG. 8;
FIG. 10 is a view of the position of the retainer plate when the bolt is loosened in accordance with the present invention;
fig. 11 is an enlarged view at B in fig. 10.
The reference numbers in the figures illustrate:
1 equipment base, 2 tooling base, 3 top plate, 4 pressing plate, 5 limiting plates, 51 moving slide hole, 52 bolt, 53 inserted rod, 54 pushing plate, 55 moving spring plate, 56 spring, 561 extrusion bag, 57 expanding top ball, 571 elastic ball, 572 inserted cylinder, 573 vertical rod, 574 horizontal rod, 58 arc-shaped hinge rod, 581 limiting ring block, 59 connecting rod, 510 rotating plate, 511 connecting hose, 512 latch ring plate, 513 pull rope, 514 trigger plate, 515 switch button, 516 buzzer and 6 chip product.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1-9, a novel gold wire bonding apparatus for integrated circuit chips comprises an apparatus base 1, a tooling base 2 fixedly connected to the upper side wall of the apparatus base 1, a top plate 3 slidably connected to the tooling base 2, a pressing plate 4 mounted on the tooling base 2 and located above the top plate 3, a chip product 6 placed on the tooling base 2, a limiting plate 5 slidably connected to both sides of the chip product 6 of the tooling base 2, two moving slide holes 51 drilled on the limiting plate 5, bolts 52 threadedly connected to the lower sides of the two limiting plates 5 of the tooling base 2 and arranged to penetrate the moving slide holes 51, an inserting rod 53 inserted into one side of the spring 56 of the limiting plate 5, a push plate 54 fixedly connected to one end of the inserting rod 53 close to the chip product 6, a moving spring plate 55 fixedly connected to the inside of the limiting plate 5 of the inserting rod 53, and a spring 56 fixedly connected between the inner wall of the limiting plate 5 and the moving spring plate 55, an extrusion bag 561 is arranged between the bolt 52 and the limiting plate 5, a connecting hose 511 is fixedly connected between the extrusion bag 561 and the inserted rod 53, an expansion top ball 57 is installed at one end of the inserted rod 53 far away from the push plate 54, two arc-shaped hinge rods 58 are hinged at one end of the inserted rod 53 close to the expansion top ball 57, a connecting rod 59 is fixedly connected to one side wall of each of the two arc-shaped hinge rods 58, a rotating plate 510 is connected to the opposite end of each of the two connecting rods 59, and a plurality of latch ring plates 512 are arranged around the expansion top ball 57 of the limiting plate 5, when installing the chip product 6, a certain pretightening force is applied to the chip product 6 by moving the two limiting plates 5 and the bolt 52 is rotated to fix the limiting plate 5, so that the chip product 6 can be limited, at the moment, the push plate 54 is in contact with the limiting plate 5, the spring 56 is also subjected to a pulling force, then the top plate 3 is moved, and the bolt on the pressing plate 4 is rotated, can utilize clamp plate 4 to play the fixed action to roof 3 to avoid the chip to move because of the vibration of machinery is irregular when carrying out the bonding, when screwing up bolt 52 and fixing limiting plate 5, bolt 52 extrudees extrusion bag 561, makes elastic ball 571 take place the inflation, thereby elastic ball 571 promotes two arc hinge bars 58 and expandes, and along with the lapse of live time, following two kinds of situations can appear: firstly, under the effect that the bolt 52 has a fixing effect on the limiting plates 5, the clamping pretightening force of the two limiting plates 5 on the chip product 6 is gradually reduced due to the mechanical vibration of the limiting plates 5, even the two limiting plates 5 are deviated due to the mechanical vibration, so that the chip product 6 is shaken between the two limiting plates 5, when the situation occurs, as shown in fig. 8-9, the moving spring plate 55 is pulled by the restoring force of the spring 56, so that the push plate 54 can continue to clamp the chip product 6, meanwhile, the expansion top ball 57 moves synchronously through the inserted link 53, the elastic ball 571 is made of elastic material, so that the arc-shaped hinge rod 58 presses the elastic ball 571 and moves to the second latch ring plate 512, thereby improving the stability of clamping the chip product 6 and preventing the chip product 6 from shaking to a large extent.
Referring to fig. 6-11, the expansion top ball 57 includes an elastic ball 571, a socket 572 is fixedly connected to a sidewall of the elastic ball 571, the socket 572 is inserted into the socket 53, a vertical rod 573 is fixedly connected to an interior of the socket 572, the vertical rod 573 is fixedly connected to a cross rod 574, and the cross rod 574 penetrates through the elastic ball 571, and as shown in fig. 10-11, when the bolt 52 is loosened due to mechanical vibration, the limiting plate 5 loses the fixation of the bolt 52, so that the limiting plate 5 does not have a clamping force on the chip product 6, and therefore, under the action of the spring 56, the whole limiting plate 5 moves reversely when pushing the chip product 6.
Referring to fig. 4, a cavity is drilled in the limiting plate 5, a trigger plate 514 is slidably connected in the cavity, a pull rope 513 is fixedly connected between the trigger plate 514 and the cross rod 574, a switch button 515 is installed above the trigger plate 514 in the cavity, a buzzer 516 is installed on the side wall of the limiting plate 5, and the buzzer 516 is electrically connected with the switch button 515, at this time, under the restoring force of the spring 56, the pull rope 513 is pulled by the cross rod 574, so that the trigger plate 514 moves upward, and the switch button 515 is pressed, so that the buzzer 516 gives an alarm to notify the worker that the bolt 52 is loosened, and the worker is prompted to take corresponding measures.
Referring to fig. 6, the opposite ends of the two connecting rods 59 are hinged to the rotating plates 510, and the two rotating plates 510 are fixedly connected to the elastic balls 571, so that the elastic balls 571 can expand to drive the two arc-shaped hinge rods 58 to unfold.
Referring to fig. 6, the insert rod 53 is fixedly connected with a limit ring block 581, the limit ring block 581 contacts with the arc-shaped hinge rod 58 and can limit the arc-shaped hinge rod 58, so that the expansion top ball 57 can only move in one direction, the shaking range of the chip product 6 is reduced, the radian of the inner wall of the latch ring plate 512 is matched with that of the arc-shaped hinge rod 58, and the surface of the arc-shaped hinge rod 58 is polished and polished, so that the friction force between the arc-shaped hinge rod 58 and the latch ring plate 512 can be reduced, and the phenomenon of blocking is avoided.
Referring to fig. 3-4, the limiting plate 5 is drilled with a sliding hole, and the connection hose 511 is disposed through the sliding hole to facilitate the movement of the limiting plate 5.
The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (10)
1. The utility model provides a novel integrated circuit chip gold wire bonding equipment, includes equipment base (1), its characterized in that: the equipment base (1) is fixedly connected with a tooling base (2) on the side wall, a top plate (3) is connected to the tooling base (2) in a sliding manner, a pressing plate (4) located on the top plate (3) is installed on the tooling base (2), chip products (6) are placed on the tooling base (2), limiting plates (5) are arranged on two sides of each chip product (6) in an equal sliding manner, two movable sliding holes (51) are drilled on the limiting plates (5), bolts (52) are connected to lower sides of the two limiting plates (5) in an equal threaded manner and penetrate through the movable sliding holes (51), inserting rods (53) are inserted into one sides of springs (56) of the limiting plates (5), and the inserting rods (53) are close to push plates (54) fixedly connected with one ends of the chip products (6), the inserted bar (53) is positioned inside the limit plate (5) and is fixedly connected with a movable spring plate (55), a spring (56) is fixedly connected between the inner wall of the limit plate (5) and the movable spring plate (55), an extrusion bag (561) is arranged between the bolt (52) and the limiting plate (5), a connecting hose (511) is fixedly connected between the extrusion bag (561) and the inserted rod (53), one end of the inserted link (53) far away from the push plate (54) is provided with an expansion top ball (57), one end of the inserted rod (53) close to the expansion top ball (57) is hinged with two arc-shaped hinged rods (58), one side wall of each of the two arc-shaped hinged rods (58) is fixedly connected with a connecting rod (59), one end of each of the two connecting rods (59) is connected with a rotating plate (510), and a plurality of latch ring plates (512) are arranged on the limiting plate (5) around the expansion top ball (57).
2. The apparatus of claim 1, wherein: the expansion top ball (57) comprises an elastic ball (571), an insertion tube (572) is fixedly connected to the side wall of the elastic ball (571), and the insertion tube (572) is inserted into the insertion rod (53).
3. The apparatus of claim 2, wherein: a vertical rod (573) is fixedly connected to the inside of the inserting barrel (572), a cross rod (574) is fixedly connected to the vertical rod (573), and the cross rod (574) penetrates through the elastic ball (571) to be arranged.
4. The apparatus of claim 1, wherein: the opposite ends of the two connecting rods (59) are respectively hinged with the rotating plates (510), and the two rotating plates (510) are fixedly connected with the elastic balls (571).
5. The apparatus of claim 1, wherein: limiting plate (5) inside division chisel has the cavity, and the inside sliding connection of cavity has trigger plate (514), fixedly connected with stay cord (513) between trigger plate (514) and horizontal pole (574), switch button (515) are installed to the cavity position above trigger plate (514).
6. The apparatus of claim 1, wherein: and a buzzer (516) is mounted on the side wall of the limiting plate (5), and the buzzer (516) is electrically connected with the switch button (515).
7. The apparatus of claim 4, wherein: the elastic ball (571) is made of elastic material.
8. The apparatus of claim 1, wherein: the insert rod (53) is fixedly connected with a limit ring block (581), and the limit ring block (581) is in contact with the arc-shaped hinge rod (58).
9. The apparatus of claim 1, wherein: the radian of the inner wall of the latch ring plate (512) is matched with that of the arc-shaped hinge rod (58), and the surface of the arc-shaped hinge rod (58) is polished.
10. The apparatus of claim 1, wherein: the limiting plate (5) is provided with a sliding hole, and the connecting hose (511) penetrates through the sliding hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210056735.0A CN114420577B (en) | 2022-01-18 | 2022-01-18 | Novel gold wire bonding equipment for integrated circuit chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210056735.0A CN114420577B (en) | 2022-01-18 | 2022-01-18 | Novel gold wire bonding equipment for integrated circuit chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114420577A true CN114420577A (en) | 2022-04-29 |
| CN114420577B CN114420577B (en) | 2022-12-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210056735.0A Active CN114420577B (en) | 2022-01-18 | 2022-01-18 | Novel gold wire bonding equipment for integrated circuit chip |
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| Country | Link |
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| CN (1) | CN114420577B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5579985A (en) * | 1993-07-26 | 1996-12-03 | Kabushiki Kaisha Shinkawa | Chip bonding method and apparatus |
| US20030086775A1 (en) * | 2001-11-08 | 2003-05-08 | Farhad Farassat | Mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machine |
| CN212461611U (en) * | 2020-05-25 | 2021-02-02 | 北京华芯微半导体有限公司 | Clamp for chip gold wire bonding |
| CN212859602U (en) * | 2020-05-21 | 2021-04-02 | 深圳市佰誉科技有限公司 | Cutting device is used in chip production |
| CN212887147U (en) * | 2020-05-28 | 2021-04-06 | 湖北嘉烜科技有限公司 | Clamping device for automatic lead bonding machine |
| CN113161271A (en) * | 2021-03-17 | 2021-07-23 | 刘光桐 | Can deposit strorage device for chip of different specifications |
-
2022
- 2022-01-18 CN CN202210056735.0A patent/CN114420577B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5579985A (en) * | 1993-07-26 | 1996-12-03 | Kabushiki Kaisha Shinkawa | Chip bonding method and apparatus |
| US20030086775A1 (en) * | 2001-11-08 | 2003-05-08 | Farhad Farassat | Mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machine |
| CN212859602U (en) * | 2020-05-21 | 2021-04-02 | 深圳市佰誉科技有限公司 | Cutting device is used in chip production |
| CN212461611U (en) * | 2020-05-25 | 2021-02-02 | 北京华芯微半导体有限公司 | Clamp for chip gold wire bonding |
| CN212887147U (en) * | 2020-05-28 | 2021-04-06 | 湖北嘉烜科技有限公司 | Clamping device for automatic lead bonding machine |
| CN113161271A (en) * | 2021-03-17 | 2021-07-23 | 刘光桐 | Can deposit strorage device for chip of different specifications |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114420577B (en) | 2022-12-30 |
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