CN114415856A - Touch control display device - Google Patents

Touch control display device Download PDF

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Publication number
CN114415856A
CN114415856A CN202210053783.4A CN202210053783A CN114415856A CN 114415856 A CN114415856 A CN 114415856A CN 202210053783 A CN202210053783 A CN 202210053783A CN 114415856 A CN114415856 A CN 114415856A
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CN
China
Prior art keywords
circuit board
chip
sub
flexible circuit
touch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210053783.4A
Other languages
Chinese (zh)
Inventor
曾国栋
高亮
李非凡
孙浩
黄小霞
杨虎飞
杨恩建
王彬
都阿娟
王洋
王永乐
曾乙伦
吴易谦
黄允晖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN202210053783.4A priority Critical patent/CN114415856A/en
Publication of CN114415856A publication Critical patent/CN114415856A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention relates to a touch display device, comprising: the display substrate, the touch-control base plate that is located the light-emitting side of display substrate, and the main circuit board that is located the backlight side of display substrate, the touch-control base plate includes touch-control district and along the first direction to be located the first district of binding of one side in touch-control district, the display substrate includes the display area corresponding with touch-control district to and along the first direction to be located the second of display area one side and bind the district, touch-control display device still includes: one end of the flexible circuit board is connected with the first binding region, and the other end of the flexible circuit board is bent to the backlight side of the display substrate and connected with the main circuit board; one end of the chip on film is connected with the second binding region, and the other end of the chip on film is bent to the backlight side of the display substrate and connected with the main circuit board; the chip on film comprises a plurality of sub chip on films, the flexible circuit board comprises a plurality of sub flexible circuit boards, and the plurality of sub chip on films and the plurality of sub flexible circuit boards are arranged at intervals in a staggered mode along a second direction perpendicular to the first direction.

Description

Touch control display device
Technical Field
The invention relates to the technical field of manufacturing of display products, in particular to a touch display device.
Background
Flexible OLED (organic light-Emitting Diode) is the mainstream technology of display products at present, and has been widely used in electronic products such as mobile phones and watches. However, currently, the OLED NB product usually uses an externally-mounted scheme, where the touch display device includes a display substrate and a touch substrate located on a light-emitting side of the display substrate, a bonding area of the display substrate is bonded with a chip on film COF, the bonding area of the touch substrate is bonded with a TFPC, the TFPC is connected to a side of the main circuit board away from the display substrate after being bent, and the TFPC is located outside the chip on film, so as to avoid interference, the bending radius of the TFPC is large, a lower frame of the externally-mounted product is large, and compared with an lcd (liquid Crystal display) product, the screen has an unobvious advantage and insufficient competitiveness.
Disclosure of Invention
In order to solve the technical problem, the invention provides a touch display device which solves the problem that a lower frame of a flexible OLED is large.
In order to achieve the purpose, the embodiment of the invention adopts the technical scheme that: a touch display device, comprising: the display device comprises a display substrate, a touch substrate positioned on the light emergent side of the display substrate and a main circuit board positioned on the backlight side of the display substrate, wherein the touch substrate comprises a touch area and a first binding area positioned on one side of the touch area along a first direction, the display substrate comprises a display area corresponding to the touch area and a second binding area positioned on one side of the display area along the first direction,
the touch display device further includes:
one end of the flexible circuit board is connected with the first binding region, and the other end of the flexible circuit board is bent to the backlight side of the display substrate and is connected with the main circuit board;
one end of the chip on film is connected with the second binding region, and the other end of the chip on film is bent to the backlight side of the display substrate and is connected with the main circuit board;
the chip on film comprises a plurality of sub chip on films, the flexible circuit board comprises a plurality of sub flexible circuit boards, and the plurality of sub chip on films and the plurality of sub flexible circuit boards are arranged at intervals in a staggered mode along a second direction perpendicular to the first direction.
Optionally, the distance between the sub flip chip film and the sub flexible circuit board adjacent to the sub flip chip film is greater than 10 mm.
Optionally, an avoiding concave portion is arranged on one side of the sub flip chip film, which is close to the sub flexible circuit board adjacent to the sub flip chip film.
Optionally, the other end of the flexible circuit board is connected to the first surface of the main circuit board close to the display substrate.
Optionally, the other end of the flexible circuit board is connected to the side surface of the main circuit board.
Optionally, the other end of the flip chip is connected to the side surface of the main circuit board.
Optionally, the other end of the flip-chip film is connected to the second surface of the main circuit board, which is far away from the display substrate.
Optionally, the other end of the flip-chip film is connected to the first surface of the main circuit board close to the display substrate.
Optionally, the other end of the flexible circuit board is connected to the side surface of the main circuit board, and the other end of the flexible circuit board is connected to one end of the side surface close to the display substrate;
the flip chip film is connected to the side face of the main circuit board, and the other end of the flip chip film is connected to one end, close to the display substrate, of the side face.
Optionally, the flexible circuit board is connected to the first binding region of the touch substrate through a connector, and the flexible circuit board is connected to the main circuit board through a connector.
The invention has the beneficial effects that: the width of the lower frame is reduced by changing the connecting position of the TFPC and the PCB.
Drawings
Fig. 1 is a schematic structural diagram of a touch display device in the related art;
fig. 2 is a schematic structural diagram of a touch display device according to an embodiment of the invention;
FIG. 3 is a schematic structural diagram of a touch display device according to an embodiment of the invention;
FIG. 4 is a schematic structural diagram of a touch display device according to an embodiment of the invention;
fig. 5 is a schematic structural diagram of a touch display device according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the related art, a stacking structure of a touch display device is shown in fig. 1, one end of a flip-chip film 2 is bound and connected to a binding region of a display substrate 10, the other end of the flip-chip film 2 is connected to a main circuit board 30 after being bent, one end of a TFPC (flexible circuit board 1) is connected to a touch sensor, the other end of the TFPC is connected to the main circuit board 30 after being bent, and the TFPC is connected to one side of the main circuit board 30 away from the display substrate 10, the TFPC is located outside the flip-chip film 2, and a width of an outer frame of the touch display device is 7,7 is 1+2+3+4+5+6, wherein 1 represents a distance (Panel border) from an AA (display region of the display substrate 10) to a Panel edge, 2 represents a glue width (UV glue applied between the flip-chip film 2 and the display substrate 10 for preventing water and oxygen invasion), 3 represents a bonding radius of the flip-chip film (flip-chip film 2), and 4 represents a thickness of the COF 2, 5 represents the thickness of the TFPC, 6 represents the binding radius of the TFPC, the lower frame of an externally-hung product is larger, and compared with an LCD (liquid Crystal display) product, the externally-hung product has unobvious screen ratio advantages and insufficient competitiveness; after the TFPC is connected to the PCB (main circuit board 30), the TFPC is prone to fall off due to bending tension, which causes signal transmission problem and finally affects normal use of the product.
Referring to fig. 2 to 4, in order to solve the above problem, the present embodiment provides a touch display device, including: a display substrate 10, a touch substrate 20 located at a light-emitting side of the display substrate 10, and a main circuit board 30 located at a backlight side of the display substrate 10, wherein the touch substrate 20 includes a touch region and a first binding region located at one side of the touch region along a first direction (refer to an X direction in fig. 2), the display substrate 10 includes a display region corresponding to the touch region, and a second binding region located at one side of the display region along the first direction,
the touch display device further includes:
one end of the flexible circuit board 1 is connected with the first binding region, and the other end of the flexible circuit board 1 is bent to the backlight side of the display substrate 10 and connected with the main circuit board 30;
one end of the chip on film 2 is connected with the second binding region, and the other end of the chip on film 2 is bent to the backlight side of the display substrate 10 and connected with the main circuit board 30;
the chip on film 2 includes a plurality of sub chip on films 201, the flexible printed circuit board 1 includes a plurality of sub flexible printed circuit boards 101, and the plurality of sub chip on films 201 and the plurality of sub flexible printed circuit boards 101 are arranged alternately and alternately along a second direction perpendicular to the first direction.
In the related art, the flexible circuit board 1 connected to the touch substrate 20 is located outside the flip-chip film 2 connected to the display substrate 10 after being bent, that is, the flexible circuit board 1 and the flip-chip film 2 are stacked, so that the arrangement of the flip-chip film 2 limits the bending radius of the flexible circuit board 1, thereby increasing the width of the lower frame of the touch display device, in this embodiment, the flip-chip film 2 is divided into a plurality of sub flip-chip films 201, the flexible circuit board 1 is divided into a plurality of sub flexible circuit boards 101, and the plurality of sub flip-chip films 201 and the plurality of sub flexible circuit boards 101 are spaced and staggered, so as to break the limitation of the flip-chip film 2 on the flexible circuit board 1, the width of the lower frame is Max (1+2+3+4, 1+2+5+6), referring to fig. 2, that the bending area of the flexible circuit board 1 and the bending area of the flip-chip film 2 are no longer stacked in the first direction, the bending radius of the flexible circuit board 1 is no longer limited by the bending radius of the chip on film 2, and according to actual needs (such as circuit distribution), the bending radius of the chip on film 2 can be larger than the bending radius of the flexible circuit board 1, at the moment, the width of the lower frame of the touch display device is 1+2+3+4, the bending radius of the chip on film 2 can be smaller than the bending radius of the flexible circuit board 1, and at the moment, the width of the lower frame of the touch display device is 1+2+5+ 6. Compared with fig. 1, the width of the lower frame of the touch display device in the related art is 7, which includes the bending radius of the flip chip 2 and the radius of the flexible circuit board 1, but by adopting the above-mentioned scheme in this embodiment, the width of the lower frame only includes the bending radius of the flip chip 2 or the bending radius of the flexible circuit board 1, which is obvious, compared with the related art, in which the flexible circuit board 1 connected to the touch substrate 20 is located in the arrangement manner that the flip chip 2 connected to the display substrate 10 is stacked on the flip chip 2, the limitation of the flip chip 2 on the flexible circuit board 1 can be broken, the bending radius of the flexible circuit board 1 is reduced, and thus the width of the lower frame of the touch display device is reduced.
It should be noted that, in the related art, due to the limitation of the relative position relationship between the flip chip 2 and the flexible circuit board 1, along the first direction, the initial bending point (the first bending start point 11) of the flexible circuit board 1 is located on the side of the initial bending point (the second bending start point 21) of the flip chip 2 away from the first binding region, so that the flexible circuit board 1 has a larger bending radius to avoid interference between the flexible circuit board 1 and the flip chip 2 after bending, and by adopting the above technical solution of this embodiment, the initial bending point of the flexible circuit board 1 can be moved towards the direction close to the first binding region, for example, the initial bending point of the flexible circuit board 1 is flush with the initial bending point of the flip chip 2, even, the initial bending point of the flexible circuit board 1 can be located on the side of the initial bending point of the flip chip 2 close to the first binding region, therefore, the bending radius of the flexible circuit board 1 is reduced, and the width of the lower frame of the touch display device is reduced.
In this embodiment, the distance between the sub flip-chip film 201 and the sub flexible printed circuit board 101 adjacent to the sub flip-chip film is greater than 10 mm.
The gap between the sub chip on film 201 and the sub flexible circuit board 101 adjacent to the sub chip on film is ensured, and the interference between the chip on film 2 and the sub flexible circuit board 101 is avoided.
In this embodiment, as an example, an avoiding concave portion is disposed on one side of the sub flip-chip film 201 close to the sub flexible printed circuit board 101 adjacent thereto.
When the length of the main circuit board 30 along the first direction is short, and the number of the sub flexible circuit boards 101 and the number of the sub flip-chip films 201 are large, so that the distance between the adjacent sub flip-chip films 201 and the sub flexible circuit boards 101 is small, the shapes of the sub flip-chip films 201 need to be arranged in an avoiding manner, so as to prevent the adjacent sub flip-chip films 201 and the sub flexible circuit boards 101 from interfering, referring to fig. 5.
It should be noted that, in order to avoid interference between the adjacent sub flip chip films 201 and the sub flexible printed circuit board 101, an avoiding structure may be provided on the corresponding sub flip chip films 201, or an avoiding structure may be provided on the corresponding sub flexible printed circuit board 101, however, there are many wirings on the sub flexible printed circuit board 101, and in order to avoid influencing the wirings on the sub flexible printed circuit board 101, it is preferable in this embodiment to provide an avoiding structure (for example, the arrangement of the avoiding concave portion) on the corresponding sub flip chip films 201.
It should be noted that the flip chip includes a first region for connecting with the display substrate, a bending region and a second region for connecting with the main circuit board, the avoidance concave portion is disposed in the bending region of the flip chip and/or the second region, when the flip chip is in the flat state, the length of the avoidance concave portion in the first direction is less than or equal to K, referring to fig. 5, when the length of the avoidance concave portion in the first direction is equal to K, one end of the avoidance concave portion starts from a bending starting point (second bending starting point 21) of the flip chip, and the other end of the avoidance concave portion coincides with one end of the flip chip, which is far away from the display substrate.
By adopting the above-mentioned scheme of this embodiment, the connection position of the flexible circuit board 1 to the main circuit board 30 is more flexible, that is, the arrangement of the bending radius and the like of the flexible circuit board 1 is not limited by the flip chip film 2.
Referring to fig. 2, in the present embodiment, the other end of the flexible circuit board 1 is connected to the first surface of the main circuit board 30 close to the display substrate 10.
With respect to fig. 1, the flexible circuit board 1 is reversely connected to the main circuit board 30, that is, a window is opened on the first surface of the main circuit board 30 close to the display substrate 10, and a window is opened on the first end of the front surface (the surface connected to the display substrate 10 is the back surface, and the other surface opposite to the back surface is the front surface) of the flexible circuit board 1 away from the display substrate 10, so that the problem that the main circuit board 30 is separated from the flexible circuit board 1 due to bending tension is avoided.
Referring to fig. 3, in the present embodiment, the other end of the flexible wiring board 1 is connected to the side surface of the main circuit board 30.
The main circuit board 30 is connected with the display substrate 10 through an adhesive 40, when the adhesive 40 is thinner, the flexible circuit board 1 cannot be connected to the first surface of the main circuit board 30, that is, the flexible circuit board 1 cannot be located between the display substrate 10 and the main circuit board 30 after being bent, and at this time, the other end of the flexible circuit board 1 can be connected to the side surface of the main circuit board 30.
Referring to fig. 2 and 3, in the present embodiment, the other end of the flip-chip film 2 is connected to the side of the main circuit board 30.
In this embodiment, the other end of the flip-chip film 2 is connected to the second surface of the main circuit board 30 away from the display substrate 10.
In this embodiment, the other end of the flip-chip film 2 is connected to the first surface of the main circuit board 30 close to the display substrate 10.
Referring to fig. 3, in the present embodiment, for example, the other end of the flexible wiring board 1 is connected to the side surface of the main circuit board 30, and the other end of the flexible wiring board 1 is connected to one end of the side surface close to the display substrate 10;
the flip chip film 2 is connected to the side surface of the main circuit board 30, and the other end of the flip chip film 2 is connected to one end of the side surface close to the display substrate 10.
The flexible circuit board 1 is divided into a plurality of sub-flexible circuit boards 101, the chip on film 2 is divided into a plurality of sub-chip on films 201, then the plurality of sub-flexible circuit boards 101 and the plurality of sub-chip on films 201 are arranged in a spaced and staggered manner, the limitation of the mutual position relation between the chip on film 2 and the flexible circuit board 1 is broken, the connection position of the flexible circuit board 1 and the main circuit board 30 is more flexible, the connection position of the chip on film 2 and the main circuit board 30 is also more flexible, by adopting the scheme, the other end of the flexible circuit board 1 is connected to one end of the side surface close to the display substrate 10, the bending radius of the flexible circuit board 1 is reduced, the chip on film 2 is connected to the side surface of the main circuit board 30, the other end of the chip on film 2 is connected to one end of the side surface close to the display substrate 10, and the bending radius of the chip on film 2 is reduced, and the width of a lower frame of the touch display device is reduced.
Referring to fig. 3, the other end of the flexible printed circuit board 1 is connected to the side surface of the main printed circuit board 30, the flexible printed circuit board 1 is connected to a first position on the side surface of the main printed circuit board 30, the flip-chip 2 is connected to the side surface of the main printed circuit board 30, the first position corresponds to a plurality of sub flexible printed circuit boards 101 including a plurality of first sub-positions, the second position corresponds to a plurality of sub flip-chips 201 including a plurality of second sub-positions, and in the first direction, the plurality of first sub-positions and the plurality of second sub-positions are spaced and staggered.
In the thickness direction of the main circuit board 30 (i.e. in the light emitting direction of the display substrate 10), the first position and the second position are layered (i.e. the distance between the first position and the display substrate 10 is different from the distance between the second position and the display substrate 10), and in the first direction, the first sub-position is located between two adjacent second sub-positions, so as to avoid interference between the chip on film 2 and the flexible circuit board 1.
In this embodiment, for example, the flexible circuit board 1 is connected to the first bonding region of the touch substrate 20 through a connector, and the flexible circuit board 1 is connected to the main circuit board 30 through a connector.
In this embodiment, for example, the chip on film 2 is bound and connected to the display substrate 10 through a conductive adhesive, and the chip on film 2 is bound and connected to the main circuit board 30 through a conductive adhesive.
In this embodiment, for example, one end of the flexible printed circuit board 1 connected to the touch display substrate 10 is covered with a cover film to protect the connection between the flexible printed circuit board 1 and the touch display substrate 10.
In this embodiment, a CPI (transparent polyimide) layer 60 is disposed on a side of the touch substrate 20 away from the display substrate 10.
In this embodiment, an UV glue blocking layer is exemplarily disposed between the flip chip film 2 and the display substrate 10 to prevent water and oxygen from invading.
In this embodiment, the backlight side of the display substrate 10 is provided with a heat dissipation structure 50, and the main circuit board 30 is located on a side of the heat dissipation structure 50 away from the display substrate 10.
The following points need to be explained:
(1) the drawings of the embodiments of the disclosure only relate to the structures related to the embodiments of the disclosure, and other structures can refer to the common design.
(2) For purposes of clarity, the thickness of layers or regions in the figures used to describe embodiments of the present disclosure are exaggerated or reduced, i.e., the figures are not drawn on a true scale. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
(3) Without conflict, embodiments of the present disclosure and features of the embodiments may be combined with each other to arrive at new embodiments.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims (10)

1. A touch display device, comprising: the display substrate comprises a touch control area and a first binding area which is positioned at one side of the touch control area along a first direction, the display substrate comprises a display area corresponding to the touch control area and a second binding area which is positioned at one side of the display area along the first direction, and the display substrate is characterized in that,
the touch display device further includes:
one end of the flexible circuit board is connected with the first binding region, and the other end of the flexible circuit board is bent to the backlight side of the display substrate and is connected with the main circuit board;
one end of the chip on film is connected with the second binding region, and the other end of the chip on film is bent to the backlight side of the display substrate and is connected with the main circuit board;
the chip on film comprises a plurality of sub chip on films, the flexible circuit board comprises a plurality of sub flexible circuit boards, and the plurality of sub chip on films and the plurality of sub flexible circuit boards are arranged at intervals in a staggered mode along a second direction perpendicular to the first direction.
2. The touch display device of claim 1, wherein a distance between the sub flip-chip film and the sub flexible circuit board adjacent to the sub flip-chip film is greater than 10 mm.
3. The touch display device of claim 1, wherein an avoiding recess is formed on one side of the sub flip-chip film, which is close to the sub flexible circuit board adjacent to the sub flip-chip film.
4. The touch display device of claim 1, wherein the other end of the flexible circuit board is connected to the first surface of the main circuit board close to the display substrate.
5. The touch display device according to claim 1, wherein the other end of the flexible wiring board is connected to a side surface of the main wiring board.
6. The touch display device of claim 1, 4 or 5, wherein the other end of the flip-chip film is connected to the side of the main circuit board.
7. The touch display device of claim 1, 4 or 5, wherein the other end of the flip-chip film is connected to the second surface of the main circuit board away from the display substrate.
8. The touch display device of claim 1, 4 or 5, wherein the other end of the flip-chip film is connected to the first surface of the main circuit board close to the display substrate.
9. The touch display device according to claim 1, wherein the other end of the flexible wiring board is connected to a side surface of the main circuit board, and the other end of the flexible wiring board is connected to an end of the side surface close to the display substrate;
the flip chip film is connected to the side face of the main circuit board, and the other end of the flip chip film is connected to one end, close to the display substrate, of the side face.
10. The touch display device of claim 1, wherein the flexible circuit board is connected to the first bonding area of the touch substrate via a connector, and the flexible circuit board is connected to the main circuit board via a connector.
CN202210053783.4A 2022-01-18 2022-01-18 Touch control display device Pending CN114415856A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210053783.4A CN114415856A (en) 2022-01-18 2022-01-18 Touch control display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210053783.4A CN114415856A (en) 2022-01-18 2022-01-18 Touch control display device

Publications (1)

Publication Number Publication Date
CN114415856A true CN114415856A (en) 2022-04-29

Family

ID=81272848

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210053783.4A Pending CN114415856A (en) 2022-01-18 2022-01-18 Touch control display device

Country Status (1)

Country Link
CN (1) CN114415856A (en)

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