CN114414035A - Piezoelectric sensor calibration device and method and vibration sensor - Google Patents
Piezoelectric sensor calibration device and method and vibration sensor Download PDFInfo
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Abstract
The embodiment of the application discloses piezoelectric sensor calibration device, method and vibration sensor, wherein the vibration sensor comprises: a housing; one end of the cantilever beam is fixed with the side wall of the shell, a first piezoelectric material layer and a second piezoelectric material layer are respectively attached to a first surface and a second surface of the cantilever beam, which are opposite to each other, and the first piezoelectric material layer and the second piezoelectric material layer are connected in parallel or in series; the mass block is fixed with the other end of the cantilever beam; the first induction coil is connected with the top of the shell and used for adsorbing the mass block when the shell is electrified so as to enable the cantilever beam to bend towards the direction of the first induction coil; the second induction coil is connected with the bottom of the shell and used for adsorbing the mass block when the shell is electrified so as to enable the cantilever beam to bend towards the direction of the second induction coil; and the signal output circuit is used for being connected with the piezoelectric material layer so as to output an electric signal generated by the piezoelectric material layer along with the bending of the cantilever beam. The vibration sensor of the embodiment of the application is convenient to calibrate, and the on-site self-calibration of the vibration sensor can be realized.
Description
Technical Field
The application relates to the technical field of piezoelectric material layers, in particular to a piezoelectric sensor calibration device and method and a vibration sensor.
Background
The statements in this application as background to the related art related to this application are merely provided to illustrate and facilitate an understanding of the contents of the present application and are not to be construed as an admission that the applicant expressly or putatively admitted the prior art of the filing date of the present application at the first filing date.
Piezoelectric sensors are widely used as dynamic strain sensors, and are widely used in medical sensors, vibration sensors and the like, taking piezoelectric films as an example. Piezoelectric sensors generally require calibration. If the piezoelectric thin film material has creep characteristics, the performance parameters of the sensor can change along with time and temperature, so that the calibration of the piezoelectric material layer sensor is needed.
In the past, the calibration method is mainly used for calibrating the test object in a laboratory by utilizing a Hopkinson bar, the test method is precise, and the test method is difficult to realize by ordinary non-technical personnel and cannot be used for calibrating the test object on site. On-line self-calibration cannot be realized for the vibration sensor in a use state.
Disclosure of Invention
The embodiment of the application provides a piezoelectric sensor calibration device and method and a vibration sensor, which can conveniently calibrate the vibration sensor.
In a first aspect, an embodiment of the present application provides a vibration sensor, including:
a housing;
the cantilever beam is provided with a first surface and a second surface which are opposite, the first surface faces the top surface of the shell, the second surface faces the bottom surface of the shell, a first piezoelectric material layer is attached to the first surface, a second piezoelectric material layer is attached to the second surface, and the first piezoelectric material layer and the second piezoelectric material layer are connected in parallel or in series;
the mass block is fixed with the other end of the cantilever beam;
the first induction coil is connected with the top of the shell and used for adsorbing the mass block when the shell is electrified so as to enable the cantilever beam to bend towards the direction of the first induction coil;
the second induction coil is connected with the bottom of the shell and used for adsorbing the mass block when the shell is electrified so as to enable the cantilever beam to bend towards the direction of the second induction coil;
and the signal output circuit is used for being connected with the first piezoelectric material layer and the second piezoelectric material layer which are connected in parallel or in series so as to output an electric signal generated by the first piezoelectric material layer and the second piezoelectric material layer which are connected in parallel or in series along with the bending of the cantilever beam.
In an optional embodiment, the cantilever beam is a beryllium bronze sheet.
In an alternative embodiment, the signal output circuit includes a charge amplifier, and the charge amplifier is used for converting the charges generated by the first piezoelectric material layer and the second piezoelectric material layer which are connected in parallel or in series along with the bending of the cantilever beam into a voltage signal to be output.
In a second aspect, an embodiment of the present application provides a calibration method for a vibration sensor according to any one of the foregoing embodiments, where the method includes:
absorbing the mass block to the first induction coil and then releasing the mass block, so that the released mass block drives the cantilever beam to generate first vibration;
acquiring a first voltage signal, wherein the first voltage signal is generated by the piezoelectric material layer based on the first vibration;
absorbing the mass block to the second induction coil and then releasing the mass block, so that the released mass block drives the cantilever beam to generate second vibration;
acquiring a second voltage signal, wherein the second voltage signal is generated by the piezoelectric material layer based on the second vibration;
acquiring a first peak voltage amplitude, a first valley voltage amplitude and a period according to one period of a waveform formed by the first voltage signal, wherein the first peak voltage amplitude and the first valley voltage amplitude are respectively the peak voltage amplitude and the valley voltage amplitude of the one period of the waveform formed by the first voltage signal;
acquiring a second peak voltage amplitude and a second valley voltage amplitude according to a cycle of a waveform formed by the second voltage signal, wherein the second peak voltage amplitude and the second valley voltage amplitude are respectively the peak voltage amplitude and the valley voltage amplitude of the cycle of the waveform formed by the second voltage signal;
and obtaining parameters of the vibration sensor according to the first peak voltage amplitude, the first valley voltage amplitude, the period, the second peak voltage amplitude and the second valley voltage amplitude.
In an alternative embodiment, the first peak voltage amplitude is a voltage value of a second peak of a waveform formed by the first voltage signal, and the first valley voltage amplitude is a voltage value of a first valley of the waveform formed by the first voltage signal;
the second peak voltage amplitude is a voltage value of a first peak of a waveform formed by the second voltage signal, and the second valley voltage amplitude is a voltage value of a second valley of the waveform formed by the second voltage signal.
In an alternative embodiment, obtaining the parameter of the vibration sensor comprises:
obtaining a damping ratio D (dimensionless) according to the first peak voltage amplitude and the first valley voltage amplitude; the damping ratio D is obtained by the following formula,
in the formula u1Is the first valley voltage amplitude (unit: V), u2Is the first peak voltage amplitude (unit: V).
In an optional embodiment, obtaining the parameter of the vibration sensor further includes:
obtaining the natural frequency omega according to the first peak voltage amplitude, the first valley voltage amplitude and the period0(unit: rad/s), the natural frequency ω0Is obtained by the following formula,
in the formula u1Is the first valley voltage amplitude, u2Is a first peak voltage amplitude, T is a firstIn an alternative embodiment, where the time interval (unit: s) between the trough and the first peak is from, obtaining the parameter of the vibration sensor further comprises:
obtaining sensitivity according to the damping ratio, the first peak voltage amplitude, the second peak voltage amplitude and the sum of the distances from the mass block to the first induction coil and the second induction coil; the sensitivity K is obtained by the following formula,
in the formula u1Is the first valley voltage amplitude, u1' is the second peak voltage amplitude, D is the damping ratio, and D is the sum of the distances (unit: m) from the mass to the first and second induction coils.
In a third aspect, an embodiment of the present application provides a piezoelectric sensor calibration apparatus, including:
a frame body;
one end of the cantilever beam is fixed with the frame body, the cantilever beam is provided with a first surface and a second surface which are opposite, and the first surface and the second surface provide attachment surfaces of the piezoelectric material layer to be calibrated;
the mass block is fixed with the other end of the cantilever beam;
the first induction coil is connected with the frame body, is positioned on one side of the first surface and is used for adsorbing the mass block when being electrified so as to enable the cantilever beam to bend towards the direction of the first induction coil;
the second induction coil is connected with the frame body, is positioned on one side of the second surface and is used for adsorbing the mass block when being electrified so as to enable the cantilever beam to bend towards the direction of the second induction coil;
and the signal output circuit is used for being connected with the piezoelectric material layer to be calibrated so as to output an electric signal generated by the piezoelectric material layer to be calibrated along with the bending of the cantilever beam.
In an optional embodiment, the apparatus further comprises:
and the data processing module is electrically connected with the signal output circuit and is used for processing the electric signals of the signal output circuit.
In a fourth aspect, an embodiment of the present application provides a piezoelectric sensor calibration method, where the method is implemented by using the apparatus according to any of the foregoing embodiments
The embodiment of the application provides a vibration sensor, enough adsorb the quality piece behind first induction coil or the second induction coil circular telegram ability, make the quality piece to first induction coil or the removal of second induction coil, thereby make the cantilever beam crooked, release the quality piece after first induction coil or the outage of second induction coil, the quality piece drives the cantilever beam vibration, first piezoelectric material layer and second piezoelectric material layer change along with the electric charge that the vibration produced, based on this, can obtain vibration sensor's relevant parameter, can realize demarcating its online at vibration sensor user state. The scheme is simple and practical.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 shows a schematic structural diagram of a vibration sensor of an embodiment of the present application;
FIG. 2 is a model schematic of a cantilever beam of the vibration sensor.
Fig. 3 is a schematic diagram showing a schematic configuration of a signal output circuit of the vibration sensor according to the embodiment of the present application;
fig. 4 is a schematic diagram of two piezoelectric material layers connected in parallel.
Fig. 5 is a schematic diagram of a mechanical model of a vibration sensor.
FIG. 6 is a schematic diagram of a strain profile of a cantilevered beam.
Fig. 7 is a waveform diagram of the first voltage signal output by the signal output circuit.
Fig. 8 is a waveform diagram of the second voltage signal output by the signal output circuit.
Description of reference numerals:
1-a shell; 2-cantilever beam; 3-a mass block; 4-a first induction coil; 5-a second induction coil; 6-a first piezoelectric material layer; 7-second piezoelectric material layer 7.
Detailed Description
In order to make the technical solutions in the embodiments of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
As shown in fig. 1, the present embodiment provides a vibration sensor including a housing 1, a cantilever beam 2, a mass 3, an induction coil, a piezoelectric material layer, and a signal output circuit.
One end of the cantilever beam 2 is fixed with the side wall of the shell 1, and the cantilever beam 2 has a first surface and a second surface which are opposite, wherein the first surface faces to the top surface of the shell 1, and the second surface faces to the bottom surface of the shell 1. The piezoelectric material layer comprises a first piezoelectric material layer 6 and a second piezoelectric material layer 7, the first piezoelectric material layer 6 is attached to the first surface of the cantilever beam 2, and the second piezoelectric material layer 7 is attached to the second surface of the cantilever beam 2. The first piezoelectric material layer 6 and the second piezoelectric material layer 7 may be connected in parallel or in series.
The mass block 3 is fixed with the other end of the cantilever beam 2. The one end that cantilever beam 2 and quality piece 3 are connected is the free end, and quality piece 3 can drive cantilever beam 2 vibration.
The induction coil is connected with the shell 1, and the induction coil is used for adsorbing the mass block 3 when being electrified, and releases the mass block 3 when being powered off, thereby causing vibration. The induction coil includes a first induction coil 4 and a second induction coil 5. The first induction coil 4 is connected with the top of the shell 1 and is used for absorbing the mass block 3 when being electrified, so that the cantilever beam 2 bends towards the first induction coil 4. The second induction coil 5 is connected with the bottom of the shell 1 and used for absorbing the mass block 3 when being electrified, so that the cantilever beam 2 bends towards the direction of the second induction coil 5.
The signal output circuit is used for being connected with the first piezoelectric material layer 6 and the second piezoelectric material layer 7 which are connected in series or in parallel so as to output an electric signal generated by the first piezoelectric material layer and the second piezoelectric material layer which are connected in series or in parallel along with the bending of the cantilever beam 2.
The embodiment of the application provides a vibration sensor, enough adsorb mass block 3 behind first induction coil 4 or the 5 circular telegrams of second induction coil, make mass block 3 to first induction coil 4 or the 5 removal of second induction coil, thereby make cantilever beam 2 crooked, release mass block 3 behind first induction coil 4 or the 5 outage of second induction coil, mass block 3 drives cantilever beam 2 vibration, first piezoelectric material layer 6 and second piezoelectric material layer 7 change along with the electric charge that the vibration produced, based on this, can obtain vibration sensor's relevant parameter, can realize demarcating its online at vibration sensor user state. The scheme is simple and practical.
In the embodiment of the present application, the specific material of the cantilever beam 2 is not limited as long as the performance parameters thereof meet the requirements of the vibration sensor. In the exemplary embodiment, the cantilever beam 2 is a beryllium bronze sheet. The beryllium bronze sheet has high hardness, elastic limit, fatigue limit and wear resistance, and also has good corrosion resistance, thermal conductivity and electrical conductivity, so that the vibration sensor has good performance and long service life.
The piezoelectric material layer in the embodiments of the present application may be made of any suitable sensitive functional material capable of generating a piezoelectric effect. In an exemplary embodiment, the piezoelectric material layer may be a piezoelectric film, a piezoelectric ceramic, or the like. Taking a piezoelectric film as an example, the first piezoelectric material layer 6 and the second piezoelectric material layer 7 in the embodiment of the present application are a first piezoelectric film and a second piezoelectric film, respectively.
Referring to fig. 3, in some embodiments, the signal output circuit includes a charge amplifier for converting the charge generated by the first piezoelectric material layer 6 and the second piezoelectric material layer 7 as the cantilever beam 2 bends into a voltage signal output.
In some embodiments, the vibration sensor of the embodiments of the present application further includes a data processing module, where the data processing module is electrically connected to the signal output circuit and is configured to process an electrical signal of the signal output circuit. The data processing module processes the electric signals to obtain the relevant parameters of the vibration sensor, so that the calibration of the vibration sensor is realized.
The data processing module may have a computationally powerful computer module. Specifically, the mobile phone can be a tablet computer, a notebook computer, a mobile phone, a single chip microcomputer and the like. The data processing module and the signal output circuit can be in wired connection or wireless connection. The connection mode for realizing data transmission between the data processing module and the signal output circuit is not limited. The data processing module can be integrated in the housing 1 or can be a relatively separate component which is connected to the signal output circuit if necessary.
In some embodiments, the vibration sensor in the embodiments of the present application further includes a display module, the display module is connected to the data processing module, and the display module is configured to display a processing result of the data processing module. For example, the parameters of the vibration sensor are displayed on a display module. The display module may be any display. The display module may be integrated in the housing 1, or may be a relatively separate component, or may be integrated with the data processing module. For example, the host of the notebook computer can be used as the data processing module, and the display screen of the notebook computer can be used as the display module.
The vibration sensor of the embodiment of the application further comprises a power supply, and the power supply is used for supplying power to the power utilization component of the vibration sensor. For example, the power source is connected to the first induction coil 4 and the second induction coil 5, and is used for supplying power to the first induction coil 4 or the second induction coil 5, so that the first induction coil 4 or the second induction coil 5 adsorbs the mass block 3. The power supply can also be connected with the data processing module and used for supplying power to the data processing module.
The embodiments of the present application provide a calibration method for a vibration sensor according to any of the above embodiments, and the following embodiments of the method may be used to further understand the vibration sensor according to the above embodiments, and the above embodiments of the vibration sensor may be used to understand the calibration method according to the embodiments of the present application. The calibration method of the vibration sensor in the embodiment of the application comprises the following steps:
and absorbing the mass block 3 to the first induction coil 4 and then releasing, so that the released mass block 3 drives the cantilever beam 2 to generate first vibration. For example, the mass block 3 is absorbed by the first induction coil 4, and after the cantilever beam 2 is bent, the power supply is cut off, so that the released mass block 3 drives the cantilever beam 2 to vibrate.
A first voltage signal is obtained, and the first voltage signal is generated based on first vibration of the piezoelectric material layer. In the vibration process, the piezoelectric material layer bends along with the cantilever beam 2, the piezoelectric material layer generates charges, the output charge data can be called as first charge data, and a first voltage signal can be obtained according to the first charge data output by the piezoelectric material layer.
The first voltage signal may be obtained by converting the first charge data, and in an implementation, the signal output circuit may convert the first charge data into the first voltage signal.
And obtaining parameters of the vibration sensor according to the first voltage signal. For example, damping ratio D and natural frequency ω0。
Of course, the mass block 3 may be adsorbed to the second induction coil 5 and then released, so that the released mass block 3 drives the cantilever 2 to generate the second vibration. For example, the mass block 3 is absorbed by the second induction coil 5, and after the cantilever beam 2 is bent, the power supply is cut off, so that the released mass block 3 drives the cantilever beam 2 to vibrate.
And acquiring a second voltage signal, wherein the second voltage signal is generated by the piezoelectric material layer based on the second vibration. In the vibration process, the piezoelectric material layer bends along with the cantilever beam 2, the piezoelectric material layer generates charges, the output charge data can be called as second charge data, and a second voltage signal can be obtained according to the second charge data output by the piezoelectric material layer.
The second voltage signal may be obtained by converting the second charge data, and in an implementation, the signal output circuit may convert the second charge data into the second voltage signal.
And obtaining parameters of the vibration sensor according to the second voltage signal. For example, damping ratio D and natural frequency ω0。
The sensitivity K is obtained according to the first voltage signal and the second voltage signal.
The damping ratio D and the natural frequency omega are obtained according to the first voltage signal0The description is given for the sake of example.
And acquiring a first peak voltage amplitude, a first valley voltage amplitude and a period according to one period of a waveform formed by the first voltage signal. The first peak voltage amplitude and the first valley voltage amplitude are respectively the peak voltage amplitude and the valley voltage amplitude of one period of the waveform formed by the first voltage signal, namely the first peak is adjacent to the first valley, and the period is the time between the first peak and the second peak.
Obtaining a damping ratio D according to a peak voltage amplitude and a first trough voltage amplitude; the damping ratio D is obtained by the following formula,
in the formula u1Is the first valley voltage amplitude (unit: V), u2Is the first peak voltage amplitude (unit: V).
Obtaining the natural frequency omega according to the first peak voltage amplitude, the first valley voltage amplitude and the period0Said natural frequency ω0Is obtained by the following formula,
in the formula u1Is the first valley voltage amplitude, u2T is the time interval between the first trough and the first peak and the time interval between two points, and is a half oscillation period (unit: s).
According to the second voltage signal, obtaining a damping ratio D and a natural frequency omega0In an exemplary embodiment, obtaining the parameter of the vibration sensor according to the second voltage signal includes: and acquiring a second peak voltage amplitude, a second valley voltage amplitude and a period according to one period of a waveform formed by the second voltage signal. The second peak voltage amplitude and the second valley voltage amplitude are respectively the peak voltage amplitude and the valley voltage amplitude of one period of the waveform formed by the second voltage signal, namely the second peak is adjacent to the second valley, and the period is the time between the second peak and the second peak. Obtaining the damping ratio D and the natural frequency omega0The specific formula can refer to the above embodiments, and is not described herein again.
In some embodiments, deriving the sensitivity from the first voltage signal and the second voltage signal comprises: and obtaining the sensitivity according to the damping ratio, the first peak voltage amplitude, the second peak voltage amplitude and the sum of the distances from the mass block 3 to the first induction coil 4 and the second induction coil 5. The sensitivity K is obtained by the following formula,
in the formula u1Is the first valley voltage amplitude, u1' is a second peak voltage amplitude, D is a damping ratio, and D is the sum of the distances (unit: m) of the mass block 3 to the first induction coil 4 and the second induction coil 5.
In the calibration method of the vibration sensor in the embodiment of the application, the mass block 3 can be adsorbed after the first induction coil 4 or the second induction coil 5 is electrified, the mass block 3 moves towards the first induction coil 4 or the second induction coil 5, so that the cantilever beam 2 bends, the mass block 3 is released after the first induction coil 4 or the second induction coil 5 is powered off, the mass block 3 drives the cantilever beam 2 to vibrate, the first piezoelectric material layer and the second piezoelectric material layer change along with the charge generated by vibration, based on the change, the relevant parameters of the vibration sensor can be obtained, and the online calibration of the vibration sensor can be realized in the use state of the vibration sensor. The scheme is simple and practical.
In the embodiment of the present application, the power supply to the first induction coil 4 or the second induction coil 5 can be realized by a switch, for example, by supplying power to the first induction coil 4 or the second induction coil 5 through manual control or remote control, or cutting off the power supply. In manual control, a mechanical switch may be used. In the case of remote control, an electromagnetic switch, a pneumatic switch, or the like may be used. In a specific implementation, the data processing module may send a power supply or power cut-off instruction to supply power to the first induction coil 4 or the second induction coil 5, or to cut off power supply.
Referring to fig. 7, in some embodiments, the first peak voltage amplitude is a voltage value of a second peak of the waveform formed by the first voltage signal, and the first valley voltage amplitude is a voltage value of a first valley of the waveform formed by the first voltage signal. Adopt the data after the first trough, can avoid when the initial moment, because quality piece 3 has initial displacement, the piezoelectric material layer has the electric charge to produce this moment, and electric charge can take place to reveal, the inaccuracy that causes. And the first wave trough and the second wave crest are adopted, so that the data are clear and reliable. Referring to fig. 8, the second peak voltage amplitude is a voltage value of a first peak of the waveform formed by the second voltage signal, and the second valley voltage amplitude is a voltage value of a second valley of the waveform formed by the second voltage signal.
The following describes a calibration principle of the vibration sensor according to the embodiment of the present application.
Fig. 2 is a schematic model view of a cantilever beam 2 of the vibration sensor. As shown in fig. 2, the cantilever beam 2 is a beryllium bronze sheet, piezoelectric material layers are respectively arranged on the upper and lower surfaces of the cantilever beam 2, the left end of the cantilever beam 2 is fixed on the housing, and the right end of the cantilever beam is fixedly connected with a mass block 3 as a free end. The length of the integral cantilever beam 2 is l (unit: m), the width is w (unit: m), and the thickness from the beam neutral axis to the beryllium bronze surface is T1(unit: m) and a thickness T from the neutral axis of the beam to the surface of the piezoelectric material2(unit: m), from which it can be seen that the thickness of the beryllium bronze sheet is 2T1The thickness of the single piezoelectric material layer is T2-T1。
Taking a piezoelectric thin film as an example, a single-layer piezoelectric thin film is generally composed of a piezoelectric body, an electrode, a piezoelectric protective layer, and a terminal. The electrodes and the protective layer are respectively covered on the upper surface and the lower surface of the piezoelectric body, and the connecting terminals are respectively connected with the electrodes of the piezoelectric body. The multiple piezoelectric films may be connected in series or in parallel. In view of the fact that it is intended to output a larger electric charge, the present embodiment will be described by connecting the upper and lower piezoelectric material layers in parallel. Fig. 4 is a schematic diagram of two piezoelectric material layers connected in parallel. Referring to fig. 4, the upper and lower piezoelectric material layers are bonded to the middle beryllium bronze sheet in opposite polarization directions. Assuming that a change in capacitance due to a minute deformation of the piezoelectric material layer caused by a mechanical external force is small, the capacitance of the piezoelectric material layer can be approximately considered to be a constant. Assuming that the piezoelectric material layer itself is insulating and leak-free, the energy dissipation of the adhesive layer is negligible.
The piezoelectric material layers are respectively attached to the upper surface and the lower surface of the middle-layer beryllium bronze sheet by adopting a method of consistent polarity, and meanwhile, the two piezoelectric material layers are connected in parallel. When the piezoelectric material layers are connected in parallel, the internal resistance is reduced, the leakage charge is reduced, double positive and negative charges are respectively gathered at two poles and enter a loop, and the output signal can be effectively increased.
When the ground vibrates, the housing 1 of the vibration sensor moves along with the ground,the cantilever beam 2 with the mass 3 will generate a relative displacement with the housing of the sensor due to inertia, and the mechanical model is shown in fig. 5. m is the mass (unit: kg) of the mass 3, k is the stiffness coefficient (N/m) of the cantilever beam 2, c is the damping coefficient (unit: N/(m/s)), and the absolute displacement of the housing 1 of the vibration sensor with respect to the ground vibration is xu(t) (unit: m), the displacement of the housing 1 of the vibrating sensor causes a relative displacement x between the mass 3 and the housing 1ξ(t) (unit: m), the absolute displacement of the mass 3 relative to the ground is x (t) xu(t)+xξ(t)。
The force exerted by the spring is kxξ(t) the damper applies a force of-cdxξ(t)/dt, there is Newton's second law:
the two sides are subjected to Laplace change, and the transfer functions of absolute displacement and relative displacement are obtained as follows:
get
As the undamped natural frequency parameter, D ═ c/(2m ω)0) As a damping ratio. The transfer function can thus be written as a standard second order transfer function:
the output voltage generated by the piezoelectric material layer is to find the amount of charge generated by the piezoelectric material layer, the amount of charge is related to the stress, so it is necessary to construct a strain diagram and then calculate the stress distribution, and the strain distribution of the cantilever beam 2 is shown in fig. 6: e1Is the elastic modulus (unit: Pa), sigma of the beryllium bronze sheet1Is subject to beryllium bronzeStress (unit: Pa), E2Is the elastic modulus (unit: Pa), σ, of the piezoelectric material layer2Is the stress (unit: Pa) to which the piezoelectric material layer is subjected.
From the moment balance it is possible to obtain:
wherein σ1Is the stress, sigma, to which the beryllium bronze sheet is subjected2Is the stress to which the piezoelectric material layer is subjected.
The stress versus material strain epsilon (dimensionless) is as follows:
σ1＝E1·ε
σ2＝E2·ε
thus the radius of curvature ρ (in m)-1) Can be expressed as:
ξ is the displacement of a point at different x positions of cantilever beam 2 in the z direction relative to the equilibrium state. Neglecting the effect of bending on thickness, the arc length of the neutral axis after bending is rho theta, where theta is the central angle (unit: rad) corresponding to the arc length of the neutral axis. The arc length at z above the neutral axis is (ρ + z) θ, and the expression of the available strain is:
finishing to obtain:
substituting the expression for stress, one can obtain:
substituting the relation of moment balance:
order to
Comprises the following steps:
the following can be obtained:
derived from the boundary conditions, c1＝c20, so we can:
when x is equal to l, xi (l) represents the position of the mass 3 at the end of the cantilever beam 2 relative to the housingThe movement of the movable part, at this time,
the force versus displacement relationship can thus be obtained:
i.e. the stiffness coefficient of the cantilever beam 2 is:
the expression of the charge Q (unit: C) generated by the piezoelectric material layer is:
wherein d is31Is the piezoelectric coefficient (unit: C/N) of the piezoelectric material
The stress expression of the piezoelectric material layer is:
the expression for the substituted charge can be given as:
the following can be obtained:
substituting the expression of force and displacement, the expression relationship of generated charge and displacement can be:
the method is simplified and can be obtained:
as can be seen from the above equation, the amount of charge generated by the piezoelectric material layer is proportional to the displacement.
Referring to fig. 2, capacitance C of the piezoelectric material layerp(unit: F) is:
wherein e is a dielectric constant (unit: F/m) of the piezoelectric material layer, and A is a surface area (unit: m) of the piezoelectric material layer2) Size is equal to lw, dgIs the distance (unit: m) between two polar plates of the piezoelectric material layer, i.e. the thickness of the piezoelectric material layer, and has a size equal to T2-T1. Because the upper and lower surfaces are attached with piezoelectric material layers and adopt a parallel mode, the equivalent capacitance of the vibration sensor is as follows:
C＝2Cp
referring to fig. 3, the charge readout circuit is constructed using a charge amplifier such that (1+ K)f)Cf> C, wherein KfFor amplifier open loop gain (dimensionless) and with a large value, CfFor the feedback loop capacitance, the circuit output voltage at this time is:
order:
the output voltage is proportional to the relative displacement:
u＝K·xξ
the overall transfer function of the vibration sensor consists of a mechanical transfer function, an electrical transfer function and a read-out circuit transfer function:
referring to fig. 1, the displacement of the known mass 3 to the first induction coil is dupAnd d to the second induction coildownThe sum of the distances d between the first and second induction coils 4 and 5 and the mass block 3 is | dup|+|ddownIf the coil is energized, the mass block 3 is attracted by the magnetic field generated by the energization of the coil, thereby generating displacement. When the coil is not electrified, the mass block 3 loses the adsorption effect to generate damping oscillation, so that the piezoelectric material layer deforms to generate a charge signal. The piezoelectric material layer and the cantilever beam 2 material creep with time, so that the mass block 3 is not positioned at the central position, but the value d does not change, and the first induction coil 4 and the second induction coil 5 are selected for combined calibration, so that an accurate calibration result can be obtained.
The mass block 3 is adsorbed and lifted to dupAnd then releasing, and solving a second-order system differential equation to obtain a displacement-time function expression as follows:
is solved as the product of exponential decay term and trigonometric function period term, wherein
Representing the frequency (unit: rad/s) of the solution period term, A is the amplitude of the period term,
phase of periodic term (unit: rad)
Voltage-time function of
Voltage signals are collected and the first voltage signal is shown in fig. 7. According to the output response curve graph, the first trough amplitude u is easily known through peak detection1And a second peak amplitude u2And its time difference T (half period), the following derivation uses the above three parameters to calibrate the damping ratio D, frequency ω0。t1,t2Are each u1，u2And T is half period of trigonometric function.
Since the initial displacement is determined by the distance of the mass 3 from the first induction coil 4 and the second induction coil 5, d is used respectivelyup，ddownTo perform calibration. Known as T ═ T2-t1For half a cycle, we can obtain:
let the voltage amplitude at two positions be u0，u1，u2The following can be obtained:
the above formula can be obtained simultaneously:
referring to FIG. 7, the first peak is the initial value u0The value is not accurate because at the initial moment, the mass 3 initially displaces dupAt this time, the piezoelectric material layer has a charge amount generated and the charge leaks, so the first wave trough and the second wave crest are selected for calibration, and the expression of D is:
from this, an expression for the calibrated damping ratio D can be obtained.
Natural frequency omega0The expression is as follows:
thus obtaining the natural frequency omega0The calibration expression of (1).
The sensitivity K is input-output dependent, and is the ratio of the input signal to the output signal. The sensitivity can not be calibrated by only using a single induction coil, and the first induction coil 4 and the second induction coil 5 are required to be calibrated simultaneously.
The initial relative displacement is d when calibrated by the first induction coil 4upThe relative displacement of the first wave trough and the second wave crest is d1The same principle is as follows:
the first induction coil 4 is calibrated to obtain the first trough voltage amplitude
Similarly, the first peak voltage amplitude u obtained by calibrating the second induction coil 51′：
The two formulas take absolute values simultaneously:
a calibration expression for the sensitivity K can thus be obtained.
Therefore, when calibration of the vibration sensor is performed, knowing the sum d of the distances from the first induction coil 4 and the second induction coil 5 to the mass block 3, inputting current, absorbing the mass block 3 to the first induction coil 4, then releasing the response curve graph of the vibration sensor output voltage and time, the first trough t can be easily obtained by peak detection1Amplitude u corresponding to time1Second peak t2Amplitude u corresponding to time2And t and1and t2The time interval T between the two induction coils is similar, the mass block 3 is adsorbed to the second induction coil 5 by electrifying, and the first wave peak T is easily obtained1Amplitude u corresponding to time1From these measurements, three parameters of the vibration sensor can be calibrated: damping ratio D, natural frequency ω0And sensitivity K, thus obtaining a complete vibration sensor transfer function.
The embodiment of the application provides a piezoelectric sensor calibration device, and refers to fig. 1 and the description part related to the vibration sensor. The above description of the vibration sensor and the calibration method thereof can be used for understanding the piezoelectric sensor calibration device according to the embodiment of the present application. The piezoelectric sensor calibration device of the embodiment of the application comprises:
a frame body;
one end of the cantilever beam is fixed with the frame body, the cantilever beam is provided with a first surface and a second surface which are opposite, and the first surface and the second surface provide attachment surfaces of the piezoelectric material layer to be calibrated;
the mass block is fixed with the other end of the cantilever beam;
the first induction coil is connected with the frame body, is positioned on one side of the first surface and is used for adsorbing the mass block when being electrified so as to bend the cantilever beam towards the direction of the first induction coil;
the second induction coil is connected with the frame body, is positioned on one side of the second surface and is used for adsorbing the mass block when being electrified so as to enable the cantilever beam to bend towards the direction of the second induction coil;
and the signal output circuit is used for being connected with the piezoelectric material layer to be calibrated so as to output an electric signal generated by the piezoelectric material layer to be calibrated along with the bending of the cantilever beam.
Compared with a vibration sensor, the piezoelectric sensor calibration device provided by the embodiment of the application has the advantages that the shell in the vibration sensor is replaced by the frame body, and the structures of other parts can refer to the vibration sensor part. The support body provides the installation basis for calibration device. In order to facilitate the calibration of the piezoelectric material layer to be calibrated, the frame body can adopt a non-closed structure, for example, a structure with one or more open sides. In a specific implementation, only the top surface, the bottom surface, and a side surface connecting the top surface and the bottom surface may be provided. The calibration device can calibrate the electrical parameters of the piezoelectric sensor.
In some embodiments, the calibration apparatus further includes: and the data processing module is electrically connected with the signal output circuit and is used for processing the electric signals of the signal output circuit.
The description of the embodiments of the vibration sensor and the calibration method of the sensor can be used for understanding the embodiments of the calibration method of the piezoelectric sensor. The piezoelectric sensor calibration method of the embodiment of the application is realized by adopting the calibration device of any one of the embodiments.
Referring to the embodiments of the vibration sensor and the calibration method thereof, the young's modulus E of the piezoelectric material can be obtained by the calibration device2And piezoelectric coefficient d31Thereby realizing the Young modulus E of the piezoelectric material2And piezoelectric coefficient d31And (4) calibrating. For example, the Young's modulus E of the piezoelectric material can be obtained by the following two formulae2And piezoelectric coefficient d31。
When calibrating the size of the device, the Young modulus E of the cantilever beam1Mass m of mass and feedback capacitance CfIn a known amount, the Young's modulus E of the piezoelectric material can be obtained from the above two formulae2And piezoelectric coefficient d31Realizing Young's modulus E to piezoelectric material2And piezoelectric coefficient d31And (5) calibrating.
It is clear to a person skilled in the art that the solution of the present application can be implemented by means of software and/or hardware. The "Unit" and "module" in this specification refer to software and/or hardware that can perform a specific function independently or in cooperation with other components, and the hardware may be, for example, a Field-Programmable Gate Array (FPGA), a Micro Controller Unit (MCU), an Integrated Circuit (IC), or the like.
It should be noted that, for simplicity of description, the above-mentioned method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present application is not limited by the order of acts described, as some steps may occur in other orders or concurrently depending on the application. Further, those skilled in the art should also appreciate that the embodiments described in the specification are preferred embodiments and that the acts and modules referred to are not necessarily required in this application.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the above-described embodiments of the apparatus are merely illustrative, and for example, a division of a unit is merely a logical division, and an actual implementation may have another division, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of some interfaces, devices or units, and may be an electric or other form.
Units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable memory. Based on such understanding, the technical solution of the present application may be substantially implemented or a part of or all or part of the technical solution contributing to the prior art may be embodied in the form of a software product stored in a memory, and including several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method of the embodiments of the present application. And the aforementioned memory comprises: various media capable of storing program codes, such as a usb disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a removable hard disk, a magnetic disk, or an optical disk.
Those skilled in the art will appreciate that all or part of the steps in the methods of the above embodiments may be implemented by associated hardware instructed by a program, which may be stored in a computer-readable memory, which may include: flash disks, Read-Only memories (ROMs), Random Access Memories (RAMs), magnetic or optical disks, and the like.
The above description is only an exemplary embodiment of the present disclosure, and the scope of the present disclosure should not be limited thereby. That is, all equivalent changes and modifications made in accordance with the teachings of the present disclosure are intended to be included within the scope of the present disclosure. Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
Claims (10)
1. A vibration sensor, comprising:
a housing;
the cantilever beam is provided with a first surface and a second surface which are opposite, the first surface faces the top surface of the shell, the second surface faces the bottom surface of the shell, a first piezoelectric material layer is attached to the first surface, a second piezoelectric material layer is attached to the second surface, and the first piezoelectric material layer and the second piezoelectric material layer are connected in parallel or in series;
the mass block is fixed with the other end of the cantilever beam;
the first induction coil is connected with the top of the shell and used for adsorbing the mass block when the shell is electrified so as to enable the cantilever beam to bend towards the direction of the first induction coil;
the second induction coil is connected with the bottom of the shell and used for adsorbing the mass block when the shell is electrified so as to enable the cantilever beam to bend towards the direction of the second induction coil;
and the signal output circuit is used for being connected with the first piezoelectric material layer and the second piezoelectric material layer which are connected in parallel or in series so as to output an electric signal generated by the first piezoelectric material layer and the second piezoelectric material layer which are connected in parallel or in series along with the bending of the cantilever beam.
2. The vibration sensor according to claim 1, wherein the signal output circuit comprises a charge amplifier for converting charges generated by the first piezoelectric material layer and the second piezoelectric material layer connected in parallel or in series with bending of the cantilever beam into a voltage signal output.
3. A method for calibrating a vibration sensor according to any of claims 1-2, said method comprising:
absorbing the mass block to the first induction coil and then releasing the mass block, so that the released mass block drives the cantilever beam to generate first vibration;
acquiring a first voltage signal, wherein the first voltage signal is generated by the piezoelectric material layer based on the first vibration;
absorbing the mass block to the second induction coil and then releasing the mass block, so that the released mass block drives the cantilever beam to generate second vibration;
acquiring a second voltage signal, wherein the second voltage signal is generated by the piezoelectric material layer based on the second vibration;
acquiring a first peak voltage amplitude, a first valley voltage amplitude and a period according to one period of a waveform formed by the first voltage signal, wherein the first peak voltage amplitude and the first valley voltage amplitude are respectively the peak voltage amplitude and the valley voltage amplitude of the one period of the waveform formed by the first voltage signal;
acquiring a second peak voltage amplitude and a second valley voltage amplitude according to a cycle of a waveform formed by the second voltage signal, wherein the second peak voltage amplitude and the second valley voltage amplitude are respectively the peak voltage amplitude and the valley voltage amplitude of the cycle of the waveform formed by the second voltage signal;
and obtaining parameters of the vibration sensor according to the first peak voltage amplitude, the first valley voltage amplitude, the period, the second peak voltage amplitude and the second valley voltage amplitude.
4. The method of claim 3, wherein the first peak voltage amplitude is a voltage value of a second peak of a waveform formed by the first voltage signal, and the first valley voltage amplitude is a voltage value of a first valley of the waveform formed by the first voltage signal;
the second peak voltage amplitude is a voltage value of a first peak of a waveform formed by the second voltage signal, and the second valley voltage amplitude is a voltage value of a second valley of the waveform formed by the second voltage signal.
5. The method of claim 3, deriving parameters of the vibration sensor, comprising:
obtaining a damping ratio D according to the first peak voltage amplitude and the first valley voltage amplitude; the damping ratio D is obtained by the following formula,
in the formula u1Is the first valley voltage amplitude, u2Is the first peak voltage amplitude.
6. The method of claim 4, wherein obtaining the parameters of the vibration sensor further comprises:
obtaining the natural frequency omega according to the first peak voltage amplitude, the first valley voltage amplitude and the period0Said natural frequency ω0Is obtained by the following formula,
in the formula u1Is the first valley voltage amplitude, u2T is the time interval from the first trough to the first peak.
7. The method of claim 5, wherein obtaining the parameters of the vibration sensor further comprises:
obtaining sensitivity according to the damping ratio, the first peak voltage amplitude, the second peak voltage amplitude and the sum of the distances from the mass block to the first induction coil and the second induction coil; the sensitivity K is obtained by the following formula,
in the formula u1Is the first valley voltage amplitude, u1' is the second peak voltage amplitude, D is the damping ratio, D isThe sum of the distances of the mass to the first and second induction coils.
8. A piezoelectric sensor calibration device is characterized by comprising:
a frame body;
one end of the cantilever beam is fixed with the frame body, the cantilever beam is provided with a first surface and a second surface which are opposite, and the first surface and the second surface provide attachment surfaces of the piezoelectric material layer to be calibrated;
the mass block is fixed with the other end of the cantilever beam;
the first induction coil is connected with the frame body, is positioned on one side of the first surface and is used for adsorbing the mass block when being electrified so as to enable the cantilever beam to bend towards the direction of the first induction coil;
the second induction coil is connected with the frame body, is positioned on one side of the second surface and is used for adsorbing the mass block when being electrified so as to enable the cantilever beam to bend towards the direction of the second induction coil;
and the signal output circuit is used for being connected with the piezoelectric material layer to be calibrated so as to output an electric signal generated by the piezoelectric material layer to be calibrated along with the bending of the cantilever beam.
9. The apparatus of claim 8, further comprising:
and the data processing module is electrically connected with the signal output circuit and is used for processing the electric signals of the signal output circuit.
10. A method for calibrating a piezoelectric transducer, wherein the method is implemented by the apparatus of claim 8.
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