CN114413191A - Aluminium system LED fluorescent tube convenient to heat dissipation - Google Patents

Aluminium system LED fluorescent tube convenient to heat dissipation Download PDF

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Publication number
CN114413191A
CN114413191A CN202210006207.4A CN202210006207A CN114413191A CN 114413191 A CN114413191 A CN 114413191A CN 202210006207 A CN202210006207 A CN 202210006207A CN 114413191 A CN114413191 A CN 114413191A
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led lamp
shell layer
niobium silicide
lamp tube
heat dissipation
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CN114413191B (en
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李静信
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Dongguan Xinyi Aluminum Products Co ltd
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Dongguan Xinyi Aluminum Products Co ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F21K9/275—Details of bases or housings, i.e. the parts between the light-generating element and the end caps; Arrangement of components within bases or housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses an aluminum LED lamp tube convenient for heat dissipation, which comprises an LED lamp tube body, wherein the LED lamp tube body comprises an LED lamp cap, an LED lamp bar and an LED shell; the LED shell comprises an upper shell layer and a lower shell layer, wherein the upper shell layer is of a flat plate type structure, the lower shell layer is of a semicircular arc structure, two ends of the arc structure of the lower shell layer are respectively provided with a buckle structure, and the lower shell layer is fixedly connected with the upper shell layer through the buckle structures; the LED light bar is fixedly attached to the lower surface of the upper shell layer through heat-conducting adhesive; the LED lamp holder sets up to two, and fixes respectively at the both ends of LED shell. The LED lamp strip is additionally provided with the aluminum upper shell layer on the basis of the existing plastic lamp tube, so that the LED lamp strip with larger heating degree is adhered to the upper shell layer, and the effect of rapid heat dissipation is achieved. A series of improvements are also carried out on the adhesive, and the adhesive obtained by final curing has stronger cohesiveness, high temperature resistance and thermal conductivity.

Description

Aluminium system LED fluorescent tube convenient to heat dissipation
Technical Field
The invention relates to the field of LED lamp tubes, in particular to an aluminum LED lamp tube convenient for heat dissipation.
Background
Human lighting goes through different stages such as incandescent lamps, fluorescent lamps, energy-saving lamps and the like, and great progress is made in the aspects of improving the lighting effect and the like. However, there is room for further improvement in terms of cost reduction, energy saving, and environmental protection. The LED uses a solid semiconductor chip as a luminescent material, has the advantages of high luminous efficiency, small volume, low power consumption, long service life, environmental protection and the like, and is an ideal substitute of a traditional light source due to its inherent characteristics, and the theoretical conversion efficiency of the LED is 5-20 times higher than the light emitting efficiency of the traditional light source.
However, in the prior art, heat generated by the LED lamp tube cannot be effectively dissipated, and long-term heat accumulation can reduce the luminous efficiency of the LED, so that the LED can generate rapid light decay.
Disclosure of Invention
The invention aims to provide an aluminum LED lamp tube convenient for heat dissipation, aiming at the problems that heat generated by the LED lamp tube in the prior art cannot be effectively dissipated, long-term heat accumulation can reduce the luminous efficiency of an LED and the LED generates rapid light attenuation.
The purpose of the invention is realized by adopting the following technical scheme:
an aluminum LED lamp tube convenient for heat dissipation comprises an LED lamp tube body, wherein the LED lamp tube body comprises an LED lamp cap, an LED lamp bar and an LED shell; the LED shell comprises an upper shell layer and a lower shell layer, wherein the upper shell layer is of a flat plate type structure, the lower shell layer is of a semicircular arc structure, two ends of the arc structure of the lower shell layer are respectively provided with a buckle structure, and the lower shell layer is fixedly connected with the upper shell layer through the buckle structures; the LED light bar is fixedly attached to the lower surface of the upper shell layer through heat-conducting adhesive; the LED lamp holder sets up to two, and fixes respectively at the both ends of LED shell.
Preferably, the upper shell layer is made of an aluminum alloy material, and the lower shell layer is made of a plastic material with good light transmittance and good elasticity.
Preferably, one side of the LED lamp strip, which is far away from the lower shell layer, is provided with a plurality of lamp beads, and the lamp beads are arranged at equal intervals.
Preferably, the heat-conducting bonding adhesive is obtained by mixing and curing a modified acrylic adhesive and a curing agent, and the modified acrylic adhesive is obtained by modifying acrylic resin by using niobium silicide nitride composite microspheres.
Preferably, the preparation method of the niobium silicide nitride composite microsphere comprises the following steps:
s1, weighing niobium silicide powder, dispersing the niobium silicide powder into deionized water, adding a silane coupling agent, stirring at room temperature for 2-5 hours, filtering, and drying to obtain surface-activated niobium silicide powder; wherein the mass ratio of the niobium silicide powder to the silane coupling agent to the deionized water is 1: 0.05-0.1: 6-10;
s2, dispersing the surface-activated niobium silicide powder into ammonia water with the mass fraction of 10%, adding resorcinol, carrying out ultrasonic homogenization, dropwise adding a formaldehyde aqueous solution with the mass fraction of 35%, carrying out continuous stirring treatment for 18-24 h at room temperature, filtering, collecting precipitate, and drying to obtain resorcinol formaldehyde polymer/niobium silicide composite microspheres; wherein the mass ratio of the surface-activated niobium silicide powder to the aqueous solution of ammonia water to formaldehyde is 0.26-0.52: 3-4: 1, and the mass ratio of resorcinol to the aqueous solution of formaldehyde is 0.5-0.8: 1;
s3, placing the resorcinol formaldehyde polymer/niobium silicide composite microspheres in a reaction furnace, heating to 400-500 ℃, and treating for 2-4 hours under an air condition to obtain porous carbon-coated niobium silicide composite microspheres;
and S4, cooling the reaction furnace to 120-180 ℃, carrying out heat preservation treatment for 1-2 hours, introducing nitrogen to replace air, heating to 880-930 ℃, carrying out heat preservation treatment for 2-4 hours, and then cooling to normal pressure and normal temperature to obtain the niobium silicide nitride composite microspheres.
Preferably, the preparation method of the modified acrylic adhesive comprises the following steps:
p1, mixing an acrylate monomer into ethyl acetate, and uniformly stirring to obtain an acrylic acid mixed solution; wherein the mass ratio of the acrylate monomer to the ethyl acetate is 1: 2.5-5;
and P2, mixing the niobium silicide nitride composite microspheres and diethoxy dimethyl silane into ethyl acetate, ultrasonically dispersing until the mixture is uniform, then dropwise adding the mixture into the acrylic mixed solution which is continuously stirred, and after dropwise adding, continuously stirring and dispersing for 1-2 hours to obtain an acrylic/composite microsphere mixed solution; wherein the mass ratio of the niobium silicide nitride composite microspheres to the diethoxydimethylsilane to the mixed solution of ethyl acetate and acrylic acid is 1: 0.02-0.05: 3-6: 10-15;
and P3, pouring the acrylic acid/composite microsphere mixed solution into a reflux condensing device, heating to 75-80 ℃ under the protection of nitrogen, adding azobisisobutyronitrile, reacting for 2-4 h, and cooling to room temperature to obtain the modified acrylic acid adhesive.
Preferably, in the P1, the acrylate monomer comprises acrylic acid, methacrylic acid, hydroxyethyl acrylate and hydroxyethyl methacrylate in a mass ratio of 1: 1.2-0.8: 5.4-8.8: 7.5-10.3.
Preferably, the mass ratio of the modified acrylic adhesive to the curing agent is 100: 6-10, and the curing agent is an isocyanate curing agent or an epoxy curing agent.
The invention has the beneficial effects that:
the invention discloses an aluminum LED lamp tube convenient for heat dissipation, which is characterized in that an aluminum upper shell layer is additionally arranged on the basis of the existing plastic lamp tube, so that an LED lamp strip with larger heating degree is adhered to the upper shell layer, and the effect of rapid heat dissipation is achieved.
Because the existing adhesive has poor adhesion effect and poor heat conductivity and high temperature resistance, the invention also aims at the adhesive to carry out a series of improvements, the improvement process is improved on the basis of the acrylic adhesive, the niobium silicide nitride composite microspheres are added in the preparation process of the acrylic adhesive, and the finally cured adhesive has stronger cohesiveness, high temperature resistance and heat conductivity.
Niobium silicide is an intermetallic compound, the property of the intermetallic compound is between that of an ionic compound and that of an alloy, the niobium silicide has better thermal conductivity, but an ideal thermal conductivity effect is not achieved during application, so that the niobium silicide nitride composite microspheres are prepared on the basis of the niobium silicide nitride composite microspheres, and the purpose of the invention is to enhance the dispersibility and the thermal conductivity of the niobium silicide in an acrylic adhesive.
The preparation process of the niobium silicide nitride composite microsphere comprises the following steps: firstly, carrying out surface activation treatment on niobium silicide powder by using a silane coupling agent, then preparing the niobium silicide composite microsphere coated with the resorcinol formaldehyde polymer by using the reaction of resorcinol and formaldehyde, then placing the niobium silicide composite microsphere in a reaction furnace to carry out carbonization treatment on the polymer, and finally carrying out nitridation treatment on the obtained microsphere. The target product of the invention is the composite microsphere of silicon nitride and niobium nitride, and the detection shows that compared with the single composite of silicon nitride and niobium nitride, the addition of the niobium silicide nitride composite microsphere has better thermal conductivity, and the suspected reason is that part of niobium silicide does not participate in the reaction due to the unique preparation process of the invention, and the prepared niobium silicide nitride composite microsphere has better associativity and dispersibility.
The carbonization temperature of the resorcinol-formaldehyde resin is 400-500 ℃, the surface of the niobium silicide powder is partially oxidized in the process, but the niobium silicide powder is reduced by carbon generated at the same time due to the overhigh temperature, so that the niobium silicide powder is subjected to heat treatment again at a lower temperature (120-180 ℃) to oxidize the surface of the niobium silicide powder again, and a nitride cushion is generated better in the follow-up process.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be obtained on the basis of the following drawings without inventive effort.
Fig. 1 is a schematic structural diagram of an aluminum LED lamp tube facilitating heat dissipation in embodiment 1;
fig. 2 is a schematic cross-sectional view of an aluminum LED lamp tube for facilitating heat dissipation in embodiment 1.
Reference numerals: LED fluorescent tube body 1, LED lamp holder 2, LED lamp strip 3, LED shell 4, upper shell 5, lower shell 6, buckle structure 7 and lamp pearl 8.
Detailed Description
The invention is further described with reference to the following examples.
Example 1
An aluminum LED lamp tube convenient for heat dissipation comprises an LED lamp tube body 1, wherein the LED lamp tube body 1 comprises an LED lamp cap 2, an LED lamp bar 3 and an LED shell 4; the LED shell 4 comprises an upper shell layer 5 and a lower shell layer 6, wherein the upper shell layer 5 is of a flat plate type structure, the lower shell layer 6 is of a semicircular arc structure, two ends of the arc structure of the lower shell layer 6 are respectively provided with a buckle structure 7, and the lower shell layer 6 is fixedly connected with the upper shell layer 5 through the buckle structures 7; the LED lamp strip 3 is fixedly attached to the lower surface of the upper shell layer 5 through heat-conducting bonding glue; the number of the LED lamp caps 2 is two, and the LED lamp caps are respectively fixed at two ends of the LED shell 4. The upper shell layer 5 is made of an aluminum alloy material, and the lower shell layer 6 is made of a plastic material with good light transmission and elasticity. One side that LED lamp strip 3 kept away from lower shell layer 6 is provided with a plurality of lamp pearl 8, is equidistant range between the lamp pearl 8.
The heat-conducting bonding adhesive is obtained by mixing and curing a modified acrylic adhesive and an isocyanate curing agent according to the mass ratio of 100:8, and the modified acrylic adhesive is obtained by modifying acrylic resin by using niobium silicide nitride composite microspheres.
The preparation method of the niobium silicide nitride composite microsphere comprises the following steps:
s1, weighing niobium silicide powder, dispersing the niobium silicide powder into deionized water, adding a silane coupling agent, stirring at room temperature for 3 hours, filtering, and drying to obtain surface-activated niobium silicide powder; wherein the mass ratio of the niobium silicide powder to the silane coupling agent to the deionized water is 1:0.07: 8;
s2, dispersing the surface-activated niobium silicide powder into ammonia water with the mass fraction of 10%, adding resorcinol, carrying out ultrasonic homogenization, dropwise adding a formaldehyde aqueous solution with the mass fraction of 35%, continuously stirring at room temperature for 20 hours, filtering, collecting precipitate, and drying to obtain resorcinol formaldehyde polymer/niobium silicide composite microspheres; wherein the mass ratio of the surface-activated niobium silicide powder, ammonia water and an aqueous solution of formaldehyde is 0.38:3.5:1, and the mass ratio of resorcinol and an aqueous solution of formaldehyde is 0.6: 1;
s3, placing the resorcinol formaldehyde polymer/niobium silicide composite microspheres in a reaction furnace, heating to 450 ℃, and treating for 3 hours under the air condition to obtain porous carbon coated niobium silicide composite microspheres;
and S4, cooling the reaction furnace to 150 ℃, carrying out heat preservation treatment for 2 hours, introducing nitrogen to replace air, heating to 900 ℃, carrying out heat preservation treatment for 3 hours, and then cooling to normal pressure and normal temperature to obtain the niobium silicide nitride composite microspheres.
The preparation method of the modified acrylic acid adhesive comprises the following steps:
p1, mixing an acrylate monomer into ethyl acetate, and uniformly stirring to obtain an acrylic acid mixed solution; wherein the mass ratio of the acrylate monomer to the ethyl acetate is 1: 3.8; wherein the acrylate monomer comprises acrylic acid, methacrylic acid, hydroxyethyl acrylate and hydroxyethyl methacrylate in a mass ratio of 1:1.5:6.7: 8.6;
p2, mixing the niobium silicide nitride composite microspheres and diethoxy dimethylsilane into ethyl acetate, ultrasonically dispersing until the mixture is uniform, then dropwise adding the mixture into the acrylic mixed solution which is continuously stirred, and after the dropwise adding is finished, continuously stirring and dispersing for 2 hours to obtain an acrylic/composite microsphere mixed solution; wherein the mass ratio of the niobium silicide nitride composite microspheres to the mixed liquid of diethoxydimethylsilane, ethyl acetate and acrylic acid is 1:0.03:4: 12;
and P3, pouring the acrylic acid/composite microsphere mixed solution into a reflux condensing device, heating to 80 ℃ under the protection of nitrogen, adding azobisisobutyronitrile, reacting for 3 hours, and cooling to room temperature to obtain the modified acrylic acid adhesive.
Example 2
An aluminum LED lamp tube convenient for heat dissipation is similar to that in the embodiment 1, and is different from the embodiment 1 in that the heat-conducting adhesive is prepared by mixing a modified acrylic adhesive and an epoxy curing agent according to the mass ratio of 100:6 and then curing the mixture to obtain a curing agent;
the preparation method of the niobium silicide nitride composite microsphere comprises the following steps:
s1, weighing niobium silicide powder, dispersing the niobium silicide powder into deionized water, adding a silane coupling agent, stirring at room temperature for 2 hours, filtering, and drying to obtain surface-activated niobium silicide powder; wherein the mass ratio of the niobium silicide powder to the silane coupling agent to the deionized water is 1:0.05: 6;
s2, dispersing the surface-activated niobium silicide powder into ammonia water with the mass fraction of 10%, adding resorcinol, carrying out ultrasonic homogenization, dropwise adding a formaldehyde aqueous solution with the mass fraction of 35%, continuously stirring at room temperature for 18h, filtering, collecting precipitate, and drying to obtain resorcinol formaldehyde polymer/niobium silicide composite microspheres; wherein the mass ratio of the surface-activated niobium silicide powder, ammonia water and an aqueous solution of formaldehyde is 0.26:3:1, and the mass ratio of resorcinol and an aqueous solution of formaldehyde is 0.5: 1;
s3, placing the resorcinol formaldehyde polymer/niobium silicide composite microspheres in a reaction furnace, heating to 400 ℃, and treating for 2 hours under the air condition to obtain porous carbon coated niobium silicide composite microspheres;
and S4, cooling the reaction furnace to 120 ℃, carrying out heat preservation treatment for 1 hour, introducing nitrogen to replace air, heating to 880 ℃, carrying out heat preservation treatment for 2 hours, and then cooling to normal pressure and normal temperature to obtain the niobium silicide nitride composite microspheres.
The preparation method of the modified acrylic acid adhesive comprises the following steps:
p1, mixing an acrylate monomer into ethyl acetate, and uniformly stirring to obtain an acrylic acid mixed solution; wherein the mass ratio of the acrylate monomer to the ethyl acetate is 1: 2.5; wherein the acrylate monomer comprises acrylic acid, methacrylic acid, hydroxyethyl acrylate and hydroxyethyl methacrylate in a mass ratio of 1:1.2:5.4: 7.5;
and P2, mixing the niobium silicide nitride composite microspheres and diethoxy dimethyl silane into ethyl acetate, ultrasonically dispersing until the mixture is uniform, then dropwise adding the mixture into the acrylic mixed solution which is continuously stirred, and after dropwise adding, continuously stirring and dispersing for 1-2 hours to obtain an acrylic/composite microsphere mixed solution; wherein the mass ratio of the niobium silicide nitride composite microspheres to the diethoxydimethylsilane to the mixed solution of ethyl acetate and acrylic acid is 1:0.02:3: 10;
and P3, pouring the acrylic acid/composite microsphere mixed solution into a reflux condensing device, heating to 75 ℃ under the protection of nitrogen, adding azobisisobutyronitrile, reacting for 2 hours, and cooling to room temperature to obtain the modified acrylic acid adhesive.
Example 3
An aluminum LED lamp tube convenient for heat dissipation is different from the embodiment 1 in that a heat-conducting adhesive is obtained by mixing and curing a modified acrylic adhesive and an isocyanate curing agent according to the mass ratio of 100:10,
the preparation method of the niobium silicide nitride composite microsphere comprises the following steps:
s1, weighing niobium silicide powder, dispersing the niobium silicide powder into deionized water, adding a silane coupling agent, stirring at room temperature for 5 hours, filtering, and drying to obtain surface-activated niobium silicide powder; wherein the mass ratio of the niobium silicide powder to the silane coupling agent to the deionized water is 1:0.1: 10;
s2, dispersing the surface-activated niobium silicide powder into ammonia water with the mass fraction of 10%, adding resorcinol, carrying out ultrasonic homogenization, dropwise adding a formaldehyde aqueous solution with the mass fraction of 35%, continuously stirring at room temperature for 24 hours, filtering, collecting precipitate, and drying to obtain resorcinol formaldehyde polymer/niobium silicide composite microspheres; wherein the mass ratio of the surface-activated niobium silicide powder, ammonia water and an aqueous solution of formaldehyde is 0.52:4:1, and the mass ratio of resorcinol and an aqueous solution of formaldehyde is 0.8: 1;
s3, placing the resorcinol formaldehyde polymer/niobium silicide composite microspheres in a reaction furnace, heating to 500 ℃, and treating for 4 hours under the air condition to obtain porous carbon coated niobium silicide composite microspheres;
and S4, cooling the reaction furnace to 180 ℃, carrying out heat preservation treatment for 2 hours, introducing nitrogen to replace air, heating to 930 ℃, carrying out heat preservation treatment for 4 hours, and then cooling to normal pressure and normal temperature to obtain the niobium silicide nitride composite microspheres.
The preparation method of the modified acrylic acid adhesive comprises the following steps:
p1, mixing an acrylate monomer into ethyl acetate, and uniformly stirring to obtain an acrylic acid mixed solution; wherein the mass ratio of the acrylate monomer to the ethyl acetate is 1: 5; wherein the acrylate monomer comprises acrylic acid, methacrylic acid, hydroxyethyl acrylate and hydroxyethyl methacrylate in a mass ratio of 1:0.8:8.8: 10.3.
P2, mixing the niobium silicide nitride composite microspheres and diethoxy dimethylsilane into ethyl acetate, ultrasonically dispersing until the mixture is uniform, then dropwise adding the mixture into the acrylic mixed solution which is continuously stirred, and after the dropwise adding is finished, continuously stirring and dispersing for 2 hours to obtain an acrylic/composite microsphere mixed solution; wherein the mass ratio of the niobium silicide nitride composite microspheres to the diethoxydimethylsilane to the mixed solution of ethyl acetate and acrylic acid is 1:0.05:6: 15;
and P3, pouring the acrylic acid/composite microsphere mixed solution into a reflux condensing device, heating to 80 ℃ under the protection of nitrogen, adding azobisisobutyronitrile, reacting for 4 hours, and cooling to room temperature to obtain the modified acrylic acid adhesive.
Comparative example 1
The heat-conducting bonding adhesive is obtained by mixing and curing a modified acrylic adhesive and an isocyanate curing agent according to the mass ratio of 100:8, wherein the modified acrylic adhesive is obtained by modifying acrylic resin by niobium silicide.
The preparation method of the modified acrylic acid adhesive comprises the following steps:
p1, mixing an acrylate monomer into ethyl acetate, and uniformly stirring to obtain an acrylic acid mixed solution; wherein the mass ratio of the acrylate monomer to the ethyl acetate is 1: 2.5; wherein the acrylate monomer comprises acrylic acid, methacrylic acid, hydroxyethyl acrylate and hydroxyethyl methacrylate in a mass ratio of 1:1.2:5.4: 7.5;
p2, mixing niobium silicide and diethoxydimethylsilane into ethyl acetate, ultrasonically dispersing until the mixture is uniform, then dropwise adding the mixture into the acrylic mixed solution which is continuously stirred, and after dropwise adding, continuously stirring and dispersing for 1-2 hours to obtain an acrylic/composite microsphere mixed solution; wherein the mass ratio of the niobium silicide, diethoxydimethylsilane, ethyl acetate and acrylic acid mixed liquid is 1:0.02:3: 10;
and P3, pouring the acrylic acid/composite microsphere mixed solution into a reflux condensing device, heating to 75 ℃ under the protection of nitrogen, adding azobisisobutyronitrile, reacting for 2 hours, and cooling to room temperature to obtain the modified acrylic acid adhesive.
Comparative example 2
The heat-conducting bonding adhesive is obtained by mixing and curing an acrylic adhesive and an isocyanate curing agent according to a mass ratio of 100: 8.
The preparation method of the acrylic adhesive comprises the following steps:
p1, mixing an acrylate monomer into ethyl acetate, and uniformly stirring to obtain an acrylic acid mixed solution; wherein the mass ratio of the acrylate monomer to the ethyl acetate is 1: 2.5; wherein the acrylate monomer comprises acrylic acid, methacrylic acid, hydroxyethyl acrylate and hydroxyethyl methacrylate in a mass ratio of 1:1.2:5.4: 7.5;
and P2, pouring the acrylic acid mixed solution into a reflux condensing device, heating to 75 ℃ under the protection of nitrogen, adding azobisisobutyronitrile, reacting for 2 hours, and cooling to room temperature to obtain the acrylic acid adhesive.
To more clearly illustrate the present invention, the heat conductive adhesive prepared in examples 1 to 3 and comparative examples 1 to 2 were compared in performance tests, two 5083 aluminum alloy materials of 50mm × 30mm × 2mm were coated with 20mm × 15mm area, cured after adhesion, and tested for 180 ° peel strength according to standard GB/T2792-:
TABLE 1 comparison of the Properties of different thermally conductive adhesive glues
Figure BDA0003455549690000071
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims (8)

1. An aluminum LED lamp tube convenient for heat dissipation is characterized by comprising an LED lamp tube body, wherein the LED lamp tube body comprises an LED lamp cap, an LED lamp bar and an LED shell; the LED shell comprises an upper shell layer and a lower shell layer, wherein the upper shell layer is of a flat plate type structure, the lower shell layer is of a semicircular arc structure, two ends of the arc structure of the lower shell layer are respectively provided with a buckle structure, and the lower shell layer is fixedly connected with the upper shell layer through the buckle structures; the LED light bar is fixedly attached to the lower surface of the upper shell layer through heat-conducting adhesive; the LED lamp holder sets up to two, and fixes respectively at the both ends of LED shell.
2. The aluminum LED lamp tube convenient for heat dissipation as claimed in claim 1, wherein the upper shell layer is made of aluminum alloy material, and the lower shell layer is made of plastic material with good light transmittance and good elasticity.
3. The aluminum LED lamp tube convenient for heat dissipation of claim 1, wherein a plurality of lamp beads are arranged on one side of the LED lamp strip away from the lower shell layer, and the lamp beads are arranged at equal intervals.
4. The aluminum LED lamp tube convenient for heat dissipation as claimed in claim 1, wherein the heat-conducting adhesive is obtained by mixing a modified acrylic adhesive with a curing agent and then curing, and the modified acrylic adhesive is obtained by modifying acrylic resin with niobium silicide nitride composite microspheres.
5. The aluminum LED lamp tube convenient for heat dissipation of claim 1, wherein the niobium silicide nitride composite microsphere is prepared by the following steps:
s1, weighing niobium silicide powder, dispersing the niobium silicide powder into deionized water, adding a silane coupling agent, stirring at room temperature for 2-5 hours, filtering, and drying to obtain surface-activated niobium silicide powder;
s2, dispersing the surface-activated niobium silicide powder into ammonia water with the mass fraction of 10%, adding resorcinol, carrying out ultrasonic homogenization, dropwise adding a formaldehyde aqueous solution with the mass fraction of 35%, carrying out continuous stirring treatment for 18-24 h at room temperature, filtering, collecting precipitate, and drying to obtain resorcinol formaldehyde polymer/niobium silicide composite microspheres;
s3, placing the resorcinol formaldehyde polymer/niobium silicide composite microspheres in a reaction furnace, heating to 400-500 ℃, and treating for 2-4 hours under an air condition to obtain porous carbon-coated niobium silicide composite microspheres;
and S4, cooling the reaction furnace to 120-180 ℃, carrying out heat preservation treatment for 1-2 hours, introducing nitrogen to replace air, heating to 880-930 ℃, carrying out heat preservation treatment for 2-4 hours, and then cooling to normal pressure and normal temperature to obtain the niobium silicide nitride composite microspheres.
6. The aluminum LED lamp tube convenient for heat dissipation of claim 1, wherein the preparation method of the modified acrylic adhesive comprises the following steps:
p1, mixing an acrylate monomer into ethyl acetate, and uniformly stirring to obtain an acrylic acid mixed solution;
and P2, mixing the niobium silicide nitride composite microspheres and diethoxy dimethyl silane into ethyl acetate, ultrasonically dispersing until the mixture is uniform, then dropwise adding the mixture into the acrylic mixed solution which is continuously stirred, and after dropwise adding, continuously stirring and dispersing for 1-2 hours to obtain an acrylic/composite microsphere mixed solution;
and P3, pouring the acrylic acid/composite microsphere mixed solution into a reflux condensing device, heating to 75-80 ℃ under the protection of nitrogen, adding azobisisobutyronitrile, reacting for 2-4 h, and cooling to room temperature to obtain the modified acrylic acid adhesive.
7. The aluminum LED lamp tube for facilitating heat dissipation of claim 1, wherein the acrylic ester monomers in P1 comprise acrylic acid, methacrylic acid, hydroxyethyl acrylate and hydroxyethyl methacrylate.
8. The aluminum LED lamp tube convenient for heat dissipation as claimed in claim 1, wherein the mass ratio of the modified acrylic adhesive to the curing agent is 100: 6-10, and the curing agent is an isocyanate curing agent or an epoxy curing agent.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004102014A (en) * 2002-09-11 2004-04-02 Fuji Photo Film Co Ltd Lithographic printing master plate
JP2011113876A (en) * 2009-11-27 2011-06-09 Fdk Corp Led type illumination device
CN103511858A (en) * 2012-06-21 2014-01-15 深圳市通普科技有限公司 Led lamp tube
CN104425088A (en) * 2013-08-19 2015-03-18 富致科技股份有限公司 Over-current protection apparatus and battery assembly using same
CN107446528A (en) * 2017-08-04 2017-12-08 信利半导体有限公司 A kind of heat-conducting glue and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004102014A (en) * 2002-09-11 2004-04-02 Fuji Photo Film Co Ltd Lithographic printing master plate
JP2011113876A (en) * 2009-11-27 2011-06-09 Fdk Corp Led type illumination device
CN103511858A (en) * 2012-06-21 2014-01-15 深圳市通普科技有限公司 Led lamp tube
CN104425088A (en) * 2013-08-19 2015-03-18 富致科技股份有限公司 Over-current protection apparatus and battery assembly using same
CN107446528A (en) * 2017-08-04 2017-12-08 信利半导体有限公司 A kind of heat-conducting glue and preparation method thereof

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