CN114406492A - Method and system for laser cutting of wafer - Google Patents
Method and system for laser cutting of wafer Download PDFInfo
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- CN114406492A CN114406492A CN202210037401.9A CN202210037401A CN114406492A CN 114406492 A CN114406492 A CN 114406492A CN 202210037401 A CN202210037401 A CN 202210037401A CN 114406492 A CN114406492 A CN 114406492A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a method and a system for laser cutting of a wafer, belonging to the technical field of laser cutting of the wafer.
Description
Technical Field
The invention relates to wafer laser cutting, in particular to a wafer laser cutting method, and further relates to a wafer laser cutting system, belonging to the technical field of wafer laser cutting.
Background
The prior art has the following problems when carrying out wafer laser cutting:
1. the clamping and fixing adopted by the fixing mode of the wafer leads to that the wafer is easy to damage;
2. in the prior art, the combined operation of feeding and discharging wafers and leading out waste materials cannot be carried out continuously;
3. no proper frame structure combined with the laser cutting device is used for fixing and continuously operating the wafer;
a method and system for laser dicing a wafer is designed to optimize the above problems.
Disclosure of Invention
The present invention is directed to a method and system for laser dicing a wafer.
The purpose of the invention can be achieved by adopting the following technical scheme:
a wafer laser cutting method comprises wafer fixing equipment used for the wafer laser cutting method, the fixing equipment comprises a wafer conveying assembly, a side support frame assembly is installed at the top of the wafer conveying assembly, a rotating frame assembly is arranged in the middle of the side support frame assembly, a wafer adsorption guiding assembly capable of adsorbing and guiding wafers and guiding waste materials is arranged on the rotating frame assembly, an inner adjusting ring is installed at the top of the side support frame assembly, sliding grooves are formed in the top of the inner adjusting ring at equal intervals along the ring portion of the inner adjusting ring, a pneumatic clamping assembly capable of sliding in the sliding grooves is arranged on the inner side of the sliding grooves, an L-shaped fixing piece is installed at the position, close to the edge, of the top of the inner adjusting ring, an outer gear ring assembly capable of sliding in the bottom of the end of the L-shaped fixing piece is clamped at the bottom of the end of the L-shaped fixing piece, and an outer gear ring assembly capable of being adjusted in a horizontal rotary mode is arranged at the top of one side of the side support frame assembly And the outer gear ring assembly is matched with the pneumatic clamping assembly.
The operation of a transmission motor is controlled by a central control module, the transmission motor drives a transmission belt to move, wafers are placed on the transmission belt at equal intervals and are transmitted by the transmission belt, a rotating motor is started to rotate to enable a second electric telescopic rod to face the transmission belt, then the second electric telescopic rod is started to drive a first suction disc to abut against the wafers and start a first adsorption air pump to adsorb the wafers, a rotating drum of the rotating motor is started to drive the first suction disc on the second electric telescopic rod to be parallel to an inner adjusting ring and start the second electric telescopic rod to move to the position above the inner adjusting ring, an adjusting motor is started to drive a gear disc to rotate, an outer gear ring is driven by the gear disc, a convex part is driven by an outer gear ring to abut against an adjusting rod, the I-shaped sliding block is adjusted to move, a clamping disc is driven by the I-shaped sliding block to move to the outer side of the wafers, and the air pump is started to generate the function of air jacking from the wafers, cutting by adopting laser cutting equipment, starting a rotating motor again to drive a middle fixed disk to rotate to be parallel to an inner adjusting ring, starting a first electric telescopic rod to drive the middle fixed disk, a side connecting rod and a ring-shaped adsorption frame to move, starting a second adsorption air pump to adsorb the outer ring of the cut wafer, starting a third electric telescopic rod to enable a second sucker to abut against the other wafer to be adsorbed and cut, starting a third adsorption air pump to adsorb, reversely moving an adjusting motor, enabling a clamping disk to reset through the cooperation of an inner sliding rod, an outer sliding cylinder and a reset spring, loosening the fixation of waste materials, starting the rotating motor to rotate to enable the fixed disk to face a conveying belt, then starting a second adsorption air pump to place the waste materials on the conveying belt to be led out, then starting the third electric telescopic rod to be above the inner adjusting ring, starting an adjusting motor to adjust a gear disk, and the outer gear ring is adjusted by the gear disc to move the adjusting convex part, the clamping disc is adjusted by the adjusting convex part to clamp the wafer, and the circular operation is repeated.
Preferably, the wafer conveying assembly comprises a conveying motor, a conveying belt, a side fixing plate, a driving roller and a driven roller, wherein the driving roller is arranged at one end of the inner side of the side fixing plate through a bearing, the driven roller is arranged at the other end of the inner side of the side fixing plate through a bearing, the conveying belt is sleeved on the outer side of the driving roller and the driven roller, the conveying motor is arranged in the middle of one end of the outer side of the side fixing plate, and the output end of the conveying motor is installed to penetrate through the driving roller of the side fixing plate.
Preferably, the swivel mount subassembly includes that side support frame subassembly includes side bearer and roof side board, the side bearer is installed to the top middle part department of side fixed plate, the roof side board is installed at the top of side bearer, the interior bottom department of roof side board is equipped with the swivel mount subassembly.
Preferably, the swivel mount subassembly includes rotating electrical machines, rotary drum, well connecting rod and side L template, the outside bottom department of top side board installs the side L template, the outside middle part department of side L template installs rotating electrical machines, rotating electrical machines's output runs through the rotary drum is installed to the side L template, just the opposite side of rotary drum is established the inboard bottom department of top side board, the connecting rod in the equidistant installation of the outside middle part of rotary drum.
Preferably, the wafer adsorbs leads and send the subassembly to include second electric telescopic handle, first sucking disc, well fixed disk, side connecting rod, loop type absorption frame, first electric telescopic handle, second sucking disc and third electric telescopic handle, and second electric telescopic handle is installed to the one end of a set of well connecting rod, first sucking disc is installed to second electric telescopic handle's output, and first electric telescopic handle is installed to the one end of a set of well connecting rod, just well fixed disk is installed to first electric telescopic handle's output, the side connecting rod is installed to the equidistant outside of well fixed disk, just the loop type absorption frame is installed to the other end of side connecting rod, third electric telescopic handle is installed to the one end of well connecting rod, just the second sucking disc is installed to third electric telescopic handle's output.
Preferably, the pneumatic clamping assembly includes an air pump, an i-shaped slider, an outer sliding cylinder, an inner sliding rod, an adjusting rod and a clamping disk, the i-shaped slider capable of sliding inside the sliding chute is disposed inside the sliding chute, the clamping disk is mounted on the top of the i-shaped slider, the inner sliding rod is mounted at one end of the inner side of the sliding chute, the outer sliding cylinder is sleeved outside the inner sliding rod, a return spring is mounted between the inner end of the outer sliding cylinder and the inner sliding rod, the i-shaped slider is mounted at the outer end of the outer sliding cylinder, the adjusting rod is mounted at one end of the bottom of the i-shaped slider, the air pump is disposed at the bottom of the inner adjusting ring, and the output end of the air pump is communicated with the clamping disk through a pipeline.
Preferably, the outer gear ring component comprises an outer gear ring, an annular limiting ring and an adjusting convex piece, the annular limiting ring which can slide at the end bottom of the L-shaped fixing piece is arranged at the end bottom of the L-shaped fixing piece, the outer gear ring is installed at the top of the annular limiting ring, and the adjusting convex piece which is matched with the adjusting rod is arranged on the inner side of the outer gear ring.
Preferably, horizontal position rotating assembly includes accommodate motor, L type fixing base and toothed disc, L type fixing base is installed to the side top department of roof curb plate, accommodate motor is installed to the bottom middle part department of L type fixing base, just accommodate motor's output runs through toothed disc is installed to L type fixing base, toothed disc with outer gear ring intermeshing.
A system for laser cutting of a wafer comprises a wafer fixing equipment control method used for the wafer laser cutting method, and the control method comprises the following steps:
step 1: a central control module is adopted to control the operation of a conveying motor, and the conveying motor drives a conveying belt to move;
step 2: placing wafers on a conveyor belt at equal intervals and transmitting the wafers through the conveyor belt;
and step 3: starting the rotating motor to rotate to enable the second electric telescopic rod to face the conveying belt, then starting the second electric telescopic rod to drive the first suction disc to abut against the wafer, and starting the first adsorption air pump to adsorb the wafer;
and 4, step 4: starting a rotating motor to rotate the rotary drum to drive a first suction disc on the second electric telescopic rod to be parallel to the inner adjusting ring and starting the second electric telescopic rod to move to the position above the inner adjusting ring;
and 5: starting an adjusting motor to drive a gear disc to rotate, driving an outer gear ring through the gear disc, driving an adjusting convex piece to abut against an adjusting rod through the outer gear ring, further adjusting the movement of an I-shaped sliding block, driving a clamping disc to move to the outer side of the wafer through the I-shaped sliding block, and starting an air pump to generate air jacking from the wafer;
step 6: after the laser cutting equipment is used for cutting, the rotating motor is started again to drive the middle fixed disk to rotate to be parallel to the inner adjusting ring, then the first electric telescopic rod is started to drive the middle fixed disk, the side connecting rods and the annular adsorption frame to move, then the second adsorption air pump is started to adsorb the outer ring of the cut wafer, and meanwhile, the third electric telescopic rod is started to enable the second sucker of the third electric telescopic rod to abut against the other wafer needing to be subjected to adsorption cutting to start the third adsorption air pump to adsorb;
and 7: the reverse movement adjusting motor resets the clamping disc through the matching of the inner sliding rod, the outer sliding cylinder and the reset spring, then loosens the fixation of the waste material, starts the rotating motor to rotate so that the fixed disc faces the conveyor belt, and then starts the second adsorption air pump to lead the waste material out of the conveyor belt;
and 8: and then starting a third electric telescopic rod to be above the inner adjusting ring, starting an adjusting motor to adjust the gear disc, adjusting the outer gear ring through the gear disc to drive the adjusting convex part to move, adjusting the clamping disc to clamp the wafer through the adjusting convex part, and circularly working in cycles.
The invention has the beneficial technical effects that:
the invention provides a method and a system for laser cutting of a wafer, which adopts a central control module to control a transmission motor to operate, drives the transmission belt to move through the transmission motor, equally spaces the wafer on the transmission belt and transmits the wafer through the transmission belt, starts a rotating motor to rotate so that a second electric telescopic rod faces the transmission belt, then starts a second electric telescopic rod to drive a first suction disc to abut against the wafer and starts a first adsorption air pump to adsorb the wafer, starts a rotating drum of the rotating motor to drive the first suction disc on the second electric telescopic rod to be parallel to an inner adjusting ring and starts the second electric telescopic rod to move to the upper part of the inner adjusting ring, starts an adjusting motor to drive a gear disc to rotate, drives an outer gear ring through the gear disc, drives an adjusting convex piece to abut against the adjusting rod through the outer gear ring, further adjusts the movement of an I-shaped sliding block, drives a clamping disc to move to the outer side of the wafer through the I-shaped sliding block and starts the air pump to generate the function of ejecting gas from the wafer, cutting by adopting laser cutting equipment, starting a rotating motor again to drive a middle fixed disk to rotate to be parallel to an inner adjusting ring, starting a first electric telescopic rod to drive the middle fixed disk, a side connecting rod and a ring-shaped adsorption frame to move, starting a second adsorption air pump to adsorb the outer ring of the cut wafer, starting a third electric telescopic rod to enable a second sucker to abut against the other wafer to be adsorbed and cut, starting a third adsorption air pump to adsorb, reversely moving an adjusting motor, enabling a clamping disk to reset through the cooperation of an inner sliding rod, an outer sliding cylinder and a reset spring, loosening the fixation of waste materials, starting the rotating motor to rotate to enable the fixed disk to face a conveying belt, then starting a second adsorption air pump to place the waste materials on the conveying belt to be led out, then starting the third electric telescopic rod to be above the inner adjusting ring, starting an adjusting motor to adjust a gear disk, and the outer gear ring is adjusted by the gear disc to move the adjusting convex part, the clamping disc is adjusted by the adjusting convex part to clamp the wafer, and the circular operation is repeated.
Drawings
FIG. 1 is a schematic view of an overall first perspective structure of an apparatus in accordance with a preferred embodiment of a method and system for laser dicing a wafer according to the invention;
FIG. 2 is a schematic perspective view of an apparatus according to a preferred embodiment of the present invention, taken from a second perspective, illustrating a laser dicing method and system for wafer dicing;
FIG. 3 is a perspective view of a wafer holder assembly and a wafer loading and unloading assembly in combination with a first perspective view according to a preferred embodiment of the method and system for laser dicing a wafer according to the invention;
FIG. 4 is a perspective view of a wafer holder assembly and a wafer loading and unloading assembly in a second perspective view in accordance with a preferred embodiment of the method and system for laser dicing a wafer of the present invention;
FIG. 5 is a schematic view of a first perspective view of a clamp ring assembly in accordance with a preferred embodiment of the method and system for laser cutting a wafer in accordance with the present invention;
FIG. 6 is a second perspective view of a clamp ring assembly in accordance with a preferred embodiment of the method and system for laser cutting wafers of the present invention;
FIG. 7 is an enlarged view of a preferred embodiment of a method and system for laser dicing a wafer according to the invention at structure a;
FIG. 8 is a schematic view of a buffer cylinder assembly according to a preferred embodiment of the method and system for laser dicing a wafer according to the invention.
In the figure: 1-side fixing plate, 2-conveyor belt, 3-rotary drum, 4-side frame, 5-rotary motor, 6-top side plate, 7-inner adjusting ring, 8-L type fixing piece, 9-conveyor motor, 10-outer gear ring, 11-L type fixing base, 13-gear plate, 14-middle connecting rod, 15-side L type plate, 16-adjusting motor, 17-annular adsorption frame, 18-side connecting rod, 19-middle fixing plate, 20-first electric telescopic rod, 21-first suction cup, 22-second electric telescopic rod, 23-second suction cup, 24-third electric telescopic rod, 25-clamping plate, 26-chute, 27-adjusting convex piece, 28-adjusting rod, 29-annular limiting ring, 30-I-shaped sliding block, 31-outer sliding cylinder, 32-inner sliding rod and 33-return spring.
Detailed Description
In order to make the technical solutions of the present invention more clear and definite for those skilled in the art, the present invention is further described in detail below with reference to the examples and the accompanying drawings, but the embodiments of the present invention are not limited thereto.
As shown in fig. 1-8, the method for laser cutting a wafer according to this embodiment includes a wafer fixing apparatus for the method for laser cutting a wafer, the fixing apparatus includes a wafer transferring assembly, a side supporting frame assembly is mounted at a top of the wafer transferring assembly, a rotating frame assembly is disposed at a middle portion of the side supporting frame assembly, a wafer adsorbing and guiding assembly capable of adsorbing and guiding a wafer and guiding a waste material is disposed on the rotating frame assembly, an inner adjusting ring 7 is mounted at a top of the side supporting frame assembly, sliding grooves 26 are formed at a top portion of the inner adjusting ring 7 at equal intervals along a ring portion of the inner adjusting ring 7, a pneumatic clamping assembly capable of sliding inside the sliding grooves 26 is disposed inside the sliding grooves 26, an L-shaped fixing member 8 is mounted at a top portion of the inner adjusting ring 7 near a side portion, an outer gear ring assembly capable of sliding at a bottom portion of the L-shaped fixing member 8 is clamped at a bottom portion of the L-shaped fixing member 8, and a horizontal direction rotating assembly capable of adjusting an outer gear ring assembly is arranged at the top of one side of the side support frame assembly, and the outer gear ring assembly is matched with the pneumatic clamping assembly.
A central control module is adopted to control a transmission motor 9 to operate, the transmission motor 9 drives a transmission belt 2 to move, wafers are placed on the transmission belt 2 at equal intervals and are transmitted through the transmission belt 2, a rotating motor 5 is started to rotate, a second electric telescopic rod 22 faces the transmission belt 2, then the second electric telescopic rod 22 is started to drive a first suction cup 21 to abut against the wafers and a first adsorption air pump is started to adsorb the wafers, the rotating motor 5 is started to rotate a rotary drum 3 to drive the first suction cup 21 on the second electric telescopic rod 22 to be parallel to an inner adjusting ring 7 and start the second electric telescopic rod 22 to move to be above the inner adjusting ring 7, an adjusting motor 16 is started to drive a gear disc 13 to rotate, an outer gear ring 10 is driven through the gear disc 13, an adjusting convex piece 27 is driven to abut against an adjusting rod 28 through the outer gear ring 10, and further the I-shaped sliding block 30 is adjusted to move, a clamping disc 25 is driven to move to the outer side of the wafers through the I-shaped sliding block 30 and the air pump is started to generate the function of air jacking from the wafers, after cutting by adopting laser cutting equipment, starting the rotary motor 5 again to drive the middle fixed disk 19 to rotate to be parallel to the inner adjusting ring 7, then starting the first electric telescopic rod 20 to drive the middle fixed disk 19, the side connecting rod 18 and the annular adsorption frame 17 to move, then starting the second adsorption air pump to adsorb the outer ring of the cut wafer, simultaneously starting the third electric telescopic rod 24 to enable the second sucker 23 to abut against another wafer to be subjected to adsorption and cutting, starting the third adsorption air pump to adsorb, reversely moving the adjusting motor 16, resetting the clamping disk 25 through the cooperation of the inner sliding rod 32, the outer sliding cylinder 31 and the reset spring 33, then loosening the fixation of the waste materials, then starting the rotary motor 5 to rotate to enable the fixed disk 19 to face the conveying belt 2, then starting the second adsorption air pump to lead the waste materials out on the conveying belt 2, and then starting the third electric telescopic rod 24 to be above the inner adjusting ring 7, the adjusting motor 16 is started to adjust the gear disc 13, the outer gear ring 10 is adjusted through the gear disc 13 to drive the adjusting convex piece 27 to move, the clamping disc 25 is adjusted through the adjusting convex piece 27 to clamp the wafer, and the circular operation is repeated.
In this embodiment, wafer conveying subassembly includes conveying motor 9, conveyer belt 2, side fixing plate 1, initiative cylinder and driven cylinder, the inboard one end of side fixing plate 1 is equipped with initiative cylinder through the bearing, the inboard other end of side fixing plate 1 is equipped with driven cylinder through the bearing, the outside cover of initiative cylinder and driven cylinder is equipped with conveyer belt 2, conveying motor 9 is installed to the outside one end middle part department of side fixing plate 1, and conveying motor 9's output is installed and is run through the initiative cylinder of side fixing plate 1.
In this embodiment, the swivel mount assembly includes that side support frame assembly includes side bearer 4 and roof side plate 6, and side bearer 4 is installed to the top middle part department of side fixed plate 1, and roof side plate 6 is installed at the top of side bearer 4, and the interior bottom department of roof side plate 6 is equipped with the swivel mount assembly.
In this embodiment, the swivel mount subassembly includes rotating electrical machines 5, rotary drum 3, well connecting rod 14 and side L template 15, and side L template 15 is installed to the outside bottom department of top side board 6, and rotating electrical machines 5 is installed to the outside middle part department of side L template 15, and rotating electrical machines 5's output runs through side L template 15 and installs rotary drum 3, and the opposite side of rotary drum 3 is established in 6 inboard bottoms departments of top side board, and connecting rod 14 in the equidistant installation in the outside middle part of rotary drum 3.
In this embodiment, the wafer adsorbing and guiding assembly includes a second electric telescopic rod 22, a first suction cup 21, a middle fixing disc 19, a side connecting rod 18, a ring-shaped adsorption frame 17, a first electric telescopic rod 20, a second suction cup 23 and a third electric telescopic rod 24, the second electric telescopic rod 22 is installed at one end of a group of middle connecting rods 14, the first suction cup 21 is installed at the output end of the second electric telescopic rod 22, the first electric telescopic rod 20 is installed at one end of a group of middle connecting rods 14, the middle fixing disc 19 is installed at the output end of the first electric telescopic rod 20, the side connecting rods 18 are installed at equal intervals outside the middle fixing disc 19, the ring-shaped adsorption frame 17 is installed at the other end of the side connecting rods 18, the third electric telescopic rod 24 is installed at one end of the middle connecting rod 14, and the second suction cup 23 is installed at the output end of the third electric telescopic rod 24.
In this embodiment, the pneumatic clamping assembly includes an air pump, an i-shaped slider 30, an outer sliding cylinder 31, an inner sliding rod 32, an adjusting rod 28 and a clamping disk 25, the i-shaped slider 30 capable of sliding inside the sliding chute 26 is disposed inside the sliding chute 26, the clamping disk 25 is mounted on the top of the i-shaped slider 30, the inner sliding rod 32 is mounted at one end inside the sliding chute 26, the outer sliding cylinder 31 is sleeved outside the inner sliding rod 32, a return spring 33 is mounted between the inner end of the outer sliding cylinder 31 and the inner sliding rod 32, the i-shaped slider 30 is mounted at the outer end of the outer sliding cylinder 31, the adjusting rod 28 is mounted at one end of the bottom of the i-shaped slider 30, the air pump is disposed at the bottom of the inner adjusting ring 7, and the output end of the air pump is communicated with the clamping disk 25 through a pipeline.
In this embodiment, the external gear ring assembly includes an external gear ring 10, an annular retainer ring 29 and an adjusting protrusion 27, the bottom of the L-shaped fixing member 8 is provided with the annular retainer ring 29 which can slide at the bottom of the L-shaped fixing member 8, the top of the annular retainer ring 29 is provided with the external gear ring 10, and the inner side of the external gear ring 10 is provided with the adjusting protrusion 27 which is matched with the adjusting rod 28.
In this embodiment, the horizontal direction rotating assembly includes an adjusting motor 16, an L-shaped fixing seat 11 and a gear plate 13, the L-shaped fixing seat 11 is installed at the top of the side of the top side plate 6, the adjusting motor 16 is installed at the middle of the bottom of the L-shaped fixing seat 11, the output end of the adjusting motor 16 penetrates through the L-shaped fixing seat 11 to install the gear plate 13, and the gear plate 13 is meshed with the outer gear ring 10.
A system for laser cutting of a wafer comprises a wafer fixing equipment control method used for the wafer laser cutting method, and the control method comprises the following steps:
step 1: a central control module is adopted to control the operation of the conveying motor 9, and the conveying motor 9 drives the conveying belt 2 to move;
step 2: placing wafers on the conveyor belt 2 at equal intervals and transmitting the wafers through the conveyor belt 2;
and step 3: starting the rotating motor 5 to rotate to enable the second electric telescopic rod 22 to face the conveyor belt 2, then starting the second electric telescopic rod 22 to drive the first suction cup 21 to abut against the wafer, and starting the first adsorption air pump to adsorb the wafer;
and 4, step 4: starting the rotating motor 5 to rotate the rotating drum 3 to drive the first suction cup 21 on the second electric telescopic rod 22 to be parallel to the inner adjusting ring 7 and starting the second electric telescopic rod 22 to move to the position above the inner adjusting ring 7;
and 5: starting an adjusting motor 16 to drive a gear disc 13 to rotate, driving an outer gear ring 10 through the gear disc 13, driving an adjusting convex piece 27 to abut against an adjusting rod 28 through the outer gear ring 10, further adjusting an I-shaped sliding block 30 to move, driving a clamping disc 25 to move to the outer side of a wafer through the I-shaped sliding block 30, and starting an air pump to jack up air generated by the wafer;
step 6: after the laser cutting equipment is used for cutting, the rotating motor 5 is started again to drive the middle fixed disk 19 to rotate to be parallel to the inner adjusting ring 7, then the first electric telescopic rod 20 is started to drive the middle fixed disk 19, the side connecting rod 18 and the annular adsorption frame 17 to move, then the second adsorption air pump is started to adsorb the outer ring of the cut wafer, and meanwhile, the third electric telescopic rod 24 is started to enable the second suction cup 23 to abut against another wafer needing to be subjected to adsorption and cutting to start the third adsorption air pump to adsorb;
and 7: the reverse movement adjusting motor 16 resets the clamping disc 25 through the cooperation of the inner sliding rod 32, the outer sliding cylinder 31 and the reset spring 33, then releases the fixation of the waste material, then starts the rotating motor 5 to rotate to enable the fixed disc 19 to face the conveyor belt 2, and then starts the second adsorption air pump to place the waste material on the conveyor belt 2 for leading out;
and step 9: then, the third electric telescopic rod 24 is started to be positioned above the inner adjusting ring 7, the adjusting motor 16 is started to adjust the gear disc 13, the outer gear ring 10 is adjusted through the gear disc 13 to drive the adjusting convex piece 27 to move, the clamping disc 25 is adjusted through the adjusting convex piece 27 to clamp the wafer, and the circular operation is repeated.
The above are only further embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can substitute or change the technical solution of the present invention and its concept within the scope of the present invention.
Claims (9)
1. A method for laser cutting a wafer is characterized in that: the wafer fixing equipment comprises a wafer conveying assembly, a side support frame assembly is installed at the top of the wafer conveying assembly, a rotating frame assembly is arranged at the middle of the side support frame assembly, a wafer adsorption guiding assembly capable of adsorbing and guiding wafers and guiding wastes is arranged on the rotating frame assembly, an inner adjusting ring (7) is installed at the top of the side support frame assembly, sliding grooves (26) are formed in the top of the inner adjusting ring (7) along the ring part of the inner adjusting ring (7) at equal intervals, a pneumatic clamping assembly capable of sliding in the sliding grooves (26) is arranged on the inner side of the sliding grooves (26), an L-shaped fixing piece (8) is installed at the position, close to the edge, of the top of the inner adjusting ring (7), an outer gear ring assembly capable of sliding at the bottom of the L-shaped fixing piece (8) is clamped at the bottom of the end of the L-shaped fixing piece (8), and a horizontal direction rotating assembly capable of adjusting the outer gear ring assembly is arranged at the top of one side of the side support frame assembly, and the outer gear ring assembly is matched with the pneumatic clamping assembly.
2. The method of claim 1, further comprising: wafer conveying subassembly includes conveying motor (9), conveyer belt (2), side fixing plate (1), initiative cylinder and driven cylinder, the inboard one end of side fixing plate (1) is equipped with initiative cylinder through the bearing, the inboard other end of side fixing plate (1) is equipped with driven cylinder through the bearing, the outside cover of initiative cylinder and driven cylinder is equipped with conveyer belt (2), conveying motor (9) are installed to the outside one end middle part department of side fixing plate (1), just run through is installed to the output of conveying motor (9) the initiative cylinder of side fixing plate (1).
3. The method of claim 2, wherein: the swivel mount subassembly includes that side support frame subassembly includes side bearer (4) and top side board (6), side bearer (4) are installed to the top middle part department of side fixity board (1), top side board (6) are installed at the top of side bearer (4), the interior bottom department of top side board (6) is equipped with the swivel mount subassembly.
4. The method of claim 3, wherein: the swivel mount subassembly includes rotating electrical machines (5), rotary drum (3), well connecting rod (14) and side L template (15), the outside bottom department of top curb plate (6) installs side L template (15), the outside middle part department of side L template (15) installs rotating electrical machines (5), the output of rotating electrical machines (5) runs through rotary drum (3) are installed to side L template (15), just the opposite side of rotary drum (3) is established the inboard bottom department of top curb plate (6), connecting rod (14) in the equidistant installation of outside middle part of rotary drum (3).
5. The method of claim 4, wherein: the wafer adsorption and conveying assembly comprises a second electric telescopic rod (22), a first sucker (21), a middle fixed disc (19), side connecting rods (18), a ring-shaped adsorption frame (17), a first electric telescopic rod (20), a second sucker (23) and a third electric telescopic rod (24), wherein the second electric telescopic rod (22) is installed at one end of a group of middle connecting rods (14), the first sucker (21) is installed at the output end of the second electric telescopic rod (22), the first electric telescopic rod (20) is installed at one end of a group of middle connecting rods (14), the middle fixed disc (19) is installed at the output end of the first electric telescopic rod (20), the side connecting rods (18) are installed at the outer side of the middle fixed disc (19) at equal intervals, the ring-shaped adsorption frame (17) is installed at the other end of the side connecting rods (18), and the third electric telescopic rod (24) is installed at one end of the middle connecting rod (14), and the output end of the third electric telescopic rod (24) is provided with a second sucker (23).
6. The method of claim 5, wherein: the pneumatic clamping assembly comprises an air pump, an I-shaped sliding block (30), an outer sliding cylinder (31), an inner sliding rod (32), an adjusting rod (28) and a clamping disc (25), the inner side of the sliding groove (26) is provided with a I-shaped sliding block (30) which can slide in the inner side of the sliding groove (26), the top of the I-shaped sliding block (30) is provided with a clamping disc (25), one end of the inner side of the sliding chute (26) is provided with an inner sliding rod (32), the outer side of the inner sliding rod (32) is sleeved with an outer sliding cylinder (31), and a return spring (33) is arranged between the inner end part of the outer sliding cylinder (31) and the inner sliding rod (32), an I-shaped sliding block (30) is arranged at the outer end part of the outer sliding cylinder (31), an adjusting rod (28) is arranged at one end of the bottom of the I-shaped sliding block (30), the bottom of the inner adjusting ring (7) is provided with an air pump, and the output end of the air pump is communicated with the clamping disc (25) through a pipeline.
7. The method of claim 6, wherein: the outer gear ring subassembly includes outer gear ring (10), annular spacing ring (29) and adjusts protruding piece (27), the end bottom department of L type mounting (8) is equipped with can the gliding annular spacing ring (29) of end bottom department of L type mounting (8), outer gear ring (10) are installed at the top of annular spacing ring (29), the inboard of outer gear ring (10) be equipped with adjust protruding piece (27) of regulation pole (28) and mutually supporting.
8. The method of claim 7, wherein: horizontal position rotating assembly includes accommodate motor (16), L type fixing base (11) and toothed disc (13), the side top department of top curb plate (6) installs L type fixing base (11), the end middle part department of L type fixing base (11) installs accommodate motor (16), just the output of accommodate motor (16) runs through toothed disc (13) are installed in L type fixing base (11), toothed disc (13) with outer gear ring (10) intermeshing.
9. The system for laser dicing a wafer according to claim 8, wherein: the control method of the wafer fixing equipment comprises the method for laser cutting of the wafer, and comprises the following steps:
step 1: the central control module is adopted to control the operation of the conveying motor (9), and the conveying motor (9) drives the conveying belt (2) to move;
step 2: wafers are placed on the conveyor belt (2) at equal intervals and are conveyed through the conveyor belt (2);
and step 3: starting a rotating motor (5) to rotate so that a second electric telescopic rod (22) faces the conveyor belt (2), then starting the second electric telescopic rod (22) to drive a first suction cup (21) to abut against the wafer, and starting a first adsorption air pump to adsorb the wafer;
and 4, step 4: starting a rotating motor (5) to rotate a rotating drum (3) to drive a first sucker (21) on a second electric telescopic rod (22) to be parallel to the inner adjusting ring (7) and starting the second electric telescopic rod (22) to move above the inner adjusting ring (7);
and 5: starting an adjusting motor (16) to drive a gear disc (13) to rotate, driving an outer gear ring (10) through the gear disc (13), driving an adjusting convex piece (27) to abut against an adjusting rod (28) through the outer gear ring (10), further adjusting an I-shaped sliding block (30) to move, driving a clamping disc (25) to move to the outer side of the wafer through the I-shaped sliding block (30), and starting an air pump to generate air jacking from the wafer;
step 6: after the laser cutting equipment is used for cutting, the rotating motor (5) is started again to drive the middle fixed disk (19) to rotate to be parallel to the inner adjusting ring (7), then the first electric telescopic rod (20) is started to drive the middle fixed disk (19), the side connecting rod (18) and the annular adsorption frame (17) to move, then the second adsorption air pump is started to adsorb the outer ring of the cut wafer, and meanwhile the third electric telescopic rod (24) is started to enable the second suction cup (23) to abut against another wafer needing to be adsorbed and cut to start the third adsorption air pump to adsorb;
and 7: the reverse movement adjusting motor (16) is matched with the reset spring (33) through the inner sliding rod (32), the outer sliding cylinder (31) and the reset spring to reset the clamping disc (25), then the fixation of the waste material is released, then the rotating motor (5) is started to rotate to enable the fixed disc (19) to face the conveyor belt (2), and then the second adsorption air pump is started to place the waste material on the conveyor belt (2) to be led out;
and step 9: then, the third electric telescopic rod (24) is started to be arranged above the inner adjusting ring (7), the adjusting motor (16) is started to adjust the gear disc (13), the outer gear ring (10) is adjusted through the gear disc (13) to drive the adjusting convex piece (27) to move, the clamping disc (25) is adjusted through the adjusting convex piece (27) to clamp the wafer, and the circular operation is repeated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210037401.9A CN114406492A (en) | 2022-01-13 | 2022-01-13 | Method and system for laser cutting of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210037401.9A CN114406492A (en) | 2022-01-13 | 2022-01-13 | Method and system for laser cutting of wafer |
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| Publication Number | Publication Date |
|---|---|
| CN114406492A true CN114406492A (en) | 2022-04-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210037401.9A Withdrawn CN114406492A (en) | 2022-01-13 | 2022-01-13 | Method and system for laser cutting of wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115815834A (en) * | 2022-12-09 | 2023-03-21 | 安徽大学绿色产业创新研究院 | Laser grooving equipment for wafer processing |
-
2022
- 2022-01-13 CN CN202210037401.9A patent/CN114406492A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115815834A (en) * | 2022-12-09 | 2023-03-21 | 安徽大学绿色产业创新研究院 | Laser grooving equipment for wafer processing |
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Application publication date: 20220429 |