CN114405849A - Integrated circuit device for intelligent chip manufacturing - Google Patents

Integrated circuit device for intelligent chip manufacturing Download PDF

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Publication number
CN114405849A
CN114405849A CN202210079078.1A CN202210079078A CN114405849A CN 114405849 A CN114405849 A CN 114405849A CN 202210079078 A CN202210079078 A CN 202210079078A CN 114405849 A CN114405849 A CN 114405849A
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Prior art keywords
chip
detection
module
integrated circuit
sorting
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CN202210079078.1A
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马利娟
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Shenzhen Zhuorexin Electronic Co ltd
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Shenzhen Zhuorexin Electronic Co ltd
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Priority to CN202210079078.1A priority Critical patent/CN114405849A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02Measures preceding sorting, e.g. arranging articles in a stream orientating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34Sorting according to other particular properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36Sorting apparatus characterised by the means used for distribution
    • B07C5/361Processing or control devices therefor, e.g. escort memory
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36Sorting apparatus characterised by the means used for distribution
    • B07C5/361Processing or control devices therefor, e.g. escort memory
    • B07C5/362Separating or distributor mechanisms

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Abstract

The invention provides an integrated circuit device for chip intelligent manufacturing, comprising: the chip sorting system comprises a chip conveying module, a chip detection module, a control center module, an integrated circuit module and a chip sorting module; the chip conveying module receives the conveyed chips, conveys the chips to the chip detection table and conveys the chips out after the chip detection is finished; the chip detection module is connected with the control center module, detects the chip on the chip detection table and transmits detection data to the control center module; the control center module is also connected with the integrated circuit module, analyzes the detection data to obtain a detection result, and switches on the integrated circuit module according to the detection result; the integrated circuit module is connected with the chip sorting module, and the chip sorting module sorts the chips according to the circuit connection condition. The invention adopts the integrated circuit to realize the intelligent sorting of the chips, does not need human participation, reduces the manpower consumption, and has high detection efficiency and accuracy rate of the chips.

Description

Integrated circuit device for intelligent chip manufacturing
Technical Field
The invention relates to the technical field of intelligent chip manufacturing, in particular to an integrated circuit device for intelligent chip manufacturing.
Background
The chip technology belongs to high and sharp and novel significant complex technology, and is a strategic high place for world countries. The chip manufacturing industry has the dual features of being capital intensive and technology intensive, being in the middle of the entire industry chain of chips, an important ring in the entire industry chain. In a new era of rapid development of informatization, digitization, networking and intellectualization, the chip manufacturing industry is not only a high-tech industry, but also a basic industry influencing the development level of other industries.
The chip products are almost applied to various industries, relate to the aspects of daily life, and have higher requirements on chip manufacturing along with wider application of the chips, so that the chip products have more and more requirements on quantity and quality. At present, in the intelligent chip manufacturing process, manual participation is often needed in the chip detection process, so that the efficiency is low, the accuracy is low, and a large amount of manpower is consumed.
Disclosure of Invention
The present invention is directed to an integrated circuit device for smart chip manufacturing, which solves the above-mentioned problems of the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: an integrated circuit device for smart fabrication of chips, comprising: the chip sorting system comprises a chip conveying module, a chip detection module, a control center module, an integrated circuit module and a chip sorting module; the chip conveying module is used for receiving chips conveyed by a chip manufacturing assembly line, conveying the chips to a chip detection table and conveying the chips out after the chips are detected; the chip detection module is connected with the control center module and used for detecting the chip on the chip detection table and transmitting detection data to the control center module; the control center module is also connected with the integrated circuit module and used for analyzing the detection data to obtain a detection result and connecting an integrated circuit in the integrated circuit module according to the detection result; the integrated circuit module is connected with the chip sorting module and used for enabling the chip sorting module to sort the chips according to the connection condition of the integrated circuit.
Preferably, the chip conveying module is further connected to the control center module, when the control center module receives the detection data of the chip transmitted by the chip detection module, the control center module sends a chip moving signal to the chip conveying module, the chip conveying module conveys the chip on the chip detection table in a moving manner according to the chip moving signal, and the transmission speed is adjusted according to the analysis progress of the detection data of the chip by the control center module in the transmission process.
Preferably, the chip detection module includes: an appearance detection unit and a performance detection unit; the appearance detection unit is used for detecting the appearance of the chip and comprises: the performance detection unit is used for detecting the performance of the chip through analog signals, and respectively carrying out integral detection and block detection on the chip to obtain the performance detection data of the chip; and when the appearance detection unit and the performance detection unit detect the chip on the chip detection table, the chip detection table is moved to the appearance detection unit for appearance detection, and after the appearance detection is finished, the chip detection table is moved to the performance detection unit for performance detection.
Preferably, the control center module includes: the device comprises a signal transceiving unit, a result analysis unit and a control processing unit; the signal receiving and sending unit is used for receiving the detection data of the chip transmitted by the chip detection module and sending signal information to the chip transmission module; the result analysis unit is connected with the signal transceiving unit and is used for analyzing the detection data of the chip received by the signal transceiving unit and determining whether the detection data of the chip belongs to the qualified range of the chip, if the detection data of the chip belongs to the qualified range of the chip, the detection result of the chip is qualified, and if the detection data of the chip does not belong to the qualified range of the chip, the detection result of the chip is unqualified, so that the detection result is obtained; the control processing unit is connected with the result analysis unit and used for calling the detection result, generating a control scheme for the integrated circuit in the integrated circuit module according to the detection result and controlling and executing the integrated circuit module.
Preferably, when obtaining the detection result, the result analysis unit respectively analyzes and determines the detection data of the chip, and includes: analyzing and judging the appearance detection data of the chip to obtain an appearance detection result and analyzing and judging the performance detection data to obtain a performance detection result, then comprehensively analyzing the appearance detection result and the performance detection result to determine the detection result of the chip, and labeling the indexes which cause disqualification in the appearance detection result and the performance detection result when the detection result of the chip is disqualified.
Preferably, the integrated circuit module includes a first integrated circuit and a second integrated circuit, the first integrated circuit is turned on when the detection result of the chip is qualified, so that the chip sorting module sorts the chip into a qualified chip collecting device when the first integrated circuit is turned on, and the second integrated circuit is turned on when the detection result of the chip is unqualified, so that the second integrated circuit drives the sorting arm in the chip sorting module to sort the chip into an unqualified chip collecting device when the second integrated circuit is turned on.
Preferably, the chip sorting module includes a plurality of sorting arms, the second integrated circuit includes a plurality of sorting branches, the sorting branches and the sorting arms are in a one-to-one correspondence relationship, when the control processing unit generates a control scheme for the integrated circuit in the integrated circuit module according to the detection result, if the appearance detection result is unqualified, the sorting branches are switched on for the unqualified appearance in the second integrated circuit, and if the performance detection result is unqualified, the sorting branches corresponding to the index with the unqualified performance index detection result in the index are further analyzed for the index in the performance detection result, and the sorting branches corresponding to the index with the unqualified performance index detection result in the index are determined and switched on.
Preferably, the number of the sorting branches and the sorting arms is two more than that of the performance indexes, and when the number of results with unqualified performance index detection results in the performance detection results exceeds one, the chips are sorted into the single collecting device.
Preferably, the appearance detection unit acquires image information of the chip on the chip detection table through an image acquisition device when detecting the appearance of the chip, and then identifies and analyzes the image information;
when the image acquisition device acquires the image information of the chip on the chip detection table, the image acquisition device acquires a close-range image by adopting multi-azimuth angles, and performs space construction on the acquired close-range image to obtain the image information of the chip;
when the image information is identified and analyzed, the method comprises the following steps:
acquiring parameters aiming at the image information of the chip to obtain size parameters of the chip, and calculating according to the size parameters to determine the size of the chip to obtain size detection data of the chip;
carrying out distribution identification on the image information of the chip, identifying the distribution condition of electronic elements in the chip, and obtaining distribution detection data of the chip;
and performing binarization gray level processing on the image information of the chip, and then performing connected domain analysis on the chip to obtain connected detection data of the chip.
Preferably, the adjusting of the transmission speed according to the analysis progress of the detection data of the chip by the control center module in the transmission process includes: acquiring the analysis progress condition of the detection data of the chip by the control center module in real time, and acquiring the process information of the control center module; performing time consumption estimation according to the information of the control center module, and determining the residual time of the distance of the control center module for completing the analysis of the detection data of the chip; and finishing forward acceleration adjustment or reverse deceleration adjustment on the analysis residual time of the detection data of the chip by combining the current transmission rate of the chip transmission module with the distance of the control center module.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of an integrated circuit device for smart chip fabrication according to the present invention;
FIG. 2 is a schematic diagram of an integrated circuit device for smart chip fabrication according to the present invention;
FIG. 3 is a schematic diagram of a chip detection module of an integrated circuit device for smart chip manufacturing according to the present invention;
FIG. 4 is a schematic diagram of a control center module in an integrated circuit device for smart chip manufacturing according to the present invention;
FIG. 5 is a diagram of an integrated circuit module of an integrated circuit device for smart chip fabrication according to the present invention.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
As shown in fig. 1, an embodiment of the present invention provides an integrated circuit device for chip smart manufacturing, including: the chip sorting system comprises a chip conveying module, a chip detection module, a control center module, an integrated circuit module and a chip sorting module; the chip conveying module is used for receiving chips conveyed by a chip manufacturing assembly line, conveying the chips to a chip detection table and conveying the chips out after the chips are detected; the chip detection module is connected with the control center module and used for detecting the chip on the chip detection table and transmitting detection data to the control center module; the control center module is also connected with the integrated circuit module and used for analyzing the detection data to obtain a detection result and connecting an integrated circuit in the integrated circuit module according to the detection result; the integrated circuit module is connected with the chip sorting module and used for enabling the chip sorting module to sort the chips according to the connection condition of the integrated circuit.
The above technical solution provides an integrated circuit device for chip intelligent manufacturing, including in the integrated circuit device: the chip sorting system comprises a chip conveying module, a chip detection module, a control center module, an integrated circuit module and a chip sorting module; the integrated circuit device carries out final detection and sorting on the manufactured chip in the intelligent chip manufacturing process, and the method comprises the following steps: firstly, a chip conveying module receives a chip conveyed by a production line in the chip manufacturing process, transfers the chip to a chip detection table, then carries out factory detection on the chip detection table by the chip detection module to obtain detection information of the chip, sends the detection information of the chip to a control center module, and simultaneously carries out mobile output on the chip detection table by the chip conveying module; the control center module analyzes the detection information of the chip to determine whether the chip is qualified or not, so as to obtain the detection result of the chip, the control center module switches on the integrated circuit in the integrated circuit module according to the detection result of the chip, the integrated circuit module is connected with the chip sorting module, the integrated circuit in the integrated module is respectively connected with the sorting arms in the chip sorting module, when the integrated circuit is switched on, the sorting arms can move, so as to move the chip into a corresponding container, so that the integrated circuit switches on the corresponding sorting arms in the chip sorting module, and finally, the chip which is moved and output by the chip conveying module is sorted into the corresponding result by the sorting arms corresponding to the detection result of the chip in the chip sorting module, so as to realize the sorting of the chip for qualification and disqualification.
Above-mentioned technical scheme passes through the integrated circuit module, chip letter sorting module and control center module have realized whether qualified differentiation to the chip according to the testing result of chip for automatic realization is to the letter sorting of chip, need not artificial participation, artifical spending and the human consumption has been reduced, and chip detection module is intelligent operation when examining the chip moreover, and not only detection efficiency is high, but also can make the detection data error rate of the chip that obtains low, and the accuracy is high, and then the accuracy of chip letter sorting module to chip letter sorting has been improved. In addition, the chip can be moved and output after being detected through the chip conveying module, so that the integrated circuit device can sort the chips according to the detection results of the chips, and the unqualified chips are prevented from flowing into the market with qualified chips, and the use of the chips is prevented from being influenced.
As shown in fig. 2, in an embodiment provided by the present invention, the chip delivery module is further connected to the control center module, when the control center module receives the detection data of the chip transmitted by the chip detection module, the control center module sends a chip moving signal to the chip delivery module, the chip delivery module moves and delivers the chip on the chip detection table according to the chip moving signal, and the transmission speed is adjusted according to the analysis progress of the detection data of the chip by the control center module during the transmission process.
In the technical scheme, the chip conveying module in the integrated circuit device is further connected with the control center module, the chip detection module transmits the detection data of the chip to the control center module after detecting the chip to obtain the detection data of the chip, the control center module sends a chip moving signal to the chip conveying module after receiving the detection data of the chip, the chip conveying module conveys the chip on the chip detection table after moving out the chip according to the chip moving signal, the chip conveying module obtains the progress of the control center module in analyzing the detection data of the chip in the chip conveying process, and the transmission speed is accelerated or decelerated according to the progress degree of the control center module in analyzing the detection data of the chip.
The technical proposal can ensure that the chip transmission module moves out the chip on the chip detection platform for transmission after the control center module receives the detection data obtained by the chip detection module for detecting the chip through the connection of the chip transmission module and the control center module, thereby avoiding the chip from not being detected completely and also avoiding the control center module from failing to judge whether the chip is qualified or not because the detection data of the chip which is not received completely is received, in addition, in the transmission process, the chip transmission module adjusts the transmission speed according to the progress of the analysis of the detection data of the chip by the control center module, thereby being capable of sorting the chip in the chip transmission module according to the detection result of the chip and avoiding the chip transmission module from transmitting the chip before the control center module obtains the detection result of the chip, thereby avoiding the inability to perform an invalid sort of chips.
As shown in fig. 3, in an embodiment provided by the present invention, the chip detection module includes: an appearance detection unit and a performance detection unit; the appearance detection unit is used for detecting the appearance of the chip and comprises: the performance detection unit is used for detecting the performance of the chip through analog signals, and respectively carrying out integral detection and block detection on the chip to obtain the performance detection data of the chip; and when the appearance detection unit and the performance detection unit detect the chip on the chip detection table, the chip detection table is moved to the appearance detection unit for appearance detection, and after the appearance detection is finished, the chip detection table is moved to the performance detection unit for performance detection.
The chip detection module in the technical scheme is divided into an appearance detection unit and a performance detection unit, when a chip on a chip detection table is detected by the appearance detection unit and the performance detection unit, the chip detection table is moved into the appearance detection unit to perform appearance detection, when the appearance detection is performed, the chip on the chip detection table is subjected to chip packaging detection and chip surface detection, so that chip appearance detection data are obtained, after the appearance detection is completed, the chip detection table is moved into the performance detection unit to perform performance detection, when the performance detection is performed, the whole performance detection and electronic element block detection in the chip are performed on the chip detection table through signal simulation, so that the performance detection data are obtained.
According to the technical scheme, the chip on the chip detection table is enabled to sequentially pass through the appearance detection unit and the performance detection unit to realize detection in the aspect of appearance and detection in the aspect of performance through the mobile chip detection table, the difficulty in moving the appearance detection unit and the performance detection unit can be avoided, the mobile chip is easy and convenient to detect, time consumption of detection in the aspect of appearance and detection in the aspect of performance during conversion can be reduced, the chip can be comprehensively detected through the appearance detection unit and the performance detection unit, the chip which finally leaves a factory is determined to be qualified in appearance and performance, and the quality of the chip is ensured. In addition, when the performance is detected, the performance state of the chip can be more comprehensively known by respectively carrying out overall detection and block detection on the chip, and the comprehensiveness of performance detection data of the chip is improved, so that the accuracy of chip detection is improved.
As shown in fig. 4, in an embodiment provided by the present invention, the control center module includes: the device comprises a signal transceiving unit, a result analysis unit and a control processing unit; the signal receiving and sending unit is used for receiving the detection data of the chip transmitted by the chip detection module and sending signal information to the chip transmission module; the result analysis unit is connected with the signal transceiving unit and is used for analyzing the detection data of the chip received by the signal transceiving unit and determining whether the detection data of the chip belongs to the qualified range of the chip, if the detection data of the chip belongs to the qualified range of the chip, the detection result of the chip is qualified, and if the detection data of the chip does not belong to the qualified range of the chip, the detection result of the chip is unqualified, so that the detection result is obtained; the control processing unit is connected with the result analysis unit and used for calling the detection result, generating a control scheme for the integrated circuit in the integrated circuit module according to the detection result and controlling and executing the integrated circuit module.
The control center module in the above technical solution includes: the device comprises a signal transceiving unit, a result analyzing unit and a control processing unit, wherein the signal transceiving unit is connected with the result analyzing unit, and the result analyzing unit is also connected with the control processing unit; when the control center module analyzes detection data and switches on an integrated circuit in the integrated circuit module according to a detection result, firstly, the signal transceiving unit is used for receiving the detection data of the chip transmitted by the chip detection module, then the result analysis unit analyzes the detection data of the chip received by the signal transceiving unit to determine whether the detection data of the chip belongs to the qualified range of the chip, when the detection data of the chip belongs to the qualified range of the chip, the detection result of the chip is qualified, and when the detection data of the chip does not belong to the qualified range of the chip, the detection result of the chip is unqualified, so that the detection result of the chip is obtained; and finally, the control processing unit calls the detection result of the chip obtained in the result analysis unit and generates a control scheme for the integrated circuit module according to the detection result so as to determine a connection scheme of the integrated circuit in the integrated circuit module and control the integrated circuit module to connect the integrated circuit according to the control scheme, wherein the signal transceiving unit sends a chip moving signal to the chip transmission module when the signal transceiving unit receives the detection data of the chip, and sends a signal for adjusting the transmission speed to the chip transmission module in the operation process of the result analysis unit and the control processing unit.
According to the technical scheme, the signal receiving and sending unit can better receive the detection data of the chip transmitted by the chip detection module and timely and accurately send the chip moving signal and the signal for adjusting the transmission speed to the chip transmission module, so that the cooperativity among all the module units of the integrated circuit device is improved, the accuracy of the integrated circuit device is further improved, and the integrated circuit device can smoothly sort the chips.
In an embodiment of the present invention, when obtaining the detection result, the result analyzing unit respectively analyzes and determines the detection data of the chip, including: analyzing and judging the appearance detection data of the chip to obtain an appearance detection result and analyzing and judging the performance detection data to obtain a performance detection result, then comprehensively analyzing the appearance detection result and the performance detection result to determine the detection result of the chip, and labeling the indexes which cause disqualification in the appearance detection result and the performance detection result when the detection result of the chip is disqualified.
In the above technical solution, when the result analyzing unit analyzes and determines the detection data of the chip respectively in the process of obtaining the detection result, the chip appearance detection data is analyzed and judged to obtain the appearance detection result and the performance detection data is analyzed and judged to obtain the performance detection result, when the chip appearance detection data is analyzed and judged, the detection data of each index in the chip appearance detection data is analyzed and judged to obtain the detection result of the appearance index, when the performance detection data is analyzed and judged, the detection data of each index in the performance detection data is analyzed and judged to obtain the detection result of the performance index, then the appearance detection result is determined according to the detection result of the appearance index and the performance detection result is determined according to the detection result of the performance index, and when the appearance detection result and the performance detection result are comprehensively analyzed and determined to determine the detection result of the chip, and when the detection result of the chip is unqualified, the indexes which cause the unqualified appearance detection result and performance detection result are also subjected to detection data and detection result label display.
According to the technical scheme, the appearance detection result and the performance detection result are comprehensively analyzed to determine the detection result of the chip, so that the detection result of the chip is determined to be unqualified when one piece of detection data does not belong to a qualified range, the sensitivity of the detection result of the chip is improved, the detection data and the detection result of the unqualified index are displayed in the detection result of the chip in a labeling mode, the reason why the detection result is unqualified can be more visually reflected by the detection result of the chip, and the solution can be efficiently and quickly obtained when the unqualified chip is processed.
As shown in fig. 5, in an embodiment provided by the present invention, the integrated circuit module includes a first integrated circuit and a second integrated circuit, the first integrated circuit is turned on when the detection result of the chip is qualified, so that the first integrated circuit causes the chip sorting module to sort the chip into a qualified chip collecting device when the first integrated circuit is turned on, and the second integrated circuit is turned on when the detection result of the chip is unqualified, so that the second integrated circuit drives the sorting arm in the chip sorting module to sort the chip into an unqualified chip collecting device when the second integrated circuit is turned on.
The integrated circuit module in the technical scheme comprises a first integrated circuit and a second integrated circuit, when the detection result of the chip is qualified, the chip sorting module can sort the chip with the qualified detection result into a qualified chip collecting device through the connection of the first integrated circuit, wherein the first integrated circuit is a fixed-frequency signal transmission circuit and is not connected with a sorting arm in the chip sorting module, and the chip transmitted by the chip transmission module smoothly enters the qualified chip collecting device through the chip sorting module in the connection process of the first integrated circuit; when the detection result of the chip is unqualified, the second integrated circuit is switched on, so that the sorting arm in the chip sorting module can swing, and the chip with the unqualified detection result is sorted into an unqualified chip collecting device.
Above-mentioned technical scheme realizes the letter sorting of chip letter sorting modularity degree to the chip through setting up first integrated circuit and second integrated circuit respectively in the integrated circuit module, need not the manual work and judge and sort to the chip, realized the automatic letter sorting to the chip, artifical spending and manpower consumption have been reduced, and only just switch on the second integrated circuit under the condition that the testing result of chip is unqualified makes the letter sorting arm in the chip letter sorting module wave thereby sort the testing result for unqualified chip to unqualified chip collection device, so not only can come with qualified and unqualified differentiation of chip, and unqualified chip is less relatively than qualified chip in the chip manufacturing process, so can also reduce the device loss that wave of letter sorting arm caused, improve integrated circuit device's life.
In an embodiment of the present invention, the chip sorting module includes a plurality of sorting arms, the second integrated circuit includes a plurality of sorting branches, the sorting branches and the sorting arms are in a one-to-one correspondence relationship, when the control processing unit generates a control scheme for the integrated circuit in the integrated circuit module according to the detection result, if the appearance detection result is unqualified, the sorting branches are connected for the unqualified appearance in the second integrated circuit, and if the performance detection result is unqualified, the sorting branches corresponding to the unqualified performance detection result in the performance detection result are further analyzed for the indexes in the performance detection result, and the sorting branches corresponding to the unqualified performance detection result in the indexes are determined and connected.
The chip sorting module in the technical scheme comprises a plurality of sorting arms, the second integrated circuit comprises a plurality of sorting branches, the sorting branches and the sorting arms are in one-to-one correspondence, each sorting branch in the second integrated circuit is connected with one sorting arm, the second integrated circuit is a frequency conversion signal transmission circuit, the tail end of the second integrated circuit is connected with the sorting arms in the chip sorting module, in the process of connecting the second integrated circuit, the connected sorting arms are swung through signal frequency conversion, so that chips transmitted by the chip transmission module are sorted into corresponding chip collecting devices, and when a control scheme is generated for the integrated circuits in the integrated circuit module according to the detection result, if the appearance detection result is unqualified, the sorting branches in the second integrated circuit are connected aiming at the unqualified appearance, and if the performance detection result is unqualified, and further analyzing indexes in the performance detection result, determining a sorting branch corresponding to the index with the unqualified performance index detection result in the indexes, switching on the sorting branch, and sorting the chip into a chip collecting device corresponding to the index with the unqualified performance index detection result.
Above-mentioned technical scheme makes through a plurality of letter sorting arms and a plurality of letter sorting branch road and can realize sorting the chip according to the testing result of chip, but also can carry out accurate letter sorting according to the factor that leads to unqualified when the testing result of chip is unqualified to make the problem of the unqualified chip of clearly sorting out in chip letter sorting module, and then can restore to unqualified chip, thereby improve the qualification rate of chip.
In an embodiment of the invention, the number of the sorting branches and the sorting arms is two more than that of the performance indexes, and when the number of results with unqualified performance index detection results in the performance detection results exceeds one, the chips are sorted into the single collecting device.
According to the technical scheme, the number of the sorting branches and the sorting arms is two more than that of the performance indexes, one is used for sorting according to whether the appearance detection result is qualified, and the other is used for sorting the chips into the independent collecting device when the number of the results of the performance indexes in the performance detection result, which are unqualified, exceeds one.
Above-mentioned technical scheme can make and can also sort out for unqualified chip with the testing result that has a plurality of performance index when making the letter sorting arm sort in the performance detection between putting through letter sorting branch road through the number of letter sorting branch road and letter sorting arm two more than the figure of performance index to distinguish out the many chips of problem to unqualified letter sorting, and then avoid detecting once more to unqualified chip and confirm unqualified problem place, reduce the time that consumes to unqualified chip secondary treatment, improve the efficiency of handling unqualified chip.
In an embodiment provided by the present invention, the appearance detection unit obtains image information of the chip on the chip detection table through an image acquisition device when detecting the appearance of the chip, and then identifies and analyzes the image information;
when the image acquisition device acquires the image information of the chip on the chip detection table, the image acquisition device acquires a close-range image by adopting multi-azimuth angles, and performs space construction on the acquired close-range image to obtain the image information of the chip;
when the image information is identified and analyzed, the method comprises the following steps:
acquiring parameters aiming at the image information of the chip to obtain size parameters of the chip, and calculating according to the size parameters to determine the size of the chip to obtain size detection data of the chip;
carrying out distribution identification on the image information of the chip, identifying the distribution condition of electronic elements in the chip, and obtaining distribution detection data of the chip;
and performing binarization gray level processing on the image information of the chip, and then performing connected domain analysis on the chip to obtain connected detection data of the chip.
The appearance detection unit in the technical scheme acquires image information of a chip on the chip detection table through the image acquisition device when detecting the appearance of the chip, and then identifies and analyzes the image information; when the image acquisition device acquires the image information of the chip on the chip detection table, the image acquisition device acquires a close-range image by adopting multi-azimuth angles, and performs space construction on the acquired close-range image to obtain the image information of the chip; when the image information is identified and analyzed, the method comprises the following steps: acquiring parameters aiming at image information of a chip to obtain size parameters of the chip, and calculating according to the size parameters to determine the size of the chip to obtain size detection data of the chip; carrying out distribution identification on the image information of the chip, identifying the distribution condition of electronic elements in the chip and obtaining distribution detection data of the chip; and performing binarization gray level processing on the image information of the chip, and then performing connected domain analysis on the chip to obtain connected detection data of the chip.
Above-mentioned technical scheme carries out information acquisition to the chip on the chip detection platform through image acquisition device and has realized the conversion of chip electronic information, make and handle between the electronic information when carrying out the analysis to the chip, avoided artifical manual subjective detection data of returning the chip, conveniently use and handle, and image acquisition device not only collection efficiency is high, the information of gathering is still accurate, in addition when discerning and analyzing image information, parameter and the information that obtain the chip through image identification carry out size detection data, distribution detection data and the definite of intercommunication detection data, not only discernment accuracy is high, but also can complete definite chip at the detailed information on the outward appearance, and then improve the accuracy of the outward appearance testing result of chip.
In an embodiment provided by the present invention, the adjusting of the transmission speed according to the analysis progress of the detection data of the chip by the control center module in the transmission process includes: acquiring the analysis progress condition of the detection data of the chip by the control center module in real time, and acquiring the process information of the control center module; performing time consumption estimation according to the information of the control center module, and determining the residual time of the distance of the control center module for completing the analysis of the detection data of the chip; and finishing forward acceleration adjustment or reverse deceleration adjustment on the analysis residual time of the detection data of the chip by combining the current transmission rate of the chip transmission module with the distance of the control center module.
The technical scheme is that the transmission speed adjustment is carried out according to the analysis progress of the detection data of the chip by the control center module in the transmission process, and the method comprises the following steps: acquiring the analysis progress condition of the detection data of the chip by the control center module in real time, and acquiring the process information of the control center module; performing time consumption estimation according to the information of the control center module, and determining the residual time of the distance of the control center module for completing the analysis of the detection data of the chip; and performing forward acceleration adjustment or reverse deceleration adjustment on the analysis residual time of the detection data of the chip by combining the current transmission rate of the chip transmission module chip with the distance of the control center module. When determining to perform forward acceleration adjustment or reverse deceleration adjustment, determining through the following formula:
H=t1×(N1-C1)+t2×(N2-C2)
Figure BDA0003485344290000161
in the above formula, t1The average consumption time of one index in the detection data representing the analysis aspect of the control center module; t is t2The average consumption time of one index in the detection data representing the analysis performance aspect of the control center module; n is a radical of1The index number of the detection data representing the appearance aspect in the detection data of the chip; n is a radical of2The index number of the detection data representing the performance aspect in the detection data of the chip; c1The index number of the detection data which represents the appearance aspect in the detection data of the chip and is analyzed by the control center module; c2The index number of the detection data which represents the performance aspect in the detection data of the chip and is analyzed by the control center module; h represents the residual time for completing the analysis of the detection data of the chip by the distance of the control center module; r represents a harmonic parameter, the value of which is related to the processing time of a control processing unit in the control center module; l represents the total length of a transmission path for the chip transmission module to transmit the chip from the chip detection platform to the chip sorting module; s represents the path length of the chip transmitted from the chip detection platform by the chip transmission module at the current moment; v represents the current transmission speed of the chip transmission module; t represents a forward determination threshold; q represents a reverse determination threshold; g denotes the adjustment direction, and when G is equal to Z, it denotes the reverse deceleration adjustment, and when G is equal to F, it denotes the forward acceleration adjustment.
According to the technical scheme, the analysis progress condition of the detection data of the chip by the control center module is obtained in real time, the real-time adjustment is carried out on the transmission speed of the chip by the chip transmission module, so that the chip sorting module is prevented from being sorted according to the detection result of the chip in time, the chip sorting effect is influenced, the forward acceleration adjustment or the reverse deceleration adjustment is carried out on the analysis remaining time of the detection data of the chip by combining the current transmission speed of the chip transmission module with the distance of the control center module, the effective sorting of the chip can be realized, the consumption of waiting time for chip transmission during chip sorting can be reduced, and the chip sorting efficiency of the chip sorting module is improved. In addition, when the chip transmission module is used for forward acceleration adjustment or reverse deceleration adjustment, the progress of analysis of detection data of the chip by the control center module is fully combined with the condition of chip transmission for adjustment after analysis, so that the adjustment result can enable the chip transmission module and the control center module to be adaptive to each other at the running speed, the chip transmission module is prevented from waiting too long time to sort the chips transmitted by the chip transmission module after the control center module obtains the detection result of the chip, the waste of waiting time is reduced, meanwhile, the chip transmission module can be prevented from transmitting the chips through the chip sorting module before the control center module obtains the detection result of the chips, and the invalid sorting of the chip sorting module is avoided.
It will be understood by those skilled in the art that the first and second embodiments of the present invention are merely directed to different stages of application.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. An integrated circuit device for smart fabrication of chips, comprising: the chip sorting system comprises a chip conveying module, a chip detection module, a control center module, an integrated circuit module and a chip sorting module; the chip conveying module is used for receiving chips conveyed by a chip manufacturing assembly line, conveying the chips to a chip detection table and conveying the chips out after the chips are detected; the chip detection module is connected with the control center module and used for detecting the chip on the chip detection table and transmitting detection data to the control center module; the control center module is also connected with the integrated circuit module and used for analyzing the detection data to obtain a detection result and connecting an integrated circuit in the integrated circuit module according to the detection result; the integrated circuit module is connected with the chip sorting module and used for enabling the chip sorting module to sort the chips according to the connection condition of the integrated circuit.
2. The ic device according to claim 1, wherein the chip delivery module is further connected to the control center module, and when the control center module receives the detection data of the chip transmitted by the chip detection module, the control center module sends a chip moving signal to the chip delivery module, and the chip delivery module moves and delivers the chip on the chip detection table according to the chip moving signal, and performs transmission speed adjustment according to the analysis progress of the detection data of the chip by the control center module during transmission.
3. The integrated circuit device of claim 2, wherein the chip detection module comprises: an appearance detection unit and a performance detection unit; the appearance detection unit is used for detecting the appearance of the chip and comprises: the performance detection unit is used for detecting the performance of the chip through analog signals, and respectively carrying out integral detection and block detection on the chip to obtain the performance detection data of the chip; and when the appearance detection unit and the performance detection unit detect the chip on the chip detection table, the chip detection table is moved to the appearance detection unit for appearance detection, and after the appearance detection is finished, the chip detection table is moved to the performance detection unit for performance detection.
4. The integrated circuit device of claim 3, wherein the hub module comprises: the device comprises a signal transceiving unit, a result analysis unit and a control processing unit; the signal receiving and sending unit is used for receiving the detection data of the chip transmitted by the chip detection module and sending signal information to the chip transmission module; the result analysis unit is connected with the signal transceiving unit and is used for analyzing the detection data of the chip received by the signal transceiving unit and determining whether the detection data of the chip belongs to the qualified range of the chip, if the detection data of the chip belongs to the qualified range of the chip, the detection result of the chip is qualified, and if the detection data of the chip does not belong to the qualified range of the chip, the detection result of the chip is unqualified, so that the detection result is obtained; the control processing unit is connected with the result analysis unit and used for calling the detection result, generating a control scheme for the integrated circuit in the integrated circuit module according to the detection result and controlling and executing the integrated circuit module.
5. The integrated circuit device according to claim 4, wherein the result analysis unit performs analysis and determination on the detection data of the chip when obtaining the detection result, respectively, and includes: analyzing and judging the appearance detection data of the chip to obtain an appearance detection result and analyzing and judging the performance detection data to obtain a performance detection result, then comprehensively analyzing the appearance detection result and the performance detection result to determine the detection result of the chip, and labeling the indexes which cause disqualification in the appearance detection result and the performance detection result when the detection result of the chip is disqualified.
6. The IC device according to claim 5, wherein the IC module comprises a first IC and a second IC, the first IC is turned on when the detection result of the chip is acceptable, so that the first IC causes the chip sorting module to sort the chip into an acceptable chip collecting device when the first IC is turned on, and the second IC is turned on when the detection result of the chip is unacceptable, so that the second IC drives the sorting arm in the chip sorting module to sort the chip into an unacceptable chip collecting device when the second IC is turned on.
7. The ic device according to claim 6, wherein the chip sorting module includes a plurality of sorting arms, the second ic includes a plurality of sorting branches, the sorting branches are in a one-to-one correspondence with the sorting arms, and when the control processing unit generates the control scheme for the ic in the ic module according to the detection result, if the appearance detection result is unqualified, the sorting branches are turned on for the unqualified appearance in the second ic, and if the performance detection result is unqualified, the sorting branches corresponding to the index with the unqualified performance index detection result in the performance detection result are further analyzed to determine the sorting branches corresponding to the index with the unqualified performance index detection result in the index, and the sorting branches are turned on.
8. The IC device according to claim 7, wherein the number of the sorting branches and the sorting arms is two more than the number of the performance indexes, and when the number of the performance indexes detected by the performance detecting unit is more than one, the chips are sorted into the individual collecting units.
9. The integrated circuit device according to claim 3, wherein the appearance detection unit obtains image information of the chip on the chip detection stage through an image acquisition device when performing appearance detection on the chip, and then performs recognition and analysis on the image information;
when the image acquisition device acquires the image information of the chip on the chip detection table, the image acquisition device acquires a close-range image by adopting multi-azimuth angles, and performs space construction on the acquired close-range image to obtain the image information of the chip;
when the image information is identified and analyzed, the method comprises the following steps:
acquiring parameters aiming at the image information of the chip to obtain size parameters of the chip, and calculating according to the size parameters to determine the size of the chip to obtain size detection data of the chip;
carrying out distribution identification on the image information of the chip, identifying the distribution condition of electronic elements in the chip, and obtaining distribution detection data of the chip;
and performing binarization gray level processing on the image information of the chip, and then performing connected domain analysis on the chip to obtain connected detection data of the chip.
10. The integrated circuit device according to claim 2, wherein the adjusting of the transmission speed according to the analysis progress of the detection data of the chip by the control center module during the transmission process comprises: acquiring the analysis progress condition of the detection data of the chip by the control center module in real time, and acquiring the process information of the control center module; performing time consumption estimation according to the information of the control center module, and determining the residual time of the distance of the control center module for completing the analysis of the detection data of the chip; and finishing forward acceleration adjustment or reverse deceleration adjustment on the analysis residual time of the detection data of the chip by combining the current transmission rate of the chip transmission module with the distance of the control center module.
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