CN114390125B

CN114390125B - Electronic device

Info

Publication number: CN114390125B
Application number: CN202210010964.9A
Authority: CN
Inventors: 郑宁杰; 魏杨
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2022-01-05
Filing date: 2022-01-05
Publication date: 2022-12-16
Anticipated expiration: 2042-01-05
Also published as: CN114390125A

Abstract

The application discloses electronic equipment relates to electron technical field. The electronic device includes: the shell structure is provided with a closed cavity and comprises a first shell and a second shell, the second shell is connected with the first shell in a matched mode, and a gap communicated with the outside of the shell structure is formed between the second shell and the first shell; an opening is formed in one side, located in the sealed cavity, of the second shell, a ventilation channel is arranged in the second shell, and the ventilation channel is communicated with the gap and the opening; the air pressure balancing assembly is connected with the opening in a sealing mode, and the air-permeable channel is isolated from the closed cavity through the air pressure balancing assembly; wherein the exterior of the shell structure is balanced with the air pressure of the enclosed cavity by the gap, the air-permeable passage and the air pressure balancing assembly.

Description

Electronic device

Technical Field

The application belongs to the technical field of electronics, concretely relates to electronic equipment.

Background

With the rapid development of electronic technology, electronic devices such as mobile phones and tablet computers are becoming more and more popular and becoming an indispensable part of people's daily life. Wherein, in order to satisfy people to the waterproof dustproof performance's of electronic equipment requirement, electronic equipment's leakproofness is higher and higher. However, when the electronic device has high sealing performance, the air pressure in the electronic device may become excessively high when the internal temperature of the electronic device generates heat or the electronic device is pressed from the outside.

Disclosure of Invention

The application aims to provide electronic equipment, and at least solves the problem that the internal air pressure of the existing electronic equipment is too large easily.

In order to solve the technical problem, the present application is implemented as follows:

an embodiment of the present application provides an electronic device, including:

the shell structure is provided with a closed cavity and comprises a first shell and a second shell, the second shell is connected with the first shell in a matched mode, and a gap communicated with the outside of the shell structure is formed between the second shell and the first shell; an opening is formed in one side, located in the sealed cavity, of the second shell, a ventilation channel is arranged in the second shell, and the ventilation channel is communicated with the gap and the opening;

the air pressure balancing assembly is connected with the opening in a sealing mode, and the ventilation channel is separated from the closed cavity through the air pressure balancing assembly;

wherein the exterior of the shell structure is balanced with the air pressure of the enclosed cavity by the gap, the air-permeable passage and the air pressure balancing assembly.

In the embodiment of the application, the ventilation channel is arranged in the second shell, the ventilation channel is communicated with the gap between the first shell and the second shell, one side, located in the sealed cavity, of the second shell is provided with an opening, the opening is provided with an air pressure balancing assembly in sealing connection with the opening, the ventilation channel is separated from the sealed cavity through the air pressure balancing assembly, and the outer portion of the shell structure is balanced with the air pressure of the sealed cavity through the gap, the ventilation channel and the air pressure balancing assembly. Therefore, when the internal temperature of the electronic equipment generates heat or is extruded from the outside, and the like, the air pressure inside the shell (namely the closed cavity) can be balanced with the air pressure outside the shell through the gap, the air-permeable channel and the air pressure balancing component, so that the air pressure inside the shell can be prevented from being increased; in addition, the gap between the first shell and the second shell is communicated with the outside, so that an additional vent hole is not required to be formed, and the appearance attractiveness of the electronic equipment can be improved.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a cross-sectional schematic view of an embodiment of an electronic device according to the present application;

FIG. 2 is an enlarged schematic view of portion A of FIG. 1;

FIG. 3 is another cross-sectional schematic view of an embodiment of an electronic device according to the present application;

FIG. 4 is an exploded schematic view of another partial structure of an embodiment of an electronic device according to the present application;

FIG. 5 is an exploded schematic view of another partial structure of an embodiment of an electronic device according to the present application;

FIG. 6 is an exploded schematic view of another partial structure of an embodiment of an electronic device according to the present application;

fig. 7 is a schematic structural diagram of a sink according to an embodiment of an electronic device of the present application;

FIG. 8 is another cross-sectional schematic view of an embodiment of an electronic device according to the present application.

Detailed Description

Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/", and generally means that the former and latter related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

In the description of the present application, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

An electronic device according to an embodiment of the application is described below in conjunction with fig. 1-8.

Please refer to fig. 1 and fig. 2 simultaneously, an electronic device provided in an embodiment of the present application. As shown in fig. 1 and 2, the electronic apparatus includes:

the shell structure is provided with a closed cavity 100 and comprises a first shell 10 and a second shell 20, the second shell 20 is connected with the first shell 10 in a matching mode, and a gap 200 communicated with the outside of the shell structure is formed between the second shell 20 and the first shell 10; an opening 300 is formed in one side of the second shell 20, which is located in the sealed cavity 100, a ventilation channel 400 is arranged in the second shell 20, and the ventilation channel 400 is communicated with the gap 200 and the opening 300;

the air pressure balancing assembly 30, the air pressure balancing assembly 30 is connected with the opening 300 in a sealing manner, and the air-permeable passage 400 is isolated from the closed cavity 100 by the air pressure balancing assembly 30;

wherein the outside of the shell structure is balanced with the air pressure of the closed chamber 100 through the gap 200, the air-permeable passage 400 and the air pressure balancing assembly 30.

Based on this, through set up ventilative passageway 400 in second casing 20, ventilative passageway 400 communicates with clearance 200 between first casing 10, the second casing 20, second casing 20 is located one side of sealed chamber 100 and has seted up opening 300, and opening 300 is provided with rather than the balanced subassembly 30 of atmospheric pressure of sealing connection, cuts off through balanced subassembly 30 of atmospheric pressure between ventilative passageway 400 and the sealed chamber 100, and through clearance 200, ventilative passageway 400 and balanced subassembly 30 of atmospheric pressure, the outside of shell structure is balanced with the atmospheric pressure in sealed chamber 100. Thus, when the internal temperature of the electronic device generates heat or is extruded from the outside, the air pressure inside the housing (i.e., the sealed cavity 100) and the outside can be balanced by the gap 200, the air permeable channel 400 and the air pressure balancing assembly 30, so that the audio module can be prevented from being affected by the increased air pressure inside the housing; in addition, since the gap 200 between the first casing 10 and the second casing 20 is used to communicate with the outside, no additional vent hole needs to be formed, and the appearance of the electronic device can be more beautiful.

It should be noted that the housing structure may be a housing of an electronic device, and the electronic device may be a mobile phone, a tablet computer, or a wearable device, and so on.

In the embodiment of the present application, the housing structure includes a first housing 10 and a second housing 20, the first housing 10 and the second housing 20 are connected in a matching manner, and a gap 200 communicating with the outside of the housing structure is provided between the second housing 20 and the first housing 10.

The first housing 10 and the second housing 20 may be any two-part housing with a detachable connection in the housing structure.

For example, in the case that the housing structure is an outer shell of an electronic device, the outer shell includes a middle frame and a rear cover, and the outer shell and a display screen of the electronic device jointly enclose the sealed cavity 100, the first housing 10 may be the middle frame and the second housing 20 may be the rear cover (as shown in fig. 2), or the first housing 10 may be the rear cover and the second housing 20 may be the middle frame; alternatively, in the case where the electronic device further includes a decoration, and the decoration is disposed on the middle frame or the rear cover (may be bonded by the adhesive layer 11), the first housing 10 may be a decoration, and the second housing 20 may be a middle frame or a rear cover, as shown in fig. 3 and 4, or the like.

The first housing 10 and the second housing 20 may be connected by at least one of snap-fit, adhesive, interference fit, and the like, and when the first housing 10 and the second housing 20 are connected, a gap 200 communicating with the outside of the housing structure is formed between the first housing 10 and the second housing 20.

In addition, an opening 300 is formed at one side of the second housing 20 located in the sealed cavity 100, and a ventilation channel 400 is formed in the second housing 20, wherein the ventilation channel 400 communicates the gap 200 and the opening 300.

Of course, the ventilation channel 400 may be a pipe disposed in the wall of the second housing 20 and used for transmitting the air entering from the gap 200 to the opening 300, and the shape, size, disposition position and the like of the ventilation channel may be set according to actual needs, and are not limited herein.

The electronic device may further include a built-in module disposed in the sealed chamber 100. The built-in module can be any component which can be influenced when the air pressure is too large, so that the air pressure balance is realized, and the normal work of the built-in module can be ensured. Specifically, the built-in module may be an audio module, and the audio module may include at least one of a receiver and a speaker.

In this embodiment, the electronic device further includes an air pressure balancing assembly 30, the air pressure balancing assembly 30 is hermetically connected to the opening 300, the air permeable passage 400 is isolated from the sealed cavity 100 by the air pressure balancing assembly 30, and the outside of the housing structure is balanced with the air pressure of the sealed cavity 100 through the gap 200, the air permeable passage 400 and the air pressure balancing assembly 30, so as to prevent the air pressure in the sealed cavity 100 from being too high.

The air pressure balancing assembly 30 is hermetically connected to the opening 300, and the air pressure balancing assembly 30 may be attached to a sidewall of the second housing 20 located in the sealed cavity 100, and hermetically connected (e.g., bonded) to the sidewall, and the air pressure balancing assembly 30 covers the opening 300.

In some embodiments, as shown in fig. 5, a groove 500 is formed in the sidewall of the closed cavity 100 of the second housing 20 facing away from the closed cavity 100, the opening 300 is formed in the bottom of the groove 500, and the air pressure balance assembly 30 is disposed in the groove 500 and is connected to the groove 500 in a sealing manner.

Based on this, the groove 500 is formed on the side wall of the second housing 20 located in the sealed cavity 100, and the air pressure balancing assembly 30 is embedded in the groove 500, so that the air pressure balancing assembly 30 is not easy to fall off from the groove 500, and the stability of the electronic device is improved.

It should be noted that, the air pressure balancing assembly 30 is disposed in the groove 500 and is connected to the groove 500 in a sealing manner, the air pressure balancing assembly 30 may be embedded in the groove 500, and a sealing layer is disposed at a connection position between the air pressure balancing assembly 30 and the groove 500.

In some embodiments, the air pressure balancing assembly 30 is bonded to the bottom of the groove 500.

Based on this, through bonding atmospheric pressure balance assembly 30 and tank bottom, not only can promote the firm in connection between atmospheric pressure balance assembly 30 and the tank bottom, can also promote the connection gas tightness between the two.

For example, as shown in fig. 5, the groove 500 may be a sinking groove with a groove bottom opened with the opening 300, the air pressure balancing assembly 30 may be disposed in the sinking groove, and the first adhesive layer 40 (such as glue or the like) may be disposed between the groove bottom of the sinking groove and the air pressure balancing assembly 30, as shown in fig. 6, to achieve the sealing connection of the air pressure balancing assembly 30 in the sinking groove.

In the embodiment of the present application, the air pressure balancing assembly 30 may be any assembly having waterproof and air-permeable properties, and air may pass through the air pressure balancing assembly 30, so that the air pressure in two spaces separated by the air pressure balancing assembly 30 can be kept balanced.

For example, the air pressure balancing assembly 30 may include only a waterproof and air-permeable assembly, which may be a film made of a waterproof and air-permeable material, and the waterproof and air-permeable assembly may be adhered to the opening 300.

In some embodiments, the air pressure balancing assembly 30 may include a reinforcing member 31 and a waterproof air-permeable member 32, the reinforcing member 31 has a hollow area 600, the waterproof air-permeable member 32 is hermetically connected to the reinforcing member 31, the waterproof air-permeable member 32 covers the hollow area 600, and the reinforcing member 31 supports the waterproof air-permeable member 32 in the opening 300.

Based on this, set up in opening 300 through reinforcer 31 with waterproof ventilative piece 32 support, reinforcer 31 plays the supporting role to waterproof ventilative piece 32 to can avoid waterproof ventilative piece 32 easily to take place to warp, promote electronic equipment's reliability.

The waterproof air-permeable member 32 and the reinforcing member 31 may be hermetically connected, and the waterproof air-permeable member 32 and the reinforcing member 31 may be hermetically connected by bonding or the like. For example, the second adhesive layer 33 may be provided between the waterproof air-permeable member 32 and the reinforcing member 31, and the waterproof air-permeable member 32 may be bonded to the reinforcing member 31 via the second adhesive layer 33.

In addition, the reinforcing member 31 may be a ring-shaped reinforcing member, so that the supporting effect of the reinforcing member 31 on the waterproof and breathable member 32 can be improved.

In some embodiments, the second housing 20 is further provided with a dust receiving groove 700, and the dust receiving groove 700 communicates with the air-permeable passage 400 and/or the gap 200.

Based on this, the dust accommodating groove 700 communicated with the air-permeable passage 400 is arranged in the second housing 20, so that the dust entering the air-permeable passage 400 can be accommodated, the air-permeable passage 400 is not easily blocked, and the reliability of the electronic device is improved.

The dust accommodating groove 700 may be any cavity that is provided in the second housing 20 and can accommodate dust entering the air-permeable passage 400, and the shape, size, installation position, and the like of the dust accommodating groove may be set according to actual needs.

In some embodiments, as shown in fig. 2, the dust receiving groove 700 may be disposed at a connection of the gap 200 and the air-permeable passage 400.

Accordingly, the dust containing groove 700 is provided between the gap 200 and the air-permeable passage 400, so that dust can be directly contained in the dust containing groove 700 after entering from the gap 200, dust which can enter the air-permeable passage 400 is reduced, and the possibility of blocking the air-permeable passage 400 is further reduced.

For example, in a case where the first housing 10 is a rear cover and the second housing 20 is a middle frame, the dust receiving groove 700 may be formed in the middle frame, and the dust receiving groove 700 may be located at a connection portion between the gap 200 and the ventilation channel 400.

Alternatively, as shown in fig. 7, the dust receiving groove 700 is disposed at a connection portion of the opening 300 and the air-permeable passage 400, so that the dust receiving groove 700 is disposed in a more flexible manner.

For example, in the case where the second housing 20 is a middle frame and the first housing 10 is a decoration member embedded in the second housing 20, the bottom of the sinking groove may be disposed on the opening 300 and the dust receiving groove 700, the dust receiving groove 700 may be located at a connection portion between the opening 300 and the ventilation channel 400, and a depth direction of the dust receiving groove 700 may be different from a depth direction of the opening 300.

It should be noted that, in order to ensure the dust accommodating capacity of the dust accommodating groove 700, the size of the dust accommodating groove 700 may be larger than that of the air permeable passage 400, for example, when the dust accommodating groove 700 is a spherical cavity, the diameter of the spherical cavity may be larger than that of the air permeable passage 400, and so on; alternatively, the dust receiving groove 700 may be formed in a depth direction different from the extending direction of the air-permeable passage 400.

In addition, in order to clean the dust in the dust accommodating groove 700, the dust accommodating groove 700 may be configured to be detachable, for example, a part of the second housing 20 located in the dust accommodating groove 700 includes a first sub-housing and a second sub-housing, and the first sub-housing and the second sub-housing are detachably connected and jointly enclose the dust accommodating groove 700, and in a case that the dust in the dust accommodating groove 700 needs to be cleaned, the first sub-housing and the second sub-housing may be detached.

In some embodiments, in a case where the dust receiving groove 700 is provided at a connection of the gap 200 and the air-permeable passage 400, a notch of the dust receiving groove 700 is provided opposite to the first housing 10;

in a case where the dust receiving groove 700 is disposed at a connection portion of the opening 300 and the air-permeable passage 400, a notch of the dust receiving groove 700 is disposed opposite to the air pressure balancing assembly 30.

Therefore, when the dust in the dust accommodating groove 700 needs to be cleaned, only the first housing 10 needs to be detached from the second housing 20, or the air pressure balancing assembly 30 needs to be detached from the opening 300, so that the operation is convenient and time-saving.

In some embodiments, the dust receiving groove 700 is disposed in the gap 200 (as shown in fig. 3) or the air-permeable passage 400 (as shown in fig. 8), and a depth direction of the dust receiving groove 700 is different from an extending direction of the gap 200 or the air-permeable passage 400.

Based on this, the dust accommodating groove 700 may also be disposed in the gap 200 or the air-permeable channel 400, so that the dust accommodating groove 700 is disposed at more flexible and various positions; in addition, the depth direction of the dust accommodating groove 700 is different from the extending direction of the gap 200 or the ventilation channel 400, so that the dust accommodating capacity of the dust accommodating groove 700 can be ensured.

In the case where the dust receiving groove 700 is provided in the gap 200, the gap 200 may extend linearly, the dust receiving groove 700 may be provided at any position between both ends of the gap 200, and the depth direction of the dust receiving groove 700 may be different from the direction in which the straight line extends.

Alternatively, when the dust accommodating groove 700 is disposed in the gap 200, the gap 200 may be bent, the dust accommodating groove 700 may be disposed between both ends of the gap 200, and the depth direction of the dust accommodating groove 700 may be different from the extending direction of at least a portion of the gap 200.

For example, as shown in fig. 8, in the case where the first housing 10 is a deco and the second housing 20 is a middle frame, a dust receiving groove 700 may be provided at a corner of the gap 200 formed between the deco and the middle frame.

Of course, in the case that the dust receiving groove 700 is disposed in the air channel 400, the air channel 400 may extend linearly, the dust receiving groove 700 may be disposed at any position between two ends of the air channel 400, and the depth direction of the dust receiving groove 700 is different from the direction in which the dust receiving groove extends linearly.

Alternatively, when the dust receiving groove 700 is disposed in the air channel 400, the air channel 400 may be bent, the dust receiving groove 700 is disposed between two ends of the air channel 400, and the depth direction of the dust receiving groove 700 may be different from the extending direction of at least a portion of the air channel 400.

Specifically, as shown in fig. 8, the air-permeable passage 400 includes a first sub-passage 410 and a second sub-passage 420, the first sub-passage 410 is communicated with the gap 200, the second sub-passage 420 is communicated with the first sub-passage 410 and the opening 300, and an included angle is formed between the first sub-passage 410 and the second sub-passage 420;

the dust receiving groove 700 is disposed at a connection position of the first sub-channel 410 and the second sub-channel 420, and a depth direction of the dust receiving groove 700 is different from an extending direction of the second sub-channel 420.

Accordingly, the air-permeable passage 400 is a bent passage, and the dust receiving groove 700 is formed at the bent position of the air-permeable passage 400 (i.e., the connection between the first sub-passage 410 and the second sub-passage 420), and the depth direction of the dust receiving groove 700 is different from the extension direction of the partial passage extending toward the opening 300, so that the dust receiving capability can be improved.

It should be noted that the depth direction of the dust accommodating groove 700 may be any direction different from the extending direction of the second sub-channel 420. Specifically, the depth direction of the dust accommodating groove 700 is the same as the extending direction of the first sub-channel 410, so that the dust accommodating capability is further improved. Of course, the depth direction of the dust accommodating groove 700 may be different from the extending direction of the first sub-channel 410, and is not limited herein.

It should be noted that other structures of the electronic device are well known to those skilled in the art, for example, the electronic device may further include a main circuit board and the like, and the main circuit board is disposed in the closed cavity of the housing structure, and the description thereof is omitted here.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising:

the shell structure is provided with a closed cavity and comprises a first shell and a second shell, the second shell is connected with the first shell in a matched mode, and a gap communicated with the outside of the shell structure is formed between the second shell and the first shell; an opening is formed in one side, located in the sealed cavity, of the second shell, a ventilation channel is arranged in the second shell, and the ventilation channel is communicated with the gap and the opening; the air pressure balancing assembly is connected with the opening in a sealing mode, and the air-permeable channel is isolated from the closed cavity through the air pressure balancing assembly;

wherein the exterior of the shell structure is balanced with the air pressure of the enclosed cavity by the gap, the air-permeable passage and the air pressure balancing assembly;

the second shell is also provided with a dust accommodating groove which is communicated with the ventilation channel and/or the gap;

the dust accommodating groove is arranged in the gap or the ventilation channel, and the depth direction of the dust accommodating groove is different from the extending direction of the gap or the ventilation channel;

the air-permeable passage comprises a first sub-passage and a second sub-passage, the first sub-passage is communicated with the gap, the second sub-passage is communicated with the first sub-passage and the opening, and an included angle is formed between the first sub-passage and the second sub-passage;

the dust containing groove is arranged at the joint of the first sub-channel and the second sub-channel, and the depth direction of the dust containing groove is different from the extending direction of the second sub-channel.

2. The electronic device of claim 1, wherein the dust receiving groove is disposed at a connection of the gap and the air-permeable channel, or wherein the dust receiving groove is disposed at a connection of the opening and the air-permeable channel.

3. The electronic device according to claim 2, wherein in a case where the dust containing groove is provided at a connection of the gap and the air-permeable passage, a notch of the dust containing groove is provided opposite to the first housing;

the dust containing groove is arranged at the joint of the opening and the ventilation channel, and the notch of the dust containing groove and the air pressure balancing component are arranged oppositely.

4. The electronic device according to claim 1, wherein a depth direction of the dust accommodating groove is the same as an extending direction of the first sub-passage.

5. The electronic device according to claim 1, wherein a groove is formed in a side wall of the second housing located in the sealed cavity in a direction away from the sealed cavity, the opening is formed in a bottom of the groove, and the air pressure balancing assembly is disposed in the groove and hermetically connected to the groove.

6. The electronic device of claim 5, wherein the air pressure balancing component is bonded to a bottom of the groove.

7. The electronic device of claim 1, wherein the air pressure balancing assembly comprises a reinforcing member and a waterproof air-permeable member, the reinforcing member has a hollow area, the waterproof air-permeable member is connected to the reinforcing member in a sealing manner, the waterproof air-permeable member covers the hollow area, and the reinforcing member supports the waterproof air-permeable member in the opening.