CN114389064A - Display module - Google Patents
Display module Download PDFInfo
- Publication number
- CN114389064A CN114389064A CN202210012857.XA CN202210012857A CN114389064A CN 114389064 A CN114389064 A CN 114389064A CN 202210012857 A CN202210012857 A CN 202210012857A CN 114389064 A CN114389064 A CN 114389064A
- Authority
- CN
- China
- Prior art keywords
- terminal
- binding
- display module
- thickness
- compensation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Abstract
The embodiment of the application discloses a display module, which comprises a display panel and a flexible circuit board, wherein in a binding area, the display panel comprises a first binding terminal and a first marking terminal, the flexible circuit board comprises a second binding terminal and a second marking terminal, the second binding terminal and the first binding terminal are correspondingly abutted to form a binding terminal group, and the second marking terminal and the first marking terminal are arranged in an alignment manner to form an alignment terminal group; the thickness of the alignment terminal group is smaller than that of the binding terminal group, so that uneven stress of the edge area is improved, stress generated by the alignment terminal group on the display panel is reduced, and the display panel at the position of the marking terminal group is prevented from being broken.
Description
Technical Field
The application relates to the technical field of flexible display, in particular to a display module.
Background
At present, the mainstream of the connection between the driving chip of the flexible product and the display panel in the industry is a flexible binding technology, a high-temperature and high-pressure environment needs to be used in the flexible circuit board binding process of the display module, the stress of the marking terminal group in the edge areas of two sides of the flexible circuit board is large during binding, the area of the marking terminal group is small, the break difference is large, and the distance from the binding terminal group is far, so that the stress of the marking terminal group is uneven, the display panel at the corresponding position of the display panel is easy to break, and the reliability of the product is affected.
Therefore, the conventional display module has the technical problem that the display panel at the position of the marking terminal group is easy to break.
Disclosure of Invention
The embodiment of the application provides a display module assembly, can alleviate the easy cracked technical problem of display panel that current display module assembly exists mark terminal group department.
The embodiment of the application provides a display module assembly, including binding the district, binding the district including central zone, lieing in the marginal area of central zone both sides includes:
a display panel including a first binding terminal, a first mark terminal;
the flexible circuit board is bound and connected with the display panel and comprises a second binding terminal and a second marking terminal, the second binding terminal and the first binding terminal are correspondingly abutted to form a binding terminal group, and the second marking terminal and the first marking terminal are arranged in an alignment mode to form an alignment terminal group;
the binding terminal group is arranged in the central area, the alignment terminal group is arranged in the edge area, and the thickness of any alignment terminal group is smaller than that of the binding terminal group.
Optionally, in some embodiments of the present application, a thickness of the second flag terminal is smaller than a thickness of the second binding terminal.
Optionally, in some embodiments of the present application, the second binding terminal is a stacked structure of a conductive layer and a protective layer, and the second marking terminal is a single-layer structure of a conductive layer.
Optionally, in some embodiments of the present application, the second mark terminal and the second binding terminal are both stacked structures of a conductive layer and a protective layer, the conductive layer includes a first conductive portion corresponding to the second binding terminal and a second conductive portion corresponding to the second mark terminal, where a thickness of the first conductive portion is greater than a thickness of the second conductive portion.
Optionally, in some embodiments of the present application, the conductive layer is made of copper, and the thickness of the second conductive portion ranges from 5 micrometers to 6 micrometers.
Optionally, in some embodiments of the present application, the second flag terminal includes a plurality of chamfers, wherein at least one of the chamfers is a rounded corner.
Optionally, in some embodiments of the present application, the second flag terminals located in the edge regions on different sides are symmetrically disposed with respect to the central region.
Optionally, in some embodiments of the present application, a compensation terminal is further disposed in the edge region, and a width of the compensation terminal is greater than or equal to 50 micrometers.
Optionally, in some embodiments of the present application, the compensation terminal includes a first compensation terminal, the first compensation terminal is disposed on a side of the second mark terminal close to the second binding terminal, and a minimum distance from the first compensation terminal to the second binding terminal is greater than or equal to 50 micrometers.
Optionally, in some embodiments of the present application, the compensation terminal further includes a second compensation terminal, the second compensation terminal is disposed on a side of the second mark terminal away from the second binding terminal, a minimum distance between the second compensation terminal and the second mark terminal is greater than or equal to 50 micrometers, and a minimum distance between the second compensation terminal and a side of the edge region is greater than 500 micrometers.
Has the advantages that: this application is less than through the thickness that makes counterpoint terminal group bind the thickness of terminal group, improves the atress inequality of marginal area's counterpoint terminal group department, has reduced the stress that counterpoint terminal group produced to display panel, has alleviated the easy cracked technical problem of display panel that current display module group exists mark terminal group department.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of a display module provided herein;
FIG. 2 is a schematic cross-sectional view of a display module assembly provided herein at a bonding area A-A;
FIG. 3 is a schematic perspective view of a first flexible circuit board in a bonding area of a display module provided herein;
FIG. 4 is a first schematic cross-sectional view at B-B of a flexible printed circuit board of a display module provided in the present application;
FIG. 5 is a second schematic cross-sectional view of a flexible printed circuit B-B of a display module provided herein;
FIG. 6 is a schematic cross-sectional view of a flexible printed circuit B-B of the display module provided in the present application;
FIG. 7 is a fourth schematic cross-sectional view taken along line B-B of a flexible printed circuit board of a display module provided herein;
FIG. 8 is a second perspective view of a flexible circuit board in a bonding area of a display module provided herein;
FIG. 9 is a schematic perspective view of a display panel of a bonding area of a display module provided in the present application;
fig. 10 is a schematic cross-sectional view at C-C of a flexible circuit board of a display module provided in the present application.
Description of reference numerals:
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
In the existing display module, a high-temperature and high-pressure environment is needed in the flexible circuit board binding process, the distance between the marking terminal of the binding area and the binding terminal is far, the area of the marking terminal is small, and the breaking difference is large, so that the stress on the marking terminal groups in the edge areas at two sides is large, and the position of the display panel corresponding to the marking terminal group is easy to break due to uneven stress.
Therefore, a display module is needed to alleviate the technical problem that the labeled terminal set is prone to breaking due to uneven stress.
Referring to fig. 1 and 2, the present application provides a display module 1, where the display module 1 includes a display panel 40 and a flexible circuit board 80, the display panel 40 includes a first binding terminal 102 and a first mark terminal 103, the flexible circuit board 80 is bound and connected with the display panel 40, the flexible circuit board 80 includes a second binding terminal 202 and a second mark terminal 203, the second binding terminal 202 is correspondingly abutted to the first binding terminal 102 to form a binding terminal group 100, the second mark terminal 203 is aligned to the first mark terminal 103 to form an alignment terminal group 110, where the display module 1 includes a binding region 2, the binding region 2 includes a central region 4 and edge regions 5 located at two sides of the central region 4, the binding terminal group 100 is located at the central region 4, the alignment group 110 is located at the edge regions 5, the thickness of any alignment terminal set 110 is smaller than that of the binding terminal set 100.
The display module 1 further includes a cover plate 10, an optical adhesive 20, a polarizer 30, a back plate 50, a heat dissipation layer 60, a support layer 70, and a driving chip 90.
Wherein the back plate 50 comprises a first back plate 501 and a second back plate 502.
The display panel 40 further includes a first substrate 101, and the first binding terminal 102 and the first mark terminal 103 are disposed on a surface of the first substrate 101.
The flexible circuit board 80 includes a second substrate 201, and the second binding terminal 202 and the second mark terminal 203 are disposed on a surface of the second substrate 201.
In the embodiment, the thickness of the alignment terminal group 110 is smaller than the thickness of the binding terminal group 100, so that uneven stress on the alignment terminal group 110 in the edge region 5 is improved, stress on the display panel 40 caused by the alignment terminal group 110 is reduced, and the technical problem that the display panel 40 in the conventional display module 1 is easy to break when the mark terminal group is located is solved.
It is understood that the thickness of any of the pair of position terminal sets 110 is smaller than the thickness of the binding terminal set 100, and the thickness of the first mark terminal 103 is smaller than the thickness of the first binding terminal 102; the thickness of the second tag terminal 203 may be smaller than the thickness of the second binding terminal 202; it is also possible that the thickness of the first flag terminal 103 is smaller than the thickness of the first binding terminal 102 and the thickness of the second flag terminal 203 is smaller than the thickness of the second binding terminal 202.
Referring to fig. 2 to 10, the technical solution of the present application will now be described with reference to the embodiments.
The display module assembly 1 provided by the application comprises a binding area 2, wherein the binding area 2 comprises a central area 4 and edge areas 5 positioned on two sides of the central area 4.
Referring to fig. 2, the bonding area 2 is a bonding area between the flexible circuit board 80 and the display panel 40.
Wherein, the display panel 40 is provided with a first binding terminal 102 and a first mark terminal 103, and the flexible circuit board 80 is provided with a second binding terminal 202 and a second mark terminal 203.
The thickness of at least one of the first mark terminal 103 and the second mark terminal 203 can be reduced, so that the thickness of the alignment terminal set 110 is smaller than the thickness of the binding terminal set 100.
Referring to fig. 3 to 8, in some embodiments, the flexible circuit board 80 includes a second binding terminal 202 located in the central region 4, and a second marking terminal 203 located in the edge region 5; the thickness of the second mark terminal 203 in the flexible circuit board 80 is smaller than the thickness of the second binding terminal 202.
Wherein the second binding terminal 202 may be rectangular or parallelogram.
Wherein the second tab terminal 203 is trapezoidal or "T" shaped.
In one embodiment, referring to fig. 3, the surface area of any of the second tag terminals 203 is larger than the surface area of any of the second binding terminals 202.
In the embodiment, by increasing the surface area of the second mark terminal 203, after being bound with the display panel 40, the pressure of the second mark terminal 203 on the display panel 40 is reduced, thereby further alleviating the technical problem that the display panel 40 is easy to break at the mark terminal group.
In one embodiment, the arrangement density of the second flag terminals 203 is greater than the arrangement density of the second binding terminals 202.
In the present embodiment, by increasing the arrangement density of the second mark terminals 203 in the edge region 5, after being bound with the display panel 40, the pressure of the second mark terminals 203 on the display panel 40 is reduced, thereby further alleviating the technical problem that the display panel 40 is easy to break at the mark terminal group.
In one embodiment, the thickness of the second tag terminal 203 is smaller than the thickness of the second binding terminal 202.
Referring to fig. 4, in an embodiment, the second binding terminal 202 is a stacked structure of a conductive layer and a protective layer, and the second tag terminal 203 is a single-layer structure of a conductive layer.
Wherein the second flag terminal 203 is provided with only a conductive layer.
Wherein, the preparation material of the conducting layer can be copper.
Wherein the sum of the thickness of the second flag terminal 203 and the thickness of the protection layer is equal to the thickness of the second binding terminal 202.
Wherein, the preparation material of the protective layer comprises at least one of nickel or gold, and the thickness of the protective layer ranges from 2 micrometers to 6 micrometers.
It is understood that the conductive layer at the second binding terminal 202 and the conductive layer at the second mark terminal 203 can be prepared by the same process, so that the thicknesses of the two are the same, and the thickness of the second mark terminal 203 can be reduced by not providing the second mark terminal 203 with a protective layer.
It is understood that the protective layer protects the conductive layer, and the protection includes at least one of moisture barrier, oxidation prevention, and scratch prevention; providing the protective layer at the second binding terminal 202 can prevent the conductive layer of the second binding terminal 202 from failing or breaking.
It should be noted that the second mark terminal 203 does not need to perform a conductive function, and the second mark terminal 203 is used for aligning with the first mark terminal 103 when being bound with the display panel 40, so as to improve the alignment accuracy of binding the flexible circuit board 80 and the display panel 40. Therefore, the protective layer at the second tag terminal 203 can be removed or not provided at the second tag terminal 203, so that the thickness of the second tag terminal 203 is smaller than that of the second binding terminal 202, and the function of the second tag terminal 203 is not affected.
In this embodiment, only the second mark terminal 203 is not provided with the protective layer, so that the effect of making the thickness of the second mark terminal 203 smaller than the thickness of the second binding terminal 202 can be achieved, and the preparation process is simple and the cost is low.
Referring to fig. 5 to 7, in an embodiment, the second mark terminal 203 and the second binding terminal 202 are stacked structures of a conductive layer and a protective layer, the conductive layer includes a first conductive portion 301 corresponding to the second binding terminal 202 and a second conductive portion 302 corresponding to the second mark terminal 203, wherein a thickness of the first conductive portion 301 is greater than a thickness of the second conductive portion 302.
Wherein the protection layer includes a second protection portion 304 corresponding to the second tag terminal 203, and a first protection portion 303 corresponding to the second binding terminal 202.
Wherein the thickness of the second protection portion 304 is less than or equal to the thickness of the first protection portion 303.
Wherein the cross-sections of the second binding terminal 202 and the second flag terminal 203 may be both rectangular.
It is understood that the thickness of the second protection portion 304 can be smaller than the thickness of the first protection portion 303, and the thickness of the second conductive portion 302 can also be smaller than the thickness of the first conductive portion 301 by controlling the difference between the etching rate at the second mark terminal 203 and the etching rate at the second binding terminal 202.
In this embodiment, the etching rates of different regions are only changed without changing the process, so that the thickness of the second mark terminal 203 is smaller than that of the second binding terminal 202, and the change is small and the cost is low based on the existing process.
In one embodiment, the conductive layer is made of copper, and the second conductive portion 302 has a thickness in a range from 5 microns to 6 microns.
Referring to fig. 6 and 7, in an embodiment, the second tab terminal 203 includes a plurality of chamfers 3, wherein at least one of the chamfers 3 is a rounded corner.
Wherein the rounded corners generate less pressure on the display panel 40.
It is understood that when the second flag terminal 203 has a rectangular cross section, it may have four chamfers 3, and at least one of the chamfers 3 has a rounded corner comprising: one chamfer 3 is a fillet, or two adjacent chamfers 3 are fillets, or two opposite chamfers 3 are fillets, or three chamfers 3 are fillets, or four chamfers 3 are fillets.
In this embodiment, by making the chamfer 3 of the second mark terminal 203 be a rounded corner, the pressure or impact of the chamfer 3 of the second mark terminal 203 on the display panel 40 is reduced, and the technical problem that the display panel 40 is easily broken at the alignment terminal group 110 is further alleviated.
In one embodiment, the second flag terminals 203 of the edge regions 5 located on different sides are symmetrically arranged with respect to the central region 4.
It can be understood that the second mark terminals 203 can be symmetrically disposed by a mask having a symmetrical structure, and the opening of the mask is simpler and more convenient, which can reduce the cost.
In the embodiment, the symmetrical structure design improves the uniformity of stress distribution, simplifies the process of the process and reduces the complexity of the process.
Referring to fig. 8, in some embodiments, a compensation terminal is further disposed in the edge region 5, and a width of the compensation terminal is greater than or equal to 50 micrometers.
In one embodiment, the compensation terminal includes a first compensation terminal 401, the first compensation terminal 401 is disposed on a side of the second tag terminal 203 close to the second binding terminal 202, and a minimum distance d2 between the first compensation terminal 401 and the second binding terminal 202 is greater than or equal to 50 micrometers.
Wherein the width d1 of the first compensation terminal 401 is greater than 50 micrometers, and the minimum distance d3 of the second flag terminal 203 from the second binding terminal 202 is greater than 100 micrometers.
In one embodiment, the compensation terminal further includes a second compensation terminal 402, the second compensation terminal 402 is disposed on a side of the second mark terminal 203 far from the second binding terminal 202, a minimum distance d5 between the second compensation terminal 402 and the second mark terminal 203 is greater than or equal to 50 micrometers, and a minimum distance d6 between the second compensation terminal 402 and a side edge of the edge region 5 is greater than 500 micrometers.
Wherein the minimum distance d7 of the second flag terminal 203 from the side of the edge area 5 is greater than 600 micrometers.
Referring to fig. 9 to 10, in some embodiments, in the bonding region 2, the display panel 40 includes a first bonding terminal 102 located in the central region 4, and a first mark terminal 103 located in the edge region 5; the description will be given by taking an example in which the thickness of the first mark terminal 103 in the display panel 40 is smaller than the thickness of the first binding terminal 102.
The first mark terminal 103 and the second mark terminal 203 are aligned, and the first binding terminal 102 and the second binding terminal 202 are aligned.
It is understood that the set position of the first flag terminal 103 corresponds to the set position of the second flag terminal 203, and the set position of the first binding terminal 102 corresponds to the second binding terminal 202.
Referring to fig. 10, in an embodiment, the thickness of the first flag terminal 103 is smaller than that of the first binding terminal 102.
Referring to fig. 10, in an embodiment, the first binding terminal 102 has a stacked structure, and the first flag terminal 103 has a single-layer structure.
In one embodiment, the first tag terminal 103 and the first binding terminal 102 are both of a laminated structure, and the first tag terminal 103 and the first binding terminal 102 each include a conductive film layer and a protective film layer.
In one embodiment, the conductive film layer is made of copper, and the thickness of the conductive film layer ranges from 5 micrometers to 6 micrometers.
In one embodiment, the first flag terminal 103 includes a plurality of chamfers 3, wherein at least one of the chamfers 3 is a rounded corner.
In one embodiment, the first flag terminals 103 of the edge regions 5 located on different sides are symmetrically arranged with respect to the central region 4.
In one embodiment, a compensation terminal is further provided in the edge region 5, and the width of the compensation terminal is greater than or equal to 50 micrometers.
In one embodiment, the compensation terminal includes a third compensation terminal disposed on a side of the first mark terminal 103 close to the first binding terminal 102, and a minimum distance of the third compensation terminal from the first binding terminal 102 is greater than or equal to 50 micrometers.
Wherein a width of the third compensation terminal is greater than or equal to 50 micrometers.
In one embodiment, the compensation terminal further includes a fourth compensation terminal, the fourth compensation terminal is disposed on a side of the first mark terminal 103 far from the first binding terminal 102, a minimum distance of the fourth compensation terminal from the first mark terminal 103 is greater than or equal to 50 micrometers, and a minimum distance of the first compensation terminal 401 from a side of the edge area 5 is greater than 500 micrometers.
Wherein a width of the fourth compensation terminal is greater than or equal to 50 micrometers.
In some embodiments, the thickness of the first flag terminal 103 in the display panel 40 is smaller than the thickness of the first binding terminal 102, and the thickness of the second flag terminal 203 in the flexible circuit board 80 is smaller than the thickness of the second binding terminal 202, and the first flag terminal 103 and the second flag terminal 203 can refer to the first flag terminal 103 and the second flag terminal 203 in any of the embodiments, which is not described herein again.
The application also provides a display device, the display device comprises the display module. The display module includes a binding region, which is not described herein again.
The display module provided by the embodiment comprises a display panel and a flexible circuit board, wherein the display panel comprises a first binding terminal and a first marking terminal, the flexible circuit board is bound and connected with the display panel, the flexible circuit board comprises a second binding terminal and a second marking terminal, the second binding terminal and the first binding terminal are correspondingly abutted to form a binding terminal group, the second marking terminal and the first marking terminal are oppositely arranged to form an alignment terminal group, the display module comprises a binding area, the binding area comprises a central area and edge areas positioned on two sides of the central area, the binding terminal group is arranged in the central area, the alignment terminal group is arranged in the edge areas, and the thickness of any alignment terminal group is smaller than that of the binding terminal group; the thickness of the alignment terminal group is smaller than that of the binding terminal group, so that the stress on the alignment terminal group in the edge area is improved, the stress on the display panel caused by the alignment terminal group is reduced, and the technical problem that the display panel of the existing display module is easy to break when the display module marks the terminal group is solved.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display module provided by the embodiment of the present application is described in detail above, and a specific example is applied to explain the principle and the implementation manner of the present application, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. The utility model provides a display module assembly, includes the binding area, the binding area includes central zone, is located the marginal area of central zone both sides, its characterized in that includes:
a display panel including a first binding terminal, a first mark terminal;
the flexible circuit board is bound and connected with the display panel and comprises a second binding terminal and a second marking terminal, the second binding terminal and the first binding terminal are correspondingly abutted to form a binding terminal group, and the second marking terminal and the first marking terminal are arranged in an alignment mode to form an alignment terminal group;
the binding terminal group is arranged in the central area, the alignment terminal group is arranged in the edge area, and the thickness of any alignment terminal group is smaller than that of the binding terminal group.
2. The display module of claim 1, wherein a thickness of the second flag terminal is less than a thickness of the second binding terminal.
3. The display module of claim 2, wherein the second binding terminal is a stacked structure of a conductive layer and a protective layer, and the second marking terminal is a single-layer structure of a conductive layer.
4. The display module according to claim 2, wherein the second tag terminal and the second binding terminal are each a stacked structure of a conductive layer and a protective layer, the conductive layer includes a first conductive portion corresponding to the second binding terminal and a second conductive portion corresponding to the second tag terminal, and a thickness of the first conductive portion is greater than a thickness of the second conductive portion.
5. The display module of claim 4, wherein the conductive layer is made of copper, and the second conductive portion has a thickness ranging from 5 microns to 6 microns.
6. The display module of claim 2, wherein the second flag terminal comprises a plurality of chamfers, wherein at least one of the chamfers is a rounded corner.
7. The display module according to claim 2, wherein the second flag terminals located in the edge regions on different sides are symmetrically disposed with respect to the central region.
8. The display module of claim 2, wherein a compensation terminal is further disposed at the edge region, and a width of the compensation terminal is greater than or equal to 50 μm.
9. The display module of claim 8, wherein the compensation terminal comprises a first compensation terminal disposed on a side of the second flag terminal adjacent to the second binding terminal, and a minimum distance of the first compensation terminal from the second binding terminal is greater than or equal to 50 μm.
10. The display module of claim 9, wherein the compensation terminal further comprises a second compensation terminal disposed on a side of the second mark terminal away from the second binding terminal, a minimum distance of the second compensation terminal from the second mark terminal is greater than or equal to 50 micrometers, and a minimum distance of the second compensation terminal from a side of the edge region is greater than 500 micrometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210012857.XA CN114389064B (en) | 2022-01-07 | 2022-01-07 | Display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210012857.XA CN114389064B (en) | 2022-01-07 | 2022-01-07 | Display module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114389064A true CN114389064A (en) | 2022-04-22 |
| CN114389064B CN114389064B (en) | 2023-06-02 |
Family
ID=81199515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210012857.XA Active CN114389064B (en) | 2022-01-07 | 2022-01-07 | Display module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114389064B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114973953A (en) * | 2022-05-25 | 2022-08-30 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
| CN114973946A (en) * | 2022-05-18 | 2022-08-30 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110061037A (en) * | 2019-04-25 | 2019-07-26 | 京东方科技集团股份有限公司 | Flexible base board and display device |
| CN111883039A (en) * | 2020-07-31 | 2020-11-03 | 厦门天马微电子有限公司 | Drive chip and display device |
| CN215341900U (en) * | 2020-12-01 | 2021-12-28 | 深圳柔宇显示技术有限公司 | Display device |
| CN114967260A (en) * | 2022-05-30 | 2022-08-30 | 京东方科技集团股份有限公司 | Array substrate and display device |
-
2022
- 2022-01-07 CN CN202210012857.XA patent/CN114389064B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110061037A (en) * | 2019-04-25 | 2019-07-26 | 京东方科技集团股份有限公司 | Flexible base board and display device |
| CN111883039A (en) * | 2020-07-31 | 2020-11-03 | 厦门天马微电子有限公司 | Drive chip and display device |
| CN215341900U (en) * | 2020-12-01 | 2021-12-28 | 深圳柔宇显示技术有限公司 | Display device |
| CN114967260A (en) * | 2022-05-30 | 2022-08-30 | 京东方科技集团股份有限公司 | Array substrate and display device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114973946A (en) * | 2022-05-18 | 2022-08-30 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
| CN114973946B (en) * | 2022-05-18 | 2023-08-22 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
| CN114973953A (en) * | 2022-05-25 | 2022-08-30 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
| CN114973953B (en) * | 2022-05-25 | 2024-01-26 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114389064B (en) | 2023-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114389064A (en) | Display module | |
| JP5274564B2 (en) | Flexible substrate and electric circuit structure | |
| KR101657330B1 (en) | Semiconductor dece | |
| JPH03275394A (en) | Preparation of ic card | |
| CN112599574B (en) | Display module and display device | |
| CN111880679B (en) | touch display device | |
| CN111638607B (en) | Narrow-frame display panel and preparation method thereof | |
| WO2023231682A1 (en) | Array substrate and display apparatus | |
| TW202206905A (en) | Display device | |
| CN113825304B (en) | Circuit board structure and display device | |
| US10014249B2 (en) | Circuit board and smart card module and smart card utilizing the same | |
| CN114241922B (en) | Display panel and display module | |
| US11428996B2 (en) | Display device | |
| US10032708B2 (en) | Circuit board and smart card module and smart card utilizing the same | |
| US20060132466A1 (en) | Touch panel | |
| JP2978684B2 (en) | Liquid crystal display | |
| CN113870732B (en) | Display device | |
| US10488580B2 (en) | Display module | |
| CN110391192A (en) | Package structure membrane of flip chip package | |
| US7538278B2 (en) | Printed circuit board for preventing increase of thermal expansion | |
| JP2011238657A (en) | Chip-on film | |
| JP3897484B2 (en) | Wiring board lead terminal structure | |
| CN110703521A (en) | Liquid crystal display panel | |
| CN219842609U (en) | Display panel and display device | |
| CN217718387U (en) | Narrow-frame liquid crystal display module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |