CN114384720A - Display module and display device - Google Patents
Display module and display device Download PDFInfo
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- CN114384720A CN114384720A CN202111521409.4A CN202111521409A CN114384720A CN 114384720 A CN114384720 A CN 114384720A CN 202111521409 A CN202111521409 A CN 202111521409A CN 114384720 A CN114384720 A CN 114384720A
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- metal wire
- gnd metal
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/22—Antistatic materials or arrangements
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- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
The invention discloses a display module and display equipment, the display module includes: a liquid crystal; a CF substrate, wherein an upper GND metal lead is arranged in a non-display area facing the liquid crystal; a TFT substrate provided with a lower GND metal wire in a non-display region facing the liquid crystal; the anisotropic conductive adhesive encapsulates the liquid crystal and is conducted with the upper GND metal lead and the lower GND metal lead; the FPC is conducted with the lower CNG lead; and the backlight module is conducted with the FPC. In the manufacturing process meeting the electrostatic discharge requirement, a silver paste dispensing process is not needed, and waiting for silver paste cooling is not needed, so that the process flow is shortened, the manufacturing time is shortened, the production cost is reduced, and the production efficiency is improved; hidden troubles caused by too little or too much silver paste are avoided, and the product yield is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module and display equipment.
Background
Taking a mobile phone as an example, the display module is one of the important components of the mobile phone, and has a complex structure, numerous components and a long production flow. In addition, the display module generates static electricity during the use process, so that the display module needs to be subjected to anti-static treatment. The silver paste 3' process is an anti-static method commonly contained and adopted in the liquid crystal display industry at present, and is used for releasing static electricity on the surface of a display module, preventing an electric field generated by the static electricity from influencing liquid crystal rotation so as to influence the display effect, and simultaneously preventing the electric field from influencing touch control so as to report points randomly and influence the touch control effect. As shown in fig. 1 and fig. 2, wherein the arrows in fig. 1 indicate the flow path of the static electricity, a high resistance film 2 'is coated on the CF substrate 1' as the starting point of the static electricity collection and dispersion on the display module. Static electricity generated by the display module flows to the backlight module 6 'through the high-resistance film 2', the silver paste 3 ', the TFT substrate 4' and the FPC5 ', and then flows to the whole machine shell through the backlight module 6', so that the static electricity is released.
However, since the silver paste 3 'process is operated in a liquid flowable state of the silver paste 3', it is then solidified by natural cooling. The 3' amount of silver paste is difficult to control due to flowability. The dots are less and easy to be covered incompletely, and the electrostatic discharge lines are different, so that the function is lost. The points are more than the upper polaroid easily and interfere with the cover plate, and the TFT substrate 4 'is fractured easily by silver paste 3' in the following cover plate attaching process, so that abnormal display is caused. And because of the natural cooling solidification mode, the time is relatively long, and the real-time connection operation of the display module is influenced.
Disclosure of Invention
The invention discloses a display module and display equipment, which are used for solving the problem that the amount of silver paste is difficult to control when static silver paste is released through a silver paste dispensing process in the prior art.
In order to solve the problems, the invention adopts the following technical scheme:
provide a display module assembly, include:
a liquid crystal;
the CF substrate is arranged on the liquid crystal, and an upper GND metal lead is arranged on the CF substrate in a non-display area facing the liquid crystal;
the TFT substrate is arranged below the liquid crystal, and a lower GND metal lead is arranged on the TFT substrate in a non-display area facing the liquid crystal;
an anisotropic conductive paste disposed between the CF substrate and the TFT substrate, encapsulating the liquid crystal, and being in conduction with the upper GND metal wire and the lower GND metal wire;
the FPC is bound on the TFT substrate and is conducted with the lower CNG lead;
and the backlight module is arranged below the TFT substrate and is conducted with the FPC.
Optionally, the upper GND metal wire continuously surrounds the CF substrate, and the lower GND metal wire continuously surrounds the TFT substrate.
Optionally, the upper GND metal lead is formed by a plurality of upper metal wires arranged at intervals from the center to the periphery of the CF substrate, and each upper metal wire extends continuously in the circumferential direction of the CF substrate.
Optionally, the lower GND metal wire is formed by a plurality of lower metal wires arranged at intervals from the center to the periphery of the TFT substrate, each of the lower metal wires extends continuously in the circumferential direction of the TFT substrate, and the FPC is connected to each of the lower metal wires through an auxiliary wire.
Optionally, the width of each part of the upper GND metal wire and the lower GND metal wire is 0.5-1 mm.
Optionally, the anisotropic conductive adhesive covers each of the upper metal lines and each of the lower metal lines.
Optionally, the upper GND metal wire and the lower GND metal wire are metal layer etching structures.
Optionally, a non-display area of the TFT substrate is provided with a control circuit connected to the TFT, and the lower GND metal wire is located on an outer layer of the control circuit and an insulating layer is provided between the control circuit and the lower GND metal wire.
Optionally, the distance between the lower GND metal wire and the TFT is greater than 0.5 mm.
Still provide a display device, include any one of the above-mentioned display module assembly.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the manufacturing process of the display module meeting the requirement of releasing static electricity, a silver paste dispensing process is not needed, and waiting for silver paste cooling is not needed, so that the process flow is shortened, the manufacturing time is shortened, the production cost is reduced, and the production efficiency is improved; hidden troubles caused by too little or too much silver paste are avoided, and the yield of products is improved; an upper GND metal wire and a lower GND metal wire can be arranged according to the width of the anisotropic conductive adhesive, so that the conduction contact area of the upper GND metal wire, the anisotropic conductive adhesive and the lower GND metal wire is increased, and static electricity can be released more quickly; the sealing performance of the anisotropic conductive adhesive, the CF substrate and the TFT substrate is ensured, and the risk that moisture and the like enter a sealing cavity limited by the anisotropic conductive adhesive to damage a TFT and the like is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below to form a part of the present invention, and the exemplary embodiments and the description thereof illustrate the present invention and do not constitute a limitation of the present invention. In the drawings:
fig. 1 is a schematic view of a stacked structure of a display module disclosed in the prior art;
FIG. 2 is a schematic top view of a display module according to the prior art;
fig. 3 is a schematic view of a stacked structure of a display module according to an embodiment of the disclosure;
fig. 4 is a schematic top view of a display module according to an embodiment of the disclosure.
Wherein the following reference numerals are specifically included in figures 1-4:
CF substrate-1'; high resistance film-2'; silver paste-3'; TFT substrate-4'; FPC-5'; backlight module-6';
CF substrate-1; an upper GND metal lead-11; a TFT substrate-2; a lower GND metal lead-21; a driver IC-22; liquid crystal-3; anisotropic conductive adhesive-4; FPC-5; a backlight module-6; conductive double-sided adhesive tape-7.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 3 and 4, wherein arrows in fig. 3 indicate a flow path of static electricity, the display module of the present invention includes a CF substrate 1, a TFT substrate 2, a liquid crystal 3 sandwiched between the CF substrate 1 and the TFT substrate 2, an anisotropic conductive adhesive 4 encapsulating the liquid crystal 3, an FPC5 bonded to the TFT substrate 2, and a backlight module 6 disposed on the back of the TFT substrate 2. The CF substrate 1 is provided with an upper GND (ground terminal of wire) metal lead in the non-display area of the side facing the liquid crystal 3, and the upper GND metal lead 11 is used as the starting point of electrostatic collection and dispersion on the display module. The TFT substrate 2 is provided with a lower GND metal wiring 21 in a non-display region on a side facing the liquid crystal 3. The upper and lower GND metal wires 11 and 21 are connected to the anisotropic conductive film 4, and the lower GND metal wire 21 is connected to the FPC 5.
When static electricity is generated due to direct or indirect contact of a human body with, for example, a cover plate in a production process of the display module or when static electricity is generated due to unbalanced distribution of surface charges of components caused by, for example, electromagnetic induction of the cover plate in a use process of the display module, the static electricity is collected by the upper GND metal lead 11 of the CF substrate 1, then flows to the backlight module 6 through the anisotropic conductive adhesive 4, the lower GND metal lead 21 of the TFT substrate 2 and the FPC5 in sequence, then is conducted to the whole machine casing through the backlight module 6, and is released by the whole machine casing.
Through the arrangement of the mode, in the manufacturing process of the display module meeting the electrostatic discharge requirement, a silver paste dispensing process is not needed, and waiting for silver paste cooling is not needed, so that the process flow is shortened, the manufacturing time is shortened, the production cost is reduced, and the production efficiency is improved; hidden troubles caused by too little or too much silver paste are avoided, and the product yield is improved.
To achieve the above object, the components of the display module can be arranged in various ways, and the following describes the structure of each component in detail by taking a specific embodiment as an example.
The CF substrate 1 may be a glass substrate, the middle portion is a display region, and the periphery is a non-display region. The structure in the display region of the CF substrate 1 is the same as that of a normal one, and a black matrix, a color layer, a protective layer, an ITO conductive film, and the like may be provided in this order. The non-display area of the CF substrate 1 is provided with an upper GND metal wiring 11 continuously extending around the circumference of the CF substrate 1. At this time, the high-resistance film is omitted from the side of the CF substrate 1 facing away from the liquid crystal 3, i.e., the high-resistance film is not coated.
The upper GND metal wiring 11 may be formed in such a manner that a metal layer is coated and etched. The specific structure of the upper GND metal wiring 11, i.e., the pattern constituting the upper GND metal wiring 11, may be various. In one example, the upper GND metal wire 11 is composed of a plurality of upper metal wires, each of which continuously surrounds the CF substrate 1 around the CF substrate 1, and the plurality of upper metal wires are arranged at intervals along the direction from the display area to the non-display area of the CF substrate 1. The width of each upper metal wire can be specifically set according to requirements, and the distance between every two adjacent upper metal wires can also be specifically set according to requirements. The width of each part of the upper GND metal lead 11, i.e., the sum of the width of the space between the outermost upper metal lines and the width of the two outermost upper metal lines, may be 0.5 to 1 mm. The distance between the upper GND metal wire 11 and the display area of the CF substrate 1 is greater than 0.5mm, so as to reduce the risk of short circuit between the upper GND metal wire 11 and the structure in the display area of the CF substrate 1.
The TFT substrate 2 may also be a glass substrate, with a display region in the middle and a non-display region in the periphery. The structure of the TFT substrate 2 in the display region is the same as usual, and includes TFTs and the like. A control circuit, such as a scanning circuit and a driving circuit, connected to the TFT is provided on a layer surface of the TFT substrate 2 in the non-display region. A drive IC22 is provided at one side edge of the non-display region of the TFT substrate 2. The non-display area of the TFT substrate 2 is provided with a lower GND metal lead 21 extending continuously around the circumference of the TFT substrate 2 at a level away from the TFT substrate 2, the lower GND metal lead 21 is located inside the driver IC22, and an insulating layer is provided between the lower GND metal lead 21 and the control circuit.
The lower GND metal wire 21 may be shaped in such a manner that a metal layer is coated and etched. The specific structure of the lower GND metal wiring 21, i.e., the pattern constituting the lower GND metal wiring 21, may be various. In one example, the configuration of the lower GND metal wire 21 is the same as that of the upper GND metal wire 11. The lower GND metal lead 21 is formed by a plurality of lower metal wires, each of which continuously surrounds the CF substrate 1 around the circumference of the CF substrate 1, and the plurality of lower metal wires are arranged at intervals in the direction from the display region to the non-display region of the CF substrate 1. The width of each portion of the lower GND metal wire 21, i.e., the sum of the width of the outermost two lower metal wires and the width of the outermost lower metal wires, may be 0.5 to 1 mm. The distance between the lower GND metal wire 21 and the display area of the CF substrate 1 is greater than 0.5mm, so as to reduce the risk of short circuit between the lower GND metal wire 21 and the TFT on the TFT substrate 2. A plurality of auxiliary wires are provided on the TFT substrate 2, and the auxiliary wires are connected to the FPC5 and the respective lower metal lines to conduct the lower GND metal wires 21 and the FPC 5.
The anisotropic conductive adhesive 4 is an adhesive which contains conductive gold balls inside, and is conductive in the Z direction and non-conductive in the X and Y directions. When the anisotropic conductive paste 4 is applied, the conductive gold balls are pressed to break the conductive gold balls, thereby connecting the upper GND metal wire 11 and the lower GND metal wire 21. The width of the anisotropic conductive paste 4 may be slightly larger than the widths of the upper GND metal wire 11 and the lower GND metal wire 21, so that the anisotropic conductive paste 4 completely covers the upper GND metal wire 11 and the lower GND metal wire 21, i.e. the anisotropic conductive paste 4 covers the upper metal lines and the lower metal lines.
The FPC5 may extend from the back of the backlight module 6 to connect with the main circuit board of the display device. And then the conductive double-sided adhesive tape 7 is adhered between the FPC5 and the backlight module 6, so that the FPC5 is electrically conducted with the backlight module 6, and the structure is simple.
The backlight module 6 may have the same structure as a general structure, and may be a direct type backlight module 6 or a side type backlight module 6. The direct type backlight module 6 and the side type backlight module 6 have the same structure as a general structure, for example, the side type backlight module 6 includes a metal frame, and a backlight source, a reflective sheet, a light guide plate, an optical film layer, and the like disposed in the metal frame.
By arranging all parts of the display module in the manner, the upper GND metal wire 11 and the lower GND metal wire 21 can be arranged according to the width of the anisotropic conductive adhesive 4, so that the conduction contact area of the upper GND metal wire 11, the anisotropic conductive adhesive 4 and the lower GND metal wire 21 is increased, and static electricity can be released more quickly; the sealing performance of the anisotropic conductive adhesive 4, the CF substrate 1 and the TFT substrate 2 is ensured, and the risk that moisture and the like enter a sealing cavity defined by the anisotropic conductive adhesive 4 to damage a TFT and the like is reduced; simple structure, the processing preparation of being convenient for, it is efficient, with low costs.
Of course, the components of the display module may be arranged in other manners, such as the upper GND metal wire 11 and the lower GND metal wire 21 are in a grid structure with intersecting vertical and horizontal metal wires.
The display device of the invention can be a mobile terminal (such as a mobile phone, a personal computer and the like), a vehicle-mounted display screen, a wearable device and the like. In the display equipment, in the manufacturing process of the display equipment, which meets the requirement of electrostatic discharge, a silver paste dispensing process is not needed, and waiting for silver paste cooling is not needed, so that the process flow is shortened, the manufacturing time is shortened, the production cost is reduced, and the production efficiency is improved; hidden troubles caused by too little or too much silver paste are avoided, and the yield of products is improved; the upper GND metal wire 11 and the lower GND metal wire 21 can be arranged according to the width of the anisotropic conductive adhesive 4, so that the conducting contact area of the upper GND metal wire 11, the anisotropic conductive adhesive 4 and the lower GND metal wire 21 is increased, and static electricity can be released more quickly; the sealing performance of the anisotropic conductive adhesive 4 with the CF substrate 1 and the TFT substrate 2 is ensured, and the risk that moisture and the like enter a sealing cavity defined by the anisotropic conductive adhesive 4 to damage a TFT and the like is reduced.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A display module, comprising:
a liquid crystal;
the CF substrate is arranged on the liquid crystal and provided with an upper GND metal lead in a non-display area facing the liquid crystal;
a TFT substrate disposed under the liquid crystal, the TFT substrate being provided with a lower GND metal wire at a non-display region facing the liquid crystal;
an anisotropic conductive paste disposed between the CF substrate and the TFT substrate, encapsulating the liquid crystal, and being in conduction with the upper GND metal wire and the lower GND metal wire;
the FPC is bound on the TFT substrate and is conducted with the lower CNG lead;
and the backlight module is arranged below the TFT substrate and is conducted with the FPC.
2. The display module of claim 1, wherein the upper GND metal wire continuously surrounds the CF substrate and the lower GND metal wire continuously surrounds the TFT substrate.
3. The display module according to claim 2, wherein the upper GND metal wires are formed by a plurality of upper metal wires arranged at intervals from the center to the periphery of the CF substrate, and each upper metal wire continuously extends in the circumferential direction of the CF substrate.
4. The display module according to claim 3, wherein the lower GND metal wire is formed by a plurality of lower metal wires arranged at intervals from a center to an outer periphery of the TFT substrate, each of the lower metal wires extends continuously in a circumferential direction of the TFT substrate, and the FPC is connected to each of the lower metal wires through an auxiliary wire.
5. The display module of claim 4, wherein the width of the upper GND metal wire and the lower GND metal wire at each position is 0.5-1 mm.
6. The display module of claim 4, wherein the anisotropic conductive film covers each of the upper metal lines and each of the lower metal lines.
7. The display module according to any one of claims 1 to 6, wherein the upper GND metal wire and the lower GND metal wire are metal layer etched structures.
8. The display module according to any one of claims 1 to 6, wherein the non-display area of the TFT substrate is provided with a control circuit connected with the TFT, and the lower GND metal wire is positioned outside the control circuit and provided with an insulating layer between the lower GND metal wire and the control circuit.
9. The display module of any one of claims 1-6, wherein the distance between the lower GND metal wire and the TFT on the TFT substrate is greater than 0.5 mm.
10. A display device comprising the display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111521409.4A CN114384720A (en) | 2021-12-13 | 2021-12-13 | Display module and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111521409.4A CN114384720A (en) | 2021-12-13 | 2021-12-13 | Display module and display device |
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| CN114384720A true CN114384720A (en) | 2022-04-22 |
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| CN202111521409.4A Pending CN114384720A (en) | 2021-12-13 | 2021-12-13 | Display module and display device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040046909A1 (en) * | 2001-06-29 | 2004-03-11 | Kanetaka Sekiguchi | Liquid crystal display panel and its manufacturing method |
| CN101685211A (en) * | 2008-09-26 | 2010-03-31 | 乐金显示有限公司 | Liquid crystal display and fabricating method thereof |
| CN104330908A (en) * | 2014-11-19 | 2015-02-04 | 京东方科技集团股份有限公司 | Color film substrate and manufacturing method thereof, display panel and display device |
| CN104793362A (en) * | 2015-03-30 | 2015-07-22 | 深超光电（深圳）有限公司 | Liquid crystal display panel |
| US20160070146A1 (en) * | 2014-09-09 | 2016-03-10 | Boe Technology Group Co., Ltd. | Color film substrate and liquid crystal display device |
-
2021
- 2021-12-13 CN CN202111521409.4A patent/CN114384720A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040046909A1 (en) * | 2001-06-29 | 2004-03-11 | Kanetaka Sekiguchi | Liquid crystal display panel and its manufacturing method |
| CN101685211A (en) * | 2008-09-26 | 2010-03-31 | 乐金显示有限公司 | Liquid crystal display and fabricating method thereof |
| US20160070146A1 (en) * | 2014-09-09 | 2016-03-10 | Boe Technology Group Co., Ltd. | Color film substrate and liquid crystal display device |
| CN104330908A (en) * | 2014-11-19 | 2015-02-04 | 京东方科技集团股份有限公司 | Color film substrate and manufacturing method thereof, display panel and display device |
| CN104793362A (en) * | 2015-03-30 | 2015-07-22 | 深超光电（深圳）有限公司 | Liquid crystal display panel |
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