CN114379239B - Heating substrate for thermal printing head with surface resistant to paper dust accumulation and manufacturing method thereof - Google Patents

Heating substrate for thermal printing head with surface resistant to paper dust accumulation and manufacturing method thereof Download PDF

Info

Publication number
CN114379239B
CN114379239B CN202110810382.4A CN202110810382A CN114379239B CN 114379239 B CN114379239 B CN 114379239B CN 202110810382 A CN202110810382 A CN 202110810382A CN 114379239 B CN114379239 B CN 114379239B
Authority
CN
China
Prior art keywords
comb
wear
mastoid
shaped
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110810382.4A
Other languages
Chinese (zh)
Other versions
CN114379239A (en
Inventor
冷正超
王吉刚
曹永茂
陈文卓
山科佳弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shandong Hualing Electronics Co Ltd
Original Assignee
Shandong Hualing Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shandong Hualing Electronics Co Ltd filed Critical Shandong Hualing Electronics Co Ltd
Priority to CN202110810382.4A priority Critical patent/CN114379239B/en
Publication of CN114379239A publication Critical patent/CN114379239A/en
Application granted granted Critical
Publication of CN114379239B publication Critical patent/CN114379239B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33535—Substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3353—Protective layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Landscapes

  • Electronic Switches (AREA)

Abstract

The utility model relates to the technical field of manufacturing of heating substrates for thermal printheads, in particular to a heating substrate for thermal printheads with paper dust accumulation resistant surfaces and a manufacturing method thereof, which are characterized in that the surfaces of a heating resistor body and a comb-shaped common electrode and part of the surfaces of comb-shaped individual electrodes are provided with wear-resistant protection layers; the wear-resistant protective layer is provided with a micro-nano hierarchical structure, and the micro-nano hierarchical structure comprises a micro-level 'mastoid' array and a nano-level particle structure; the micron-sized mastoid arrays are internally provided with micron-sized mastoid with uniform size and consistent density distribution, the diameter range of the mastoid is 2-20 mu m, the height is 1-5 mu m, and the distance between the mastoid is 2-20 mu m; the nano-scale particle structure is arranged on the surface of the mastoid array, and has the advantages of remarkably improving the phenomenon of printing and sticking paper, prolonging the service life of the product, along with self-cleaning, low adhesion property and the like.

Description

Heating substrate for thermal printing head with surface resistant to paper dust accumulation and manufacturing method thereof
Technical Field
The utility model relates to the technical field of manufacturing of heating substrates for thermal printheads, in particular to a heating substrate for thermal printheads, which can obviously improve the phenomenon of printing sticking paper, prolong the service life of products and has self-cleaning and low adhesion characteristics and surface anti-paper scrap accumulation, and a manufacturing method thereof.
Background
It is well known that when a thermal printhead works, a color-developing layer of the thermal medium changes color by heating the printhead, and at the moment, the thermal medium can drop black or white condensate, and the condensate is adhered to a protective layer of a thermal substrate of the printhead in a cooling process to form paper scraps to accumulate, so that the thermal printhead is stuck with paper, and the printing quality and the service life of a product are affected.
The prior art is as follows: in the patent with publication number CN204870085U, a thermal print head is disclosed, which can take away paper scraps by a thermal medium, wherein the outermost surface layer of a heating resistor body is provided with a functional protective layer of hydrophilic material and non-hydrophilic material, and the paper scraps are taken away by the thermal medium in the paper feeding process of the thermal medium. But the utility model is more concerned with the intrinsic hydrophobicity of the material and does not give specific composition and preparation method of the film layer.
In the patent with publication number CN209616659U, a thermal printing device for automatically removing paper scraps on the surface of a thermal printing head is disclosed. The utility model does not innovate the design of the thermal print head.
Lotus leaves, which can produce silt without dyeing, and the surface of the blade has the effects of superhydrophobicity, self-cleaning, low adhesion and the like. The surface of lotus leaf is found to have micro-nano hierarchical structure composed of micron-scale mastoid structure and nano-scale wax layer attached on the structure. The two-stage structure enables a layer of air film to exist between the water drops and the leaf surfaces, reduces the contact area between the leaf surfaces and the water drops, reduces the adhesion force, and enables the water drops to freely roll on the surfaces of the lotus leaves, so that the lotus leaves have self-cleaning capability.
Disclosure of Invention
Aiming at the problems of accumulation of paper scraps and sticking paper of a substrate surface protection layer when the conventional thermal printing head works, the utility model provides a heating substrate for the thermal printing head, which is simple in process, green, pollution-free and controllable in surface resistance to accumulation of paper scraps, and a manufacturing method thereof, so that the phenomena of accumulation of paper scraps and sticking paper in the printing process are improved, and the service life of the thermal printing head is prolonged.
The utility model is achieved by the following measures:
the heating substrate for the thermal printing head, the surface of which is resistant to paper dust accumulation, is provided with an insulating substrate, and the surface of the insulating substrate is provided with a primer layer; the surface of the ground coat layer is provided with a comb-shaped individual electrode and a comb-shaped public electrode, the comb-shaped individual electrode and the comb-shaped public electrode form a comb-shaped electrode pair, and the heating resistor body is arranged in the middle of the comb-shaped electrode pair along the main printing direction; one end of the comb-shaped public electrode is connected with the heating resistor body, and the other end of the comb-shaped public electrode is connected with the COM electrode; one end of each comb-shaped individual electrode is connected with the heating resistor body, and the other end of each comb-shaped individual electrode is connected with the control IC; the wear-resistant protective layer is arranged on the surfaces of the heating resistor and the comb-shaped common electrode and on part of the surfaces of the comb-shaped individual electrodes; the wear-resistant protective layer is provided with a micro-nano hierarchical structure, and the micro-nano hierarchical structure comprises a micro-level 'mastoid' array and a nano-level particle structure; the micron-sized mastoid arrays are internally provided with micron-sized mastoid with uniform size and consistent density distribution, the diameter range of the mastoid is 2-20 mu m, the height is 1-5 mu m, and the distance between the mastoid is 2-20 mu m; the nanoscale particle structures are disposed on the surface of a "mastoid" array.
The particle size range in the nano-scale particle structure is 20-700 nm, and the density distribution is uniform.
The wear-resistant protective layer consists of silicate glass glaze, the thickness of the wear-resistant protective layer is 4-20 mu m, and the micro-nano hierarchical structure is arranged in the region of the wear-resistant protective layer except for the right upper part of the heating resistor body.
The wear-resistant protective layer consists of an inner layer and an outer layer, wherein the inner layer is silicate glass glaze, the thickness of the inner layer is 4-14 mu m, the outer layer is carbide or nitride or sialon ceramic, the thickness of the outer layer is 1-6 mu m, and the micro-nano hierarchical structure is arranged on the surface area of the outer layer except the right upper part of the heating resistor body.
The utility model also provides a manufacturing method of the heating substrate for the thermal printing head with the surface resistant to paper dust accumulation, which comprises the following steps: sintering the surface of the insulating substrate to form a primer layer, and forming a metal electrode layer on the primer layer and part of the area of the insulating substrate to prepare a first metallized substrate; patterning the first metallized substrate by adopting a photoetching technology to form a comb-shaped common electrode and a comb-shaped individual electrode; a heating resistor is arranged along the main printing direction by adopting a drawing or printing mode, and the heating resistor is arranged at the middle part of the comb-shaped part electrode; the method is characterized in that a wear-resistant protective layer is arranged on the surface of the heating resistor, the surface of the comb-shaped common electrode and the surface of the comb-shaped individual electrode part; forming a micro-nano hierarchical structure on the wear-resistant protective layer at a position except for the surface of the wear-resistant protective layer right above the heating resistor body by adopting a laser processing mode; the micro-nano hierarchical structure is manufactured through femtosecond laser processing, and the micro-nano hierarchical structure processing process is completed in water.
The utility model relates to femtosecond laser parameter setting: the method comprises the steps of femtosecond laser single pulse parameter setting and time-shaped femtosecond laser pulse sequence parameter setting, wherein the femtosecond laser single pulse parameter setting comprises the following steps: the central wavelength is 300-900nm, the pulse width is 10-200fs, and the pulse5-500, and setting the repetition frequency to be 1-1kHz; setting parameters of the shaped femtosecond laser pulse sequence: shaping and modulating femtosecond laser single pulse into a pulse sequence consisting of 2-4 sub-pulses, wherein the delay time between adjacent sub-pulses is 0-200fs, the energy of each sub-pulse is the same, and the total energy density of the pulse sequence is 0.2-5J/cm 2 The laser scanning speed is 50-500 μm/s, the scanning interval is 5-11 μm, and the scanning times are 1-3.
The manufacturing method of the wear-resistant protective layer with the micro-nano hierarchical structure comprises the following steps: forming a wear-resistant protective layer with the thickness of 4-20 mu m by screen printing and sintering silicate glass glaze slurry; and forming the micro-nano hierarchical structure on the wear-resistant protective layer at a position except for the surface of the wear-resistant protective layer right above the heating resistor body by a laser processing mode, so as to manufacture the wear-resistant protective layer with the micro-nano hierarchical structure.
The manufacturing method of the wear-resistant protective layer with the micro-nano hierarchical structure comprises the following steps: forming an inner wear-resistant protective layer with the thickness of 4-14 mu m by printing and sintering silicate glass glaze slurry; an outer wear-resistant protective layer formed by carbide or nitride or sialon ceramic is arranged on the surface of the inner wear-resistant protective layer in an evaporation or sputtering coating mode, and the thickness of the outer wear-resistant protective layer is 1-6 mu m; and forming the micro-nano hierarchical structure on the surface of the outer wear-resistant protective layer at a position except the surface of the outer wear-resistant protective layer right above the heating resistor body by a laser processing mode, so as to manufacture the wear-resistant protective layer with the micro-nano hierarchical structure.
The heating substrate for the thermal print head and the manufacturing method thereof have the advantages that when the abrasion-resistant protective layer except for the heating resistor body is etched by using femtosecond laser, the influence on the materials around the processing part is small; when underwater processing is performed, the material removal rate can be improved, and a surface micro-nano hierarchical structure is formed stably; the micro-nano hierarchical structure processed improves the contact angle between the surface of the wear-resistant protective layer and the surface of the paper scraps, reduces the contact area between the wear-resistant protective layer and the paper scraps, effectively reduces the rolling angle of the paper scraps on the surface of the wear-resistant protective layer, and ensures that the paper scraps are not easy to adhere to the surface of the wear-resistant protective layer in the printing process, but are adsorbed and taken away by the thermosensitive paper, thereby realizing the effects of self cleaning, low adhesion, paper scraps accumulation resistance and the like of the wear-resistant protective layer. The surface preparation method of the substrate for preventing paper scraps from accumulating on the surface is simple, has strong operability, can improve the phenomena of paper scraps accumulation and paper sticking in the printing process, and prolongs the service life of the thermal printing head.
Description of the drawings:
FIG. 1 is a schematic cross-sectional view of a heat-generating substrate for a thermal head finally formed in example 1.
FIG. 2 is a schematic cross-sectional view of the heat-generating substrate for a thermal head finally formed in comparative example 1.
FIG. 3 is a schematic cross-sectional view of the heat-generating substrate for thermal head finally formed in example 2.
Fig. 4 is a schematic cross-sectional view of the heat-generating substrate for thermal head finally formed in comparative example 2.
Fig. 5 is a schematic plan view of a substrate after printing or drawing a heating resistor in the embodiment.
FIG. 6 is a schematic cross-sectional view of a micro-nano hierarchical structure of a surface of a wear-resistant protective layer in an embodiment.
FIG. 7 is a Scanning Electron Microscope (SEM) image of a lotus leaf like surface structure according to the present utility model.
Fig. 8 is a Scanning Electron Microscope (SEM) image of a single "mastoid" structure of the lotus-like leaf surface of the present utility model.
FIG. 9 is a graph showing the performance comparison of example 1 and comparative example 1, wherein FIGS. 9 (a) and 9 (b) are schematic cross-sectional views of the products of example 1 and comparative example 1, respectively, and accumulated paper dust when continuously printing 1 Km.
Fig. 10 (a) and 10 (b) are schematic cross-sectional views of the products of example 2 and comparative example 2, respectively, when printing continuously 1 Km.
Reference numerals: the anti-wear protective coating comprises a 1-insulating substrate, a 2-ground coat layer, a 3 a-comb-shaped public electrode, a 3 b-comb-shaped individual electrode, a 4-heating resistor body, a 5-wear protective layer, a 5 a-paper-discharging-side wear protective layer, a 5 b-paper-feeding-side wear protective layer, a 6-inner wear protective layer, a 6 a-paper-discharging-side inner wear protective layer, a 6 b-paper-feeding-side inner wear protective layer, a 7-outer wear protective layer, a 7 a-paper-discharging-side outer wear protective layer, a 7 b-paper-feeding-side outer wear protective layer, an 8-product surface accumulated paper scrap section and a 9-product section.
The specific embodiment is as follows:
specific embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.
Example 1
The embodiment provides a heating substrate for a thermal print head with paper dust accumulation resistant surface, which comprises an insulating substrate 1, wherein a primer layer 2 is formed by printing and sintering the surface of the insulating substrate 1, the primer layer 2 is made of amorphous glass material, a comb-shaped individual electrode 3b and a comb-shaped common electrode 3a are arranged on the surface of the primer layer 2, and a heating resistor 4 is arranged between a comb-shaped electrode pair consisting of the comb-shaped common electrode 3a and the comb-shaped individual electrode 3b along the main printing direction; one end of the comb-shaped public electrode 3a is connected with the heating resistor body 4, and the other end is connected with the COM electrode; one end of the comb-shaped individual electrode 3b is connected with the heating resistor body 4, and the other end is connected with the control IC; wear-resistant protective layers 5 are formed on the surfaces of the heating resistor 4, the comb-shaped common electrode 3a and the comb-shaped individual electrodes 3b, and micro-nano hierarchical structures are arranged on the surfaces of the paper-discharging-side wear-resistant protective layers 5a and the paper-feeding-side wear-resistant protective layers 5 b.
The embodiment also provides a manufacturing method of the heating substrate for the thermal printing head with the surface resistant to paper dust accumulation, which comprises the following steps:
step 1: amorphous glass material is printed on the surface of the insulating substrate 1, and sintered for 0.1 to 2 hours at 900 to 1300 ℃ to form a primer layer 2;
step 2: forming a metal electrode layer on the ground coat layer 2 and part of the insulating substrate 1 by adopting a screen printing and metal slurry sintering mode, wherein the sintering temperature is 600-900 ℃, and the film thickness is 0.2-4 mu m, so as to prepare a first metallized substrate;
step 3: patterning the first metallized substrate by adopting a photoetching technology to form a comb-shaped common electrode 3a and a comb-shaped individual electrode 3b;
step 4: a heating resistor 4 is arranged at the middle part of a comb-shaped electrode pair formed by a comb-shaped common electrode 3a and a comb-shaped individual electrode 3b in a main printing direction by adopting a drawing or printing mode, and is sintered at 700-900 ℃ to form a film with the film thickness of 3-10 mu m;
step 5: the surface of the heating resistor body 4, part of the comb-shaped individual electrodes 3b and all the comb-shaped common electrodes 3a is provided with a wear-resistant protective layer 5 by printing silicate glass glaze slurry, and the film is sintered at 700-900 ℃ to form a film with the film thickness of 4-20 mu m;
step 6: femtosecond laser parameter setting comprises single pulse laser parameter setting and pulse sequence parameter setting after time shaping. Single pulse laser parameter setting: the central wavelength is 300-900nm, the pulse width is 10-200fs, the pulse number is 5-500, and the repetition frequency is set to be 1Hz; setting pulse sequence parameters after shaping: the femtosecond laser monopulse is shaped and modulated into a pulse sequence consisting of 3 subpulses, the delay time between adjacent subpulses is 0-200fs, and the subpulse energy ratio is 1:1:1, the total energy density of the pulse sequence is 0.2-5J/cm 2 The laser scanning speed is 50-500 μm/s, the scanning interval is 5-11 μm, and the scanning times are 1-3.
Step 7: and (3) processing the paper-out side wear-resistant protection layer 5a and the paper-in side wear-resistant protection layer 5b into a micro-nano hierarchical structure under water by utilizing the femtosecond laser pulse sequence set by the parameters in the step (6): the micron-sized mastoid structure has a diameter of 2-20 mu m and a height of about 1-5 mu m, mastoid distances of 2-20 mu m, the mastoid sizes are uniform, the distribution density is basically consistent, the nano particles are uniformly distributed on the surface of the mastoid and the bottom between the mastoid, and the granularity is 20-700 nm.
Comparative example 1:
the comparative example provides a heating substrate for a thermal print head without micro-nano hierarchical structure on the surface of a wear-resistant protective layer, which comprises an insulating substrate 1, wherein a primer layer 2 is formed by printing and sintering the surface of the insulating substrate 1, the primer layer 2 is made of amorphous glass material, a comb-shaped individual electrode 3b and a comb-shaped common electrode 3a are arranged on the surface of the primer layer 2, and a heating resistor 4 is arranged in the middle of a comb-shaped electrode pair consisting of the comb-shaped common electrode 3a and the comb-shaped individual electrode 3b along the main printing direction; one end of the comb-shaped public electrode 3a is connected with the heating resistor body 4, and the other end is connected with the COM electrode; one end of the comb-shaped individual electrode 3b is connected with the heating resistor body 4, and the other end is connected with the control IC; a wear-resistant protective layer 5 is formed on the surface of the heating resistor 4, the surface of the comb-shaped common electrode 3a, and a part of the surface of the comb-shaped individual electrode 3 b.
The method for manufacturing the heating substrate for the thermal head of the comparative example includes the steps of:
step 1: amorphous glass material is printed on the surface of the insulating substrate 1, and sintered for 0.1 to 2 hours at 900 to 1300 ℃ to form a primer layer 2;
step 2: forming a metal electrode layer on the ground coat layer 2 and part of the insulating substrate 1 by adopting a screen printing and metal slurry sintering mode, wherein the sintering temperature is 600-900 ℃, and the film thickness is 0.2-4 mu m, so as to prepare a first metallized substrate;
step 3: patterning the first metallized substrate by adopting a photoetching technology to form a comb-shaped common electrode 3a and a comb-shaped individual electrode 3b;
step 4: a heating resistor 4 is arranged at the middle part of a comb-shaped electrode pair formed by a comb-shaped common electrode 3a and a comb-shaped individual electrode 3b in a main printing direction by adopting a drawing or printing mode, and is sintered at 700-900 ℃ to form a film with the film thickness of 3-10 mu m;
step 5: the surface of the heating resistor body 4, part of the comb-shaped individual electrodes 3b and all the comb-shaped common electrodes 3a is provided with a wear-resistant protective layer 5 by printing silicate glass glaze slurry, and the film is sintered at 700-900 ℃ to form a film with the film thickness of 4-20 mu m;
when the products of example 1 and comparative example 1 continuously work and feed for 1Km, the cross section of the paper dust accumulated on the surface of the product is shown as 9 (a) and 9 (b) in fig. 9, and the accumulated paper dust on the surface of the product of example 1 is reduced by 50% -80% compared with that of comparative example 1.
Example 2:
the embodiment provides a heating substrate for a thermal printing head with the surface resistant to paper dust accumulation, which comprises an insulating substrate 1, wherein a primer layer 2 is formed by printing and sintering the surface of the insulating substrate 1, and the primer layer 2 is made of an amorphous glass material. The surface of the ground coat layer 2 is provided with a comb-shaped individual electrode 3b and a comb-shaped common electrode 3a, and the heating resistor 4 is arranged in the middle of a comb-shaped electrode pair formed by the comb-shaped common electrode 3a and the comb-shaped individual electrode 3b along the main printing direction; one end of the comb-shaped public electrode 3a is connected with the heating resistor body 4, and the other end is connected with the COM electrode; one end of the comb-shaped individual electrode 3b is connected with the heating resistor body 4, and the other end is connected with the control IC; an inner wear-resistant protective layer 6 is manufactured on the surface of the heating resistor body 4, the surface of the comb-shaped common electrode 3a and part of the surface of the comb-shaped individual electrode 3b, an outer wear-resistant protective layer 7 is manufactured on the surface of the inner wear-resistant protective layer 6, and the surfaces of the outer wear-resistant protective layer 7a on the paper outlet side and the outer wear-resistant protective layer 7b on the paper inlet side are provided with micro-nano hierarchical structures.
The embodiment also provides a manufacturing method of the heating substrate for the thermal printing head with the surface resistant to paper dust accumulation, which comprises the following steps:
step 1: amorphous glass material is printed on the surface of the insulating substrate 1, and sintered for 0.1 to 2 hours at 900 to 1300 ℃ to form a primer layer 2;
step 2: forming a metal electrode layer on the ground coat layer 2 and part of the insulating substrate 1 by adopting a screen printing and sintering metal slurry mode, wherein the sintering temperature is 600-900 ℃, and the film thickness is 0.2-4 mu m, so as to prepare a first metallized substrate;
step 3: patterning the first metallized substrate by using a photolithography technique to form a common electrode 3a and an individual electrode 3b;
step 4: a heating resistor 4 is arranged at the middle part of a comb-shaped electrode pair formed by a comb-shaped common electrode 3a and a comb-shaped individual electrode 3b along the main printing direction by adopting a drawing or printing mode, and the film thickness is 3-10 mu m;
step 5: the surfaces of the heating resistor body 4, part of the comb-shaped individual electrodes 3b and all the comb-shaped common electrodes 3a are provided with an inner wear-resistant protective layer 6 by printing silicate glass slurry, and the inner wear-resistant protective layer is sintered at 700-900 ℃ to form a film with the film thickness of 4-14 mu m;
step 6: an outer wear-resistant protective layer 7 formed by carbide ceramics is formed on the surface of the inner wear-resistant protective layer 6 by adopting an evaporation or sputtering coating mode, and the thickness is 1-6 mu m;
step 7: femtosecond laser parameter setting comprises single pulse laser parameter setting and pulse sequence parameter setting after time shaping. Single pulseSetting laser parameters: the central wavelength is 300-900nm, the pulse width is 10-200fs, the pulse number is 5-500, and the repetition frequency is set to be 1Hz; setting pulse sequence parameters after shaping: the femtosecond laser monopulse is shaped and modulated into a pulse sequence consisting of 3 subpulses, the delay time between adjacent subpulses is 0-200fs, and the subpulse energy ratio is 1:1:1, the total energy density of the pulse sequence is 0.2-5J/cm 2 The laser scanning speed is 50-500 μm/s, the scanning interval is 5-11 μm, and the scanning times are 1-3.
Step 8: and (3) processing the outer wear-resistant protection layer 7a on the paper outlet side and the outer wear-resistant protection layer 7b on the paper inlet side into a micro-nano hierarchical structure under water by using the femtosecond laser pulse sequence set by the parameters in the step (7): the micron-sized mastoid structure has a diameter of 2-20 mu m and a height of about 1-5 mu m, mastoid distances of 2-20 mu m, the mastoid sizes are uniform, the distribution density is basically consistent, the nano particles are uniformly distributed on the surface of the mastoid and the bottom between the mastoid, and the granularity is 20-700 nm.
Comparative example 2:
the comparative example provides a heating substrate for a thermal print head without micro-nano hierarchical structure on the surface of a wear-resistant protective layer, which comprises an insulating substrate 1, wherein a primer layer 2 is formed by printing and sintering the surface of the insulating substrate 1, the primer layer 2 is made of amorphous glass material, a comb-shaped individual electrode 3b and a comb-shaped common electrode 3a are arranged on the surface of the primer layer 2, and a heating resistor 4 is arranged in the middle of a comb-shaped electrode pair consisting of the comb-shaped common electrode 3a and the comb-shaped individual electrode 3b along the main printing direction; one end of the comb-shaped public electrode 3a is connected with the heating resistor body 4, and the other end is connected with the COM electrode; one end of the comb-shaped individual electrode 3b is connected with the heating resistor body 4, and the other end is connected with the control IC; an inner wear-resistant protective layer 6 is formed on the surface of the heating resistor 4, the surface of the comb-shaped common electrode 3a and a part of the surface of the comb-shaped individual electrode 3b, and an outer wear-resistant protective layer 7 is formed on the surface of the wear-resistant protective layer 6.
The method for manufacturing the heating substrate for the thermal head of the comparative example includes the steps of:
step 1: amorphous glass material is printed on the surface of the insulating substrate 1, and sintered for 0.1 to 2 hours at 900 to 1300 ℃ to form a primer layer 2;
step 2: forming a metal electrode layer on the ground coat layer 2 and part of the insulating substrate 1 by adopting a screen printing and metal slurry sintering mode, wherein the sintering temperature is 600-900 ℃, and the film thickness is 0.2-4 mu m, so as to prepare a first metallized substrate;
step 3: patterning the first metallized substrate by adopting a photoetching technology to form a comb-shaped common electrode 3a and a comb-shaped individual electrode 3b;
step 4: a heating resistor 4 is arranged at the middle part of a comb-shaped electrode pair formed by a comb-shaped common electrode 3a and a comb-shaped individual electrode 3b in a main printing direction by adopting a drawing or printing mode, and is sintered at 700-900 ℃ to form a film with the film thickness of 3-10 mu m;
step 5: the surfaces of the heating resistor body 4, part of the comb-shaped individual electrodes 3b and all the comb-shaped common electrodes 3a are provided with an inner wear-resistant protective layer 6 by printing silicate glass slurry, and the inner wear-resistant protective layer is sintered at 700-900 ℃ to form a film with the film thickness of 4-14 mu m;
step 6: an outer wear-resistant protective layer 7 formed by carbide ceramics is formed on the surface of the inner wear-resistant protective layer 6 by adopting an evaporation or sputtering coating mode, and the thickness is 1-6 mu m.
When the products of example 2 and comparative example 2 continuously work and feed for 1Km, the cross section of the paper dust accumulated on the surface of the product is shown as 10 (a) and 10 (b) in fig. 10, and the accumulation amount of the paper dust of the product of example 2 is reduced by 50% -80% compared with that of the product of comparative example 2.
The heating substrate for the thermal print head and the manufacturing method thereof have the advantages that when the abrasion-resistant protective layer except for the heating resistor body is etched by using femtosecond laser, the influence on the materials around the processing part is small; when underwater processing is performed, the material removal rate can be improved, and a surface micro-nano hierarchical structure is formed stably; the micro-nano hierarchical structure processed improves the contact angle between the surface of the wear-resistant protective layer and the surface of the paper scraps, reduces the contact area between the wear-resistant protective layer and the paper scraps, effectively reduces the rolling angle of the paper scraps on the surface of the wear-resistant protective layer, and ensures that the paper scraps are not easy to adhere to the surface of the wear-resistant protective layer in the printing process, but are adsorbed and taken away by the thermosensitive paper, thereby realizing the effects of self cleaning, low adhesion, paper scraps accumulation resistance and the like of the wear-resistant protective layer. The surface preparation method of the substrate for preventing paper scraps from accumulating on the surface is simple, has strong operability, can improve the phenomena of paper scraps accumulation and paper sticking in the printing process, and prolongs the service life of the thermal printing head.

Claims (1)

1. A method for manufacturing a heating substrate for a thermal print head with surface resistant to paper dust accumulation, wherein the heating substrate for the thermal print head with surface resistant to paper dust accumulation is provided with an insulating substrate, and the surface of the insulating substrate is provided with a primer layer; the surface of the ground coat layer is provided with a comb-shaped individual electrode and a comb-shaped public electrode, the comb-shaped individual electrode and the comb-shaped public electrode form a comb-shaped electrode pair, and the heating resistor body is arranged in the middle of the comb-shaped electrode pair along the main printing direction; one end of the comb-shaped public electrode is connected with the heating resistor body, and the other end of the comb-shaped public electrode is connected with the COM electrode; one end of each comb-shaped individual electrode is connected with the heating resistor body, and the other end of each comb-shaped individual electrode is connected with the control IC; the surface of the heating resistor and the surface of the comb-shaped common electrode and part of the surface of the comb-shaped individual electrode are provided with wear-resistant protection layers; the wear-resistant protective layer is provided with a micro-nano hierarchical structure, and the micro-nano hierarchical structure comprises a micro-level 'mastoid' array and a nano-level particle structure; the micron-sized mastoid arrays are internally provided with micron-sized mastoid with uniform size and consistent density distribution, the diameter range of the mastoid is 2-20 mu m, the height is 1-5 mu m, and the distance between the mastoid is 2-20 mu m; the nano-scale particle structure is arranged on the surface of the mastoid array;
the granularity range in the nano-scale particle structure is 20-700 nm, and the density distribution is uniform; the wear-resistant protective layer consists of silicate glass glaze, the thickness of the wear-resistant protective layer is 4-20 mu m, and the micro-nano hierarchical structure is arranged in a region of the wear-resistant protective layer except for the right upper part of the heating resistor; or the wear-resistant protective layer consists of an inner layer and an outer layer, wherein the inner layer is silicate glass glaze, the thickness of the inner layer is 4-14 mu m, the outer layer is carbide or nitride or sialon ceramic, the thickness of the outer layer is 1-6 mu m, and the micro-nano hierarchical structure is arranged on the surface area of the outer layer except the right upper part of the heating resistor body;
the manufacturing method of the heating substrate for the thermal printing head, which is used for preventing paper dust accumulation on the surface, is characterized by comprising the following steps of: sintering the surface of the insulating substrate to form a primer layer, and forming a metal electrode layer on the primer layer and part of the area of the insulating substrate to prepare a first metallized substrate; patterning the first metallized substrate by adopting a photoetching technology to form a comb-shaped common electrode and a comb-shaped individual electrode; a heating resistor is arranged along the main printing direction in a drawing or printing mode, and the heating resistor is arranged at the middle part of the comb-shaped electrode; a wear-resistant protective layer is arranged on the surface of the heating resistor, the surface of the comb-shaped common electrode and the surface of the comb-shaped individual electrode part; forming a micro-nano hierarchical structure on the wear-resistant protective layer at a position except for the surface of the wear-resistant protective layer right above the heating resistor body by adopting a laser processing mode; the manufacturing of the micro-nano hierarchical structure is finished in water by femtosecond laser processing, and the micro-nano hierarchical structure processing process comprises the following steps:
step A: femto second laser parameter setting, including single pulse laser parameter setting and pulse sequence parameter setting after time shaping, wherein the single pulse laser parameter setting: the central wavelength is 300-900nm, the pulse width is 10-200fs, the pulse number is 5-500, and the repetition frequency is set to be 1-1kHz; setting pulse sequence parameters after shaping: shaping and modulating femtosecond laser single pulse into pulse sequence composed of 2-4 sub-pulses, wherein delay time between adjacent sub-pulses is 0-200fs, energy of each sub-pulse is the same, and total energy density of pulse sequence is 0.2-5J/cm 2 The laser scanning speed is 50-500 mu m/s, the scanning interval is 5-11 mu m, and the scanning times are 1-3;
and (B) step (B): and processing the outer wear-resistant protection layer on the paper outlet side and the outer wear-resistant protection layer on the paper inlet side into a micro-nano hierarchical structure by using a set femtosecond laser pulse sequence: the structure of the micro-level mastoid has the diameter of 2-20 mu m, the height of 1-5 mu m, the distance between mastoid is 2-20 mu m, the mastoid size is even, the distribution density is even, the nano-level particles are evenly distributed on the surface of the mastoid and the surface of the area between the mastoid, and the granularity is 20-700 nm.
CN202110810382.4A 2021-07-16 2021-07-16 Heating substrate for thermal printing head with surface resistant to paper dust accumulation and manufacturing method thereof Active CN114379239B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110810382.4A CN114379239B (en) 2021-07-16 2021-07-16 Heating substrate for thermal printing head with surface resistant to paper dust accumulation and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110810382.4A CN114379239B (en) 2021-07-16 2021-07-16 Heating substrate for thermal printing head with surface resistant to paper dust accumulation and manufacturing method thereof

Publications (2)

Publication Number Publication Date
CN114379239A CN114379239A (en) 2022-04-22
CN114379239B true CN114379239B (en) 2023-05-30

Family

ID=81195007

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110810382.4A Active CN114379239B (en) 2021-07-16 2021-07-16 Heating substrate for thermal printing head with surface resistant to paper dust accumulation and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN114379239B (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02305654A (en) * 1989-05-19 1990-12-19 Tokyo Electric Co Ltd Thermal head
JPH11157111A (en) * 1997-11-28 1999-06-15 Kyocera Corp Thermal head
WO2007148663A1 (en) * 2006-06-21 2007-12-27 Rohm Co., Ltd. Thermal printhead
JP4584947B2 (en) * 2007-03-15 2010-11-24 ローム株式会社 Thermal print head
CN104439708B (en) * 2014-11-18 2016-09-21 清华大学 A kind of ultra-hydrophobic high sticking metal surface and preparation method thereof
CN108346633A (en) * 2017-11-08 2018-07-31 中电普瑞电力工程有限公司 A kind of micro-nano structure array heat-delivery surface and preparation method thereof
CN209079467U (en) * 2018-11-06 2019-07-09 山东华菱电子股份有限公司 A kind of thermal printing head heating base plate
CN111020502A (en) * 2019-11-29 2020-04-17 华南理工大学 Lotus leaf-like hydrophobic antiserum adhesion surface and preparation method thereof

Also Published As

Publication number Publication date
CN114379239A (en) 2022-04-22

Similar Documents

Publication Publication Date Title
CN100548692C (en) Printhead with film
US4317124A (en) Ink jet recording apparatus
CN102107559A (en) Method for manufacturing thermosensitive printing head
US20080223240A1 (en) Method of Printing
CA2552728A1 (en) Micro-fluid ejection device having high resistance heater film
WO2010044775A1 (en) Fluid ejector structure
JP4756641B2 (en) Manufacturing method of design building materials
CN114379239B (en) Heating substrate for thermal printing head with surface resistant to paper dust accumulation and manufacturing method thereof
WO2006004964A2 (en) Reduced sized micro-fluid jet nozzle structure
US20100015354A1 (en) Method of making rollers with a fine pattern
CN114368232B (en) Printing control method and printing device of gas sensor array
EP1428662A3 (en) Monolithic ink-jet printhead and method for manufacturing the same
US20030025767A1 (en) Multi-nozzle ink jet head and manufacturing method thereof
EP0794057B1 (en) Ink jet pen with a heater element having a contoured surface
US10328699B2 (en) Liquid ejection head and recording device using same
CN111409376A (en) Printing and manufacturing method for base glaze of heating substrate of thermal printing head
KR20130059644A (en) Manufacturing method for glass of vehicle having transparent heating element
JP4375865B2 (en) Inkjet nozzle fine manufacturing method
CN204736569U (en) Printer head is beaten to temperature sensing
CN220095935U (en) Heating substrate for film thermal printing head
US20100134569A1 (en) Continuous inkjet printers
CN109070591B (en) Multilayer nozzle fluid ejection device
CN217347213U (en) Heating substrate for thermal print head with low resistance value deviation and thermal print head
JP4508370B2 (en) Inkjet head
US6547372B1 (en) Ink jet head

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant