CN114373705B - Silicon wafer loading mechanism for silicon single crystal production inserting machine - Google Patents
Silicon wafer loading mechanism for silicon single crystal production inserting machine Download PDFInfo
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- CN114373705B CN114373705B CN202210028043.5A CN202210028043A CN114373705B CN 114373705 B CN114373705 B CN 114373705B CN 202210028043 A CN202210028043 A CN 202210028043A CN 114373705 B CN114373705 B CN 114373705B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the technical field of a silicon wafer inserting machine, in particular to a silicon wafer loading mechanism for a silicon wafer inserting machine for monocrystalline silicon production, which comprises a main body mechanism, wherein a driving mechanism is arranged on the main body mechanism; the main body mechanism is matched with and rotated with a fixing mechanism; and the driving mechanism is abutted against the fixing mechanism; a collision mechanism is arranged on the main body mechanism in a sliding manner; the main body mechanism is rotatably provided with a protection mechanism; the protection mechanism is connected with the limiting mechanism in a matching way; the silicon wafer is abutted against the abutting mechanism when entering the main body mechanism, so that the impact force on the silicon wafer is buffered when the abutting mechanism slides, the silicon wafer is protected conveniently, and the silicon wafer is prevented from being damaged by collision; after the silicon wafer is placed, an operator can rotate the driving mechanism by hand, so that the driving mechanism can resist the fixing mechanism when sliding in the main body mechanism, and the fixing mechanism can extrude the silicon wafer when rotating, thereby being beneficial to preventing the silicon wafer from sliding out of the main body mechanism in the moving process.
Description
Technical Field
The invention relates to the technical field of silicon wafer inserting machines, in particular to a silicon wafer loading mechanism for a silicon wafer inserting machine for monocrystalline silicon production.
Background
Single crystal silicon generally refers to a substance formed by an arrangement of silicon atoms; silicon is the most commonly used semiconductor material, and when molten elemental silicon solidifies, the silicon atoms are arranged in diamond lattices to form crystal nuclei, and the crystal nuclei grow into crystal grains with the same crystal plane orientation to form single crystal silicon. In the production and processing process of monocrystalline silicon, a piece inserting machine is generally needed to place the washed monocrystalline silicon piece into a piece inserting box.
However, the wafer inserting machine generates a certain impact force to the monocrystalline silicon wafer when guiding and conveying the monocrystalline silicon wafer, and the silicon wafer may be damaged due to collision when colliding with the inner wall of the wafer inserting box, thereby being not beneficial to improving the processing effect of the silicon wafer; in addition, because the cleaning solution can be adhered to the silicon wafer after cleaning, when the silicon wafer is placed into the insert box for moving, a monocrystalline silicon piece which is not fixed can slide off from the insert box during displacement, and then the silicon wafer is easy to fall off and damage, so that the protection effect of the insert box is not improved.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a silicon wafer loading mechanism for a silicon wafer inserting machine for monocrystalline silicon production.
The technical scheme adopted by the invention for solving the technical problem is as follows: the silicon wafer loading mechanism for the insert machine for monocrystalline silicon production comprises a main body mechanism, wherein a driving mechanism is arranged on the main body mechanism; the main body mechanism is matched with a fixing mechanism; the driving mechanism is abutted against the fixing mechanism; a collision mechanism is arranged on the main body mechanism in a sliding manner; the main body mechanism is provided with a protection mechanism; the protection mechanism is connected with the limiting mechanism in a matching way;
the main body mechanism comprises a base plate, the fixing mechanism comprises a rotating shaft, the rotating shaft and the base plate are rotatably arranged, a connecting rod is fixedly mounted on the rotating shaft, a second torsion spring is sleeved on the rotating shaft, the connecting rod is connected with the base plate in a matched mode through the second torsion spring, and a mounting block and a fixing block are fixedly connected to the connecting rod.
The main body mechanism further comprises an insert box, the base plate is fixedly connected with the insert box, a plurality of groups are arranged on the base plate in an equidistant mode, the base plate is fixedly connected with water-absorbing sponges on the base plate, two fixing frames are symmetrically and fixedly mounted on the insert box, the cross section of each fixing frame is of an L-shaped structure, and slots are formed in the insert box.
Specifically, actuating mechanism includes the screw rod, it is connected with the screw rod to rotate on the inserted sheet box, fixed mounting has the turning block on the screw rod, threaded connection has the loop bar on the screw rod, the equidistance is equipped with a plurality of spout on the inserted sheet box, the spout fit in slides and is equipped with to the piece, support fixed connection between piece and the loop bar, just the tip of supporting the piece is the inclined plane setting, it has the gyro wheel to support roll connection on the piece, the gyro wheel rotates the setting on the installation piece, just the gyro wheel with support roll connection between the piece.
It is specific, conflict mechanism is including the protection pad, sliding connection has the protection to fill up on the inserted sheet box, the protection fills up fixed connection between and the slide, the slide is contradicted with the lug, a plurality of the lug is the equidistance and arranges, just fixedly connected with gasbag on the lug, the cooperation is installed the gasbag in the inserted sheet box, the symmetry is fixed with two pressure springs on the gasbag.
Specifically, protection machanism is including linking the axle, even the axle rotates the setting on the inserted sheet box, link epaxial first torsional spring that has cup jointed, just link the axle and be connected through first torsional spring and the cooperation of inserted sheet box, even epaxial winding has the protection network, fixedly connected with cardboard on the protection network, the cardboard is contradicted with the inserted sheet box, just be equipped with the draw-in groove on the cardboard.
Specifically, stop gear includes the pull rod, it has the pull rod to contradict on the inserted sheet box, fixedly connected with supports the pole on the pull rod, it has cup jointed expanding spring on the pole to support, support fixed mounting on the pole and support the board, support the board and be connected through expanding spring and inserted sheet box cooperation, support fixed mounting on the pole and have the stopper, the cross-sectional width who supports the board is greater than expanding spring's cross-sectional diameter, the tip cross-section of stopper is the isosceles trapezoid structure setting, just the stopper is connected with the draw-in groove cooperation.
The invention has the beneficial effects that:
(1) According to the silicon wafer loading mechanism for the silicon wafer inserting machine, disclosed by the invention, an operator inserts a monocrystalline silicon wafer into the main body mechanism through the silicon wafer inserting machine, then the monocrystalline silicon wafer is abutted against the abutting mechanism when entering the main body mechanism, so that the impact force applied to the silicon wafer is buffered when the abutting mechanism slides in the main body mechanism, and therefore, the end part of the silicon wafer is protected conveniently, and meanwhile, the silicon wafer can be prevented from being damaged by collision, namely: an operator can convey the monocrystalline silicon wafer into the wafer inserting box through the wafer inserting machine, the silicon wafer is placed on the backing plate, and the backing plate is fixedly connected with the water absorption sponge, so that water on the silicon wafer can be absorbed conveniently, and the silicon wafer can be prevented from sliding out of the wafer inserting box; when the silicon chip is inserted into the inserting sheet box, the end part of the silicon chip can be butted with the protecting pad due to the action of impact force, the protecting pad is fixedly connected with a sliding plate, the sliding plate slides in the inserting sheet box and is butted with the lug, the lug is fixedly provided with an air bag and is extruded, and then a pressure spring installed in the air bag is compressed, so that the impact force applied to the silicon chip is buffered, and meanwhile, the silicon chip is prevented from being damaged due to collision.
(2) According to the silicon wafer loading mechanism for the silicon wafer inserting machine for monocrystalline silicon production, after the silicon wafer is placed, an operator can rotate the driving mechanism by hand, so that the driving mechanism is abutted against the fixing mechanism when sliding in the main body mechanism, and the silicon wafer is extruded when the fixing mechanism rotates, so that the situation that the silicon wafer slides out of the main body mechanism in the moving process is favorably prevented, namely: after placing monocrystalline silicon piece, operating personnel uses the hand rotation turning block, fixedly connected with screw rod on the turning block, threaded connection has the loop bar on the screw rod, when the turning block rotates, the screw rod rotates and drives the loop bar and slide in the inserted sheet box, because fixedly connected with supports the piece on the loop bar, support the piece and contradict the installation piece when the spout position slides, fixed mounting has the connecting rod on the installation piece, fixedly connected with pivot on the connecting rod, and cup jointed the second torsional spring in the pivot, when the installation piece drives the connecting rod and rotates, and then make the deformation of second torsional spring, because install the fixed block on the connecting rod, conflict the silicon piece when the connecting rod drives the fixed block and rotates, and then be favorable to preventing the condition that the silicon piece from landing and falling and damaging in the inserted sheet box when removing along with the inserted sheet machine.
(3) According to the silicon wafer loading mechanism for the silicon wafer inserting machine, after the silicon wafer is fixed, an operator can pull the protection mechanism by hand, then pull the limiting mechanism, and release the limiting mechanism when the protection mechanism is clamped in the main body mechanism, so that the limiting mechanism limits the protection mechanism, and the silicon wafer is protected, namely: after placing the silicon chip, operating personnel can pull the pulling block with the hand, fixed mounting has the cardboard on the pulling block, be fixed with the protection network on the cardboard, and the protection network winding is epaxial even, link epaxial first torsional spring that has cup jointed, when operating personnel drags the cardboard, and then drive even axle rotation when making the protection network expand, and then make first torsional spring deformation, the cardboard slides, then pull the pole with the hand, fixedly connected with resists the pole on the pole, it has cup jointed expanding spring on the pole to resist, and it has resisting the board to support fixed mounting on the pole, the pulling pull rod, and then make to drive to resist and extrude expanding spring when board slides, fixed connection between stopper and the pole, it slides and drives the stopper and slides into the inserted sheet box to resist the pole, and then be convenient for make operating personnel block the cardboard in the slot, after loosening the pull rod, and then make the stopper block under expanding spring's reaction force in the draw-in groove, thereby also be convenient for protect the silicon chip when the stopper is fixed to the cardboard.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic overall structural diagram of a preferred embodiment of a silicon wafer loading mechanism for a silicon wafer inserting machine for single crystal silicon production according to the present invention;
FIG. 2 is an enlarged view of the part A shown in FIG. 1;
FIG. 3 is an enlarged view of the structure of the portion B shown in FIG. 1;
FIG. 4 is an enlarged view of the structure of the section C shown in FIG. 1;
FIG. 5 is a schematic view of a connection structure of a turning block and a screw according to the present invention;
FIG. 6 is an enlarged view of the structure of the portion D shown in FIG. 5;
FIG. 7 is an enlarged view of the structure of the section E shown in FIG. 5;
FIG. 8 is a schematic view of the connection structure of the protection pad and the slide plate according to the present invention;
FIG. 9 is a schematic view of a connection structure of a card board and a protection net according to the present invention;
fig. 10 is a schematic view of a connection structure of the resisting rod and the limiting block of the invention.
In the figure: 1. a main body mechanism; 101. a card housing; 102. a fixed mount; 103. a water-absorbing sponge; 104. a base plate; 105. a slot; 2. a drive mechanism; 201. rotating the block; 202. a screw; 203. a loop bar; 204. a chute; 205. a resisting block; 3. a collision mechanism; 301. a protective pad; 302. a slide plate; 303. a bump; 304. an air bag; 305. a pressure spring; 4. a protection mechanism; 401. pulling the block; 402. clamping a plate; 403. a card slot; 404. a protective net; 405. a connecting shaft; 406. a first torsion spring; 5. a limiting mechanism; 501. a pull rod; 502. a support rod; 503. a tension spring; 504. a resisting plate; 505. a limiting block; 6. a fixing mechanism; 601. mounting blocks; 602. a roller; 603. a connecting rod; 604. a second torsion spring; 605. a rotating shaft; 606. and fixing blocks.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1-10, the silicon wafer loading mechanism for a silicon wafer inserting machine for monocrystalline silicon production according to the present invention includes a main body mechanism 1, wherein a driving mechanism 2 is installed on the main body mechanism 1; the main body mechanism 1 is matched with a fixing mechanism 6; and the driving mechanism 2 is abutted against the fixing mechanism 6; the main body mechanism 1 is provided with a collision mechanism 3 in a sliding manner; the main body mechanism 1 is provided with a protection mechanism 4; the protection mechanism 4 is connected with the limiting mechanism 5 in a matching way;
the main body mechanism 1 comprises a base plate 104, the fixing mechanism 6 comprises a rotating shaft 605, the rotating shaft 605 and the base plate 104 are rotatably arranged, a connecting rod 603 is fixedly mounted on the rotating shaft 605, a second torsion spring 604 is sleeved on the rotating shaft 605, the connecting rod 603 is connected with the base plate 104 through the second torsion spring 604 in a matched mode, and a mounting block 601 and a fixing block 606 are fixedly connected onto the connecting rod 603.
Specifically, main part mechanism 1 still includes inserted sheet box 101, fixed connection between backing plate 104 and the inserted sheet box 101, and a plurality of groups backing plate 104 is the equidistance and arranges, the last fixedly connected with sponge 103 that absorbs water of backing plate 104, symmetrical fixed mounting has two mounts 102 on the inserted sheet box 101, just the cross-section of mount 102 is L shape structure, be equipped with slot 105 on the inserted sheet box 101.
Specifically, actuating mechanism 2 includes screw rod 202, it is connected with screw rod 202 to rotate on the card box 101, fixed mounting has turning block 201 on the screw rod 202, threaded connection has loop bar 203 on the screw rod 202, it is equipped with a plurality of spout 204 to equidistant on the card box 101, spout 204 fit in slides and is equipped with and supports piece 205, support fixed connection between piece 205 and the loop bar 203, just the tip that supports piece 205 is the inclined plane setting, it has gyro wheel 602 to roll connection on the piece 205, gyro wheel 602 rotates the setting on installation piece 601, just gyro wheel 602 and support roll connection between the piece 205, put the back with the silicon chip, operating personnel can rotate actuating mechanism 2 with the hand, and then make actuating mechanism 2 contradict fixed establishment 6 when sliding in main body mechanism 1, extrude the silicon chip when fixed establishment 6 rotates to be favorable to preventing the condition that the silicon chip from sliding out in main body mechanism 1 in the removal process, promptly: after the monocrystalline silicon wafer is placed, an operator rotates the rotating block 201 by hand, the screw 202 is fixedly connected to the rotating block 201, the sleeve rod 203 is connected to the screw 202 in a threaded manner, when the rotating block 201 rotates, the screw 202 rotates to drive the sleeve rod 203 to slide in the insert box 101, the sleeve rod 203 is fixedly connected with the abutting block 205, the abutting block 205 abuts against the mounting block 601 when sliding at the position of the sliding groove 204, the connecting rod 603 is fixedly mounted on the mounting block 601, the rotating shaft 605 is fixedly connected to the connecting rod 603, and the second torsion spring 604 is sleeved on the rotating shaft 605, when the mounting block 601 drives the connecting rod 603 to rotate, the second torsion spring 604 is deformed, and the fixing block 606 is mounted on the connecting rod 603, so that the silicon wafer is abutted against when the fixing block is driven to rotate by the connecting rod 603, and the situation that the silicon wafer slides down and is damaged from the insert box 101 when moving along with the insert machine is prevented.
It is specific, conflict mechanism 3 includes the protection and fills up 301, sliding connection has the protection to fill up 301 on card case 101, the protection fills up fixed connection between 301 and the slide 302, slide 302 is contradicted with lug 303, a plurality of lug 303 is the equidistance and arranges, just fixedly connected with gasbag 304 on the lug 303, gasbag 304 is installed to card case 101 fit-in, the symmetry is fixed with two pressure springs 305 on the gasbag 304, and operating personnel inserts monocrystalline silicon piece through the card machine on main body mechanism 1, then contradicts with conflict mechanism 3 when monocrystalline silicon piece enters into main body mechanism 1, and then makes conflict mechanism 3 cushion the impact force that the silicon piece received when sliding in main body mechanism 1 to also be favorable to preventing the condition that the silicon piece was damaged when being convenient for protect the tip of silicon piece, promptly: an operator can convey the monocrystalline silicon wafer into the wafer inserting box 101 through the wafer inserting machine, the silicon wafer is placed on the backing plate 104, and the water absorption sponge 103 is fixedly connected to the backing plate 104, so that water on the silicon wafer is conveniently absorbed, and the silicon wafer is prevented from sliding out of the wafer inserting box 101; when the silicon chip is inserting into inserted sheet box 101, owing to receive the effect of impact force, the tip of silicon chip can fill up 301 with the protection and contradict, fixedly connected with slide 302 on the protection fills up 301, slide 302 slides and contradicts with lug 303 in inserted sheet box 101, be fixed with gasbag 304 on the lug 303, lug 303 receives the extrusion, and then make the compression spring 305 compression of installation in the gasbag 304, thereby also be favorable to preventing the condition that the silicon chip was hit to the damage when being convenient for cushion the impact force that the silicon chip received.
Specifically, protection machanism 4 is including linking a 405, link a 405 rotation setting on inserted sheet box 101, link and cup jointed first torsional spring 406 on the 405, just link a 405 cooperation through first torsional spring 406 and inserted sheet box 101 and be connected, it has protection network 404 to twine on the 405 to link, fixedly connected with cardboard 402 on the protection network 404, cardboard 402 contradicts with inserted sheet box 101, just be equipped with draw-in groove 403 on the cardboard 402.
Specifically, stop gear 5 includes pull rod 501, it has pull rod 501 to contradict on the card case 101, fixedly connected with supports pole 502 on the pull rod 501, it has expanding spring 503 to cup joint on the pole 502 to support, support fixed mounting on the pole 502 and support board 504, support board 504 and be connected with the cooperation of card case 101 through expanding spring 503, support fixed mounting has stopper 505 on the pole 502, the cross-sectional width who supports board 504 is greater than expanding spring 503's cross-sectional diameter, the tip cross-section of stopper 505 is the isosceles trapezoid structure setting, just stopper 505 is connected with the cooperation of draw-in groove 403, and the silicon chip is fixed back, and operating personnel can stimulate protection machanism 4 with the hand, then stimulates stop gear 5, loosens stop gear 5 again when will protection machanism 4 block in main part mechanism 1, and then makes stop gear 5 spacing protection machanism 4 to be favorable to protecting the silicon chip, promptly: after the silicon wafer is placed, an operator can pull the pulling block 401 by hand, a clamping plate 402 is fixedly installed on the pulling block 401, a protective net 404 is fixed on the clamping plate 402, the protective net 404 is wound on the connecting shaft 405, a first torsion spring 406 is sleeved on the connecting shaft 405, when the operator pulls the clamping plate 402, the connecting shaft 405 is driven to rotate when the protective net 404 is unfolded, the first torsion spring 406 is deformed, the clamping plate 402 slides, then the pulling rod 501 is pulled by hand, the resisting rod 502 is fixedly connected to the pulling rod 501, the resisting rod 502 is sleeved with the torsion spring 503, the resisting rod 502 is fixedly installed with the resisting plate 504, the pulling rod 501 is pulled, the resisting rod 502 drives the resisting plate 504 to slide, the telescopic spring 503 is extruded when the resisting plate 504 is driven by the resisting rod 502, the limiting block 505 is fixedly connected with the resisting rod 502, the sliding of the resisting rod 502 drives the limiting block 505 to slide into the insert box 101, the clamping plate 402 is conveniently clamped into the slot 105, and after the pulling rod 501 is loosened, the limiting block 505 is clamped into the clamping slot 403 under the counter-acting force of the telescopic spring 503, and the limiting block is convenient for fixing the silicon wafer 402.
When the silicon wafer inserting machine is used, firstly, an operator can convey a monocrystalline silicon wafer into the silicon wafer inserting box 101 through the silicon wafer inserting machine, the silicon wafer is placed on the backing plate 104, and the water-absorbing sponge 103 is fixedly connected to the backing plate 104, so that water on the silicon wafer can be absorbed conveniently, and the silicon wafer can be prevented from sliding out of the silicon wafer inserting box 101; when a silicon wafer is inserted into the insert box 101, under the action of impact force, the end part of the silicon wafer can be abutted against the protective pad 301, the protective pad 301 is fixedly connected with a sliding plate 302, the sliding plate 302 slides in the insert box 101 and is abutted against a bump 303, the bump 303 is fixedly provided with an air bag 304, and the bump 303 is extruded, so that a pressure spring 305 installed in the air bag 304 is compressed, the impact force applied to the silicon wafer is buffered, and meanwhile, the silicon wafer is prevented from being damaged; after the monocrystalline silicon wafer is placed, an operator rotates the rotating block 201 by hand, the rotating block 201 is fixedly connected with a screw 202, the screw 202 is in threaded connection with a loop bar 203, when the rotating block 201 rotates, the screw 202 rotates to drive the loop bar 203 to slide in the insert box 101, as the loop bar 203 is fixedly connected with a resisting block 205, the resisting block 205 is butted against the mounting block 601 when sliding at the position of the chute 204, a connecting rod 603 is fixedly mounted on the mounting block 601, a rotating shaft 605 is fixedly connected on the connecting rod 603, and a second torsion spring 604 is sleeved on the rotating shaft 605, when the mounting block 601 drives the connecting rod 603 to rotate, the second torsion spring 604 is deformed, and as the connecting rod 603 is mounted with a fixing block 606, the connecting rod 603 drives the fixing block to rotate, the silicon wafer to be butted against, so that the situation that the silicon wafer slides down and is damaged from the insert box 101 when moving along with the insert machine is prevented; after the silicon wafer is placed, an operator can pull the pulling block 401 by hand, a clamping plate 402 is fixedly installed on the pulling block 401, a protective net 404 is fixed on the clamping plate 402, the protective net 404 is wound on the connecting shaft 405, a first torsion spring 406 is sleeved on the connecting shaft 405, when the operator pulls the clamping plate 402, the connecting shaft 405 is driven to rotate when the protective net 404 is unfolded, the first torsion spring 406 is deformed, the clamping plate 402 slides, then the pulling rod 501 is pulled by hand, a resisting rod 502 is fixedly connected to the pulling rod 501, a telescopic spring 503 is sleeved on the resisting rod 502, a resisting plate 504 is fixedly installed on the resisting rod 502, the pulling rod 501 is pulled, the telescopic spring 503 is extruded when the resisting rod 502 drives the resisting plate 504 to slide, the limiting block 505 is fixedly connected with the resisting rod 502, the resisting rod 502 slides to drive the limiting block 505 to slide into the insert box 101, the clamping plate 402 is conveniently clamped into the inserting slot 105 by the operator, and after the pulling rod 501 is loosened, the limiting block 505 is clamped into the clamping slot 403 under the reactive force of the telescopic spring 503, so that the silicon wafer 402 can be conveniently protected.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. The silicon wafer loading mechanism for the silicon wafer inserting machine for monocrystalline silicon production is characterized by comprising a main body mechanism (1), wherein a driving mechanism (2) is installed on the main body mechanism (1); a fixing mechanism (6) is matched on the main body mechanism (1); the driving mechanism (2) is abutted against the fixing mechanism (6); the main body mechanism (1) is provided with a collision mechanism (3) in a sliding manner; the main body mechanism (1) is provided with a protection mechanism (4); the protection mechanism (4) is connected with the limiting mechanism (5) in a matching way;
the main body mechanism (1) comprises a base plate (104), the fixing mechanism (6) comprises a rotating shaft (605), the rotating shaft (605) and the base plate (104) are rotatably arranged, a connecting rod (603) is fixedly mounted on the rotating shaft (605), a second torsion spring (604) is sleeved on the rotating shaft (605), the connecting rod (603) is connected with the base plate (104) in a matched mode through the second torsion spring (604), and a mounting block (601) and a fixing block (606) are fixedly connected onto the connecting rod (603);
the main body mechanism (1) further comprises a sheet inserting box (101), the base plates (104) are fixedly connected with the sheet inserting box (101), a plurality of groups of base plates (104) are arranged at equal intervals, and water absorbing sponges (103) are fixedly connected onto the base plates (104);
the driving mechanism (2) comprises a screw rod (202), the slide box (101) is connected with the screw rod (202) in a rotating mode, a rotating block (201) is fixedly installed on the screw rod (202), a loop bar (203) is connected to the screw rod (202) in a threaded mode, a plurality of sliding grooves (204) are formed in the slide box (101) at equal intervals, a resisting block (205) is arranged in each sliding groove (204) in a matched and sliding mode, the resisting block (205) is fixedly connected with the loop bar (203), and the end portion of the resisting block (205) is arranged in an inclined plane;
the collision mechanism (3) comprises a protection pad (301), the protection pad (301) is connected onto the card box (101) in a sliding mode, the protection pad (301) is fixedly connected with a sliding plate (302), the sliding plate (302) collides with the convex blocks (303), the convex blocks (303) are arranged at equal intervals, air bags (304) are fixedly connected onto the convex blocks (303), the air bags (304) are installed in the card box (101) in a matched mode, and the air bags (304) are symmetrically fixed with two pressure springs (305);
the protection mechanism (4) comprises a connecting shaft (405), the connecting shaft (405) is rotatably arranged on the inserting sheet box (101), a first torsion spring (406) is sleeved on the connecting shaft (405), the connecting shaft (405) is connected with the inserting sheet box (101) in a matched mode through the first torsion spring (406), a protective net (404) is wound on the connecting shaft (405), and a clamping plate (402) is fixedly connected to the protective net (404);
stop gear (5) include pull rod (501), it has pull rod (501) to contradict on plug-in sheet box (101), fixedly connected with supports pole (502) on pull rod (501), support pole (502) and go up to cup jointed expanding spring (503), support pole (502) and go up fixed mounting and have support board (504), support board (504) and be connected through expanding spring (503) and plug-in sheet box (101) cooperation, support pole (502) and go up fixed mounting and have stopper (505).
2. The silicon wafer loading mechanism for the wafer inserting machine for the production of the monocrystalline silicon according to claim 1, characterized in that: the plug-in card box (101) is provided with two fixing frames (102) symmetrically and fixedly, the cross section of each fixing frame (102) is of an L-shaped structure, and each plug-in card box (101) is provided with a slot (105).
3. The silicon wafer loading mechanism for the wafer inserting machine for the production of monocrystalline silicon of claim 1, characterized in that: the supporting block (205) is connected with a roller (602) in a rolling manner, the roller (602) is arranged on the mounting block (601) in a rotating manner, and the roller (602) is connected with the supporting block (205) in a rolling manner.
4. The silicon wafer loading mechanism for the wafer inserting machine for the production of the monocrystalline silicon according to claim 1, characterized in that: the clamping plate (402) is abutted against the inserting sheet box (101), and a clamping groove (403) is formed in the clamping plate (402).
5. The silicon wafer loading mechanism for the wafer inserting machine for the production of the monocrystalline silicon according to claim 1, characterized in that: the cross section width of the abutting plate (504) is larger than the cross section diameter of the telescopic spring (503), the end section of the limiting block (505) is arranged in an isosceles trapezoid structure, and the limiting block (505) is connected with the clamping groove (403) in a matched mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210028043.5A CN114373705B (en) | 2022-01-11 | 2022-01-11 | Silicon wafer loading mechanism for silicon single crystal production inserting machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210028043.5A CN114373705B (en) | 2022-01-11 | 2022-01-11 | Silicon wafer loading mechanism for silicon single crystal production inserting machine |
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| Publication Number | Publication Date |
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| CN114373705A CN114373705A (en) | 2022-04-19 |
| CN114373705B true CN114373705B (en) | 2022-11-15 |
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| CN202210028043.5A Active CN114373705B (en) | 2022-01-11 | 2022-01-11 | Silicon wafer loading mechanism for silicon single crystal production inserting machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115069585B (en) * | 2022-08-22 | 2022-10-25 | 无锡京运通科技有限公司 | Sorting feeding table fragment removing device for monocrystalline silicon preparation |
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| JP2002305228A (en) * | 2001-04-06 | 2002-10-18 | Matsushita Electric Ind Co Ltd | Wafer cassette fixing device |
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| CN114373705A (en) | 2022-04-19 |
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