CN114372550B - Composite holographic anti-counterfeiting label film and manufacturing method thereof - Google Patents
Composite holographic anti-counterfeiting label film and manufacturing method thereof Download PDFInfo
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- CN114372550B CN114372550B CN202210027170.3A CN202210027170A CN114372550B CN 114372550 B CN114372550 B CN 114372550B CN 202210027170 A CN202210027170 A CN 202210027170A CN 114372550 B CN114372550 B CN 114372550B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
Abstract
The invention provides a compound holographic anti-counterfeiting label film and a manufacturing method thereof, wherein the film comprises a substrate, an RFID layer and a plurality of information layers, wherein the RFID layer and the information layers are attached to the substrate; the RFID layer is provided with an RFID chip, and the RFID chip is used for storing first anti-counterfeiting information and decryption information; the information layer records second anti-counterfeiting information, the second anti-counterfeiting information is decomposed into a plurality of sub-information segments which are respectively recorded on the plurality of information layers, at least one sub-information segment which records the second anti-counterfeiting information in the information layer adopts an encrypted holographic image, and the encrypted holographic image is decrypted by using decryption information stored in the RFID chip and then read. The method comprises the following steps: packaging the RFID chip stored with the first anti-counterfeiting information and the decryption information on a substrate to form an RFID layer; decomposing the second anti-counterfeiting information into a plurality of sub information segments, and encrypting at least one sub information segment into an encrypted holographic image which can be decrypted by using decryption information stored in the RFID chip; each sub information segment is described in a plurality of information layers.
Description
Technical Field
The invention relates to the technical field of anti-counterfeiting information and identification, in particular to a composite holographic anti-counterfeiting identification film and a manufacturing method thereof.
Background
The holographic anti-counterfeiting label film is usually manufactured by utilizing a laser color hologram plate making technology and a mould pressing copying technology, and the adopted plate making technology comprises dot matrix dynamic light rays, a disposable special laser film, a 3D optical miniature background, colorful optical random interference, chinese and English uranium contracted characters and the like. The common laser holographic identification sticking film can be observed by naked eyes generally, and the holographic anti-counterfeiting identification sticking film has the colors of gold, silver, red, blue, green and the like. The holographic anti-counterfeiting label film has wide application field and is suitable for marking and identifying various products in various industries.
The existing holographic anti-counterfeiting label film generally uses an aluminum oxide film as a main material, as shown in fig. 1, enterprise information, LOGO, trademark and the like can be arranged on the surface of the label, and a portrait or other special patterns can also be arranged on the surface of the label. With the popularization of laser holography, the anti-counterfeiting performance of the holographic anti-counterfeiting label film needs to be further improved.
Disclosure of Invention
In order to solve the technical problem, the invention provides a composite holographic anti-counterfeiting label film, which comprises a substrate, an RFID layer and a plurality of information layers, wherein the RFID layer and the information layers are attached to the substrate;
the RFID layer is provided with an RFID chip, and the RFID chip is used for storing first anti-counterfeiting information and decryption information;
the information layer records second anti-counterfeiting information, the second anti-counterfeiting information is decomposed into a plurality of sub-information segments which are respectively recorded on the plurality of information layers, at least one sub-information segment which records the second anti-counterfeiting information in the information layer adopts an encrypted holographic image, and the encrypted holographic image is decrypted by using decryption information stored in the RFID chip and then read.
Optionally, the RFID layer and the plurality of information layers are located on the same side of the substrate, and the RFID layer is located between the substrate and the information layers;
alternatively, the first and second electrodes may be,
there is at least one information layer on the opposite side of the substrate from the RFID layer, and the RFID layer is in contact with the substrate.
Alternatively, when a plurality of information layers are provided on the same surface of the substrate, the information layers other than the information layer closest to the substrate record sub information segments using transparent laser hologram images.
Optionally, a protective layer is disposed on an outer surface of the RFID layer and/or the information layer facing away from the substrate, and the protective layer is made of a polyester light-transmitting material.
Optionally, the substrate is made of silicon crystal material, the RFID layer is in contact with the substrate, a metal layer is disposed on a surface of the substrate facing away from the RFID layer, and the metal layer is provided with an antenna;
the substrate is provided with through holes in an array, and conductive adhesive is arranged in the through holes;
the salient points of the RFID chip are connected with the antenna by conductive adhesive;
the RFID chip is packaged on the substrate by adopting the following method:
the substrate is made of silicon crystal materials, and a metal layer is formed on the surface of the substrate through a deposition process;
manufacturing an antenna with a set pattern on the metal layer by etching for the first time by adopting a patterning process;
setting a pattern according to the salient point condition of the RFID chip, and etching through holes in an array on the substrate for the second time;
filling conductive adhesive in the through hole, wherein one end of the conductive adhesive is connected with the antenna, and the other end of the conductive adhesive extends to the surface of the substrate, which is far away from the metal layer, from the through hole;
and attaching the RFID chip to the surface of the substrate, which is far away from the metal layer, to form an RFID layer, wherein the salient point of the RFID chip is connected with the other end of the electric adhesive.
The invention also provides a manufacturing method of the compound holographic anti-counterfeiting label film, which comprises the following steps:
s100, packaging the RFID chip stored with the first anti-counterfeiting information and the decryption information on a substrate to form an RFID layer;
s200, decomposing the second anti-counterfeiting information into a plurality of sub information segments, and encrypting at least one sub information segment into an encrypted holographic image which can be decrypted by using decryption information stored in the RFID chip;
s300, a plurality of information layers are manufactured on a substrate provided with an RFID layer, each sub information segment is recorded on each information layer, and the sub information segments recorded on at least one information layer are encrypted holographic images.
Optionally, in step S300, a plurality of information layers are fabricated on the surface of the RFID layer facing away from the substrate;
alternatively, the first and second electrodes may be,
at least one information layer is produced on the surface of the substrate facing away from the RFID layer.
Optionally, in step S300, a plurality of information layers are formed on the same surface of the substrate, and the information layers except the information layer closest to the substrate use a transparent laser hologram to describe the sub-information segment.
Optionally, in step S300, after the information layer is manufactured, a protective layer is manufactured on the outer surface of the RFID layer and/or the information layer, which faces away from the substrate, and the protective layer is made of a polyester light-transmitting material.
Optionally, in step S100, the method for packaging the RFID chip on the substrate is as follows:
s110, forming a metal layer on the surface of the substrate by using a silicon crystal material through a deposition process;
s120, manufacturing an antenna with a set pattern on the metal layer by adopting a patterning process through first etching;
s130, setting a pattern according to the salient point condition of the RFID chip, and etching through holes in an array on the substrate for the second time;
s140, filling a conductive adhesive in the through hole, wherein one end of the conductive adhesive is connected with the antenna, and the other end of the conductive adhesive extends to the surface of the substrate, which is far away from the metal layer, from the through hole;
s150, the RFID chip is attached to the surface, away from the metal layer, of the substrate to form an RFID layer, and the salient point of the RFID chip is connected with the other end of the conductive adhesive.
The invention relates to a composite holographic anti-counterfeiting label film and a manufacturing method thereof.A substrate is provided with an RFID layer and a plurality of information layers, wherein the RFID layer is provided with an RFID chip which is used for storing first anti-counterfeiting information and decryption information, the first anti-counterfeiting information can comprise producer information, product process information and the like, and the decryption information is used for decrypting an encrypted holographic image; the second anti-counterfeiting information is decomposed into a plurality of sub-information segments which are respectively recorded on a plurality of information layers, and the sub-information segments with at least one information layer recording the second anti-counterfeiting information adopt encrypted holographic images which can be read after being decrypted by decryption information stored in an RFID chip; according to the scheme, the second anti-counterfeiting information is decomposed into a plurality of sub-information segments which are recorded in a plurality of information layers, so that the anti-counterfeiting performance is improved, the information segments of different information layers can be allowed to be represented in different modes, and the anti-counterfeiting performance is improved in a diversified manner; the sub information segments recorded in at least one information layer adopt encrypted holographic images, the second anti-counterfeiting information can be further prevented from being easily read and counterfeited by decomposing the second anti-counterfeiting information and adopting the encrypted holographic images for at least one sub information segment, and the anti-counterfeiting performance of the label sticking film is enhanced; the decryption information is stored in the RFID chip, and the RFID chip is buried in the RFID layer, so that the decryption information can not be acquired by other people.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of a conventional holographic anti-counterfeit label film;
FIG. 2 is a schematic view of a composite holographic anti-counterfeit label film according to an embodiment of the present invention;
FIG. 3 is a flow chart of a method for manufacturing a composite holographic anti-counterfeit label film according to an embodiment of the present invention;
FIG. 4 is a flowchart of a method for packaging an RFID chip on a substrate according to an embodiment of the method for manufacturing a composite holographic anti-counterfeit label film of the present invention.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
As shown in fig. 2, the embodiment of the present invention provides a composite holographic anti-counterfeit label film, which includes a substrate 1, and an RFID layer 2 and a plurality of information layers 3 attached to the substrate;
the RFID layer 2 is provided with an RFID chip, and the RFID chip is used for storing first anti-counterfeiting information and decryption information;
the information layer 3 records second anti-counterfeiting information, the second anti-counterfeiting information is decomposed into a plurality of sub information segments which are respectively recorded on the plurality of information layers, at least one sub information segment which is recorded with the second anti-counterfeiting information on the information layer adopts an encrypted holographic image, and the encrypted holographic image is decrypted by using decryption information stored by the RFID chip and then read.
The working principle and the beneficial effects of the technical scheme are as follows: the scheme is that a composite holographic anti-counterfeiting label film is formed by arranging an RFID layer and a plurality of information layers on a substrate, wherein the RFID layer is provided with an RFID chip, the RFID chip is used for storing first anti-counterfeiting information and decryption information, the first anti-counterfeiting information can comprise producer information, product process information and the like, and the decryption information is used for decrypting an encrypted holographic image; the second anti-counterfeiting information is decomposed into a plurality of sub-information segments which are respectively recorded on a plurality of information layers, and the sub-information segments with at least one information layer recording the second anti-counterfeiting information adopt encrypted holographic images which can be read after being decrypted by decryption information stored in an RFID chip; according to the scheme, the second anti-counterfeiting information is decomposed into a plurality of sub-information segments which are recorded in a plurality of information layers, so that the anti-counterfeiting performance is improved, the information segments of different information layers can be allowed to be represented in different modes, and the anti-counterfeiting performance is improved in a diversified manner; the sub information segments recorded in at least one information layer adopt encrypted holographic images, the second anti-counterfeiting information can be further prevented from being easily read and counterfeited by decomposing the second anti-counterfeiting information and adopting the encrypted holographic images for at least one sub information segment, and the anti-counterfeiting performance of the label sticking film is enhanced; the decryption information is stored in the RFID chip, and the RFID chip is buried in the RFID layer, so that the decryption information can not be acquired by other people.
In one embodiment, the RFID layer and the plurality of information layers are located on the same side of the substrate, and the RFID layer is located between the substrate and the information layers;
alternatively, the first and second electrodes may be,
there is at least one information layer on the opposite side of the substrate from the RFID layer, and the RFID layer is in contact with the substrate.
The working principle and the beneficial effects of the technical scheme are as follows: in the scheme, the RFID layer is kept in contact with the substrate, so that the manufacturing, embedding and attaching of the RFID layer and the substrate are facilitated, and the manufacturing difficulty and the manufacturing cost are reduced; on the other hand, the RFID layer can be prevented from interfering the information layer or influencing the reading of the second anti-counterfeiting information; typically, all of the information layers are disposed on the same side of the substrate, and the RFID layer may be disposed between the information layers and the substrate, or on a different side of the substrate than the information layers.
In one embodiment, when a plurality of information layers are provided on the same side of the substrate, the information layers other than the information layer closest to the substrate record sub information pieces using transparent laser hologram images.
The working principle and the beneficial effects of the technical scheme are as follows: when a plurality of information layers are arranged on the same surface of a substrate, the information layers are positioned in the information layers on the same surface of the substrate, except the information layer closest to the substrate, other information layers adopt transparent laser holographic images to record carrier information sections; the information layers are prevented from interfering with each other or affecting the reading of sub-information segments of other information layers.
In one embodiment, the RFID layer and/or the information layer is provided with a protective layer on the outer surface facing away from the substrate, and the protective layer is made of polyester light-transmitting material.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, the protective layer is arranged on the outer surface of the RFID layer and/or the information layer, which is away from the substrate, so that the RFID layer and/or the information layer are protected, the RFID layer and/or the information layer are prevented from being abraded or corroded, and the service life of the RFID layer and/or the information layer is prolonged; in addition, the protective layer is made of polyester light-transmitting materials, so that the protective layer can be prevented from interfering with the formation of the information layer or influencing the reading of the sub-information segments of the information layer.
In one embodiment, the substrate is made of silicon crystal material, the RFID layer is in contact with the substrate, the surface of the substrate, which faces away from the RFID layer, is provided with a metal layer, and the metal layer is provided with an antenna;
the substrate is provided with through holes in an array, and conductive adhesive is arranged in the through holes;
the salient points of the RFID chip are connected with the antenna by conductive adhesive;
the RFID chip is packaged on the substrate by adopting the following method:
the substrate is made of silicon crystal materials, and a metal layer is formed on the surface of the substrate through a deposition process;
manufacturing an antenna with a set pattern on the metal layer by etching for the first time by adopting a patterning process;
setting a pattern according to the salient point condition of the RFID chip, and etching through holes in an array on the substrate for the second time;
filling conductive adhesive in the through hole, wherein one end of the conductive adhesive is connected with the antenna, and the other end of the conductive adhesive extends to the surface of the substrate departing from the metal layer from the through hole;
and attaching the RFID chip to the surface of the substrate, which is far away from the metal layer, to form an RFID layer, wherein the salient point of the RFID chip is connected with the other end of the electric adhesive.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, a silicon crystal material is used as a substrate, a metal layer is formed on the surface of the substrate through a deposition process, an antenna is manufactured on the metal layer through a patterning process, and an RFID layer provided with an RFID chip is arranged on the surface of the substrate different from the antenna, so that on one hand, the limited surface of the substrate can be fully utilized, the length of the antenna can be increased as much as possible, the attractiveness can be improved through the design of an antenna pattern, and on the other hand, the phenomenon that the RFID layer interferes the antenna to influence the sensitivity of the antenna for receiving information can be avoided; the connection between the salient points of the RFID chip and the antenna adopts conductive adhesive, so that the bonding strength is improved while the performance is ensured.
As shown in fig. 3, an embodiment of the present invention provides a method for manufacturing a composite holographic anti-counterfeit label film, which is used for manufacturing the composite holographic anti-counterfeit label film, and includes the following steps:
s100, packaging the RFID chip stored with the first anti-counterfeiting information and the decryption information on a substrate to form an RFID layer;
s200, decomposing the second anti-counterfeiting information into a plurality of sub information segments, and encrypting at least one sub information segment into an encrypted holographic image which can be decrypted by using decryption information stored in the RFID chip;
s300, a plurality of information layers are manufactured on a substrate provided with an RFID layer, each sub information segment is recorded on each information layer, and the sub information segments recorded on at least one information layer are encrypted holographic images.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, the RFID chip storing the first anti-counterfeiting information and the decryption information is arranged on the substrate in a packaging mode to form the RFID layer, so that the bonding strength of the RFID layer and the substrate is improved as a whole; the decryption information is stored in the RFID chip, and the RFID chip is buried in the RFID layer, so that the decryption information is prevented from being acquired by others without paying attention; the second anti-counterfeiting information is decomposed into a plurality of information segments which are respectively recorded on the plurality of information layers, and at least one sub-information segment adopts the encrypted holographic image, so that the second anti-counterfeiting information can be further prevented from being easily read and counterfeited, and the anti-counterfeiting performance of the label sticking film is enhanced.
In one embodiment, in step S300, a plurality of information layers are fabricated on the surface of the RFID layer facing away from the substrate;
alternatively, the first and second electrodes may be,
at least one information layer is made on the surface of the substrate facing away from the RFID layer.
The working principle and the beneficial effects of the technical scheme are as follows: in the scheme, the RFID layer is kept in contact with the substrate, so that the manufacturing, embedding and attaching of the RFID layer and the substrate are facilitated, and the manufacturing difficulty and the manufacturing cost are reduced; on the other hand, the RFID layer can be prevented from interfering the information layer or influencing the reading of the second anti-counterfeiting information; typically, all of the information layers are disposed on the same side of the substrate, and the RFID layer may be disposed between the information layers and the substrate, or on a different side of the substrate than the information layers.
In one embodiment, in step S300, a plurality of information layers are formed on the same surface of the substrate, and the sub-information sections are recorded on the information layers except the information layer closest to the substrate using a transparent laser hologram.
The working principle and the beneficial effects of the technical scheme are as follows: when a plurality of information layers are arranged on the same surface of a substrate, the information layers are positioned in the information layers on the same surface of the substrate, except the information layer closest to the substrate, other information layers adopt transparent laser holographic images to record carrier information sections; the information layers are prevented from interfering with each other or affecting the reading of sub-information segments of other information layers.
In one embodiment, in step S300, after the information layer is manufactured, a protective layer is manufactured on the outer surface of the RFID layer and/or the information layer, which faces away from the substrate, and the protective layer is made of a polyester light-transmitting material.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, the protective layer is arranged on the outer surface of the RFID layer and/or the information layer, which is away from the substrate, so that the RFID layer and/or the information layer are protected, the RFID layer and/or the information layer are prevented from being abraded or corroded, and the service life of the RFID layer and/or the information layer is prolonged; in addition, the protective layer is made of polyester light-transmitting materials, so that the protective layer can be prevented from interfering with the information layer or influencing the reading of the sub-information segments of the information layer.
In one embodiment, in step S100, the method for packaging the RFID chip on the substrate is as follows:
s110, forming a metal layer on the surface of the substrate by using a silicon crystal material through a deposition process;
s120, adopting a patterning process, arranging a mask on the surface of the substrate according to a preset antenna pattern, and transferring the antenna pattern to the metal layer through first etching, so as to manufacture an antenna with a set pattern on the metal layer;
s130, setting a pattern according to the salient point condition of the RFID chip, and etching through holes in an array form on the substrate for the second time, wherein the through holes are positioned in the range of the antenna pattern;
s140, filling a conductive adhesive in the through hole, wherein one end of the conductive adhesive is connected with the antenna, and the other end of the conductive adhesive extends to the surface of the substrate, which is far away from the metal layer, from the through hole;
s150, the RFID chip is attached to the surface, away from the metal layer, of the substrate to form an RFID layer, and the salient point of the RFID chip is connected with the other end of the conductive adhesive.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, a silicon crystal material is used as a substrate, a metal layer is formed on the surface of the substrate through a deposition process, an antenna is manufactured on the metal layer through a patterning process, and an RFID layer provided with an RFID chip is arranged on the surface of the substrate different from the antenna, so that on one hand, the limited surface of the substrate can be fully utilized, the length of the antenna can be increased as much as possible, the attractiveness can be improved through the design of an antenna pattern, and on the other hand, the phenomenon that the RFID layer interferes the antenna to influence the sensitivity of the antenna for receiving information can be avoided; the connection between the salient points of the RFID chip and the antenna adopts conductive adhesive, so that the bonding strength is improved while the performance is ensured; after the RFID chip is mounted, parameter measurement of contact resistance and insulation resistance can be carried out to determine whether quality requirements are met, and mounting adjustment is carried out if the quality requirements are not met.
In one embodiment, in the step S100, when the RFID chip is mounted by using the mounting device, the process temperature and the mounting pressure used in the mounting process are controlled as required;
the mounting equipment adopts a temperature sensor to measure the process temperature, and the mounting pressure is adjusted through the following formula:
in the above formula, P' represents the mounting pressure after adjustment; e represents a natural constant; k represents the mounting coefficient of the conductive adhesive, and the mounting coefficient is a positive value, is related to the conductive adhesive material and is obtained through test measurement; t is 0 The temperature of the RFID chip mounting process is preset, and the unit is Kelvin; t is 1 The temperature of an actually measured process for mounting the RFID chip is expressed in units of Kelvin; p represents a design mounting pressure at a predetermined process temperature;
when the RFID chip is mounted, mounting equipment carries out mounting of the RFID chip according to the mounting pressure after adjustment obtained by calculation of the formula.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, when the RFID chip is mounted, the process temperature of the RFID chip during mounting is controlled according to the preset process temperature, the controlled process temperature is measured in real time, the actual measured process temperature is obtained, and the design mounting pressure is adjusted by adopting the formula according to the deviation condition of the actual measured process temperature and the preset process temperature, so that the reliable connection of the RFID chip mounting and the antenna through the conductive adhesive is guaranteed, and the yield is improved; the formula reflects the quantitative relation between the mounting pressure and the adopted conductive adhesive and the process temperature, the deviation of the process temperature has influence on the state of the conductive adhesive, and the state difference of the conductive adhesive during mounting needs to adjust the mounting pressure so as to ensure the quality of the mounting process; when the measured process temperature is equal to the predetermined process temperature (i.e., T) 1 ＝T 0 ) When the pressure is higher than the set pressure, P' = P, that is, mounting pressure adjustment is not required; when T is 1 >T 0 ) Then, is P'<P, namely, the mounting pressure needs to be slightly reduced; when T is 1 <T 0 ) Then P'>P, i need to pasteThe loading pressure is slightly increased; according to the scheme, the control precision of the RFID chip mounting process during the manufacturing of the composite holographic anti-counterfeiting label film is improved, so that the yield of products is improved, and the reliability and consistency of the RFID chip mounting quality are guaranteed.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A compound holographic anti-counterfeiting label film is characterized by comprising a substrate, an RFID layer and a plurality of information layers, wherein the RFID layer and the information layers are attached to the substrate;
the RFID layer is provided with an RFID chip, and the RFID chip is used for storing first anti-counterfeiting information and decryption information;
the plurality of information layers record second anti-counterfeiting information, the second anti-counterfeiting information is decomposed into a plurality of sub-information segments which are respectively recorded on the plurality of information layers, at least one sub-information segment of the information layers which records the second anti-counterfeiting information adopts an encrypted holographic image, and the encrypted holographic image is decrypted by using decryption information stored in the RFID chip and then read.
2. The composite holographic anti-counterfeiting label film according to claim 1, wherein the RFID layer and the plurality of information layers are located on the same side of the substrate, and the RFID layer is located between the substrate and the information layers;
alternatively, the first and second electrodes may be,
there is at least one information layer on the opposite side of the substrate from the RFID layer, and the RFID layer is in contact with the substrate.
3. The composite holographic anti-counterfeiting label film according to claim 1, wherein when a plurality of information layers are disposed on the same surface of the substrate, the information layers except the information layer closest to the substrate are provided with sub-information segments using transparent laser holographic images.
4. The composite holographic anti-counterfeiting label film according to claim 1, wherein a protective layer is disposed on an outer surface of the RFID layer and/or the information layer facing away from the substrate, and the protective layer is made of a polyester light-transmitting material.
5. The compound holographic anti-counterfeiting label film according to claim 1, wherein the substrate is made of silicon crystal material, the RFID layer is in contact with the substrate, a metal layer is arranged on the surface of the substrate, which is far away from the RFID layer, and the metal layer is provided with an antenna;
the substrate is provided with through holes in an array, and conductive adhesive is arranged in the through holes;
the salient points of the RFID chip are connected with the antenna by conductive adhesive;
the RFID chip is packaged on the substrate by adopting the following method:
the substrate is made of silicon crystal materials, and a metal layer is formed on the surface of the substrate through a deposition process;
manufacturing an antenna with a set pattern on the metal layer by etching for the first time by adopting a patterning process;
setting a pattern according to the salient point condition of the RFID chip, and etching through holes in an array on the substrate for the second time;
filling conductive adhesive in the through hole, wherein one end of the conductive adhesive is connected with the antenna, and the other end of the conductive adhesive extends to the surface of the substrate, which is far away from the metal layer, from the through hole;
and attaching the RFID chip to the surface of the substrate, which is far away from the metal layer, to form an RFID layer, wherein the salient point of the RFID chip is connected with the other end of the electric adhesive.
6. A manufacturing method of a compound holographic anti-counterfeiting label film is characterized by comprising the following steps:
s100, packaging the RFID chip stored with the first anti-counterfeiting information and the decryption information on a substrate to form an RFID layer;
s200, decomposing the second anti-counterfeiting information into a plurality of sub information segments, and encrypting at least one sub information segment into an encrypted holographic image which can be decrypted by using decryption information stored in the RFID chip;
s300, a plurality of information layers are manufactured on a substrate provided with an RFID layer, each sub information segment is respectively recorded on each information layer, and at least one sub information segment recorded on each information layer is an encrypted holographic image.
7. The method for manufacturing a composite holographic anti-counterfeit label film according to claim 6, wherein in step S300, a plurality of information layers are manufactured on the surface of the RFID layer opposite to the substrate;
alternatively, the first and second electrodes may be,
at least one information layer is produced on the surface of the substrate facing away from the RFID layer.
8. The method for manufacturing a composite holographic anti-counterfeit label film according to claim 6, wherein in step S300, a plurality of information layers are manufactured on the same surface of the substrate, and the information layers except the information layer closest to the substrate are formed by recording sub-information segments by using transparent laser holographic images.
9. The method for manufacturing a composite holographic anti-counterfeit label film according to claim 6, wherein in step S300, after the information layer is manufactured, a protective layer is manufactured on the outer surface of the RFID layer and/or the information layer, which faces away from the substrate, and the protective layer is made of a polyester light-transmitting material.
10. The method for manufacturing a composite holographic anti-counterfeit label film according to any one of claims 6 to 9, wherein in step S100, the method for packaging the RFID chip on the substrate is as follows:
s110, forming a metal layer on the surface of the substrate by using a silicon crystal material through a deposition process;
s120, manufacturing an antenna with a set pattern on the metal layer by adopting a patterning process through first etching;
s130, setting a pattern according to the salient point condition of the RFID chip, and etching through holes in an array on the substrate for the second time;
s140, filling a conductive adhesive in the through hole, wherein one end of the conductive adhesive is connected with the antenna, and the other end of the conductive adhesive extends to the surface of the substrate, which is far away from the metal layer, from the through hole;
s150, the RFID chip is attached to the surface, away from the metal layer, of the substrate to form an RFID layer, and the salient point of the RFID chip is connected with the other end of the conductive adhesive.
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