CN114371792A - Touch substrate, touch substrate preparation method and display device - Google Patents
Touch substrate, touch substrate preparation method and display device Download PDFInfo
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- CN114371792A CN114371792A CN202111569232.5A CN202111569232A CN114371792A CN 114371792 A CN114371792 A CN 114371792A CN 202111569232 A CN202111569232 A CN 202111569232A CN 114371792 A CN114371792 A CN 114371792A
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- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
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Abstract
The invention discloses a touch substrate, a touch substrate preparation method and a display device, wherein the touch substrate comprises: a substrate; the touch electrode layer is arranged on one side of the substrate and comprises a touch electrode block; the wiring layer is arranged between the substrate and the touch electrode layer and comprises touch wires, and each touch wire is electrically connected with at least one touch electrode block; at least partial orthographic projection of the touch wire on the substrate is partially overlapped with the orthographic projection of the touch electrode block on the substrate. According to the touch control wiring in the embodiment of the invention, wiring is not required to be performed from the peripheral frame part of the touch control electrode layer, and wiring is performed between the substrate and the touch control electrode layer, so that the setting range of the touch control electrode layer is effectively enlarged, the touch control area of the touch control substrate is further improved, and the use experience of a user is also improved.
Description
Technical Field
The invention belongs to the technical field of electronic products, and particularly relates to a touch substrate, a touch substrate preparation method and a display device.
Background
In recent years, touch technology is more and more widely applied to display devices of various sizes, and as a display panel of a novel human-computer interaction input mode, a touch substrate is simpler, more direct and more convenient to input compared with a traditional display, keyboard and mouse input mode.
In the prior art, due to the structural limitation of the touch substrate, the touch trace of the touch electrode needs to be routed on the periphery of the touch substrate, but the frame width of the touch substrate is affected, and the touch area of the touch substrate is further affected.
Therefore, a new touch substrate, a method for manufacturing the touch substrate, and a display device are needed.
Disclosure of Invention
The embodiment of the invention provides a touch substrate, a touch substrate preparation method and a display device.
An embodiment of the present invention provides a touch substrate, including: a substrate; the touch electrode layer is arranged on one side of the substrate and comprises a touch electrode block; the wiring layer is arranged between the substrate and the touch electrode layer and comprises touch wires, and each touch wire is electrically connected with at least one touch electrode block; at least partial orthographic projection of the touch wire on the substrate is partially overlapped with the orthographic projection of the touch electrode block on the substrate.
According to an aspect of the present invention, the touch electrode layer includes a first touch electrode layer and a second touch electrode layer which are arranged in different layers, the first touch electrode layer includes a first touch electrode block, and the second touch electrode layer includes a second touch electrode block; the first touch electrode and the second touch electrode are at least partially overlapped in a direction perpendicular to the plane of the substrate.
According to one aspect of the invention, the device comprises a touch area and a binding area arranged on one side of the touch area; the control chip is arranged in the binding area; the wiring layers comprise a first wiring layer and a second wiring layer which are arranged in different layers; the first wiring layer comprises a first touch wiring, the first touch wiring is electrically connected with the first touch electrode block, the second wiring layer comprises a second touch wiring, the second touch wiring is electrically connected with the second touch electrode block, and the first touch wiring and the second touch wiring extend to the binding area and are electrically connected with the control chip.
According to an aspect of the present invention, each of the first touch electrodes is spaced along a row direction and a column direction, and each of the second touch electrodes is spaced along the row direction and the column direction; one of the first touch traces is connected to the first touch electrodes in the same row, and one of the second touch traces is connected to the second touch electrodes in the same column.
According to an aspect of the invention, the first routing layer, the second touch electrode layer and the first touch electrode layer are sequentially stacked in a direction perpendicular to a plane of the substrate.
According to one aspect of the invention, insulating layers are arranged between the first routing layer and the second routing layer, between the second routing layer and the second touch electrode layer, and between the first touch electrode layer and the second touch electrode layer; the first touch wire and the first touch electrode block are connected through a first via hole penetrating through the insulating layer, and the second touch wire and the second touch electrode block are connected through a second via hole penetrating through the insulating layer; preferably, the insulating layer includes a first insulating layer disposed between the first routing layer and the second routing layer, a second insulating layer disposed between the second routing layer and the second touch electrode layer, and a third insulating layer disposed between the second touch electrode layer and the first touch electrode layer.
In another aspect, an embodiment of the present invention provides a method for manufacturing a touch substrate, including the following steps: providing a substrate; forming a wiring layer on one side of the substrate, wherein the wiring layer comprises touch wiring; and forming a touch electrode layer on one side of the wiring layer, which is far away from the substrate, wherein the touch electrode layer comprises touch electrode blocks, the touch electrode blocks are connected with the touch wires through via holes, and at least partial orthographic projections of the touch wires on the substrate are partially overlapped with the orthographic projections of the touch electrode blocks on the substrate.
According to another aspect of the present invention, the step of forming a routing layer on one side of the substrate includes: forming a first wiring layer on one side of the substrate; forming a first insulating layer on one side, away from the substrate, of the first wiring layer; and forming a second routing layer on one side of the first insulating layer, which is far away from the substrate.
According to another aspect of the invention, the step of forming the touch electrode layer on the side of the routing layer away from the substrate comprises: forming a second insulating layer on one side, away from the substrate, of the second wiring layer, wherein the second insulating layer is provided with a through hole; forming a second touch electrode layer on one side, away from the substrate, of the second insulating layer, wherein the second touch electrode layer comprises a second touch electrode block, and the second touch electrode block is connected with the second wiring layer through a via hole of the second insulating layer; forming a third insulating layer on one side, away from the substrate, of the second touch electrode layer, wherein the third insulating layer is provided with a through hole; and forming a first touch electrode layer on one side of the third insulating layer, which is far away from the substrate, wherein the first touch electrode layer is connected with the first wiring layer through the first insulating layer, the second insulating layer and the via holes of the third insulating layer.
Another aspect of an embodiment of the present invention provides a display device, including: the touch substrate according to any one of the above embodiments.
Compared with the prior art, the touch substrate provided by the embodiment of the invention comprises the substrate, the touch electrode layer, the routing layer and the control chip, wherein the routing layer is arranged between the substrate and the touch electrode layer, and at least partial orthographic projection of the touch wiring on the substrate is partially overlapped with the orthographic projection of the touch electrode block on the substrate, namely, each touch wiring of the routing layer is directly wired from the back of the touch electrode layer.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a touch substrate according to an embodiment of the present invention;
FIG. 2 is a diagram of the structure of one embodiment of the layers at A-A in FIG. 1;
FIG. 3 is a diagram of the structure of another embodiment of the film layer at A-A in FIG. 1;
fig. 4 is a trace diagram of a first touch trace according to an embodiment of the invention;
fig. 5 is a trace diagram of a second touch trace according to an embodiment of the invention;
fig. 6 is a flowchart of a method for manufacturing a touch substrate according to an embodiment of the invention.
In the drawings:
1-a substrate; 2-a touch electrode layer; 21-a first touch electrode layer; 211-a first touch electrode block; 22-a second touch electrode layer; 221-a second touch electrode block; 3-a wiring layer; 31-a first routing layer; 311-a first touch trace; 32-a second routing layer; 321-a second touch trace; 4-a control chip; 5-an insulating layer; 51-a first insulating layer; 52-a second insulating layer; 53-third insulating layer; 6-a passivation layer; k-via holes; k1 — first via; k2 — second via; TA-touch area; BA-binding area.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents. It should be noted that the embodiments provided in the embodiments of the present invention can be combined with each other without contradiction.
Embodiments of a touch substrate 1, a method for manufacturing the touch substrate, and a display device are provided in the embodiments of the present invention, and the embodiments of the touch substrate 1, the method for manufacturing the touch substrate, and the display device will be described below with reference to fig. 1 to 6 of the drawings.
Referring to fig. 1 to 2, fig. 1 is a schematic structural diagram of a touch substrate 1 according to an embodiment of the present invention; fig. 2 is a view showing the structure of the film layer at a-a in fig. 1. The embodiment of the present invention provides a touch substrate 1, including: a substrate 1; the touch electrode layer 2 is arranged on one side of the substrate 1, and the touch electrode layer 2 comprises touch electrode blocks; the wiring layer 3 is arranged between the substrate 1 and the touch electrode layer 2, the wiring layer 3 comprises touch wires, and each touch wire is electrically connected with at least one touch electrode block; at least partial orthographic projection of the touch wire on the substrate is partially overlapped with the orthographic projection of the touch electrode block on the substrate 1.
The touch substrate 1 provided by the embodiment of the invention comprises a substrate 1, a touch electrode layer 2, a wiring layer 3 and a control chip 4, wherein the wiring layer 3 is arranged between the substrate 1 and the touch electrode layer 2, and at least partial orthographic projection of touch wiring on the substrate is partially overlapped with the orthographic projection of touch electrode blocks on the substrate 1. In other words, each touch trace of the trace layer 3 is directly routed from the back of the touch electrode layer 2, and compared with the prior art, the touch trace in the embodiment of the present invention does not need to be routed from the peripheral frame portion of the touch electrode layer 2, but is routed between the substrate 1 and the touch electrode layer 2, which effectively increases the setting range of the touch electrode layer 2, further improves the touch area of the touch substrate 1, and also improves the user experience.
In this embodiment, the touch electrode layer 2 may specifically adopt a mutual capacitance type touch electrode structure, that is, the touch electrode block includes two types of touch driving electrodes and touch sensing electrodes, and the touch position is determined by capacitance change between the touch driving electrodes and the touch sensing electrodes. Of course, the touch electrode layer 2 may also adopt a self-capacitance type touch electrode structure, and the touch position is determined by the capacitance change of each touch electrode block insulated from each other. No matter what form the touch electrode layer 2 adopts, the wiring layer 3 is arranged between the substrate 1 and the touch electrode layer 2, so that the wiring on one side of the touch electrode layer 2 close to the substrate 1, namely the back wiring, is realized, the settable range of the touch electrode layer 2 is enlarged, and the touch area of the touch substrate 1 is further improved.
Referring to fig. 3, in some optional embodiments, the touch electrode layer 2 includes a first touch electrode layer 21 and a second touch electrode layer 22 which are arranged in different layers, the first touch electrode layer 21 includes a first touch electrode block 211, and the second touch electrode layer 22 includes a second touch electrode block 221; the first touch electrode and the second touch electrode at least partially overlap in a direction perpendicular to the plane of the substrate 1.
It should be noted that, one of the first touch electrode block 211 and the second touch electrode block 221 may be a touch driving electrode block, and the other one may be a touch sensing electrode block, and is not particularly limited. Optionally, the first touch electrode block 211 is a touch driving electrode block, and the second touch electrode block 221 is an induction electrode block. In the direction perpendicular to the plane of the substrate 1, the first touch electrode and the second touch electrode are at least partially overlapped, so that the first touch electrode and the second touch electrode are oppositely arranged to form a capacitor. Optionally, the extending directions of the first touch electrode and the second touch electrode intersect, for example, the first touch electrode extends along the row direction, and the second touch electrode extends along the column direction.
As shown in fig. 3, in order to respectively transmit signals to the first touch electrode block 211 and the second touch electrode block 221 and avoid interference between the signals as much as possible, in some optional embodiments, the touch substrate has a touch area TA and a bonding area BA disposed at one side of the touch area TA, the control chip 4 is disposed in the bonding area BA, and the routing layer 3 includes a first routing layer 31 and a second routing layer 32 which are disposed in different layers; the first routing layer 31 includes a first touch trace 311, the first touch trace 311 is electrically connected to the first touch electrode block 211, the second routing layer 32 includes a second touch trace 321, the second touch trace 321 is electrically connected to the second touch electrode block 221, and the first touch trace 311 and the second touch trace 321 extend to the bonding area BA and are electrically connected to the control chip 4.
It should be noted that the first touch trace 311 and the second touch trace 321 are electrically connected to the control chip 4, specifically, the control chip 4 can send a touch driving signal to the first touch electrode block 211 through the first touch trace 311, and then the second touch trace 321 transmits a touch sensing signal generated by the second touch electrode block 221 back to the control chip 4, so as to determine the touch position through the signal change between the touch driving signal and the touch sensing signal. The first touch trace 311 and the second touch trace 321 are optional, and the first touch trace 311 and the second touch trace 321 are made of a transparent material, such as Indium Tin Oxide (ITO), so as to improve the light transmittance of the touch substrate 1 when applied to a display device. Optionally, the first touch trace 311 and the second touch trace 321 may also be opaque wires, and are made of an opaque metal with low resistivity, such as copper and aluminum.
Referring to fig. 4 and 5, in order to implement the touch function, in some optional embodiments, the first touch electrodes are spaced along a row direction and a column direction, and the second touch electrodes are spaced along the row direction and the column direction; one first touch trace 311 is connected to the first touch electrodes in the same row, and one second touch trace 321 is connected to the second touch electrodes in the same column.
It can be understood that each of the first touch traces 311 needs to be connected to the first touch electrodes in different rows to respectively send touch signals to the touch electrodes in different rows. Each second touch trace 321 is connected to the second touch electrodes located in different rows, so as to determine capacitance changes at intersections of the first touch electrodes in each row and the second touch electrodes in each row, and further determine a touch position.
In order to avoid mutual interference among the film layers of the touch substrate 1, in some alternative embodiments, the first routing layer 31, the second routing layer 32, the second touch electrode layer 22, and the first touch electrode layer 21 are sequentially stacked in a direction perpendicular to the plane of the substrate 1. It should be noted that the stacking sequence of the first routing layer 31, the second routing layer 32, the second touch electrode layer 22 and the first touch electrode layer 21 is not limited to the above-mentioned manner, and any stacking sequence that can ensure the normal touch function of the second touch electrode layer 22 and the first touch electrode layer 21 can be applied to the embodiments of the present invention.
Specifically, the insulating layers 5 are respectively arranged between the first wiring layer 31 and the second wiring layer 32, between the second wiring layer 32 and the second touch electrode layer 22, and between the first touch electrode layer 21 and the second touch electrode layer 22; the first touch trace 311 is connected to the first touch electrode block 211 through a first via K1 penetrating through the insulating layer 5, and the second touch trace 321 is connected to the second touch electrode block 221 through a second via K2 penetrating through the insulating layer 5.
Optionally, when the multilayer insulating layer 5 is disposed between the first touch trace 311 and the first touch electrode block 211, the first through hole K1, that is, a deep hole, may be directly formed on the insulating layer 5 through etching to implement connection, or a plurality of shallow holes communicated with each other may be formed on the multilayer insulating layer 5 in multiple times to implement connection between the first touch trace 311 and the first touch electrode block 211, so as to ensure a high production yield. Similarly, the second via hole K2 can also be a deep hole or a plurality of shallow holes, and specifically, the number of the insulating layers 5 between the first touch trace 311 and the first touch electrode block 211 and the number of the insulating layers 5 between the second touch trace 321 and the second touch electrode block 221 need to be selected according to the specific requirement.
Optionally, the insulating layer 5 includes a first insulating layer 51 disposed between the first routing layer 31 and the second routing layer 32, a second insulating layer 52 disposed between the second routing layer 32 and the second touch electrode layer 22, and a third insulating layer 53 disposed between the second touch electrode layer 22 and the first touch electrode layer 21.
Optionally, a passivation layer 6 is further disposed on a side of the first touch electrode layer 21 away from the substrate 1 to protect the first touch electrode block 211 and prevent a short circuit.
In this embodiment, the first via K1 penetrates through the first, second and third insulating layers 51, 52 and 53, respectively, and the second via K2 only penetrates through the second insulating layer 52.
Referring to fig. 6, an embodiment of the present invention further provides a method for manufacturing a touch substrate 1, including the following steps:
s110: providing a substrate 1;
s120: forming a wiring layer 3 on one side of the substrate 1, wherein the wiring layer 3 comprises touch wiring;
s130: a touch electrode layer 2 is formed on one side, away from the substrate 1, of the wiring layer 3, the touch electrode layer 2 comprises touch electrode blocks, the touch electrode blocks are connected with touch wiring through via holes K, and at least partial orthographic projection of the touch wiring on the substrate is partially overlapped with the orthographic projection of the touch electrode blocks on the substrate 1.
In the preparation method of the touch substrate 1 provided by the embodiment of the invention, the wiring layer 3 is formed between the substrate 1 and the touch electrode layer 2, namely, each touch wiring of the wiring layer 3 is directly wired from the back of the touch electrode layer 2 and extends from the touch area TA to the binding area BA to be electrically connected with the control chip 4.
In step S110: the substrate 1 may be a rigid substrate 1, such as a glass substrate 1; the flexible substrate 1 may be made of polyimide, polystyrene, polyethylene terephthalate, parylene, polyethersulfone, or polyethylene naphthalate. The substrate 1 is mainly used to support devices disposed thereon.
In step S120: the touch traces of the trace layer 3 may be formed by etching or the like.
In step S130: the touch electrode layer 2 may be made of a transparent material, such as Indium Tin Oxide (ITO). The opaque metal may be made of an opaque metal with low resistivity, and may be one of metal materials such as silver (Ag), aluminum (Al), lithium (Li), magnesium (Mg), ytterbium (Yb), calcium (Ca), or indium (In), or an alloy of the foregoing metal materials, such as magnesium-silver alloy (Mg/Ag), lithium-aluminum alloy (Li/Al), which is not limited In this embodiment.
In an alternative embodiment, the step of forming routing layer 3 on one side of substrate 1 includes: forming a first wiring layer 31 on one side of the substrate 1; forming a first insulating layer 51 on the side of the first wiring layer 31 away from the substrate 1; a second wiring layer 32 is formed on the side of the first insulating layer 51 facing away from the substrate 1.
In this embodiment, the first wiring layer 31 and the second wiring layer 32 can be separated by providing the first insulating layer 51, so as to avoid the short circuit and other problems, and the first insulating layer 51 may specifically be at least one of silicon nitride, silicon oxide, or silicon oxynitride.
In an alternative embodiment, the step of forming the touch electrode layer 2 on the side of the routing layer 3 away from the substrate 1 includes: forming a second insulating layer 52 on the side of the second wiring layer 32 away from the substrate 1, wherein the second insulating layer 52 is provided with a via hole K; forming a second touch electrode layer 22 on a side of the second insulating layer 52 away from the substrate 1, wherein the second touch electrode layer 22 includes a second touch electrode block 221, and the second touch electrode block 221 is connected to the second wiring layer 32 through a via hole K of the second insulating layer 52; forming a third insulating layer 53 on the side, away from the substrate 1, of the second touch electrode layer 22, wherein the third insulating layer 53 is provided with a via hole K; the first touch electrode layer 21 is formed on the side of the third insulating layer 53 away from the substrate 1, and the first touch electrode layer 21 is connected to the first wiring layer 31 through the first insulating layer 51, the second insulating layer 52 and the via hole K of the third insulating layer 53.
The second insulating layer 52 and the third insulating layer 53 may specifically employ at least one of silicon nitride, silicon oxide, or silicon oxynitride. The via holes K of the first, second, and third insulating layers 51, 52, and 53 may be formed through an etching process. The first touch electrode layer 21 and the via hole K of the first routing layer 31, i.e., the first via hole K1 penetrating through the first insulating layer 51, the second insulating layer 52 and the third insulating layer 53, may be formed at one time to reduce the process flow. Of course, the through holes K communicating with each other may be formed in the first insulating layer 51, the second insulating layer 52, and the third insulating layer 53, respectively, and are not particularly limited.
An embodiment of the present invention further provides a display device, including: the touch substrate 1 of any of the above embodiments.
The display device provided by the embodiment of the invention has the technical effects of the technical solutions of the touch substrate 1 in any of the above embodiments, and the structures and terms identical to or corresponding to those in the above embodiments are not repeated herein. The display device provided by the embodiment of the invention can be applied to a mobile phone and can also be any electronic product with a display function, including but not limited to the following categories: the touch screen display system comprises a television, a notebook computer, a desktop display, a tablet computer, a digital camera, an intelligent bracelet, intelligent glasses, a vehicle-mounted display, medical equipment, industrial control equipment, a touch interaction terminal and the like, and the embodiment of the invention is not particularly limited in this respect.
As will be apparent to those skilled in the art, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again. It should be understood that the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present invention, and these modifications or substitutions should be covered within the scope of the present invention.
It should also be noted that the exemplary embodiments mentioned in this patent describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, may be performed in an order different from the order in the embodiments, or may be performed simultaneously.
Claims (10)
1. A touch substrate, comprising:
a substrate;
the touch electrode layer is arranged on one side of the substrate and comprises a touch electrode block;
the wiring layer is arranged between the substrate and the touch electrode layer and comprises touch wires, each touch wire is electrically connected with at least one touch electrode block, and the orthographic projection of at least part of the touch wires on the substrate is partially overlapped with the orthographic projection of the touch electrode blocks on the substrate.
2. The touch substrate of claim 1, wherein the touch electrode layer comprises a first touch electrode layer and a second touch electrode layer arranged in different layers, the first touch electrode layer comprises a first touch electrode block, and the second touch electrode layer comprises a second touch electrode block;
the first touch electrode and the second touch electrode are at least partially overlapped in a direction perpendicular to the plane of the substrate.
3. The touch substrate of claim 2, wherein the touch substrate comprises a touch area and a binding area disposed on one side of the touch area;
the control chip is arranged in the binding area;
the wiring layers comprise a first wiring layer and a second wiring layer which are arranged in different layers;
the first wiring layer comprises a first touch wiring, the first touch wiring is electrically connected with the first touch electrode block, the second wiring layer comprises a second touch wiring, the second touch wiring is electrically connected with the second touch electrode block, and the first touch wiring and the second touch wiring extend to the binding area and are electrically connected with the control chip.
4. The touch substrate of claim 3, wherein the first touch electrodes are spaced apart along a row direction and a column direction, and the second touch electrodes are spaced apart along the row direction and the column direction;
one of the first touch traces is connected to the first touch electrodes in the same row, and one of the second touch traces is connected to the second touch electrodes in the same column.
5. The touch substrate of claim 3, wherein the first routing layer, the second touch electrode layer, and the first touch electrode layer are sequentially stacked in a direction perpendicular to a plane of the substrate.
6. The touch substrate of claim 3, wherein an insulating layer is disposed between the first routing layer and the second routing layer, between the second routing layer and the second touch electrode layer, and between the first touch electrode layer and the second touch electrode layer;
the first touch wire and the first touch electrode block are connected through a first via hole penetrating through the insulating layer, and the second touch wire and the second touch electrode block are connected through a second via hole penetrating through the insulating layer;
preferably, the insulating layer includes a first insulating layer disposed between the first routing layer and the second routing layer, a second insulating layer disposed between the second routing layer and the second touch electrode layer, and a third insulating layer disposed between the second touch electrode layer and the first touch electrode layer.
7. A preparation method of a touch substrate is characterized by comprising the following steps:
providing a substrate;
forming a wiring layer on one side of the substrate, wherein the wiring layer comprises touch wiring;
and forming a touch electrode layer on one side of the wiring layer, which is far away from the substrate, wherein the touch electrode layer comprises touch electrode blocks, the touch electrode blocks are connected with the touch wires through via holes, and at least partial orthographic projections of the touch wires on the substrate are partially overlapped with the orthographic projections of the touch electrode blocks on the substrate.
8. The method for preparing a touch substrate according to claim 7, wherein the step of forming a wiring layer on one side of the substrate comprises:
forming a first wiring layer on one side of the substrate;
forming a first insulating layer on one side, away from the substrate, of the first wiring layer;
and forming a second routing layer on one side of the first insulating layer, which is far away from the substrate.
9. The method for preparing a touch substrate according to claim 8, wherein the step of forming the touch electrode layer on the side of the routing layer away from the substrate comprises:
forming a second insulating layer on one side, away from the substrate, of the second wiring layer, wherein the second insulating layer is provided with a through hole;
forming a second touch electrode layer on one side, away from the substrate, of the second insulating layer, wherein the second touch electrode layer comprises a second touch electrode block, and the second touch electrode block is connected with the second wiring layer through a via hole of the second insulating layer;
forming a third insulating layer on one side, away from the substrate, of the second touch electrode layer, wherein the third insulating layer is provided with a through hole;
and forming a first touch electrode layer on one side of the third insulating layer, which is far away from the substrate, wherein the first touch electrode layer is connected with the first wiring layer through the first insulating layer, the second insulating layer and the via holes of the third insulating layer.
10. A display device, comprising: the touch substrate of any of claims 1-6.
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| CN202111569232.5A CN114371792B (en) | 2021-12-21 | 2021-12-21 | Touch substrate, touch substrate preparation method and display device |
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| CN202111569232.5A CN114371792B (en) | 2021-12-21 | 2021-12-21 | Touch substrate, touch substrate preparation method and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104657022A (en) * | 2015-03-06 | 2015-05-27 | 京东方科技集团股份有限公司 | Display substrate and display device |
| CN105630247A (en) * | 2016-02-02 | 2016-06-01 | 上海天马微电子有限公司 | Array substrate |
| CN107092393A (en) * | 2017-04-21 | 2017-08-25 | 京东方科技集团股份有限公司 | Touch base plate and preparation method thereof and touch-control display panel |
| CN111427472A (en) * | 2020-03-12 | 2020-07-17 | 武汉天马微电子有限公司 | Display panel and display device |
| CN111863903A (en) * | 2020-07-23 | 2020-10-30 | 上海天马有机发光显示技术有限公司 | Display panel, manufacturing method thereof and display device |
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2021
- 2021-12-21 CN CN202111569232.5A patent/CN114371792B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104657022A (en) * | 2015-03-06 | 2015-05-27 | 京东方科技集团股份有限公司 | Display substrate and display device |
| CN105630247A (en) * | 2016-02-02 | 2016-06-01 | 上海天马微电子有限公司 | Array substrate |
| CN107092393A (en) * | 2017-04-21 | 2017-08-25 | 京东方科技集团股份有限公司 | Touch base plate and preparation method thereof and touch-control display panel |
| CN111427472A (en) * | 2020-03-12 | 2020-07-17 | 武汉天马微电子有限公司 | Display panel and display device |
| CN111863903A (en) * | 2020-07-23 | 2020-10-30 | 上海天马有机发光显示技术有限公司 | Display panel, manufacturing method thereof and display device |
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| CN114371792B (en) | 2024-01-19 |
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