CN114368071A - Segmented annular wire saw, manufacturing method and injection mold - Google Patents
Segmented annular wire saw, manufacturing method and injection mold Download PDFInfo
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- CN114368071A CN114368071A CN202210040482.8A CN202210040482A CN114368071A CN 114368071 A CN114368071 A CN 114368071A CN 202210040482 A CN202210040482 A CN 202210040482A CN 114368071 A CN114368071 A CN 114368071A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000002347 injection Methods 0.000 title claims abstract description 17
- 239000007924 injection Substances 0.000 title claims abstract description 17
- 238000007747 plating Methods 0.000 claims abstract description 40
- 239000004576 sand Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims description 20
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- 229910000831 Steel Inorganic materials 0.000 claims description 6
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- 239000003513 alkali Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
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- 239000010432 diamond Substances 0.000 abstract description 14
- 229910003460 diamond Inorganic materials 0.000 abstract description 13
- 238000002360 preparation method Methods 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 239000000463 material Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000010408 film Substances 0.000 description 6
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- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/12—Saw-blades or saw-discs specially adapted for working stone
- B28D1/124—Saw chains; rod-like saw blades; saw cables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention provides a segmented annular fretsaw, a manufacturing method and an injection mold, and belongs to the technical field of diamond fretsaw preparation. The segmented ring wire saw comprises a ring bus, wherein a plurality of sand plating sections are arranged on the outer surface of the ring bus at intervals, and a chip removal groove is formed between every two adjacent sand plating sections. The segmented ring wire saw can solve the problem that the fully-plated ring wire in the prior art is blocked during cutting, improves the cutting efficiency and prolongs the service life of the wire saw; the manufacturing method is simple and convenient, and the up-to-standard annular wire saw can be quickly and stably manufactured; the injection mold can realize batch stable production of the segmented ring wire saw.
Description
Technical Field
The invention relates to the technical field of diamond wire saw preparation, in particular to a segmented ring wire saw, a manufacturing method of the ring wire saw and an injection mold for manufacturing the ring wire saw.
Background
The ring wire saw belongs to a special diamond ring-shaped electroplating wire saw and is mainly used for cutting materials such as crystal silicon, jade, sapphire, quartz glass, crystal, graphene, special metal and the like. The cutting tool has the advantages of high cutting efficiency, small cutting seam, wide application range and the like, is widely used in industrial production at present, and has great advantages particularly in occasions of cutting curved surfaces, special-shaped surfaces and the like.
At present, the annular wire saw is used for cutting crystalline silicon and graphite and is a full-plated annular wire, the length of the annular wire saw is generally short, continuous cutting is carried out in the cutting process, namely, after a new square wire is cut by a knife, a large part of new wire can be continuously put out for continuous cutting, and the wire is easily broken due to blockage of cutting scraps in the later cutting stage.
In view of the above, a new technical solution is needed to solve the above technical problems.
Disclosure of Invention
The invention aims to provide a segmented annular wire saw, a manufacturing method and an injection mold, which are used for solving the problem that the fully-plated annular wire in the prior art is blocked during cutting and improving the cutting efficiency; the method is simple and convenient, and the up-to-standard annular wire saw can be quickly and stably manufactured.
In order to achieve the purpose, the invention provides a segmented ring wire saw, which comprises a ring bus, wherein the outer surface of the ring bus is provided with a plurality of sand-plated sections at intervals, and a chip groove is formed between every two adjacent sand-plated sections.
As a further improvement, the plurality of sand plating sections are uniformly distributed on the annular bus, the distance between every two adjacent sand plating sections is 5-15mm, and the length of each chip discharge groove is 3-10 mm.
In a second aspect, the present invention provides a method for manufacturing a segmented ring wire saw, comprising the steps of:
firstly, manufacturing a bus with a preset length;
secondly, manufacturing a plurality of sections of insulating sleeves with preset lengths;
thirdly, sleeving a plurality of sections of insulating sleeves on the bus in a penetrating manner, and then connecting two ends of the bus together;
fourthly, adjusting the position of the insulating sleeve on the bus, heating the insulating sleeve by using a hot air gun, cooling, and then shrinking and fixing the insulating sleeve on the bus;
and fifthly, sanding the treated bus.
As a further improvement, the sanding treatment comprises: alkali washing and acid washing; pre-plating; and (6) sanding.
As a further improvement, the sanding step further comprises: reinforcement plating and/or bright plating.
As a further improvement, the sanding step further comprises:
and removing the insulating sleeve.
As a further improvement, the length of the bus bar is: 1000-30000 mm.
As a further improvement, the bus is woven by adopting a plurality of steel wire ropes; and in the third step, the two ends of the bus are connected together by adopting a weaving method.
A third aspect of the present invention provides a method of making the above-described ring wire saw, comprising the steps of:
firstly, forming a plurality of sections of insulating sleeves coated on the outer surface of a bus on the bus by adopting an injection molding process;
and secondly, connecting two ends of the bus together, and then carrying out sanding treatment.
The fourth aspect of the invention provides an injection mold using the method, which comprises a cavity, wherein the cavity is provided with a bus duct and a plurality of glue injection grooves, and the central line of the bus duct penetrates through the glue injection grooves.
Compared with the prior art, the invention has the following technical effects:
according to the annular wire saw with the shape structure, the plurality of sand plating sections are arranged on the outer surface of the bus at intervals, and the chip discharge grooves are formed between the adjacent sand plating sections, so that the cutting force can be improved, the chip discharge grooves can be beneficial to discharging chips, the blocking condition is avoided, and the cutting efficiency and precision are further ensured; according to the manufacturing method, the plurality of insulating sleeves penetrate through the bus, then the bus is subjected to sanding treatment, finally, diamonds are plated at the positions without the insulating sleeves, and the chip grooves are formed at the positions with the insulating sleeves, so that the bus is selectively sanded in a manner of penetrating through the insulating sleeves, compared with other manners such as film pasting, the manufacturing method is simpler and more convenient, and the positions of the insulating sleeves on the bus can be flexibly adjusted, so that the production efficiency and the flexibility are ensured; the method for manufacturing the segmented ring wire saw through the injection molding process can achieve the purpose of high-efficiency and batch production.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 shows a schematic view of a segmented ring wire saw of the present invention;
FIG. 2 is a flow chart illustrating a method of making a segmented ring wire saw of the present invention;
FIG. 3 shows a method flow diagram of the sanding process step of the present invention;
fig. 4 shows a cross-section of a ring busbar according to the invention in a 1 x 7 configuration;
fig. 5 shows a cross-section of the ring bus of the invention in a 7 x 7 configuration;
FIG. 6 is a flow chart illustrating another method of making a segmented ring wire saw of the present invention.
Description of the main element symbols:
100-a segmented ring wire saw; 101-ring bus; 102-sand plating section; 103-chip groove; 109-steel wire rope.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Example one
Referring to fig. 1, the present embodiment provides a segmented ring wire saw 100, which includes a ring bus 101, a plurality of sand-plated segments 102 are spaced apart from each other on an outer surface of the ring bus 101, and a dust discharge groove 103 is formed between two adjacent sand-plated segments 102.
Specifically, in the present embodiment, the length of the ring-shaped bus 101 is 3000mm, the plurality of sand-plated sections 102 are uniformly distributed on the ring-shaped bus 101, the distance between two adjacent sand-plated sections 102 is 5mm, and the length of each chip groove 103 is 3 mm.
According to factors such as size, material and the like of the material to be cut, the distance between the sand plating sections 102 can be flexibly selected within the range of 5-15mm, and the length of each chip groove 103 can be flexibly selected within the range of 3-10 mm. The length of the ring-shaped bus 101 can be flexibly selected according to specific application scenarios, and generally, the length range of the ring-shaped bus 101 is 1000-30000 mm.
According to the annular wire saw with the structure, the chip discharge groove 103 can contain chips with a certain volume in the cutting process, and the chips are taken out of the cutting seam along with the cutting action, so that the cutting seam is prevented from being blocked by the chips to further enlarge or crack; moreover, because the chip grooves 103 are arranged in the gaps between the two adjacent sand-plated sections 102, a saw-tooth structure is actually formed between the sand-plated sections 102 and the surface of the bus bar, and the saw-tooth structure can further improve the cutting force of the circular wire saw.
Compared with a full-plating ring wire saw, the segmented ring wire saw 100 provided by the invention basically eliminates the problem of wire marks in the silicon rod cutting process, and improves the cutting service life and the cutting efficiency.
For example, in a ring wire saw with the specification of phi 0.42 x 4100 (diameter 0.42 and length 4100mm), after cutting 5 silicon rods (1800 mm/silicon rod) in a silicon cutting process of a full-plated ring wire saw, the subsequent cutting force and efficiency are obviously reduced, and slight wire marks sometimes appear. The flatness of the surface of the silicon ingot after being cut is increased to 0.2-0.5 mm along with the increase of cutting time, and the cutting quality is reduced.
The sectional ring wire saw 100 with the same specification has the advantages that the cutting force and the cutting efficiency are basically unchanged from the beginning to the end of the whole wire, the surface flatness of the cut silicon ingot is less than or equal to 0.2mm, no wire mark exists, the cutting quality is high, and the stability is good.
Example two
Referring to fig. 2, the present embodiment provides a method for manufacturing a segmented circular wire saw 100, which includes the following steps:
s101, manufacturing a bus with a preset length.
Specifically, the length and thickness of the bus can be flexibly selected according to the material and size of the material to be cut actually. The length range of the bus is 1000-30000 mm.
S102, manufacturing multiple sections of insulating sleeves with preset lengths.
The insulating sleeve is made of a material with certain elasticity and thermoplasticity, such as heat shrinkable tube. The insulating sleeve has certain elasticity, so its pipe diameter is equivalent to the diameter of generating line, can slightly be less than the diameter of generating line, and for example the generating line diameter is 0.5mm specification, then insulating sleeve's pipe diameter chooses for use 0.4mm specification. During manufacturing, the whole insulating sleeve is cut into a plurality of sections for standby, and each section of the cut insulating sleeve is 3-
10mm。
S103, sleeving the multiple sections of insulating sleeves on the bus in a penetrating manner, and then connecting two ends of the bus together.
By means of the elasticity of the insulating sleeve, each section of pipe can be stably sleeved on the bus, and meanwhile, the position of the insulating sleeve on the bus can be adjusted.
After the sleeving is completed, two ends of the bus bar need to be connected together to form a closed loop, and the connection mode can adopt various modes, such as welding, butt weaving and the like.
And S104, adjusting the position of the insulating sleeve on the bus, heating the insulating sleeve by using a hot air gun, cooling, and then shrinking and fixing the insulating sleeve on the bus.
When the bus is sleeved, the insulating sleeves are roughly positioned on the bus, and after the bus is connected into a ring, the position of each section of the insulating sleeve is adjusted, so that all the insulating sleeves are distributed on the whole bus at intervals according to a preset mode. For example, all the insulating sleeves are uniformly distributed on the ring bus 101.
The hot air gun is used for blowing hot air to act on each section of the insulating sleeve, the insulating sleeve is heated and softened to be tightly attached to the bus, and the insulating sleeve contracts after being cooled so as to be stably positioned on the bus. After the step is finished, multiple sections of insulating sleeves are sleeved on the surface of the obtained annular bus 101 at intervals.
And S105, sanding the processed bus.
I.e. diamond for cutting is plated on the ring busbar 101 to form a ring wire saw.
Since the surface of the ring-shaped bus bar 101 is alternately sleeved with a plurality of sections of insulating sleeves, a diamond coating is not formed at the position where the insulating sleeves exist, and the diamond coating is formed at other positions. The region where the diamond coating is formed is defined as a sand plating section 102, after sand is coated, the finally obtained product is that a plurality of sand plating sections 102 which are arranged at intervals are formed on the surface of the annular bus 101, the insulating sleeve between two adjacent sand plating sections 102 is removed, the remaining space forms a chip discharge groove 103, and the chip discharge grooves 103 correspond to the positions of the insulating sleeve one by one, so that the final segmented annular wire saw 100 product is obtained.
Referring to fig. 3, in one embodiment, the sanding process in step S105 specifically includes the following steps:
s201, performing alkali washing and acid washing on the treated bus.
The purpose of the step is to clean the bus, clean oil stains, oxides, stains and other impurities on the bus in an alkaline solution and an acidic solution, and provide a clean foundation for subsequent sand plating.
S202, pre-plating.
The specific operation is as follows: the ring-shaped bus bar 101 obtained in step S201 is immersed in a pre-plating solution prepared in advance for forming a metal film on the surface of the ring-shaped bus bar 101 to strengthen the bonding force between the subsequent plating layer and the bus bar. The region where the metal thin film is formed is the bus bar surface not covered with the insulating sleeve.
The pre-plating solution used in this step can adopt the existing known technology, for example, the pre-plating solution is composed of nickel sulfamate, nickel chloride and boric acid, and a compact nickel film is formed on the surface of the annular bus 101 after pre-plating, and the nickel film can increase the sand on the bus and enhance the binding force between the bus and carborundum stone.
And S203, sanding.
The method used in this step is not different from the prior art, and this embodiment will not be described in more detail.
After sanding, a plurality of sand plating sections 102 arranged at intervals are formed on the surface of the annular bus 101, and the main component of each sand plating section 102 is diamond. Since the surface of the ring-shaped bus bar 101 is pre-plated with a metal film, diamond can be bonded to the surface of the ring-shaped bus bar 101 more firmly.
In another preferred embodiment, step S203 is followed by step S204 of reinforcement plating and/or step S205 of bright plating.
The purpose of strengthening plating is to increase the holding power of nickel to the diamond, the purpose of bright plating is to beautify the cladding material and thicken the cladding material, and strengthening plating and bright plating can both adopt prior art, therefore this embodiment also no longer has been repeated.
EXAMPLE III
The bus of this embodiment is woven using a multi-strand wire rope 109.
Referring to fig. 4, in one embodiment, a 1 × 7 structure is adopted, that is, 7 and a steel wire rope 109 are woven into a bus, and then the two ends of the bus are butt-woven together to form a complete annular bus 101.
Referring to fig. 5, in another embodiment, a 7-by-7 structure is adopted, that is, a total of 49 steel cables 109 is used, each 7 steel cables 109 are firstly woven into a sub-bus, then the 7 sub-buses are woven into a final bus in the same manner, and the two ends of the bus are butt-woven together to form the final ring-shaped bus 101.
The braided annular bus 101 has uniform and continuous full-line mechanical property and high strength, and can meet the requirements of a cutting wire saw.
Traditionally, two ends of a bus are connected in a welding or other mode, and a mechanical mutation point exists at a butt joint of the bus and can reduce the cutting effect, so that the width of a cutting seam is caused, and the service life of the ring wire saw is shortened. The annular bus 101 of the embodiment is formed by adopting a weaving mode, and the butt joint of the two ends of the annular bus is also connected by adopting the weaving mode, so that the mechanical property is continuous and uniform, the strength is high, the cutting quality can be improved, the cutting seam is narrow, and the service life of the annular wire saw is prolonged.
Example four
Referring to fig. 6, the present embodiment provides another method for manufacturing a segmented ring wire saw 100, comprising the steps of:
s301, forming a plurality of sections of insulating sleeves coated on the outer surface of the bus on the bus by adopting an injection molding process.
In one embodiment, the injection mold comprises an upper template and a lower template, wherein a cavity is formed between the upper template and the lower template during mold closing, the cavity comprises a bus duct and a plurality of glue injection grooves, and the central line of the bus duct penetrates through the glue injection grooves.
Specifically, the glue injection groove is connected with the plastic cavity through the runner. During operation, the bus is placed in the bus duct firstly, then the die is closed, glue is injected, and pressure is maintained for a period of time.
After the die is opened, a plurality of sections of insulating sleeves are formed on the obtained bus at intervals, and the positions of the insulating sleeves and the distance between the insulating sleeves are determined by the glue injection grooves of the die cavity. The generatrix here is also a straight line and is not closed into a ring.
And S302, connecting two ends of the bus together, and then sanding.
Two ends of the bus bar obtained in the first step are connected together, and the bus bar can be realized by adopting methods such as welding, butt weaving and the like, so that a closed annular bus bar 101 is obtained. And then sanding the annular bus 101 for plating diamond on the surface of the bus without the insulating sleeve to obtain a final annular wire saw product.
The sanding step includes a series of steps and conditions, such as subjecting the bus bar to alkali cleaning and acid cleaning to remove oil stains, oxides, and the like; for example, pre-plating is carried out before formal sand plating so as to form a metal film on the surface of the bus and improve the bonding force between the diamond and the bus; parameters such as the thickness and the density of the diamond coating can be controlled by adjusting the electroplating time, the concentration of electroplating liquid and the like; such methods and operations are well known in the art of sanding, and are not described in detail herein.
Of course, the electroplated ring wire saw product also needs to remove the insulating sleeve, so as to obtain the ring wire saw only comprising the ring bus 101 and the multiple sand-plated sections 102.
Furthermore, the annular wire saw can be sequentially subjected to reinforcement plating and/or bright plating, so that the sand-plated section 102 is combined with the bus more firmly, and the appearance of the product is more attractive.
The plastic that this embodiment used is the hot melt adhesive, is the molten state at the high temperature and can flows and be full of the notes gluey groove, and the solidification forms the insulating sleeve cladding at the generating line surface after the cooling.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (10)
1. The utility model provides a segmentation annular coping saw, its characterized in that, includes annular bus, annular bus's surface interval is equipped with a plurality of sand plating sections, adjacent two form the chip groove between the sand plating section.
2. The segmented ring wire saw of claim 1, wherein the plurality of sand coated segments are uniformly distributed on the ring bus bar, the distance between two adjacent sand coated segments is 5-15mm, and the length of each chip discharge groove is 3-10 mm.
3. A method for manufacturing a segmented ring wire saw, comprising the steps of:
firstly, manufacturing a bus with a preset length;
secondly, manufacturing a plurality of sections of insulating sleeves with preset lengths;
thirdly, sleeving a plurality of sections of insulating sleeves on the bus in a penetrating manner, and then connecting two ends of the bus together;
fourthly, adjusting the position of the insulating sleeve on the bus, heating the insulating sleeve by using a hot air gun, cooling, and then shrinking and fixing the insulating sleeve on the bus;
and fifthly, sanding the treated bus.
4. The method of claim 3, wherein the sanding process comprises:
alkali washing and acid washing;
pre-plating;
and (6) sanding.
5. The method of claim 4, wherein the sanding step further comprises:
reinforcement plating and/or bright plating.
6. The method of manufacturing of claim 4 or 5, wherein the sanding step further comprises:
and removing the insulating sleeve.
7. The method as claimed in claim 3, wherein the length of the bus bar is 1000-30000 mm.
8. The manufacturing method of claim 3, wherein the bus bar is woven by using a multi-strand steel wire rope; and in the third step, the two ends of the bus are connected together by adopting a weaving method.
9. A method of making the ring wire saw of claim 1 or 2, comprising the steps of:
firstly, forming a plurality of sections of insulating sleeves coated on the outer surface of a bus on the bus by adopting an injection molding process;
and secondly, connecting two ends of the bus together, and then carrying out sanding treatment.
10. An injection mold using the method of claim 9, comprising a cavity having a bus duct and a plurality of glue injection grooves, wherein a center line of the bus duct is disposed through the plurality of glue injection grooves.
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114959841A (en) * | 2022-05-25 | 2022-08-30 | 石家庄雷力工具有限公司 | Electroplating tool and electroplating process of diamond wire saw |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3135955U (en) * | 2007-07-24 | 2007-10-04 | 鈴幸商事株式会社 | Cutting device for semi-rigid materials |
CN103100987A (en) * | 2013-01-14 | 2013-05-15 | 南京航空航天大学 | Electroplating diamond fretsaw with grinding materials controllably distributed and preparation method |
CN204136252U (en) * | 2014-09-24 | 2015-02-04 | 江苏中博钻石科技有限公司 | Annular diamond fretsaw |
CN104726923A (en) * | 2014-07-11 | 2015-06-24 | 青岛科技大学 | Sand loading device of sectional type electroplating diamond scroll saw |
CN108327093A (en) * | 2018-02-09 | 2018-07-27 | 江苏中博钻石科技有限公司 | Stone material cutting annular beading diamond rope and its manufacturing method |
CN108381797A (en) * | 2018-02-09 | 2018-08-10 | 江苏中博钻石科技有限公司 | Annular diamond fretsaw and its manufacturing method |
CN109423899A (en) * | 2017-08-21 | 2019-03-05 | 北新集团建材股份有限公司 | A kind of weaving method of wirerope |
CN109423898A (en) * | 2017-08-21 | 2019-03-05 | 北新集团建材股份有限公司 | A kind of preparation method of annular steel wire rope |
CN111151814A (en) * | 2020-01-19 | 2020-05-15 | 徐斌 | Mobius ring structure double-blade band saw and manufacturing method thereof |
CN210525530U (en) * | 2019-05-28 | 2020-05-15 | 无锡本亚机械科技有限公司 | Annular diamond wire saw bus and wire saw |
CN113186581A (en) * | 2021-04-08 | 2021-07-30 | 苏州赛特锐精密机械配件有限公司 | Annular electroplated diamond wire saw and preparation method thereof |
-
2022
- 2022-01-14 CN CN202210040482.8A patent/CN114368071A/en active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3135955U (en) * | 2007-07-24 | 2007-10-04 | 鈴幸商事株式会社 | Cutting device for semi-rigid materials |
CN103100987A (en) * | 2013-01-14 | 2013-05-15 | 南京航空航天大学 | Electroplating diamond fretsaw with grinding materials controllably distributed and preparation method |
CN104726923A (en) * | 2014-07-11 | 2015-06-24 | 青岛科技大学 | Sand loading device of sectional type electroplating diamond scroll saw |
CN204136252U (en) * | 2014-09-24 | 2015-02-04 | 江苏中博钻石科技有限公司 | Annular diamond fretsaw |
CN109423899A (en) * | 2017-08-21 | 2019-03-05 | 北新集团建材股份有限公司 | A kind of weaving method of wirerope |
CN109423898A (en) * | 2017-08-21 | 2019-03-05 | 北新集团建材股份有限公司 | A kind of preparation method of annular steel wire rope |
CN108327093A (en) * | 2018-02-09 | 2018-07-27 | 江苏中博钻石科技有限公司 | Stone material cutting annular beading diamond rope and its manufacturing method |
CN108381797A (en) * | 2018-02-09 | 2018-08-10 | 江苏中博钻石科技有限公司 | Annular diamond fretsaw and its manufacturing method |
CN210525530U (en) * | 2019-05-28 | 2020-05-15 | 无锡本亚机械科技有限公司 | Annular diamond wire saw bus and wire saw |
CN111151814A (en) * | 2020-01-19 | 2020-05-15 | 徐斌 | Mobius ring structure double-blade band saw and manufacturing method thereof |
CN113186581A (en) * | 2021-04-08 | 2021-07-30 | 苏州赛特锐精密机械配件有限公司 | Annular electroplated diamond wire saw and preparation method thereof |
Non-Patent Citations (3)
Title |
---|
张允诚等: "《电镀手册 上侧 第2版》", vol. 2, 31 July 1997, 国防工业出版社, pages: 197 - 204 * |
徐春艳等: "《机械设计基础》", 北京理工大学出版社, pages: 166 - 178 * |
徐春艳等: "《核安全级控制机柜电子装联工艺技术》", vol. 1, 30 September 2020, 上海交通大学出版社, pages: 145 - 150 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114959841A (en) * | 2022-05-25 | 2022-08-30 | 石家庄雷力工具有限公司 | Electroplating tool and electroplating process of diamond wire saw |
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