CN114367430B - Capacitive micro-machined ultrasonic transducer and manufacturing method thereof - Google Patents
Capacitive micro-machined ultrasonic transducer and manufacturing method thereof Download PDFInfo
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- CN114367430B CN114367430B CN202111540235.6A CN202111540235A CN114367430B CN 114367430 B CN114367430 B CN 114367430B CN 202111540235 A CN202111540235 A CN 202111540235A CN 114367430 B CN114367430 B CN 114367430B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
Abstract
The invention discloses a capacitive micro-machined ultrasonic transducer and a manufacturing method thereof, and relates to the technical field of ultrasonic transducers. The capacitive micro-mechanical ultrasonic transducer comprises a metal vibration film, a cavity supporting layer, an adhesive layer, an insulating layer and a metal substrate which are sequentially arranged; a plurality of cavities are formed in the cavity supporting layer; and the metal vibration film is etched with a segmentation array groove, and the segmentation array groove is etched to the cavity supporting layer. The flexible design of the ultrasonic transducer can be realized, the structure is simple, and the cost is low.
Description
Technical Field
The invention relates to the technical field of ultrasonic transducers, in particular to a capacitive micro-machined ultrasonic transducer and a manufacturing method thereof.
Background
The Capacitive Micro-machined Ultrasonic transducer (CMUT) has the advantages of flexible design, convenient manufacturing of constituent materials, low material cost, wide bandwidth, high sensitivity, low noise, good impedance matching and the like, and effectively makes up the defects of the piezoelectric Ultrasonic transducer, so the CMUT can be applied to various fields, such as medical diagnosis and test, underwater detection and imaging, nondestructive testing and other technical fields. In the automotive field, automatic driving is favored by more and more researchers, and many car manufacturers and technical companies abroad are testing automatic driving cars with complete automatic driving function, while an ultrasonic transducer is an indispensable component in a backing and parking radar system. The working frequency of the CMUT is controlled to be about 1-500 kHz at low frequency, and the CMUT is combined with an automobile, so that more road real-time information can be provided for the automobile, roadblock analysis and obstacle avoidance can be facilitated, and the requirements of the automobile on safety, comfort and higher operating performance can be met.
Currently, the CMUT is mainly prepared by using monocrystalline silicon and silicide as materials and adopting a silicon-based integrated circuit process, so that the process cost is high, the process flow is complex, and the requirement on the manufacturing environment condition is high.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a capacitive micro-machined ultrasonic transducer and a manufacturing method thereof, which can realize flexible design of the ultrasonic transducer, and have simple structure and low cost.
On one hand, the embodiment of the invention provides a capacitive micro-machined ultrasonic transducer, which comprises a metal vibration film, a cavity supporting layer, a bonding layer, an insulating layer and a metal substrate which are sequentially arranged;
a plurality of cavities are formed in the cavity supporting layer;
and the metal vibration film is etched with a segmentation array groove, and the segmentation array groove is etched to the cavity supporting layer.
According to some embodiments of the invention, the thickness of the cavity support layer is 0.5 to 10 micrometers, the depth of the cavity in the cavity support layer is 0.5 to 10 micrometers, and the diameter of the cavity is 20 to 10000 micrometers.
According to some embodiments of the invention, the support portion of the cavity support layer is a photoresist.
According to some embodiments of the present invention, the metal vibration film, the adhesive layer, and the supporting portion of the cavity supporting layer are hermetically wrapped to form the cavity, and a vacuum degree in the cavity is 0 to 101.325 kpa.
According to some embodiments of the invention, the thickness of the insulating layer is 0.5-5 micrometers, the thickness of the metal vibration film is 3-15 micrometers, the thickness of the metal substrate is 20-100 micrometers, and the thickness of the bonding layer is 0.5-5 micrometers.
On the other hand, the embodiment of the invention also provides a manufacturing method of the capacitive micromachined ultrasonic transducer, which comprises the following steps:
taking a metal foil as a metal vibration film;
coating photoresist on one side of the metal vibration film, and carrying out exposure and development on the photoresist on one side of the metal vibration film to form a cavity supporting layer;
taking another metal foil as a metal substrate;
coating the mixture solution on the metal substrate, and heating and drying the mixture solution to form an insulating layer;
bonding the cavity supporting layer on the metal vibration film and the insulating layer on the metal substrate through an adhesive layer;
coating photoresist on the other side of the metal vibration film, and carrying out exposure and development on the photoresist on the other side of the metal vibration film to form a segmentation array groove;
and etching the segmentation array groove to the cavity supporting layer to form the capacitive micro-machined ultrasonic transducer.
According to some embodiments of the present invention, the bonding the cavity support layer on the metal vibration film and the insulating layer on the metal base by the adhesive layer includes:
coating a hot melt adhesive on the insulating layer, and heating and drying the hot melt adhesive to form an adhesive layer;
superposing a cavity supporting layer on the metal vibration film and a bonding layer on the metal substrate to form an integral structure;
and carrying out hot-pressing treatment on the integral structure to bond the cavity supporting layer and the insulating layer.
According to some embodiments of the present invention, after the step of laminating the cavity support layer on the metal vibration film and the adhesive layer on the metal base to form an integral structure, the step of bonding the cavity support layer on the metal vibration film and the insulating layer on the metal base by the adhesive layer further comprises the steps of:
and putting the integral structure into a vacuum bag, and vacuumizing the vacuum bag.
According to some embodiments of the invention, the mixture solution is prepared by:
according to the following electric storage materials: dielectric material 1: 19-49, preparing a mixture;
according to the mixture: solvent 1: 5-10 weight percent of the mixture solution.
According to some embodiments of the invention, the etching the segmented array trenches into the cavity support layer to form a capacitive micromachined ultrasonic transducer comprises:
etching the segmentation array grooves on the metal vibration film to the cavity supporting layer by using a metal etching agent;
and washing off the photoresist on the surface of the metal vibration film and the residual metal etching agent to form the capacitive micromachined ultrasonic transducer.
The technical scheme of the invention at least has one of the following advantages or beneficial effects: the metal foil is used as the vibration film and the substrate to form the metal vibration film and the metal substrate respectively, the metal vibration film and the metal substrate are good in conductivity and can be directly used as the upper electrode and the lower electrode of the ultrasonic transducer to be connected with a power supply, so that an upper electrode structure and a lower electrode structure are not required to be additionally added, the manufacture of the upper electrode and the lower electrode can be omitted, the whole operation is simple, a large-area array is easy to realize, the material is low, and the manufacturing cost is reduced. The metal vibration film and the metal substrate of the capacitive micro-mechanical ultrasonic transducer are high in flexibility and not prone to cracking, and requirements for use environments are lowered.
Drawings
Figure 1 is a side view of a capacitive micromachined ultrasonic transducer provided by an embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing a capacitive micromachined ultrasonic transducer according to an embodiment of the present invention;
FIG. 3 is a side view of a structure including a first Koutah photoresist layer and a metal vibration film according to an embodiment of the present invention;
FIG. 4 is a side view of a structure including a cavity support layer and a metal diaphragm according to an embodiment of the present invention;
FIG. 5 is a side view of a structure including an insulating layer and a metal substrate according to an embodiment of the present invention;
FIG. 6 is a side view of a structure including an adhesive layer, an insulating layer, and a metal base according to an embodiment of the present invention;
FIG. 7 is a side view of an overall structure including a metal vibration film, a cavity support layer, an adhesive layer, an insulating layer, and a metal base according to an embodiment of the present invention;
FIG. 8 is a side view of a structure in which a second Kottuy photoresist layer is disposed on a metal vibration film of an overall structure provided by an embodiment of the present invention;
FIG. 9 is a side view of a second Koxtai photoresist layer with a segmented array trench formed therein according to one embodiment of the present invention;
fig. 10 is a bode diagram of a 4 x 4 array of capacitive micromachined ultrasonic transducers provided by an embodiment of the present invention;
fig. 11 is a schematic diagram of a transmission signal of a 4 x 4 array of capacitive micromachined ultrasonic transducers and a reception signal of a 40kHz ultrasonic transducer probe according to an embodiment of the present invention;
fig. 12 is a schematic diagram of a received signal of a 4 x 4 array of capacitive micromachined ultrasonic transducers and a transmitted signal of a 40kHz ultrasonic transducer probe according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplicity of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, if there are first, second, etc. described, they are only used for distinguishing technical features, but they are not interpreted as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the precedence of the indicated technical features.
An embodiment of the present invention provides a capacitive micromachined ultrasonic transducer, which, with reference to fig. 1, includes a metal vibration film 100, a cavity support layer 200, an adhesive layer 300, an insulating layer 400, and a metal substrate 500, which are sequentially disposed. A plurality of cavities 600 are formed in the cavity support layer, and the metal vibration film is etched with divided array grooves 700, which are etched to the cavity support layer.
In some embodiments, the metal vibration film is formed of a metal foil, which may be a copper foil, an aluminum foil, a stainless steel foil, a titanium foil, a nickel foil, or the like.
In some embodiments, the metal substrate is also formed of a metal foil, which may be a copper foil, an aluminum foil, a stainless steel foil, a titanium foil, a nickel foil, or the like.
In some embodiments, the cavity of the cavity supporting layer is formed by exposing and developing a photoresist, and the supporting portion of the cavity supporting layer is a photoresist, such as kowtai photoresist, AD20 photoresist, oell photoresist, SU-8 photoresist, Polyimide (Polyimide), and the like.
In some embodiments, the adhesive layer is formed by heating and drying an adhesive, which may be a hot melt adhesive, through which the cavity support layer and the insulating layer are connected. The material of the hot melt adhesive, i.e. the adhesive layer, may be acrylic, Thermoplastic Polyurethane (TPU), Ethylene Vinyl Acetate (EVA), Polyester (PES), Polyamide (PA), polyolefin (PO, PE, PP, PIB).
In some embodiments, the insulating layer comprises a dielectric material as a dielectric insulating layer that is resistant to high voltage breakdown and an electrical storage material that increases the amount and time of stored charge. The weight ratio of the electricity storage material to the dielectric material may be 1: 19 to 99. The electricity storage material may be tourmaline powder, barium titanate powder, Polytetrafluoroethylene (PTFE), Polyvinylidene fluoride (PVDF), or the like. The dielectric material may be Polyvinyl Alcohol (PVA), Polyurethane (PU), Polymethylmethacrylate (PMMA), or the like.
In some embodiments, the thickness of the cavity support layer may be 0.5 to 10 micrometers, the depth of the cavity in the cavity support layer may be 0.5 to 10 micrometers, and the diameter of the cavity may be 20 to 10000 micrometers.
In some embodiments, the thickness of the insulating layer may be 0.5 to 5 micrometers, the thickness of the metal vibration film may be 3 to 15 micrometers, the thickness of the metal substrate may be 20 to 100 micrometers, and the thickness of the bonding layer may be 0.5 to 5 micrometers.
In some embodiments, the metal vibration film, the adhesive layer and the supporting portion of the cavity supporting layer are hermetically wrapped to form a cavity, and the degree of vacuum in the cavity is 0 to 101.325 kPa.
On the other hand, an embodiment of the present invention further provides a method for manufacturing a capacitive micromachined ultrasonic transducer, and with reference to fig. 2, the method includes the following steps:
s110, taking a metal foil as a metal vibration film;
s120, coating the photoresist on one side of the metal vibration film, and carrying out exposure and development on the photoresist on one side of the metal vibration film to form a cavity supporting layer;
s130, taking another metal foil as a metal substrate;
s140, coating the mixture solution on a metal substrate, and heating and drying the mixture solution to form an insulating layer;
s150, bonding the cavity supporting layer on the metal vibration film and the insulating layer on the metal substrate through the bonding layer;
s160, coating the photoresist on the other side of the metal vibration film, and carrying out exposure and development on the photoresist on the other side of the metal vibration film to form a segmentation array groove;
and S170, etching the segmentation array groove to the cavity supporting layer to form the capacitive micro-machined ultrasonic transducer.
In some embodiments, the metal foil used in step S110 may be a copper foil, an aluminum foil, a stainless steel foil, a titanium foil, a nickel foil, or the like. The thickness of the metal foil can be 3-15 microns to form a metal vibration film of 3-15 microns.
In some embodiments, the metal foil used in step S130 may be a copper foil, an aluminum foil, a stainless steel foil, a titanium foil, a nickel foil, or the like. The thickness of the metal foil can be 20-100 microns to form a metal substrate of 20-100 microns.
In some embodiments, the photoresist used in steps S120 and S160 may be kowtai photoresist, AD20 photoresist, orlel photoresist, SU-8 photoresist, Polyimide (Polyimide), and the like. In step S120, the thickness of the formed cavity supporting layer may be 0.5 to 10 micrometers, the depth of the cavity in the cavity supporting layer may be 0.5 to 10 micrometers, and the diameter of the cavity may be 20 to 10000 micrometers.
In some embodiments, the mixture solution in step S140 is prepared by:
according to the electric storage material: dielectric material 1: 19-49, preparing a mixture;
according to the mixture: solvent 1: 5-10 weight percent of the mixture solution.
The electricity storage material may be tourmaline powder, barium titanate powder, Polytetrafluoroethylene (PTFE), Polyvinylidene fluoride (PVDF), or the like. The dielectric material may be Polyvinyl Alcohol (PVA), Polyurethane (PU), Polymethylmethacrylate (PMMA), or the like.
Among them, the solvent may be water, N-methylpyrrolidone, or the like.
In some embodiments, the thickness of the insulating layer formed after heating and drying the mixture solution may be 0.5 to 5 μm.
Further, in step S150, the step of bonding the cavity supporting layer on the metal vibration film and the insulating layer on the metal base by the adhesive layer specifically includes:
coating a hot melt adhesive on the insulating layer, and heating and drying the hot melt adhesive to form an adhesive layer;
superposing a cavity supporting layer on the metal vibration film and a bonding layer on the metal substrate to form an integral structure;
and carrying out hot-pressing treatment on the integral structure to bond the cavity supporting layer and the insulating layer.
In some embodiments, the hot melt adhesive may be an acrylic, a Thermoplastic Polyurethane (TPU), an ethylene-vinyl acetate copolymer (EVA), a Polyester (PES), a Polyamide (PA), a polyolefin (PO, PE, PP, PIB).
Further, after the step of laminating the cavity support layer on the metal vibration film and the adhesive layer on the metal base to form an integral structure, the step S150 of bonding the cavity support layer on the metal vibration film and the insulating layer on the metal base by the adhesive layer may further include the steps of:
and putting the whole structure into a vacuum bag, and vacuumizing the vacuum bag.
And vacuumizing the vacuum bag to ensure that the vacuum degree in the cavity of the capacitive micro-machined ultrasonic transducer is 0-101.325 kilopascal.
Further, S170, etching the segmentation array trench to the cavity support layer to form a capacitive micromachined ultrasonic transducer specifically includes:
etching the segmentation array grooves on the metal vibration film to the cavity supporting layer by using a metal etching agent;
and washing off the photoresist on the surface of the metal vibration film and the residual metal etchant to form the capacitive micro-mechanical ultrasonic transducer.
In some embodiments, the metal etchant may employ a copper etchant, an aluminum etchant, a stainless steel etchant, a titanium etchant, a nickel etchant, etc., corresponding to the specific metal type employed for the metal vibration film.
The method for manufacturing the capacitive micromachined ultrasonic transducer according to the embodiment of the present invention is further described with reference to fig. 3 to 9 and fig. 1.
S210, taking a copper foil with the thickness of 8 microns as the metal vibration film 100, uniformly coating a layer of Kentai photosensitive adhesive with the thickness of 3 microns on the metal vibration film, drying for 15 minutes at the temperature of 38 ℃ to form a first Kentai photosensitive adhesive layer 210, and obtaining a structural side view shown in figure 3 and comprising the first Kentai photosensitive adhesive layer and the metal vibration film;
s220, placing an exposure lamp at a position 20cm right above the first Koutah photosensitive adhesive layer shown in the figure 3, allowing the first Koutah photosensitive adhesive layer to stand for 2 minutes after exposure for 40 seconds, and etching a plurality of cavities 600 with the depth of 3 micrometers and the diameter of 1370 micrometers on the first Koutah photosensitive adhesive layer by using water, so as to form a cavity supporting layer 200 on the metal vibration film, thereby obtaining a structural side view comprising the cavity supporting layer and the metal vibration film shown in the figure 4;
s230, preparing tourmaline powder according to the weight ratio: polyvinyl alcohol resin (PVA) ═ 1: 49, then preparing the mixture in the ratio of: water 1: 8, heating the mixture solution at 100 ℃ for 10 minutes to dissolve the mixture in the mixture solution;
s240, taking an aluminum foil with the thickness of 50 microns as a metal substrate 500, uniformly coating the mixture solution obtained in the step S230 on the metal substrate, drying the metal substrate coated with the mixture solution at 38 ℃ for 15 minutes, and evaporating the water content of the mixture solution to form an insulating layer 400, so as to obtain a structural side view comprising the insulating layer and the metal substrate as shown in FIG. 5;
s250, uniformly coating acrylic resin on the insulating layer shown in the figure 5, and drying for 15 minutes at 38 ℃ to form an adhesive layer 300, so as to obtain a structural side view comprising the adhesive layer, the insulating layer and the metal substrate shown in the figure 6;
s260, overlapping the cavity support layer of the structure shown in fig. 4 and the adhesive layer of the structure shown in fig. 6, putting the structure shown in fig. 4 and the structure shown in fig. 5 together into a vacuum bag, and performing vacuum treatment using a vacuum packing machine;
s270, utilizing a hot press to carry out hot pressing on the whole structure in the vacuumized bag at 100 ℃ for 30 seconds, and recovering the viscosity of acrylic resin of the adhesive layer, so that the structure shown in figure 4 is adhered to the structure shown in figure 6, and the side view of the whole structure comprising the metal vibration film, the cavity supporting layer, the adhesive layer, the insulating layer and the metal substrate is shown in figure 7;
s280, uniformly coating a layer of Kentai photosensitive glue with the thickness of 3 microns on the metal vibration film with the integral structure shown in the figure 7, drying the integral structure coated with the Kentai photosensitive glue for 15 minutes at the temperature of 38 ℃, and forming a second Kentai photosensitive glue layer 220 on the metal vibration film to obtain a structural side view that the second Kentai photosensitive glue layer is arranged on the metal vibration film with the integral structure shown in the figure 8;
s290, placing an exposure lamp 20cm above the second Kodazite photosensitive adhesive layer shown in the figure 8, allowing the second Kodazite photosensitive adhesive layer to stand for 2 minutes after exposure for 40 seconds, and etching a segmentation array groove 700 on the second Kodazite photosensitive adhesive layer by using water to obtain a structural side view of the second Kodazite photosensitive adhesive layer with the segmentation array groove etched as shown in the figure 9;
s2110, etching the metal vibration film exposed to the array-dividing trenches to the cavity support layer with a copper etchant, and cleaning the kowtai photoresist and the residual copper etchant with water to obtain the side view of the capacitive micromachined ultrasonic transducer shown in fig. 1.
The performance of the 4 × 4 array of capacitive micromachined ultrasonic transducers manufactured through the above steps is shown in fig. 10, fig. 11, and fig. 12, where fig. 10 is a bode diagram of the 4 × 4 array of capacitive micromachined ultrasonic transducers, fig. 11 is a schematic diagram of a transmission signal and a reception signal of a 40kHz ultrasonic transducer probe of the 4 × 4 array of capacitive micromachined ultrasonic transducers, and fig. 12 is a schematic diagram of a reception signal and a transmission signal of a 40kHz ultrasonic transducer probe of the 4 × 4 array of capacitive micromachined ultrasonic transducers. In fig. 10, the abscissa is frequency, the left ordinate is phase, the right ordinate is gain, the black dashed line is the phase of the 4 x 4 array capacitive micromachined ultrasonic transducer according to the embodiment of the present invention, i.e., the sample, and the black solid line is the gain of the sample, and it can be seen that the sample has a peak at about 5000Hz and a peak at about 100 kHz. In fig. 11, the abscissa is time, the left ordinate is a sent signal amplitude, the right ordinate is a received signal amplitude, the black dotted line is a sent signal of the 4 × 4 array capacitive micromachined ultrasonic transducer of the present embodiment, and the black solid line is a received signal of the 40kHz ultrasonic transducer probe. It can be observed that there is a certain time delay between the emission of the signal and the reception of the signal, the difference time is about 0.0003s, the propagation speed of the sound in the air is 340m/s, the distance of the emitted sound signal propagating in the air is 340 × 0.0003 s-0.102 m-10.2 cm, the calculation result is consistent with the actual result, the sample emission function is normal, the normal sound signal can be emitted, and the normal working condition is consistent with. In fig. 12, the abscissa is time, the left ordinate is a sent signal amplitude, the right ordinate is a received signal amplitude, the black dotted line is a signal sent by the 40kHz ultrasonic transducer probe, and the black solid line is a received signal of the 4 × 4 array capacitive micromachined ultrasonic transducer of the present embodiment. It can be observed that there is a certain time delay between the emission of the signal and the reception of the signal, the difference time is about 0.0003s, the propagation speed of the sound in the air is 340m/s, the distance of the emitted sound signal propagating in the air is 340 × 0.0003 s-0.102 m-10.2 cm, the calculation result is consistent with the actual result, the sample receiving function is normal, the normal sound signal can be received, and the normal working condition is consistent with.
Compared with the prior art, the embodiment of the invention has the following advantages:
1. compared with the vibration film and the substrate which are made of silicon materials, the metal and the organic polymer are more flexible and are not easy to crack, the capacitive micro-machined ultrasonic transducer is suitable for outdoor use, the cost is reduced, low-frequency ultrasound is easy to realize, and the flexible design can be realized.
2. According to the manufacturing method of the capacitive micro-machined ultrasonic transducer, the metal foil is used as the vibration film and the substrate layer, the metal foil is good in conductivity and can be directly used as the upper electrode and the lower electrode to be connected with the anode and the cathode of the power supply, so that the upper electrode structure and the lower electrode structure are not required to be additionally added, the upper electrode structure and the lower electrode structure can be omitted, the whole operation is simple, the large-area array is easy to realize, the material is low, and the manufacturing cost can be reduced.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A capacitive micro-mechanical ultrasonic transducer is characterized by comprising a metal vibration film, a cavity supporting layer, a bonding layer, an insulating layer and a metal substrate which are arranged in sequence;
a plurality of cavities are formed in the cavity supporting layer;
and a cutting array groove is etched on the metal vibration film, and the cutting array groove is etched to the cavity supporting layer.
2. The capacitive micromachined ultrasonic transducer of claim 1, wherein the thickness of the cavity support layer is 0.5 to 10 microns, the depth of the cavity in the cavity support layer is 0.5 to 10 microns, and the diameter of the cavity is 20 to 10000 microns.
3. A capacitive micromachined ultrasonic transducer according to claim 2, wherein the supporting portion of the cavity support layer is a photoresist.
4. The capacitive micromachined ultrasonic transducer of claim 3, wherein the metal vibration film, the adhesive layer and the supporting portion of the cavity supporting layer are hermetically encapsulated to form the cavity, and a vacuum degree in the cavity is 0 to 101.325 kPa.
5. The capacitive micromachined ultrasonic transducer according to claim 4, wherein the thickness of the insulating layer is 0.5 to 5 micrometers, the thickness of the metal vibration film is 3 to 15 micrometers, the thickness of the metal substrate is 20 to 100 micrometers, and the thickness of the adhesive layer is 0.5 to 5 micrometers.
6. A manufacturing method of a capacitive micro-machined ultrasonic transducer is characterized by comprising the following steps:
taking a metal foil as a metal vibration film;
coating photoresist on one side of the metal vibration film, and carrying out exposure and development on the photoresist on one side of the metal vibration film to form a cavity supporting layer;
taking another metal foil as a metal substrate;
coating the mixture solution on the metal substrate, and heating and drying the mixture solution to form an insulating layer;
bonding the cavity supporting layer on the metal vibration film and the insulating layer on the metal substrate through an adhesive layer;
coating photoresist on the other side of the metal vibration film, and carrying out exposure and development on the photoresist on the other side of the metal vibration film to form a segmentation array groove;
and etching the segmentation array grooves to the cavity supporting layer to form the capacitive micromachined ultrasonic transducer.
7. The method for fabricating a capacitive micromachined ultrasonic transducer according to claim 6, wherein the step of bonding the cavity supporting layer on the metal vibration film and the insulating layer on the metal substrate by the adhesive layer comprises the steps of:
coating a hot melt adhesive on the insulating layer, and heating and drying the hot melt adhesive to form an adhesive layer;
superposing a cavity supporting layer on the metal vibration film and an adhesive layer on the metal substrate to form an integral structure;
and carrying out hot-pressing treatment on the integral structure to bond the cavity supporting layer and the insulating layer.
8. The method for fabricating a capacitive micromachined ultrasonic transducer according to claim 7, wherein after the step of laminating the cavity supporting layer on the metal vibration film and the adhesive layer on the metal substrate to form an integral structure, the step of bonding the cavity supporting layer on the metal vibration film and the insulating layer on the metal substrate by the adhesive layer further comprises the steps of:
and putting the integral structure into a vacuum bag, and vacuumizing the vacuum bag.
9. Method for manufacturing a capacitive micromachined ultrasonic transducer according to claim 6, characterized in that the mixture solution is prepared by the following steps:
according to the following electric storage materials: dielectric material 1: 19-49, preparing a mixture;
according to the mixture: solvent 1: 5-10 weight percent of the mixture solution.
10. The method of fabricating a capacitive micromachined ultrasonic transducer according to claim 6, wherein the etching the segmented array trenches into the cavity support layer to form a capacitive micromachined ultrasonic transducer comprises the steps of:
etching the segmentation array grooves on the metal vibration film to the cavity supporting layer by using a metal etching agent;
and washing away the photoresist on the surface of the metal vibration film and the residual metal etching agent to form the capacitive micromachined ultrasonic transducer.
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| CN101645484A (en) * | 2009-03-02 | 2010-02-10 | 中国科学院声学研究所 | Soft support bridge type silicon micro-piezoelectric ultrasonic transducer chip and prepration method thereof |
| CN108120769A (en) * | 2016-11-29 | 2018-06-05 | 精工爱普生株式会社 | Ultrasonic equipment, ultrasonic unit and Thickness Design Method |
| CN108704827A (en) * | 2018-04-16 | 2018-10-26 | 天津大学 | Capacitance type micromachined ultrasonic energy converter, the Preparation method and use of Air Coupling formula |
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