CN114364742B - High frequency signal transmission component - Google Patents
High frequency signal transmission component Download PDFInfo
- Publication number
- CN114364742B CN114364742B CN202080062390.9A CN202080062390A CN114364742B CN 114364742 B CN114364742 B CN 114364742B CN 202080062390 A CN202080062390 A CN 202080062390A CN 114364742 B CN114364742 B CN 114364742B
- Authority
- CN
- China
- Prior art keywords
- frequency signal
- signal transmission
- polybutylene terephthalate
- terephthalate resin
- transmission member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000008054 signal transmission Effects 0.000 title claims abstract description 59
- -1 polybutylene terephthalate Polymers 0.000 claims abstract description 73
- 229920001707 polybutylene terephthalate Polymers 0.000 claims abstract description 66
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- 239000011342 resin composition Substances 0.000 claims abstract description 38
- 229920005990 polystyrene resin Polymers 0.000 claims abstract description 20
- 239000011256 inorganic filler Substances 0.000 claims abstract description 19
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 7
- 239000000835 fiber Substances 0.000 description 12
- 239000000178 monomer Substances 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 239000003365 glass fiber Substances 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 5
- 150000002009 diols Chemical class 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- DCTMXCOHGKSXIZ-UHFFFAOYSA-N (R)-1,3-Octanediol Chemical compound CCCCCC(O)CCO DCTMXCOHGKSXIZ-UHFFFAOYSA-N 0.000 description 2
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- MMSLOZQEMPDGPI-UHFFFAOYSA-N p-Mentha-1,3,5,8-tetraene Chemical compound CC(=C)C1=CC=C(C)C=C1 MMSLOZQEMPDGPI-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- DTCCVIYSGXONHU-CJHDCQNGSA-N (z)-2-(2-phenylethenyl)but-2-enedioic acid Chemical compound OC(=O)\C=C(C(O)=O)\C=CC1=CC=CC=C1 DTCCVIYSGXONHU-CJHDCQNGSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 1
- JWVTWJNGILGLAT-UHFFFAOYSA-N 1-ethenyl-4-fluorobenzene Chemical compound FC1=CC=C(C=C)C=C1 JWVTWJNGILGLAT-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 description 1
- KXYAVSFOJVUIHT-UHFFFAOYSA-N 2-vinylnaphthalene Chemical compound C1=CC=CC2=CC(C=C)=CC=C21 KXYAVSFOJVUIHT-UHFFFAOYSA-N 0.000 description 1
- WSQZNZLOZXSBHA-UHFFFAOYSA-N 3,8-dioxabicyclo[8.2.2]tetradeca-1(12),10,13-triene-2,9-dione Chemical group O=C1OCCCCOC(=O)C2=CC=C1C=C2 WSQZNZLOZXSBHA-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N Nitrogen dioxide Chemical class O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- VEIOBOXBGYWJIT-UHFFFAOYSA-N cyclohexane;methanol Chemical compound OC.OC.C1CCCCC1 VEIOBOXBGYWJIT-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- HDBWAWNLGGMZRQ-UHFFFAOYSA-N p-Vinylbiphenyl Chemical compound C1=CC(C=C)=CC=C1C1=CC=CC=C1 HDBWAWNLGGMZRQ-UHFFFAOYSA-N 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
- H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
Abstract
The purpose of the present invention is to provide an excellent member that is less susceptible to moisture than conventional members, as a high-frequency signal transmission member. The object of the present invention is achieved by a high-frequency signal transmission member formed of a polybutylene terephthalate resin composition comprising at least: 100 parts by mass of (A) polybutylene terephthalate resin, (B) 15 to 50 parts by mass of polystyrene resin, and (C) 0 to 70 parts by mass of fibrous inorganic filler.
Description
Technical Field
The present invention relates to a high-frequency signal transmission member.
Background
Engineering plastics are widely used for various applications such as automobile parts and electric/electronic parts because of their excellent mechanical properties, electric properties, water resistance, chemical resistance, solvent resistance, and the like.
In recent years, from the viewpoints of saving resources, reducing environmental load, reducing weight, and the like, it has been particularly desired to use a resin material for use in automobile parts and electric/electronic equipment for mobile use. In such applications, there are also substrates for electronic circuits that transmit high-frequency signals or transmit/receive electromagnetic waves, members for connecting the electronic circuits, and members that cover the electronic circuits (hereinafter, these are referred to as high-frequency signal transmission members), and such members are required to have not only excellent mechanical strength such as impact resistance but also excellent dielectric characteristics.
Here, the dielectric characteristics mean that transmission loss and transmission loss of the high-frequency signal are small. That is, excellent dielectric characteristics are referred to as low dielectric loss characteristics. The mechanical strength is sufficient enough to withstand outdoor use and long-term use.
As a resin material having low dielectric loss characteristics, polyolefin resins such as polyethylene and polypropylene are known. In many cases, heat is released from the high-frequency signal transmission member, and when these general-purpose resins are used, mechanical strength at high temperature is insufficient, and the use thereof may not be preferable.
In addition, polybutylene terephthalate resin (hereinafter sometimes referred to as PBT resin) has physical properties such as mechanical strength required for a high-frequency signal transmission member and is excellent in heat resistance, and therefore, it is considered to be preferable as a raw material for a high-frequency signal transmission member, but polybutylene terephthalate resin is insufficient in low dielectric loss characteristics and therefore cannot be preferably used as a raw material for a high-frequency signal transmission member.
As a countermeasure for improvement, a mixture of a PBT resin and a polyethylene resin is disclosed as a resin material having a mechanical strength of a certain level or more and having low dielectric loss characteristics (patent document 1).
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2013-131576
Disclosure of Invention
Problems to be solved by the invention
However, in recent years, resin materials having low dielectric loss characteristics for use in high-frequency signal transmission members such as antennas, radomes, and sensors used outdoors have been demanded, and these materials are required to have characteristics (hereinafter referred to as water resistance) that are hardly affected by moisture in the outdoor environment, particularly in rain, snow, and the like, and such characteristics have not been satisfied.
The present invention has been made to solve the above problems, and an object of the present invention is to provide a member having characteristics that are less susceptible to moisture than conventional members, as a high-frequency signal transmission member.
Solution for solving the problem
The present inventors have found that the above problems can be solved by the following.
1. A high-frequency signal transmission member formed of a polybutylene terephthalate resin composition, the polybutylene terephthalate resin composition comprising at least:
(A) 100 parts by mass of polybutylene terephthalate resin,
(B) 15 to 50 parts by mass of a polystyrene resin, and
(C) 0-70 parts by mass of fibrous inorganic filler.
2. The high-frequency signal transmission member according to the above 1, wherein the dielectric loss tangent of the member after 300 hours humidity adjustment at 23 ℃ and 50% RH is 0.01 or less, and the relative dielectric constant εr after 300 hours humidity adjustment at 23 ℃ and 50% RH 1 And a relative dielectric constant εr when dried at 110deg.C for 24 hours 2 The difference in relative dielectric constant between the two is 0.01 or less.
3. The high-frequency signal transmission member according to the above 1 or 2, which has a relative dielectric constant εr after humidity adjustment at 23 ℃ and 50% RH for 300 hours 1 At a relative dielectric constant εr of 3.5 or less 1 Relative to the medium at the time of water absorption after 300 hours of immersion in 80℃hot waterElectric constant εr 3 The difference is 0.10 or less.
4. The high-frequency signal transmission member according to any one of the preceding claims 1 to 3, wherein the polybutylene terephthalate resin composition contains a compatibilizer.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a member having excellent characteristics that is less susceptible to moisture than conventional ones can be provided as a high-frequency signal transmission member.
The mechanism of the effect embodying the present invention has not been elucidated, but it is presumed that: the overlapping of the successive benzene ring structures has a good influence on both low dielectric loss characteristics and water resistance.
Drawings
Fig. 1 is a diagram schematically showing an application example of the high-frequency signal transmission member of the present invention, fig. 1 (a) is a diagram showing a case where the high-frequency signal transmission member covers the high-frequency signal transmission section, and fig. 1 (b) is a diagram showing a case where the high-frequency signal transmission member covers the high-frequency signal reception section.
Detailed Description
Hereinafter, embodiments of the present invention will be described. The present invention is not limited to the following embodiments.
High frequency signal transmission unit
Fig. 1 is a diagram schematically showing an example of application of the high-frequency signal transmission member according to the present embodiment, where (a) of fig. 1 is a case where the high-frequency signal transmission member covers the high-frequency signal transmission section, and (b) of fig. 1 is a case where the high-frequency signal transmission member covers the high-frequency signal reception section. The high-frequency signal transmission member according to the present embodiment is a member for a high-frequency electric/electronic device, and more specifically, a circuit board for a high-frequency electric/electronic device, an antenna base for a high-frequency electric/electronic device, a radome for a high-frequency electric/electronic device, a connector for a high-frequency electric/electronic device, a housing for a high-frequency electric/electronic device, and the like.
As shown in fig. 1, the high-frequency signal transmission member 10 of the present embodiment is a member for covering the high-frequency signal transmission/transmission unit 20 and the high-frequency signal reception unit 30. When the high-frequency signal transmission member 10 covers the high-frequency signal transmission unit 20, as shown in fig. 1 a, electromagnetic waves emitted from the high-frequency signal transmission unit 20 are received by a high-frequency signal reception unit (not shown) existing outside through the high-frequency signal transmission member 10.
In the case where the high-frequency signal transmission member 10 covers the high-frequency signal reception unit 30, as shown in fig. 1b, electromagnetic waves emitted from a high-frequency signal transmission unit (not shown) existing outside are received by the high-frequency signal reception unit 30 through the high-frequency signal transmission member 10.
The high-frequency signal transmission member 10 of the present embodiment has low dielectric loss characteristics, excellent impact resistance, and excellent water resistance, and is therefore preferable as a high-frequency signal transmission member used in a severe environment. In particular, when the present invention is used as a member for protecting a radar for preventing a vehicle collision (a member for protecting a radar for avoiding a collision or the like), a vehicle radome, a vehicle connector, a vehicle electronic control circuit housing, a housing for a mobile phone, and a housing for a notebook computer, the water resistance and mechanical strength of the present invention are often required.
In fig. 1, the entire high-frequency signal transmission member 10 covering the high-frequency signal transmission unit 20 and the high-frequency signal reception unit 30 is the high-frequency signal transmission member of the present invention, but the high-frequency signal transmission member of the present invention may be disposed in a part such as a part where electromagnetic waves circulate.
The high-frequency signal transmission member 10 of the present embodiment shown in fig. 1 is an example of the high-frequency electric/electronic device of the present invention, in which the high-frequency signal transmission unit 20 and the high-frequency signal reception unit 30 are covered. As an example of the high-frequency electric/electronic device, a radar sensor and the like are given.
The high-frequency signal transmission member of the present invention has low dielectric loss characteristics, excellent mechanical strength, and excellent water resistance due to: the high-frequency signal transmission member is composed of a polybutylene terephthalate resin composition containing (A) a polybutylene terephthalate resin, (B) a polystyrene resin, and (C) a fibrous inorganic filler.
Polybutylene terephthalate resin composition
The polybutylene terephthalate resin composition constituting the high-frequency signal transmission member of the present invention contains at least (a) a polybutylene terephthalate resin, (B) a polystyrene resin, and (C) a fibrous inorganic filler.
Polybutylene terephthalate resin (A)
(A) The polybutylene terephthalate resin is a resin comprising at least terephthalic acid or an ester-forming derivative (C) 1-6 Alkyl esters, acid halides, etc.), and a diol component containing at least an alkylene glycol having 4 carbon atoms (1, 4-butanediol) or an ester-forming derivative thereof (an acetylate, etc.), and a polyester resin obtained by polycondensation. The polybutylene terephthalate resin is not limited to the homopolybutylene terephthalate resin, and may be a copolymer containing 60 mol% or more (particularly 75 mol% or more and 95 mol% or less) of a butylene terephthalate unit.
In the polybutylene terephthalate resin (a) used in the present invention, examples of dicarboxylic acid components (comonomer components) other than terephthalic acid and its ester-forming derivatives include: c such as isophthalic acid, phthalic acid, 2, 6-naphthalenedicarboxylic acid, 4' -dicarboxydiphenyl ether and the like 8-14 An aromatic dicarboxylic acid of (a); succinic acid, adipic acid, azelaic acid, sebacic acid, and the like C 4-16 An alkanedicarboxylic acid of (a); c such as cyclohexanedicarboxylic acid 5-10 A cycloalkanedicarboxylic acid of (2); ester-forming derivatives (C) of these dicarboxylic acid components 1-6 Alkyl ester derivatives, acid halides, etc.). These dicarboxylic acid components may be used singly or in combination of 2 or more.
In the polybutylene terephthalate resin (a) used in the present invention, examples of the diol component (comonomer component) other than 1, 4-butanediol include: c such as ethylene glycol, propylene glycol, trimethylene glycol, 1, 3-butanediol, hexamethylene glycol, neopentyl glycol, 1, 3-octanediol, etc 2-10 Alkylene glycol of (a); polyoxyalkylene glycols such as diethylene glycol, triethylene glycol, dipropylene glycol, and the like; cyclohexane dimethanol, hydrogenated bisphenolAlicyclic diols such as A; aromatic diols such as bisphenol a and 4,4' -dihydroxybiphenyl; bisphenol A C such as ethylene oxide 2 mol adduct of bisphenol A and propylene oxide 3 mol adduct of bisphenol A 2-4 Alkylene oxide adducts of (a); or ester-forming derivatives (acetylates, etc.) of their diols. These diol components may be used alone or in combination of 2 or more.
The intrinsic viscosity of the polybutylene terephthalate resin used in the present invention is not particularly limited within a range that does not hinder the object of the present invention. In addition, polybutylene terephthalate resins having different intrinsic viscosities may be mixed to adjust the polybutylene terephthalate resins to a desired intrinsic viscosity.
The amount of the terminal carboxyl groups of the (a) polybutylene terephthalate resin used in the present invention is not particularly limited as long as the object of the present invention is not impaired, and when the polybutylene terephthalate resin composition contains a compatibilizer (D) described later, the terminal carboxyl groups are preferably contained in a specific range. As will be described in detail below.
Polystyrene resin (B)
(B) The polystyrene resin is obtained by polymerizing a styrene monomer having a polymerizable double bond in a molecule. The styrene monomer is not particularly limited, and examples thereof include: styrene, p-methylstyrene, m-methylstyrene, p-chlorostyrene, p-fluorostyrene, p-phenylstyrene, p-tert-butylstyrene, alpha-methylstyrene, p-methyl-alpha-methylstyrene, 2-vinylnaphthalene, and the like.
(B) The polystyrene resin may be copolymerized with other monomers, but the styrene-derived monomer is preferably 50 mol% or more, more preferably 60 mol% or more, still more preferably 70 mol% or more, still more preferably 80 mol% or more, particularly preferably 90 mol% or more, and most preferably 100 mol% or more. Examples of the other monomer include olefin monomers such as ethylene and propylene, and acrylate monomers such as methyl methacrylate.
(B) The content of the polystyrene resin is preferably 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the polybutylene terephthalate resin (a). The content of the polystyrene resin (B) is preferably 10 parts by mass or more, because it exhibits low dielectric loss characteristics and excellent impact resistance, and the content of the polystyrene resin (B) is preferably 100 parts by mass or less, because it is excellent in mechanical strength and water resistance. More preferably, the content of the polystyrene resin (B) is 10 parts by mass or more and 60 parts by mass or less.
Fibrous inorganic filler (C)
In the present invention, the type of the fibrous inorganic filler (C) is not particularly limited. For example, glass fibers, asbestos fibers, silica-alumina fibers, zirconia fibers, boron nitride fibers, silicon nitride fibers, boron fibers, potassium titanate fibers, fibrous materials of metals such as stainless steel, aluminum, titanium, copper, brass, and the like can be cited as the (C) fibrous inorganic filler.
Among these (C) fibrous inorganic fillers, glass fibers are particularly preferred in the present invention. The glass fiber is preferably any known glass fiber, and is not dependent on the shape such as the glass fiber diameter, the cylindrical, cocoon-shaped cross section, or the oval cross section, or the length and glass cutting method used for manufacturing the chopped fiber, the roving, or the like.
In the present invention, the type of glass is not limited either, and in addition to the commonly used a glass and E glass, a corrosion-resistant glass containing zirconium element in the composition may be used in the resin composition, but from the viewpoint of low dielectric loss characteristics, so-called low dielectric glass such as D glass and NE glass is preferably used. Low dielectric glass is a glass having a composition containing a large amount of boron oxide and a small amount of aluminum oxide, calcium oxide, and magnesium oxide as compared with a glass a and a glass E, and is known as having a low relative dielectric constant and a low dielectric loss tangent.
As described above, the fiber length and the fiber diameter of the glass fiber may be in a usual range. For example, a fiber length of 2.0mm or more and 6.0mm or less and a fiber diameter of 9.0 μm or more and 14.0 μm or less may be used.
In order to improve the interfacial properties between the (C) fibrous inorganic filler and the (a) polybutylene terephthalate resin, it is preferable to use the (C) fibrous inorganic filler surface-treated with an organic treating agent such as a silane compound or an epoxy compound. As the silane compound and the epoxy compound, any known one can be preferably used.
(C) The content of the fibrous inorganic filler is not particularly limited, but is preferably 20 parts by mass or more and 80 parts by mass or less relative to 100 parts by mass of the polybutylene terephthalate resin (a). The content of 20 parts by mass or more is preferable for the reason of obtaining high mechanical strength, and the content of 80 parts by mass or less is preferable for the reason of not deteriorating dielectric characteristics and moldability. (C) The more preferable content of the fibrous inorganic filler is 20 parts by mass or more and 60 parts by mass or less.
Compatibilizer (D)
The polybutylene terephthalate resin composition described above optionally contains (D) a compatibilizer. By adding the compatibilizer (D) used in the present invention, the compatibility between the polybutylene terephthalate resin (a) and the polystyrene resin (B) is improved, and even in an environment exposed to moisture such as rain due to outdoor use, the invasion of moisture into the interface between the polybutylene terephthalate resin (a) and the polystyrene resin (B) is easily suppressed.
Examples of the compatibilizer (D) include compounds having a functional group reactive with the terminal carboxyl group of the polybutylene terephthalate resin (a), such as a reactive compound containing a glycidyl group and a maleic acid-modified compound, and examples of the reactive compound containing a glycidyl group include: a reactive copolymer comprising a monomer having a glycidyl group and a vinyl monomer or a styrene monomer; and/or a reactive compound containing a glycidyl group, which is composed of an alkyl methacrylate monomer and 3 or more monomers of an alkyl acrylate monomer.
As the maleic acid-modifying compound, styrene/maleic anhydride copolymer, styrene-acrylonitrile-maleic anhydride copolymer, and styrene-maleic acid half ester copolymer can be mentioned.
Heel of a shoe(D) The ratio (γ) of the functional group equivalent to the equivalent of the terminal carboxyl group when the functional group equivalent of the terminal carboxyl group reaction of the (A) polybutylene terephthalate resin in the compatibilizer is γ (g/eq) and the terminal carboxyl group amount of the (A) polybutylene terephthalate resin per 1kg is α (meq/kg) -1 ×10 6 ×w γ /(α×w α ) Preferably from 0.1 to 5.
Here, w α Represents (A) the content (100 parts by mass) of polybutylene terephthalate resin, w γ The content of the compatibilizer (D) is shown (relative to 100 parts by mass of the polybutylene terephthalate resin (A).
(D) The content of the compatibilizer is 1 part by mass or more and 15 parts by mass or less per 100 parts by mass of the polybutylene terephthalate resin (A).
Other additives
The polybutylene terephthalate resin composition optionally contains other components within a range that does not impair the effects of the present invention. Examples of the other component include: nucleating agents, pigments, antioxidants, stabilizers, plasticizers, lubricants, mold release agents, flame retardants and other additives, other resins and the like.
The content of the other components in the polybutylene terephthalate resin composition is not particularly limited, and is usually preferably 20 mass% or less, more preferably 10 mass% or less. In the case of using a flame retardant as the other component, the content is preferably 50% by mass or less, more preferably 40% by mass or less.
Process for producing polybutylene terephthalate resin composition
The specific mode of the method for producing the polybutylene terephthalate resin composition is not particularly limited, and the resin composition can be produced by using equipment and methods generally known as the production method of a resin composition or a molded article thereof. For example, the desired components may be mixed and kneaded using a single screw extruder, a twin screw extruder, or another melt kneading device, to prepare pellets for molding. In addition, a plurality of extruders or other melt-kneading devices may be used. Alternatively, all components may be fed simultaneously from a hopper, or a part of the components may be fed from a side feed port.
Properties of polybutylene terephthalate resin composition
The polybutylene terephthalate resin composition has a sea-island structure. Specifically, the polymer composition comprises a matrix phase (sea) of polybutylene terephthalate resin and a dispersed phase (islands) of polystyrene resin. The island structure can be formed by adjusting the content of the polybutylene terephthalate resin and the content of the polystyrene resin.
For example, when the matrix phase of the polystyrene resin is formed, it is difficult to determine the matrix phase and the dispersed phase, and the sea-island structure can be formed by increasing the content of polybutylene terephthalate relative to the polystyrene resin.
In the polybutylene terephthalate resin composition, the fibrous inorganic filler is present in the matrix phase. When the fibrous inorganic filler is not present in the matrix phase, the surface of the fibrous inorganic filler is treated with the organic treating agent, whereby the fibrous inorganic filler can be easily present in the matrix phase.
The polybutylene terephthalate resin composition is one of the characteristics in terms of excellent impact resistance as compared with a polystyrene resin monomer and a polybutylene terephthalate resin reinforced with a fibrous inorganic filler, but the polybutylene terephthalate resin composition has excellent low dielectric loss characteristics and water resistance as described below, and therefore can be preferably used as a raw material for a high-frequency signal transmission member. The resin composition has excellent impact resistance and has the following physical properties, so that the resin composition can be preferably used as a raw material for preventing a vehicle collision radar or the like.
The polybutylene terephthalate resin composition has excellent dielectric characteristics. Specifically, the following resin composition is preferably used: the dielectric loss tangent after humidity control at 23℃and 50% RH for 300 hours wasA relative dielectric constant εr of 0.01 or less after humidity control at 23 ℃ and 50% RH for 300 hours 1 Relative permittivity εr when dried at 110 ℃ for 24 hours 2 The difference is 0.10 or less.
In addition, it is preferable to use a relative dielectric constant εr after humidity adjustment at 23℃and 50% RH for 300 hours 1 The relative dielectric constant εr is 3.5 or less 1 And the relative dielectric constant εr when the glass is immersed in 80 ℃ hot water for 300 hours 3 The difference is 0.10 or less.
That is, the polybutylene terephthalate resin composition of the present invention has a small influence of humidity and has dielectric characteristics having excellent water resistance.
High frequency signal transmission unit
The high-frequency signal transmission member of the present invention is formed by molding the polybutylene terephthalate resin composition. The molding method is not particularly limited, and for example, injection molding or the like may be employed, but a preferable molding method may be employed depending on the shape of the high-frequency signal transmission member or the like.
As described above, the polybutylene terephthalate resin composition as a raw material is excellent in impact resistance and further excellent in water resistance and dielectric characteristics, and therefore the high-frequency signal transmission member of the present invention is also excellent in impact resistance, water resistance and dielectric characteristics.
Examples
Hereinafter, the present invention will be specifically described with reference to examples and comparative examples, but the present invention is not limited to these examples.
< Material >
(A) Polybutylene terephthalate resin (PBT): (manufactured by Baoli Plastic Co., ltd.) with a terminal carboxyl group content of 24meq/kg
(B-1) polystyrene resin 1 (PS) (HF-77, PS Japan Corporation)
(B-2) syndiotactic polystyrene resin (SPS) (Zarek 130ZC, manufactured by Ningzhixing Co., ltd.)
The resins used in this case are as follows.
PP: polypropylene (Primepolypro J707EG, primePolymer Co., ltd.)
PTFE, tetrafluorinated ethylene resin (KTL-450 manufactured by Xidocun Co., ltd.)
PPE: polyphenylene ether (PX 100L, mitsubishi engineering plastics Co., ltd.)
EEA: ethylene ethyl acrylate (NUC-6570, manufactured by Japan Unicar Co., ltd.)
PC: polycarbonate (PANLIGHT L1225, di Kagaku Co., ltd.)
PET: polyethylene terephthalate (BF 3067, manufactured by Inframa Co., ltd.)
PA6: polyamide (UBE nylon 1015B, manufactured by Yu Kogyo Xingjingsu Co., ltd.)
Core-shell polymers (Paraloid EXL2311, manufactured by Rohm and Haas Japan Co.)
Epoxy resin (Epikote JER1004K, mitsubishi chemical Co., ltd.)
(C-1) fibrous inorganic filler: glass fiber (E Glass) (GF) (ECS 03T-187 manufactured by Nitro Kagaku Kogyo Co., ltd.)
(C-2) low dielectric glass fiber: (TLD-CS 10-3.0-T-436S manufactured by Taishan glass fiber Co., ltd.)
Phenolic antioxidants (Irganox 1010BASF Japan Co., ltd.)
(D-1) compatibilizer: glycidyl group-containing reactive compounds: glycidyl methacrylate/ethylene copolymer ("Bondfast E", manufactured by Sumitomo chemical Co., ltd., epoxy equivalent of about 1200g/eq, glycidyl methacrylate 12% by mass)
(D-2) compatibilizer: maleic anhydride-modified SEBS (manufactured by Clayton Polymers Japan FG1901 polystyrene content 30% by mass)
Carbon black (750B Mitsubishi chemical system)
Production of polybutylene terephthalate resin composition
The components shown in tables 1 and 2 were used in the proportions shown in tables 1 and 2 (in parts by mass) and supplied to a container havingTwin-screw of the screw of (2)The extruder (TEX-30α, manufactured by Japan Steel works) was melt-kneaded at 250℃to obtain a pellet-shaped polybutylene terephthalate resin composition.
< evaluation >
Using the obtained pellet-shaped polybutylene terephthalate resin composition and the materials shown in the table, test pieces used for the following evaluation were produced by an injection molding method.
[ tensile test ]
The tensile strength and tensile elongation were evaluated by using a test piece for evaluating mechanical properties according to the evaluation standards defined in ISO527-1, 2. The evaluation results are shown in tables 1 and 2.
[ bending test ]
The test piece was evaluated for flexural strength and flexural modulus according to ISO 178. The evaluation results are shown in tables 1 and 2.
[ Charpy impact value ]
The Charpy impact strength was evaluated by using a test piece for evaluating mechanical properties according to the evaluation standard defined in ISO-179 (test piece thickness 4 mm). The evaluation results are shown in tables 1 and 2.
[ melt viscosity Property (MV) ]
Pellets of the resin composition of the present invention were dried at 140℃for 3 hours, and then subjected to capillary rheometer 1B (manufactured by Toyo Seisakusho Co., ltd.) according to ISO11443 at a furnace temperature of 260℃and a capillary tubeShear rate of 1000 seconds -1 The measurement is performed as follows. The unit is kPa.s. The evaluation results are shown in tables 1 and 2.
[ evaluation of dielectric Properties and Water resistance ]
For the examples and comparative examples, the relative permittivity and dielectric loss tangent were measured. Specifically, the relative dielectric constant at 1GHz was measured by a cavity resonator perturbation method using a network analyzer 8757D manufactured by Agilent corporation and a cavity resonator complex dielectric constant measuring device manufactured by Kanto electronics Co., ltd. In the measurement, a test piece having a predetermined shape (cross section 1.0mm×1.0mm, length 80 mm) was inserted into the cavity resonator. The evaluation results are shown in tables 1 and 2.
TABLE 1
TABLE 2
From tables 1 and 2, it is confirmed that: if the polybutylene terephthalate resin composition (the PBT resin composition of the example) is a polybutylene terephthalate resin composition that can be used as a raw material for a high-frequency signal transmission member of the invention, it is excellent in dielectric characteristics and water resistance without lowering mechanical strength.
Description of the reference numerals
10. High frequency signal transmission component
20. High-frequency signal transmission part
30. High frequency signal receiving unit
Claims (3)
1. A high-frequency signal transmission member formed of a polybutylene terephthalate resin composition, the polybutylene terephthalate resin composition comprising at least:
(A) 100 parts by mass of polybutylene terephthalate resin,
(B) 15 to 50 parts by mass of a polystyrene resin, and
(C) 0 to 70 parts by mass of fibrous inorganic filler,
the high-frequency signal transmission member has a dielectric loss tangent of 0.01 or less after 300 hours humidity adjustment at 23 ℃ and 50% RH, and a relative dielectric constant εr after 300 hours humidity adjustment at 23 ℃ and 50% RH 1 And a relative dielectric constant εr when dried at 110deg.C for 24 hours 2 The difference in relative dielectric constant between the two is 0.01 or less.
2. The method according to claim 1A high-frequency signal transmission member having a relative dielectric constant εr adjusted at 23 ℃ and 50% RH for 300 hours 1 At a relative dielectric constant εr of 3.5 or less 1 And the relative dielectric constant εr when the glass is immersed in 80 ℃ hot water for 300 hours 3 The difference is 0.10 or less.
3. The high-frequency signal transmission member according to claim 1 or 2, wherein the polybutylene terephthalate resin composition contains a compatibilizer.
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| JP2019-183774 | 2019-10-04 | ||
| JP2019183774 | 2019-10-04 | ||
| PCT/JP2020/028077 WO2021065161A1 (en) | 2019-10-04 | 2020-07-20 | High-frequency signal transmission component |
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| CN114364742A CN114364742A (en) | 2022-04-15 |
| CN114364742B true CN114364742B (en) | 2024-03-05 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2005133087A (en) * | 2003-10-07 | 2005-05-26 | Wintech Polymer Ltd | Resin composition for laser welding and its molded item |
| CN101484526A (en) * | 2006-07-14 | 2009-07-15 | 胜技高分子株式会社 | Polybutylene terephthalate resin composition for insulating parts |
| JP2010189584A (en) * | 2009-02-20 | 2010-09-02 | Toray Ind Inc | Polybutylene terephthalate-based resin composition |
| CN102612540A (en) * | 2009-11-10 | 2012-07-25 | 胜技高分子株式会社 | Polybutylene terephthalate resin composition |
| JP2013043942A (en) * | 2011-08-24 | 2013-03-04 | Wintech Polymer Ltd | Polybutylene terephthalate resin composition |
| JP2013131576A (en) * | 2011-12-20 | 2013-07-04 | Wintech Polymer Ltd | High frequency signal transmission component and high frequency electric/electronic apparatus |
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|---|---|---|---|---|
| JP2005133087A (en) * | 2003-10-07 | 2005-05-26 | Wintech Polymer Ltd | Resin composition for laser welding and its molded item |
| CN101484526A (en) * | 2006-07-14 | 2009-07-15 | 胜技高分子株式会社 | Polybutylene terephthalate resin composition for insulating parts |
| JP2010189584A (en) * | 2009-02-20 | 2010-09-02 | Toray Ind Inc | Polybutylene terephthalate-based resin composition |
| CN102612540A (en) * | 2009-11-10 | 2012-07-25 | 胜技高分子株式会社 | Polybutylene terephthalate resin composition |
| JP2013043942A (en) * | 2011-08-24 | 2013-03-04 | Wintech Polymer Ltd | Polybutylene terephthalate resin composition |
| JP2013131576A (en) * | 2011-12-20 | 2013-07-04 | Wintech Polymer Ltd | High frequency signal transmission component and high frequency electric/electronic apparatus |
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| JPWO2021065161A1 (en) | 2021-04-08 |
| DE112020004746T5 (en) | 2022-06-15 |
| WO2021065161A1 (en) | 2021-04-08 |
| JP7356508B2 (en) | 2023-10-04 |
| CN114364742A (en) | 2022-04-15 |
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