CN114364121A - PCB module and control system thereof - Google Patents
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Abstract
The invention discloses a PCB module and a control system thereof, relating to the technical field of circuit boards and comprising a detection circuit, a data acquisition module, an electrical analysis module and a heat dissipation protection module; the data acquisition module is used for acquiring a first detection result obtained by the detection circuit, and the electrical analysis module is used for judging whether electrical parameters of a PCB body connected with the detection circuit are normal or not according to the first detection result and giving an early warning in time; the PCB body is connected with a heat dissipation device, the heat dissipation protection module is used for monitoring the temperature data of the PCB body and processing and analyzing the temperature data, the heat accumulation coefficient of the PCB body is obtained through analysis and calculation according to the change condition of the change rate value Ht of the temperature, whether the PCB body is in the heat accumulation state is judged, then the heat dissipation effect of the heat dissipation device is judged, whether the heat dissipation device needs to be replaced is judged, the heat dissipation effect is improved, the PCB body is prevented from being damaged due to high temperature, and the service life of the circuit board is prolonged.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a PCB module and a control system thereof.
Background
Printed Circuit Boards (PCBs) are used as carriers for realizing electrical connection and fixation of electronic components, and elements such as transistors, resistors, capacitors, inductors and the like required in a circuit and wiring are interconnected together by adopting a certain process, manufactured on one or more small semiconductor wafers or medium substrates, and then packaged in a tube shell to form a microstructure with required circuit functions, so that the PCB is widely applied to various fields of modern production and manufacturing; at present, the application range of high-power and high-current electrical appliances is more and more extensive, electronic circuits controlled by power elements are more and more popular, the future development trend is that the power elements are smaller and smaller, the installation space is smaller and smaller, and the current passing through the control is larger and larger, so that the high requirement is provided for the heat dissipation mode of the power elements;
in order to achieve the purpose of better heat dissipation, at present, power elements are installed in a direct-insertion mode, and heat dissipation fins are fixed on the back of the power elements, but when a circuit board is subjected to temperature control, the processing efficiency is low, the safe use cannot be guaranteed, the heat dissipation effect is not prominent, and the automatic adjustment cannot be realized; meanwhile, the existing circuit board control system cannot monitor the operation data of the circuit board in real time and perform early warning analysis, so that the working efficiency of the circuit board is reduced, and the service life of the circuit board is shortened.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a PCB module and a control system thereof.
In order to achieve the above object, an embodiment according to a first aspect of the present invention provides a control system for a PCB module, including a detection circuit, a data acquisition module, an electrical analysis module, a control module, an alarm module, and a heat dissipation protection module;
the data acquisition module is used for acquiring a first detection result obtained by the detection circuit and uploading the first detection result to the electrical analysis module, and the first detection result comprises electrical parameters of a PCB body connected with the detection circuit;
the electrical analysis module is used for judging whether the electrical parameters of the PCB body connected with the detection circuit are normal or not according to the first detection result; if the stability value alpha is larger than a preset threshold value, indicating that the electrical parameter is abnormal, and generating an electrical abnormal signal; the electric analysis module is used for transmitting the electric abnormal signal to the alarm module through the control module, and the alarm module gives an alarm after receiving the electric abnormal signal;
be connected with heat abstractor on the PCB body, heat dissipation protection module is used for monitoring the temperature data of PCB body and carries out processing analysis to temperature data, judges heat abstractor's radiating effect and whether need change heat abstractor, and the concrete expression does:
if the heat accumulation coefficient KP is greater than the heat accumulation threshold, judging that the PCB body is in a heat accumulation state at present;
if the PCB body is in a heat accumulation state, judging that the heat dissipation performance of the heat dissipation device is poor, generating a heat dissipation replacement signal, sending the heat dissipation replacement signal to a mobile phone terminal of a manager, and prompting the manager to replace the heat dissipation device on the PCB body.
Further, the specific analysis steps of the electrical analysis module are as follows:
s21: when the PCB body is electrified, acquiring an electrical parameter DC of the PCB body;
if the electrical parameter DC is larger than the corresponding parameter threshold and the corresponding duration exceeds the preset duration, the electrical parameter is abnormal at the moment, and an electrical abnormal signal is generated;
s22: establishing a curve graph of the change of the electrical parameter DC along with time; from the initial moment, acquiring the electrical parameters of the PCB body according to a preset acquisition interval duration, and marking the acquired electrical parameters as DCi;
taking the newly acquired electrical parameters as DCn, taking the values of the DCn and the previous m groups of electrical parameters, and marking the values as interval parameters Ji, i-n-m, …, n; wherein m is a preset value;
s23: according to the interval parameter Ji, the stability value alpha of the electrical parameter is obtained, and the specific calculation method comprises the following steps:
when n is less than or equal to m; at the moment, automatically resetting the value of m, wherein m is n-1;
firstly, making i equal to n-m, and marking the interval parameter value at the moment as a reference value P; using formulas
Obtaining a stable value alpha; wherein | P-Ji | represents the absolute value of the difference between P and Ji;
s24: if the stability value alpha is not larger than the preset threshold value, making i equal to n-m +1, marking the collected electrical parameter as a reference value P, continuing to calculate a new stability value alpha, and so on; if the stability value alpha is larger than the preset threshold value, the electrical parameter is abnormal, and an electrical abnormal signal is generated.
Further, the specific analysis steps of the heat dissipation protection module are as follows:
the method comprises the following steps: marking the temperature of the surface of the PCB body as Ci, establishing a curve graph of Ci changing along with time, and marking the curve graph as a temperature curve graph; carrying out derivation on the temperature curve graph to obtain a temperature change rate curve graph;
step two: comparing the temperature Ci with a threshold limit temperature; if the first preset condition is met, judging that the surface temperature of the PCB body is high, generating a temperature abnormal signal, and sending the temperature abnormal signal to the control module, wherein the control module controls the PCB body to be powered off after receiving the temperature abnormal signal, so that the PCB body is prevented from being damaged by high temperature;
step three: if the temperature does not meet the first preset condition, obtaining a rate of change value of the temperature and marking the rate of change value as Ht, analyzing and calculating the heat accumulation coefficient KP of the PCB body according to the change condition of the Ht, and judging whether the PCB body is in a heat accumulation state or not.
Further, the first preset condition is that: ci is greater than or equal to the limit temperature threshold value, and the corresponding duration exceeds the preset duration.
Further, the specific analysis process of the heat accumulation coefficient KP is as follows:
s31: comparing the change rate value Ht of the temperature with a preset rate threshold, if Ht is more than or equal to the preset rate threshold, intercepting a corresponding curve segment in a corresponding curve graph, marking the curve segment as red and marking the curve segment as a threat curve segment;
s32: counting the number of threat curve segments to be Q1, integrating all threat curve segments with time and summing to obtain threat reference energy Q2, and calculating by using KP (Q1 × g1+ Q2 × g2 to obtain the heat accumulation coefficient KP of the current PCB body, wherein g1 and g2 are coefficient factors;
further, the detection circuit is used for detecting the electrical parameters of the PCB body connected with the detection circuit; the electrical parameter includes at least one of total current, on-resistance, and voltage.
Further, a PCB module for executing the control system of the PCB module includes a PCB body and a fixing bolt;
the PCB body is welded with an electronic element, and the electronic element is a surface-mounted element; the upper surface of the electronic element is provided with a heat dissipation device, and the heat dissipation device comprises a heat dissipation substrate and heat dissipation fins positioned on the upper surface of the heat dissipation substrate;
a plurality of electronic components are connected with the heat dissipation device simultaneously, and be provided with insulating heat conduction gasket between electronic component and the heat dissipation device, be provided with heat conduction silica gel between insulating heat conduction gasket and the heat dissipation device and between insulating heat conduction gasket and the electronic component.
Furthermore, the electronic component is a power component, and one end of each of the plurality of fixing bolts penetrates through the back surface of the PCB body and penetrates out of the front surface of the PCB body to be fixedly connected with the heat dissipation device, so that the heat dissipation device is fixed on the PCB body.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the electronic element on the front surface of the PCB body is installed in a surface-mounted manner, the upper surface of the electronic element is provided with the heat dissipation device, heat emitted by the electronic element is transmitted to the heat dissipation device through the insulating heat conduction gasket and the heat conduction silica gel, and then heat is dissipated through the heat dissipation device on the front surface, so that the heat dissipation effect is good;
2. when the PCB body is electrified, the electrical analysis module is used for judging whether the electrical parameters of the PCB body connected with the detection circuit are normal or not according to the first detection result, and if the electrical parameters DC are larger than the corresponding parameter threshold and the duration exceeds the preset duration, generating an electrical abnormal signal; otherwise, establishing a time-varying curve graph of the electrical parameter DC, setting the newly acquired electrical parameter as DCn, taking the value of the DCn and the previous m groups of electrical parameters, marking the value as interval parameter Ji, then obtaining a stability value alpha of the electrical parameter according to the interval parameter Ji, and if the stability value alpha is larger than a preset threshold value, generating an electrical abnormal signal; after the control module receives the electrical abnormal signal, the control alarm module sends an alarm to remind a manager to overhaul the PCB body;
3. the heat dissipation protection module is used for monitoring temperature data of the PCB body and processing and analyzing the temperature data, if the temperature data meets a first preset condition, the surface temperature of the PCB body is judged to be high, a temperature abnormal signal is generated, and the control module controls the power-off of the PCB body after receiving the temperature abnormal signal, so that the PCB body is prevented from being damaged by high temperature; if the temperature is not consistent with the first preset condition, the change rate value of the temperature is obtained and marked as Ht, the heat accumulation coefficient KP of the PCB body is obtained through analysis and calculation according to the change condition of the Ht, whether the PCB body is in the heat accumulation state or not is judged, so that a manager is prompted to replace a heat dissipation device on the PCB body, the heat dissipation effect is improved, the PCB body is prevented from being damaged due to high temperature, and the service life of the circuit board is prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a system block diagram of a control system of a PCB module according to the present invention.
Fig. 2 is a schematic structural diagram of a PCB module according to the present invention.
In the figure: 1. a PCB body; 2. a heat sink; 3. an insulating heat-conducting gasket; 4. an electronic component; 5. and (5) fixing the bolt.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 2, a control system of a PCB module includes a detection circuit, a data acquisition module, an electrical analysis module, a control module, an alarm module, and a heat dissipation protection module;
the detection circuit is used for detecting the electrical parameters of the PCB body 1 connected with the detection circuit; the electrical parameter comprises at least one of total current, on-resistance and voltage;
the data acquisition module is used for acquiring a first detection result obtained by the detection circuit and uploading the first detection result to the electrical analysis module, and the first detection result comprises electrical parameters of the PCB body 1 connected with the detection circuit;
the electric analysis module is used for judging whether the electric parameters of the PCB body 1 connected with the detection circuit are normal according to the first detection result, and the specific analysis steps are as follows:
s21: when the PCB body 1 is electrified, acquiring the electrical parameters of the PCB body 1 and marking the electrical parameters as DC;
comparing the electrical parameter DC with a corresponding parameter threshold;
if the electrical parameter DC is larger than the corresponding parameter threshold and the duration of the electrical parameter DC larger than the corresponding parameter threshold exceeds the preset duration, the electrical parameter is abnormal at the moment, and an electrical abnormal signal is generated;
s22: establishing a curve graph of the change of the electrical parameter DC along with time; from the initial moment, acquiring the electrical parameters of the PCB body 1 according to a preset acquisition interval duration, and marking the acquired electrical parameters as DCi;
taking the newly acquired electrical parameters as DCn, taking the values of the DCn and the previous m groups of electrical parameters, and marking the values as interval parameters Ji, i-n-m, …, n; wherein m is a preset value;
s23: according to the interval parameter Ji, the stability value alpha of the electrical parameter is obtained, and the specific calculation method comprises the following steps:
when n is less than or equal to m; at the moment, automatically resetting the value of m, wherein m is n-1; firstly, making i equal to n-m, and marking the interval parameter value at the moment as a reference value P; using formulas
Obtaining a stable value alpha(ii) a Wherein | P-Ji | represents the absolute value of the difference between P and Ji;
s24: comparing the stability value alpha with a preset threshold value; if the stability value alpha is not larger than the preset threshold value, making i equal to n-m +1, marking the collected electrical parameter as a reference value P, continuing to calculate a new stability value alpha, and so on;
if the stability value alpha is larger than a preset threshold value, indicating that the electrical parameter is abnormal, and generating an electrical abnormal signal; the electrical analysis module is used for transmitting the electrical abnormal signal to the alarm module through the control module, and the alarm module sends an alarm after receiving the electrical abnormal signal so as to remind a manager to overhaul the PCB body 1;
be connected with heat abstractor 2 on the PCB body 1, heat dissipation protection module is used for monitoring the temperature data of PCB body 1 and carries out processing analysis to temperature data, judges heat abstractor 2's radiating effect and whether need change heat abstractor 2, and wherein, temperature data is the temperature on PCB body 1 surface, and concrete analysis step is:
the method comprises the following steps: marking the temperature of the surface of the PCB body 1 as Ci, establishing a curve graph of the temperature Ci changing along with time, and marking the curve graph as a temperature curve graph; carrying out derivation on the temperature curve graph to obtain a temperature change rate curve graph;
step two: comparing the temperature Ci with a threshold limit temperature;
if the first preset condition is met, judging that the surface temperature of the PCB body 1 is high, generating a temperature abnormal signal, and sending the temperature abnormal signal to the control module, wherein the control module controls the PCB body 1 to be powered off after receiving the temperature abnormal signal, so that the PCB body 1 is prevented from being damaged by high temperature; wherein the first preset condition is: ci is greater than or equal to the limit temperature threshold, and the duration of Ci greater than or equal to the limit temperature threshold exceeds the preset duration;
step three: if the temperature does not meet the first preset condition, acquiring a rate of change value of the temperature, marking the rate of change value as Ht, and judging whether the PCB body 1 is in a heat accumulation state or not; the method comprises the following specific steps:
s31: comparing the change rate value Ht of the temperature with a preset rate threshold, if Ht is more than or equal to the preset rate threshold, intercepting a corresponding curve segment in a corresponding curve graph, marking the curve segment as red and marking the curve segment as a threat curve segment;
s32: counting the number of threat curve segments to be Q1, integrating all threat curve segments with time and summing to obtain threat reference energy Q2, and calculating by using KP (Q1 × g1+ Q2 × g2 to obtain the heat accumulation coefficient KP of the current PCB body 1, wherein g1 and g2 are coefficient factors;
s33: comparing the heat accumulation coefficient KP with a heat accumulation threshold, and if KP is greater than the heat accumulation threshold, judging that the PCB body 1 is in a heat accumulation state currently;
step four: if the PCB body 1 is in a heat accumulation state, judging that the heat dissipation performance of the heat dissipation device 2 is poor, generating a heat dissipation replacement signal, sending the heat dissipation replacement signal to a mobile phone terminal of a manager, prompting the manager to replace the heat dissipation device 2 on the PCB body 1, improving the heat dissipation effect, avoiding the damage of the PCB body 1 due to high temperature, and prolonging the service life of the circuit board;
in this embodiment, a PCB module is further disclosed, which is used for executing the control system, and includes a PCB body 1, where the PCB body 1 is in the prior art, and a specific structure thereof is not described herein again;
an electronic component 4 is welded on the PCB body 1, the electronic component 4 is a surface-mounted component, and preferably, the electronic component 4 is a power component;
the surface-mounted electronic component 4 is provided with a heat dissipation device 2 on the upper surface, and the heat dissipation device 2 is fixedly connected with the PCB body 1, generally, the heat dissipation device 2 comprises a heat dissipation substrate and heat dissipation fins positioned on the upper surface of the heat dissipation substrate, and heat is transferred to the heat dissipation fins through the heat dissipation substrate to dissipate heat;
when heat is conducted, because the heights of the surface-mounted electronic elements 4 may be different, in order to achieve sufficient contact heat conduction, an insulating heat-conducting gasket 3 may be added between the electronic elements 4 and the heat dissipation device 2, and in addition, in order to achieve better fixing and heat conduction effects, heat-conducting silica gel is arranged between the insulating heat-conducting gasket 3 and the heat dissipation device 2 and between the insulating heat-conducting gasket 3 and the electronic elements 4;
furthermore, one end of each of a plurality of fixing bolts 5 penetrates through the back surface of the PCB body 1 and penetrates out of the front surface of the PCB body 1 to be fixedly connected with the heat dissipation device 2, so that the heat dissipation device 2 is fixed on the PCB body 1;
in conclusion, in this application the positive electronic component 4 of PCB body 1 adopts the mode of table subsides to install, and electronic component 4's upper surface is provided with heat abstractor 2, and the heat that electronic component 4 distributed transmits for heat abstractor 2 through insulating heat conduction gasket 3 and heat conduction silica gel, then dispels the heat through positive heat abstractor 2, and the radiating effect is good.
The above formulas are all calculated by removing dimensions and taking numerical values thereof, the formula is a formula which is obtained by acquiring a large amount of data and performing software simulation to obtain the closest real situation, and the preset parameters and the preset threshold value in the formula are set by the technical personnel in the field according to the actual situation or obtained by simulating a large amount of data.
The working principle of the invention is as follows:
when the PCB module and the control system thereof work, an electronic element 4 on the front surface of a PCB body 1 is installed in a surface-mounted mode, a heat dissipation device 2 is arranged on the upper surface of the electronic element 4, heat emitted by the electronic element 4 is transmitted to the heat dissipation device 2 through an insulating heat conduction gasket 3 and heat conduction silica gel, and then heat dissipation is carried out through the heat dissipation device 2 on the front surface, so that the heat dissipation effect is good;
when the PCB body 1 is electrified, the data acquisition module is used for acquiring a first detection result obtained by the detection circuit and uploading the first detection result to the electrical analysis module, the electrical analysis module is used for judging whether the electrical parameters of the PCB body 1 connected with the detection circuit are normal or not according to the first detection result, and if the electrical parameters DC are larger than a corresponding parameter threshold value and the duration exceeds a preset duration, an electrical abnormal signal is generated; otherwise, establishing a time-varying curve graph of the electrical parameter DC, setting the newly acquired electrical parameter as DCn, taking the value of the DCn and the previous m groups of electrical parameters, marking the value as interval parameter Ji, then obtaining a stability value alpha of the electrical parameter according to the interval parameter Ji, and if the stability value alpha is larger than a preset threshold value, generating an electrical abnormal signal; after the control module receives the electrical abnormal signal, the control alarm module sends an alarm to remind a manager to overhaul the PCB body 1;
the heat dissipation protection module is used for monitoring the temperature data of the PCB body 1, processing and analyzing the temperature data, and judging the heat dissipation effect of the heat dissipation device 2 and whether the heat dissipation device 2 needs to be replaced; comparing the temperature Ci with a threshold limit temperature; if the first preset condition is met, judging that the surface temperature of the PCB body 1 is high, generating a temperature abnormal signal, and controlling the PCB body 1 to be powered off after the control module receives the temperature abnormal signal, so as to prevent the PCB body 1 from being damaged by high temperature; if the temperature does not meet the first preset condition, acquiring a rate of change value of the temperature, marking the rate of change value as Ht, and judging whether the PCB body 1 is in a heat accumulation state or not; if the PCB body 1 is in a heat accumulation state, the heat dissipation performance of the heat dissipation device 2 is judged to be poor, a heat dissipation replacement signal is generated, a manager is prompted to replace the heat dissipation device 2 on the PCB body 1, the heat dissipation effect is improved, the PCB body 1 is prevented from being damaged due to high temperature, and the service life of the circuit board is prolonged.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise forms disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (8)
1. A control system of a PCB module is applied to a PCB body (1) and is characterized by comprising a detection circuit, a data acquisition module, an electrical analysis module, a control module, an alarm module and a heat dissipation protection module;
the data acquisition module is used for acquiring a first detection result obtained by the detection circuit and uploading the first detection result to the electrical analysis module, and the first detection result comprises electrical parameters of a PCB body (1) connected with the detection circuit;
the electrical analysis module is used for judging whether the electrical parameters of the PCB body (1) connected with the detection circuit are normal or not according to the first detection result; if the stability value alpha is larger than a preset threshold value, indicating that the electrical parameter is abnormal, and generating an electrical abnormal signal; the electric analysis module is used for transmitting the electric abnormal signal to the alarm module through the control module, and the alarm module gives an alarm after receiving the electric abnormal signal;
be connected with heat abstractor (2) on PCB body (1), heat dissipation protection module is used for monitoring the temperature data of PCB body (1) and carries out processing analysis to temperature data, judges the radiating effect of heat abstractor (2) and whether need change heat abstractor (2), and the concrete performance is:
if the heat accumulation coefficient KP is greater than the heat accumulation threshold, judging that the PCB body (1) is in a heat accumulation state at present;
if the PCB body (1) is in a heat accumulation state, judging that the heat dissipation performance of the heat dissipation device (2) is poor, generating a heat dissipation replacement signal, sending the heat dissipation replacement signal to a mobile phone terminal of a manager, and prompting the manager to replace the heat dissipation device (2) on the PCB body (1).
2. The control system of the PCB module according to claim 1, wherein the specific analysis steps of the electrical analysis module are:
s21: when the PCB body (1) is electrified, acquiring an electrical parameter DC of the PCB body (1);
if the electrical parameter DC is larger than the corresponding parameter threshold and the corresponding duration exceeds the preset duration, the electrical parameter is abnormal at the moment, and an electrical abnormal signal is generated;
s22: establishing a curve graph of the change of the electrical parameter DC along with time; from the initial moment, acquiring the electrical parameters of the PCB body (1) according to a preset acquisition interval duration, and marking the acquired electrical parameters as DCi;
taking the newly acquired electrical parameters as DCn, taking the values of the DCn and the previous m groups of electrical parameters, and marking the values as interval parameters Ji, i-n-m, …, n; wherein m is a preset value;
s23: according to the interval parameter Ji, the stability value alpha of the electrical parameter is obtained, and the specific calculation method comprises the following steps:
when n is less than or equal to m; at the moment, automatically resetting the value of m, wherein m is n-1;
firstly, making i equal to n-m, and marking the interval parameter value at the moment as a reference value P; using formulas
Obtaining a stable value alpha; wherein | P-Ji | represents the absolute value of the difference between P and Ji;
s24: if the stability value alpha is not larger than the preset threshold value, making i equal to n-m +1, marking the collected electrical parameter as a reference value P, continuing to calculate a new stability value alpha, and so on; if the stability value alpha is larger than the preset threshold value, the electrical parameter is abnormal, and an electrical abnormal signal is generated.
3. The control system of the PCB module of claim 1, wherein the specific analysis steps of the heat dissipation protection module are as follows:
the method comprises the following steps: marking the temperature of the surface of the PCB body (1) as Ci, establishing a curve graph of Ci changing along with time, and marking the curve graph as a temperature curve graph; carrying out derivation on the temperature curve graph to obtain a temperature change rate curve graph;
step two: comparing the temperature Ci with a threshold limit temperature; if the first preset condition is met, judging that the surface temperature of the PCB body (1) is high, generating a temperature abnormal signal, and sending the temperature abnormal signal to the control module, wherein the control module controls the PCB body (1) to be powered off after receiving the temperature abnormal signal, so that the PCB body (1) is prevented from being damaged by high temperature;
step three: if the temperature does not meet the first preset condition, obtaining a rate of change value of the temperature and marking the rate of change value as Ht, analyzing and calculating the heat accumulation coefficient KP of the PCB body (1) according to the change condition of the Ht, and judging whether the PCB body (1) is in a heat accumulation state or not.
4. The control system of a PCB module according to claim 3, wherein the first preset condition is: ci is greater than or equal to the limit temperature threshold value, and the corresponding duration exceeds the preset duration.
5. The control system of the PCB module according to claim 3, wherein the specific analysis process of the heat accumulation coefficient KP is as follows:
s31: comparing the change rate value Ht of the temperature with a preset rate threshold, if Ht is more than or equal to the preset rate threshold, intercepting a corresponding curve segment in a corresponding curve graph, marking the curve segment as red and marking the curve segment as a threat curve segment;
s32: the number of the threat curve segments is counted as Q1, all the threat curve segments are integrated with time and summed to obtain threat reference energy Q2, and the heat accumulation coefficient KP of the current PCB body (1) is calculated by using KP (Q1 × g1+ Q2 × g2, wherein g1 and g2 are coefficient factors.
6. A control system of a PCB module according to claim 1, wherein the detection circuit is adapted to detect an electrical parameter of a PCB body (1) connected to the detection circuit; the electrical parameter includes at least one of total current, on-resistance, and voltage.
7. A PCB module for executing a control system of a PCB module according to any of the claims 1-6, characterized by comprising a PCB body (1) and a fixing bolt (5);
an electronic element (4) is welded on the PCB body (1), and the electronic element (4) is a surface-mounted element; the upper surface of the electronic element (4) is provided with a heat dissipation device (2), and the heat dissipation device (2) comprises a heat dissipation substrate and heat dissipation fins positioned on the upper surface of the heat dissipation substrate;
a plurality of electronic components (4) are connected with heat abstractor (2) simultaneously, are provided with insulating heat conduction gasket (3) between electronic component (4) and heat abstractor (2), be provided with heat conduction silica gel between insulating heat conduction gasket (3) and heat abstractor (2) and between insulating heat conduction gasket (3) and electronic component (4).
8. A PCB module according to claim 7, wherein the electronic component (4) is a power component, and one end of a plurality of fixing bolts (5) passes through the back surface of the PCB body (1) and penetrates out of the front surface of the PCB body (1) to be fixedly connected with the heat sink (2), so as to fix the heat sink (2) to the PCB body (1).
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Citations (6)
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