CN114361932A - Laser device - Google Patents

Abstract

The embodiment of the application discloses a laser device, and belongs to the field of photoelectricity. In this application embodiment, ceramic frame's medial surface includes the reflection inclined plane, and the laser beam that every laser chip launches is to the reflection inclined plane of corresponding ceramic frame on to follow light window and jet out after ceramic frame's reflection inclined plane reflection, so need not to set up reflection prism on the bottom plate and reflect the laser beam that laser chip sent, reduced reflection prism and taken up the bottom plate area, can set up more laser chips on the messenger same bottom plate area, thereby improve the power of laser instrument.

Description

Laser device

Technical Field

The embodiment of the application relates to the field of photoelectricity, in particular to a laser.

Background

With the development of optoelectronic technology, lasers are widely used in optoelectronic devices. The laser comprises an optical window, a bottom plate, a plurality of laser chips and a plurality of prisms, wherein the laser chips and the prisms are arranged on the bottom plate, and each laser chip corresponds to one prism. The laser chip is used for emitting laser beams, and the prism is used for reflecting the laser beams emitted by the laser chip and then emitting the laser beams through the light window. However, due to the limited area of the substrate, the number of laser chips that can be disposed on the substrate is limited, resulting in a low power of the laser, which limits the application of the laser in high brightness laser display products.

Disclosure of Invention

The embodiment of the application provides a laser, which can solve the problem that the laser power is lower due to the limited number of laser chips which can be arranged on a bottom plate. The technical scheme is as follows:

in one aspect, a laser is provided, the laser comprising: the laser chip comprises a ceramic frame, a bottom plate, a plurality of laser chips and an optical window, wherein a closed space is defined by the ceramic frame, the bottom plate and the optical window;

the inner side surface of the ceramic frame is a reflecting inclined surface;

the laser chips are positioned in the closed space and connected with the bottom plate, and light outlets of the laser chips are opposite to the inner side surface of the ceramic frame;

and light beams emitted by the plurality of laser chips are reflected by the inner side surface of the ceramic frame and then are emitted out through the light window.

Optionally, a distance between each of the plurality of laser chips and the optical window is inversely proportional to a distance between the respective laser chip and the opposite inner side of the ceramic frame.

Optionally, the inner side surface of the ceramic frame includes a first inner side surface and a second inner side surface, the first inner side surface is opposite to the second inner side surface, a first part of the laser chips is opposite to the first inner side surface, and a second part of the laser chips except the first part of the laser chips is opposite to the second inner side surface.

Optionally, the plurality of laser chips are arranged in multiple rows, the distance between each laser chip in the same row and the inner side face of the opposite ceramic frame is equal, and the difference between the distance between any two laser chips in two adjacent rows opposite to the same inner side face of the ceramic frame and the optical window is not less than the thickness of the laser chips.

Optionally, the upper surface of the base plate includes a plurality of step surfaces, and the plurality of laser chips are connected to the plurality of step surfaces of the base plate.

Optionally, the laser further includes a plurality of heat sinks corresponding to the plurality of laser chips one to one, and each laser chip is connected to one step surface of the base plate through the corresponding heat sink.

Optionally, the upper surface of the base plate is a horizontal plane, the laser further includes a plurality of substrates, the plurality of substrates are different in height, lower surfaces of the plurality of substrates are connected to the upper surface of the base plate, and the plurality of laser chips are disposed on the upper surfaces of the plurality of substrates.

Optionally, the laser further includes a plurality of heat sinks corresponding to the plurality of laser chips one to one, and each laser chip is connected to the upper surface of one of the plurality of substrates through the corresponding heat sink.

Optionally, the bottom plate is an oxygen-free copper bottom plate, the plurality of substrates are copper substrates, and the plurality of substrates are welded on the upper surface of the bottom plate.

Optionally, an included angle between the inner side surface of the ceramic frame and a horizontal plane where the bottom plate is located is 45 degrees.

Optionally, the reflection inclined plane is an inner side surface of the ceramic frame, on which a reflection film is sprayed.

The beneficial effects brought by the technical scheme provided by the embodiment of the application at least comprise:

in this application embodiment, ceramic frame's medial surface includes the reflection inclined plane, reflects the produced laser beam of laser chip through this reflection inclined plane, just so need not to set up reflection prism on the bottom plate, has reduced the occupation of reflection prism to the bottom plate area, can set up more laser chips on making the same bottom plate area to improve the power of laser instrument.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a laser provided in the related art;

fig. 2 is a schematic structural diagram of a laser provided in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a reflection bevel of a ceramic frame according to an embodiment of the present disclosure;

fig. 4 is a top view of a laser provided in an embodiment of the present application;

FIG. 5 is a schematic diagram of another laser structure provided in the embodiments of the present application;

FIG. 6 is a top view of another laser provided in embodiments of the present application;

FIG. 7 is a schematic structural diagram of another laser provided in an embodiment of the present application;

fig. 8 is a schematic structural diagram of a substrate in a laser provided in an embodiment of the present application;

fig. 9 is a schematic structural diagram of a connection relationship between a base plate and a laser chip according to an embodiment of the present disclosure;

FIG. 10 is a schematic diagram of another laser structure provided in the embodiments of the present application;

FIG. 11 is a schematic diagram of another laser structure provided in the embodiments of the present application;

fig. 12 is a schematic structural diagram of a substrate in a laser according to an embodiment of the present application.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present application more clear, the embodiments of the present application will be further described in detail with reference to the accompanying drawings.

The "plurality" mentioned in the embodiments of the application means two or more. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.

Fig. 1 is a schematic structural diagram of a laser provided in the related art. As shown in fig. 1, the laser includes a frame 101, a base plate 102, a plurality of laser chips 103, a plurality of reflection prisms 104, and an optical window 105, the frame 101, the base plate 102, and the optical window 105 enclose an enclosed space, and the plurality of laser chips 103 and the plurality of reflection prisms 104 are located in the enclosed space and are all disposed on the base plate 102. The plurality of laser chips 103 correspond to the plurality of reflection prisms 104 one-to-one, and each reflection prism 104 of the plurality of reflection prisms 104 is located on the light emitting side of the corresponding laser chip 103 and is configured to reflect the laser beam emitted from the corresponding laser chip 103, so that the reflected laser beam can be emitted from the louver 105.

As can be seen from the laser shown in fig. 1, the laser beam generated by the laser chip is parallel to the horizontal plane where the optical window is located, and in the related art, the reflecting prism is adopted to change the direction of the laser beam, so that the laser beam generated by the laser chip can be emitted from the optical window. However, the area of the substrate for supporting the laser chips and the reflecting prism is limited, so the number of laser chips that can be disposed on the substrate is also limited, resulting in a low power of the laser, which limits the application of the laser to high-brightness laser display products.

Fig. 2 is a schematic structural diagram of a laser according to an embodiment of the present disclosure, and as shown in fig. 2, the laser includes a ceramic frame 201, a bottom plate 202, a plurality of laser chips 203 and an optical window 204, where the ceramic frame 201, the bottom plate 202 and the optical window 204 enclose an enclosed space, an inner side of the ceramic frame 201 includes a reflective inclined plane, the plurality of laser chips 203 are located in the enclosed space and connected to the bottom plate 202, and light outlets of the plurality of laser chips 203 are opposite to the reflective inclined plane of the ceramic frame 201; the light beams emitted by the plurality of laser chips 203 are reflected by the inner side surface of the ceramic frame 201 and then emitted through the light window 204.

Because the inner side surface of the ceramic frame comprises the reflection inclined surface, the laser beam generated by the laser chip can be reflected, a reflection prism is not required to be arranged on the bottom plate, the occupation of the reflection prism on the area of the bottom plate is reduced, more laser chips can be arranged on the same area of the bottom plate, and the power of the laser is improved.

It should be noted that the ceramic frame 201 may be a hollow polyhedron structure or a ring structure surrounded by ceramic walls and having an upper opening and a lower opening, where the upper opening is an opening connected to the optical window, the lower opening is an opening connected to the bottom plate, and a vertical distance between a horizontal plane in which the upper opening is located and a horizontal plane in which the lower opening is located is not less than 3mm, that is, a height of the ceramic frame 201 is not less than 3mm, for example, 4 mm. In addition, the reflecting slope of the ceramic frame 201 may be as shown in fig. 3. Thus, the laser beam emitted by the laser chip can change the optical path of the laser beam after being reflected by the reflecting inclined plane of the ceramic frame 201, so that the laser beam can be emitted from the optical window.

For example, the ceramic frame 201 may have a hollow cubic structure with an upper opening and a lower opening, in which case, the ceramic frame 201 has four inner sides, and all the four inner sides of the ceramic frame 201 may be set as reflective slopes, or part of the four inner sides of the ceramic frame 201 may also be set as reflective slopes.

Referring to fig. 2, a first inner side 2011 and a second inner side 2012, which are opposite to each other, of four inner sides included in the ceramic frame 201 may be reflective slopes, a first portion of the laser chips 203 of the plurality of laser chips 203 is opposite to the first inner side 2011, and a second portion of the laser chips 203 except the first portion of the laser chips 203 is opposite to the second inner side 2012. The laser beams emitted by a first part of the laser chips 203 of the plurality of laser chips 203 are incident on the first inner side 2011 and are emitted from the light window 204 after being reflected by the first inner side 2011, and the laser beams emitted by a second part of the laser chips 203 of the plurality of laser chips 203 are incident on the second inner side 2012 and are emitted from the light window 204 after being reflected by the second inner side 2012.

It should be noted that, taking the symmetry axis between the first inner side surface 2011 and the second inner side surface 2012 as the central axis, the laser chip 203 located on the same side of the central axis as the first inner side surface 2011 is the first part of laser chip, and the light exit of the first part of laser chip faces the first inner side surface 2011, that is, the laser beam emitted by the first part of laser chip will be incident on the first inner side surface 2011, and is emitted from the light window 204 after being reflected by the first inner side surface 2011. The laser chip 203 located on the same side of the central axis as the second inner side surface 2012 is a second part of laser chip, and light outlets of the second part of laser chip face the second inner side surface 2012, that is, laser beams emitted by the second part of laser chip will be incident on the second inner side surface 2012, and are emitted from the light window 204 after being reflected by the second inner side surface 2012.

For example, fig. 4 is a top view of the laser according to the embodiment of the present application, a straight line a-a ' in fig. 4 is a symmetry axis between the first inner side surface 2011 and the second inner side surface 2012, fig. 4 shows 6 rows of laser chips, and the light outlet of the laser chip 203 located on the left side of the symmetry axis a-a ' faces the first inner side surface 2011, so that the laser generated by the laser chip 203 located on the left side of the symmetry axis a-a ' can be incident on the first inner side surface 2011, and can be emitted from the light window 204 after being reflected by the first inner side surface 2011. The light outlet of the laser chip 203 on the right side of the symmetry axis a-a 'faces the second inner side 2012, and the laser beam generated by the laser chip 203 on the right side of the symmetry axis a-a' can be incident on the second inner side 2012 and reflected by the second inner side 2012 and then emitted from the light window 204.

Alternatively, the angle between the reflecting slope of the ceramic frame 201 and the horizontal plane on which the bottom plate 202 is located may be 45 degrees.

Illustratively, the included angle between the first inner side face and the second inner side face of the ceramic frame and the horizontal plane in which the bottom plate is arranged is 45 degrees. In this way, laser beams emitted from the plurality of laser chips 203 located in the enclosed space surrounded by the ceramic frame 201, the bottom plate 202, and the optical window 204 are incident on the reflection inclined plane of the ceramic frame 201 at an incident angle of 45 degrees, are reflected by the reflection inclined plane of the ceramic frame 201, and are emitted in a direction perpendicular to the horizontal plane where the optical window is located.

Alternatively, referring to fig. 5, a reflection slope may be obtained by spraying a reflection film 205 on the inner slope of the ceramic frame 201, which may improve the reflection effect of the reflection slope of the ceramic frame 201 on the laser beam.

The material of the reflective film 205 sprayed on the inner slope of the ceramic frame 201 may be aluminum oxide and/or silicon dioxide, or may be other film materials capable of reflecting laser beams, which is not limited in this embodiment of the application.

Illustratively, if aluminum oxide and/or silicon dioxide are used as the reflective film material, it can be sprayed on the inner slope of the ceramic frame 201 by magnetron sputtering.

Optionally, the ceramic frame 201 of this application embodiment may be made of aluminum oxide and/or silicon nitride, and because the aluminum oxide or silicon nitride ceramic material has higher hardness and a larger thermal conductivity coefficient, not only can the laser chip 203 set in the ceramic frame 201 be protected, but also the heat generated when the laser chip 203 emits light can be quickly conducted out of the enclosed space surrounded by the ceramic frame 201, the bottom plate 202 and the optical window 204, and the performance of the laser is improved, but the ceramic frame 201 of this application embodiment may also be made of other ceramic materials having higher hardness and good thermal conductivity, and this application embodiment is not limited thereto.

Alternatively, as can be seen from the above description, referring to fig. 2 and 5, a bottom plate 202 is connected to the lower opening of the ceramic frame 201, the upper surface of the bottom plate 202 may be a horizontal plane, and the laser chips 203 are disposed on the bottom plate 202, in which case, the distance between each laser chip 203 of the plurality of rows of laser chips 203 and the optical window 204 is equal. Wherein, the plurality of laser chips may be correspondingly arranged in a corresponding number of columns and rows according to the number of the reflection slopes included in the ceramic frame 201.

For example, when the ceramic frame 201 includes two reflecting slopes, i.e., a first inner side 2011 and a second inner side 2012, the plurality of laser chips 203 may be arranged in two rows, and each row of laser chips is opposite to one reflecting slope, as shown in fig. 4. Of course, if the four inner side surfaces of the ceramic frame 201 are all reflective inclined surfaces, the plurality of laser chips may be arranged in two rows and two columns, where each of the two columns corresponds to one reflective inclined surface, and each of the two rows corresponds to one reflective inclined surface.

It should be noted that, in the embodiment of the present application, a distance between each laser chip in one column or one row of laser chips and the corresponding reflection inclined plane of the ceramic bezel may be equal or unequal, which is not limited in the embodiment of the present application.

In another possible implementation, when the upper surface of the base plate 202 is horizontal, the plurality of laser chips 203 may be arranged in a plurality of columns and/or a plurality of rows. In this case, each of the reflective slopes in the ceramic frame 201 may correspond to a plurality of columns or rows of the laser chips 203. Moreover, the multiple rows or multiple columns of laser chips 203 opposite to the same reflection inclined plane of the ceramic frame 201 may be staggered, that is, no other laser chip 203 is disposed between each laser chip 203 and the corresponding reflection inclined plane, so that the laser beam generated by each laser chip 203 is not shielded by other laser chips 203, and thus it can be ensured that the laser beam emitted by each laser chip 203 can be incident to the corresponding reflection inclined plane of the ceramic frame 201, and is emitted from the optical window 204 after being reflected by the reflection inclined plane of the ceramic frame 201.

For example, referring to fig. 6, the plurality of laser chips 203 are arranged in a plurality of rows, and the plurality of rows of laser chips 203 facing the same reflection slope of the ceramic frame 201 may be arranged in a staggered manner. Fig. 6 is merely an example of arranging the laser chips on the horizontal bottom surface according to the embodiment of the present application, and a plurality of rows of laser chips may be arranged on the horizontal bottom surface in another manner, which is not limited in the embodiment of the present application.

Optionally, the laser further includes a heat sink 206 corresponding to the plurality of laser chips 203 one by one, and each laser chip 203 is connected to the upper surface of the base plate 202 through the corresponding heat sink 206, so that heat generated when the laser chip emits light can be rapidly dissipated from the heat sink 206.

It should be noted that the heat sink 206 has a larger thermal conductivity, so that when the laser chip 203 emits light to generate heat, the heat can be quickly conducted out, and the laser chip 203 is prevented from being damaged by the heat. The material of the heat sink 206 may include aluminum nitride and/or silicon carbide, or other ceramic materials with large thermal conductivity. By providing the heat sink 206 between the laser chip 203 and the horizontal surface of the base plate 202, heat generated when the laser chip 203 emits light can be led out at a higher speed.

The length of the heat sink 206 in the x direction is greater than the length of the laser chip 203 in the x direction, the length of the heat sink 206 in the y direction is greater than the length of the laser chip 203 in the y direction, and the thickness of the heat sink 206 is 0.1-0.3mm, for example, 0.2 mm.

The top surface of the heat sink 206 is connected to the bottom surface of the laser chip 203 by soldering or bonding, and is used to fix the laser chip 203, and the bottom surface is connected to the horizontal surface of the base plate 202 so as to be fixed to the base plate 202, and transfers heat generated when the laser chip 203 emits light from the base plate 202 to the outside of the laser. The bottom surface of the laser chip 203 and the upper surface of the heat sink 206 may be connected in a manner that the entire bottom surface of the laser chip 203 is completely adhered to the upper surface of the heat sink 206, or a portion of the bottom surface of the laser chip 203 away from the light exit port is adhered to the upper surface of the heat sink 206, which is not limited in this embodiment.

When the whole bottom surface of the laser chip 203 is completely pasted on the upper surface of the heat sink 206, the contact area between the laser chip 203 and the heat sink 206 is large, so that the area of the area supported by the heat sink 206 in the laser chip 203 is increased, and the setting stability of the laser chip 203 is improved. When the bottom surface of the laser chip 203 away from the light-emitting side is adhered to the upper surface of the heat sink 206, the heat generated when the laser chip 203 emits light can be quickly dissipated because the bottom surface of the laser chip 203 is not in contact with any object, and the heat dissipation effect of the laser chip 203 is improved.

Optionally, a distance between each laser chip 203 of the plurality of laser chips 203 disposed on the base plate 202 and the optical window 204 is inversely proportional to a distance between the corresponding laser chip 203 and the inner side surface of the opposite ceramic frame 201.

In one implementation, referring to fig. 7, the upper surface of the base plate 202 includes a plurality of step surfaces, and the plurality of laser chips 203 are connected to the plurality of step surfaces of the base plate 202.

It should be noted that fig. 7 only shows 6 laser chips 203, but the number of the laser chips 203 in the laser of the embodiment of the present application is not limited to 6, and may be 15, 20 or more, and the embodiment of the present application does not limit this. In addition, a distance n shown in fig. 7 is a distance between one of the plurality of laser chips 203 and the optical window 204, and a distance m is a distance between one of the plurality of laser chips 203 and the inner side surface of the ceramic frame 201 facing thereto.

As shown in fig. 8, a plurality of step surfaces may be etched on a whole copper plate by etching. Each step surface is a rectangle, the length of the rectangle in the x direction is not less than the length of the laser chip 203 in the laser beam emitting direction, the length in the y direction is equal to the length of the bottom plate 202 in the y direction, the distance between the step surface and the optical window 204 increases from the middle of the bottom plate 202 to both sides in sequence, that is, the closer the step surface is to the side surface of the ceramic frame 201 in the x direction, the farther the distance between the step surface and the optical window 204 is, so that the distance between each laser chip 203 of the plurality of laser chips 203 arranged on the step surface and the optical window 204 and the distance between the corresponding laser chip 203 and the reflecting inclined surface of the opposite ceramic frame 201 are in inverse proportion, that is, the laser chips closer to the reflecting inclined surface of the opposite ceramic frame 201 are farther from the optical window 204. In addition, the height difference between two adjacent step surfaces under the laser chips 203 opposite to the same reflection inclined surface of the ceramic frame 201 is not smaller than the thickness of the laser chips 203, so that the laser beams generated by one column of the laser chips 203 far away from the reflection inclined surface of the ceramic frame 201 in two adjacent columns of the laser chips 203 with the light outlets facing the same direction are not shielded by one column of the laser chips 203 near the reflection inclined surface of the ceramic frame 201, and the laser beams generated by the laser chips 203 of each column can be ensured to be incident to the corresponding reflection inclined surface of the ceramic frame 201 and be emitted from the light window 204 after being reflected by the reflection inclined surface of the ceramic frame 201.

It should be noted that fig. 8 only shows 8 step surfaces, and a is one of the step surfaces, but the number of the step surfaces of the bottom plate 202 in the embodiment of the present application may be 3, 5, 10, and the like, which is not limited in the embodiment of the present application

Alternatively, referring to fig. 9, a plurality of laser chips 203 may be disposed on each step surface, and the light emitting directions of the plurality of laser chips 203 disposed on the same step surface are the same and are all opposite to the same reflection inclined surface of the ceramic frame 201.

It should be noted that, only 5 laser chips 203 are shown on one step surface in fig. 9, but the number of laser chips 203 that can be disposed on the step surface of the bottom plate 202 in the embodiment of the present application may be 3, 4, 7, and the like, which is not limited in the embodiment of the present application.

Alternatively, a plurality of laser chips 203 may be disposed on a plurality of step surfaces of the base plate 202 by means of pasting or welding, wherein the entire bottom surface of the laser chip 203 is pasted or welded with the step surfaces of the base plate 202 as shown by the step surfaces M in fig. 7. In this case, the contact area of the laser chip 203 with the base plate 202 is maximized, and the robustness of the laser chip 203 can be increased. Of course, as shown by the step surface N in fig. 7, the bottom surface of the portion of the laser chip 203 away from the light exit may be bonded or welded to the step surface of the bottom plate 202, and in this case, since the bottom surface of the portion of the laser chip 203 does not contact any object, the heat generated when the laser chip 203 emits light may be dissipated more quickly, and the heat dissipation rate of the laser chip 203 may be increased.

Optionally, the material of the bottom plate 202 may be copper, for example, oxygen-free copper, or may be other materials capable of supporting the laser chip 203 and having good thermal conductivity, which is not limited in this embodiment of the application.

Wherein, the oxygen-free copper is a copper material with the oxygen content of not more than 0.003 percent, the total impurity content of not more than 0.05 percent and the copper purity of more than 99.95 percent, and the heat conductivity coefficient is 401W/m.K.

Optionally, referring to fig. 10, the laser of the embodiment of the present application further includes a plurality of heat sinks 206 corresponding to the plurality of laser chips 203 one to one, and each laser chip 203 is connected to one step surface of the base plate 202 through the corresponding heat sink 206.

The length of the heat sink 206 in the x direction is greater than the length of the laser chip 203 in the x direction, but less than the length of the step surface of the base plate 202 in the x direction, the length in the y direction is greater than the length of the laser chip 203 in the y direction, and the thickness of the heat sink 206 is 0.1-0.3mm, for example, 0.2 mm.

In addition, the arrangement manner of the laser chip 203 on the heat sink 206 and the arrangement manner of the heat sink on the step surface of the bottom plate 202 may refer to the arrangement manner of the laser chip 203 on the heat sink 206 and the arrangement manner of the heat sink 206 on the horizontal surface of the bottom plate 202, which is not described herein again in this embodiment of the application.

Optionally, in another implementation manner, referring to fig. 11, the upper surface of the base plate 202 may be a horizontal plane, the laser further includes a plurality of base plates 207, the heights of the plurality of base plates 207 are different, the lower surfaces of the plurality of base plates 207 are connected to the upper surface of the base plate 202, a plurality of laser chips 203 are disposed on the upper surface of each of the plurality of base plates 207, the laser chips 203 located on the same base plate 207 are arranged in parallel, and light outlets of the laser chips 203 are all opposite to the same reflective inclined plane of the ceramic frame 201.

The height of the substrate 207 refers to the height of the substrate 207 in a direction perpendicular to the base plate 202 and toward the laser chip 203. Fig. 11 shows only 6 substrates, but the number of substrates in the laser of the embodiment of the present application is not limited to 6, and may be 3, 4, or 8, which is not limited in the embodiment of the present application.

Note that the width of the upper surface of each substrate 207 for disposing the laser chip 203 in the x direction is not smaller than the width of the laser chip 203 in the laser emission direction. In addition, the plurality of substrates 207 are arranged from the middle of the bottom plate 202 to both sides in the order of height from high to low, that is, the closer to the substrate of the reflection slope of the ceramic frame, the farther from the optical window 204, so that the distance between each of the plurality of laser chips 203 disposed on the substrate 207 and the optical window 204 and the distance between the corresponding laser chip 203 and the inner side surface of the opposite ceramic frame 201 are inversely proportional, that is, the closer to the reflection slope of the opposite ceramic frame 201, the farther from the optical window 204. In addition, the height difference between two adjacent substrates 207 corresponding to the same reflection inclined plane of the ceramic frame 201 is not smaller than the thickness of the laser chips 203, so that the laser beams generated by one column of the laser chips 203 far away from the reflection inclined plane of the ceramic frame 201 in two adjacent columns of the laser chips with the light outlets facing the same direction are not shielded by one column of the laser chips 203 near the reflection inclined plane of the ceramic frame 201, and therefore, the laser beams generated by each column of the laser chips 203 can be ensured to be incident to the corresponding reflection inclined plane of the ceramic frame 201 and be emitted from the light window 204 after being reflected by the reflection inclined plane of the ceramic frame 201.

Referring to fig. 12, in the laser according to the embodiment of the present application, each substrate 207 of the plurality of substrates 207 may be a rectangular parallelepiped, a bottom surface of which is bonded or welded to the base plate 202, and an upper surface of which is provided with the laser chip 203.

It should be noted that the material of the substrate 207 may be copper, for example, oxygen-free copper, and the arrangement manner of the laser chip 203 on the substrate may refer to the arrangement manner of the laser chip 203 on the step surface of the bottom plate 202, which is not described herein again in this embodiment of the present application.

Optionally, the laser further includes a plurality of heat sinks 206 in one-to-one correspondence with the plurality of laser chips 203, and each laser chip 203 is connected to the upper surface of one substrate 207 of the plurality of substrates 207 through the corresponding heat sink 206. Heat generated when the laser chip 203 is caused to emit light can be quickly dissipated from the heat sink 206.

The arrangement manner of the laser chip 203 on the heat sink 206 and the arrangement manner of the heat sink on the substrate 207 may refer to the arrangement manner of the laser chip 203 on the heat sink 206 and the arrangement manner of the heat sink 206 on the step surface of the bottom plate 202, and the embodiment of the present application is not repeated here.

As can be seen from the above description, the laser chips 203 are disposed on the step surface of the bottom plate 202 or on the substrate, wherein the laser chips 203 on one step surface or on one substrate 207 are a row of laser chips, so that the plurality of laser chips 203 located in the enclosed space defined by the ceramic frame 201, the bottom plate 202 and the skylight are arranged in multiple rows, the distances between each laser chip 203 located in the same row and the reflection inclined surface of the opposite ceramic frame 201 are equal, and the difference between the distances between any two laser chips 203 in two adjacent rows opposite to the same reflection inclined surface of the ceramic frame 201 and the optical window 204 is not less than the thickness of the laser chip 203. That is, the height of one row of laser chips 203, which is farther from the reflection inclined plane of the ceramic frame 201, of two adjacent rows of laser chips 203 opposite to the same reflection inclined plane of the ceramic frame 201 in the z-axis direction is higher than the height of one row of laser chips 203, which is closer to the reflection inclined plane of the ceramic frame 201, so that the laser beam emitted by the row of laser chips 203, which is farther from the reflection inclined plane of the ceramic frame 201, is not blocked by the row of laser chips 203, which is closer to the reflection inclined plane of the ceramic frame 201, thereby ensuring that the laser beam emitted by each row of laser chips 203 can be incident to the corresponding reflection inclined plane of the ceramic frame 201 and be emitted from the light window 204 after being reflected by the reflection inclined plane of the ceramic frame 201.

The laser chip 203 in the laser of the embodiment of the present application may be any one, two, or all three of the three laser chips, which is not limited in the embodiment of the present application.

Optionally, an optical window 204 is further disposed on the upper opening of the ceramic frame 201, and the optical window 204 serves as an exit port of the laser, and a light-permeable material, such as a sapphire cover plate, having good light-permeability and good thermal conductivity and mechanical properties, may be adopted, but the optical window in the embodiment of the present application may also be another light-permeable material, such as glass. The embodiment of the present application does not limit this.

Optionally, in order to improve the laser performance, the material of the optical window 204 may also be selected according to the light emitting characteristics of the laser chip 203, for example, when the laser chip is a laser chip generating red light, a material with better light transmittance for red laser may be selected as the optical window 204.

Optionally, an electrode is further disposed on the ceramic frame 201, one end of the electrode is connected to an external power supply, the other end of the electrode is connected to the laser chips 203, and a gold wire is further disposed between each laser chip 203 for connecting each laser chip in series, so that the laser chip 203 can be powered by the electrode, and the laser chip can emit a laser beam in a powered state.

To sum up, among the laser instrument that this application embodiment provided, ceramic frame's medial surface includes the reflection inclined plane, and the laser beam that every laser chip launched is incident on the reflection inclined plane of the ceramic frame that corresponds to follow light window and jet out after ceramic frame's reflection inclined plane reflection, so need not subaerial reflection prism and come to reflect the laser beam that laser chip sent, reduced reflection prism and taken up the bottom plate area, can set up more laser chips on making the same bottom plate area, thereby improved the power of laser instrument.

In addition, the ceramic frame, the bottom plate and the optical window can enclose a closed space, and the plurality of laser chips are arranged in the closed space enclosed by the ceramic frame, the bottom plate and the optical window, so that the laser chips can be prevented from being corroded by oxygen in the outside air, and the service life of the laser chips is prolonged.

The above description is only an alternative embodiment of the present application and should not be construed as limiting the present application, and any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A laser, characterized in that the laser comprises: the laser chip comprises a ceramic frame (201), a bottom plate (202), a plurality of laser chips (203) and an optical window (204), wherein the ceramic frame (201), the bottom plate (202) and the optical window (204) enclose a closed space;

the inner side surface of the ceramic frame (201) comprises a reflecting inclined surface;

the laser chips (203) are positioned in the closed space and connected with the bottom plate (202), and light outlets of the laser chips (203) are opposite to the reflecting inclined plane of the ceramic frame (201);

the light beams emitted by the plurality of laser chips (203) are reflected by the reflecting inclined plane of the ceramic frame (201) and then emitted out through the light window (204).

2. The laser according to claim 1, wherein a distance between each laser chip (203) of the plurality of laser chips (203) and the optical window (204) is inversely proportional to a distance between the respective laser chip (203) and an opposing inner side face of the ceramic frame (201).

3. The laser according to claim 2, wherein the inner side surfaces of the ceramic frame (201) comprise a first inner side surface (2011) and a second inner side surface (2012), the first inner side surface (2011) and the second inner side surface (2012) are opposite and are reflective slopes, a first portion of the plurality of laser chips (203) is opposite to the first inner side surface (2011), and a second portion of the plurality of laser chips (203) except the first portion of the plurality of laser chips (203) is opposite to the second inner side surface (2012).

4. The laser device according to claim 3, wherein the plurality of laser chips (203) are arranged in a plurality of columns, the distance between each laser chip (203) in the same column and the inner side face of the opposite ceramic frame (201) is equal, and the difference of the distance between any two laser chips (203) in two adjacent columns opposite to the same inner side face of the ceramic frame (201) and the optical window (204) is not smaller than the thickness of the laser chips (203).

5. The laser according to any of claims 1-4, wherein the upper surface of the base plate (202) comprises a plurality of step surfaces, and the plurality of laser chips (203) are connected to the plurality of step surfaces of the base plate (202).

6. The laser according to claim 5, further comprising a plurality of heat sinks (206) in one-to-one correspondence with the plurality of laser chips (203), each laser chip (203) being connected to one step surface of the base plate (202) through the corresponding heat sink (206).

7. The laser according to any one of claims 1 to 4, wherein the upper surface of the base plate (202) is a horizontal surface, the laser further comprises a plurality of base plates (207), the plurality of base plates (207) have different heights, and the lower surfaces of the plurality of base plates (207) are connected to the upper surface of the base plate (202), and the plurality of laser chips (203) are disposed on the upper surfaces of the plurality of base plates (207).

8. The laser of claim 7, further comprising a plurality of heat sinks (206) in one-to-one correspondence with the plurality of laser chips (203), each laser chip (203) being connected to an upper surface of one substrate (207) of the plurality of substrates (207) through the corresponding heat sink (206).

9. The laser according to claim 7, wherein the base plate (202) is an oxygen free copper base plate, the plurality of substrates (207) are copper substrates, and the plurality of substrates (207) are soldered on the upper surface of the base plate (202).

10. The laser according to claim 1, characterized in that the angle between the inner side of the ceramic frame (201) and the horizontal plane in which the base plate (202) is located is 45 degrees.

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