CN114361314A - Manufacturing method of glass-based MINI LED backlight substrate - Google Patents
Manufacturing method of glass-based MINI LED backlight substrate Download PDFInfo
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Abstract
The invention discloses a manufacturing method of a glass-based MINI LED backlight substrate, which has the following advantages compared with the problems of more process flows and low yield of the traditional technology: 1. the vacuum sputtering process is omitted, and the expensive equipment purchasing cost is saved; 2. the copper etching process is omitted; 3. the adhesive force of the chemical copper in the hole wall is increased by using the fluidity of the low-viscosity negative glue; 4. compared with the traditional process in which etching is adopted, the method can be used for manufacturing fine lines, and the pattern can be made very fine due to the fact that the etching process is not needed, so that the wiring density is remarkably increased; 5. obviously improving the yield and reducing the cost waste. Because the process links are optimized, quality control is facilitated, and the corresponding investment cost waste links can be controlled. The method of the invention is beneficial to the consistency of quality, and has simple and convenient process and excellent flexibility. And the labor cost can be reduced synchronously. Is beneficial to the rapid introduction into industrialization.
Description
Technical Field
The invention relates to the technical field of backlight display, in particular to a manufacturing method of a glass-based MINI LED backlight substrate.
Background
With the entrance of the Mini LED into the commercialization stage, currently, mainstream manufacturers around the world have basically completed the research and development process of the Mini-LED backlight, and enter the stage of small-batch sample supply or large-batch material supply. And various domestic enterprises also carry out process research on the tight gong and the tight drum, so that the process of putting the Chinese character into the market is accelerated. The Mini LED package mainly includes two schemes of cob (chip on board) technology and imd (integrated Mounted devices), and the Mini COG is a scheme using glass as a substrate. At present, in the processing of the Mini LED substrate, the quality frequently damaged in the traditional process is high in cost waste. Therefore, low cost and efficient manufacturing solutions are highly desirable.
Disclosure of Invention
The invention aims to provide a manufacturing method of a glass-based MINI LED backlight substrate, which is used for solving the problems of high equipment cost, more process flows and low yield in the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows: a manufacturing method of a glass-based MINI LED backlight substrate comprises the following steps:
a. preparing a glass substrate, and cutting the glass substrate into required outer contour dimensions;
b. drilling a through hole at a preset position of the plate surface of the glass substrate, wherein the aperture range value of the through hole is 50-150 mu m;
c. soaking the glass substrate into HF solution for eliminating glass microcracks generated on the periphery of the through hole, wherein the soaking time is determined according to the adopted drilling process, the soaking process is mechanically completed, and the glass substrate is cleaned and dried after being soaked;
d. coarsening the plate surface of the glass substrate and the inner hole wall of the through hole to ensure that the plate surface and the inner hole wall both have rough surfaces, thereby providing preparation for the subsequent chemical copper plating process;
e. removing chemical substances and residues remained on the outer surface of the glass substrate to obtain a semi-finished substrate;
f. coating a layer of dark polyisoprene negative photoresist on the front side of the semi-finished product of the substrate, wherein the viscosity of the photoresist is 3-10 CP, the photoresist is used for realizing proper fluidity, the photoresist can flow along the inner hole wall, and the photoresist flowing through the inner hole wall can be connected with the photoresist covering the front side and the back side of the glass substrate, so as to ensure the conductivity after subsequent copper plating, and further drying the photoresist;
g. coating a dark color polyisoprene negative photoresist on the back of the semi-finished substrate according to the step f and carrying out curing treatment; step f is combined with step g to save the vacuum sputtering process of the glass substrate before coating the photoresist in the traditional process;
h. coating a layer of active agent on the surface of the photoresist, wherein the active agent is used for increasing the adsorption of the surface of the photoresist on ionic palladium and preparing for coating the ionic palladium, and the concentration of the active agent is 20%;
i. coating an ionic palladium solution added with 1-5% of aliphatic amine compounds on the surface of the photoresist to form an ionic palladium solution layer, wherein the adopted coating mode comprises soaking or slit coating, the baking temperature value of the ionic palladium solution layer is 70-90 ℃, and the constant temperature time is 3 min;
j. aligning the front surface and the back surface of the semi-finished substrate product by using corresponding mask plates, and making the front surface and the back surface of the semi-finished substrate product into required patterns in sequence by exposure treatment, wherein the equal intervals between the front surface and the back surface and the corresponding mask plates are 20-150 mu m, and keeping 100-grade cleanliness of an exposure environment;
k. developing to remove the photoresist on the preset part and form photoresist patterns with preset patterns on the front and back surfaces of the semi-finished substrate, wherein the photoresist on the inner hole wall is connected with the photoresist patterns;
depositing a copper layer on the surface of the photoresist pattern by adopting a chemical copper process to prepare a conductive layer with a preset pattern, wherein the conductive layer is synchronously formed on the inner hole wall;
m, completing an electro-coppering process on the surface of the conductive layer, reducing the resistance of the circuit and the via hole, and further cleaning and drying to obtain a glass substrate with a preset pattern;
covering the through hole, the front surface and the back surface of the glass substrate with a solder mask ink layer, wherein the solder mask ink layer blocks the through hole and avoids the position of a pad, and further, performing pre-curing, exposure, development and curing treatment on the solder mask ink layer;
p, forming a gold-plated layer on the surface of the bonding pad to obtain a backlight substrate finished product;
and q, ensuring the consistency of the quality of the backlight substrate finished product through a testing procedure.
According to the technical scheme of the invention, the glass substrate is made of white glass, and the thickness dimension of the glass substrate is equal to or more than 0.7 mm.
According to the technical scheme of the invention, in the step c, the drilling process comprises one of mechanical drilling and laser drilling, wherein the laser drilling process is completed by adopting a picosecond green laser cutting machine.
According to the technical scheme of the invention, in the step c, when mechanical drilling is adopted, the time for immersing the white glass into the HF solution is equal to or more than 3min, and when laser drilling is adopted, the time for immersing the white glass into the HF solution is less than or equal to 3 min.
According to the technical scheme of the invention, in the step f, PGMEA is adopted for the preparation of the viscosity of the photoresist;
according to the technical scheme of the invention, in the step o, based on actual production and design requirements, the front surface and the solder mask ink layer covered by the back surface are distinguished, wherein the white solder mask ink layer is covered on the front surface in a manner including any one of direct printing or photoetching.
The invention has the beneficial effects that: compared with the problems of more process flows and low yield of the traditional technology, the method has the advantages that: 1. the vacuum sputtering process is omitted, and the expensive equipment purchasing cost is saved; 2. the copper etching process is omitted; 3. the adhesive force of the chemical copper in the hole wall is increased by using the fluidity of the low-viscosity negative glue; 4. compared with the traditional process in which etching is adopted, the method can be used for manufacturing fine lines, and the pattern can be made very fine due to the fact that the etching process is not needed, so that the wiring density is remarkably increased; 5. obviously improving the yield and reducing the cost waste. Because the process links are optimized, quality control is facilitated, and the corresponding investment cost waste links can be controlled. The method of the invention is beneficial to the consistency of quality, and has simple and convenient process and excellent flexibility. And the labor cost can be reduced synchronously. Is beneficial to the rapid introduction into industrialization.
The invention is further described with reference to the following figures and examples.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without limiting the invention.
Fig. 1 is a process flow diagram of a conventional manufacturing process.
FIG. 2 is a process flow diagram of the present invention.
Detailed Description
The present invention is further described in the following description with reference to specific embodiments and the accompanying drawings, wherein the details are set forth in order to provide a thorough understanding of the present invention, but it is apparent that the present invention can be embodied in many other forms different from the description herein, and one skilled in the art can make similar generalizations and deductions based on the practical application without departing from the spirit of the present invention, and therefore, the scope of the present invention should not be limited by the contents of this specific embodiment.
A method of fabricating a glass-based MINI LED backlight substrate according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The method is used for correspondingly solving the problems of high equipment cost, more process flows and low yield in the traditional process. In further description, a conventional manufacturing process will be described to provide a comparison. Referring to fig. 1, a process flow of a conventional manufacturing process is shown. In the traditional preparation process, on one hand, the copper plating process is finished by adopting vacuum coating equipment; on the other hand, a copper etching process is required, which is not favorable for manufacturing fine lines. Referring to fig. 2, a process flow of the present invention is shown, and in order to better describe and explain the technical solution of the present invention, in the embodiment of the present invention, the steps corresponding to the letters a to q in sequence are: step S1 to step S16.
The first embodiment:
referring to fig. 2, a method for manufacturing a glass-based MINI LED backlight substrate includes the steps of:
and step S1, cutting the white glass substrate into the required outer contour size, wherein the thickness size is equal to or larger than 0.7 mm.
Step S2, drilling through holes at preset positions on the plate surface of the glass substrate, wherein the aperture range of the through holes is 50-150 μm;
and step S3, immersing the glass substrate into HF solution to eliminate glass microcracks generated at the periphery of the through hole, wherein the immersion time is determined according to the adopted drilling process, the immersion process is automatically completed by machinery, and the glass substrate is cleaned and dried after the immersion treatment. In this embodiment, a mechanical drilling process is used, and the time for immersing the white glass in the HF solution is equal to or greater than 3min based on the crack depth characteristics of mechanical drilling.
Step S4, the plate surface of the glass substrate and the inner hole wall of the through hole are roughened, so that the plate surface and the inner hole wall both have rough surfaces, and preparation is provided for the subsequent chemical copper plating process. In the coarsening treatment process, the white glass is treated by coarsening liquid medicine in a liquid tank with a heating function, the set temperature is determined according to the manufacturer parameters of the coarsening liquid medicine, and the treatment process enables the plate surface (the front surface and the back surface) and the inner hole wall to form a micro-rough surface. Is beneficial to the adsorption of the surface active agent before the subsequent chemical copper plating process. The reliability is good.
In this embodiment, the coarsening liquid medicine can be purchased on the market.
And step S5, further, removing chemical substances and residues remained on the outer surface of the glass substrate by using normal-temperature pure water to obtain a semi-finished product of the substrate.
In this embodiment, a sheet type cleaning machine is used for cleaning. The drying process uses an air knife (oil-free blower + filtration or clean compressed air).
The sheet type cleaning machine and the oil-free blower can be purchased from the market.
Step S6, coating a dark blue or black polyisoprene negative photoresist on the front side of the glass substrate by using a slit coater, wherein the dark blue or black photoresist is selected to prevent interference with the other side (back side) of the glass substrate during front side exposure. Further, the viscosity of the photoresist is adjusted by using PGMEA, and the viscosity of the photoresist is adjusted to be 3-10 CP. In practical applications, the viscosity value varies according to the thickness dimension of the glass substrate and the aperture of the through hole, and in particular, the larger the thickness dimension and the aperture, the larger the photoresist viscosity. Correspondingly, the viscosity is selected to be 7-10 CP, including 10 CP. And when the thickness size and the aperture are both small, the viscosity value is 3-7 CP, excluding 7 CP.
Furthermore, the viscosity of the photoresist is adjusted to realize proper fluidity, so that the photoresist can flow along the inner hole wall, and the photoresist flowing through the inner hole wall can be connected with the photoresist covering the front surface and the back surface of the glass substrate, so as to ensure the conductivity after subsequent copper plating. In a further operation, the photoresist is dried by passing it through a tunnel drying oven set according to temperature gradient parameters provided by the photoresist supplier.
In this embodiment, the dark blue or black polyisoprene based negative photoresist is commercially available.
Step S7, the back side of the semi-finished substrate is coated with a dark blue or black polyisoprene negative photoresist and cured according to step S6.
In this embodiment, step S6 is combined with step S7 to save the vacuum sputtering process of the glass substrate before coating the photoresist in the conventional process.
Step S8, coating a layer of active agent on the surface of the photoresist to increase the adsorption of the surface of the photoresist to ionic palladium, and preparing for coating ionic palladium. The preparation method for coating the active agent comprises a soaking mode or a slit coating mode. When the soaking method is adopted, the glass substrate is correspondingly arranged in a tooling basket and soaked in a liquid tank containing the active agent, the concentration of the active agent is selected to be 20%, and the soaking temperature and time obtain an adjustment value according to the parameters provided by an active agent manufacturer and a preset effect; further, the tooling basket is vertically and slowly pulled out of the liquid tank, and then is put into an oven for baking, wherein the baking temperature value is 70-90 ℃, and the constant temperature treatment time is 3 min.
When the slit coating method is adopted, the operation is in accordance with the procedures in step S6 and step S7 described above.
Step S9, preparing an ionic palladium solution, in this embodiment, the ionic palladium solution is composed of an ionic palladium activator and 1.5% of pentylamine, and further coated on the surface of the photoresist to form an ionic palladium solution layer, wherein the addition ratio of the pentylamine is selected to be 1.5%, which is beneficial to good adsorption of ionic palladium on the surface of the photoresist, and is not easy to detach, and the generated effect is optimal. According to actual experiments, after the roughening treatment, the plate surface (the front surface and the back surface) of the glass substrate and the inner hole wall of the through hole are provided with rough surfaces, so that the adsorption of an activating agent is facilitated. And the adsorption of ionic palladium can be improved by adding the fatty amine, so that the ionic palladium is easily adsorbed on the inner hole wall. In the subsequent chemical copper process, the photoresist is arranged on the inner hole wall, so that the adhesive force of the chemical copper on the inner hole wall is improved.
The preparation method of the coating ionic palladium solution layer is based on the soaking or slit coating mode in the step S9, and the adopted soaking temperature, time and baking temperature values are consistent.
And step S10, aligning the front surface and the back surface of the glass substrate with the ion palladium solution layer by using corresponding mask plates, and making the front surface and the back surface of the semi-finished substrate into required patterns in sequence by exposure treatment, wherein the equal distances between the front surface and the back surface and the corresponding mask plates are 20-150 mu m, and the 100-grade cleanliness of the exposure environment is kept.
Correspondingly, a preset pattern is made on the front surface by using a mask plate, and the used equipment is a proximity exposure machine. In a further technical scheme, the equal spacing between the front surface and the corresponding mask is 20-150 μm, the proximity exposure machine is used for carrying out alignment, and the alignment precision is less than 5 μm and does not include 5 μm.
In the following steps, the same processing steps and parameters are used for exposure of the back surface.
In this embodiment, the proximity exposure machine may be purchased from a professional equipment manufacturer.
And step S11, performing a developing process to remove a predetermined portion of the photoresist and form a photoresist pattern on the front and back surfaces of the glass substrate, wherein the developing process is completed by using a developing line. After treatment, the photoresist on the inner hole wall is connected with the photoresist pattern.
In this embodiment, the development line is commercially available from a professional equipment manufacturer. The developer solution used may be commercially available or may be obtained from a photoresist manufacturer.
Step S12, depositing a copper layer on the surface of the photoresist pattern with the active agent by adopting a chemical copper process to prepare a conductive layer with a preset pattern, wherein the conductive layer is synchronously formed on the inner hole wall;
the used equipment comprises a reduction tank and an electroless plating tank, and has the functions of heating and circulating stirring. In a specific technical scheme, the adopted materials comprise a reducing agent and chemical copper liquid medicine. In the further operation, a soaking mode is adopted, and the soaking time and the soaking temperature are set according to the manufacturer parameters of the selected materials.
And step S13, completing an electro-coppering process on the surface of the conductive layer for reducing the resistance of the circuit and the via hole, and further cleaning and drying to obtain the glass substrate with the preset pattern. In the specific technical scheme, an electroplating machine is adopted to be matched with chemical electroplating liquid to finish an electroplating copper process, and the cleaning and drying are finished by a cleaning section and a drying section of the electroplating machine.
In this embodiment, the electroplating machine is commercially available from a professional equipment manufacturer. The electroless plating solutions used are commercially available.
Step S14, covering the through hole, the front surface and the back surface of the glass substrate with a solder resist ink layer which closes the through hole and avoids the position of the pad. Further, the solder resist ink layer is subjected to pre-curing, exposure, development and curing treatment. In the process of covering the solder resist ink layer, the adopted manufacturing method comprises a direct printing mode and a photoetching mode, and based on the consideration of cost in actual production, for products with low precision requirements, the back surface is subjected to direct printing of thermosetting solder resist ink, and then thermosetting is carried out.
In distinction, the front side is covered with a layer of white solder resist ink to improve the utilization efficiency of the LED. The solder resist ink is of a thermosetting type.
Step S15, forming a gold plating layer on the surface of the bonding pad to obtain a backlight substrate finished product;
and step S16, the backlight substrate finished product is tested to ensure the consistency of quality.
Second embodiment: it is different from embodiment 1 in the drilling process in step S3 and the process of covering the solder resist ink layer in step S14.
In this embodiment, step S3 is performed by using a picosecond green laser cutting machine to complete the drilling process based on the production and design requirements, and the time for immersing the white glass in the HF solution is equal to or less than 3min based on the shallow crack characteristic of laser drilling. The soaking process is automatically completed by a machine, so that the influence of the HF solution on the human health is avoided, and the cleaning and drying are carried out after the soaking treatment.
Further, the air conditioner is provided with a fan,
through step S14 of the present embodiment, the through hole, the front surface and the back surface of the glass substrate are covered with solder resist ink layers. The difference with respect to the first embodiment is that a white solder resist ink layer is applied to the front surface, and the applied method is a photolithography method. In the specific technical scheme, based on the high-precision requirement in actual production, the product with high precision requirement is covered by photoetching white solder resist ink in a printing mode. In the further processing procedures, pre-curing, exposure, development and curing are correspondingly carried out.
Wherein, the pre-curing process is used for solvent volatilization in the ink, and the specific heating temperature and time are recommended by an ink supplier; the light flux required in the exposure process is determined according to the requirements of the ink supplier; the specific developing material, developing time and developing temperature in the developing process are determined according to the ink supplier recommendations, while the specific heating temperature and time in the curing process are determined according to the ink supplier recommendations.
The above examples are only preferred embodiments of the present invention, and the present invention is not limited to all embodiments, and any technical solution using one of the above examples or equivalent changes made according to the above examples is within the scope of the present invention.
Compared with the problems of more process flows and low yield of the traditional technology, the method has the advantages that: 1. the vacuum sputtering process is omitted, and the expensive equipment purchasing cost is saved; 2. the copper etching process is omitted; 3. the adhesive force of the chemical copper in the hole wall is increased by using the fluidity of the low-viscosity negative glue; 4. compared with the traditional process in which etching is adopted, the method can be used for manufacturing fine lines, and the pattern can be made very fine due to the fact that the etching process is not needed, so that the wiring density is remarkably increased; 5. obviously improving the yield and reducing the cost waste. Because the process links are optimized, quality control is facilitated, and the corresponding investment cost waste links can be controlled. The method of the invention is beneficial to the consistency of quality, and has simple and convenient process and excellent flexibility. And the labor cost can be reduced synchronously. Is beneficial to the rapid introduction into industrialization.
While embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments, which are fully applicable in a variety of fields of endeavor to which the invention pertains, and further modifications may readily be made by those skilled in the art, it being understood that the invention is not limited to the details shown and described herein without departing from the general concepts defined by the claims and the equivalents thereof.
Claims (6)
1. A manufacturing method of a glass-based MINI LED backlight substrate is characterized by comprising the following steps:
a. preparing a glass substrate, and cutting the glass substrate into required outer contour dimensions;
b. drilling a through hole at a preset position of the plate surface of the glass substrate, wherein the aperture range value of the through hole is 50-150 mu m;
c. immersing the glass substrate into an HF solution to eliminate glass microcracks generated at the periphery of the through hole;
d. coarsening the plate surface of the glass substrate and the inner hole wall of the through hole to enable the plate surface and the inner hole wall to have rough surfaces;
e. removing chemical substances and residues remained on the outer surface of the glass substrate to obtain a semi-finished substrate;
f. coating a layer of dark polyisoprene negative photoresist on the front side of the semi-finished product of the substrate, wherein the viscosity of the photoresist is 3-10 CP, the photoresist is used for realizing proper fluidity, the photoresist can flow along the inner hole wall, and the photoresist flowing through the inner hole wall can be connected with the photoresist covering the front side and the back side of the glass substrate, so as to ensure the conductivity after subsequent copper plating;
g. coating a dark color polyisoprene negative photoresist on the back of the semi-finished substrate according to the step f and carrying out curing treatment;
h. coating a layer of active agent on the surface of the photoresist for increasing the adsorption of the surface of the photoresist to ionic palladium, wherein the concentration of the active agent is 20%;
i. coating an ionic palladium solution added with 1-5% of aliphatic amine compounds on the surface of the photoresist to form an ionic palladium solution layer, wherein the adopted coating mode comprises soaking or slit coating, the baking temperature value of the ionic palladium solution layer is 70-90 ℃, and the constant temperature time is 3 min;
j. aligning the front surface and the back surface of the semi-finished substrate product by using corresponding mask plates, and making the front surface and the back surface of the semi-finished substrate product into required patterns in sequence by exposure treatment, wherein the equal intervals between the front surface and the back surface and the corresponding mask plates are 20-150 mu m, and keeping 100-grade cleanliness of an exposure environment;
k. developing to remove the photoresist on the preset part and form photoresist patterns with preset patterns on the front and back surfaces of the semi-finished substrate, wherein the photoresist on the inner hole wall is connected with the photoresist patterns;
depositing a copper layer on the surface of the photoresist pattern by adopting a chemical copper process to prepare a conductive layer with a preset pattern, wherein the conductive layer is synchronously formed on the inner hole wall;
m, completing an electro-coppering process on the surface of the conductive layer, reducing the resistance of the circuit and the via hole, and further cleaning and drying to obtain a glass substrate with a preset pattern;
covering the through hole, the front surface and the back surface of the glass substrate with a solder mask ink layer, wherein the solder mask ink layer blocks the through hole and avoids the position of a pad, and further, performing pre-curing, exposure, development and curing treatment on the solder mask ink layer;
p, forming a gold-plated layer on the surface of the bonding pad to obtain a backlight substrate finished product;
and q, ensuring the consistency of the quality of the backlight substrate finished product through a testing procedure.
2. The method of claim 1, wherein the glass substrate is white glass with a thickness of 0.7mm or more.
3. The method of claim 2, wherein the drilling process comprises one of mechanical drilling or laser drilling, wherein the laser drilling process is performed by picosecond green laser cutting machine.
4. The method of claim 3, wherein in the step c, the white glass is immersed in the HF solution for 3min or more when mechanical drilling is performed, and the white glass is immersed in the HF solution for 3min or less when laser drilling is performed.
5. The method as claimed in claim 1, wherein the step f is performed by using PGMEA for viscosity adjustment of photoresist.
6. The method as claimed in claim 1, wherein in step o, the front surface and the back surface are covered with solder resist ink layers distinguished based on actual production and design requirements, wherein the front surface is covered with a white solder resist ink layer by any one of direct printing and photolithography.
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0016952A1 (en) * | 1979-04-06 | 1980-10-15 | International Business Machines Corporation | Method of making prints provided with masks |
| JP2000031629A (en) * | 1998-01-26 | 2000-01-28 | Shipley Co Llc | Method for metallizing and composition |
| US20030003393A1 (en) * | 2001-06-12 | 2003-01-02 | Takako Yamaguchi | Photoresist, photolithography method using the same, and method for producing photoresist |
| US20040217455A1 (en) * | 2001-07-12 | 2004-11-04 | Osamu Shiono | Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor |
| CN101379608A (en) * | 2007-03-15 | 2009-03-04 | 乔治洛德方法研究和开发液化空气有限公司 | Copper interconnection for fabricating flat-panel display |
| CN102065634A (en) * | 2011-01-05 | 2011-05-18 | 倪新军 | LED high-frequency aluminum-based circuit board |
| CN103648243A (en) * | 2013-12-13 | 2014-03-19 | 复旦大学 | Method for preparing multilayer board in additive mode |
| CN104363713A (en) * | 2014-11-05 | 2015-02-18 | 共青城超群科技股份有限公司 | Method for manufacturing high-heat-dissipativity LED baseplate |
| CN111933329A (en) * | 2020-08-13 | 2020-11-13 | 江苏软讯科技有限公司 | Double-sided metal grid flexible conductive film and manufacturing method thereof |
| CN113066758A (en) * | 2021-03-23 | 2021-07-02 | 成都迈科科技有限公司 | TGV deep hole filling method |
-
2022
- 2022-01-10 CN CN202210019628.0A patent/CN114361314B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0016952A1 (en) * | 1979-04-06 | 1980-10-15 | International Business Machines Corporation | Method of making prints provided with masks |
| JP2000031629A (en) * | 1998-01-26 | 2000-01-28 | Shipley Co Llc | Method for metallizing and composition |
| US20030003393A1 (en) * | 2001-06-12 | 2003-01-02 | Takako Yamaguchi | Photoresist, photolithography method using the same, and method for producing photoresist |
| US20040217455A1 (en) * | 2001-07-12 | 2004-11-04 | Osamu Shiono | Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor |
| CN101379608A (en) * | 2007-03-15 | 2009-03-04 | 乔治洛德方法研究和开发液化空气有限公司 | Copper interconnection for fabricating flat-panel display |
| CN102065634A (en) * | 2011-01-05 | 2011-05-18 | 倪新军 | LED high-frequency aluminum-based circuit board |
| CN103648243A (en) * | 2013-12-13 | 2014-03-19 | 复旦大学 | Method for preparing multilayer board in additive mode |
| CN104363713A (en) * | 2014-11-05 | 2015-02-18 | 共青城超群科技股份有限公司 | Method for manufacturing high-heat-dissipativity LED baseplate |
| CN111933329A (en) * | 2020-08-13 | 2020-11-13 | 江苏软讯科技有限公司 | Double-sided metal grid flexible conductive film and manufacturing method thereof |
| CN113066758A (en) * | 2021-03-23 | 2021-07-02 | 成都迈科科技有限公司 | TGV deep hole filling method |
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| CN114361314B (en) | 2022-08-16 |
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