CN114345673A - Ultrasonic transducer, manufacturing method thereof and ultrasonic transduction system - Google Patents
Ultrasonic transducer, manufacturing method thereof and ultrasonic transduction system Download PDFInfo
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- 230000026683 transduction Effects 0.000 title claims abstract description 32
- 238000010361 transduction Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 137
- 238000002604 ultrasonography Methods 0.000 claims abstract description 38
- 230000002463 transducing effect Effects 0.000 claims abstract description 35
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- 238000003384 imaging method Methods 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 238000003491 array Methods 0.000 description 6
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 5
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 5
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- 238000010586 diagram Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
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- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The embodiment of the invention discloses an ultrasonic transducer, a manufacturing method thereof and an ultrasonic transducer system. In one embodiment of the invention, an ultrasound transducer includes a substrate including a plurality of cavity channels extending through the substrate; and at least one ultrasonic transducing unit disposed on the substrate, each ultrasonic transducing unit including: the ultrasonic sensing device comprises at least one ultrasonic transmitting unit arranged on one side of a substrate far away from a sensing target and a plurality of ultrasonic receiving units arranged on one side of the substrate close to the sensing target, wherein each ultrasonic transducing unit comprises at least two cavity channels, and the lengths of the adjacent cavity channels are different, so that ultrasonic waves transmitted by the ultrasonic transmitting unit in each ultrasonic transducing unit pass through the cavity channels to reach a preset sensing area. The embodiment deflects or focuses the sound beam to the predetermined sensing area by arranging a plurality of cavity channels penetrating through the substrate and making the lengths of the adjacent cavity channels in each ultrasonic transduction unit different.
Description
Technical Field
The invention relates to the technical field of ultrasonic transducers. And more particularly, to an ultrasonic transducer, a method of fabricating the same, and an ultrasonic transduction system.
Background
At present, an imaging probe in a medical transduction system generally performs progressive scanning imaging by controlling a phased array through a driving chip. Generally, a probe is composed of 512 array elements to form a linear array or a 128 x 128 area array, and each time, a phased array beam is formed by 16 array elements, so that the traditional medical ultrasonic probe needs to use one or more multi-channel IC (integrated circuit) driving probes to form phased array focusing imaging. However, with the increasing requirement for imaging quality, when a high-density area array is required to perform fine imaging in an ultrasonic detection project, the number of array elements in the probe is increased to ten thousand, and this control method needs a large number of driving chips, which greatly increases the cost of the probe.
Disclosure of Invention
An object of the present application is to provide an ultrasonic transducer, a method of manufacturing the same, and an ultrasonic transduction system, so as to solve at least one of the problems of the prior art.
In order to achieve the purpose, the following technical scheme is adopted in the application:
a first aspect of the present application provides an ultrasonic transducer comprising:
a substrate including a plurality of cavity channels extending through the substrate; and
at least one ultrasonic transducing unit disposed on the substrate, each ultrasonic transducing unit including:
at least one ultrasonic transmission unit disposed on a side of the substrate away from the sensing target for transmitting ultrasonic waves to a predetermined sensing region, an
A plurality of ultrasonic receiving units disposed on a side of the substrate close to the sensing target, for receiving the ultrasonic waves reflected from a predetermined sensing region;
wherein each ultrasonic transduction unit comprises at least two cavity channels, and the lengths of the adjacent cavity channels are different, so that the ultrasonic waves emitted by the ultrasonic emission unit in each ultrasonic transduction unit pass through the cavity channels to reach the preset sensing area.
In some alternative embodiments, the cavity channel comprises:
a first channel formed by extending from the side of the substrate close to the ultrasonic transmitting unit along the direction vertical to the substrate;
the first channel is bent and forms a second channel extending along a direction parallel to the surface of the substrate;
the second channel is bent and forms a third channel extending along the direction vertical to the substrate;
the third channel bends and forms a fourth channel extending along the direction parallel to the surface of the substrate; and
the fourth channel bends and forms a fifth channel which extends to one side of the substrate close to the ultrasonic receiving unit along the direction vertical to the substrate.
In some alternative embodiments, the second channel length of adjacent cavity channels in each ultrasonic transducer unit is different and the fourth channel length of adjacent cavity channels is different, such that the lengths of adjacent cavity channels are different.
In some optional embodiments, an orthographic projection of the first channel on the substrate overlaps with an orthographic projection of the ultrasound transmitting unit on the substrate, and an orthographic projection of the fifth channel on the substrate is staggered with an orthographic projection of the ultrasound receiving unit on the substrate.
In some alternative embodiments, each ultrasonic transducer unit comprises a plurality of array elements, each array element comprises a cavity channel, in each ultrasonic transducer unit, the length of the cavity channel is different based on the time delay between adjacent array elements,
ultrasound emission unitThe emitted ultrasonic waves are focused and deflected or focused to a preset sensing area by a sound beam of a cavity channel, and the delay tau of the ith array elementiSatisfies the following conditions:
wherein ,
representing the angle of deflection of the beam, c representing the speed of sound of the ultrasound wave, xiIndicating the distance between the ith array element and the central array element with a delay of 0, R0Representing the focal length of the ultrasound transducing unit.
In some of the alternative embodiments, the first and second,
the ultrasonic transmitting unit in each ultrasonic transducing unit is whole-surface or independent,
the ultrasonic transmitting unit includes one of a CMUT sound source, a PMUT sound source, a PZT sound source, and a PVDF sound source.
In some optional embodiments, the ultrasound transducer further comprises:
a first support layer disposed between the substrate and the ultrasonic receiving unit, and/or
A second support layer disposed between the substrate and the ultrasound transmission unit.
A second aspect of the present invention provides an ultrasound system comprising:
a probe comprising the ultrasonic transducer described above;
a voltage source coupled to the probe for providing a voltage to at least one of the ultrasound transmission units in a transmission mode of the ultrasound system.
A third aspect of the invention provides a method of making an ultrasound transducer as described above, the method comprising:
forming a substrate including a plurality of cavity channels through the substrate;
forming at least one ultrasonic transducing unit on a substrate, each ultrasonic transducing unit including:
at least one ultrasonic transmission unit disposed on a side of the substrate away from the sensing target for transmitting ultrasonic waves to a predetermined sensing region, an
A plurality of ultrasonic receiving units disposed on a side of the substrate close to the sensing target for receiving the ultrasonic waves reflected from the predetermined sensing region,
wherein each ultrasonic transduction unit comprises at least two cavity channels, and the lengths of the adjacent cavity channels are different, so that the ultrasonic waves emitted by the ultrasonic emission unit in each ultrasonic transduction unit pass through the cavity channels to reach the preset sensing area.
In some of the alternative embodiments, the first and second,
forming the substrate further includes:
the substrate is formed using 3D printing,
forming at least one ultrasonic transducing unit on the substrate further comprises:
attaching an ultrasonic receiving unit on the first sub-material layer,
thinning one side of the first sub-material layer, which is far away from the ultrasonic receiving unit, to form a supporting layer attached with the ultrasonic receiving unit;
attaching an ultrasonic emission unit to a substrate;
and attaching the side of the support layer, which is not attached with the ultrasonic receiving unit, and the side of the substrate, which is not attached with the ultrasonic transmitting unit, together to form at least one ultrasonic transduction unit.
In some of the alternative embodiments, the first and second,
forming the substrate further includes:
etching and forming a plurality of first grooves perpendicular to the first sub-material layer and second grooves extending from the openings of the first grooves and parallel to the surface of the first sub-material layer on the first sub-material layer;
bonding a second sub-material layer on the surface of the first sub-material layer where the second groove is formed;
etching the second sub-material layer to form a plurality of third grooves perpendicular to the second sub-material layer, wherein the third grooves penetrate through the second sub-material layer and are connected with the tail ends, far away from the first grooves, of the second grooves to form a first part of the substrate;
etching a plurality of third grooves perpendicular to the third sub-material layer and fourth grooves extending from the openings of the third grooves along the surface parallel to the third sub-material layer to form a second part of the substrate;
the first portion and the second portion are bonded to form a substrate.
The invention has the following beneficial effects:
the invention aims at the existing problems at present, establishes an ultrasonic transducer, a manufacturing method thereof and an ultrasonic transducer system, and provides a substrate with a plurality of cavity channels and at least one ultrasonic transducer unit arranged on the substrate, and ensures that ultrasonic waves emitted by an ultrasonic emission unit in each ultrasonic transducer unit pass through the cavity channels to a preset sensing area by arranging that each ultrasonic transducer unit comprises at least two cavity channels and the lengths of two adjacent cavity channels are different, thereby realizing the control of the acoustic path difference through the physical length of the cavity channels, realizing the fine sound beam focusing control without arranging a multi-channel driving chip, being easy to realize, reducing the cost of the ultrasonic transducer, being suitable for large-area arrays needing fine imaging and having wide application prospect.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Fig. 1 shows a schematic top view of an ultrasound transducer according to an embodiment of the invention;
fig. 2 shows a schematic cross-sectional view of an ultrasonic transducing unit in an ultrasonic transducer according to an embodiment of the present invention taken according to line AA' in fig. 1;
fig. 3 shows a schematic cross-sectional view of an ultrasonic transducing unit in an ultrasonic transducer according to another embodiment of the present invention;
FIG. 4 shows a schematic cross-sectional view of an ultrasound transducer according to another embodiment of the invention;
FIG. 5 illustrates a schematic diagram of an ultrasonic transducer beam deflection focusing or beam focusing in accordance with an embodiment of the present invention;
fig. 6 to 8 show schematic flow diagrams of a method of manufacturing an ultrasound transducer according to an embodiment of the invention;
fig. 9 to 13 show schematic flowcharts of a method of manufacturing a substrate in an ultrasonic transducer according to another embodiment of the present invention.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Like parts in the drawings are denoted by the same or similar reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
It should be noted that, when the description "has", "includes", "including", etc. in the present invention are all open-ended, that is, when the description module "has", "includes" or "includes" the first element, the second element and/or the third element, it means that the module includes other elements in addition to the first element, the second element and/or the third element.
In order to solve one of the above problems, an embodiment of the present invention provides an ultrasonic transducer including a substrate including a plurality of cavity channels penetrating the substrate; and
at least one ultrasonic transducing unit disposed on the substrate, each ultrasonic transducing unit including:
at least one ultrasonic transmission unit disposed on a side of the substrate away from the sensing target for transmitting ultrasonic waves to a predetermined sensing region, an
A plurality of ultrasonic receiving units disposed on a side of the substrate close to the sensing target, for receiving the ultrasonic waves reflected from a predetermined sensing region;
wherein each ultrasonic transduction unit comprises at least two cavity channels, and the lengths of the adjacent cavity channels are different, so that the ultrasonic waves emitted by the ultrasonic emission unit in each ultrasonic transduction unit pass through the cavity channels to reach the preset sensing area.
In this embodiment, by providing a substrate with a plurality of cavity channels and at least one ultrasonic transduction unit arranged on the substrate, and by setting that each ultrasonic transduction unit includes at least two cavity channels and the lengths of two adjacent cavity channels are different, the ultrasonic waves emitted by the ultrasonic emission unit in each ultrasonic transduction unit pass through the cavity channels to a predetermined sensing area, thereby realizing the control of the acoustic path difference through the physical length of the cavity channels, realizing the fine sound beam focusing control without setting a multi-channel driving chip, being easy to realize, reducing the cost of the ultrasonic transducer, being suitable for a large-area array needing fine imaging, and having wide application prospect.
In a specific example, referring to fig. 1 and 2, a schematic top view of an ultrasound transducer formed of a one-dimensional linear array and a schematic cross-sectional view of an ultrasound transducing unit in the ultrasound transducer taken along line AA' in fig. 1 are shown.
As shown in fig. 1 and 2, the ultrasonic transducer 1 includes a substrate 10 and 3 ultrasonic transducing units 11 disposed on the substrate. Each ultrasonic transducer unit 11 includes one ultrasonic transmitting unit 113 disposed on a side of the substrate 10 away from the sensing target and six ultrasonic receiving units 115 disposed on a side of the substrate 10 close to the sensing target. Wherein, the ultrasonic transmitting unit 113 is used for transmitting ultrasonic waves to a predetermined sensing area in the sensing target, and the ultrasonic receiving unit 115 is used for receiving the ultrasonic waves reflected by the predetermined sensing area.
It should be noted that, although the ultrasonic transducer constituted by one-dimensional linear arrays is illustrated in this example, the present application is not intended to be limited, and both one-dimensional linear arrays and two-dimensional area arrays are possible.
In addition, although the present example illustrates that the ultrasonic transducer includes 3 ultrasonic transducing units and one ultrasonic transducing unit includes 1 ultrasonic transmitting unit and 6 ultrasonic receiving units, the present application is not intended to be limited, and a person skilled in the art may select a specific number of ultrasonic transducing units in the ultrasonic transducer according to specific needs, and likewise, a person skilled in the art may select a number of ultrasonic transmitting units and a number of ultrasonic receiving units included in each ultrasonic transducing unit according to specific needs. As can be understood by those skilled in the art, the larger the number of ultrasonic transduction units, the larger the number of target focal points of the sensing target, and the larger size of target sensing is satisfied; meanwhile, the more the number of the ultrasonic receiving units contained in each ultrasonic transduction unit is, the more the number of the acquired sensing signals is, and the more accurate the imaging is.
As will be understood from the following description, the number of the array elements for transmitting the ultrasonic waves in the present application depends on the number of the cavity channels in the substrate, and the number of the ultrasonic transmitting units is different only in the signal supply of the voltage source for driving the ultrasonic transmitting units, which can be selected by those skilled in the art according to specific requirements, and will not be described herein again.
Alternatively, the ultrasonic transmission unit 113 may include one of a CMUT (capacitive micromachined ultrasonic transducer) sound source, a PMUT (voltage micromachined ultrasonic transducer) sound source, a PZT (lead zirconate titanate) sound source, and a PVDF (piezoelectric thin film) sound source. The ultrasonic transmitting unit 113 may be a whole surface or may be independent according to a specific process, that is, may be integrated as a sound source of a whole surface electrode by using a semiconductor process, or may be an independent separate device. When the ultrasonic transmission units 113 are independent discrete devices, each transmission unit comprises an independent upper electrode, an independent lower electrode and a cavity, each cavity channel 101 corresponds to one ultrasonic transmission unit 113, and the same voltage signal can be supplied to each ultrasonic transmission unit 113 through a voltage source to generate ultrasonic waves, as shown in fig. 3. When the ultrasonic transmission units 113 are full-surface, it may be represented that all the ultrasonic transduction units include the same lower electrode and the independent upper electrode as shown in fig. 4, or that each ultrasonic transduction unit includes the same upper and lower electrodes, and the ultrasonic transmission units of the respective ultrasonic transduction units are the separate upper and lower electrodes (not shown).
Alternatively, it is decided whether the ultrasonic transmission unit is required to directly contact the opening of the cavity channel of the substrate, depending on the structural principle of the ultrasonic transmission unit. In other words, for a PVDF (piezoelectric film) sound source, a support layer, i.e., a second support layer, may be included between the substrate and the ultrasound emitting unit, and the material of the support layer may be the same material as the substrate; however, for an ultrasonic transmitting unit of other structure, for example, when the ultrasonic transmitting unit is one of a CMUT (capacitive micromachined ultrasonic transducer) sound source, a PMUT (voltage micromachined ultrasonic transducer) sound source, and a PZT (lead zirconate titanate) sound source, the ultrasonic transmitting unit needs to be in direct contact with the substrate in order to generate an effective vibration effect.
Further optionally, a support layer, i.e. a first support layer, is included between the ultrasound receiving unit 115 and the substrate 10, and the material of the support layer may be glass or polyimide. The support layer may be used to attach the support layer of the ultrasound receiving unit 115 during the fabrication of the ultrasound transducer.
In particular, and with continued reference to FIG. 2, in an embodiment of the present application, the substrate 10 includes a plurality of cavity channels through the substrate 10. In the present example, each ultrasonic transducer unit 11 includes 5 cavity channels 101, and the lengths of the adjacent cavity channels 101 are different, so that the ultrasonic waves emitted by the ultrasonic emitting unit in each ultrasonic transducer unit pass through the cavity channels to a predetermined sensing region. In the present application, the ultrasonic waves emitted by the ultrasonic emitting unit in each ultrasonic transducing unit can be deflected in a beam focusing or focused to a predetermined sensing region through the cavity channel. The predetermined sensing region is a sensing region having a predetermined depth of focus in the sensing target. As shown in fig. 4, the focusing depths of the plurality of ultrasonic transducing units 11 in the ultrasonic transducer 1 may be different, and only the lengths of the cavity channels satisfying different focusing depths in the respective ultrasonic transducing units 11 need to be set independently.
It should be noted that although this example shows that each ultrasonic transducer unit 11 includes 5 cavity channels, it is not intended to be limited thereto, the number of cavities is only for the purpose of generating the acoustic path difference of ultrasonic transmission in this application, and one cavity channel corresponds to one array element, and those skilled in the art can select an appropriate number of cavity channels as required.
In this embodiment, through the through cavity channels provided in the substrate, each ultrasonic transducer unit includes at least two cavity channels, and the lengths of the adjacent cavity channels are different, and the ultrasonic waves emitted at the same time will generate different acoustic path differences after being transmitted in the cavity channels, so that it is not necessary to provide a delay signal for each array element by using a chip or the like to control the acoustic delay of each array element, i.e. the acoustic delay can be generated. Therefore, in the application, the length of each cavity channel is set only according to the acoustic wave delay required by each array element, and the acoustic beam focusing deflection or the acoustic beam focusing to a specified focusing area can be realized.
It should be noted that fig. 1 and fig. 2 only illustrate schematic diagrams of one-dimensional linear array focusing, according to the principle of acoustic beam focusing, focusing on an ultrasonic wave at a certain point in space, and adjacent array elements should have different delays, and it is necessary to satisfy that the lengths of adjacent cavity channels should be different. The technical personnel in the field should understand that the focusing of the sound beam convergence deflection in the one-dimensional linear array is only the focusing of deflecting a certain deflection angle, and similarly, the requirement of different lengths of adjacent cavity channels is satisfied; for a two-dimensional area array, when the sound beam is polarized and focused or the sound beam is focused, two adjacent array elements in each ultrasonic transduction unit also have different delays, that is, the length of adjacent cavity channels needs to be different. The numerical relationship of the cavity channels will be described below.
In an embodiment of the present application, optionally, as shown in fig. 2, the cavity channel 101 includes: a first channel formed extending from the side of the substrate 10 near the ultrasonic transmitting unit in a direction perpendicular to the substrate; the first channel is bent and forms a second channel extending along a direction parallel to the surface of the substrate; the second channel is bent and forms a third channel extending along the direction vertical to the substrate; the third channel bends and forms a fourth channel extending along the direction parallel to the surface of the substrate; and the fourth channel bends and forms a fifth channel which extends to one side of the substrate close to the ultrasonic receiving unit along the direction vertical to the substrate. The arrangement can simplify the manufacturing scheme of the cavity channel, and the area of the substrate can be reduced by the bent first channel and the bent second channel, which is favorable for high-density array elements.
More preferably, as shown in fig. 2, the second channel length of the adjacent cavity channels and the fourth channel length of the adjacent cavity channels in each ultrasonic transducer unit 11 are different, so that the lengths of the adjacent cavity channels are different. With this arrangement, the length of each cavity channel can be set by the area of the substrate in the horizontal direction, and since the length of the cavity channel is set by both the second channel and the fourth channel, the control of the beam deflection focusing and the beam focusing can be realized without greatly increasing the thickness of the substrate and the area of the substrate.
Further optionally, the orthographic projection of the first channel on the substrate 10 overlaps with the orthographic projection of the ultrasound transmission unit 113 on the substrate 10, thereby ensuring that ultrasound generated by the ultrasound transmission unit 113 can propagate via the cavity channel. In addition, the orthographic projection of the fifth channel on the substrate 10 is staggered with the orthographic projection of the ultrasonic receiving unit 115 on the substrate 10, and through the arrangement, compared with a structure that the ultrasonic receiving unit shields a cavity channel, the transmitting efficiency of ultrasonic waves is effectively improved, and then the receiving accuracy and the imaging effect of the ultrasonic receiving unit are improved.
For the specific value of the cavity channel, in the present application, each ultrasonic transducer unit 11 includes a plurality of array elements, each array element includes a cavity channel, each ultrasonic transducer unit 11 has different delays due to different lengths of the cavity channels, and different delays are generated by the acoustic path difference transmitted in the cavity channels through the ultrasonic waves, so that the acoustic beam is focused and deflected or focused to the sensing region with the predetermined focusing depth.
Specifically, referring to fig. 5, the delay of each array element when the acoustic beam deflection focusing or the acoustic beam focusing occurs can be calculated according to the schematic diagram shown in the figure, so as to obtain the length of the cavity channel. As shown in fig. 5, the ultrasonic waves emitted from the ultrasonic emission unit are focused to a predetermined sensing region B in space through the cavity channel sound at a deflection angle phi, and when the angle phi is 0, the sound beams are directly focused to the predetermined sensing region B. In this example, the delay law is derived by applying a negative value of delay for each array element. I.e. the delay tau of the ith array elementiSatisfies the following conditions:
wherein phi isRepresenting the angle of deflection of the beam, c representing the speed of sound of the ultrasound wave, xiIndicating the distance between the ith array element and the central array element with a delay of 0, R0Representing the focal length of the ultrasound transducing unit.
Note that, the focal length R is0The vertical distance from the focus point to the straight line where the one-dimensional array element is located or the plane where the two-dimensional array element is located, during actual calculation, because the distance between adjacent array elements is small, x isiThe ratio of the focal length to the focal length is far less than 1, so if the acoustic beam deflects, the deflection angle of the acoustic beam is extremely small, and the distance R from the focal point to the ith array element is approximately equal to the focal length R during calculation0Usually, the distance R from the focusing point to the ith array element can be adopted to replace the focal length R in the expression0The delay is calculated.
Specifically, in the example of fig. 5, the ith array element is the 2 nd array element, the central array element with a delay of 0 is the 3 rd array element, and when the deflection angle Φ is 0, the ultrasonic waves emitted by all the array elements will be focused on the central axis indicated by the thick dashed line. Those skilled in the art will understand that the focal length of the ultrasonic transducer unit, or the distance from the ith array element to the focus point B, may be determined according to a rectangular coordinate system established based on the substrate, where the rectangular coordinate system of the one-dimensional linear array for R is a two-dimensional rectangular coordinate system, and the direct coordinate system of the two-dimensional planar array for R is a three-dimensional rectangular coordinate system. Those skilled in the art can determine the length of the cavity channel corresponding to each array element according to the product of the sound velocity of the ultrasonic wave and the delay, which is not described herein again.
According to the mode, the time delay of the ultrasonic wave of each array element is calculated through a space geometric relation based on the acoustic beam focusing deflection or acoustic beam focusing theory, and then the length of the cavity channel corresponding to each array element is obtained.
It should be noted that the manner of calculating the ultrasonic delay of the array element is not limited to this, and the delay of each array element in the ultrasonic transduction unit may also be obtained by using other expressions respectively for focusing or deflecting the acoustic beam, and the length of the cavity channel corresponding to each array element is obtained based on the calculated delay, which is not described herein again.
In accordance with an embodiment of the present invention, there is also provided a method for manufacturing the ultrasonic transducer according to the above embodiment, including:
forming a substrate including a plurality of cavity channels through the substrate;
forming at least one ultrasonic transducing unit on a substrate, each ultrasonic transducing unit including:
at least one ultrasonic transmission unit disposed on a side of the substrate away from the sensing target for transmitting ultrasonic waves to a predetermined sensing region, an
A plurality of ultrasonic receiving units disposed on a side of the substrate close to the sensing target for receiving the ultrasonic waves reflected from the predetermined sensing region,
wherein each ultrasonic transduction unit comprises at least two cavity channels, and the lengths of the adjacent cavity channels are different, so that the ultrasonic waves emitted by the ultrasonic emission unit in each ultrasonic transduction unit pass through the cavity channels to reach the preset sensing area.
In this embodiment, a substrate with a plurality of cavity channels and at least one ultrasonic transducer unit arranged on the substrate are formed, and the length of each ultrasonic transducer unit comprises at least two cavity channels and the length of each two adjacent cavity channels is different, so that ultrasonic waves emitted by an ultrasonic emission unit in each ultrasonic transducer unit pass through the cavity channels to a preset sensing area, and accordingly, the acoustic path difference control is realized through the physical length of the cavity channels, fine sound beam focusing control can be realized without arranging a multi-channel driving chip, the method is easy to realize, the cost of the ultrasonic transducer is reduced, the method is suitable for large-area arrays needing fine imaging, and the method has a wide application prospect.
Optionally, the step of forming the substrate further comprises: the substrate is formed by 3D printing, and the material of the substrate may be glass. Then, as shown with reference to fig. 6 to 8, forming at least one ultrasonic transducing unit on the substrate further includes:
in step S11, as shown in fig. 6, the ultrasonic receiving unit 115 fabricated in advance is bonded to the first sub-material layer 102, which may be made of glass or polyimide.
In step S12, as shown in fig. 7, the side of the first sub material layer 102 away from the ultrasonic receiving unit 115 is thinned to form the support layer 103 to which the ultrasonic receiving unit 115 is attached, and the thinning step is intended to improve the transmission efficiency of the ultrasonic waves to be emitted.
In step S13, the ultrasonic transmitting unit 113 is attached to the substrate 10, and in step S14, the side of the support layer 103 to which the ultrasonic receiving unit 115 is not attached and the side of the substrate 10 to which the ultrasonic transmitting unit 113 is not attached are attached together to form at least one ultrasonic transducer unit.
Further alternatively, the substrate may also be fabricated by a method of glass multilayer etching and bonding. Then, as shown with reference to fig. 9 to 13, forming the substrate further includes:
as shown in fig. 9 and 10, in step S21, a plurality of first trenches K1 perpendicular to the first sub-material layer and second trenches K2 extending from the opening of the first trench K1 in parallel to the surface of the first sub-material layer are etched on the first sub-material layer of the substrate, the first trenches K1 may be a first channel in the substrate to be formed, the second trenches K2 serve as the first channel and form a second channel extending in parallel to the surface of the substrate, optionally, the lengths of the adjacent second trenches K2 are different, the material of the first sub-material layer is glass, and the first trenches K1 and the second trenches K2 may be etched on the glass by wet etching;
as shown in fig. 11, in step S22, bonding a second sub-material layer on the surface of the first sub-material layer where the second slot is formed; in step S24, etching a plurality of third trenches K3 perpendicular to the second sub-material layer on the second sub-material layer, where the third trenches K3 penetrate through the second sub-material layer and are connected to the ends of the second trenches far from the first trenches to form third channels, so as to form the first portion of the substrate, the second sub-material layer is made of glass, the third trenches K3 are etched on the glass by wet etching, and the first sub-material layer and the second sub-material layer are seamlessly bonded by using the thermal bonding property of the glass;
as shown in fig. 12, in step S25, etching a plurality of third trenches perpendicular to the third sub-material layer and fourth trenches extending from the openings of the third trenches along a direction parallel to the surface of the third sub-material layer on the third sub-material layer to form a second portion of the substrate, where the third sub-material layer is made of glass, and in order to substantially simplify the manufacturing process, the step S25 is not necessarily the step after step S23, and step S25 may be completed simultaneously with step S21, and the formed second portion may be the intermediate structure manufactured in step S21, that is, the double intermediate structure is formed in step S21, and half of the intermediate structure continues to step S23 and step S24, and the remaining half is used as the second portion;
as shown in fig. 13, in step S26, the first portion and the second portion are bonded to form a substrate. Specifically, when the ultrasonic wave emitting unit is a sensor that must be in direct contact with the cavity channel to ensure sound emission, and it is desired that the ultrasonic wave be directly emitted to the sensing target in space, after the first and second portions are bonded, both sides thereof are thinned to the first and second channels that expose the cavity channel, thereby forming the substrate 10. If the ultrasonic transducer to be manufactured does not require the substrate to be in direct contact with the ultrasonic transmitting unit and the ultrasonic receiving unit, the subsequent thinning step is not performed after the step S26, and the substrate with the first supporting layer and the second supporting layer attached to both sides is directly formed, which is not described herein again. In addition, the step of forming the ultrasonic transducer unit on the substrate is to form the ultrasonic transmitter unit and the ultrasonic receiver unit on two sides of the substrate, which is not described herein again.
Based on the same inventive concept, embodiments of the present invention further provide an ultrasonic transduction system, including:
a probe comprising an ultrasound transducer as described in the embodiments above;
a voltage source coupled to the probe for providing a voltage to at least one of the ultrasound transmission units in a transmission mode of the ultrasound system. The principle of the ultrasonic transducer system for solving the problems is similar to that of the ultrasonic transducer, so the specific implementation of the ultrasonic transducer system can be referred to the implementation of the ultrasonic transducer, and the repeated points are not described herein again.
In particular implementations, the ultrasound transducer system may be any product or component having ultrasound imaging capabilities. Other essential components of the device are understood by those of ordinary skill in the art, and are not described in detail herein, nor should they be construed as limiting the present application.
The invention aims at the existing problems at present, establishes an ultrasonic transducer, a manufacturing method thereof and an ultrasonic transducer system, and provides a substrate with a plurality of cavity channels and at least one ultrasonic transducer unit arranged on the substrate, and ensures that ultrasonic waves emitted by an ultrasonic emission unit in each ultrasonic transducer unit pass through the cavity channels to a preset sensing area by arranging that each ultrasonic transducer unit comprises at least two cavity channels and the lengths of two adjacent cavity channels are different, thereby realizing the control of the acoustic path difference through the physical length of the cavity channels, realizing the fine sound beam focusing control without arranging a multi-channel driving chip, being easy to realize, reducing the cost of the ultrasonic transducer, being suitable for large-area arrays needing fine imaging and having wide application prospect.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations and modifications can be made on the basis of the above description, and all embodiments cannot be exhaustive, and all obvious variations and modifications belonging to the technical scheme of the present invention are within the protection scope of the present invention.
Claims (11)
1. An ultrasonic transducer, comprising:
a substrate including a plurality of cavity channels extending through the substrate; and
at least one ultrasonic transducing unit disposed on the substrate, each ultrasonic transducing unit including:
at least one ultrasonic transmission unit disposed on a side of the substrate away from the sensing target for transmitting ultrasonic waves to a predetermined sensing region, an
A plurality of ultrasonic receiving units disposed on a side of the substrate close to the sensing target for receiving the ultrasonic waves reflected from the predetermined sensing region,
wherein each ultrasonic transduction unit comprises at least two cavity channels, and the lengths of the adjacent cavity channels are different, so that the ultrasonic waves emitted by the ultrasonic emission unit in each ultrasonic transduction unit pass through the cavity channels to reach the preset sensing area.
2. The ultrasonic transducer of claim 1, wherein the cavity channel comprises:
a first channel formed to extend from the substrate near the ultrasonic transmitting unit side in a direction perpendicular to the substrate;
the first channel is bent and forms a second channel extending along a direction parallel to the surface of the substrate;
the second channel is bent and forms a third channel extending along a direction perpendicular to the substrate;
the third channel bends and forms a fourth channel extending along a direction parallel to the surface of the substrate; and
the fourth channel bends and forms a fifth channel which extends to one side of the substrate close to the ultrasonic receiving unit along the direction vertical to the substrate.
3. The ultrasonic transducer according to claim 1 wherein the second channel length of adjacent cavity channels in each ultrasonic transducing unit is different and the fourth channel length of adjacent cavity channels is different such that the lengths of adjacent cavity channels are different.
4. The ultrasonic transducer according to claim 2 or 3, wherein an orthographic projection of the first channel on the substrate overlaps with an orthographic projection of the ultrasonic transmitting unit on the substrate, and an orthographic projection of the fifth channel on the substrate is staggered from an orthographic projection of the ultrasonic receiving unit on the substrate.
5. The ultrasonic transducer of claim 1, wherein each ultrasonic transducer unit comprises a plurality of array elements, each array element comprising a cavity channel, the length of the cavity channel in each ultrasonic transducer unit being different based on the time delay between adjacent array elements,
the ultrasonic wave emitted by the ultrasonic emission unit is focused and deflected or focused to the preset sensing area through the cavity channel acoustic beam, and the delay tau of the ith array elementiSatisfies the following conditions:
wherein ,
representing the angle of deflection of the beam, c representing the speed of sound of the ultrasound wave, xiIndicating the distance between the ith array element and the central array element with a delay of 0, R0Representing the focal length of the ultrasound transducing unit.
6. The ultrasonic transducer of claim 1,
the ultrasonic transmitting unit in each ultrasonic transducing unit is whole-surface or independent,
the ultrasonic transmitting unit includes one of a CMUT sound source, a PMUT sound source, a PZT sound source, and a PVDF sound source.
7. The ultrasonic transducer of claim 1, further comprising:
a first support layer disposed between the substrate and the ultrasonic receiving unit, and/or
A second support layer disposed between the substrate and the ultrasound transmission unit.
8. An ultrasound system, comprising:
a probe comprising the ultrasound transducer of any of claims 1-7;
a voltage source coupled to the probe for providing a voltage to at least one of the ultrasound transmission units in a transmission mode of the ultrasound system.
9. A method of making the ultrasonic transducer of any one of claims 1-7, wherein the method comprises:
forming a substrate comprising a plurality of cavity channels through the substrate;
forming at least one ultrasonic transducing unit on the substrate, each ultrasonic transducing unit including:
at least one ultrasonic transmission unit disposed on a side of the substrate away from the sensing target for transmitting ultrasonic waves to a predetermined sensing region, an
A plurality of ultrasonic receiving units disposed on a side of the substrate close to the sensing target for receiving the ultrasonic waves reflected from the predetermined sensing region,
wherein each ultrasonic transduction unit comprises at least two cavity channels, and the lengths of the adjacent cavity channels are different, so that the ultrasonic waves emitted by the ultrasonic emission unit in each ultrasonic transduction unit pass through the cavity channels to reach the preset sensing area.
10. The method of manufacturing according to claim 9,
the forming a substrate further includes:
the substrate is formed using 3D printing,
the forming at least one ultrasonic transduction unit on the substrate further includes:
attaching the ultrasonic receiving unit on the first sub-material layer,
thinning one side, away from the ultrasonic receiving unit, of the first sub-material layer to form a supporting layer attached with the ultrasonic receiving unit;
attaching an ultrasonic emission unit to the substrate;
and adhering one side of the supporting layer, which is not adhered to the ultrasonic receiving unit, and one side of the substrate, which is not adhered to the ultrasonic transmitting unit, together to form the at least one ultrasonic transduction unit.
11. The method of manufacturing according to claim 9,
the forming a substrate further includes:
etching a plurality of first grooves perpendicular to the first sub-material layer and second grooves extending from the opening of the first grooves and parallel to the surface of the first sub-material layer on the first sub-material layer;
bonding a second sub-material layer on the surface of the first sub-material layer where the second groove is formed;
etching a plurality of third grooves perpendicular to the second sub-material layer on the second sub-material layer, wherein the third grooves penetrate through the second sub-material layer and are connected with the tail ends, far away from the first grooves, of the second grooves to form a first part of the substrate;
etching a plurality of third grooves perpendicular to the third sub-material layer and fourth grooves extending from the openings of the third grooves along the surface parallel to the third sub-material layer to form a second part of the substrate;
bonding the first and second portions to form the substrate.
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Cited By (1)
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| CN115971021A (en) * | 2022-12-19 | 2023-04-18 | 京东方科技集团股份有限公司 | Ultrasonic transduction substrate, manufacturing method of transduction substrate and detection method |
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