CN114345036A - Semiconductor waste gas treatment equipment with water-vapor separation device and treatment method - Google Patents
Semiconductor waste gas treatment equipment with water-vapor separation device and treatment method Download PDFInfo
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Abstract
The invention provides a semiconductor waste gas treatment device with a water-vapor separation device, which comprises an oxidation reaction tank, a waste liquid collecting box and an atomization tank which are arranged on a placing rack, wherein a waste gas inlet and an oxygen inlet are formed in the oxidation reaction tank; the atomization tank is provided with an air outlet and is connected with the water tank through a water inlet pipe; the waste liquid collecting box is provided with a water outlet, a manual valve is installed on the water outlet, and a water receiving barrel is arranged under the manual valve. The device also comprises a water-vapor separation device and a liquid level detection device, and can separate waste water which is carried in the waste gas and can not undergo oxidation reaction.
Description
Technical Field
The invention belongs to the technical field of semiconductor process waste gas treatment, and particularly relates to semiconductor waste gas treatment equipment with a water-vapor separation device and a treatment method.
Background
Solvents used in the semiconductor industry, such as cleaning agents, developers, photoresists, etching solutions, and the like, contain a large amount of organic components, and most of these organic solvents are volatilized to become exhaust gas during the process. The main body of the waste gas is VOCs, and meanwhile, the waste gas is also mixed with dangerous pollutants such as HCl, ammonia, HF and the like.
Chinese patent publication No. CN113578009A relates to a semiconductor process waste gas treatment device. The semiconductor process exhaust gas treatment device comprises: the treatment tank body comprises an oxidation reaction cavity, a waste liquid gathering cavity and an atomization washing cavity which are sequentially communicated; the oxidation reaction cavity and the atomization water washing cavity are positioned above the waste liquid gathering cavity; the oxidation reaction cavity is communicated with an air inlet channel, the air inlet channel is used for inputting process waste gas into the oxidation reaction cavity, and the oxidation reaction cavity performs oxidation reaction on the process waste gas input into the oxidation reaction cavity; the atomization water washing cavity is communicated with the exhaust channel, a spraying device is arranged in the atomization water washing cavity, an atomization sheet is mounted on the spraying device, and the atomization sheet can vibrate at a first oscillation frequency to enable the spraying device to spray atomized water droplets; the waste liquid gathering cavity is provided with a vibrating plate which can vibrate at a second oscillation frequency. The semiconductor process waste gas treatment device can solve the problem of a waste gas discharge port in the related art.
Chinese patent publication No. CN1923342B discloses a scrubber for treating semiconductor waste gas generated in a semiconductor manufacturing process, which burns the waste gas with high-temperature flame, filters and collects particles generated after the waste gas is burnt, and discharges the waste gas from which the particles are filtered out to the atmosphere. The semiconductor waste gas treatment purifier comprises: a supply section for supplying semiconductor off-gas, fuel and oxygen; a burner connected to the supply part to burn the semiconductor waste gas by a flame; a combustion chamber which is combined with the burner and drops particles generated when the semiconductor waste gas is burnt; a wet tower installed at a side of the combustion chamber to drop the fine particles transferred from the combustion chamber after being adsorbed with water; and a water storage tank connected to the combustion chamber and the wet tower to collect particles falling from the combustion chamber and the wet tower. The invention increases the efficiency of exhaust gas combustion, prevents particles from depositing on the inner walls of the combustion chamber, and facilitates maintenance and repair of the combustion chamber.
Among the prior art when waste gas passes through behind the high temperature oxidation reaction waste gas oxidation oxide and water, but gas after the purification still can carry the waste water of unable oxidation reaction when leaving from oxidation reaction unit, and waste water can leave the polluted environment along with gas after the purification.
Disclosure of Invention
In view of the above problems in the prior art, it is an object of the present invention to provide a semiconductor exhaust gas treatment apparatus having a water-vapor separation device and a treatment method.
The invention provides the following technical scheme:
a semiconductor waste gas treatment device with a water-vapor separation device comprises an oxidation reaction tank, a waste liquid collecting box and an atomization tank which are arranged on a placing rack, wherein a waste gas inlet and an oxygen inlet are formed in the oxidation reaction tank; the atomization tank is provided with an air outlet and is connected with the water tank through a water inlet pipe; the waste liquid collecting box is provided with a water outlet, a manual valve is mounted on the water outlet, a water receiving barrel is arranged under the manual valve, the waste liquid collecting box also comprises a water-vapor separating device which is arranged in the waste liquid collecting box, and the water-vapor separating device is connected with a waste gas outlet pipe on the waste liquid collecting box; and a liquid level detection device is arranged on the waste liquid collecting box.
Specifically, the water-vapor separation device comprises an air inlet pipe connected with a waste gas outlet pipe on the waste liquid gathering tank; the air inlet pipe is connected with the transition pipe through a first closing device; one end of the transition pipe is mounted on the water-vapor separation shell through a sealing plate, the water-vapor separation shell is in an inverted triangular shape, and the transition pipe is located in the middle of the triangular side face; the top surface of the water-vapor separation shell is provided with an air outlet pipe; a water outlet II is formed in the bottom surface of the water-vapor separation shell; and a water-vapor separation pipe is arranged at the other end of the transition pipe and is arranged in the water-vapor separation shell.
Specifically, the water-vapor separation device further comprises a second closing device arranged in the waste gas outlet pipe on the waste liquid collecting box.
Specifically, one end of the water-vapor separation pipe is set to be an open end, a water-vapor sealing plate is arranged at the other end of the water-vapor separation pipe, the water-vapor separation pipe is installed in the water-vapor separation shell through the water-vapor sealing plate, and a plurality of separation holes are formed in the surface of the water-vapor separation pipe.
Specifically, the closing device comprises a connecting box, wherein an air inlet pipe and a transition pipe are respectively arranged on two sides of the connecting box; the closing plate is arranged in the square hole, and the thickness of the closing plate is equal to the distance between the air inlet pipe and the transition pipe; the closing plate is installed on the connecting box through an air cylinder, and magnetic switches are installed at two ends of the air cylinder.
Specifically, the second closing device comprises knobs penetrating through two ends of a waste gas outlet pipe on the waste liquid gathering box, and two ends of each knob are mounted on the waste gas outlet pipe through rubber gaskets; a screw is installed at one end of the knob, and a butterfly nut is installed on the screw through a nut; a rubber gasket at the other end of the knob is arranged on the waste gas outlet pipe through a bolt; the division board is installed on the knob, just the diameter of division board equals the internal diameter of waste gas outlet duct.
Specifically, the liquid level detection device comprises a transparent hose, two ends of which are arranged on the waste liquid gathering tank through quick connectors; the fixed pipe penetrates through the transparent hose, one end of the fixed pipe is mounted on the quick connector through a shaft collar, and an opening is formed in one side of the fixed pipe; the optical fiber sensor is installed on the fixed pipe through a sensor fixing band, and the optical fiber sensor is arranged in the opening.
The rack comprises a rack body, and is characterized by further comprising handles arranged on two sides of the rack body, wherein the two sides of the rack body are symmetrically arranged on supporting frames, and the number of the supporting frames is at least four
Specifically, the strut comprises square pipe, the strut includes the bracing piece, the bracing piece is equipped with the lug of slope, the bracing piece passes through the fixed pin and installs on the stopper, the stopper both sides are equipped with the limiting plate, interval between the limiting plate equals the width of square pipe, just the lug is the level and places, and two are arranged in to square pipe on the strut between the limiting plate.
Based on the device, the invention also provides a treatment method of the semiconductor waste gas treatment equipment with the water-vapor separation device, which comprises the following steps:
s1, enabling the waste gas to enter an oxidation reaction tank for combustion oxidation reaction, and enabling the oxidized gas to carry waste water which cannot be oxidized to enter a water-vapor separation pipe device;
s2, enabling the waste gas to enter the gas inlet pipe through the waste gas outlet pipe, then enter the transition pipe, and enter the water-vapor separation pipe, hanging the waste water on the separation holes to be collected when the waste gas passes through the water-vapor separation pipe, then falling on the triangular inclined plane of the water-vapor separation shell, and collecting along the inclined plane to flow into the waste liquid collection box;
s3, enabling waste gas after waste water separation to enter an atomization tank through a waste gas outlet pipe, enabling waste water formed after atomization and washing to flow back into a waste liquid collection box, and enabling residual gas to leave from a gas outlet;
s4, when the liquid level in the waste liquid collecting tank is too high, the optical fiber sensor detects a liquid level position transmission signal, and the PLC controls to open the air cylinder and manually rotate the butterfly nut; the cylinder drives the closing plate to move downwards, a magnetic switch at the zero stroke position of the cylinder senses a piston position transmission signal in the cylinder, the cylinder is closed, the closing plate seals a channel between the air inlet pipe and the transition pipe at the moment, and meanwhile, the partition plate cuts off the introduction of waste gas in the waste gas outlet pipe;
s5, when the optical fiber sensor feeds back signals, the manual valve is manually opened to discharge waste water into the water receiving barrel;
s6, after the waste water in the waste liquid collecting tank is discharged, closing the manual valve, controlling to open the cylinder, and rotating the butterfly nut to open the partition plate;
and S7, repeating the operation.
The invention has the beneficial effects that:
1. this device is equipped with the waste water that can't carry out oxidation that water vapor separation device can separate in the waste gas.
2. The second closing device and the first closing device designed by the device are matched with the liquid level detection device and used for controlling the closing or opening of an inlet of waste gas entering the water-steam separation device. When the liquid level detection device feeds back a signal, the air cylinder is started, and the butterfly nut is manually rotated; the cylinder drives the closing plate to move downwards to close a channel between the air inlet pipe and the transition pipe, meanwhile, the partition plate is used for separating the introduction of waste gas in the waste gas outlet pipe, and the double-layer closing can better separate the entering of the waste gas.
3. Under the cooperation of strut and handle, removal that semiconductor exhaust-gas treatment equipment can be convenient is convenient for the holistic removal of semiconductor exhaust-gas treatment equipment and is placed.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a front view of the present invention;
FIG. 2 is a three-dimensional view of the water-vapor separation device of the present invention;
FIG. 3 is a schematic view showing the internal structure of the water-vapor separation device according to the present invention;
FIG. 4 is a top view of the present invention;
FIG. 5 is a three-dimensional view of a water vapor separation tube according to the present invention;
FIG. 6 is a three-dimensional view of a second closure device of the present invention;
FIG. 7 is a three-dimensional view of a mounting tube according to the present invention;
FIG. 8 is a front view of a second embodiment of the present invention;
fig. 9 is a three-dimensional view of a bracket in the second embodiment of the invention.
Detailed Description
Example one
As shown in fig. 1, the invention provides a semiconductor waste gas treatment device with a subminiature built-in water-vapor separation device, which comprises an oxidation reaction tank 1, a waste liquid collecting tank 11 and an atomization tank 5 which are arranged on a placing frame 14, wherein a waste gas inlet 2 and an oxygen inlet 3 are arranged on the oxidation reaction tank 1, the oxidation reaction tank 1 and the waste liquid collecting tank 11, the waste liquid collecting tank 11 and the atomization tank 5 are connected through waste gas outlet pipes, and sealing rings are arranged at the joints to prevent waste gas from leaking; an air outlet 6 is arranged on the atomization tank 5, and the atomization tank 5 is connected with a water tank 9 through a water inlet pipe 4; the waste liquid collecting box 11 is provided with a water outlet 12, a manual valve 13 is installed on the water outlet 12, and a water receiving barrel 8 is arranged under the manual valve 13.
Still include water vapor separator 15 and arrange in waste liquid gathers the case 11, and water vapor separator 15 is connected with the waste gas outlet duct on the waste liquid gathers the case 11 for the waste water that can't carry out oxidation carried in the separation waste gas.
Still include install liquid level detection device 10 on the waste liquid gathers case 11 for detect the liquid level position in the waste liquid gathers case 11, when liquid level position is too high, easily influence the waste gas in the water vapor separation device 15 and carry out steam and water separation, consequently when detection device feedback signal, manual valve 13 of opening is manual opens and emits waste water, avoids influencing water waste gas and carries out steam and water separation.
Referring to fig. 2 to 4, the water-vapor separation device 15 includes an air inlet pipe 1501 connected to an exhaust gas outlet pipe of the waste liquid collecting tank 11, the air inlet pipe 1501 is connected to a transition pipe 1505 through a first closing device 1502, and one end of the transition pipe 1505 is mounted on a water-vapor separation shell 1503 through a sealing plate 1506 to prevent the exhaust gas from leaking at the connection; the water-vapor separation shell 1503 is in an inverted triangular shape, the transition pipe 1505 is located in the middle of the triangular side face, an air outlet pipe 1504 is arranged on the top face of the water-vapor separation shell 1503, two water outlets 1509 are arranged on the bottom face of the water-vapor separation shell 1503, the water-vapor separation pipe 1507 is arranged at the other end of the transition pipe 1505, the water-vapor separation pipe 1507 is installed in the water-vapor separation shell 1503, and the water-vapor separation shell further comprises a second closing device 1508 installed in an exhaust gas outlet pipe on the waste liquid collecting box 11.
The waste water separated from the waste gas falls on the triangular inclined plane of the water-vapor separation shell 1503 through the water outlet II 1509 and flows into the waste liquid collecting box 11 along the inclined plane.
When the liquid level detecting device 10 feeds back a signal, the first closing device 1502 and the second closing device 1508 can close the inlet of the exhaust gas into the water-vapor separating device 15. Avoid the continuous device that gets into of waste gas and influence the subsequent processing of waste gas.
Referring to fig. 5, one end of the water vapor separation tube 1507 is an open end 15071, the other end is a water vapor sealing plate 15072, the water vapor separation tube 1507 is installed in the water vapor separation housing 1503 by the water vapor sealing plate 15072, and the surface of the water vapor separation tube 1507 is provided with a plurality of separation holes 15073 for separating water vapor. When the exhaust gas passes through the moisture separation tube 1507, the waste water is caught on the separation hole 15073 and then falls on the triangular slope of the moisture separation housing 1503.
Referring to fig. 2, the first closing device 1502 includes a connection box 15021 having an air inlet pipe 1501 and a transition pipe 1505 installed on both sides thereof, the connection box 15021 has a square hole on the upper end thereof, a water outlet pipe 15022 installed on the lower end thereof, a closing plate 15024 disposed in the square hole and having a thickness equal to the distance between the air inlet pipe 1501 and the transition pipe 1505, the closing plate 15024 is installed on the connection box 15021 through an air cylinder 15023, magnetic switches are installed on both ends of the air cylinder 15023, and the closing plate 15024 is controlled by the air cylinder 15023 to move up and down for controlling the closing or opening of the inlet of the exhaust gas into the water-vapor separation device 15.
Referring to fig. 6, the second closing device 1508 includes a knob 15083 penetrating through both ends of the waste gas outlet pipe of the waste liquid collecting tank 11, both ends of the knob 15083 are mounted on the waste gas outlet pipe through a rubber washer 15084, a screw is welded to one end of the knob 15083, and a butterfly nut 1508 is mounted on the screw through a nut 15082; a rubber packing 15084 at the other end of the knob 15083 is installed on the exhaust gas outlet pipe by a bolt 15085, a partition plate 15086 is installed on the knob 15083 by a screw, and the diameter of the partition plate 15086 is equal to the inner diameter of the exhaust gas outlet pipe.
The second closing device 1508 cooperates with the first closing device 1502 to control the closing or opening of the inlet of the exhaust gas into the moisture separator 15. When the liquid level detection device 10 feeds back a signal, the air cylinder 15023 is started and the butterfly nut 1508 is manually rotated; the cylinder 15023 drives the closing plate 15024 to move downwards to close a channel between the air inlet pipe 1501 and the transition pipe 1505, meanwhile, the separating plate 15086 is used for separating the introduction of waste gas in the waste gas outlet pipe, and the double-layer closing can better separate the entering of the waste gas.
While waste water carried along when the waste gas reaches the closing plate 15024 flows along the closing plate 15024 from the water outlet port one 15022 into the waste liquid collecting tank 11.
The liquid level detecting device 10 includes a transparent flexible tube 102 having two ends mounted on the waste liquid collecting tank 11 through a quick coupling 101, a fixing tube 106 passing through the transparent flexible tube 102, and one end of the fixing tube 106 mounted on the quick coupling 101 through a collar 103, please refer to fig. 7, an opening 107 is disposed on one side of the fixing tube 106, an optical fiber sensor 104 is mounted on the fixing tube 106 through a sensor fixing band 105, and the optical fiber sensor 104 is disposed in the opening 107.
The cylinder 15023, magnetic switch and fiber optic sensor 104 are communicatively coupled to the control panel.
The control panel is internally provided with a PLC controller which can program a numerical control system, the PLC is used as a central control system, the touch screen is used for realizing the program input and the operation control of the whole machine, and the automation of the whole processing process is realized. The control system can be used as a system for connecting each execution element to move according to a logic track, and the execution elements are controlled to operate according to the required operation steps through programming.
Based on the device, the invention also provides a treatment method of the semiconductor waste gas treatment equipment with the microminiature built-in water-vapor separation device, which comprises the following steps:
step one, waste gas enters an oxidation reaction tank 1 to carry out combustion oxidation reaction, and oxidized gas carries waste water which cannot be oxidized to enter a water-steam separation pipe 1507 device;
step two, the waste gas enters the gas inlet pipe 1501 through the waste gas outlet pipe, then enters the transition pipe 1505 and enters the water-vapor separation pipe 1507, when the waste gas passes through the water-vapor separation pipe 1507, the waste water is hung on the separation holes 15073 to be collected, then falls on the triangular inclined plane of the water-vapor separation shell 1503 and flows into the waste liquid collecting box 11 along the inclined plane;
step three, the waste gas after the waste water separation enters the atomization tank 5 through a waste gas outlet pipe, the waste water formed after atomization and washing flows back into the waste liquid collection tank 11, and the residual gas leaves from the gas outlet 6;
step four, when the liquid level in the waste liquid collecting tank 11 is too high, the optical fiber sensor 104 detects a liquid level position transmission signal, and the PLC controls to open the air cylinder 15023 and simultaneously manually rotate the butterfly nut 1508; the cylinder 15023 drives the closing plate 15024 to move downwards, the magnetic switch at the zero stroke position of the cylinder 15023 senses the position of the piston in the cylinder 15023 to transmit signals, the cylinder 15023 is closed, at the moment, the closing plate 15024 seals the channel between the air inlet pipe 1501 and the transition pipe 1505, and simultaneously, the partition plate 15086 cuts off the introduction of waste gas in the waste gas outlet pipe;
step five, when the optical fiber sensor 104 feeds back a signal, the manual valve 13 is manually opened to discharge the wastewater into the water receiving barrel 8;
step six, after the waste water in the waste water collecting tank 11 is discharged, closing the manual valve 13, controlling to open the cylinder 15023, and rotating the butterfly nut 1508 to open the partition plate 15086;
and step seven, repeating the operation.
Example two
As shown in fig. 8, the semiconductor waste gas treatment equipment further comprises handles 7 installed on two sides of the placing frame 14, two sides of the placing frame 14 are symmetrically placed on the supporting frames 17, and the number of the supporting frames 17 is at least four. Other devices and installation positions are the same as those of the first embodiment.
Please refer to fig. 9, the supporting frame 17 is made of a square tube, the supporting frame 17 includes a supporting rod 1701, the supporting rod 1701 has an inclined protrusion 1704, the supporting rod 1701 is mounted on the limiting block 1702 through a fixing pin 1703, two sides of the limiting block 1702 are provided with limiting plates, the spacing between the limiting plates is equal to the width of the square tube, the protrusion 1704 is horizontally disposed, and the square tube on the supporting frame 17 is disposed between the two limiting plates.
Under the cooperation of strut 17 and handle 7, the removal that semiconductor exhaust-gas treatment equipment can be convenient, the holistic removal of semiconductor exhaust-gas treatment equipment of being convenient for is placed.
The processing method of the second embodiment is the same as that of the first embodiment.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A semiconductor waste gas treatment device with a water-vapor separation device comprises an oxidation reaction tank (1), a waste liquid collecting box (11) and an atomization tank (5) which are placed on a placing rack (14), wherein a waste gas inlet (2) and an oxygen inlet (3) are formed in the oxidation reaction tank (1), the oxidation reaction tank (1) and the waste liquid collecting box (11), the waste liquid collecting box (11) and the atomization tank (5) are connected through a waste gas outlet pipe, and sealing rings are arranged at the connection parts; an air outlet (6) is formed in the atomization tank (5), and the atomization tank (5) is connected with a water tank (9) through a water inlet pipe (4); the waste liquid collecting box (11) is provided with a water outlet (12), a manual valve (13) is arranged on the water outlet (12), a water receiving barrel (8) is arranged under the manual valve (13),
it is characterized by also comprising
The water-vapor separation device (15) is arranged in the waste liquid collecting box (11), and the water-vapor separation device (15) is connected with a waste gas outlet pipe on the waste liquid collecting box (11);
the liquid level detection device (10) is installed on the waste liquid collecting tank (11).
2. The semiconductor exhaust gas treatment device with water-vapor separation device according to claim 1, wherein the water-vapor separation device (15) comprises
The gas inlet pipe (1501) is connected with a waste gas outlet pipe on the waste liquid collecting tank (11);
the first closing device (1502), the air inlet pipe (1501) is connected with the transition pipe (1505) through the first closing device (1502);
a water-vapor separation shell (1503), wherein one end of the transition pipe (1505) is installed on the water-vapor separation shell (1503) through a sealing plate (1506), the water-vapor separation shell (1503) is in an inverted triangular shape, and the transition pipe (1505) is positioned in the middle of the triangular side;
the top surface of the water-vapor separation shell (1503) is provided with an air outlet pipe (1504);
a water outlet II (1509), wherein the bottom surface of the water-vapor separation shell (1503) is provided with the water outlet II (1509);
the water-vapor separation pipe (1507) is arranged at the other end of the transition pipe (1505), and the water-vapor separation pipe (1507) is arranged in the water-vapor separation shell (1503).
3. The semiconductor exhaust gas treatment device with water-vapor separation device according to claim 2, wherein the water-vapor separation device (15) further comprises a second closing device (1508) installed in the exhaust gas outlet pipe of the waste liquid header tank (11).
4. The semiconductor waste gas treatment apparatus with water-vapor separation device according to claim 2, wherein one end of the water-vapor separation pipe (1507) is provided with an open end (15071), the other end is provided with a water-vapor sealing plate (15072), and the water-vapor separation pipe (1507) is installed in the water-vapor separation housing (1503) through the water-vapor sealing plate (15072), and the surface of the water-vapor separation pipe (1507) is provided with a plurality of separation holes (15073).
5. The semiconductor exhaust gas treatment device with water-steam separation device according to claim 2, wherein the first closing device (1502) comprises
The air inlet pipe (1501) and the transition pipe (1505) are respectively arranged on two sides of the connecting box (15021), a square hole is formed in the upper end of the connecting box (15021), and a first water outlet (15022) is formed in the lower end of the connecting box (15021);
a closing plate (15024) placed in the square hole, wherein the thickness of the closing plate (15024) is equal to the distance between the air inlet pipe (1501) and the transition pipe (1505);
and the closing plate (15024) is arranged on the connecting box (15021) through the cylinder (15023), and magnetic switches are arranged at two ends of the cylinder (15023).
6. The semiconductor exhaust gas treatment device with water-vapor separation device according to claim 3, wherein the second closing means (1508) comprises
The knob (15083) penetrates through the knobs (15083) at two ends of the waste gas outlet pipe on the waste liquid collecting box (11), and two ends of the knob (15083) are arranged on the waste gas outlet pipe through rubber gaskets (15084);
the screw rod is installed at one end of the knob (15083), and the butterfly nut (1508) is installed on the screw rod through the nut (15082);
a bolt (15085), and a rubber gasket (15084) at the other end of the knob (15083) is mounted on the exhaust gas outlet pipe through the bolt (15085);
and a separation plate (15086) mounted on the knob (15083), and the diameter of the separation plate (15086) is equal to the inner diameter of the exhaust gas outlet pipe.
7. The semiconductor exhaust gas treatment device with water-vapor separation device according to claim 1, wherein the liquid level detection means (10) comprises
A transparent hose (102), both ends of which are mounted on the transparent hose (102) of the waste liquid collecting tank (11) through a quick connector (101);
the fixing pipe (106) penetrates through the transparent hose (102), one end of the fixing pipe (106) is installed on the quick connector (101) through a collar (103), and an opening (107) is formed in one side of the fixing pipe (106);
and the optical fiber sensor (104) is arranged on the fixed pipe (106) through a sensor fixing belt (105), and the optical fiber sensor (104) is arranged in the opening (107).
8. The semiconductor waste gas treatment equipment with the water-steam separation device according to claim 1, further comprising handles (7) mounted on both sides of the placing frame (14), wherein both sides of the placing frame (14) are symmetrically arranged on the brackets (17), and the number of the brackets (17) is at least four.
9. The semiconductor exhaust gas treatment device with the water-vapor separation device according to claim 8, wherein the bracket (17) is composed of a square tube, the bracket (17) comprises a support bar (1701), the support bar (1701) is provided with an inclined bump (1704), the support bar (1701) is mounted on the limit block (1702) through a fixing pin (1703), limit plates are arranged on two sides of the limit block (1702), the spacing between the limit plates is equal to the width of the square tube, the bump (1704) is horizontally arranged, and the square tube on the bracket (17) is arranged between the two limit plates.
10. A treatment method using the semiconductor exhaust gas treatment device with a water-gas separation apparatus according to any one of claims 1 to 9, comprising the steps of:
s1, enabling the waste gas to enter an oxidation reaction tank (1) for combustion oxidation reaction, and enabling the oxidized gas to carry waste water which cannot be oxidized to enter a water-vapor separation pipe (1507) device;
s2, enabling the waste gas to enter an air inlet pipe (1501) through a waste gas outlet pipe, then entering a transition pipe (1505) and entering a water-vapor separation pipe (1507), hanging and collecting the waste water on a separation hole (15073) when the waste gas passes through the water-vapor separation pipe (1507), then falling on a triangular inclined plane of a water-vapor separation shell (1503) and collecting and flowing into a waste liquid collecting box (11) along the inclined plane;
s3, enabling waste gas after waste water separation to enter an atomization tank (5) through a waste gas outlet pipe, enabling waste water formed after atomization and washing to flow back into a waste liquid collection box (11), and enabling residual gas to leave from a gas outlet (6);
s4, when the liquid level in the waste liquid collecting box (11) is too high, the optical fiber sensor (104) detects a liquid level position transmission signal, and the PLC controls to open the air cylinder (15023) and manually rotate the butterfly nut (1508); the cylinder (15023) drives the closing plate (15024) to move downwards, the magnetic switch at the zero stroke position of the cylinder (15023) senses the position of a piston in the cylinder (15023) to transmit signals, the cylinder (15023) is closed, the closing plate (15024) seals a channel between the air inlet pipe (1501) and the transition pipe (1505), and meanwhile, the partition plate (15086) cuts off the introduction of waste gas in the waste gas outlet pipe;
s5, when the optical fiber sensor (104) feeds back a signal, the manual valve (13) is manually opened to discharge waste water into the water receiving barrel (8);
s6, after the waste water in the waste water collecting tank (11) is discharged, closing the manual valve (13), controlling to open the cylinder (15023), and rotating the butterfly nut (1508) to open the partition plate (15086);
and S7, repeating the operation.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210148791.7A CN114345036B (en) | 2022-02-18 | 2022-02-18 | Semiconductor waste gas treatment equipment with water-steam separation device and treatment method |
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| CN202210148791.7A CN114345036B (en) | 2022-02-18 | 2022-02-18 | Semiconductor waste gas treatment equipment with water-steam separation device and treatment method |
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| CN114345036B CN114345036B (en) | 2023-04-25 |
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| CN205019874U (en) * | 2015-09-18 | 2016-02-10 | 江苏新凯晟机械设备有限公司 | Big volume ordinary pressure vacuum vapour and liquid separator |
| CN107670478A (en) * | 2017-11-10 | 2018-02-09 | 嘉兴市博莱特纸业有限公司 | A kind of waste water station waste gas treatment process |
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2022
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205019874U (en) * | 2015-09-18 | 2016-02-10 | 江苏新凯晟机械设备有限公司 | Big volume ordinary pressure vacuum vapour and liquid separator |
| CN107670478A (en) * | 2017-11-10 | 2018-02-09 | 嘉兴市博莱特纸业有限公司 | A kind of waste water station waste gas treatment process |
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| CN114345036B (en) | 2023-04-25 |
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Effective date of registration: 20230918 Address after: 201315, 3rd Floor, Building 12, No. 957 Kangqiao Road, Pudong New Area, Shanghai Patentee after: Shanghai Gaosheng Integrated Circuit Equipment Co.,Ltd. Address before: 201315 floor 4, building 12, No. 957, Kangqiao Road, Pudong New Area, Shanghai Patentee before: Cui Hanbo |