CN114341719A - Passivation layer of photo-oriented quantum rod enhanced film for LCD - Google Patents
Passivation layer of photo-oriented quantum rod enhanced film for LCD Download PDFInfo
- Publication number
- CN114341719A CN114341719A CN201980099409.4A CN201980099409A CN114341719A CN 114341719 A CN114341719 A CN 114341719A CN 201980099409 A CN201980099409 A CN 201980099409A CN 114341719 A CN114341719 A CN 114341719A
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- CN
- China
- Prior art keywords
- layer
- substrate
- photo
- passivation layer
- enhancement film
- Prior art date
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- Pending
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Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133617—Illumination with ultraviolet light; Luminescent elements or materials associated to the cell
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
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Abstract
The invention discloses a passivation layer for a photo-oriented Quantum Rod Enhancement Film (QREF). The passivation layer includes a substrate having an organic-inorganic multi-layer and a barrier adhesive layer. The passivation layer and QREF are coated on the polymer substrate. An additional polymer layer may be applied to the substrate along with a planarization layer, followed by an inorganic layer to provide high oxygen and water blocking properties for photo-oriented QREF. An adhesive layer is applied on top of the QREF, and then the two QREFs are subjected to a face-to-face lamination and polymerization process to provide good passivation of the photo-aligned QREF. An additional passivation layer or QREF layer may also be deposited on the resulting film. Thus, the passivation multilayer produced provides a high barrier to water and oxygen exposure. The Water Vapor Transmission Rate (WVTR) of the manufactured passivation layer is as low as 8.06x10 under the conditions of 60 ℃ and 100% R.H‑7gm‑2day‑1This confirms that the water permeability through the barrier film is low. The film is also characterized by an Oxygen Transmission Rate (OTR) of less than 4.93x10‑3cc/m2Perday, low oxygen permeability was indicated.
Description
Technical Field
The invention relates to the technical field, in particular to a packaging management system and a packaging management method of a film based on a nano material.
Background
Quantum Dot Enhanced Films (QDEF) are used as backlights in liquid crystal displays. QDEF is fabricated by adding red and green emitting Quantum Dots (QDs) combined together in a polymer matrix laminated between two barrier layers. QDEF adds more colors to the LCD system, provides better image quality, and covers more of the visible spectrum than conventional LED backlights.
However, the power efficiency of LCDs with QDEF is still low. Quantum Rods (QR), on the other hand, have polarized emission characteristics with a color spectrum similar to that of QDs. Due to the anisotropic shape, QR shows 2D confinement, and fine structure splitting of 1D ground exciton states and dielectric shielding of electromagnetic fields facilitate light absorption and emission along the long axis of the rod. The quantum rods need to be aligned for polarized emission and therefore special layers are needed to align the red and green QR with the compatible matrix to provide good alignment and uniform distribution of QR embedded therein. Photoalignment is a straightforward technique that provides for the alignment of Liquid Crystal Polymers (LCPs) to disperse QR into the LCP matrix. However, the barrier structure of photo-oriented Quantum Rod Enhanced Films (QREF) needs to be modified to ensure a high degree of passivation against water and oxygen.
QR is as highly sensitive to degradation as QD's, so photo-oriented QREF should have good barrier properties against water and oxygen permeation, which can degrade QR performance. The passivation layer protects the QR in the interior region of the laminated structure from damage caused by oxygen or water exposure, but photo-alignment to the cut edge of the QREF exposes the adhesive material to the atmosphere. In the edge region, the protection of QREF depends mainly on the barrier properties of the substrate and the adhesive layer. Therefore, there is a need for a modified passivation layer comprising an adhesive layer with better barrier properties to protect QR in photo-orientation QREF from degradation, thereby achieving longer lifetime stability.
The common polymer matrix layer used for QDs cannot be used because of the QR required alignment in the matrix layer. Furthermore, the binder material cannot be mixed into the matrix material, since this would lead to a reduction in alignment properties. Thus, a matrix material with good blocking and orientation properties is a prerequisite for the oriented QRs film of polarized light emitting light.
Disclosure of Invention
The present invention is directed to solving at least one problem in the prior art. To this end, the present invention provides a passivation layer for a photo-alignment quantum rod enhancement film for an LCD.
A passivation layer for encapsulating at least one photo-oriented quantum rod enhancement film deposited on a photo-oriented layer for use in an LCD, comprising:
i. at least one substrate;
at least one inorganic layer;
this indicates that the photo-oriented quantum rod reinforced film has good protection against oxygen and moisture.
Preferably, the passivation layer for encapsulating photo-oriented quantum rod enhancement film of claim 1, comprising at least one adhesion layer.
Preferably wherein the substrate comprises polyethylene naphthalate, polyethylene terephthalate.
Preferably, the passivation layer for an optical orientation quantum rod enhancement film according to claim 1, wherein the substrate is a backlight light guide plate.
Preferably wherein the substrate comprises a polymer from the family of polyesters and polyolesters.
Preferably wherein the substrate comprises a polymer from the polyvinyl chloride family.
Preferably wherein the substrate comprises a polymer from the polysiloxane family.
Preferably wherein the substrate comprises a polymer of the ionomer family.
Preferably wherein the substrate comprises polypropylene.
Preferably wherein the substrate comprises a polymer from the family of fluorinated ethylenes.
Preferably wherein the substrate comprises a polymer from the styrene methyl methacrylate family.
Preferably wherein the substrate comprises a polymer from the styrene acrylonitrile resin family.
Preferably wherein the substrate comprises polystyrene.
Preferably wherein said substrate comprises a polymer from the polyaryletherketone family.
Preferably, the polyaryletherketone polymer is polyetheretherketone, polyetherketoneketone, polyetheretherketoneketone, polyetherketoneetherketoneketone.
Preferably wherein the substrate comprises a polymer from the polyimide family.
Preferably wherein the substrate comprises a polymer from the polycarbonate family.
Preferably wherein the substrate comprises a polymer from the family of cyclic olefin copolymers.
Preferably wherein the substrate comprises a polymer from the polysulfone family.
Preferably wherein the substrate comprises an acrylic polymer.
Preferably wherein the substrate comprises a polymer from the acrylonitrile-butadiene-styrene (ABS) family.
Preferably, the substrate in which the passivation layer of claim 1 is present, wherein the substrate comprises a polymer from the family Acrylonitrile Styrene Acrylate (ASA).
The thickness of the substrate is in the range of 50-1000 μm.
Preferably wherein the substrate thickness is 100-400 μm.
The passivation layer includes at least one planarization layer coated on the substrate.
Preferably, the planarization layer comprises an organic polymer, a siloxane polymer, a silicate, a metal oxide, fluorine-doped tin oxide, or a mixture thereof.
Preferably, wherein Al2O3Deposited on the substrate as a planarization layer.
Preferably, wherein Al2O3The thickness of the film deposited on the substrate is 50nm-5 μm.
Preferably, Al deposited on the substrate2O3Is 200 nm.
The inorganic layer is coated on at least one side of the substrate for tight passivation of the photo-oriented quantum rod enhancement film.
Preferably, the thickness of the inorganic layer is 50nm-5 μm.
Preferably wherein the inorganic layer is 200nm thick.
Preferably wherein the inorganic layer comprises silicates, phosphosilicates, mechanically deposited glass frits, oxides and nitrides of silicon, aluminum, tin, indium, boron and titanium.
Preferably wherein the inorganic layer comprises a combination of two different inorganic layers.
Preferably, wherein the inorganic layer is SiO2And (3) a layer.
Preferably wherein the passivation layer comprises a combination of organic or inorganic layers.
Preferably wherein the passivation layer comprises a combination of alternating organic and inorganic layers.
Preferably wherein the passivation layer comprises a plurality of layers having a combination of alternating organic and inorganic layers.
Preferably, wherein the passivation layer comprises three layers consisting of an organic layer and an inorganic layer alternately combined.
Preferably wherein the inorganic layer according to claim 31 is also used as a planarization layer of the substrate according to claim 26.
Preferably, wherein the passivation layer comprises one substrate coated with a protective layer and another inorganic layer on top of the enhancement film.
Preferably, the protective layer is an inorganic layer.
Preferably wherein the passivation layer comprises a PET substrate coated with an inorganic layer, and another inorganic layer over the enhancement film.
Preferably wherein the passivation layer comprises a PET substrate coated with an inorganic layer, and a further inorganic layer over the reinforcement film and an organic layer over the inorganic layer.
Preferably, wherein the substrate is a PET substrate having a thickness of 70 μm and the inorganic layer is SiO having a thickness of 200nm2And (3) a layer.
The passivation layer includes a light guide plate as a substrate coated with an inorganic layer, and another inorganic layer on top of the enhancement film.
Preferably, wherein the passivation layer includes a light guide plate as a substrate, the light guide plate being coated with an inorganic layer, another inorganic layer over the reinforcement film, and an organic layer over the inorganic layer.
Preferably, the substrate is a light guide plate with a thickness of 400 μm, and the inorganic layer is SiO with a thickness of 200nm2And (3) a layer.
The adhesive layer is used to laminate two photo-aligned quantum rod enhancement films deposited on a single organic-inorganic passivation layer face-to-face.
Preferably wherein the adhesive layer is used to laminate two photo-oriented quantum rod enhancement films deposited on a single organic-inorganic passivation layer comprising an additional planarization layer, face to face.
Preferably, the glue layer comprises a polymer glue.
Preferably, wherein the polymer gum is epoxy, ethylene vinyl acetate (hot melt), phenolic, polyamide, polyester, polyethylene (hot melt), polypropylene, polysulfide, polyurethane (e.g., Gorilla Glue), polyvinyl acetate, polyvinyl alcohol, polyvinyl chloride, polyvinyl pyrrolidone, rubber cement, silicone, silyl modified polymers, styrene acrylic copolymers are mixtures thereof.
Preferably, the glue layer comprises a monomer glue.
Preferably wherein the monomer glue is an acrylonitrile, cyanoacrylate, acrylic or resorcinol glue.
Preferably wherein the adhesive layer comprises a glue material that can be cured thermally or optically or dry.
Preferably wherein the adhesive layer comprises a UV curable adhesive.
Preferably wherein the adhesive layer thickness is in the range of 2-30 μm.
Preferably wherein the adhesive layer comprises nanoparticles.
A passivation layer is designed, wherein the base material is a PET base material, and the inorganic layer is SiO2And the adhesive layer is a UV curing adhesive layer.
Preferably, wherein the substrate is a PET substrate having a thickness of 70 μm and the inorganic layer is SiO having a thickness of 200nm2Layer, the adhesive layer is a UV-curable adhesive layer with a thickness of 10 μm.
Preferably, the substrate is a light guide plate, the inorganic layer is a SiO2 layer, and the adhesive layer is an ultraviolet light curing adhesive layer.
Preferably, wherein the substrate is a 400 μm thick light guide plate and the inorganic layer is 200nm thick SiO2And the adhesive layer is an ultraviolet light polymerization adhesive layer with the thickness of 10 mu m.
Preferably, one of the substrates is a PET substrate, the other substrate is a light guide plate, and the inorganic layer is SiO2The adhesive layer is UV curing adhesive.
Preferably, wherein the substrate is a PET substrate having a thickness of 70 μm, the other substrate is a light guide plate having a thickness of 400 μm, and the inorganic layer is SiO having a thickness of 200nm2And the adhesive layer is a UV curing adhesive layer with the thickness of 10 mu m.
A passivation layer for a photo-oriented quantum rod enhancement film for LCD backlights is presented. The passivation layer includes a substrate having an organic-inorganic multilayer and a barrier adhesive layer. The polymer substrate is used to coat the passivation layer and QREF on top of it. The polymer layer may be coated with a planarization layer and then an inorganic layer to achieve high barrier properties. The inorganic layer is also used to deposit a thin layer of photo-alignment material (azo dye) to align the QREF matrix and QR therein. An adhesive passivation layer is applied on top of the QREF and then subjected to a face-to-face lamination and polymerization process for two photo-alignment QREF sealing purposes, providing passivation from the sides. In addition, it is commonly usedThe displacement of the red and green emitters in two separate layers eliminates the problem of re-absorption compared to all emitters in a one-layer structure of QDEF. Additional passivation layers and QREF layers may be further deposited on top of the resulting film. The passivation multilayer produced provides high barrier properties against moisture and oxygen permeation. The Water Vapor Transmission Rate (WVTR) of the manufactured passivation layer is as low as 8.06x10 under the conditions of 60 ℃ and 100% R.H-7g m-2Sky-1This confirms that the water permeability through the barrier film is low. The film is also characterized by an Oxygen Transmission Rate (OTR) of less than 4.93x10-3 cc/m2Day, this indicates a low capacity of oxygen to permeate the barrier film.
Is illustrated by a diagram
Embodiments of the present disclosure include a passivation layer for a photo-oriented quantum rod enhancement film for an LCD backlight. When illuminated with a source of light having a wavelength lower than the emission wavelength, the QR emits polarized light. QR is very sensitive to degradation when exposed to humidity and oxygen. Therefore, a passivation layer is needed to provide encapsulation of the QREF from moisture and oxygen.
The passivation layer of QREF comprises a substrate for depositing photo-alignment material, followed by QREF, which also serves as an encapsulation layer. The passivation layer comprises organic and inorganic multilayer structures for providing a high barrier to oxygen and moisture for photocuring QREF. The integrally passivated QREF film also contains an adhesive barrier layer for adhering and sealing the red and green QREF layers and providing encapsulation from the side regions.
In one embodiment, the passivation layer comprises at least one substrate (101), one inorganic layer (102) and one adhesion layer (105) with an orientation layer (103) and a QREF layer (104) (fig. 1)
In one embodiment, the passivation layer comprises a substrate (201), two inorganic layers (202) and an adhesion layer (205) with an orientation layer (203) and a QREF layer (204) (fig. 2).
In one embodiment, the passivation layer comprises at least one substrate (301), one planarization layer (302), one inorganic layer (303), and one adhesion layer (306) with an orientation layer (303) and a QREF layer (304) (fig. 3)).
In one embodiment, the passivation layer comprises one substrate (401), two planarization layers (402), two inorganic layers (403), and one adhesion layer (406) with an orientation layer (403) and a QREF layer (404) (fig. 4).
The substrate used to deposit the QREF layer can be any material that provides good thermal and mechanical stability and high transmission in the visible region.
In one embodiment, the substrate comprises polyethylene naphthalate. The polyethylene naphthalate is
In one example, the substrate comprises polyethylene terephthalate. Polyethylene terephthalate from Crystal, Impet, Laer +, Mylar, Rynite, Valox or structural analogs thereof having different names or mixtures thereof.
In one example, the substrate includes a polymer of the family of polyesters and polyolesters. The polymers of the polyester and polyolic acid resin families can be derived from Aropol, CosmicAlkyd, BMC-Cyglas, Durez, Cirrasol, CHS-ALKYD or their different named structural analogues or mixtures thereof.
In one example, the substrate comprises a polymer of the polyvinyl chloride family. The polymers of the polyvinyl chloride family can be from Geon, OxyVinyls, Benvic, Tygon, Vestolite or their different named structural analogs or mixtures thereof.
In one embodiment, the substrate comprises a polymer of the polysiloxane family. The polymers of the polysiloxane family may be derived from
SiloprenTM、
Or a different named structural analogue thereof or a mixture thereof.
In one example, the substrate comprises a polymer of the ionomer family. The polymer of the ionomer family may be derived from
PrimacoreTM、OptemaTMOr they have different names of structural analogs or mixtures thereof.
In one example, the substrate comprises polypropylene. The polypropylene family can be from Adstif, Eltex, Hostalen, Ineos PP, Inspire, Moplen, Profax, Petrothene, Profax PP, Seetec, Unipol PPo or their structural analogues with different names or mixtures thereof.
In one example, the substrate comprises a polymer of the fluorinated vinyl family. The fluorinated ethylene polymers may be from Neoflon, Teflon FEP, Dyneon FEPo or their structural analogs of different names or mixtures thereof.
In one example, the substrate comprises a polymer of the styrene methyl methacrylate family. The polymers of the styrene methyl methacrylate family can be derived from
RhoplexTMTexicryl or their different named structural analogues or mixtures thereof.
In one example, the substrate comprises a polymer of the styrene acrylonitrile resin family. The polymers of the styrene acrylonitrile resin family may be derived from LG SAN, Luran, Lustran, RTP SAN, Tyril or structural analogs of different names thereof or mixtures thereof.
In one example, the substrate comprises polystyrene (general purpose — GPPS). The polystyrene may be from Cellofoam, Styrofoam, Styron, Styropek, Styropor, or structural analogs thereof having different names, or mixtures thereof.
In one example, the substrate comprises a polymer of the family of methylmethacrylate acrylonitrile butadiene styrene copolymers.
In one example, the substrate comprises a polymer of the polyaryletherketone family. The polyaryletherketone family of polymers are polyetheretherketone, polyetherketoneketone, polyetheretherketoneketone, polyetherketoneetherketoneketone.
In one example, the substrate comprises a polyimide polymer. The polyimide family of polymers can be from Duratron, Kerimid, Matrimid, Kapton, Kinel, Upilex, Upimol, Vespel or their different named structural analogs or mixtures thereof.
In one example, the substrate comprises a polycarbonate family polymer. The polymers of the polycarbonate family can be from Marlon, Durolon, Lupilon, Lupoy, Panlite, Lexan, Thermoclear, Macrolux, Polycasa SPC, Makrolon, Sunlite, Corotherm or their structural analogs of different names or mixtures thereof.
In one example, the substrate comprises a polymer of the cyclic olefin copolymer family. The polymers of the cycloolefin copolymer family can be from Apel, Arton, Topas, DCPD HP, Zeonex, Zeonor or their structural analogs of different names or mixtures thereof.
In one embodiment, the substrate comprises a polysulfone group polymer. The polysulfone group of polymers can be derived from Acudel, Eviva, Quadrant PSU, RTP-PSU, Tecason, Udel, Ultrason S, Veradel or their different named structural analogs or mixtures thereof.
In one example, the substrate comprises an acrylic polymer. The acrylic polymer may be derived from Dow acrylics, Acronal, Aroset, Acrydic, Plextol, and mixtures thereof,
AC、
Hytem, Vamac, DerGom, Kurarity, or their structural analogs by different names or mixtures thereof.
In one example, the substrate comprises a polymer of the acrylonitrile-butadiene-styrene (ABS) family. The substrates of the acrylonitrile-butadiene-styrene (ABS) family are Cevian, Cycolac, Lustran, Magnum, malecac or their structural analogues of different names or mixtures thereof.
In one example, the passivation layer substrate includes an acrylonitrile-Styrene (SAN) polymer.
In one example, the substrate comprises a polymer of the Acrylonitrile Styrene Acrylate (ASA) family. The substrates of the Acrylonitrile Styrene Acrylate (ASA) family are Centrex, Geloy, Kibisan, Luran, terrblend or their structural analogues of different names or mixtures thereof.
The substrate thickness is calibrated to maintain the polarized emission of the nanorod enhancement film.
In one embodiment, a planarization layer in the passivation layer is used to reduce roughness and defects on the substrate. The planarization layer comprises an organic polymer, a siloxane polymer, a silicate, a metal oxide, fluorine doped tin oxide, or mixtures thereof.
In one embodiment, an inorganic layer is coated on one side of the substrate for tightly passivating the quantum rod enhancement film.
In some embodiments, an inorganic layer is coated on one side of the planarizing substrate for tight passivation of the quantum rod enhancement film.
In some embodiments, inorganic layers are coated on both sides of the substrate for tight passivation of the quantum rod enhancement film.
In some embodiments, inorganic layers are coated on both sides of the planarization substrate for tight passivation of the quantum rod enhancement film.
In one example, the inorganic layer includes a silicate, phosphosilicate.
In one example, the inorganic layer comprises a mechanically deposited frit.
In one example, the inorganic layer includes oxides and nitrides of silicon, such as SiO2、Si3N4。
In one example, the inorganic layer includes an oxide of an alkali metal. The basic metal oxide includes Al2O3、In2O3、SnO2. And so on.
In one example, the inorganic layer comprises an oxide of titanium.
In one example, the inorganic layer is a combination of two inorganic layers, e.g., TiO2/SiO2、TiO2/Al2O3。
The inorganic layer is coated on the substrate using Atomic Layer Deposition (ALD), Plasma Enhanced Chemical Vapor Deposition (PECVD), or sputter deposition.
The adhesive layer in the passivation layer is used for face-to-face lamination of two polarized emissive films (QREF), each containing emitters of different wavelengths, deposited on a single or multiple organic-inorganic passivation layers (see examples in fig. 5, 6 and 7). This structure of the film solves the re-absorption problem, where part of the emitted light is absorbed by another type of emitter.
In one embodiment, an adhesive layer (505) is used to laminate a passivated QREF film with another passivated QREF film. Wherein each passivation layer comprises a substrate (501), one inorganic layer (502) with a photo-alignment layer (503) and a QREF layer (504).
In one embodiment, an adhesive layer (606) is used to laminate the passivated QREF film with another passivated QREF film. Wherein each passivation layer comprises a substrate (601), a planarization layer (602), an inorganic layer (603) having a photo-alignment layer (604), and a QREF layer (605).
In one embodiment, an adhesive layer (707) is used to laminate the passivated QREF film with another passivated QREF film. One of the passivation layers comprises a substrate (701), one inorganic layer (703) has a light-directing layer (704) and a QREF layer (705), and the other passivation layer comprises a light guide plate as substrate (702), one inorganic layer (703) has a light-directing layer (704) and a QREF layer (705).
A light guide plate is a film used in an LCD backlight for guiding and emitting light from LEDs.
In one example, the adhesive layer includes a polymer glue. The polymer adhesive is epoxy resin, ethylene-vinyl acetate (a hot melt adhesive), phenolic resin, polyamide, polyester resin, polyethylene (a hot melt adhesive), polypropylene, polysulfide, polyurethane (e.g., Gorilla Glue), polyvinyl acetate, polyvinyl alcohol, polyvinyl chloride, polyvinyl pyrrolidone, rubber cement, silicone, silyl modified polymer, styrene acrylic copolymer.
In one example, the adhesive layer includes a monomer glue. The monomer glue is acrylonitrile, cyanoacrylate, acrylic acid or resorcinol glue.
The adhesive layer includes a glue material mixed with nanoparticles.
The nanoparticles in the adhesive layer have a certain size. In one example, the size of the nanoparticles is 400nm, 410nm, 420nm, 430nm, 440nm, 450nm, 460nm, 470nm, 480nm, 490nm, and 500 nm.
In one example, the nanoparticle sizes are 500nm, 600nm, 700nm, 800nm, 900nm, and 1 μm. In another example, the nanoparticle sizes are 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm,8 μm, 9 μm, and 10 μm. More preferably, the nanoparticles are between 410nm and 1 micron in size.
The adhesive layer comprises a glue material that can be cured by using a chemical, thermal or optical treatment.
In some embodiments, the adhesive layer comprises a UV curable adhesive.
In some embodiments, the adhesive layer comprises a heat curable adhesive
In some embodiments, the adhesive layer comprises a combination of a thermally cured adhesive and a UV cured adhesive.
In another configuration of the QREF passivation layer, there is no adhesion layer.
In one embodiment, the passivation layer comprises only one substrate (801), one protective layer (802) on top of the substrate, one alignment layer (803), one hybrid QREF layer (804), and one inorganic layer (805) layer (804) on top of the QREF.
In one embodiment, the passivation layer comprises only one substrate (901), one protective layer (902) on top of the substrate, one alignment layer (903), one hybrid QREF layer (904), one inorganic layer (905) layer (904) on top of the QREF, one organic layer (906) on top of the inorganic layer (905).
In one embodiment, the protective layer is an inorganic layer.
In one embodiment, the protective layer is a multi-layer organic-inorganic layer.
In one example, the substrate is a PET film.
In one example, the substrate is a light guide plate for an LCD backlight.
Procedure for the preparation of inorganic passivation layers.
The inorganic passivation layer may be fabricated on top of the substrate layer using sputter deposition, Atomic Layer Deposition (ALD) or Plasma Enhanced Chemical Vapor Deposition (PECVD) methods.
For ALD, any modern deposition system may be used. Thus, the Picosun Oy Sun R200 ALD, BENEQ TFS500, Sentech SI ALD LL system, Oxford Instruments open load ALD system (OpAL), Oxford Instruments FlexAl reactor is a good example of a possible apparatus. For the deposition of the inorganic layer, suitable precursors should be selected. Therefore, in order to form Al2O3Layer of trimethylaluminum with H2O is used together, and for MgO deposition, Mg (CpMe)2/H2O is a typical choice. For TiO2As the ALD layer, tetrakis (dimethylamino) titanium, tetrakis (diethylamino) titanium, tetrakis (ethylmethylamino) titanium, TiCl can be used4And novel PrimeTiTM, StarTiTM and TyALDTM precursors. For depositing SiO2Catalysts such as Lewis bases are required. NH is generally used3Or pyridine. Tetraethoxysilane (TEOS) can also be used as SiO2A precursor. Other suitable precursors are tris [ dimethylamino ]]Silane, bis [ diethylamino ]]Silane, dichlorosilane, silane AP-LTO 330 precursor, 3DMAS, BDEAS and oxygen precursors such as oxygen and nitrous oxide. The plasma deposited silicon nitride may be formed from silane and ammonia or nitrogen. Plasma enhancement can generally be achieved by Radio Frequency (RF), Alternating Current (AC), or Direct Current (DC) discharge using a corresponding tool. Deposition process parameters, including pulse time, temperature, oxygen/ozone flow rate, plasma power, and pressure, may be optimized to achieve the desired thickness and layer quality.
In the case of sputter deposition different techniques can be used. Including gas flow sputtering, reactive sputtering, ion beam sputtering, ion assisted deposition, and HiTUS and HiPIMS methods. Pulsed laser deposition can be used as a sputter deposition technique, where layer-by-layer growth can be actively controlled.
The thickness of the inorganic passivation layer should be large enough (≧ 3nm) to remain continuous. However, it should also be thin enough to have the desired properties, such as visible light transmission and flexibility.
Adhesive layer coating process
An adhesive layer coating is required to seal the two QREF layers deposited on the light alignment substrate. Thus, a photo-alignment layer is first prepared on the inorganic layer of the substrate, and then the QREF is printed on the photo-alignment layer. For adhesive layer deposition, different techniques can be applied, including but not limited to, die, bar, reverse roll, and flexible bar coating. Cold and hot melt coating machines may be used. Preferably, a low temperature adhesive layer coating process is used with subsequent UV curing after lamination. Other examples include polymer glues such as epoxy, ethylene vinyl acetate (hot melt), phenolic, polyamide, polyester, polyethylene (hot melt), polypropylene, polysulfide, polyurethane (e.g. gorilla), polyvinyl acetate, polyvinyl alcohol, polyvinyl chloride, polyvinyl pyrrolidone, rubber cement, silicones, silyl modified polymers, styrene acrylic copolymers.
Synthetic monomer glues from the series acrylonitrile, cyanoacrylate, acrylic or resorcinol glue can be used as adhesive layer materials, deposited by low temperature methods and subsequent uv curing.
Lamination procedure
After gluing, the two passivated QREFs can be laminated using various assembly jigs. Precise positioning and pressing is generally required to achieve void-free and sufficiently strong lamination contact. Generally, it is desirable to use as high a clamping pressure as possible, since the material can withstand without being crushed. Typically, a moderate pressure of 0.1 to 10MPa should be applied in a suitable press. The laminate may be placed in a suitable vacuum chamber or plastic box/bag and then evacuated-allowing atmospheric pressure to apply the clamping force and remove air bubbles from the interface of the two laminates. Curing is carried out simultaneously during the lamination process, thereby forming a hard bond of the two photo-oriented QREFs. The lamination/curing time may vary from adhesive to adhesive, typically from 1 to 60 minutes.
Fig. 10 shows the complete procedure for preparing a packaged QREF.
Testing
Water vapor transmission rate and oxygen transmission rate
In order to measure the Water Vapor Transmission Rate (WVTR) of the obtained passivation film, different techniques may be used. Thus, for initial rapid testing, the MOCON method is appropriate, allowing rapid assessment of WVTR values down to 5 × 10-2To 5X10-3gm-2Day/day depending on MOCON instruments model, such as MOCON PERMATRAN-W model 398WVTR and MOCON PERMATRAN-W700. Other more sensitive techniques, such as calcium testing and tritiated water (HTO) penetration, can be used to further refine the water permeability test. Therefore, the HTO penetration test is very sensitive, and the detection limit is as low as 10-6gm-2Day, but the Relative Humidity (RH) does not easily change in this static system. The Ca test has a higher sensitivity, although the duration of the experiment may be much longer than either of the other two techniques due to potentially long lag times (depending on the WVTR of the film). When the goal is relative comparison of different samples, increasing the temperature and/or relative humidity can speed up the measurement speed of all methods. Furthermore, this would lead to the possibility of applying MOCON instruments, since WVTR would increase significantly with increasing temperature. In any event, these conditions need to be closely matched in order to accurately compare the WVTRs of different samples.
For oxygen transmission rate measurements, different ASTM standard test methods may be applied, such as D3985, F2622, F1927 or F1307. Thus, MOCON OX-TRAN@Instrument model 2/22(10X), Coulomb sensor-equipped model 2/22(L) is an example that meets ASTM D3985 standard, and can measure down to 5X10-2To 5x10-4cc m-2The day is. Drying conditions and normalized temperature are more suitable for OTR measurement and comparison of different samples。
For both key passivation properties (WVTR and OTR), the measurements should be averaged over the appropriate number of film pieces (from each sample) to avoid sample variations such as the effects of film defects and actual differences in barrier properties from film area to film area.
Representative examples
Example 1
μ m, 60 μm, 70 μm,80 μm, 90 μm and 100 μm of the organic substrate a passivation layer was made for QREF (fig. 1) and inorganic layers of 30nm, 40nm, 50nm, 100nm, 500nm and 1 μm were coated on the organic substrate in thickness. The alignment layer is coated on the inorganic layer to a thickness of 10nm, 20nm, 30nm, 40nm, and 50 nm. Quantum rod films were deposited on the alignment layer to thicknesses of 1 μm,2 μm, 3 μm, 4 μm, 5 μm,10 μm, and 20 μm, respectively. Barrier adhesives were deposited on the cured QREF to thicknesses of 1 μm,2 μm, 3 μm, 4 μm and 5 μm,10 μm,20 μm.
MOCON PERMATRAN-W700 type WVTR test system (available from MOCON, inc., minneapolis, mn) (standardized according to ASTM F-1249/Tappi T) performed MOCON limit tests on the passivation layer units to quickly evaluate WVTR-557). The sample is placed between the dry and wet chambers to form a diffusion cell. An atmosphere with 100% RH was provided to a wet chamber (according to ASTM F1249) at a temperature of 60 ℃.
A passivation layer of μm, an inorganic layer of 200nm and a barrier adhesive layer of 10 μm, a WVTR of 4.91x10 was obtained-3g/m 2/Day, near the limit of the instrument.
In order to estimate the WVTR of the passivation layer more accurately, a Ca degradation test was performed by performing an electrical analysis on Ca metal, including a monitoring system with an automatic acquisition function, to achieve dynamic monitoring of resistivity changes. A200 nm thick Ca film with a length/width (L/W) of 40/80mm was deposited on the patterned Au electrode (100nm) in the shape of two narrow stripes. This structure is adhered to the barrier film of interest by an epoxy sealant and uv cured. The samples were placed in an oven at constant temperature (60 ℃) and humidity (100%) while electrical measurements were taken using two electrodes connected by an SMU probe and a Keithley 2420 source meter. The change in conductance over time dG/dt is used to calculate the effective WVTR value according to the following equation
Wherein n represents the molar equivalent of the degradation reaction (n ═ 2), δCaIs Ca resistivity and ρCaThe density of Ca (. about.1.55 g/cm2), dG/dt, is a linear fit of the conductance as a function of time. M [ H ]2O]And M [ Ca ]]The molar mass of the water vapour, 18amu and Ca, 40.1amu, respectively.
The rate of change of the electrical conductance of the Ca metal was plotted against time (in hours) to calculate the WVTR of the passivation layer (fig. 11). For this passivation layer, 8.06x10 was obtained-7gm-2Sky-1The WVTR of (1).
The OTR measurements were performed using a MOCON OX-TRAN model 2/22(L) (standardized according to ASTM D3985) OTR test system, using the same samples as described in example 1. The sample was placed in a cell to form a diffusion cell between the nitrogen and oxygen chambers. An atmosphere of 0% RH was supplied to an oxygen and nitrogen chamber at a temperature of 35 deg.C under a pressure of 0.1 MPa. OTR near the instrument limit of 4.93x10-3cc/m2Sky/
Depositing inorganic layers on both sides of the organic substrate did not significantly improve the WVTR and OTR values compared to single layer deposition, as shown in figure 2.
Example 2
μ m, 60 μm, 70 μm,80 μm, 90 μm and 100 μm of the organic substrate a passivation layer (fig. 3) was made for QREF and coated with a planarization layer having a thickness of 30nm, 40nm, 50nm,80nm,100nm,200nm and 500nm on the organic substrate. The inorganic layer on the planarization layer is coated to a thickness of 30nm, 40nm, 50nm, 100nm, 500nm and
the alignment layer is coated on the inorganic layer to a thickness of 10nm, 20nm, 30nm, 40nm, and 50 nm. Quantum rod films were deposited on the alignment layer to thicknesses of 1 μm,2 μm, 3 μm, 4 μm, 5 μm,10 μm, and 20 μm, respectively. Depositing the adhesive at thicknesses of 1 μm,2 μm, 3 μm, 4 μm and 5 μmm,10 μm cured QREF.
MOCON PERMATRAN-w (r) type 700 WVTR test system (available from MOCON, inc., minneapolis, mn) (standardized according to ASTM F-1249) performs MOCON limit tests on the passivation layer units to quickly evaluate WVTR/tarp T-557). The sample is placed between the dry and wet chambers to form a diffusion cell. An atmosphere with 100% RH was provided to a wet chamber (according to ASTM F1249) at a temperature of 60 ℃.
Mu.m passivation layer, 200nm planarization layer, 200nm inorganic layer and 10 mu m barrier glue layer, the obtained WVTR is 4.95x10-3g/m2Day, approaching the limit of the instrument.
The ORT measurements were performed using a MOCON OX-TRAN model 2/22(L) (standardized according to ASTM D3985) OTR test system, using the same samples as described in example 2. The sample was placed in a cell to form a diffusion cell between the nitrogen and oxygen chambers. An atmosphere of 0% RH was supplied to an oxygen and nitrogen chamber at 35 deg.C and a pressure of 0.1 MPa. OTR near the instrument limit was 4.90x10-3 cc/m2/And (5) day.
As shown in fig. 4, the deposition of the planarization layer on both sides of the organic substrate with two inorganic layers did not significantly improve the WVTR and OTR values compared to single layer deposition.
Example 3
By using a PET substrate with a thickness of 70 μm, passivation layers were made for two QREFs containing different (red and green) emitters in each QREF (fig. 5). SiO on organic substrates2 inorganic layerThe coating thickness was 200 nm. The photoalignment layer is coated on the inorganic layer and has a thickness of 10 nm. The quantum rod thin film was deposited on the alignment layer to a thickness of 20 μm. The adhesive was deposited on a cured QREF having a thickness of 10 μm. The two films obtained were laminated face to face by a homogeneous plane pressing mechanism at a pressure of about 0.4MPa in a vacuum chamber to remove air bubbles from the interface of the two laminated materials.
OTR and WVTR were measured using the same equipment as in example 1 and found to be close to the instrument limits.
Degree of polarization
QREF display due to alignment of red QR (1201) and green QR (1202) by photo-alignment layersAnd (4) polarized emission. As shown in fig. 12, the effect on QREF emission polarization degree has been examined since red QREF (1203) and green QREF (1204) are attached with an adhesive layer (1205). QREF shows a degree of polarization (DOP) of 0.75, which is expressed by DOP ═ Imax-Imin)/(Imax+Imin) Is given bymaxAnd IminIs the emission intensity through parallel polarizers and is perpendicular to their transmission axes, respectively. The variation of QREF emission intensity with polarizer axis rotation before and after lamination is shown in fig. 13. The variation in strength after lamination is very small and there are experimental errors. The calculated DOP for each film was found to be nearly similar, i.e., close to 0.75.
Color representation
Emissions from QREF can be affected by high temperatures during the various processes of making the film package. The color coordinates of QREF emission were measured before and after QREF lamination using a Konica Minolta (CS-2000) spectroradiometer as shown in fig. 14 a. No significant change was observed after attaching the two QREFs with adhesive. The emission spectra of the laminated QREF and of the QR solution used were recorded using a marine optical spectrometer (USB 4000). QREF showed no change in emission wavelength and FWHM compared to the emission of QR solution (fig. 14 b).
QREF (1501) is given in fig. 15 a. When the QREF is placed on the blue backlight (1502), the QREF displays white emission due to color mixing. Different colors can be observed using the LCD (1503) on the top QREF backlight unit.
Claims (66)
1. A passivation layer for encapsulating at least one photo-oriented quantum rod enhancement film deposited on a photo-oriented layer for use in an LCD, comprising:
i. at least one substrate;
at least one inorganic layer;
this indicates that the photo-oriented quantum rod reinforced film has good protection against oxygen and moisture.
2. The passivation layer for encapsulating a photo-oriented quantum rod enhancement film of claim 1, comprising at least one adhesion layer.
3. The passivation layer for a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises polyethylene naphthalate, polyethylene terephthalate.
4. The photo-oriented quantum rod enhancement film passivation layer of claim 1, wherein the substrate is a light guide plate for a backlight.
5. The substrate for a passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises a polymer from the family of polyesters and polyolesters.
6. A passivation layer substrate for a photo-oriented quantum rod enhancement film according to claim 1, wherein said substrate comprises a polymer from the polyvinyl chloride family.
7. The substrate for the passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises a polymer from the polysiloxane family
8. The substrate for a passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises a polymer of the ionomer family.
9. The substrate for a passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises polypropylene.
10. The substrate for a passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises a polymer from the family of fluorinated ethylenes.
11. The substrate for a passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises a polymer from the styrene methyl methacrylate family.
12. The substrate for a passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises a polymer from the styrene acrylonitrile resin family.
13. The passivation layer for a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises polystyrene.
14. The substrate for a passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises a polymer from the polyaryletherketone family.
15. The polymer of claim 14, wherein the polyaryletherketone polymer is polyetheretherketone, polyetherketoneketone, polyetheretherketoneketone, polyetherketoneetherketoneketone.
16. The substrate for a passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises a polymer from the polyimide family.
17. The substrate for a passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises a polymer from the polycarbonate family.
18. The substrate for a passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises a polymer from the cyclic olefin copolymer family.
19. The substrate for a passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises a polymer from the polysulfone family.
20. The substrate for the passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises an acrylic polymer.
21. The substrate for the passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the substrate comprises a polymer from the acrylonitrile-butadiene-styrene (ABS) family.
22. The passivation layer substrate of claim 1, wherein the substrate comprises a polymer from the Acrylonitrile Styrene Acrylate (ASA) family.
23. The substrate of a passivation layer of a photo-oriented quantum rod enhancement film of claim 1, wherein the thickness of the substrate is 50-1000 μ ι η.
24. The substrate of claim 3, wherein the substrate has a thickness of 70 μm.
25. The passivation layer substrate for a photo-oriented quantum rod enhancement film according to claim 4, wherein the thickness of the substrate is 100-400 μm.
26. The passivation layer for a photo-oriented quantum rod enhancement film of claim 1, comprising at least one planarization layer coated on the substrate.
27. The passivation layer for a photo-oriented quantum rod enhancement film of claim 26, wherein the planarization layer comprises an organic polymer, a siloxane polymer, a silicate, a metal oxide, a fluorine-doped tin oxide, or a mixture thereof.
28. The planarization layer of claim 26, wherein Al2O3 is deposited on the substrate.
29. The planarization layer of claim 28, wherein Al2O3 is deposited on the substrate to a thickness in the range of 50nm-5 μ ι η.
30. The planarization layer of claim 28, wherein the Al2O3 is deposited on the substrate to a thickness of 200 nm.
31. The passivation layer for a photo-oriented quantum rod enhancement film of claim 1, wherein the inorganic layer is coated on one side of the substrate at least for tight passivation of the photo-oriented quantum rod enhancement film.
32. The inorganic layer of claim 31, wherein the inorganic layer has a thickness in the range of 50nm-5 μ ι η.
33. The inorganic layer of claim 31, wherein the inorganic layer is 200nm thick.
34. The passivation layer for a photo-oriented quantum rod enhancement film of claim 1, wherein the inorganic layer comprises silicates, phosphosilicates, mechanically deposited glass frits, oxides and nitrides of silicon, aluminum, tin, indium, boron, and titanium.
35. The passivation layer for a photo-oriented quantum rod enhancement film of claim 1, wherein the inorganic layer comprises a combination of two different inorganic layers.
36. The inorganic layer of claim 34, wherein the inorganic layer is SiO2And (3) a layer.
37. The passivation layer for a photo-oriented quantum rod enhancement film of claim 1, wherein the passivation layer comprises a combination of organic or inorganic layers.
38. The passivation layer for a photo-oriented quantum rod enhancement film of claim 1, wherein the passivation layer comprises a combination of alternating organic and inorganic layers.
39. The passivation layer for a photo-oriented quantum rod enhancement film of claim 38, wherein the passivation layer comprises a plurality of layers having a combination of alternating organic and inorganic layers.
40. The passivation layer for a photo-oriented quantum rod enhancement film of claim 39, wherein the passivation layer comprises three layers of alternating combinations of organic and inorganic layers.
41. The passivation layer for a photo-oriented quantum rod enhancement film of claim 1, wherein the inorganic layer of claim 31 also serves as a planarization layer for the substrate of claim 26.
42. The passivation layer for a photo-oriented quantum rod enhancement film of claim 1, wherein the passivation layer comprises a substrate coated with a protective layer and another inorganic layer on top of the enhancement film.
43. The protective layer of claim 42 is an inorganic layer.
44. The passivation layer for a photo-oriented quantum rod enhancement film of claim 42, wherein the passivation layer comprises a PET substrate coated with an inorganic layer, and another inorganic layer on top of the enhancement film.
45. The passivation layer for a photo-oriented quantum rod enhancement film of claim 42, comprising a PET substrate coated with an inorganic layer, and another inorganic layer over the enhancement film and an organic layer over the inorganic layer.
46. The method of claim 44, wherein the film is a photoaligned quantum rod enhancement filmThe passivation layer is characterized in that the substrate is a PET substrate with the thickness of 70 mu m, and the inorganic layer is SiO with the thickness of 200nm2And (3) a layer.
47. The passivation layer for a photo-oriented quantum rod enhancement film of claim 42, wherein the passivation layer comprises a light guide plate as a substrate coated with an inorganic layer and another inorganic layer over the enhancement film.
48. The passivation layer for a photo-oriented quantum rod enhancement film of claim 42, comprising a light guide plate as a substrate coated with an inorganic layer, and another inorganic layer on top of the enhancement film and an organic layer on top of the inorganic layer.
49. The passivation layer of a photo-oriented quantum rod enhancement film according to claim 47, wherein the substrate is a 400 μm thick light guide plate and the inorganic layer is 200nm thick SiO2And (3) a layer.
50. The passivation layer for a photo-oriented quantum rod enhancement film of claim 1, wherein the adhesive layer is used to laminate the two photo-oriented quantum rod enhancement films deposited on the single organic-inorganic passivation layer face-to-face.
51. The passivation layer for a photo-oriented quantum rod enhancement film of claim 1, wherein the adhesive layer is used for face-to-face lamination of two photo-oriented quantum rod enhancement films deposited on the separate single organic-inorganic passivation layer, including an additional planarization layer.
52. The adhesive layer of claims 2 and 51, wherein the adhesive layer comprises a polymer glue.
53. The adhesive layer of claims 2 and 52, wherein the polymer Glue is epoxy, ethylene vinyl acetate (hot melt), phenolic, polyamide, polyester, polyethylene (hot melt), polypropylene, polysulfide, polyurethane (e.g., Gorilla Glue), polyvinyl acetate, polyvinyl alcohol, polyvinyl chloride, polyvinyl pyrrolidone, rubber cement, silicone, silyl modified polymers, styrene acrylic copolymers are mixtures thereof.
54. The adhesive layer of claims 2 and 51, wherein the adhesive layer comprises a monomer glue.
55. The adhesive layer of claim 54 wherein the monomer glue is an acrylonitrile, cyanoacrylate, acrylic or resorcinol glue.
56. The adhesive layer of claims 2 and 51, wherein the adhesive layer comprises a glue material that can be thermally or optically cured or dry cured.
57. The adhesive layer of claims 2 and 51, wherein the adhesive layer comprises a UV cured adhesive.
58. The adhesive layer of claims 2 and 51, wherein the adhesive layer thickness is in the range of 2-30 μm.
59. The adhesive layer of claims 2 and 49, wherein the adhesive layer comprises nanoparticles.
60. The passivation layer of a photo-oriented quantum rod enhancement film according to claims 1 and 2, wherein the substrate is a PET substrate and the inorganic layer is SiO2And the adhesive layer is a UV curing adhesive layer.
61. The passivation layer of a photo-oriented quantum rod enhancement film according to claim 60, wherein the substrate is a PET substrate with a thickness of 70 μm and the inorganic layer is SiO with a thickness of 200nm2The adhesive layer is 10m thickThe UV curable adhesive layer of (1).
62. The passivation layer for a photo-oriented quantum rod enhancement film according to claims 1 and 2, wherein the substrate is a light guide plate and the inorganic layer is SiO2And the adhesive layer is an ultraviolet light polymerization adhesive layer.
63. The passivation layer of an optical oriented quantum rod enhancement film of claim 60, wherein the substrate is a 400 μm thick light guide plate and the inorganic layer is 200nm thick SiO2Layer, the adhesive layer is a UV-curing adhesive layer with a thickness of 10 m.
64. The passivation layer for a photo-oriented quantum rod enhancement film according to claims 1 and 2, wherein one substrate is a PET substrate, the other substrate is a light guide plate, and the inorganic layer is SiO2The adhesive layer is a UV curable adhesive.
65. The passivation layer of an optical oriented quantum rod enhancement film of claim 64, wherein the substrate is a PET substrate with a thickness of 70 μm, the other substrate is a light guide plate with a thickness of 400 μm, and the inorganic layer is SiO with a thickness of 200nm2Layer, the adhesive layer is a UV-curable adhesive layer with a thickness of 10 m.
66. The passivation layer for a photo-oriented quantum rod enhancement film of claim 60 having WVTR and OTR properties of 8.06x10, respectively-7g m-2Sky-1and 4.93x10-3cc/m2The day is.
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| CN109298562A (en) * | 2018-11-26 | 2019-02-01 | 昆山龙腾光电有限公司 | Quantum rod film and preparation method thereof, liquid crystal display device |
| CN109313366A (en) * | 2016-05-10 | 2019-02-05 | 香港科技大学 | Light orientation quantum rod enhances film |
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2019
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- 2019-08-16 WO PCT/CN2019/100910 patent/WO2021030926A1/en active Application Filing
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| US20170276854A1 (en) * | 2016-03-24 | 2017-09-28 | Samsung Display Co., Ltd. | Display device and method for fabricating the same |
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