CN114340350A - Intelligent incubator - Google Patents
Intelligent incubator Download PDFInfo
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- CN114340350A CN114340350A CN202111680808.5A CN202111680808A CN114340350A CN 114340350 A CN114340350 A CN 114340350A CN 202111680808 A CN202111680808 A CN 202111680808A CN 114340350 A CN114340350 A CN 114340350A
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Abstract
The invention provides an intelligent incubator, comprising: the shell is a cubic shell which is formed by connecting five side walls and is provided with an opening at one side, the side walls are made of magnetic field shielding materials, and each side wall is provided with a heat insulation interlayer; the incubator door is hinged with the shell, and when the incubator door is closed, the incubator door closes the opening of the shell; the wave-absorbing material is arranged on the inner side of the side wall of the top of the shell; and the heating and refrigerating device is arranged on one side wall and is used for heating or refrigerating the inner space of the shell. The intelligent incubator provided by the invention can shield external electromagnetic interference signals and improve the accuracy of product performance judgment in the high-low temperature environment testing process.
Description
Technical Field
The invention relates to the technical field of testing, in particular to an intelligent incubator.
Background
When performing radio frequency testing on electronic products, in order to verify the performance status of the electronic products in high-temperature and low-temperature environments, radio frequency testing is generally performed in a high-temperature and low-temperature chamber. In the prior art, a box body is generally made of a material with a heat insulation interlayer, and a heating or cooling device is arranged in the box body, so that the temperature in the incubator is controlled to be in a preset constant temperature state during the test.
However, in the radio frequency test process of the electronic device, the device is easily interfered by external signals, so that the judgment of the product performance is inaccurate, and the test efficiency is influenced.
Disclosure of Invention
The intelligent incubator provided by the invention can shield external electromagnetic interference signals in the high-low temperature environment test process, and improves the accuracy of product performance judgment.
The invention provides an intelligent incubator, comprising:
the shell is a cubic shell which is formed by connecting five side walls and is provided with an opening at one side, the side walls are made of magnetic field shielding materials, and each side wall is provided with a heat insulation interlayer;
the incubator door is hinged with the shell, and when the incubator door is closed, the incubator door closes the opening of the shell;
the wave-absorbing material is arranged on the inner side of the side wall of the top of the shell;
and the heating and refrigerating device is arranged on one side wall and is used for heating or refrigerating the inner space of the shell.
Optionally, the heating and cooling device comprises an external fan, a first radiator, a first heat conduction block, a semiconductor heating and cooling sheet, a second heat conduction block, a second radiator and an internal fan, which are arranged in sequence from outside to inside; wherein the content of the first and second substances,
one side wall of the shell is provided with a through hole, the semiconductor heating and refrigerating piece is arranged in the through hole, and the first heat conduction block and the second heat conduction block are matched with the through hole and are in contact with the semiconductor heating and refrigerating piece.
Optionally, the electronic device further comprises a control circuit module, wherein the control circuit module comprises:
an embedded controller;
the temperature control unit is in communication connection with the embedded controller, receives a control signal sent by the embedded controller, and controls the rotating speed of the external fan, the rotating speed of the internal fan and the output power of the semiconductor heating and refrigerating sheet according to the control signal;
the temperature acquisition unit comprises a first temperature sensor arranged on the first heat conduction block, a second temperature sensor arranged on the second heat conduction block and a third temperature sensor arranged in the shell; the first temperature sensor, the second temperature sensor and the third temperature sensor are in communication connection with the embedded controller.
Optionally, the temperature control unit comprises an H-bridge circuit and a constant current source;
the constant current source is used for providing constant current for the heating and refrigerating piece;
the H-bridge circuit is used for controlling the switching between a heating mode and a cooling mode of the heating and cooling piece.
Optionally, the control circuit module further includes a touch display screen; the touch display screen is in communication connection with the embedded controller.
Optionally, the control circuit module has a power interface for electrically connecting with an external power source.
Optionally, the intelligent incubator further comprises a radio frequency line interface, and the radio frequency line interface is used for communication connection between the equipment to be tested in the incubator and an external instrument, so that the external instrument can detect the communication performance of the equipment to be tested in the high-temperature and low-temperature environment.
Optionally, the control circuit further includes a communication interface, the communication interface is in communication connection with the embedded controller, and the communication interface can be in communication connection with an upper computer, so that the upper computer sends a control instruction to the embedded controller remotely.
Optionally, a rack is arranged in the housing, and the rack is arranged below the internal fan.
Optionally, a transparent observation window is arranged on the incubator door;
the shell is provided with a latch groove, the temperature box door is provided with a latch, and the latch is matched with the latch groove; the bolt is matched with the bolt groove to enable the incubator door to be closed;
and a sealing strip is arranged on one side of the opening of the shell, and when the incubator door is closed, the sealing strip is extruded to enable the space in the shell to be airtight.
According to the technical scheme provided by the invention, the shielding material and the heat insulation interlayer are adopted to shield the external signals, and the extremely low heat exchange efficiency between the interior of the incubator and the external environment is ensured, so that the external signals can be shielded in the high-temperature environment and the low-temperature environment in the incubator. Meanwhile, in the technical scheme provided by the invention, the wave absorbing material is arranged on the top layer, so that the wave absorbing material has better bandwidth wave absorbing performance under the conditions of vertical incidence and oblique incidence of electromagnetic waves, and the influence of the electromagnetic waves on the test process is avoided.
Drawings
FIG. 1 is a schematic cross-sectional view of an intelligent incubator according to an embodiment of the invention;
FIG. 2 is a schematic perspective view of an intelligent incubator according to an embodiment of the invention;
fig. 3 is a schematic diagram of a control circuit module of the intelligent incubator according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the present invention provides an intelligent incubator, as shown in fig. 1 to 3, including:
the shell 100 is a cubic shell 100 which is formed by connecting five side walls and is provided with an opening at one side, the side walls are made of magnetic field shielding materials, and each side wall is provided with a heat insulation interlayer; in some embodiments, the incubator housing 100 is made of solid aluminum, which is capable of shielding magnetic fields. Every lateral wall of incubator casing 100 all has the intermediate layer, the intermediate layer adopts polystyrene foam material to fill, and polystyrene foam material has better thermal insulation performance.
The oven door 300 is hinged to the housing 100, and when the oven door 300 is closed, the opening of the housing 100 is closed by the oven door 300;
the wave-absorbing material 101 is arranged on the inner side of the top side wall of the shell 100; in some embodiments, the wave-absorbing material is arranged on the top layer in the incubator, is an MAT type wave-absorbing material, and has good bandwidth wave-absorbing performance under the conditions of vertical incidence and oblique incidence of electromagnetic waves. The working temperature of the MAT type wave-absorbing material is-50-100 ℃, and the MAT type wave-absorbing material is suitable for the high-low temperature test requirements of most electronic products.
And a heating and cooling device provided on one of the sidewalls for heating or cooling the inner space of the casing 100. In some embodiments, the heating and cooling device may use the semiconductor heating and cooling plate 201 to heat and cool.
In the technical scheme that this embodiment provided, adopt shielding material and thermal-insulated intermediate layer to shield ambient signal, guarantee simultaneously that the incubator is interior to have extremely low heat exchange efficiency with external environment to, can ensure that can also shield ambient signal under high low temperature environment in the incubator. Meanwhile, in the technical scheme provided by the embodiment, the wave absorbing material is arranged on the top layer, so that the wave absorbing material has good bandwidth wave absorbing performance under the conditions of vertical incidence and oblique incidence of electromagnetic waves, and the influence of the electromagnetic waves on the test process is avoided.
As an optional embodiment, the heating and cooling device includes an external fan 205, a first heat sink 204, a first heat-conducting block 202, a semiconductor heating and cooling fin 201, a second heat-conducting block 206, a second heat sink 208, and an internal fan 209, which are arranged in sequence from outside to inside; wherein the content of the first and second substances,
a through hole is formed in one of the side walls of the casing 100, the semiconductor heating and cooling plate 201 is disposed in the through hole, and the first heat conduction block 202 and the second heat conduction block 206 are adapted to the through hole and contact with the semiconductor heating and cooling plate 201.
In some embodiments, the semiconductor heating and cooling plate 201 may adopt, for example, a four-stage TEC-12706 series, and the heating and cooling temperature reaches-40 ℃ to 85 ℃, which can meet the test requirements of most electronic products. The semiconductor heating and refrigerating piece 201 has the characteristics of small volume, high response speed, high precision, no refrigerant, easiness in heating and refrigerating conversion and the like.
As an optional implementation, the apparatus further includes a control circuit module 400, where the control circuit module 400 includes:
an embedded controller;
the temperature control unit is in communication connection with the embedded controller, receives a control signal sent by the embedded controller, and controls the rotating speed of the external fan 205, the rotating speed of the internal fan 209 and the output power of the semiconductor heating and refrigerating sheet 201 according to the control signal; in some embodiments, the embedded controller is electrically connected to the temperature control unit, and the embedded controller controls the temperature in the temperature chamber by outputting a PWM wave to the temperature control unit. The PWM wave is divided into a first PWM wave, a second PWM wave and a third PWM wave. The first PWM wave controls the speed of the external fan 205, the second PWM wave controls the speed of the internal fan 209, and the third PWM wave controls the output power of the TEC.
The temperature acquisition unit comprises a first temperature sensor 203 arranged on the first heat conduction block 202, a second temperature sensor 207 arranged on the second heat conduction block 206 and a third temperature sensor 102 arranged in the shell; the first temperature sensor 203, the second temperature sensor 207 and the third temperature sensor 102 are in communication connection with the embedded controller. In some embodiments, the temperature acquisition unit comprises 3 temperature sensors. The first temperature sensor 203 is used for detecting the temperature of the first heat-conducting block 202 on the semiconductor heating and refrigerating sheet 201, the second temperature sensor 207 is used for detecting the temperature of the second heat-conducting block 206 on the semiconductor heating and refrigerating sheet 201, and the third temperature sensor 102 is used for detecting the temperature in the refrigerator. The temperature acquisition unit can measure temperature by combining a Pt100 temperature sensor and a temperature acquisition chip MAV6675, for example, and the temperature acquisition chip MAV6675 internally obeys SPI protocol and can be in communication connection with a data end of the embedded controller. The temperature acquisition unit converts the three acquired temperature values into voltage signals by using a temperature acquisition circuit, the embedded controller calculates the deviation between a temperature set value and an actually measured value according to the received voltage signals, controls a third PWM wave to adjust the output power of the TEC by using a BP-PID algorithm, and controls the first PWM wave and the second PWM wave to control the rotating speed of the inner fan and the outer fan to adjust the temperature in the box when the deviation between the temperature set value and the actually measured value is more than 3 ℃, so that the working efficiency of the incubator is improved.
The control circuit module 400 is electrically connected with the incubator power supply 401; the incubator power supply 401 is used for controlling the incubator to be in two states of opening and closing.
As an alternative embodiment, the temperature control unit includes an H-bridge circuit and a constant current source;
the constant current source is used for providing constant current for the heating and refrigerating sheet 201; in some embodiments, the constant current source circuit is electrically connected to the semiconductor heating and cooling plate 201 through an H-bridge circuit, and is used for supplying a constant current to the semiconductor heating and cooling plate 201.
The H-bridge circuit is used for controlling the switching between the heating mode and the cooling mode of the heating and cooling plate 201. In some embodiments, the H-bridge circuit is used to control TEC heating and cooling switching, and the embedded controller controls TEC heating or cooling to maintain a constant temperature by controlling the H-bridge circuit. In the H-bridge circuit, in order to reduce heat generation, 4N-channel MOSFETs are preferably used to form the H-bridge circuit.
As an optional implementation, the control circuit module 400 further includes a touch display screen 402; the touch display screen 402 is in communication with the embedded controller. In some embodiments, the embedded controller is electrically connected to the touch screen 402, the touch screen 402 can display the real-time temperature inside the incubator, and the touch screen 402 can set the temperature inside the incubator by touching the keys.
As an alternative embodiment, the control circuit module 400 has a power interface 405, and the power interface 405 is used for electrically connecting with an external power source. In some embodiments, the power interface 405 may be connected to an external power device to meet the power demand of the device under test.
As an optional implementation manner, the intelligent incubator further has a radio frequency line interface 403, where the radio frequency line interface 403 is used for communication connection between the device to be tested in the incubator and an external instrument, so that the external instrument can detect communication performance of the device to be tested in a high-temperature and low-temperature environment. In some embodiments, the radio frequency interface can be used for connecting a plurality of radio frequency lines, so as to meet the multi-antenna test requirement of the communication product.
As an optional implementation manner, the control circuit further has a communication interface 404, the communication interface 403 is communicatively connected to the embedded controller, and the communication interface 404 is communicatively connected to an upper computer, so that the upper computer sends a control instruction to the embedded controller remotely. In some embodiments, the embedded controller may be electrically connected to a PC through the RS232 communication interface 404, and the temperature inside the incubator may also be set through a human-machine interface on the PC.
As an alternative embodiment, a rack 500 is disposed in the housing 100, and the rack 500 is disposed below the inner fan 209. In some embodiments, the rack 500 is disposed in the housing 100 to support the electronic device 600 to be tested, so that the electronic device 600 to be tested is aligned with the air outlet of the internal fan 209, and the electronic device 600 to be tested can be in a suspended and constant temperature state.
As an alternative embodiment, the oven door 300 is provided with a transparent viewing window 301; the shell 100 is provided with a latch slot 104, the incubator door 300 is provided with a latch 302, and the latch 302 is matched with the latch slot 104; the bolt 302 is matched with the bolt groove 104, so that the incubator door 300 can be closed; the sealing strip 103 is arranged on one side of the opening of the shell 100, and when the incubator door 300 is closed, the sealing strip 103 is extruded to seal the space in the shell 100. In some embodiments, the observation window 301 is embedded in the oven door 300, so that the state of the device under test can be observed; the bolt 302 may be inserted into a bolt slot. Sealing strips 103 are arranged on the frame of the incubator door 300 and the frame of the incubator opening, so that the incubator has a good heat preservation effect.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. An intelligent incubator, comprising:
the shell is a cubic shell which is formed by connecting five side walls and is provided with an opening at one side, the side walls are made of magnetic field shielding materials, and each side wall is provided with a heat insulation interlayer;
the incubator door is hinged with the shell, and when the incubator door is closed, the incubator door closes the opening of the shell;
the wave-absorbing material is arranged on the inner side of the side wall of the top of the shell;
and the heating and refrigerating device is arranged on one side wall and is used for heating or refrigerating the inner space of the shell.
2. The intelligent incubator according to claim 1, wherein the heating and cooling device comprises an external fan, a first heat sink, a first heat conducting block, a semiconductor heating and cooling fin, a second heat conducting block, a second heat sink and an internal fan, which are arranged in sequence from outside to inside; wherein the content of the first and second substances,
one side wall of the shell is provided with a through hole, the semiconductor heating and refrigerating piece is arranged in the through hole, and the first heat conduction block and the second heat conduction block are matched with the through hole and are in contact with the semiconductor heating and refrigerating piece.
3. The intelligent incubator of claim 2, further comprising a control circuit module, the control circuit module comprising:
an embedded controller;
the temperature control unit is in communication connection with the embedded controller, receives a control signal sent by the embedded controller, and controls the rotating speed of the external fan, the rotating speed of the internal fan and the output power of the semiconductor heating and refrigerating sheet according to the control signal;
the temperature acquisition unit comprises a first temperature sensor arranged on the first heat conduction block, a second temperature sensor arranged on the second heat conduction block and a third temperature sensor arranged in the shell; the first temperature sensor, the second temperature sensor and the third temperature sensor are in communication connection with the embedded controller.
4. The intelligent incubator according to claim 3, wherein the temperature control unit comprises an H-bridge circuit and a constant current source;
the constant current source is used for providing constant current for the heating and refrigerating piece;
the H-bridge circuit is used for controlling the switching between a heating mode and a cooling mode of the heating and cooling piece.
5. The intelligent incubator of claim 3, wherein the control circuit module further comprises a touch display screen; the touch display screen is in communication connection with the embedded controller.
6. The intelligent incubator of claim 3, wherein the control circuit module has a power interface for electrical connection with an external power source.
7. The intelligent incubator according to claim 1, further comprising a radio frequency line interface, wherein the radio frequency line interface is used for communication connection between the device to be tested in the incubator and an external instrument, so that the external instrument can detect communication performance of the device to be tested in high and low temperature environments. .
8. The intelligent incubator according to claim 3, wherein the control circuit further comprises a communication interface, the communication interface is in communication connection with the embedded controller, and the communication interface can be in communication connection with an upper computer, so that the upper computer sends control instructions to the embedded controller remotely.
9. The intelligent incubator of claim 1, wherein a shelf is disposed within the housing, the shelf being disposed below the internal fan.
10. The intelligent incubator according to claim 1, wherein a transparent observation window is provided on the incubator door; the shell is provided with a latch groove, the temperature box door is provided with a latch, and the latch is matched with the latch groove; the bolt is matched with the bolt groove to enable the incubator door to be closed; and a sealing strip is arranged on one side of the opening of the shell, and when the incubator door is closed, the sealing strip is extruded to enable the space in the shell to be airtight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111680808.5A CN114340350A (en) | 2021-12-31 | 2021-12-31 | Intelligent incubator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111680808.5A CN114340350A (en) | 2021-12-31 | 2021-12-31 | Intelligent incubator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114340350A true CN114340350A (en) | 2022-04-12 |
Family
ID=81022669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111680808.5A Pending CN114340350A (en) | 2021-12-31 | 2021-12-31 | Intelligent incubator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114340350A (en) |
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2021
- 2021-12-31 CN CN202111680808.5A patent/CN114340350A/en active Pending
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