CN114340244B - Electronic device and method of assembling the same - Google Patents
Electronic device and method of assembling the same Download PDFInfo
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- CN114340244B CN114340244B CN202011056596.9A CN202011056596A CN114340244B CN 114340244 B CN114340244 B CN 114340244B CN 202011056596 A CN202011056596 A CN 202011056596A CN 114340244 B CN114340244 B CN 114340244B
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- circuit board
- bottom wall
- adhesive layer
- electronic device
- bonding layer
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000012790 adhesive layer Substances 0.000 claims abstract description 96
- 239000010410 layer Substances 0.000 claims abstract description 67
- 238000004378 air conditioning Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Abstract
The application provides an electronic device and an assembly method thereof. The first adhesive layer is arranged on one side of the first bottom wall. The circuit board is arranged on one side of the first bonding layer, which is away from the first bottom wall, and the orthographic projection of the circuit board on the first bottom wall is positioned in the orthographic projection of the first bonding layer on the first bottom wall. The second shell is arranged on one side, away from the first shell, of the circuit board and comprises a second bottom wall. And one end of the second bonding layer is bonded with the second bottom wall, the other opposite end of the second bonding layer is bonded with the circuit board, and the orthographic projection of the circuit board on the second bottom wall is positioned in the orthographic projection of the second bonding layer on the second bottom wall. The first bonding layer and the second bonding layer are respectively added on the two opposite sides of the circuit board, so that the connection performance of the circuit board is improved. And secondly, the thickness of the circuit board can be increased by phase change, so that the overall strength of the electronic equipment is improved.
Description
Technical Field
The application belongs to the technical field of electronic products, and particularly relates to electronic equipment and an assembly method thereof.
Background
With the continuous development of electronic products, the electronic products are popular with the majority of users due to portability and rich and varied operability. But at the same time, the expected value and the requirement of users on electronic products are also higher and higher. For example, in the electronic device, a circuit board is usually fixed by a screw, but only the connection performance of the screw fixing part is better, and the connection performance of other parts is poorer, so that the overall strength of the structural member is reduced.
Disclosure of Invention
In view of this, a first aspect of the present application provides an electronic device, comprising:
a first housing including a first bottom wall;
the first bonding layer is arranged on one side of the first bottom wall;
the circuit board is arranged on one side of the first bonding layer, which is away from the first bottom wall, and the orthographic projection of the circuit board on the first bottom wall is positioned in the orthographic projection of the first bonding layer on the first bottom wall;
the second shell is covered with the first shell, the second shell is arranged on one side of the circuit board, which is away from the first shell, and the second shell comprises a second bottom wall; a kind of electronic device with high-pressure air-conditioning system
The second adhesive layer, the one end bonding of second adhesive layer the second diapire, the opposite other end bonding of second adhesive layer the circuit board, just the orthographic projection of circuit board on the second diapire is located the second adhesive layer is in the orthographic projection on the second diapire.
According to the electronic equipment provided by the first aspect of the application, the first bonding layer and the second bonding layer are respectively additionally arranged on the two opposite sides of the circuit board, so that the first shell and the circuit board are respectively bonded on the two opposite sides of the first bonding layer, and the second shell and the circuit board are respectively bonded on the two opposite sides of the second bonding layer. Meanwhile, the orthographic projection of the circuit board on the first bottom wall is positioned in the orthographic projection of the first bonding layer on the first bottom wall, and the orthographic projection of the circuit board on the second bottom wall is positioned in the orthographic projection of the second bonding layer on the second bottom wall. Therefore, the bonding and fixing area of the circuit board can be increased, and the surfaces of the two opposite sides of the circuit board can be bonded and fixed, so that the connection performance of the circuit board is improved. Secondly, the arrangement of the first bonding layer and the second bonding layer can change the phase to increase the thickness of the circuit board, so that the electronic equipment is more difficult to bend, the integral strength of the electronic equipment is improved, and the protection performance of the circuit board is improved.
The first bottom wall comprises a body and a first positioning part, the first positioning part is arranged on one side, close to the circuit board, of the body, a second positioning part is arranged on one side, close to the first bottom wall, of the circuit board, and the first positioning part and the second positioning part are matched with each other so that the circuit board is connected with the first bonding layer.
The circuit board is provided with a positioning groove, wherein a positioning column is arranged on one side of the body, which is close to the circuit board, and a positioning groove is arranged on one side of the circuit board, which is close to the body; an overflow groove is formed in one side, away from the body, of the positioning column, and part of the first bonding layer is arranged in the overflow groove.
The circuit board is characterized in that a positioning column is arranged on one side, close to the circuit board, of the body, a positioning hole is formed on one side, close to the body, of the circuit board, and part of the first bonding layer is arranged on one side, deviating from the first bottom wall, of the circuit board.
The first shell further comprises a first side wall connected with the first bottom wall in a bending mode, one end of the first bonding layer is bonded with the first side wall, and the other end, opposite to the first bonding layer, of the first bonding layer is bonded with the circuit board.
The second shell further comprises a second side wall which is connected with the second bottom wall in a bending mode, one end of the second bonding layer is bonded with the second side wall, and the other end, opposite to the second bonding layer, of the second bonding layer is bonded with the circuit board.
The electronic equipment further comprises a power supply close to the circuit board, the circuit board is electrically connected with the power supply, one end of the power supply is bonded with the first bonding layer, and the other opposite end of the power supply is bonded with the second bonding layer.
Wherein, the orthographic projection of the power supply on the first bottom wall is positioned in the orthographic projection of the first bonding layer on the first bottom wall.
Wherein, the orthographic projection of the power supply on the second bottom wall is positioned in the orthographic projection of the second bonding layer on the second bottom wall.
The surface of the power supply, which is close to the first bottom wall, is higher than the surface of the circuit board, which is close to the first bottom wall.
A second aspect of the present application provides an assembling method of an electronic device, including:
a first housing is provided, the first housing including a first bottom wall, a first adhesive layer being formed on one side of the first bottom wall.
Providing a circuit board, and enabling the circuit board to be arranged on one side of the first bonding layer, which is away from the first bottom wall, and enabling orthographic projection of the circuit board on the first bottom wall to be located in orthographic projection of the first bonding layer on the first bottom wall.
A second housing is provided, the second housing including a second bottom wall, a second adhesive layer being formed on one side of the second bottom wall.
And enabling the second shell to cover the first shell, enabling the second bonding layer to be connected with the circuit board, and enabling the orthographic projection of the circuit board on the second bottom wall to be located in the orthographic projection of the second bonding layer on the second bottom wall.
According to the assembly method provided by the second aspect of the application, the first bonding layer and the second bonding layer are additionally arranged on the two opposite sides of the circuit board, so that the two opposite sides of the first bonding layer are respectively bonded with the first shell and the circuit board, and the two opposite sides of the second bonding layer are respectively bonded with the second shell and the circuit board. Meanwhile, the orthographic projection of the circuit board on the first bottom wall is positioned in the orthographic projection of the first bonding layer on the first bottom wall, and the orthographic projection of the circuit board on the second bottom wall is positioned in the orthographic projection of the second bonding layer on the second bottom wall. Therefore, the bonding and fixing area of the circuit board can be increased, and the surfaces of the two opposite sides of the circuit board can be bonded and fixed, so that the connection performance of the circuit board is improved. Secondly, the arrangement of the first bonding layer and the second bonding layer can change the phase to increase the thickness of the circuit board, so that the electronic equipment is more difficult to bend, the integral strength of the electronic equipment is improved, and the protection performance of the circuit board is improved.
Drawings
In order to more clearly explain the technical solutions in the embodiments of the present application, the drawings that are used in the embodiments of the present application will be described below.
Fig. 1 is a schematic view of a part of an electronic device according to an embodiment of the application.
Fig. 2 is a schematic view of a part of an electronic device according to another embodiment of the application.
Fig. 3 is a schematic view of a part of an electronic device according to another embodiment of the application.
Fig. 4 is a schematic view of a part of an electronic device according to another embodiment of the application.
Fig. 5 is a schematic view of a part of an electronic device according to another embodiment of the application.
Fig. 6 is a schematic view of a part of an electronic device according to another embodiment of the application.
Fig. 7 is an exploded view of an electronic device according to an embodiment of the present application.
Fig. 8 is a schematic view of a part of an electronic device according to another embodiment of the present application.
Fig. 9 is a schematic view of a part of an electronic device according to another embodiment of the present application.
Fig. 10 is a schematic view of a part of an electronic device according to another embodiment of the present application.
Fig. 11 is a process flow diagram of an assembly method of an electronic device according to an embodiment of the application.
Description of the reference numerals:
the electronic equipment comprises an electronic device-1, a first shell-10, a first bottom wall-11, a body-12, a first positioning part-13, an overflow groove-14, a first side wall-15, a first bonding layer-20, a circuit board-30, a second positioning part-31, a second bonding layer-40, a second shell-50, a second bottom wall-51, a second side wall-52 and a power supply-60.
Detailed Description
The following are preferred embodiments of the present application, and it should be noted that modifications and variations can be made by those skilled in the art without departing from the principle of the present application, and these modifications and variations are also considered as the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic diagram of a portion of an electronic device according to an embodiment of the application. The present embodiment provides an electronic apparatus 1 including a first case 10, a first adhesive layer 20, a circuit board 30, a second case 50, and a second adhesive layer 40. Wherein the first housing 10 comprises a first bottom wall 11. The first adhesive layer 20 is provided on one side of the first bottom wall 11. The circuit board 30 is disposed on a side of the first adhesive layer 20 facing away from the first bottom wall 11, and an orthographic projection of the circuit board 30 on the first bottom wall 11 is located in an orthographic projection of the first adhesive layer 20 on the first bottom wall 11. The second housing 50 is covered with the first housing 10, the second housing 50 is disposed on a side of the circuit board 30 facing away from the first housing 10, and the second housing 50 includes a second bottom wall 51. One end of the second adhesive layer 40 is adhered to the second bottom wall 51, the opposite end of the second adhesive layer 40 is adhered to the circuit board 30, and the orthographic projection of the circuit board 30 on the second bottom wall 51 is located in the orthographic projection of the second adhesive layer 40 on the second bottom wall 51.
The electronic device 1 provided by the application includes, but is not limited to, an anti-lost patch. The anti-lost tag is an electronic device 1 that can conveniently find the position of a lost object. In particular, the anti-lost tag may be attached to an object or the anti-lost tag may be integrated on the object. The anti-lost tag is internally provided with a circuit board 30, and a plurality of circuit modules are arranged on the circuit board 30 and continuously transmit data signals outwards. When the object is lost, other electronic devices 1, such as a cell phone, may be used to receive the data signal. When the mobile phone receives the data signal, the mobile phone can obtain the position of the anti-lost tag, so that a user can find the anti-lost tag faster and simpler and further find the object.
The conventional anti-lost tag generally includes a first housing 10 to which a circuit board 30 is screw-fixed, thereby improving the fixing performance of the circuit board 30. Meanwhile, part of the circuit board 30 can be wrapped by the steel sheet, so that the circuit board 30 is better protected, the overall strength of the circuit board 30 is improved, and the phenomenon that the circuit board 30 is damaged due to bending of the electronic equipment 1 is prevented. Finally, the second shell 50 is covered on the first shell 10, so that the anti-lost label is packaged. However, the connection of the part of the circuit board 30 which is fixed only by the screw is better, and the connection performance of the rest of the circuit board 30 which is not fixed by the screw is poorer. In addition, although wrapping the circuit board 30 with a steel sheet can prevent the circuit board 30 from being bent, this not only increases the weight of the electronic apparatus 1, but also increases the cost and the difficulty in assembling the electronic apparatus 1.
In view of this, in the electronic device 1 provided in this embodiment, the first adhesive layer 20 and the second adhesive layer 40 are added to the opposite sides of the circuit board 30, so that the opposite sides of the first adhesive layer 20 are respectively bonded to the first housing 10 and the circuit board 30, and the opposite sides of the second adhesive layer 40 are respectively bonded to the second housing 50 and the circuit board 30. At the same time, the front projection of the circuit board 30 on the first bottom wall 11 can be positioned in the front projection of the first bonding layer 20 on the first bottom wall 11, and the front projection of the circuit board 30 on the second bottom wall 51 can be positioned in the front projection of the second bonding layer 40 on the second bottom wall 51. It is also understood that the area of the first adhesive layer 20 is not smaller than the area of one side of the circuit board 30 and the area of the second adhesive layer 40 is not smaller than the area of the other side of the circuit board, thereby achieving a full-coverage adhesion of the adhesive layer to the circuit board 30. Therefore, the bonding and fixing area of the circuit board 30 can be increased, and the surfaces of the two opposite sides of the circuit board 30 can be bonded and fixed, so that the connection performance of the circuit board 30 is improved. Secondly, the arrangement of the first bonding layer 20 and the second bonding layer 40 can change the phase to increase the thickness of the circuit board 30, so that the electronic equipment 1 is more difficult to bend, the overall strength of the electronic equipment 1 is improved, and the protection performance of the circuit board 30 is improved.
In summary, in the electronic device 1 provided in this embodiment, the first adhesive layer 20 and the second adhesive layer 40 are added on two opposite sides of the circuit board 30, so that the connection performance of the circuit board 30 can be improved, the overall strength of the circuit board 30 can be improved, and the cost and the assembly difficulty of the electronic device 1 can be reduced.
Optionally, the materials of the first adhesive layer 20 and the second adhesive layer 40 include, but are not limited to, silicone.
Optionally, this embodiment is illustrated by the front projection of the circuit board 30 on the first bottom wall 11 overlapping the front projection of the first adhesive layer 20 on the first bottom wall 11, and the front projection of the circuit board 30 on the second bottom wall 51 overlapping the front projection of the second adhesive layer 40 on the second bottom wall 51.
Referring to fig. 2-3 together, fig. 2 is a schematic diagram illustrating a part of an electronic device according to another embodiment of the application. Fig. 3 is a schematic view of a part of an electronic device according to another embodiment of the application. In this embodiment, the first bottom wall 11 includes a body 12 and a first positioning portion 13, the first positioning portion 13 is disposed on a side of the body 12 close to the circuit board 30, a second positioning portion 31 is disposed on a side of the circuit board 30 close to the first bottom wall 11, and the first positioning portion 13 and the second positioning portion 31 cooperate with each other to connect the circuit board 30 to the first adhesive layer 20.
In order to make it possible to better locate the circuit board 30 with the first housing 10 and the first adhesive layer 20, in this embodiment, the first bottom wall 11 may include a body 12 and a first locating portion 13, where the body 12 is used to carry the first adhesive layer 20 and the first locating portion 13. The circuit board 30 is provided with a second positioning portion 31 at a side close to the first bottom wall 11, and the first positioning portion 13 and the second positioning portion 31 cooperate with each other to enable the circuit board 30 to be positioned and connected with the first adhesive layer 20. By the cooperation of the first positioning portion 13 and the second positioning portion 31, the mounting accuracy of the circuit board 30 can be improved.
Alternatively, the first positioning portion 13 may be a positioning post or a positioning groove, and the second positioning portion 31 may be a positioning groove or a positioning post. Further alternatively, as shown in fig. 2, when the first positioning portion 13 is a positioning post, the second positioning portion 31 is a positioning groove. As shown in fig. 3, when the first positioning portion 13 is a positioning groove, the second positioning portion 31 is a positioning post. Of course, the first positioning portion 13 and the second positioning portion 31 may have other configurations, and the present application is not limited thereto.
Alternatively, since the first positioning portion 13 is provided upstream of the body 12, the first adhesive layer 20 may be provided only on the body 12, or the first adhesive layer 20 may be provided on the body 12 and the first positioning portion 13, thereby further improving the connection performance of the circuit board 30.
Referring to fig. 4 together, fig. 4 is a schematic view of a portion of an electronic device according to another embodiment of the application. In this embodiment, a positioning column is disposed on a side of the body 12 close to the circuit board 30, and a positioning groove is disposed on a side of the circuit board 30 close to the body 12; an overflow groove 14 is formed in one side, away from the body 12, of the positioning column, and a part of the first bonding layer 20 is arranged in the overflow groove 14.
In the present embodiment, the first positioning portion 13 is used as a positioning column, and the second positioning portion 31 is used as a second groove. First, the positioning posts and the positioning slots can be used to precisely position the circuit board 30. Secondly, an overflow groove 14 may be formed on a side of the positioning post away from the body 12, so when the first adhesive layer 20 is formed on the first bottom wall 11, sometimes the amount of the first adhesive layer 20 cannot be accurately grasped, so that the first adhesive layer 20 is excessively used, at this time, a part of the first adhesive layer 20 can be introduced into the overflow groove 14, and the overflow groove 14 is used for storing the excessive first adhesive layer 20, thereby reducing the preparation difficulty of the electronic device 1. In addition, a part of the first adhesive layer 20 is disposed in the overflow groove 14, so that the overall strength of the first positioning portion 13 can be increased, and the stability and the service life of the electronic device 1 can be improved.
Referring to fig. 5 together, fig. 5 is a schematic view illustrating a part of an electronic device according to another embodiment of the application. In this embodiment, a positioning post is disposed on a side of the body 12 close to the circuit board 30, a positioning hole is disposed on a side of the circuit board 30 close to the body 12, and a portion of the first adhesive layer 20 is disposed on a side of the circuit board 30 away from the first bottom wall 11.
The above embodiments of the present application describe the use of isopipe 14 to store excess first bond coat 20. The application also provides another solution. In the present embodiment, the first positioning portion 13 is used as a positioning column, and the second positioning portion 31 is used as a positioning hole. First, the positioning posts and the positioning holes can be used to perform matching to precisely position the circuit board 30. Second, when the first adhesive layer 20 is used too much, a portion of the first adhesive layer 20 located on the side of the circuit board 30 close to the body 12 may be located on the side of the circuit board 30 away from the body 12 through the positioning hole, so as to drain the excess first adhesive layer 20. The first adhesive layer 20 disposed on the side of the circuit board 30 facing away from the body 12 may further improve the connection performance between the side of the circuit board 30 facing away from the body 12 and the second housing 50.
Optionally, a gap is formed between the positioning post (i.e. the first positioning portion 13) and the side wall of the circuit board 30 forming the positioning hole (i.e. the second positioning portion 31), so that the first adhesive layer 20 is better disposed on the side of the circuit board 30 facing away from the first bottom wall 11 through the positioning hole.
Referring to fig. 6-7 together, fig. 6 is a schematic view illustrating a part of an electronic device according to another embodiment of the application. Fig. 7 is an exploded view of an electronic device according to an embodiment of the present application. In this embodiment, the first housing 10 further includes a first side wall 15 that is connected to the first bottom wall 11 in a bending manner, one end of the first adhesive layer 20 is bonded to the first side wall 15, and the opposite end of the first adhesive layer 20 is bonded to the circuit board 30.
In the present embodiment, the first case 10 includes the first side wall 15 in addition to the bottom wall, and the first adhesive layer 20 may be bonded not only to the first bottom wall 11 but also to the first side wall 15. At this time, one end of the first adhesive layer 20 may be adhered to the first sidewall 15, and the opposite end of the first adhesive layer 20 may be adhered to the circuit board 30, thereby adhering the side surface of the circuit board 30 with the first adhesive layer 20, and further improving the connection performance of the circuit board 30.
Referring to fig. 8 together, fig. 8 is a schematic diagram illustrating a part of an electronic device according to another embodiment of the application. In this embodiment, the second housing 50 further includes a second side wall 52 connected to the second bottom wall 51 in a bending manner, one end of the second adhesive layer 40 is bonded to the second side wall 52, and the other end opposite to the second adhesive layer 40 is bonded to the circuit board 30.
In the present embodiment, the second case 50 may include the second side wall 52 in addition to the first case 10 including the first side wall 15, and the second adhesive layer 40 may be bonded not only to the second bottom wall 51 but also to the second side wall 52. At this time, one end of the second adhesive layer 40 is adhered to the second sidewall 52, and the opposite end of the second adhesive layer 40 is adhered to the circuit board 30, so that the side surface of the circuit board 30 is adhered by the second adhesive layer 40, thereby further improving the connection performance of the circuit board 30. Optionally, the first side wall 15 connects the second side wall 52, thereby enabling packaging of the entire electronic device 1.
Referring to fig. 9 together, fig. 9 is a schematic diagram illustrating a part of an electronic device according to another embodiment of the application. In this embodiment, the electronic device 1 further includes a power supply 60 adjacent to the circuit board 30, the circuit board 30 is electrically connected to the power supply 60, one end of the power supply 60 is bonded to the first adhesive layer 20, and the opposite end of the power supply 60 is bonded to the second adhesive layer 40.
In the present embodiment, the electronic apparatus 1 may further include a power source 60 adjacent to the circuit board 30 and electrically connected to the circuit board 30, in addition to the circuit board 30. Wherein the power supply 60 is used to supply power to the circuit board 30 and other electronic components in the electronic device 1 so that they can operate properly. The present embodiment may also bond the opposite sides of the power supply 60 to the adhesive layer, for example, one end of the power supply 60 is bonded to the first adhesive layer 20, and the opposite end of the power supply 60 is bonded to the second adhesive layer 40. This also improves the connection performance and overall strength of the power supply 60.
Alternatively, referring to fig. 9 again, in this embodiment, the front projection of the power supply 60 on the first bottom wall 11 is located in the front projection of the first adhesive layer 20 on the first bottom wall 11. In this embodiment, the area of the first adhesive layer 20 is larger than the area of the power source 60, so that the side of the power source 60 close to the first bottom wall 11 is adhered to the first adhesive layer 20, thereby further improving the connection performance and the overall strength of the power source 60.
Optionally, referring to fig. 9 again, in this embodiment, the orthographic projection of the power source 60 on the second bottom wall 51 is located in the orthographic projection of the second adhesive layer 40 on the second bottom wall 51. In the same way as the above embodiment, the area of the second adhesive layer 40 is larger than the area of the power source 60, so that the side of the power source 60 close to the second bottom wall 51 is adhered to the second adhesive layer 40, and the connection performance and the overall strength of the power source 60 are further improved.
Referring to fig. 10 together, fig. 10 is a schematic view of a portion of an electronic device according to another embodiment of the application. In this embodiment, the surface of the power supply 60 near the first bottom wall 11 is higher than the surface of the circuit board 30 near the first bottom wall 11.
The present application replaces the conventional screw and protective case structure with the first adhesive layer 20 and the second adhesive layer 40, so that the surface of the power supply 60 near the first bottom wall 11 is higher than the surface of the circuit board 30 near the first bottom wall 11. It is also understood that the thickness of the power supply 60 is greater than the thickness of the circuit board 30, thereby increasing the endurance of the electronic device 1. And because of the easy variability of the structures of the first bonding layer 20 and the second bonding layer 40, the thickness of the first bonding layer 20 corresponding to the power supply 60 can be reduced to realize the increase after the power supply 60, so that the connection performance and the overall strength of the power supply 60 are not reduced.
Referring to fig. 11, fig. 11 is a process flow chart of an assembling method of an electronic device according to an embodiment of the application. The present embodiment provides an assembling method of the electronic device 1, including S100, S200, S300, S400. Among them, S100, S200, S300, S400 are described in detail below.
S100, providing a first housing 10, wherein the first housing 10 includes a first bottom wall 11, and a first adhesive layer 20 is formed on one side of the first bottom wall 11.
S200, providing a circuit board 30, and making the circuit board 30 be disposed on a side of the first adhesive layer 20 facing away from the first bottom wall 11, where an orthographic projection of the circuit board 30 on the first bottom wall 11 is located in an orthographic projection of the first adhesive layer 20 on the first bottom wall 11.
S300, providing a second housing 50, wherein the second housing 50 includes a second bottom wall 51, and a second adhesive layer 40 is formed on one side of the second bottom wall 51.
S400, the second housing 50 is covered on the first housing 10, the second adhesive layer 40 is connected to the circuit board 30, and the orthographic projection of the circuit board 30 on the second bottom wall 51 is located in the orthographic projection of the second adhesive layer 40 on the second bottom wall 51.
In the assembly method provided in this embodiment, the first adhesive layer 20 and the second adhesive layer 40 are added to the opposite sides of the circuit board 30, so that the opposite sides of the first adhesive layer 20 are respectively bonded to the first housing 10 and the circuit board 30, and the opposite sides of the second adhesive layer 40 are respectively bonded to the second housing 50 and the circuit board 30. At the same time, the front projection of the circuit board 30 on the first bottom wall 11 can be positioned in the front projection of the first bonding layer 20 on the first bottom wall 11, and the front projection of the circuit board 30 on the second bottom wall 51 can be positioned in the front projection of the second bonding layer 40 on the second bottom wall 51. Therefore, the bonding and fixing area of the circuit board 30 can be increased, so that the surfaces of the two opposite sides of the circuit board 30 can be bonded and fixed, and the connection performance of the circuit board 30 is improved. Secondly, the arrangement of the first bonding layer 20 and the second bonding layer 40 can change the phase to increase the thickness of the circuit board 30, so that the electronic equipment 1 is more difficult to bend, the overall strength of the electronic equipment 1 is improved, and the protection performance of the circuit board 30 is improved.
The foregoing has outlined rather broadly the more detailed description of embodiments of the application in order that the principles and embodiments of the application may be better understood, and in order that the present application may be better understood; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.
Claims (10)
1. An electronic device, comprising:
a first housing including a first bottom wall;
the first bonding layer is arranged on one side of the first bottom wall;
the circuit board is arranged on one side of the first bonding layer, which is away from the first bottom wall, and the orthographic projection of the circuit board on the first bottom wall is positioned in the orthographic projection of the first bonding layer on the first bottom wall;
the second shell is covered with the first shell, the second shell is arranged on one side of the circuit board, which is away from the first shell, and the second shell comprises a second bottom wall; a kind of electronic device with high-pressure air-conditioning system
The second adhesive layer is bonded at one end of the second adhesive layer to the second bottom wall, the opposite end of the second adhesive layer is bonded to the circuit board, the orthographic projection of the circuit board on the second bottom wall is positioned in the orthographic projection of the second adhesive layer on the second bottom wall, and the second adhesive layer and the first adhesive layer are of a split type structure;
the first bottom wall comprises a body and a positioning column, the positioning column is arranged on one side, close to the circuit board, of the body, a positioning groove is formed in one side, close to the first bottom wall, of the circuit board, the positioning column is arranged in the positioning groove, and the first bonding layer is arranged on the body and the positioning column.
2. The electronic device of claim 1, wherein a positioning post is provided on a side of the body adjacent to the circuit board, and a positioning slot is provided on a side of the circuit board adjacent to the body; an overflow groove is formed in one side, away from the body, of the positioning column, and part of the first bonding layer is arranged in the overflow groove.
3. The electronic device of claim 1, wherein a positioning post is disposed on a side of the body adjacent to the circuit board, a positioning hole is disposed on a side of the circuit board adjacent to the body, and a portion of the first adhesive layer is disposed on a side of the circuit board facing away from the first bottom wall.
4. The electronic device of claim 1, wherein the first housing further comprises a first sidewall in folded connection with the first bottom wall, one end of the first adhesive layer being bonded to the first sidewall, the opposite end of the first adhesive layer being bonded to the circuit board.
5. The electronic device of claim 1, wherein the second housing further comprises a second sidewall in folded connection with the second bottom wall, one end of the second adhesive layer being bonded to the second sidewall, the opposite end of the second adhesive layer being bonded to the circuit board.
6. The electronic device of claim 1, further comprising a power source proximate the circuit board, the circuit board electrically connected to the power source, one end of the power source bonded to the first adhesive layer and an opposite end of the power source bonded to the second adhesive layer.
7. The electronic device of claim 6, wherein an orthographic projection of the power source on the first bottom wall is located within an orthographic projection of the first adhesive layer on the first bottom wall.
8. The electronic device of claim 6, wherein an orthographic projection of the power source on the second bottom wall is located within an orthographic projection of the second adhesive layer on the second bottom wall.
9. The electronic device of claim 6, wherein a surface of the power supply proximate the first bottom wall is higher than a surface of the circuit board proximate the first bottom wall.
10. A method of assembling an electronic device, comprising:
providing a first shell, wherein the first shell comprises a first bottom wall, the first bottom wall comprises a body and a positioning column, a first bonding layer is formed on one side of the first bottom wall, and the first bonding layer is arranged on the body and the positioning column;
providing a circuit board, wherein a positioning groove is formed in one side, close to the first bottom wall, of the circuit board, the circuit board is arranged on one side, away from the first bottom wall, of the first bonding layer, the positioning column is arranged in the positioning groove, and the orthographic projection of the circuit board on the first bottom wall is positioned in the orthographic projection of the first bonding layer on the first bottom wall;
providing a second shell, wherein the second shell comprises a second bottom wall, and a second bonding layer is formed on one side of the second bottom wall; a kind of electronic device with high-pressure air-conditioning system
And enabling the second shell to cover the first shell, enabling the second bonding layer to be connected with the circuit board, and enabling the orthographic projection of the circuit board on the second bottom wall to be located in the orthographic projection of the second bonding layer on the second bottom wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011056596.9A CN114340244B (en) | 2020-09-29 | 2020-09-29 | Electronic device and method of assembling the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011056596.9A CN114340244B (en) | 2020-09-29 | 2020-09-29 | Electronic device and method of assembling the same |
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| CN114340244A CN114340244A (en) | 2022-04-12 |
| CN114340244B true CN114340244B (en) | 2023-11-07 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008039921A1 (en) * | 2008-08-27 | 2010-03-04 | Continental Automotive Gmbh | Electronic device e.g. electronic guiding device, for use in vehicle, has free space formed between discrete element and component side of board, where openings of printed circuit board and free space are filled with adhesive mass |
| CN202976162U (en) * | 2012-12-18 | 2013-06-05 | 陕西理工学院 | Waterproof anti-interference electronic tag |
| CN204331778U (en) * | 2014-12-02 | 2015-05-13 | 北京亿羽舜海科技有限公司 | PCB electronic tag |
| CN107439059A (en) * | 2016-09-26 | 2017-12-05 | 深圳市大疆创新科技有限公司 | Electron speed regulator and head, unmanned vehicle with the electron speed regulator |
| CN207284000U (en) * | 2017-10-11 | 2018-04-27 | 安徽衡孚电子科技有限公司 | A kind of switching power circuit plate sealing structure |
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2020
- 2020-09-29 CN CN202011056596.9A patent/CN114340244B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008039921A1 (en) * | 2008-08-27 | 2010-03-04 | Continental Automotive Gmbh | Electronic device e.g. electronic guiding device, for use in vehicle, has free space formed between discrete element and component side of board, where openings of printed circuit board and free space are filled with adhesive mass |
| CN202976162U (en) * | 2012-12-18 | 2013-06-05 | 陕西理工学院 | Waterproof anti-interference electronic tag |
| CN204331778U (en) * | 2014-12-02 | 2015-05-13 | 北京亿羽舜海科技有限公司 | PCB electronic tag |
| CN107439059A (en) * | 2016-09-26 | 2017-12-05 | 深圳市大疆创新科技有限公司 | Electron speed regulator and head, unmanned vehicle with the electron speed regulator |
| CN207284000U (en) * | 2017-10-11 | 2018-04-27 | 安徽衡孚电子科技有限公司 | A kind of switching power circuit plate sealing structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114340244A (en) | 2022-04-12 |
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