CN114340244A - Electronic device and assembling method thereof - Google Patents
Electronic device and assembling method thereof Download PDFInfo
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- CN114340244A CN114340244A CN202011056596.9A CN202011056596A CN114340244A CN 114340244 A CN114340244 A CN 114340244A CN 202011056596 A CN202011056596 A CN 202011056596A CN 114340244 A CN114340244 A CN 114340244A
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- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000012790 adhesive layer Substances 0.000 claims description 94
- 239000010410 layer Substances 0.000 claims description 60
- 238000010586 diagram Methods 0.000 description 19
- 238000005452 bending Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
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Abstract
The application provides an electronic device and an assembling method thereof, wherein the electronic device comprises a first shell, and the first shell comprises a first bottom wall. The first bonding layer is arranged on one side of the first bottom wall. The circuit board is arranged on one side, deviating from the first bottom wall, of the first bonding layer, and the orthographic projection of the circuit board on the first bottom wall is located in the orthographic projection of the first bonding layer on the first bottom wall. The second casing, the one side that the circuit board deviates from first casing is located to the second casing, and the second casing includes the second diapire. The one end bonding second diapire of second tie coat, the other end bonding circuit board that the second tie coat is relative, and the orthographic projection of circuit board on the second diapire is located the orthographic projection of second tie coat on the second diapire. The first bonding layer and the second bonding layer are respectively additionally arranged on the two opposite sides of the circuit board, so that the connection performance of the circuit board is improved. And secondly, the thickness of the circuit board can be increased by changing phases, so that the overall strength of the electronic equipment is improved.
Description
Technical Field
The application belongs to the technical field of electronic products, and particularly relates to electronic equipment and an assembling method thereof.
Background
With the continuous development of electronic products, electronic products are now popular with users due to their portability and rich and varied operability. But at the same time, the expectation and the demand of users for electronic products are also higher and higher. For example, in the electronic device, a circuit board is usually fixed by screws, but only the connection performance at the screw fixing position is good, and the connection performance at other positions is poor, so that the overall strength of the structural member is reduced.
Disclosure of Invention
In view of this, a first aspect of the present application provides an electronic device, comprising:
a first housing including a first bottom wall;
the first bonding layer is arranged on one side of the first bottom wall;
the circuit board is arranged on one side, away from the first bottom wall, of the first bonding layer, and the orthographic projection of the circuit board on the first bottom wall is located in the orthographic projection of the first bonding layer on the first bottom wall;
the second shell is covered with the first shell, the second shell is arranged on one side of the circuit board, which is far away from the first shell, and the second shell comprises a second bottom wall; and
one end of the second bonding layer is bonded with the second bottom wall, the other end, opposite to the second bonding layer, of the second bonding layer is bonded with the circuit board, and the orthographic projection of the circuit board on the second bottom wall is located in the orthographic projection of the second bonding layer on the second bottom wall.
The electronic equipment that this application first aspect provided, through add first tie coat and second tie coat respectively in the relative both sides of circuit board, make the relative both sides of first tie coat bond first casing and circuit board respectively, the relative both sides of second tie coat bond second casing and circuit board respectively. Meanwhile, the orthographic projection of the circuit board on the first bottom wall can be positioned in the orthographic projection of the first bonding layer on the first bottom wall, and the orthographic projection of the circuit board on the second bottom wall is positioned in the orthographic projection of the second bonding layer on the second bottom wall. Therefore, the bonding and fixing area of the circuit board can be increased, so that the surfaces of the two opposite sides of the circuit board can be bonded and fixed, and the connection performance of the circuit board is improved. And secondly, the arrangement of the first bonding layer and the second bonding layer can change the phase to increase the thickness of the circuit board, so that the electronic equipment is more difficult to bend, the overall strength of the electronic equipment is improved, and the protection performance of the circuit board is improved.
The first bottom wall comprises a body and a first positioning part, the first positioning part is arranged on one side, close to the circuit board, of the body, a second positioning part is arranged on one side, close to the first bottom wall, of the circuit board, and the first positioning part and the second positioning part are matched with each other to enable the circuit board to be connected with the first bonding layer.
One side of the body, which is close to the circuit board, is provided with a positioning column, and one side of the circuit board, which is close to the body, is provided with a positioning groove; an overflow groove is formed in one side, away from the body, of the positioning column, and part of the first bonding layer is arranged in the overflow groove.
The positioning column is arranged on one side, close to the circuit board, of the body, the positioning hole is arranged on one side, close to the body, of the circuit board, and part of the first bonding layer is arranged on one side, away from the first bottom wall, of the circuit board.
The first shell further comprises a first side wall connected with the first bottom wall in a bent mode, one end of the first bonding layer is bonded with the first side wall, and the other end, opposite to the first bonding layer, of the first bonding layer is bonded with the circuit board.
The second shell further comprises a second side wall connected with the second bottom wall in a bent mode, one end of the second bonding layer is bonded with the second side wall, and the other end, opposite to the second bonding layer, of the second bonding layer is bonded with the circuit board.
The electronic equipment further comprises a power supply close to the circuit board, the circuit board is electrically connected with the power supply, one end of the power supply is bonded with the first bonding layer, and the other end, opposite to the power supply, of the power supply is bonded with the second bonding layer.
Wherein an orthographic projection of the power source on the first bottom wall is located within an orthographic projection of the first adhesive layer on the first bottom wall.
Wherein an orthographic projection of the power source on the second bottom wall is located within an orthographic projection of the second adhesive layer on the second bottom wall.
Wherein the surface of the power supply close to the first bottom wall is higher than the surface of the circuit board close to the first bottom wall.
A second aspect of the present application provides an assembling method of an electronic device, including:
providing a first shell, wherein the first shell comprises a first bottom wall, and a first bonding layer is formed on one side of the first bottom wall.
Providing a circuit board, and enabling the circuit board to be arranged on one side of the first bonding layer, which is far away from the first bottom wall, wherein the orthographic projection of the circuit board on the first bottom wall is positioned in the orthographic projection of the first bonding layer on the first bottom wall.
Providing a second shell, wherein the second shell comprises a second bottom wall, and a second bonding layer is formed on one side of the second bottom wall.
And covering the second shell on the first shell, connecting the second bonding layer with the circuit board, and enabling the orthographic projection of the circuit board on the second bottom wall to be positioned in the orthographic projection of the second bonding layer on the second bottom wall.
In the assembling method provided by the second aspect of the present application, the first bonding layer and the second bonding layer are additionally arranged on the two opposite sides of the circuit board, so that the two opposite sides of the first bonding layer are respectively bonded with the first shell and the circuit board, and the two opposite sides of the second bonding layer are respectively bonded with the second shell and the circuit board. Meanwhile, the orthographic projection of the circuit board on the first bottom wall can be positioned in the orthographic projection of the first bonding layer on the first bottom wall, and the orthographic projection of the circuit board on the second bottom wall is positioned in the orthographic projection of the second bonding layer on the second bottom wall. Therefore, the bonding and fixing area of the circuit board can be increased, so that the surfaces of the two opposite sides of the circuit board can be bonded and fixed, and the connection performance of the circuit board is improved. And secondly, the arrangement of the first bonding layer and the second bonding layer can change the phase to increase the thickness of the circuit board, so that the electronic equipment is more difficult to bend, the overall strength of the electronic equipment is improved, and the protection performance of the circuit board is improved.
Drawings
In order to more clearly explain the technical solution in the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be described below.
Fig. 1 is a schematic partial structural diagram of an electronic device according to an embodiment of the present disclosure.
Fig. 2 is a schematic partial structural diagram of an electronic device according to another embodiment of the present application.
Fig. 3 is a schematic partial structural diagram of an electronic device according to another embodiment of the present application.
Fig. 4 is a schematic partial structural diagram of an electronic device according to still another embodiment of the present application.
Fig. 5 is a schematic partial structure diagram of an electronic device according to still another embodiment of the present application.
Fig. 6 is a schematic partial structure diagram of an electronic device according to still another embodiment of the present application.
Fig. 7 is an exploded view of an electronic device according to an embodiment of the present application.
Fig. 8 is a schematic partial structure diagram of an electronic device according to still another embodiment of the present application.
Fig. 9 is a schematic partial structure diagram of an electronic device according to still another embodiment of the present application.
Fig. 10 is a schematic partial structure diagram of an electronic device according to still another embodiment of the present application.
Fig. 11 is a process flow diagram of an assembly method of an electronic device according to an embodiment of the present disclosure.
Description of reference numerals:
the electronic device comprises an electronic device-1, a first shell-10, a first bottom wall-11, a body-12, a first positioning part-13, an overflow groove-14, a first side wall-15, a first bonding layer-20, a circuit board-30, a second positioning part-31, a second bonding layer-40, a second shell-50, a second bottom wall-51, a second side wall-52 and a power supply-60.
Detailed Description
The following is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic view of a partial structure of an electronic device according to an embodiment of the present disclosure. The present embodiment provides an electronic apparatus 1 including a first housing 10, a first adhesive layer 20, a circuit board 30, a second housing 50, and a second adhesive layer 40. Wherein the first housing 10 comprises a first bottom wall 11. The first adhesive layer 20 is disposed on one side of the first bottom wall 11. The circuit board 30 is disposed on a side of the first adhesive layer 20 away from the first bottom wall 11, and an orthogonal projection of the circuit board 30 on the first bottom wall 11 is located in an orthogonal projection of the first adhesive layer 20 on the first bottom wall 11. The second housing 50 covers the first housing 10, the second housing 50 is disposed on a side of the circuit board 30 away from the first housing 10, and the second housing 50 includes a second bottom wall 51. One end of the second adhesive layer 40 is adhered to the second bottom wall 51, the other end opposite to the second adhesive layer 40 is adhered to the circuit board 30, and an orthographic projection of the circuit board 30 on the second bottom wall 51 is located in an orthographic projection of the second adhesive layer 40 on the second bottom wall 51.
The electronic device 1 provided herein includes, but is not limited to, an anti-lost patch. The anti-lost tag is an electronic device 1 which can conveniently find the position of a lost object. In particular, the anti-loss tag may be attached to an object or integrated into the object. The anti-lost label is internally provided with a circuit board 30, and the circuit board 30 is provided with a plurality of circuit modules and continuously sends data signals to the outside. When the object is lost, other electronic devices 1, such as cell phones, may be used to receive the data signal. When the mobile phone receives the data signal, the mobile phone can obtain the position of the anti-lost label, so that the user can find the anti-lost label and then the object more quickly and simply.
The structure of the conventional loss prevention tag generally includes a first housing 10, and a circuit board 30 is screwed to the first housing 10, thereby improving the fixing performance of the circuit board 30. Meanwhile, a part of the circuit board 30 can be wrapped by the steel sheet, so that the circuit board 30 is better protected, the overall strength of the circuit board 30 is improved, and the phenomenon that the circuit board 30 is damaged due to bending of the electronic device 1 is prevented. And finally, covering the first shell 10 by using the second shell 50 to realize the packaging of the anti-lost label. However, only the part of the circuit board 30 fixed by the screws has better connection performance, and the rest of the circuit board 30 not fixed by the screws has poorer connection performance. In addition, although wrapping the circuit board 30 with a steel sheet can prevent the circuit board 30 from being bent, this not only increases the weight of the electronic apparatus 1, but also increases the cost and increases the difficulty of assembling the electronic apparatus 1.
In view of this, in the electronic device 1 provided in the present embodiment, the first adhesive layer 20 and the second adhesive layer 40 are respectively added on two opposite sides of the circuit board 30, so that the first housing 10 and the circuit board 30 are respectively bonded on two opposite sides of the first adhesive layer 20, and the second housing 50 and the circuit board 30 are respectively bonded on two opposite sides of the second adhesive layer 40. Meanwhile, the orthographic projection of the circuit board 30 on the first bottom wall 11 can be positioned in the orthographic projection of the first adhesive layer 20 on the first bottom wall 11, and the orthographic projection of the circuit board 30 on the second bottom wall 51 can be positioned in the orthographic projection of the second adhesive layer 40 on the second bottom wall 51. It can also be understood that the area of the first adhesive layer 20 is not smaller than the area of one side of the circuit board 30, and the area of the second adhesive layer 40 is not smaller than the area of the other side of the circuit board, so as to realize the overall coverage bonding of the adhesive layer to the circuit board 30. Thus, the bonding and fixing area of the circuit board 30 can be increased, so that the surfaces of the opposite sides of the circuit board 30 can be bonded and fixed, thereby improving the connection performance of the circuit board 30. Secondly, the arrangement of the first adhesive layer 20 and the second adhesive layer 40 can change the phase to increase the thickness of the circuit board 30, so that the electronic device 1 is more difficult to bend, thereby improving the overall strength of the electronic device 1 and improving the protection performance of the circuit board 30.
In summary, in the electronic device 1 provided in the present embodiment, the first adhesive layer 20 and the second adhesive layer 40 are additionally disposed on the opposite sides of the circuit board 30, so that the connection performance of the circuit board 30 can be improved, the overall strength of the circuit board 30 can be improved, and the cost and the assembly difficulty of the electronic device 1 can be further reduced.
Optionally, the materials of the first adhesive layer 20 and the second adhesive layer 40 include, but are not limited to, silicone.
Optionally, in the present embodiment, an orthographic projection of the circuit board 30 on the first bottom wall 11 is overlapped with an orthographic projection of the first adhesive layer 20 on the first bottom wall 11, and an orthographic projection of the circuit board 30 on the second bottom wall 51 is overlapped with an orthographic projection of the second adhesive layer 40 on the second bottom wall 51.
Please refer to fig. 2-3 together, fig. 2 is a schematic diagram illustrating a partial structure of an electronic device according to another embodiment of the present application. Fig. 3 is a schematic partial structural diagram of an electronic device according to another embodiment of the present application. In this embodiment, the first bottom wall 11 includes a main body 12 and a first positioning portion 13, the first positioning portion 13 is disposed on a side of the main body 12 close to the circuit board 30, a second positioning portion 31 is disposed on a side of the circuit board 30 close to the first bottom wall 11, and the first positioning portion 13 and the second positioning portion 31 cooperate with each other to connect the circuit board 30 to the first adhesive layer 20.
In order to better position the circuit board 30 with the first housing 10 and the first adhesive layer 20, in the present embodiment, the first bottom wall 11 may include a body 12 and a first positioning portion 13, wherein the body 12 is used for carrying the first adhesive layer 20 and the first positioning portion 13. The circuit board 30 is provided with a second positioning portion 31 on a side close to the first bottom wall 11, and the first positioning portion 13 and the second positioning portion 31 cooperate with each other to position and connect the circuit board 30 to the first bonding layer 20. The mounting accuracy of the circuit board 30 can be improved by the cooperation of the first positioning portions 13 and the second positioning portions 31.
Alternatively, the first positioning portion 13 may be a positioning column or a positioning groove, and the second positioning portion 31 may be a positioning groove or a positioning column. Further alternatively, as shown in fig. 2, when the first positioning portion 13 is a positioning column, the second positioning portion 31 is a positioning column. As shown in fig. 3, when the first positioning portion 13 is a positioning groove, the second positioning portion 31 is a positioning column. Of course, the first positioning portion 13 and the second positioning portion 31 may have other configurations, and the present application is not limited thereto.
Alternatively, since the first positioning portion 13 is provided on the upper side of the body 12, the first adhesive layer 20 may be provided only on the body 12, or the first adhesive layer 20 may be provided on the body 12 and the first positioning portion 13, thereby further improving the connection performance of the circuit board 30.
Please refer to fig. 4, fig. 4 is a schematic diagram of a partial structure of an electronic device according to another embodiment of the present application. In this embodiment, a positioning column is disposed on one side of the body 12 close to the circuit board 30, and a positioning groove is disposed on one side of the circuit board 30 close to the body 12; an overflow groove 14 is formed in a side of the positioning column, which faces away from the main body 12, and a part of the first bonding layer 20 is disposed in the overflow groove 14.
In the present embodiment, the first positioning portion 13 is taken as a positioning column, and the second positioning portion 31 is taken as a second groove. First, the circuit board 30 can be precisely positioned by the cooperation of the positioning posts and the positioning slots. Secondly, an overflow groove 14 may be formed on a side of the positioning column away from the main body 12, so that when the first bonding layer 20 is formed on the first bottom wall 11, sometimes, the amount of the first bonding layer 20 cannot be accurately grasped, and the amount of the first bonding layer 20 is too much, at this time, a part of the first bonding layer 20 may be introduced into the overflow groove 14, and the overflow groove 14 is used to store the too much first bonding layer 20, thereby reducing the difficulty in manufacturing the electronic device 1. In addition, a part of the first bonding layer 20 is disposed in the overflow groove 14, which can increase the overall strength of the first positioning portion 13, and improve the stability and the service life of the electronic device 1.
Please refer to fig. 5, and fig. 5 is a schematic diagram of a partial structure of an electronic device according to another embodiment of the present application. In this embodiment, a positioning column is disposed on one side of the body 12 close to the circuit board 30, a positioning hole is disposed on one side of the circuit board 30 close to the body 12, and a portion of the first bonding layer 20 is disposed on one side of the circuit board 30 away from the first bottom wall 11.
The above embodiments of the present application describe the use of the overflow channel 14 to store excess first adhesive layer 20. The present application also provides another solution. In the present embodiment, the first positioning portion 13 is taken as a positioning column, and the second positioning portion 31 is taken as a positioning hole for example. First, the circuit board 30 can be precisely positioned by matching the positioning posts and the positioning holes. Secondly, when the amount of the first adhesive layer 20 is too much, a portion of the first adhesive layer 20 on the side of the circuit board 30 close to the body 12 can be disposed on the side of the circuit board 30 away from the body 12 through the positioning hole, so as to discharge the excess first adhesive layer 20. The first adhesive layer 20 disposed on the side of the circuit board 30 away from the body 12 can also improve the connection performance between the side of the circuit board 30 away from the body 12 and the second housing 50.
Optionally, a gap is formed between the positioning column (i.e., the first positioning portion 13) and a side wall of the circuit board 30 forming the positioning hole (i.e., the second positioning portion 31), so that the first adhesive layer 20 is better disposed on a side of the circuit board 30 away from the first bottom wall 11 through the positioning hole.
Please refer to fig. 6-7 together, fig. 6 is a schematic diagram illustrating a partial structure of an electronic device according to another embodiment of the present application. Fig. 7 is an exploded view of an electronic device according to an embodiment of the present application. In this embodiment, the first housing 10 further includes a first sidewall 15 connected to the first bottom wall 11 in a bending manner, one end of the first adhesive layer 20 is adhered to the first sidewall 15, and the other end of the first adhesive layer 20 is adhered to the circuit board 30.
In the present embodiment, the first case 10 includes the first side wall 15 in addition to the bottom wall, and the first adhesive layer 20 may be adhered not only to the first bottom wall 11 but also to the first side wall 15. At this time, one end of the first adhesive layer 20 may be adhered to the first sidewall 15, and the other end of the first adhesive layer 20 may be adhered to the circuit board 30, so that the side surface of the circuit board 30 is adhered by the first adhesive layer 20, thereby further improving the connection performance of the circuit board 30.
Please refer to fig. 8, fig. 8 is a schematic diagram of a partial structure of an electronic device according to another embodiment of the present application. In this embodiment, the second casing 50 further includes a second side wall 52 connected to the second bottom wall 51 in a bending manner, one end of the second adhesive layer 40 is adhered to the second side wall 52, and the other end of the second adhesive layer 40 opposite to the second adhesive layer 40 is adhered to the circuit board 30.
In the present embodiment, in addition to the first case 10 including the first sidewall 15, the second case 50 may also include a second sidewall 52, and the second adhesive layer 40 may be adhered not only to the second bottom wall 51 but also to the second sidewall 52. At this time, one end of the second adhesive layer 40 is adhered to the second sidewall 52, and the other end of the second adhesive layer 40 opposite to the second adhesive layer 40 is adhered to the circuit board 30, so that the side surface of the circuit board 30 is adhered by the second adhesive layer 40, thereby further improving the connection performance of the circuit board 30. Optionally, the first side wall 15 is connected to the second side wall 52, thereby realizing the encapsulation of the entire electronic device 1.
Please refer to fig. 9, fig. 9 is a schematic diagram of a partial structure of an electronic device according to another embodiment of the present application. In this embodiment, the electronic device 1 further includes a power supply 60 close to the circuit board 30, the circuit board 30 is electrically connected to the power supply 60, one end of the power supply 60 is bonded to the first adhesive layer 20, and the other end of the power supply 60 opposite to the first adhesive layer 40 is bonded to the second adhesive layer.
In the present embodiment, the electronic apparatus 1 may further include a power supply 60 that is close to the circuit board 30 and electrically connected to the circuit board 30, in addition to the circuit board 30. Wherein the power supply 60 is used for supplying power to the circuit board 30 and other electronic components in the electronic device 1 so as to enable the electronic device to work normally. In this embodiment, both opposite sides of the power source 60 may be bonded to the adhesive layer, for example, one end of the power source 60 is bonded to the first adhesive layer 20, and the other end of the power source 60 is bonded to the second adhesive layer 40. This also improves the connection performance and overall strength of the power supply 60.
Optionally, referring to fig. 9 again, in this embodiment, an orthogonal projection of the power source 60 on the first bottom wall 11 is located in an orthogonal projection of the first adhesive layer 20 on the first bottom wall 11. In this embodiment, the area of the first adhesive layer 20 is larger than that of the power supply 60, so that the power supply 60 is adhered to the first adhesive layer 20 on the side close to the first bottom wall 11, thereby further improving the connection performance and the overall strength of the power supply 60.
Optionally, referring to fig. 9 again, in this embodiment, an orthogonal projection of the power source 60 on the second bottom wall 51 is located in an orthogonal projection of the second adhesive layer 40 on the second bottom wall 51. Similarly to the above embodiment, in the present embodiment, the area of the second adhesive layer 40 is larger than the area of the power supply 60, so that the power supply 60 is adhered to the second adhesive layer 40 on the side close to the second bottom wall 51, thereby further improving the connection performance and the overall strength of the power supply 60.
Please refer to fig. 10, fig. 10 is a schematic diagram illustrating a partial structure of an electronic device according to another embodiment of the present application. In this embodiment, the surface of the power supply 60 near the first bottom wall 11 is higher than the surface of the circuit board 30 near the first bottom wall 11.
In the present application, the first adhesive layer 20 and the second adhesive layer 40 are used to replace the conventional screw and protective casing structure, so that the surface of the power supply 60 close to the first bottom wall 11 is higher than the surface of the circuit board 30 close to the first bottom wall 11 in the present embodiment. It is also understood that the thickness of the power source 60 is greater than the thickness of the circuit board 30, thereby increasing the endurance of the electronic device 1. Moreover, due to the easy modification of the structures of the first adhesive layer 20 and the second adhesive layer 40, the thickness of the first adhesive layer 20 corresponding to the power supply 60 can be reduced to increase the power supply 60, so that the connection performance and the overall strength of the power supply 60 are not reduced.
Referring to fig. 11, fig. 11 is a process flow diagram of an assembling method of an electronic device according to an embodiment of the present disclosure. The present embodiment provides an assembling method of an electronic device 1, including S100, S200, S300, and S400. The details of S100, S200, S300, and S400 are as follows.
S100, providing a first housing 10, where the first housing 10 includes a first bottom wall 11, and a first adhesive layer 20 is formed on one side of the first bottom wall 11.
S200, providing a circuit board 30, and enabling the circuit board 30 to be disposed on a side of the first adhesive layer 20 away from the first bottom wall 11, wherein an orthographic projection of the circuit board 30 on the first bottom wall 11 is located in an orthographic projection of the first adhesive layer 20 on the first bottom wall 11.
And S300, providing a second shell 50, wherein the second shell 50 comprises a second bottom wall 51, and a second bonding layer 40 is formed on one side of the second bottom wall 51.
S400, covering the second housing 50 on the first housing 10, connecting the second adhesive layer 40 to the circuit board 30, and positioning an orthographic projection of the circuit board 30 on the second bottom wall 51 in an orthographic projection of the second adhesive layer 40 on the second bottom wall 51.
In the assembly method provided by the present embodiment, the first adhesive layer 20 and the second adhesive layer 40 are additionally arranged on the opposite sides of the circuit board 30, so that the first housing 10 and the circuit board 30 are respectively bonded to the opposite sides of the first adhesive layer 20, and the second housing 50 and the circuit board 30 are respectively bonded to the opposite sides of the second adhesive layer 40. Meanwhile, the orthographic projection of the circuit board 30 on the first bottom wall 11 can be positioned in the orthographic projection of the first adhesive layer 20 on the first bottom wall 11, and the orthographic projection of the circuit board 30 on the second bottom wall 51 can be positioned in the orthographic projection of the second adhesive layer 40 on the second bottom wall 51. Thus, the bonding and fixing area of the circuit board 30 can be increased, so that the surfaces of the opposite sides of the circuit board 30 can be bonded and fixed, thereby improving the connection performance of the circuit board 30. Secondly, the arrangement of the first adhesive layer 20 and the second adhesive layer 40 can change the phase to increase the thickness of the circuit board 30, so that the electronic device 1 is more difficult to bend, thereby improving the overall strength of the electronic device 1 and improving the protection performance of the circuit board 30.
The foregoing detailed description has provided for the embodiments of the present application, and the principles and embodiments of the present application have been presented herein for purposes of illustration and description only and to facilitate understanding of the methods and their core concepts; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (11)
1. An electronic device, comprising:
a first housing including a first bottom wall;
the first bonding layer is arranged on one side of the first bottom wall;
the circuit board is arranged on one side, away from the first bottom wall, of the first bonding layer, and the orthographic projection of the circuit board on the first bottom wall is located in the orthographic projection of the first bonding layer on the first bottom wall;
the second shell is covered with the first shell, the second shell is arranged on one side of the circuit board, which is far away from the first shell, and the second shell comprises a second bottom wall; and
one end of the second bonding layer is bonded with the second bottom wall, the other end, opposite to the second bonding layer, of the second bonding layer is bonded with the circuit board, and the orthographic projection of the circuit board on the second bottom wall is located in the orthographic projection of the second bonding layer on the second bottom wall.
2. The electronic device of claim 1, wherein the first bottom wall includes a body and a first positioning portion, the first positioning portion is disposed on a side of the body close to the circuit board, a second positioning portion is disposed on a side of the circuit board close to the first bottom wall, and the first positioning portion and the second positioning portion cooperate with each other to connect the circuit board to the first adhesive layer.
3. The electronic device of claim 2, wherein a positioning column is disposed on a side of the body close to the circuit board, and a positioning groove is disposed on a side of the circuit board close to the body; an overflow groove is formed in one side, away from the body, of the positioning column, and part of the first bonding layer is arranged in the overflow groove.
4. The electronic device according to claim 2, wherein a positioning column is disposed on a side of the body close to the circuit board, a positioning hole is disposed on a side of the circuit board close to the body, and a portion of the first adhesive layer is disposed on a side of the circuit board away from the first bottom wall.
5. The electronic device of claim 1, wherein the first housing further comprises a first side wall connected with the first bottom wall in a bent manner, one end of the first adhesive layer is bonded to the first side wall, and the other end of the first adhesive layer opposite to the first adhesive layer is bonded to the circuit board.
6. The electronic device of claim 1, wherein the second housing further comprises a second side wall connected with the second bottom wall in a bent manner, one end of the second adhesive layer is adhered to the second side wall, and the other end of the second adhesive layer opposite to the second adhesive layer is adhered to the circuit board.
7. The electronic device of claim 1, further comprising a power source proximate to the circuit board, the circuit board electrically connected to the power source, one end of the power source bonded to the first adhesive layer and an opposite end of the power source bonded to the second adhesive layer.
8. The electronic device of claim 7, wherein an orthographic projection of the power source on the first bottom wall is within an orthographic projection of the first adhesive layer on the first bottom wall.
9. The electronic device of claim 7, wherein an orthographic projection of the power source on the second bottom wall is within an orthographic projection of the second adhesive layer on the second bottom wall.
10. The electronic device of claim 7, wherein a surface of the power supply near the first bottom wall is higher than a surface of the circuit board near the first bottom wall.
11. A method of assembling an electronic device, comprising:
providing a first shell, wherein the first shell comprises a first bottom wall, and a first bonding layer is formed on one side of the first bottom wall;
providing a circuit board, and enabling the circuit board to be arranged on one side of the first bonding layer, which is far away from the first bottom wall, wherein the orthographic projection of the circuit board on the first bottom wall is positioned in the orthographic projection of the first bonding layer on the first bottom wall;
providing a second shell, wherein the second shell comprises a second bottom wall, and a second bonding layer is formed on one side of the second bottom wall; and
and covering the second shell on the first shell, connecting the second bonding layer with the circuit board, and enabling the orthographic projection of the circuit board on the second bottom wall to be positioned in the orthographic projection of the second bonding layer on the second bottom wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011056596.9A CN114340244B (en) | 2020-09-29 | 2020-09-29 | Electronic device and method of assembling the same |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008039921A1 (en) * | 2008-08-27 | 2010-03-04 | Continental Automotive Gmbh | Electronic device e.g. electronic guiding device, for use in vehicle, has free space formed between discrete element and component side of board, where openings of printed circuit board and free space are filled with adhesive mass |
| CN202976162U (en) * | 2012-12-18 | 2013-06-05 | 陕西理工学院 | Waterproof anti-interference electronic tag |
| CN204331778U (en) * | 2014-12-02 | 2015-05-13 | 北京亿羽舜海科技有限公司 | PCB electronic tag |
| CN107439059A (en) * | 2016-09-26 | 2017-12-05 | 深圳市大疆创新科技有限公司 | Electron speed regulator and head, unmanned vehicle with the electron speed regulator |
| CN207284000U (en) * | 2017-10-11 | 2018-04-27 | 安徽衡孚电子科技有限公司 | A kind of switching power circuit plate sealing structure |
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2020
- 2020-09-29 CN CN202011056596.9A patent/CN114340244B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008039921A1 (en) * | 2008-08-27 | 2010-03-04 | Continental Automotive Gmbh | Electronic device e.g. electronic guiding device, for use in vehicle, has free space formed between discrete element and component side of board, where openings of printed circuit board and free space are filled with adhesive mass |
| CN202976162U (en) * | 2012-12-18 | 2013-06-05 | 陕西理工学院 | Waterproof anti-interference electronic tag |
| CN204331778U (en) * | 2014-12-02 | 2015-05-13 | 北京亿羽舜海科技有限公司 | PCB electronic tag |
| CN107439059A (en) * | 2016-09-26 | 2017-12-05 | 深圳市大疆创新科技有限公司 | Electron speed regulator and head, unmanned vehicle with the electron speed regulator |
| CN207284000U (en) * | 2017-10-11 | 2018-04-27 | 安徽衡孚电子科技有限公司 | A kind of switching power circuit plate sealing structure |
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| Publication number | Publication date |
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| CN114340244B (en) | 2023-11-07 |
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