CN114335405B - Display panel manufacturing method, display panel and display device - Google Patents
Display panel manufacturing method, display panel and display device Download PDFInfo
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- CN114335405B CN114335405B CN202111590017.3A CN202111590017A CN114335405B CN 114335405 B CN114335405 B CN 114335405B CN 202111590017 A CN202111590017 A CN 202111590017A CN 114335405 B CN114335405 B CN 114335405B
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Abstract
The embodiment of the application discloses a preparation method of a display panel, the display panel and a display device. The preparation method of the display panel comprises the following steps: providing a carrier substrate; forming a display module on one side of the carrier substrate, wherein a metal layer in the display module is formed in a process of a preset temperature range, so that the impedance value of the metal layer is smaller than a preset impedance value; providing a display substrate, wherein the display substrate comprises a light-emitting device layer and a packaging layer formed on one side of the light-emitting device layer; bonding one side of the display module, which is far away from the carrier substrate, with one side of the packaging layer, which is far away from the light-emitting device layer; and separating the carrier substrate and the display module by adopting a laser stripping process. The preparation method of the display panel, the display panel and the display device provided by the embodiment of the application can reduce the voltage drop of the film layer in the display panel.
Description
Technical Field
The embodiment of the application relates to the technical field of display, in particular to a preparation method of a display panel, the display panel and a display device.
Background
In recent years, a rollable display device, which is a next generation display device, has been receiving increasing attention in applications in the middle-large-sized field, such as a roll television, a roll mobile phone, and the like. Because of the higher requirements of various large terminal manufacturers on products, such as higher display quality, faster touch response speed, more sensitive face recognition, and the like, the method has the advantages of simple structure, low cost and convenient operation. However, as the size of the display device increases, the voltage Drop (IR Drop) in the screen increases, affecting the quality and user experience of the display device. Therefore, how to reduce the voltage drop of the film layer in the rollable screen becomes a continuous pursuit for each display panel manufacturer.
Disclosure of Invention
The embodiment of the application provides a preparation method of a display panel, the display panel and a display device, which are used for reducing voltage drop of a film layer in the display panel.
In order to achieve the technical purpose, the embodiment of the application provides the following technical scheme:
the application provides a preparation method of a display panel, which comprises the following steps:
providing a carrier substrate;
forming a display module on one side of the carrier substrate, wherein a metal layer in the display module is formed in a process of a preset temperature range, so that the impedance value of the metal layer is smaller than a preset impedance value;
providing a display substrate, wherein the display substrate comprises a light-emitting device layer and a packaging layer formed on one side of the light-emitting device layer;
bonding one side of the display module, which is far away from the carrier substrate, with one side of the packaging layer, which is far away from the light-emitting device layer;
and separating the carrier substrate and the display module by adopting a laser stripping process.
Optionally, the metal layer includes a touch layer.
Optionally, the display module includes a polarizer and a cover plate, at least one of the polarizer and the cover plate is formed in a process of a predetermined temperature range.
Optionally, laminating the side of the display module far away from the carrier substrate with the side of the encapsulation layer far away from the light emitting device layer, including:
gluing the side, far away from the carrier substrate, of the display module or the side, far away from the light-emitting device layer, of the packaging layer to form a glue coating layer;
bonding one side of the display module, which is far away from the carrier substrate, with one side of the packaging layer, which is far away from the light-emitting device layer, through the glue coating layer;
optionally, the material used for the glue layer comprises an optically transparent resin.
Optionally, the glue layer has a thickness of less than 30 μm.
Optionally, after providing a display substrate and before attaching the side of the display module away from the carrier substrate to the side of the encapsulation layer away from the light emitting device layer, the preparation method further includes:
inverting the display module with the carrier substrate so that one side of the display module far away from the carrier substrate is opposite to one side of the packaging layer far away from the light emitting device layer;
and under the inverted state of the display module, aligning one side of the display module, which is far away from the carrier substrate, with one side of the packaging layer, which is far away from the light emitting device layer.
Optionally, the resistance value of the metal layer being smaller than the preset resistance value includes: the resistance value of the metal layer per 350 nm thickness is less than 100 ohm.
Optionally, the preset temperature range includes a range of 200 degrees celsius to 300 degrees celsius.
Correspondingly, the embodiment of the application also provides a display panel which is prepared by adopting the preparation method of the display panel according to any embodiment of the application.
Correspondingly, the embodiment of the application also provides a display device which comprises the display panel according to any embodiment of the application.
According to the embodiment of the application, the metal layer in the display module is formed under the process of the preset temperature range, so that the impedance value of the metal layer is smaller than the preset impedance value. Because the metal layer is formed at a higher temperature, the metal resistance of the metal layer is smaller, and the metal resistance is smaller when the volume of the display panel is increased, so that the voltage drop of the film layer in the display panel can be effectively reduced. In addition, after the display module is formed, the display module is attached to the display substrate, and the display substrate is not prepared first and is formed on the display substrate, so that the preparation of the display module and the preparation of the display substrate are carried out separately, and the influence of the high temperature for preparing the metal layer on some film layers in the display substrate can be avoided.
Drawings
Fig. 1 is a schematic structural view of a display panel in the related art;
fig. 2 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a manufacturing method of a display panel according to an embodiment of the present application at each step;
FIG. 4 is a flowchart of another method for manufacturing a display panel according to an embodiment of the present application;
FIG. 5 is a schematic structural diagram of another method for manufacturing a display panel according to an embodiment of the present application at each step;
FIG. 6 is a flowchart of a method for manufacturing a display panel according to another embodiment of the present application;
fig. 7 is a schematic structural diagram of a manufacturing method of a display panel according to another embodiment of the present application at each step;
fig. 8 is a schematic structural diagram of a display panel according to an embodiment of the present application;
fig. 9 is a schematic structural diagram of another display panel according to an embodiment of the present application;
fig. 10 is a schematic structural diagram of another display panel according to an embodiment of the present application.
Detailed Description
The application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present application are shown in the drawings.
As described in the background art, the voltage drop of the film layer in the display panel of the related art is large, and the inventors have found that the above problem occurs due to the following:
fig. 1 is a schematic structural view of a display panel in the related art. Referring to fig. 1, taking an OLED display panel as an example, the display panel is provided with an array layer 2, an OLED layer 3, a packaging and touch layer 4, a first adhesive layer 5, a polarizer 6, a second adhesive layer 7 and a cover plate 8 on a substrate 1 in sequence. The packaging and touch control layer 4 has the packaging function and the touch control function, and is prepared in the same process. For the display panel shown in fig. 1, as the size increases, the area of each film layer in the display panel also increases, and for the metal film layers such as the package and the touch layer 4, since the area of the package and the touch layer 4 increases, the metal resistance of the package and the touch layer 4 increases with the area of the package and the touch layer 4, which results in a larger resistance voltage Drop (IR Drop) of the package and the touch layer 4.
In view of the above problems, embodiments of the present application provide a method for manufacturing a display panel. Fig. 2 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application, and fig. 3 is a schematic structural diagram of the method for manufacturing the display panel according to the embodiment of the present application at each step. With reference to fig. 2 and 3, the preparation method comprises the following steps:
s110, providing a carrier substrate 100.
The material used for the carrier substrate 100 may include glass, for example, the carrier substrate 100 is carrier glass. The material used for the carrier substrate 100 may also include other materials, which are not limited herein.
S120, forming a display module 10 on one side of the carrier substrate, wherein the metal layer in the display module 10 is formed under a process of a preset temperature range, so that the impedance value of the metal layer is smaller than the preset impedance value.
Specifically, the metal layer in the display module 10 is formed on the carrier substrate 100 by a high temperature process with a predetermined temperature range, which may be a temperature range exceeding 200 ℃. The metal layer is a film layer comprising a metal material in the display module. When the metal layer is formed in the process of the preset temperature range, the impedance of the metal layer can be reduced, and the impedance value of the metal layer is smaller than the preset impedance value. From the microstructure, when the metal layer is prepared at a higher temperature, the film forming process of the metal material in the metal layer can provide enough diffusion activation energy for metal atoms, and the metal atoms can orderly occupy lattice positions, so that crystal grains grow up, defects are fewer at a relatively low temperature, and the impedance of the metal layer is smaller. Therefore, the resistance of the metal layer formed under the high temperature process in the preset temperature range can be reduced, and when the volume of the display panel is increased, the metal resistance is still smaller, so that the voltage drop of the film layer in the display panel can be reduced.
S130, providing a display substrate 20, where the display substrate 20 includes a light emitting device layer 22 and an encapsulation layer 23 formed on one side of the light emitting device layer 22.
Illustratively, the display substrate 20 may include a substrate 24, an array layer 21, a light emitting device layer 22, and an encapsulation layer 23, which are sequentially stacked. An encapsulation layer 23 is positioned on the light emitting device layer 22 for encapsulating the light emitting device layer 22.
And S140, bonding the side of the display module 10 away from the carrier substrate 100 with the side of the packaging layer 23 away from the light-emitting device layer 22.
The high temperature may affect some of the layers in the display substrate 20, for example, the materials used for the light emitting device layer 22 in the display substrate 20 include light emitting materials, and the high temperature may cause degradation of the light emitting materials and a shortened lifetime. Therefore, in order to avoid the influence of high temperature on some of the film layers in the display substrate 20, the display module 10 is not directly formed on the display substrate 20, but the display module 10 is formed on the carrier substrate 100 under the high temperature process of the preset temperature range, and then the display module 10 is attached to the display substrate 20, so that the influence of high temperature on some of the film layers in the display substrate 20 can be prevented while the impedance value of the metal layer is smaller than the preset impedance value.
S150, separating the carrier substrate 100 and the display module 10 from each other by adopting a laser stripping process.
Illustratively, the carrier substrate 100 cannot be peeled off if the laser energy in the laser peeling process is too small, the display module 10 is damaged if the laser energy is too large, the laser energy in the laser peeling process is determined by the thickness of the carrier substrate 100 and the thickness of the film attached to the carrier substrate 100, so that the carrier substrate 100 can be ensured to be peeled off normally, and the display module 10 cannot be damaged.
It should be noted that, in fig. 2, which is an embodiment of the method for manufacturing a display panel according to the present application, the sequence of executing the steps in S110 to S150 is not limited to the sequence shown in fig. 2, and the sequence of executing the steps in S110 to S150 is not particularly limited. For example, S130 may be performed before any one of the steps before S140. Specifically, S130 may be performed before S110 or during S110, which is not particularly limited herein.
According to the manufacturing method of the display panel, the metal layer in the display module is formed under the high-temperature process of the preset temperature range, and enough diffusion activation energy can be provided for metal atoms under the high-temperature process, so that the metal atoms orderly occupy lattice positions, crystal grains grow up, defects are fewer under the condition of relatively low temperature, the impedance of the metal layer is smaller, and the voltage drop of the metal layer of the display panel can be reduced.
Optionally, the resistance value of the metal layer being smaller than the preset resistance value includes: the resistance value of the metal layer per 350 nm thickness is less than 100 ohm. Therefore, the resistance value of the metal layer formed in the preset temperature range is smaller, and the voltage drop of the metal layer of the display panel can be reduced.
It should be noted that the specific value of the preset resistance value may be determined according to a specific preparation process, that is, the resistance values of the metal layers are different according to different specific processes.
Illustratively, the resistance value of the metal layer per 350 nm thickness is 80 ohms in the metal layer formed under a high temperature process of 220 degrees celsius. In the metal layer formed under the high temperature process of 260 degrees celsius, the resistance value of the metal layer per 350 nanometers thickness is 60 ohms.
Alternatively, the preset temperature range may include a range of 200 degrees celsius to 300 degrees celsius. Specifically, for the display panel in the related art, the metal layer is generally formed at a temperature higher than 100 degrees celsius and lower than 200 degrees celsius, so that the metal resistance of the metal layer is large, and when the volume of the display panel is increased, the metal resistance is larger, so that the voltage drop of the film layer of the display panel is large. The metal layer in the display module in this embodiment is formed at a high temperature of 200 to 300 degrees celsius, so that the impedance of the metal layer can be reduced, and when the volume of the display panel is increased, the impedance of the metal layer is still smaller, thereby reducing the voltage drop of the metal layer.
Optionally, the metal layer includes the touch layer 11, so that the impedance of the touch layer 11 can be reduced, and when the volume of the display panel is increased, the impedance of the touch layer 11 is still smaller, so that the problem of response delay of the touch function of the large-sized display panel can be improved. Of course, the metal layer may also include other functional layers having metal materials, which are not particularly limited herein.
Optionally, the display module 10 includes a polarizer 12 and a cover plate 13, and at least one of the polarizer 12 and the cover plate 13 is formed in a process of a predetermined temperature range.
Alternatively, the polarizer 12 may be made of an electro-optical material, which may be an electro-optical material or an inorganic electro-optical material, and the polarizer 12 may be formed by a coating process at a high temperature within a predetermined temperature range.
Compared with the display panel using the color film to replace the polarizer 12 in the related art, the color film needs to be aligned with the encapsulation layer 23 when formed on the encapsulation layer 23, and the alignment is difficult. In addition, the polarizer 12 is formed on the carrier substrate 100 by a coating process through a high-temperature process in a preset temperature range, a supporting film is not needed, the thickness of the polarizer 12 can be reduced, the whole thickness of the display panel is reduced, meanwhile, the temperature resistant range is improved, and the bending resistance of the display panel can be improved.
Alternatively, the cover plate 13 may be formed on the carrier substrate 100 by a coating process using a material including at least one of polyimide and a hard coating material. Illustratively, the cover plate 13 is made of polyimide and hard coating materials, the hardness of which is relatively high, and the cover plate 13 made of polyimide and hard coating materials, which are formed by a high temperature process of a preset temperature range, can increase the hardness, so that the surface hardness of the display panel can be relatively high, and the surface hardness and the surface impact resistance of the display panel can be improved.
Optionally, S140 includes:
glue is applied to the side of the display module 10 away from the carrier substrate 100 or to the side of the encapsulation layer 23 away from the light emitting device layer 22 to form a glue layer 14;
the side of the display module 10 away from the carrier substrate 100 is attached to the side of the array layer 21 away from the light emitting device layer 22 by the glue layer 14.
Alternatively, the material used for the glue layer 14 may include OCR glue (Optical Clear Resin, optically transparent resin), and the glue layer 14 may be formed using a coating process. The glue layer 14 is not formed by a high temperature process within a predetermined temperature range. If other film layers are formed between the carrier substrate 100 and the touch layer 11, the film layers formed between the carrier substrate 100 and the touch layer 11 may be formed under a high temperature process in a predetermined temperature range.
Alternatively, the thickness of the glue layer 14 may be less than 30 μm, and the thickness of the glue layer 14 may be made smaller, so that the overall thickness of the display panel can be reduced, which is advantageous for light and thin display panel.
In the related manufacturing method of the display panel, the OCA optical adhesive layer is generally formed by using the OCA optical adhesive, and the thickness of the formed OCA optical adhesive layer is generally 50 μm to 60 μm, which is unfavorable for the light and thin of the display panel. In this embodiment, the material used for the glue coating layer 14 includes OCR glue, and the thickness of the formed glue coating layer 14 can reach below 30 μm, so that the thickness of the glue coating layer 14 is smaller, and the thickness of the glue coating layer 14 can be reduced to a greater extent xiao Tu, so that the overall thickness of the display panel can be reduced, and the light and thin display panel is facilitated.
Optionally, after S130 and before S140, the method for manufacturing a display panel may further include:
inverting the display module 10 formed with the carrier substrate 100 such that a side of the display module 10 away from the carrier substrate 100 is placed opposite to a side of the array layer 21 away from the light emitting device layer 22;
in the inverted state of the display module 10, the side of the display module 10 away from the carrier substrate 100 is aligned with the side of the array layer 21 away from the light emitting device layer 22.
When the alignment is completed by aligning the side of the display module 10 away from the carrier substrate 100 with the side of the array layer 21 away from the light emitting device layer 22, the side of the display module 10 away from the carrier substrate 100 is bonded with the side of the array layer 21 away from the light emitting device layer 22.
In one embodiment, fig. 4 is a flowchart of another method for manufacturing a display panel according to an embodiment of the present application, and fig. 5 is a schematic structural diagram of the other method for manufacturing a display panel according to the embodiment of the present application at each step. With reference to fig. 4 and 5, the preparation method comprises the following steps:
s210, providing a carrier substrate 100.
S220, forming a display module on one side of the carrier substrate 100, wherein the metal layer in the display module is formed under a process of a preset temperature range, so that the impedance value of the metal layer is smaller than the preset impedance value.
Illustratively, the metal layer preset temperature includes the touch layer 11. The material used for the touch layer 11 may include a metal material, and the touch layer 11 may be formed on the carrier substrate 100 using a high temperature process in a predetermined temperature range by a deposition process. The minimum temperature of the preset temperature range can reach 200 ℃. Alternatively, in the process of forming the display module 10, the cover plate 13 and the polarizer 12 may be formed at a predetermined temperature range, in addition to the touch layer 11 being formed at a predetermined temperature range.
S230, providing a display substrate 20, where the display substrate 20 includes an array layer 21, a light emitting device layer 22, and a packaging layer 23 sequentially stacked. Both the array layer 21 and the light emitting device layer 22 may be formed using a deposition process.
S240, forming a rubberizing layer 14 on one side of the touch layer 11 away from the carrier substrate 100.
The execution order of S230 and S240 is not limited, and S230 may be executed first, S240 may be executed second, or S240 may be executed first, and S230 may be executed second.
After S240, the manufacturing method of the display panel may further include:
s250, the display module formed with the carrier substrate 100 is inverted.
Specifically, the touch layer 11 and the glue layer 14 are sequentially formed on the carrier substrate 100, and the display module formed with the carrier substrate 100 is inverted, so that the side of the display module, which is far away from the carrier substrate 100, is opposite to the side of the encapsulation layer 23, which is far away from the light emitting device layer 22, i.e. the glue layer 14 is opposite to the encapsulation layer 23.
And S260, in the inverted state of the display module, aligning the side, away from the carrier substrate 100, of the display module with the side, away from the light-emitting device layer 22, of the packaging layer 23.
Specifically, the side of the display module far away from the carrier substrate 100 is aligned with the side of the encapsulation layer 23 far away from the light emitting device layer 22, so as to ensure that the positions of the touch layer 11 and the glue layer 14, and the array layer 21 and the light emitting device layer 22 are accurate. In addition, the display module can also be aligned in a non-inverted state.
S270, the rubberizing layer 14 is attached to the packaging layer 23, and the carrier substrate 100 and the display module are separated from each other.
In the method for manufacturing a display panel provided in this embodiment, the metal layer is formed under a high temperature process within a predetermined temperature range, and the metal layer is formed under a high temperature process within a predetermined temperature range. From the microstructure, when the temperature is higher, the film forming process of the metal material of the metal layer can provide enough diffusion activation energy for metal atoms, and the metal atoms can orderly occupy lattice positions, so that crystal grains grow up, defects are fewer under the condition of relatively low temperature, and metal impedance is smaller. Therefore, the metal resistance of the metal layer can be reduced by the process of forming the metal layer by the high-temperature process with higher temperature, and the metal resistance is still smaller when the volume of the display panel is increased, so that the voltage drop of the metal layer can be reduced. The metal layer comprises a touch layer, and the problem of response delay of the touch function of the display panel can be solved because the voltage drop of the touch layer is smaller. And the display module and the display substrate are formed separately, so that the problem of ageing of the film layer of the display substrate caused by high temperature can be prevented. And the glue that the rubberizing layer adopted includes OCR glue, and the thickness of rubberizing layer can reach below 30 mu m for the thickness of rubberizing layer is less, can reduce the thickness of rubberizing layer to a great extent, thereby can make display panel's whole thickness reduce, is favorable to display panel's frivolousness.
In one embodiment, the present embodiment also provides another method for manufacturing a display panel. Fig. 6 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application, and fig. 7 is a schematic structural diagram of the method for manufacturing the display panel according to the embodiment of the present application at each step. With reference to fig. 6 and 7, the preparation method comprises the following steps:
s310, a carrier substrate 100 and a substrate 24 are provided.
Illustratively, the substrate 24 may be a flexible substrate, with the substrate 24 being formed from materials including silicon, silicon carbide, and polyimides such as transparent polyimide materials, and the like.
S320, the array layer 21 is formed on the substrate 24.
Illustratively, the array layer 21 includes a drive array, the material used for the array layer 21 includes a semiconductor material, and the array layer 21 may be formed on the substrate 24 using a deposition process.
S330, the light emitting device layer 22 is formed on the side of the array layer 21 away from the substrate 24.
For example, the light emitting device layer 22 may be formed of an OLED, and materials used for the light emitting device layer 22 include a metal material, an organic light emitting material, and the like, and may be formed using a deposition process and an etching process. The light emitting device layer may also be composed of micro LEDs, and micro LED chips may be transferred onto the array layer 21 through a bulk transfer process.
S340, forming an encapsulation layer 23 on a side of the light emitting device layer 22 away from the array layer 21.
Illustratively, the encapsulation layer 23 may be made of a material including tetrafluoroethylene, which is highly stable and corrosion resistant, and the encapsulation layer 23 may be formed on the light emitting device layer 22 using a deposition process.
The display substrates are formed in S320 to S340.
The preparation method of the display panel further comprises the following steps:
s350, forming the cover plate 13 on the carrier substrate 100 under a high temperature process in a preset temperature range.
S360, forming the polarizer 12 on one side of the cover plate away from the carrier substrate 100 under a high temperature process in a preset temperature range.
S370, forming a touch layer 11 on one side of the polarizer 12 away from the cover plate 13 under a high temperature process within a preset temperature range.
Illustratively, the material used for the touch layer 11 includes a metal material, and the touch layer 11 may be formed on a side of the polarizer 12 away from the cover plate 13 by a deposition process. The touch layer 11 is formed under a high temperature process within a preset temperature range, so that the metal impedance of the touch layer 11 can be reduced, and the problem of response delay of the touch function of the display panel is solved.
And S380, forming a rubberizing layer 14 on one side of the touch control layer 11 far away from the polaroid 12.
Illustratively, the material used for the glue layer 14 may include OCR glue (Optical Clear Resin, optically transparent resin), and the glue layer 14 may be formed on the side of the touch layer 11 away from the carrier substrate 100 by a coating process, and the glue layer 14 may be formed without using a high temperature process of a predetermined temperature range.
The above-mentioned S350 to S380 form a display module.
The preparation method of the display panel further comprises the following steps:
s390, the display substrate is attached to the display module through the glue coating layer 14.
Illustratively, the encapsulation layer 23 is positioned on the light emitting device layer 22, and the glue layer 14 formed on the carrier substrate 100 is bonded to the encapsulation layer 23 such that the glue layer 14 is positioned on a side of the encapsulation layer 23 remote from the light emitting device layer 10.
S391, the carrier substrate 100 is peeled from the cover plate 13 by a laser peeling process.
Specifically, the carrier substrate 100 may be peeled from the cover plate 13 by using a laser peeling process, and if the laser energy in the laser peeling process is too small, the carrier substrate 100 cannot be peeled, and if the laser energy is too large, the cover plate 13 is damaged, and if the laser energy in the laser peeling process is determined by the thickness of the carrier substrate 100 and the thickness of the cover plate 13, normal peeling of the carrier substrate 100 can be ensured, and the first functional layer cannot be damaged.
According to the preparation method of the display panel, the cover plate, the polaroid and the touch layer are sequentially formed on the carrier substrate under the high-temperature process of the preset temperature range, and the touch layer is formed under the high-temperature process of the preset temperature range, so that the preset temperature process is higher in temperature, and when the temperature is higher in microstructure, the metal material film forming process of the touch layer can provide enough diffusion activation energy for metal atoms, the metal atoms can occupy lattice positions in a more ordered manner, crystal grains grow up, defects are fewer under the condition of relatively low temperature, and metal impedance is smaller. Therefore, the process of forming the touch control by the high-temperature process with higher temperature can reduce the metal impedance of the touch control layer, and the metal impedance is smaller when the volume of the display panel is increased, so that the problems of voltage drop of the film layer of the display panel and delay of the touch control function can be reduced. Meanwhile, the hardness and impact resistance of the cover plate formed at high temperature are improved, so that the surface hardness and the surface impact resistance of the display panel can be improved. And the array layer, the light-emitting device layer and the packaging layer are sequentially formed on the substrate, the light-emitting device layer and the packaging layer are not formed on the carrier substrate together with the touch layer by a high-temperature process, and the problem of ageing of the light-emitting material in the light-emitting device layer caused by high temperature can be avoided.
The embodiment of the application also provides a display panel, which is prepared by adopting the preparation method of the display panel according to any embodiment of the application.
Fig. 8 is a schematic structural diagram of a display panel according to an embodiment of the application. Referring to fig. 8, the display panel includes: the display module 10 and the display substrate 20, the display module 10 is located on the display substrate 20; the resistance value of the metal layer in the display module 10 is smaller than the preset resistance value.
The display module 10 may also include one film layer or two or more film layers, and the display substrate 20 may include one film layer or two or more film layers. The display module 10 is located at one side of the display substrate 20 far away from the substrate of the display panel, and the impedance value of the metal layer in the display module 10 is smaller than the preset impedance value, so that the impedance of the metal layer is smaller, and the voltage drop of the metal layer can be effectively reduced.
Fig. 9 is a schematic structural diagram of another display panel according to an embodiment of the application. Referring to fig. 9, the display module 10 includes a touch layer 11, a polarizer 12, and a cover 13 sequentially stacked, and at least one of the touch layer 11, the polarizer 12, and the cover 13 is formed in a process of a predetermined temperature range.
The display substrate 20 includes: the array layer 21, the light emitting device layer 22 and the encapsulation layer 23 are sequentially stacked, and the encapsulation layer 23 is located on the light emitting device layer 22 and is used for encapsulating the light emitting device layer 22.
Illustratively, the glue layer 14 is located on a side of the encapsulation layer 23 away from the light emitting device layer 22, and the touch layer 11 is located on a side of the glue layer 14 away from the encapsulation layer 23, where the glue layer 14 is used to fix the touch layer 11 on the encapsulation layer 23.
The material used for the glue layer 14 may include OCR glue (Optical Clear Resin, optical transparent resin), and the thickness of the glue layer 14 formed by using OCR glue is smaller than that of an OCA optical glue layer formed by using OCA (Optically Clear Adhesive, optical transparent adhesive) optical glue in the prior art.
Alternatively, the thickness of the glue coating layer 14 is smaller than the preset thickness, so that the thickness of the glue coating layer 14 can be smaller, and the overall thickness of the display panel can be reduced, which is beneficial to the light and thin of the display panel. Optionally, the thickness of the glue layer 14 is less than 30 μm. Specifically, in the conventional display panel, the thickness of the OCA optical adhesive layer formed by OCA optics is generally 50 μm to 60 μm, and the thickness is large, which is disadvantageous for the light and thin of the display panel. The glue coating layer 14 of the display panel in this embodiment is made of OCR glue, and the thickness of the glue coating layer 14 can be less than 30 μm, so that the thickness of the glue coating layer 14 is smaller, and the thickness of the glue coating layer 14 can be reduced xiao Tu to a greater extent, so that the overall thickness of the display panel can be reduced, and the display panel is light and thin.
Fig. 10 is a schematic structural diagram of another display panel according to an embodiment of the present application. Referring to fig. 10, in one embodiment, the film layer of the display substrate 20 further includes a substrate 24, and the array layer 21, the light emitting device layer 22, the encapsulation layer 23, the glue layer 14, the touch layer 11, the polarizer 12, and the cover plate 13 are sequentially disposed on the substrate 24.
Illustratively, the material of the cover 13 includes: at least one of polyimide and hard coat material. The cover plate 13 may be made of polyimide and a hard coating material, and the polyimide and the hard coating material have high hardness, and the cover plate 13 may be made of polyimide and the hard coating material to have high surface hardness, so that the surface impact resistance of the display panel may be improved.
In summary, in this embodiment, by disposing the display module on the display substrate, the touch layer in the display module is formed under a high temperature process with a preset temperature, and the preset temperature is higher, so that when the temperature is higher, the film forming process of the metal material of the touch layer can provide sufficient diffusion activation energy for the metal atoms, the metal atoms can occupy the lattice positions in a relatively orderly manner, so that the crystal grains grow up, defects are fewer at a relatively low temperature, and thus the metal impedance is smaller, and the metal impedance of the touch layer can be reduced. When the volume of the display panel is increased, the metal impedance is still smaller, and the problems of voltage drop of a film layer of the display panel and delay of a touch function can be reduced. Meanwhile, the cover plate is made of polyimide and hard coating materials, the hardness of the polyimide and the hard coating materials is high, and the hardness of the cover plate can be improved by adopting the polyimide and the hard coating materials, so that the surface hardness and the surface impact resistance of the display panel can be improved. And the glue that the rubberizing layer adopted includes OCR glue, and the thickness of rubberizing layer can reach below 30 mu m for the thickness of rubberizing layer is less, can reduce the thickness of rubberizing layer to a great extent, thereby can make display panel's whole thickness reduce, is favorable to display panel's frivolousness.
The embodiment of the application also provides a display device which comprises the display panel according to any embodiment of the application, so that the display device has the corresponding structure and beneficial effects of the display panel, and the description is omitted here.
Illustratively, the display panel may be a rollable display panel and the display device may be a rollable display device. For example, the display device may be a rollable television, a rollable cell phone, a rollable computer, or the like.
Note that the above is only a preferred embodiment of the present application and the technical principle applied. It will be understood by those skilled in the art that the present application is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements, combinations, and substitutions can be made by those skilled in the art without departing from the scope of the application. Therefore, while the application has been described in connection with the above embodiments, the application is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the application, which is set forth in the following claims.
Claims (9)
1. A method for manufacturing a display panel, comprising:
providing a carrier substrate;
forming a display module on one side of the carrier substrate, wherein a metal layer in the display module is formed in a process of a preset temperature range, so that the impedance value of the metal layer is smaller than a preset impedance value;
providing a display substrate, wherein the display substrate comprises a light-emitting device layer and a packaging layer formed on one side of the light-emitting device layer;
bonding one side of the display module, which is far away from the carrier substrate, with one side of the packaging layer, which is far away from the light-emitting device layer;
separating the carrier substrate and the display module by adopting a laser stripping process;
the resistance value of the metal layer is smaller than a preset resistance value, and the method comprises the following steps: the resistance value of the metal layer is less than 100 ohms per 350 nanometers thickness;
the preset temperature range includes a range of 200 degrees celsius to 300 degrees celsius.
2. The method of claim 1, wherein the metal layer comprises a touch layer.
3. The method of claim 1, wherein the display module includes a polarizer and a cover plate, at least one of the polarizer and the cover plate being formed at the predetermined temperature range.
4. The method of manufacturing according to claim 1, wherein bonding the side of the display module away from the carrier substrate to the side of the encapsulation layer away from the light emitting device layer comprises:
gluing the side, far away from the carrier substrate, of the display module or the side, far away from the light-emitting device layer, of the packaging layer to form a glue coating layer;
and bonding one side, far away from the carrier substrate, of the display module with one side, far away from the light-emitting device layer, of the packaging layer through the glue coating layer.
5. The method of claim 4, wherein the glue layer comprises an optically transparent resin.
6. The method of claim 4, wherein the glue layer has a thickness of less than 30 μm.
7. The method of claim 1, wherein after providing a display substrate and before attaching the side of the display module away from the carrier substrate to the side of the encapsulation layer away from the light emitting device layer, the method further comprises:
inverting the display module with the carrier substrate formed so that a side of the display module, which is far away from the carrier substrate, is placed opposite to a side of the encapsulation layer, which is far away from the light emitting device layer;
and under the inverted state of the display module, aligning one side, far away from the carrier substrate, of the display module with one side, far away from the light emitting device layer, of the packaging layer.
8. A display panel prepared by the method of any one of claims 1 to 7.
9. A display device comprising the display panel according to claim 8.
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| CN109119453A (en) * | 2018-09-25 | 2019-01-01 | 武汉天马微电子有限公司 | Display panel and preparation method thereof and display device |
| CN110233207A (en) * | 2018-03-05 | 2019-09-13 | 上海和辉光电有限公司 | Display panel production method, display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110233207A (en) * | 2018-03-05 | 2019-09-13 | 上海和辉光电有限公司 | Display panel production method, display panel and display device |
| CN109119453A (en) * | 2018-09-25 | 2019-01-01 | 武汉天马微电子有限公司 | Display panel and preparation method thereof and display device |
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