CN114335057A - Colored Microled - Google Patents
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- CN114335057A CN114335057A CN202111590281.7A CN202111590281A CN114335057A CN 114335057 A CN114335057 A CN 114335057A CN 202111590281 A CN202111590281 A CN 202111590281A CN 114335057 A CN114335057 A CN 114335057A
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Abstract
The invention relates to a color Microled which comprises a substrate layer, driving chips, a first light-emitting layer, a metal contact electrode and a second light-emitting layer, wherein a plurality of driving chips are arranged on the substrate layer, the first light-emitting layer is arranged above the driving chips, the first light-emitting chip in the first light-emitting layer is connected with the corresponding driving chip on the substrate layer, the second light-emitting layer is arranged above the first light-emitting layer, the second light-emitting chip in the second light-emitting layer is connected with the corresponding driving chip on the substrate layer through the metal contact electrode, the first light-emitting chip in the first light-emitting layer and the second light-emitting chip in the second light-emitting layer are arranged back to back, and the colors of the first light-emitting chip and the second light-emitting chip are different. The micro LED of the invention designs two light emitting chips, namely the first light emitting chip and the second light emitting chip, wherein the two light emitting chips emit primary color light with two different colors, and the color light can be mixed to generate a color effect.
Description
Technical Field
The invention relates to the field of design and manufacture of colored Microled, in particular to colored Microled.
Background
The micro LED display technology is a display technology in which a self-luminous micrometer-scale LED is used as a light-emitting pixel unit, and the light-emitting pixel unit is assembled on a driving panel to form a high-density LED array. Due to the characteristics of small size, high integration level, self-luminescence and the like of the micro LED chip, compared with an LCD and an OLED, the micro LED chip has the advantages of higher brightness, resolution, contrast, energy consumption, service life, response speed, thermal stability and the like in the aspect of display.
With the rise of the Microled market, the Microled technology has been widely studied. Among them, the process difficulty of combining the micro light emitting chip and the driving chip is a major problem that hinders the commercialization thereof. The existing technology for combining the Microled light-emitting chip with the driving chip comprises Stamp mass transfer, laser transfer, electrostatic transfer, electromagnetic transfer, fluid self-assembly and the like. The technical scheme has the problems of low yield of single working step and long time.
Currently, the display size required on small-sized head-mounted AR/VR is small, about less than or equal to 0.5 inches, and the wafer to wafer bonding scheme has the advantages of high yield and short time. However, in the wafer to wafer scheme, colorization has not been a good solution, and the practical application of the technology is severely limited.
Thus, there is a need for further improvements to the wafer to wafer scheme to achieve a colorization scheme for micro leds.
Disclosure of Invention
The invention aims to provide a colored Microled capable of solving the problem that colorization cannot be realized by adopting a wafer to wafer scheme for the MicroLED in the background art.
In order to achieve the purpose, the invention is realized by the following technical scheme: a color micro comprises a substrate layer, driving chips, a first light emitting layer, a first transparent insulating layer, a metal contact electrode and a second light emitting layer, wherein the driving chips are arranged on the substrate layer, the first light emitting layer is arranged above the driving chips, the first light emitting chip in the first light emitting layer is connected with the corresponding driving chip on the substrate layer, the first transparent insulating layer is arranged above the first light emitting layer, the second light emitting layer is arranged above the first transparent insulating layer, the second light emitting chip in the second light emitting layer is connected with the corresponding driving chip on the substrate layer through the metal contact electrode, and the first light emitting chip in the first light emitting layer and the second light emitting chip in the second light emitting layer are arranged back to back.
As a further improvement of the color micro, the driving chip is embedded on the upper side of the substrate layer, and the upper surface of the driving chip is in contact and electrical connection with the first light emitting chip or the metal contact electrode.
As a further improvement of the above color micro, the first light emitting layer includes a first transparent insulating layer, a second transparent insulating layer and a first light emitting chip, the first light emitting chip is embedded on the lower side surface of the first transparent insulating layer, and the bottom surface of the first light emitting chip contacts with the driving chip and is electrically connected to the driving chip, a first groove is arranged above the first light emitting chip in the first transparent insulating layer, the bottom of the first groove corresponds to the upper surface of the first light emitting chip, the second transparent insulating layer is arranged above the first transparent insulating layer, a protrusion corresponding to the first groove is arranged on the second transparent insulating layer, and the shape of the protrusion corresponds to the shape of the first groove.
As a further improvement of the color micro, the second light emitting layer includes a third transparent insulating layer, a fourth transparent insulating layer and a second light emitting chip, the second light emitting chip is embedded in the upper side surface of the fourth transparent insulating layer, the upper surface of the second light emitting chip is electrically connected to the upper end of the metal contact electrode through a wire, a second groove is formed below the second light emitting chip in the fourth transparent insulating layer, the bottom of the second groove corresponds to the lower surface of the second light emitting chip, the third transparent insulating layer is disposed below the fourth transparent insulating layer, a protrusion corresponding to the second groove is formed in the third transparent insulating layer, and the shape of the protrusion corresponds to the shape of the second groove.
As a further improvement of the color micro, the first light emitting chip and the second light emitting chip are both in a truncated cone shape, a circular surface of the first light emitting chip with a larger diameter is arranged downward, and a circular surface of the second light emitting chip with a smaller diameter is arranged downward.
As a further improvement of the color micro, the metal contact electrode includes a first metal contact electrode and a second metal contact electrode, the first metal contact electrode is disposed in the first light emitting layer, and the second metal contact electrode penetrates through the second light emitting layer and is bonded to the first metal contact electrode.
As a further improvement of the above color micro, the first metal contact electrode and the second metal contact electrode are both in a truncated cone shape, the circular surface on the larger side of the diameter of the first metal contact electrode is arranged downward, the circular surface on the larger side of the diameter of the first contact electrode is adapted to the size of the upper surface of the driving chip, the circular surface on the smaller side of the diameter of the second metal contact electrode is arranged downward, the circular surface on the smaller side of the diameter of the second metal contact electrode is adapted to the circular surface on the smaller side of the diameter of the first metal electrode, the two are in contact with each other and are electrically connected, and the upper end of the second metal contact electrode extends to the upper surface of the second light emitting layer and is electrically connected with the second light emitting chip through a wire.
As a further improvement of the color micro, the second light-emitting layer is further provided with a third light-emitting layer, and a third light-emitting chip of the third light-emitting layer is electrically connected with the driving chip through a metal contact electrode. By providing the third light-emitting layer, the third light-emitting layer can be combined with light of the first light-emitting layer and the second light-emitting layer, and the three light-emitting layers are combined with three primary colors of RGB, so that the Microled can emit color light.
The invention has the positive effects that: 1) the color Microled of the invention designs two light-emitting chips, namely a first light-emitting chip and a second light-emitting chip, wherein the two light-emitting chips emit light with two different colors, two of the three primary colors are usually selected for the color, and the color effect is generated by mixing color light; 2) the colored Microled adopts the back-to-back bonding technology, so that the colorizing process of the Microled is simplified and is convenient to implement.
Drawings
Fig. 1 is a schematic cross-sectional structure of a color micro according to the present invention.
FIG. 2 is a flow chart of the production process of the colored Microled of the present invention.
In the figure, a substrate layer 1, a driving chip 2, a first light emitting layer 3, a first transparent insulating layer 31, a second transparent insulating layer 32, a first light emitting chip 33, a metal contact electrode 4, a first metal contact electrode 41, a second metal contact electrode 42, a second light emitting layer 5, a third transparent insulating layer 51, a fourth transparent insulating layer 52 and a second light emitting chip 53.
Detailed Description
The technical solutions of the present invention are described clearly and completely by the following embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, a color micro includes a substrate layer, a driving chip, a first light emitting layer, a metal contact electrode, and a second light emitting layer.
The substrate layer is a 0.725mm Si layer.
The plurality of driving chips are arranged on the upper side face of the substrate layer in an embedded mode at a certain interval, and the upper surfaces of the driving chips are in contact with and electrically connected with the first light-emitting chips or the metal contact electrodes. Since the positions of the driving chips correspond to the positions of the first light emitting chip and the metal contact electrode, and the positions of the metal contact electrode correspond to the positions of the second light emitting chip, the distance between the driving chips must be reasonably controlled.
The first light-emitting layer is arranged above the driving chips, and the first light-emitting chips in the first light-emitting layer are connected with the corresponding driving chips on the substrate layer. The first light-emitting layer comprises a first transparent insulating layer, a second transparent insulating layer and a first light-emitting chip, the first light-emitting chip is embedded to be arranged on the lower side face of the first transparent insulating layer, the bottom face of the first light-emitting chip is in contact with the driving chip and is electrically connected with the driving chip, a first groove is formed in the first transparent insulating layer above the first light-emitting chip, the bottom of the first groove corresponds to the upper surface of the first light-emitting chip, the second transparent insulating layer is arranged above the first transparent insulating layer, a bulge corresponding to the first groove is formed in the second transparent insulating layer, and the shape of the bulge corresponds to that of the first groove.
The second light-emitting layer is arranged above the first transparent insulating layer, and a second light-emitting chip in the second light-emitting layer is connected with a corresponding driving chip on the substrate layer through a metal contact electrode. The second luminescent layer comprises a third transparent insulating layer, a fourth transparent insulating layer and a second luminescent chip, the second luminescent chip is embedded to be arranged on the upper side face of the fourth transparent insulating layer, the upper surface of the second luminescent chip is electrically connected with the upper end part of the metal contact electrode through a wire, a second groove is arranged below the second luminescent chip in the fourth transparent insulating layer, the bottom of the second groove corresponds to the lower surface of the second luminescent chip, the third transparent insulating layer is arranged below the fourth transparent insulating layer, a bulge corresponding to the second groove is arranged on the third transparent insulating layer, and the shape of the bulge corresponds to that of the second groove.
The first light-emitting chip and the second light-emitting chip are both in a round platform shape, the round face on the larger side of the diameter of the first light-emitting chip is arranged downwards, the round face on the smaller side of the diameter of the second light-emitting chip is arranged downwards, and the first light-emitting chip and the second light-emitting chip are arranged back to back.
Although the first light-emitting chip and the second light-emitting chip are described as being in the truncated cone shape in the above scheme, the specific shapes of the first light-emitting chip and the second light-emitting chip can be set according to actual design requirements, so that the first light-emitting chip and the second light-emitting chip meet specific process design requirements.
The metal contact electrode comprises a first metal contact electrode and a second metal contact electrode, the first metal contact electrode is arranged in the first light-emitting layer, and the second metal contact electrode penetrates through the second light-emitting layer to be bonded with the first metal contact electrode. First metal contact electrode and second metal contact electrode are the round platform shape, the great one side circular surface of diameter of first metal contact electrode sets up downwards, and the great one side circular surface of first contact electrode diameter suits with driver chip's upper surface size, the less one side circular surface of diameter of second metal contact electrode sets up downwards, and the less one side circular surface of diameter of second metal contact electrode suits with the less one side circular surface size of first metal electrode diameter, the two contacts, and the electricity is connected, the upper end of second metal contact electrode extends to the upper surface top of second luminescent layer, and be connected through wire and second luminescence chip electricity. Although the first metal contact electrode and the second metal contact electrode are described as being both in the truncated cone shape in the above-mentioned scheme, the specific shapes of the first metal contact electrode and the second metal contact electrode may be set according to actual design requirements, so that the first metal contact electrode and the second metal contact electrode meet specific process design requirements.
Although only the first light emitting layer and the second light emitting layer are provided in the above-described embodiments, in order to implement complete combination of three primary colors of RGB, a fourth transparent insulating layer may be further provided above the second light emitting layer, and a third light emitting layer is further provided on the fourth transparent insulating layer, and a third light emitting chip of the third light emitting layer is electrically connected to the driving chip through a metal contact electrode. By arranging the third light emitting layer, the third light emitting layer can be combined with the light of the first light emitting layer and the light of the second light emitting layer, and the three light emitting layers are combined by three primary colors of RGB, so that the Microled can emit complete RGB colored light.
As shown in fig. 2, the production process of the colored Microled of the present invention is as follows: s1 preparing an epitaxial layer, wherein the epitaxial layer comprises a 1.3mm Si layer, a Buffer layer (Buffer layer-Al (Ga) N-1650 nm) and an N layer (N layer-GaN-1500 nm); s2, preparing a first light-emitting layer on the substrate layer, wherein a first light-emitting chip and a first metal contact electrode are arranged in the first light-emitting layer; s3, arranging a driving chip on the substrate layer in an embedded manner, then bonding the driving chip and the first light-emitting layer, wherein during bonding, the driving chip is correspondingly contacted with and electrically connected with the first light-emitting chip and the first metal contact electrode in the first light-emitting layer; s4, removing the substrate layer of the first light-emitting layer, wherein the substrate layer comprises a 1.3mm Si layer and a Buffer layer (Buffer layer-Al (Ga) N-1650 nm), and the N layer is reserved as a second transparent insulating layer; s5, preparing a second light-emitting layer as shown in FIG. 2, turning the chip processed in S4 by 180 degrees to turn the first light-emitting layer to the upward direction, and then bonding the prepared second light-emitting layer and the first light-emitting layer back to back, wherein the second light-emitting layer is bonded above the first light-emitting layer, and the first metal contact electrode and the first light-emitting chip are positioned in the middle of the second light-emitting chip of the second light-emitting layer; s6 removing the substrate layer on the second light-emitting layer; s7, forming a second metal contact electrode between the second light-emitting chips in the second light-emitting layer by deep hole etching, electroplating and CMP process, bonding the second metal contact electrode with the first metal contact electrode in the first light-emitting layer, and electrically connecting the upper end of the second metal contact electrode with the second light-emitting chip through a wire.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A colored Microled, its characterized in that: the LED driving chip comprises a substrate layer, driving chips, a first light-emitting layer, metal contact electrodes and a second light-emitting layer, wherein the driving chips are arranged on the substrate layer, the first light-emitting layer is arranged above the driving chips, the first light-emitting chip in the first light-emitting layer is connected with the corresponding driving chip on the substrate layer, the second light-emitting layer is arranged above the first light-emitting layer, the second light-emitting chip in the second light-emitting layer is connected with the corresponding driving chip on the substrate layer through the metal contact electrodes, the first light-emitting chip in the first light-emitting layer and the second light-emitting chip in the second light-emitting layer are arranged back to back, and the colors of the first light-emitting chip and the second light-emitting chip are different.
2. A color micro according to claim 1, wherein: the driving chip is embedded on the upper side surface of the substrate layer, and the upper surface of the driving chip is in contact with and electrically connected with the first light-emitting chip or the metal contact electrode.
3. A color micro according to claim 1, wherein: the first light-emitting layer comprises a first transparent insulating layer, a second transparent insulating layer and a first light-emitting chip, the first light-emitting chip is embedded to be arranged on the lower side face of the first transparent insulating layer, the bottom face of the first light-emitting chip is in contact with the driving chip and is electrically connected with the driving chip, a first groove is formed in the first transparent insulating layer above the first light-emitting chip, the bottom of the first groove corresponds to the upper surface of the first light-emitting chip, the second transparent insulating layer is arranged above the first transparent insulating layer, a bulge corresponding to the first groove is formed in the second transparent insulating layer, and the shape of the bulge corresponds to that of the first groove.
4. A color micro according to claim 1, wherein: the second luminescent layer comprises a third transparent insulating layer, a fourth transparent insulating layer and a second luminescent chip, the second luminescent chip is embedded to be arranged on the upper side face of the fourth transparent insulating layer, the upper surface of the second luminescent chip is electrically connected with the upper end part of the metal contact electrode through a wire, a second groove is arranged below the second luminescent chip in the fourth transparent insulating layer, the bottom of the second groove corresponds to the lower surface of the second luminescent chip, the third transparent insulating layer is arranged below the fourth transparent insulating layer, a bulge corresponding to the second groove is arranged on the third transparent insulating layer, and the shape of the bulge corresponds to that of the second groove.
5. A color micro according to claim 1, wherein: the first light-emitting chip and the second light-emitting chip are both in a round table shape, the round face on the larger side of the first light-emitting chip in diameter is arranged downwards, and the round face on the smaller side of the second light-emitting chip in diameter is arranged downwards.
6. A color micro according to claim 1, wherein: the metal contact electrode comprises a first metal contact electrode and a second metal contact electrode, the first metal contact electrode is arranged in the first light-emitting layer, and the second metal contact electrode penetrates through the second light-emitting layer to be bonded with the first metal contact electrode.
7. A color micro according to claim 6, wherein: first metal contact electrode and second metal contact electrode be the round platform shape, the great one side circular surface of diameter of first metal contact electrode sets up downwards, and the great one side circular surface of first contact electrode diameter suits with driver chip's upper surface size, the less one side circular surface of diameter of second metal contact electrode sets up downwards, and the less one side circular surface of diameter of second metal contact electrode suits with the less one side circular surface size of first metal electrode diameter, the two contacts, and the electricity is connected, the upper end of second metal contact electrode extends to the upper surface top of second luminescent layer, and be connected with second luminescent chip electricity through the wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111590281.7A CN114335057A (en) | 2021-12-23 | 2021-12-23 | Colored Microled |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111590281.7A CN114335057A (en) | 2021-12-23 | 2021-12-23 | Colored Microled |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114335057A true CN114335057A (en) | 2022-04-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111590281.7A Pending CN114335057A (en) | 2021-12-23 | 2021-12-23 | Colored Microled |
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|---|---|
| CN (1) | CN114335057A (en) |
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2021
- 2021-12-23 CN CN202111590281.7A patent/CN114335057A/en active Pending
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Effective date of registration: 20230727 Address after: 518000 room 402, building 24, Lianhua second village, No. 5002, Hongli West Road, Lianhua second village community, Huafu street, Futian District, Shenzhen, Guangdong Province Applicant after: Shenzhen Aoshi Micro Technology Co.,Ltd. Address before: 528000 No. 28, Huandao South Road, Guicheng Street, Nanhai District, Foshan City, Guangdong Province Applicant before: Ji Huashiyanshi |
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