CN114334769B - Integrated IC vibration conveying device - Google Patents
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- CN114334769B CN114334769B CN202210237076.0A CN202210237076A CN114334769B CN 114334769 B CN114334769 B CN 114334769B CN 202210237076 A CN202210237076 A CN 202210237076A CN 114334769 B CN114334769 B CN 114334769B
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Abstract
The application provides an integrated IC vibrating conveyor, belongs to integrated IC production facility technical field. The vibration conveying device includes: base and conveyer trough. The base is the conical shape of vertical setting. The conveying groove is of a spiral rising structure along the outer wall of the base, the section of the conveying groove is of an L shape and comprises a bottom plate and side edges, an interval is formed between the bottom plate and the side wall of the base, a clamping groove is formed in the edge of the junction of the inner wall of the side edge and the bottom plate, when the integrated IC pins are positioned below and tightly attached to the bottom plate and face the normal direction of the base, the pins on one side of the integrated IC are positioned in the clamping groove in a sliding mode and conveyed along the clamping groove; the lower end of the conveying trough is a feeding end, and the upper end of the conveying trough is provided with a first discharging trough; the conveying track along the conveying groove is sequentially provided with: the second discharge chute, the first blanking mechanism and the second blanking mechanism. The vibration conveying device can reduce the repeated arrangement process and times of the integrated ICs, and further improve the feeding and conveying efficiency.
Description
Technical Field
The invention belongs to the technical field of integrated IC production equipment, and particularly relates to an integrated IC vibrating conveying device.
Background
The vibration feed tray is widely applied in the integrated IC production process, aims to arrange and convey IC chips and is an important front-end device for realizing automatic conveying, packaging and detection of the integrated ICs.
The application number is CN201220016045.4 discloses IC chip automatic feeding device, packaging equipment and packaging system for IC chip material loading, although the shell improves IC chip's production efficiency, the loading attachment of this kind of structure, when the unqualified IC chip of position state will directly drop to the bottom of vibration dish in the material loading process, then arrange at random again, and get into the heliciform recess again, it is very likely to fall again because of the position is unqualified, if the circulation is reciprocal many times, lead to IC chip material loading efficiency lower wantonly, and increase the number of times that the IC chip was carried repeatedly, cause the IC chip to damage easily.
Disclosure of Invention
In order to solve the defects of the prior art, the invention provides the integrated IC vibrating conveying device, which can reduce the repeated arrangement process and times of the integrated ICs and further improve the feeding conveying efficiency.
In order to realize the purpose of the invention, the following scheme is adopted:
an integrated IC vibratory conveying apparatus, comprising: base and conveyer trough.
The base is the conical shape of vertical setting.
The conveying groove is of a spiral rising structure along the outer wall of the base, the section of the conveying groove is of an L shape and comprises a bottom plate and side edges, an interval is formed between the bottom plate and the side wall of the base, a clamping groove is formed in the edge of the junction of the inner wall of the side edge and the bottom plate, when the integrated IC pins are positioned below and tightly attached to the bottom plate and face the normal direction of the base, the pins on one side of the integrated IC are positioned in the clamping groove in a sliding mode and conveyed along the clamping groove; the lower end of the conveying trough is a feeding end, and the upper end of the conveying trough is provided with a first discharging trough;
the conveying track along the conveying groove is sequentially provided with:
the front end of the second discharge chute is arranged on the side edge of the conveying chute and is positioned above the clamping groove at intervals, and the rear end of the second discharge chute is laid along the tangential direction of the conveying chute and is used for outputting an integrated IC with pins positioned above and facing the normal direction of the base;
the first blanking mechanism is used for enabling the pins to be positioned above the second discharging groove, enabling the pins to fall into the conveying groove below the second discharging groove towards the integrated IC in the tangential direction of the base, and enabling the falling point to be positioned behind the conveying direction of the second discharging groove;
the second blanking mechanism is used for enabling the pins to be located below, and the integrated ICs of which the pins face the tangential direction of the base fall into the conveying grooves below.
Further, still include the rolling disc, the coaxial below of locating base and conveyer trough, the rolling disc is rotatory around the axis, and the direction of rotation is unanimous with the spiral direction of conveyer trough, and the rolling disc has the side bounding wall.
Furthermore, a first notch is formed in the position, corresponding to the second discharging groove, of the side edge, and the first notch is located above the clamping groove at intervals.
Further, the falling point of the integrated IC falling from the second blanking mechanism is positioned in front of the conveying direction of the second discharging groove.
Furthermore, an air blowing pipe is arranged below the second blanking mechanism, and the air blowing pipe is inclined from top to bottom towards the conveying direction of the conveying groove.
Furthermore, the outer wall of the base is provided with guide grooves corresponding to the first blanking mechanism and the second blanking mechanism, the guide grooves are arranged downwards along the bus direction of the conical surface of the base, one side wall of each guide groove is of a linear structure, the upper section of the other side wall of each guide groove is bent towards the outer side of the corresponding guide groove, the width of the lower section of each guide groove is larger than the width of the integrated IC and smaller than the length of the integrated IC, the connecting lines of two ends of the pins of the integrated IC are defined as the length direction, and the connecting lines of the other two ends of the integrated IC are defined as the width direction.
Furthermore, a second notch is formed in the position, corresponding to the first blanking mechanism, of the side edge, the second notch is arranged above the clamping groove at intervals, a wedge block is arranged on the position, corresponding to the first blanking mechanism, of the top surface of the bottom plate, the wedge block is arranged along the track of the conveying groove, and the top surface of the rear section of the wedge block in the conveying direction is an inclined surface; the top surface of the bottom plate is used as a base surface, the height of the top surface of the front section of the wedge block is higher than that of the bottom surface of the second notch, the height of the wedge block is lower than the height difference between the integrated IC pins and the bottom surface of the plastic package body, the width of the wedge block is smaller than the distance between the integrated IC pins on the same side, a space is formed between the wedge block and the inner wall of the side edge, and the space is larger than the width of a single pin.
Furthermore, a rectangular through hole is formed in the position, corresponding to the second blanking mechanism, of the bottom plate and used for downwards dropping out the integrated IC.
The invention has the beneficial effects that: the first discharge chute and the second discharge chute are arranged, so that the integrated ICs in two position states with pins facing the normal direction of the base can be output, the number of times of circulating arrangement of the integrated ICs in one position state is reduced, and the feeding efficiency is improved; a first blanking mechanism is arranged behind the second discharging groove for positioning the pins above, and the pins fall towards the integrated IC in the tangential direction of the base, turn the posture of the integrated IC and output through the second discharging groove; a second blanking mechanism is arranged in front of the second discharge chute in conveying and used for positioning the pins below, enabling the pins to fall towards the integrated IC in the tangential direction of the base and turning the posture of the integrated IC, enabling the pins to be inserted into the clamping grooves and output from the first discharge chute along the conveying chute; the discharging pins of the first blanking mechanism and the second blanking mechanism are used for inserting the integrated ICs into the clamping grooves and the second discharging grooves, the postures of the integrated ICs are adjusted, the integrated ICs are prevented from directly falling into the rotating disc to be circularly arranged again, the feeding efficiency is improved, the number of times of circular arrangement of the integrated ICs is reduced, and the probability of damage of the integrated ICs is reduced.
Drawings
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Fig. 1 is a schematic view showing a state where the second blanking mechanism and the second discharge chute convey the integrated ICs.
Fig. 2 shows an enlarged view at a in fig. 1.
Fig. 3 is a schematic diagram showing the state of the integrated IC passing through the first blanking mechanism and entering the second discharge chute.
Fig. 4 shows an enlarged view at B in fig. 3.
Fig. 5 shows an enlarged view at C in fig. 3.
Fig. 6 is a schematic view showing a state where the integrated IC is discharged from the first and second discharging mechanisms.
Fig. 7 shows an enlarged view at D in fig. 6.
Fig. 8 shows an enlarged view at E in fig. 6.
Fig. 9 is a schematic diagram showing a state where the integrated ICs are dropped from the first and second dropping mechanisms into the conveying chute below.
Fig. 10 shows an enlarged view at F in fig. 9.
Fig. 11 shows a top view of the base and the trough.
Fig. 12 shows a cross-sectional view taken along the direction H-H in fig. 11.
Fig. 13 shows a square at G in fig. 12.
Fig. 14 shows a state diagram of a guide groove structure of the prior art stuck on an integrated IC.
Fig. 15 shows another state diagram of a prior art guide slot structure stuck on an integrated IC.
The mark in the figure is: the device comprises a base-1, a guide groove-11, a conveying groove-2, a bottom plate-21, a rectangular through hole-211, a side edge-22, a clamping groove-221, a first notch-222, a second notch-223, a wedge-shaped block-23, a first discharging groove-3, a second discharging groove-4, a first blanking mechanism-5, a second blanking mechanism-6, an air blow pipe-61 and a rotating disc-7.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms, "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that are usually placed when the product of the present invention is used, and are only for convenience of describing the present invention and simplifying the description. The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; either directly or indirectly through intervening media, or through both elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown, an integrated IC vibratory conveying apparatus, comprising: base 1, conveyer trough 2 and rolling disc 7.
Specifically, as shown in fig. 1, 3 and 12, the base 1 is vertically disposed in a conical shape.
Specifically, as shown in fig. 1, 3 and 6, the conveying trough 2 is of a spiral ascending structure along the outer wall of the base 1, as shown in fig. 13, the section of the conveying trough 2 is L-shaped, and includes a bottom plate 21 and a side edge 22, a space is provided between the bottom plate 21 and the side wall of the base 1, and a clamping groove 221 is provided at the boundary edge between the inner wall of the side edge 22 and the bottom plate 21. When the pins of the integrated IC are positioned below and tightly attached to the bottom plate 21 and face the normal direction of the base 1, the pins on one side of the integrated IC slide in the clamping grooves 221 and are conveyed along the clamping grooves 221, the integrated IC in this state is output from the first discharging chute 3, the lower end of the conveying chute 2 is a feeding end, and the first discharging chute 3 is arranged at the upper end of the conveying chute 2.
Specifically, as shown in fig. 1, 6, and 9, the rotating disk 7 is coaxially disposed below the base 1 and the conveying chute 2, the rotating disk 7 rotates around the axis, and the rotating direction is the same as the spiral direction of the conveying chute 2, and the rotating disk 7 has a side fence for limiting the movement space of the integrated ICs, facilitating the entry of the integrated ICs into the conveying chute 2, and preventing the integrated ICs from falling.
More specifically, as shown in fig. 1, 3, and 11, along the conveying path of the conveying trough 2, there are provided in order: a second discharging chute 4, a first blanking mechanism 5 and a second blanking mechanism 6.
As shown in fig. 2, 5, and 13, the front end of the second discharge chute 4 is opened at the side edge 22 of the conveying chute 2, and is spaced above the catching groove 221, and the rear end of the second discharge chute 4 is laid along the tangential direction of the conveying chute 2. A first notch 222 is formed in the position of the side edge 22 corresponding to the second discharging chute 4 and used for avoiding the plastic package body of the integrated IC, and the first notch 222 is spaced above the clamping groove 221. For an integrated IC with output pins above and pins facing the normal direction of the base 1. The IC in the loaded position state can be output to the next process through the second discharging groove 4 or temporarily stored and collected by using a storage pipe.
As shown in fig. 3, 4, 7 and 10, a second notch 223 is formed at a position of the side edge 22 corresponding to the first blanking mechanism 5, the second notches 223 are arranged above the clamping groove 221 at intervals, a wedge-shaped block 23 is arranged at a position of the top surface of the bottom plate 21 corresponding to the first blanking mechanism 5, the wedge-shaped block 23 is arranged along the track of the conveying trough 2, and the top surface of the wedge-shaped block 23 along the rear section of the conveying direction is an inclined surface, so that the plastic package body of the integrated IC slides on the top surface of the wedge-shaped block 23. The height of the top surface of the front section of the wedge block 23 is higher than the height of the bottom surface of the second notch 223 by using the top surface of the bottom plate 21 as a base surface, as shown in fig. 7 and 10, so that the integrated IC sliding on the top surface of the wedge block 23 can smoothly slide out of the second notch 223. As shown in fig. 4, the height of the wedge 23 is lower than the height difference between the IC pins and the bottom surface of the plastic package, the width of the wedge 23 is smaller than the distance between the IC pins on the same side, and there is a space between the wedge 23 and the inner wall of the side edge 22, as shown in fig. 4, the space is used for passing through the IC pins in two orientations. When the IC pins are located below and contact the bottom plate 21, and the pins face to the tangential direction of the base 1, the IC pins can pass through the first blanking mechanism 5 smoothly.
Preferably, the first blanking mechanism 5 is used for placing the pins above, the integrated ICs with the pins facing the tangential direction of the base 1 fall into the conveying chute 2 below, and the falling point is located behind the conveying direction of the second discharging chute 4. The pins of the IC dropped down here are always above as they slide down along the outer wall of the base 1, but during the sliding process and when they contact the side edge 22 of the conveying trough 2 again, the pins may be oriented to change, and finally the pins are oriented to the normal direction of the base 1, and when the IC is in this state, the IC can be output through the second discharging trough 4 behind the conveying, so as to reduce the number of times of the cyclic arrangement of the IC dropped down from the first dropping mechanism 5.
As shown in fig. 8, the bottom plate 21 is provided with a rectangular through hole 211 corresponding to the second dropping mechanism 6 for dropping the integrated IC downward. When the IC with pins inserted in the card slot 221 passes through the rectangular through hole 211, the IC is prevented from falling from the rectangular through hole 211 in such a position state by the way that the card slot 221 is connected to the pins, and continuous conveyance is realized. After falling from the rectangular through hole 211, the IC slides down along the side wall of the base 1 from the space between the bottom plate 21 and the side wall of the base 1, and slides into the conveying chute 2 below. The second blanking mechanism 6 is used for placing the pins below, and the integrated ICs with the pins facing the tangential direction of the base 1 fall into the conveying chute 2 below. Because the IC is in a free sliding state in the process of sliding down, the pins of the IC have a possibility of changing their orientations in the sliding process, for example, when the IC slides into the lower conveying direction 2, the pins face the normal direction of the base 1, the pins will be inserted into the card slots 221, and the IC in this state will be discharged from the first discharging chute 3. This process is random, but it can make the pins of part of the IC smoothly insert into the card slots 221, reducing the number of times of cyclic arrangement of the part of the IC.
Preferably, as shown in fig. 1, 9 and 11, the drop point of the IC dropped from the second drop mechanism 6 is located in front of the second chute 4 in the conveying direction, and the IC dropped from the second drop mechanism 6 can be smoothly inserted into the conveying chute 2 for alignment and conveyance by utilizing the neutral position of the second chute 4 when the pin is above and facing the IC in the normal direction of the base 1.
More preferably, as shown in fig. 1, 2 and 9, an air blowing pipe 61 is provided below the second material dropping mechanism 6, and the air blowing pipe 61 is inclined from top to bottom in the conveying direction of the conveying chute 2. The blowing pipe 61 can blow the integrated ICs dropped into the conveying trough 2 by the second dropping mechanism 6 along the conveying direction, so as to make room for the later integrated ICs dropped later. Moreover, the integrated IC can be rotated on the side wall of the base 1 by utilizing the airflow blown by the air blowing pipe 61 to change the orientation of the pins of the integrated IC, the pins of the integrated IC falling from the second blanking mechanism 6 are positioned below and are attached to the outer wall of the base 1, and the orientation of the pins of the integrated IC can be actively changed in the falling process by utilizing the blowing of the air blowing pipe 61, so that the probability that the pins of the integrated IC face the normal direction of the base 1 is increased, and then the pins are clamped into the clamping grooves 221 to be output from the first discharging grooves 3, so that the number of times of cyclic arrangement of the integrated IC falling from the second blanking mechanism 6 is reduced, the conveying efficiency is improved, and the damage probability of the integrated IC is reduced.
Preferably, as shown in fig. 1, 4 and 8 to 10, guide grooves 11 are disposed on the outer wall of the base 1 at positions corresponding to the first blanking mechanism 5 and the second blanking mechanism 6, the guide grooves 11 are disposed downward along the generatrix direction of the conical surface of the base 1, one side wall of each guide groove 11 is a linear structure, and the upper section of the other side wall is bent toward the outer side of the guide groove 11, so as to increase the cross-sectional width at the entrance of the upper section of the guide groove 11, thereby facilitating the entry of the integrated IC. The width of the lower section of the guide groove 11 is greater than the width of the IC and less than the length of the IC, and the connecting line of the two ends of the IC with pins is defined as the length direction, while the connecting line of the other two ends is defined as the width direction.
As shown in fig. 8 and 10, when the IC falls into the guide slot 11, the IC is rotated by the bending structure on one side of the guide slot 11, because the pins of the IC falling from the first and second blanking mechanisms 5 and 6 are all oriented to the tangential direction of the base 1, i.e., when the IC falls into the guide slot 11, the length direction of the IC is exactly corresponding to the width direction of the guide slot 11, at this time, the IC cannot smoothly pass through the lower section of the guide slot 11, and the IC can be guided by the bending structure on one side of the guide slot 11 to rotate in a state that the length direction is oriented to the conveying direction of the guide slot 11; at this time, the pins of the integrated ICs dropped by the first dropping mechanism 5 are clamped into the second discharging chute 4 in the conveying process and output from the second discharging chute 4. The pins of the IC dropped from the second dropping mechanism 6 are inserted into the card slot 221 and output from the first discharging chute 3.
The guide groove 11 is designed to have a bent structure on only one side, not only for rotating the IC to change the posture, but also for preventing the IC from being stuck, the conventional guide groove is in the state shown in fig. 14 and 15, the upper section has a trumpet-shaped opening structure, both side walls thereof have bent structures, and the integrated IC is often stuck in the use of the structure as shown in fig. 14 and 15.
The foregoing is only a preferred embodiment of the present invention and is not intended to be exhaustive or to limit the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.
Claims (8)
1. An integrated IC vibratory conveying apparatus, comprising:
the base (1) is vertically arranged and conical;
the conveying trough (2) is of a spiral rising structure along the outer wall of the base (1), the section of the conveying trough (2) is L-shaped and comprises a bottom plate (21) and side edges (22), an interval is reserved between the bottom plate (21) and the side wall of the base (1), a clamping groove (221) is formed in the junction edge of the inner wall of each side edge (22) and the bottom plate (21), when the pins of the integrated IC are positioned below the integrated IC and tightly attached to the bottom plate (21), and the pins face the normal direction of the base (1), the pins on one side of the integrated IC slide in the clamping groove (221) and are conveyed along the clamping groove (221); the lower end of the conveying trough (2) is a feeding end, and the upper end is provided with a first discharging trough (3);
the conveying track along the conveying groove (2) is sequentially provided with:
the front end of the second discharging groove (4) is arranged on the side edge (22) of the conveying groove (2) and is positioned above the clamping groove (221) at intervals, and the rear end of the second discharging groove (4) is laid along the tangential direction of the conveying groove (2) and is used for outputting an integrated IC (integrated circuit) with pins positioned above and facing the normal direction of the base (1);
the first blanking mechanism (5) is used for enabling the pins to be located above, enabling the pins to fall into the conveying groove (2) below towards the integrated IC in the tangential direction of the base (1), and enabling the falling points to be located behind the conveying direction of the second discharging groove (4);
the second blanking mechanism (6) is used for placing the pins below, and the pins fall into the conveying groove (2) below towards the integrated IC in the tangential direction of the base (1).
2. The integrated IC vibratory feeder of claim 1 further comprising a rotatable disk (7) coaxially disposed below the base (1) and the trough (2), the rotatable disk (7) being rotatable about the axis in a direction corresponding to the direction of the spiral of the trough (2), the rotatable disk (7) having side enclosures.
3. The integrated IC vibrating conveyor device according to claim 1, wherein the side edge (22) is provided with a first notch (222) at a position corresponding to the second discharge chute (4), and the first notch (222) is spaced above the clamping groove (221).
4. The IC jigging conveyer of claim 1, wherein the drop point of the IC dropped from the second drop mechanism (6) is located forward in the conveying direction of the second discharge chute (4).
5. The integrated IC vibrating conveying device according to claim 1, wherein an air blowing pipe (61) is arranged below the second blanking mechanism (6), and the air blowing pipe (61) is inclined from top to bottom towards the conveying direction of the conveying groove (2).
6. The integrated IC vibrating conveyor according to claim 1, wherein the outer wall of the base (1) is provided with a guide groove (11) at a position corresponding to the first blanking mechanism (5) and the second blanking mechanism (6), the guide groove (11) is arranged downward along the generatrix direction of the conical surface of the base (1), one side wall of the guide groove (11) is of a straight line structure, the upper section of the other side wall is bent towards the outer side of the guide groove (11), the width dimension of the lower section of the guide groove (11) is greater than the width of the integrated IC and smaller than the length of the integrated IC, the connecting line of the two ends of the pins of the integrated IC is defined as the length direction, and the connecting line of the other two ends is defined as the width direction.
7. The integrated IC vibration conveying device according to claim 1, wherein a second notch (223) is formed in a position, corresponding to the first blanking mechanism (5), of the side edge (22), the second notch (223) is arranged above the clamping groove (221) at intervals, a wedge block (23) is arranged in a position, corresponding to the first blanking mechanism (5), of the top surface of the bottom plate (21), the wedge block (23) is arranged along the track of the conveying groove (2), and the top surface of the rear section of the wedge block (23) in the conveying direction is an inclined surface; the top surface of the bottom plate (21) is used as a base surface, the height of the top surface of the front section of the wedge block (23) is higher than that of the bottom surface of the second notch (223), the height of the wedge block (23) is lower than the height difference between the integrated IC pins and the bottom surface of the plastic package body, the width of the wedge block (23) is smaller than the distance between the integrated IC pins on the same side, and a gap is reserved between the wedge block (23) and the inner wall of the side edge (22) and used for allowing the pins to penetrate through.
8. The integrated IC vibrating conveyor according to claim 1, wherein the bottom plate (21) is provided with a rectangular through hole (211) corresponding to the second blanking mechanism (6) for dropping the integrated IC downward.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210237076.0A CN114334769B (en) | 2022-03-11 | 2022-03-11 | Integrated IC vibration conveying device |
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| CN202210237076.0A CN114334769B (en) | 2022-03-11 | 2022-03-11 | Integrated IC vibration conveying device |
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| CN114664717B (en) * | 2022-05-26 | 2022-09-13 | 四川熙隆半导体科技有限公司 | KBL semiconductor device pin equipment |
| CN114684581B (en) * | 2022-05-31 | 2022-08-23 | 四川明泰微电子科技股份有限公司 | Plastic envelope chip detects uses loading attachment |
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