CN114327104A - Contact area structure - Google Patents

Contact area structure Download PDF

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CN114327104A
CN114327104A CN202011046812.1A CN202011046812A CN114327104A CN 114327104 A CN114327104 A CN 114327104A CN 202011046812 A CN202011046812 A CN 202011046812A CN 114327104 A CN114327104 A CN 114327104A
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conductive layer
inorganic conductive
organic
organic substrate
layer
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CN114327104B (en
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林家瑞
方国龙
陈俊荣
杨承军
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TPK Advanced Solutions Inc
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Abstract

Providing a contact region structure comprising: an organic substrate, an inorganic conductive layer, an organic adhesive layer, and a transparent conductive layer. The organic substrate comprises at least one lap joint area, and the lap joint area comprises a first block and a second block adjacent to the first block. The inorganic conductive layer is arranged on the organic substrate, wherein the inorganic conductive layer is partially arranged on the first block, and the second block is exposed out of the upper surface of the organic substrate. The organic adhesion layer covers the inorganic conductive layer and the upper surface of the organic substrate. The transparent conductive layer is arranged on the organic adhesion layer to enhance the adhesive force of the transparent conductive layer attached to the inorganic conductive layer.

Description

接触区结构Contact area structure

技术领域technical field

本揭露是有关于一种接触区的结构,且特别是有关于有机与无机导体于接触区的结构。The present disclosure relates to a structure of a contact region, and in particular, to the structure of organic and inorganic conductors in the contact region.

背景技术Background technique

现有技术中,触控电极与传输线交会处的接触区中,传输线材料多为整片实心金属层,触控电极使用有机材料粘着于传输线上。因此,接触面积越大、接触的阻值越小。然而,有机材料对金属等无机材料无法形成键结,造成附着力不佳进而使触控电极脱落。有鉴于此,现有技术实有待改善的必要。In the prior art, in the contact area where the touch electrode and the transmission line meet, the material of the transmission line is mostly a solid metal layer, and the touch electrode is adhered to the transmission line by using an organic material. Therefore, the larger the contact area, the smaller the resistance of the contact. However, organic materials cannot form bonds with inorganic materials such as metals, resulting in poor adhesion and thus the touch electrodes falling off. In view of this, the existing technology needs to be improved.

发明内容SUMMARY OF THE INVENTION

本揭露的一实施方式的目的在于提供一种接触区结构,显著增强透明导电层附着于无机导电层的附着力,避免因光阻剥膜时而会造成脱落。An embodiment of the present disclosure aims to provide a contact area structure that significantly enhances the adhesion of the transparent conductive layer to the inorganic conductive layer and avoids peeling off due to the photoresist film being stripped.

本揭露的一实施方式提供了接触区结构,包含:有机基板、无机导电层、有机粘着层以及透明导电层。有机基板包含至少一搭接区域(contact pad area),搭接区域包含第一区块以及与第一区块相邻的第二区块。无机导电层设于有机基板上,其中无机导电层部分设于第一区块,第二区块则裸露出有机基板的上表面。有机粘着层覆盖于无机导电层与有机基板的上表面。透明导电层设于有机粘着层上。An embodiment of the present disclosure provides a contact area structure including: an organic substrate, an inorganic conductive layer, an organic adhesive layer, and a transparent conductive layer. The organic substrate includes at least one contact pad area, and the contact pad area includes a first area and a second area adjacent to the first area. The inorganic conductive layer is disposed on the organic substrate, wherein the inorganic conductive layer is partially disposed in the first block, and the second block exposes the upper surface of the organic substrate. The organic adhesive layer covers the inorganic conductive layer and the upper surface of the organic substrate. The transparent conductive layer is arranged on the organic adhesive layer.

在一些实施方式中,无机导电层为金属层。In some embodiments, the inorganic conductive layer is a metal layer.

在一些实施方式中,金属层为铜层。In some embodiments, the metal layer is a copper layer.

在一些实施方式中,无机导电层于平面图上呈线状结构。In some embodiments, the inorganic conductive layer has a linear structure in plan view.

在一些实施方式中,线状结构的宽度为10微米至50微米。In some embodiments, the line-like structures have a width of 10 microns to 50 microns.

在一些实施方式中,无机导电层的厚度为0.1微米至1微米。In some embodiments, the thickness of the inorganic conductive layer is 0.1 micron to 1 micron.

在一些实施方式中,无机导电层在搭接区域的剖面图中,呈现间隔排列。In some embodiments, the inorganic conductive layers are spaced apart in the cross-sectional view of the overlapping area.

在一些实施方式中,无机导电层呈筛网状、树枝状、蜂巢状、或格栅状结构。In some embodiments, the inorganic conductive layer is in a mesh-like, dendritic-like, honeycomb-like, or grid-like structure.

在一些实施方式中,无机导电层面积为10,000平方微米至1,000,000平方微米。In some embodiments, the inorganic conductive layer has an area of 10,000 square micrometers to 1,000,000 square micrometers.

在一些实施方式中,有机基板还包含多个搭接区域,所述多个搭接区域经由无机导电层电性连接。In some embodiments, the organic substrate further includes a plurality of overlapping regions, and the multiple overlapping regions are electrically connected through the inorganic conductive layer.

附图说明Description of drawings

当结合附图阅读以下详细描述时,本揭露的各种态样将最易于理解。应注意的是,根据行业标准操作规程,各种特征结构可能并非按比例绘制。事实上,为了论述的清晰性,可以任意地增大或减小各种特征结构的尺寸。The various aspects of the present disclosure will be best understood when the following detailed description is read in conjunction with the accompanying drawings. It should be noted that in accordance with industry standard operating procedures, the various features may not be drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of discussion.

图1绘示本揭露的第一实施例的接触区结构的示意图;FIG. 1 is a schematic diagram of a contact area structure according to a first embodiment of the present disclosure;

图2绘示图1的局部剖面图;FIG. 2 is a partial cross-sectional view of FIG. 1;

图3绘示本揭露的第二实施例的接触区结构的示意图;3 is a schematic diagram illustrating a contact area structure according to a second embodiment of the present disclosure;

图4绘示本揭露的第三实施例的接触区结构的示意图;4 is a schematic diagram illustrating a contact area structure according to a third embodiment of the present disclosure;

图5绘示图4的局部剖面图;FIG. 5 is a partial cross-sectional view of FIG. 4;

图6绘示本揭露的第四实施例的接触区结构的示意图。FIG. 6 is a schematic diagram illustrating a contact area structure according to a fourth embodiment of the present disclosure.

【符号说明】【Symbol Description】

10:接触区结构10: Contact area structure

100:有机基板100: Organic substrate

110:搭接区域110: Overlap area

111:第一区块111: The first block

112:第二区块112: Second block

200:无机导电层200: Inorganic conductive layer

300:有机粘着层300: organic adhesive layer

400:透明导电层400: transparent conductive layer

具体实施方式Detailed ways

为使本揭露的叙述更加详尽与完备,下文针对本揭露的实施态样与具体实施例提出说明性的描述,但这并非实施或运用本揭露具体实施例的唯一形式。以下所揭露的各实施例,在有益的情形下可相互组合或取代,也可在一实施例中附加其他的实施例,而无须进一步的记载或说明。在以下描述中,将详细叙述许多特定细节,以使读者能够充分理解以下的实施例。然而,亦可在无这些特定细节的情况下实践本揭露的实施例。In order to make the description of the present disclosure more detailed and complete, the following provides an illustrative description of the implementation aspects and specific embodiments of the present disclosure, but this is not the only form of implementing or using the specific embodiments of the present disclosure. The embodiments disclosed below can be combined or substituted with each other under beneficial circumstances, and other embodiments can also be added to one embodiment without further description or explanation. In the following description, numerous specific details are set forth in detail to enable the reader to fully understand the following embodiments. However, embodiments of the present disclosure may be practiced without these specific details.

另外,空间相对用语,如“下”、“上”等,是用以方便描述一元件或特征与其他元件或特征在附图中的相对关系。这些空间相对用语旨在包含除了附图中所示的方位以外,装置在使用或操作时的不同方位。装置可被另外定位(例如旋转90度或其他方位),而本文所使用的空间相对叙述亦可相对应地进行解释。In addition, spatially relative terms, such as "lower", "upper", etc., are used to conveniently describe the relative relationship of one element or feature to other elements or features in the drawings. These spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may be otherwise oriented (eg, rotated 90 degrees or at other orientations) and the spatially relative descriptions used herein interpreted accordingly.

于本文中,除非内文中对于冠词有所特别限定,否则“一”与“该”可泛指单一个或多个。将进一步理解的是,本文中所使用的“包含”、“包括”、“具有”及相似词汇,指明其所记载的特征、区域、整数、步骤、操作、元件与/或组件,但不排除其它的特征、区域、整数、步骤、操作、元件、组件,与/或其中的群组。As used herein, "a" and "the" can generally refer to a single one or a plurality unless the context of the article specifically limits them. It will be further understood that "comprising", "including", "having" and similar words used herein designate the recited features, regions, integers, steps, operations, elements and/or components, but do not exclude Other features, regions, integers, steps, operations, elements, components, and/or groups thereof.

以下列举数个实施例及实验例以更详尽阐述本揭露的接触区结构,然其仅为例示说明之用,并非用以限定本揭露,本揭露的保护范围当以所附的权利要求书所界定的范围为准。Several embodiments and experimental examples are listed below to describe the structure of the contact area of the present disclosure in more detail. However, they are only used for illustration and are not intended to limit the present disclosure. The protection scope of the present disclosure should be defined by the appended claims. The defined range shall prevail.

本揭露的一些实施方式中,请参阅图1及图2,接触区结构10包含有机基板100、无机导电层200、有机粘着层300、以及透明导电层400。In some embodiments of the present disclosure, please refer to FIGS. 1 and 2 , the contact area structure 10 includes an organic substrate 100 , an inorganic conductive layer 200 , an organic adhesive layer 300 , and a transparent conductive layer 400 .

在一实施方式中,本揭露的接触区结构10可广泛应用于有机材质与无机材质叠合接触的地方,包括,但不限于纳米银接触金属层的位置。例如:接触区结构10为触控面板中触控电极与信号传输线交会或交叠处,使触控电极的信号能传送至信号传输线。In one embodiment, the contact region structure 10 of the present disclosure can be widely used in the places where the organic material and the inorganic material are in contact with each other, including but not limited to the position where the nano-silver contacts the metal layer. For example, the contact area structure 10 is the intersection or overlap of the touch electrodes and the signal transmission lines in the touch panel, so that the signals of the touch electrodes can be transmitted to the signal transmission lines.

在一实施方式中,有机基板100是指非导电材料。基板可为刚性或挠性的。基板可是透明或不透明。适宜刚性基板包含(例如)聚碳酸酯、丙烯酸系物及诸如此类。适宜挠性基板包含(但不限于):聚酯(例如,聚对苯二甲酸乙二酯(PET)、聚萘二甲酸酯及聚碳酸酯)、聚烯烃(例如,直链、具支链及环状聚烯烃)、聚乙烯(例如,聚氯乙烯、聚二氯亚乙烯、聚乙烯醇缩醛、聚苯乙烯、聚丙烯酸酯及诸如此类)、纤维素酯基底(例如,三乙酸纤维素、乙酸纤维素)、聚砜(例如聚醚砜)、聚酰亚胺、聚硅氧及其他习用聚合膜。适宜基板的其他实例可参见(例如)美国专利第6,975,067号。In one embodiment, the organic substrate 100 refers to a non-conductive material. The substrate can be rigid or flexible. The substrate may be transparent or opaque. Suitable rigid substrates include, for example, polycarbonates, acrylics, and the like. Suitable flexible substrates include, but are not limited to: polyesters (eg, polyethylene terephthalate (PET), polyethylene naphthalate, and polycarbonate), polyolefins (eg, linear, branched chain and cyclic polyolefins), polyethylene (eg, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetal, polystyrene, polyacrylates, and the like), cellulose ester substrates (eg, triacetate cellulose) cellulose acetate), polysulfones (eg, polyethersulfone), polyimides, polysiloxanes, and other conventional polymeric membranes. Additional examples of suitable substrates can be found in, eg, US Pat. No. 6,975,067.

在一实施方式中,有机基板100包含至少一搭接区域110,搭接区域110包含第一区块111以及与第一区块111相邻的第二区块112。在一些实施例中,搭接区域110是呈连续平面、或呈块状。In one embodiment, the organic substrate 100 includes at least one overlapping area 110 , and the overlapping area 110 includes a first block 111 and a second block 112 adjacent to the first block 111 . In some embodiments, the overlapping area 110 is in the form of a continuous plane, or a block shape.

在一实施方式中,有机基板100包含多个搭接区域110。在一些实施例中,这些搭接区域110彼此互不相连。在一些实施例中,这些搭接区域110经由无机导电层200电性连接。In one embodiment, the organic substrate 100 includes a plurality of overlapping regions 110 . In some embodiments, the overlapping regions 110 are not connected to each other. In some embodiments, the overlapping regions 110 are electrically connected through the inorganic conductive layer 200 .

在一实施方式中,无机导电层200设于有机基板100上,其中无机导电层200部分设于第一区块111,第二区块112则裸露出有机基板100的上表面。在图2的局部剖面图中,无机导电层200的两侧为有机粘着层300覆盖于有机基板100,形成有机、无机、有机材质的间隔排列,使得透明导电层400附着力强,不易因光阻剥膜时而会造成脱落。在一实施方式中,无机导电层200为金属层。在一些实施例中,金属层的材质为包括,但不限于氧化铟锡、银、锌、铜、金、铂、钨、铝或上述金属合金。在一些实施例中,无机导电层200是作为传输线路。在一些实施例中,无机导电层200为软性电路板的一部份。In one embodiment, the inorganic conductive layer 200 is disposed on the organic substrate 100 , wherein the inorganic conductive layer 200 is partially disposed on the first block 111 , and the second block 112 exposes the upper surface of the organic substrate 100 . In the partial cross-sectional view of FIG. 2 , the organic adhesive layer 300 covers the organic substrate 100 on both sides of the inorganic conductive layer 200 to form an arrangement of organic, inorganic, and organic materials at intervals, so that the transparent conductive layer 400 has strong adhesion and is not easily affected by light. The stripping film will sometimes cause peeling off. In one embodiment, the inorganic conductive layer 200 is a metal layer. In some embodiments, the material of the metal layer includes, but is not limited to, indium tin oxide, silver, zinc, copper, gold, platinum, tungsten, aluminum, or the aforementioned metal alloys. In some embodiments, the inorganic conductive layer 200 is used as a transmission line. In some embodiments, the inorganic conductive layer 200 is part of a flexible circuit board.

在一实施方式中,有机粘着层300可帮助将透明导电层400粘着至无机导电层200与有机基板100上。有机粘着层300包括适宜的粘合剂,例如光学透明聚合物,其包含(但不限于):聚丙烯酸系物,例如聚甲基丙烯酸酯(例如,聚(甲基丙烯酸甲酯))、聚丙烯酸酯及聚丙烯腈;聚乙烯醇;聚酯(例如,聚对苯二甲酸乙二酯(PET)、聚对萘二甲酸酯及聚碳酸酯);具有高芳香化程度的聚合物,例如酚醛或甲酚-甲醛

Figure BDA0002708254890000041
聚苯乙烯、聚乙烯甲苯、聚乙烯二甲苯、聚酰亚胺、聚酰胺、聚酰胺酰亚胺、聚醚酰亚胺、聚硫化物、聚砜、聚苯及聚苯基醚、聚胺基甲酸酯(PU)、环氧树脂、聚烯烃(例如聚丙烯、聚甲基戊烯及环状烯烃)、丙烯腈-丁二烯-苯乙烯共聚物(ABS)、纤维素、聚硅氧及其他含硅聚合物(例如聚硅倍半氧烷及聚硅烷)、聚氯乙烯(PVC)、聚乙酸酯、聚降莰烯、合成橡胶(例如,EPR、SBR、EPDM)及氟聚合物(例如,聚二氟亚乙烯、聚四氟乙烯(TFE)或聚六氟丙烯)、氟-烯烃与烃烯烃的共聚物(例如,
Figure BDA0002708254890000042
)及非晶型氟碳聚合物或共聚物(例如,Asahi Glass公司的
Figure BDA0002708254890000043
或DuPont的
Figure BDA0002708254890000044
AF)。In one embodiment, the organic adhesive layer 300 may help to adhere the transparent conductive layer 400 to the inorganic conductive layer 200 and the organic substrate 100 . The organic adhesion layer 300 includes a suitable adhesive, such as an optically clear polymer, including, but not limited to: polyacrylics such as polymethacrylates (eg, poly(methyl methacrylate)), poly(methyl methacrylate) Acrylates and polyacrylonitrile; polyvinyl alcohol; polyesters (eg, polyethylene terephthalate (PET), polyethylene terephthalate, and polycarbonate); polymers with a high degree of aromatization, e.g. phenolic or cresol-formaldehyde
Figure BDA0002708254890000041
Polystyrene, polyethylene toluene, polyethylene xylene, polyimide, polyamide, polyamideimide, polyetherimide, polysulfide, polysulfone, polyphenylene and polyphenyl ether, polyamine Urethanes (PU), epoxy resins, polyolefins (such as polypropylene, polymethylpentene, and cyclic olefins), acrylonitrile-butadiene-styrene (ABS), cellulose, polysilicon Oxygen and other silicon-containing polymers (eg, polysilsesquioxane and polysilane), polyvinyl chloride (PVC), polyacetate, polynorbornene, synthetic rubbers (eg, EPR, SBR, EPDM), and fluorine Polymers (eg, polyvinylidene fluoride, polytetrafluoroethylene (TFE), or polyhexafluoropropylene), copolymers of fluoro-olefins and hydrocarbon olefins (eg,
Figure BDA0002708254890000042
) and amorphous fluorocarbon polymers or copolymers (eg, Asahi Glass'
Figure BDA0002708254890000043
or DuPont
Figure BDA0002708254890000044
AF).

在一实施方式中,透明导电层400是通过涂覆含有纳米结构的涂覆组合物来制备。为形成涂覆组合物,通常将金属纳米线分散于挥发性液体中以帮助涂覆制程。应理解,如本文所使用,可使用其中金属纳米线可形成稳定分散液的任何非腐蚀性挥发性液体。较佳地,将金属纳米线分散于水、醇、酮、醚、烃或芳香族溶剂(苯、甲苯、二甲苯等)中。更佳地,液体具有挥发性,其沸点不大于200℃、不大于150℃或不大于100℃。In one embodiment, the transparent conductive layer 400 is prepared by coating a nanostructure-containing coating composition. To form coating compositions, metal nanowires are typically dispersed in a volatile liquid to aid in the coating process. It should be understood that, as used herein, any non-corrosive volatile liquid in which the metal nanowires can form a stable dispersion can be used. Preferably, the metal nanowires are dispersed in water, alcohol, ketone, ether, hydrocarbon or aromatic solvent (benzene, toluene, xylene, etc.). More preferably, the liquid is volatile and its boiling point is no greater than 200°C, no greater than 150°C or no greater than 100°C.

此外,金属纳米线分散液可含有添加剂及粘合剂以控制粘度、腐蚀、粘着性及纳米线分散。适宜添加剂及粘合剂的实例包含(但不限于)羧甲基纤维素(CMC)、2-羟乙基纤维素(HEC)、羟丙基甲基纤维素(HPMC)、甲基纤维素(MC)、聚乙烯醇(PVA)、三丙二醇(TPG)、及黄原胶(XG);及表面活性剂,例如乙氧基化物、烷氧基化物、环氧乙烷及环氧丙烷及其共聚物、磺酸盐、硫酸盐、二磺酸盐、磺基琥珀酸盐、磷酸酯及含氟表面活性剂(例如,DuPont的

Figure BDA0002708254890000051
)。In addition, the metal nanowire dispersion may contain additives and binders to control viscosity, corrosion, adhesion, and nanowire dispersion. Examples of suitable additives and binders include, but are not limited to, carboxymethyl cellulose (CMC), 2-hydroxyethyl cellulose (HEC), hydroxypropyl methyl cellulose (HPMC), methyl cellulose ( MC), polyvinyl alcohol (PVA), tripropylene glycol (TPG), and xanthan gum (XG); and surfactants such as ethoxylates, alkoxylates, ethylene oxide and propylene oxide and their Copolymers, sulfonates, sulfates, disulfonates, sulfosuccinates, phosphates, and fluorosurfactants (eg, DuPont's
Figure BDA0002708254890000051
).

在一些实施例中,纳米线分散液或“墨水”包含以重量计0.0025%至0.1%的表面活性剂(例如,

Figure BDA0002708254890000052
FSO-100的较佳范围是0.0025%至0.05%)、0.02%至4%的粘度改质剂(例如,HPMC的较佳范围是0.02%至0.5%)、94.5%至99.0%的溶剂及0.05%至1.4%的金属纳米线。适宜表面活性剂的代表性实例包含
Figure BDA0002708254890000053
FSN、
Figure BDA0002708254890000054
FSO、
Figure BDA0002708254890000055
FSH、Triton(x100、x114、x45)、Dynol(604、607)、正十二烷基b-D-麦芽糖苷及Novek。适宜粘度改质剂的实例包含羟丙基甲基纤维素(HPMC)、甲基纤维素、黄原胶、聚乙烯醇、羧甲基纤维素及羟乙基纤维素。适宜溶剂的实例包含水及异丙醇。In some embodiments, the nanowire dispersion or "ink" comprises 0.0025% to 0.1% by weight of a surfactant (eg,
Figure BDA0002708254890000052
The preferred range for FSO-100 is 0.0025% to 0.05%), 0.02% to 4% viscosity modifier (eg, the preferred range for HPMC is 0.02% to 0.5%), 94.5% to 99.0% solvent and 0.05% % to 1.4% metal nanowires. Representative examples of suitable surfactants include
Figure BDA0002708254890000053
FSN,
Figure BDA0002708254890000054
FSO,
Figure BDA0002708254890000055
FSH, Triton (x100, x114, x45), Dynol (604, 607), n-dodecyl bD-maltoside and Novek. Examples of suitable viscosity modifiers include hydroxypropyl methylcellulose (HPMC), methylcellulose, xanthan gum, polyvinyl alcohol, carboxymethylcellulose, and hydroxyethylcellulose. Examples of suitable solvents include water and isopropanol.

分散液中的纳米线浓度可影响或决定纳米线网络层的参数,例如厚度、导电率(包括表面导电率)、光学透明度及机械特性。可调节溶剂百分比以提供纳米线在分散液中的期望浓度。然而,在较佳实施例中,其他成份的相对比率可保持不变。具体而言,表面活性剂对粘度改质剂的比率较佳介于约80至约0.01范围内;粘度改质剂对金属纳米线的比率较佳介于约5至约0.000625范围内;且金属纳米线对表面活性剂的比率较佳介于约560至约5范围内。分散液中各组份的比率可端视所使用基板及施加方法而改变。用于纳米线分散液的较佳粘度范围介于约1cP与100cP之间。The nanowire concentration in the dispersion can affect or determine the parameters of the nanowire network layer, such as thickness, electrical conductivity (including surface electrical conductivity), optical transparency, and mechanical properties. The solvent percentage can be adjusted to provide the desired concentration of nanowires in the dispersion. However, in preferred embodiments, the relative ratios of the other components may remain unchanged. Specifically, the ratio of surfactant to viscosity modifier is preferably in the range of about 80 to about 0.01; the ratio of viscosity modifier to metal nanowire is preferably in the range of about 5 to about 0.000625; and the metal nanowire The ratio to surfactant is preferably in the range of about 560 to about 5. The ratio of the components in the dispersion can vary depending on the substrate used and the method of application. The preferred viscosity range for nanowire dispersions is between about 1 cP and 100 cP.

在涂覆后,通过蒸发移除挥发性液体。可通过加热(例如烘焙)来加速蒸发。所得纳米线网络层可需要后处理以使其导电。如下文所阐述,此后处理可是涉及暴露于热、电浆、电晕放电、UV-臭氧或压力下的制程步骤。After coating, the volatile liquid is removed by evaporation. Evaporation can be accelerated by heating (eg baking). The resulting nanowire network layer may require post-processing to make it conductive. As set forth below, post-processing may be process steps involving exposure to heat, plasma, corona discharge, UV-ozone, or pressure.

在一实施方式中,透明导电层400(即非导电基板上的导电网络)的光学透明度或清晰度可通过包含光透射率及浊度在内的参数以定量方式定义。“透光率”(或“光透射率”)是指入射光穿过介质透射的百分比。在多个实施例中,导电层的透光率是至少80%且可高至98%。诸如粘着层、抗反射层或抗眩光层等性能增强层可进一步帮助减小透明导体的总体透光率。在多个实施例中,透明导体的透光率(T%)可为至少50%、至少60%、至少70%或至少80%,且可高至至少91%至92%或至少95%。In one embodiment, the optical transparency or clarity of the transparent conductive layer 400 (ie, the conductive network on the non-conductive substrate) can be quantitatively defined by parameters including light transmittance and haze. "Light transmittance" (or "light transmittance") refers to the percentage of incident light transmitted through a medium. In various embodiments, the light transmittance of the conductive layer is at least 80% and can be as high as 98%. Performance enhancing layers such as adhesion layers, anti-reflection layers or anti-glare layers can further help reduce the overall light transmittance of the transparent conductor. In various embodiments, the transmittance (T%) of the transparent conductor may be at least 50%, at least 60%, at least 70%, or at least 80%, and may be as high as at least 91% to 92% or at least 95%.

有机基板100、无机导电层200、有机粘着层300、以及透明导电层400更详细地说明于以下非限制性实例中。The organic substrate 100, the inorganic conductive layer 200, the organic adhesion layer 300, and the transparent conductive layer 400 are described in more detail in the following non-limiting examples.

实施例1Example 1

图1为本揭露的第一实施例的接触区结构的示意图,图2为图1的局部剖面图。本揭露的一实施方式的接触区结构10包含有机基板100、无机导电层200、有机粘着层300、以及透明导电层400。FIG. 1 is a schematic diagram of a contact area structure according to a first embodiment of the disclosure, and FIG. 2 is a partial cross-sectional view of FIG. 1 . The contact area structure 10 of an embodiment of the present disclosure includes an organic substrate 100 , an inorganic conductive layer 200 , an organic adhesive layer 300 , and a transparent conductive layer 400 .

有机基板100包含至少一搭接区域110,搭接区域110包含第一区块111以及与第一区块111相邻的第二区块112。The organic substrate 100 includes at least one overlapping area 110 , and the overlapping area 110 includes a first block 111 and a second block 112 adjacent to the first block 111 .

无机导电层200设于有机基板100上,其中无机导电层200部分设于第一区块111,第二区块112则裸露出有机基板100的上表面101。无机导电层200为金属层,例如铜层。无机导电层200于平面图上呈线状结构,其中线状结构的宽度为约10微米至50微米,例如:约15微米、约20微米、约25微米、约30微米、约35微米、约40微米、约45微米,或者这些值中任意两者之间的任何值。无机导电层200的厚度为约0.1微米至1微米,例如:约0.2微米、约0.3微米、约0.4微米、约0.5微米、约0.6微米、约0.7微米、约0.8微米、约0.9微米,或者这些值中任意两者之间的任何值。无机导电层200面积为约10,000平方微米至约1,000,000平方微米,例如:约50,000平方微米、约100,000平方微米、约200,000平方微米、约500,000平方微米、约700,000平方微米、约900,000平方微米,或者这些值中任意两者之间的任何值,将有助于透明导电层400与无机导电层200之间的附着。The inorganic conductive layer 200 is disposed on the organic substrate 100 , wherein the inorganic conductive layer 200 is partially disposed on the first block 111 , and the second block 112 exposes the upper surface 101 of the organic substrate 100 . The inorganic conductive layer 200 is a metal layer, such as a copper layer. The inorganic conductive layer 200 is a linear structure in plan view, wherein the width of the linear structure is about 10 microns to 50 microns, for example: about 15 microns, about 20 microns, about 25 microns, about 30 microns, about 35 microns, about 40 microns microns, about 45 microns, or any value in between any of these values. The thickness of the inorganic conductive layer 200 is about 0.1 micrometer to 1 micrometer, for example: about 0.2 micrometer, about 0.3 micrometer, about 0.4 micrometer, about 0.5 micrometer, about 0.6 micrometer, about 0.7 micrometer, about 0.8 micrometer, about 0.9 micrometer, or these Any of the values in between. The inorganic conductive layer 200 has an area of about 10,000 square microns to about 1,000,000 square microns, for example: about 50,000 square microns, about 100,000 square microns, about 200,000 square microns, about 500,000 square microns, about 700,000 square microns, about 900,000 square microns, or these Any value between any two of the values will facilitate the adhesion between the transparent conductive layer 400 and the inorganic conductive layer 200 .

有机粘着层300覆盖于无机导电层200与有机基板100的上表面101。换言之,有机基板100由无机导电层200与部分有机粘着层300覆盖。The organic adhesive layer 300 covers the inorganic conductive layer 200 and the upper surface 101 of the organic substrate 100 . In other words, the organic substrate 100 is covered by the inorganic conductive layer 200 and part of the organic adhesive layer 300 .

透明导电层400设于有机粘着层300上。透明导电层400包括纳米银。通过无机导电层200与部分有机粘着层300覆盖于有机基板100,使得透明导电层400附着力强,不易因光阻剥膜时而会造成脱落。The transparent conductive layer 400 is disposed on the organic adhesive layer 300 . The transparent conductive layer 400 includes nano silver. The organic substrate 100 is covered by the inorganic conductive layer 200 and part of the organic adhesive layer 300 , so that the transparent conductive layer 400 has strong adhesion and is not easily peeled off when the photoresist is peeled off.

实施例2Example 2

图3绘示本揭露的第二实施例的接触区结构的示意图。实施例2与实施例1的差异在于,实施例2的无机导电层200于平面下的图形呈弯曲的线状结构。在局部剖面图中与图2相似,无机导电层200的两侧为有机粘着层300覆盖于有机基板100,使得透明导电层400附着力强,不易因光阻剥膜时而会造成脱落。FIG. 3 is a schematic diagram of a contact area structure according to a second embodiment of the present disclosure. The difference between Example 2 and Example 1 is that the pattern of the inorganic conductive layer 200 in Example 2 under a plane is a curved linear structure. 2 , both sides of the inorganic conductive layer 200 are covered by the organic adhesive layer 300 on the organic substrate 100, so that the transparent conductive layer 400 has strong adhesion and is not easily peeled off due to the photoresist stripping.

实施例3Example 3

图4绘示本揭露的第三实施例的接触区结构的示意图,图5绘示图4的局部剖面图。实施例3与实施例1的差异在于,无机导电层200在搭接区域110的剖面图中,呈现间隔排列,且搭接区域110具有多个第一区块111与多个第二区块112。详细而言,无机导电层200呈现格栅状结构,无机导电层200镂空处即为这些第二区块112,并裸露出有机基板100的上表面。在图5的局部剖面图中,无机导电层200的两侧为有机粘着层300覆盖于有机基板100,形成有机、无机、有机、无机、有机材质的间隔排列,使得透明导电层400附着力强,不易因光阻剥膜时而会造成脱落。FIG. 4 is a schematic diagram of a contact area structure according to a third embodiment of the present disclosure, and FIG. 5 is a partial cross-sectional view of FIG. 4 . The difference between Embodiment 3 and Embodiment 1 is that the inorganic conductive layers 200 are arranged at intervals in the cross-sectional view of the overlap region 110 , and the overlap region 110 has a plurality of first blocks 111 and a plurality of second blocks 112 . In detail, the inorganic conductive layer 200 has a grid-like structure, and the hollows of the inorganic conductive layer 200 are the second blocks 112 , and the upper surface of the organic substrate 100 is exposed. In the partial cross-sectional view of FIG. 5 , two sides of the inorganic conductive layer 200 are the organic adhesive layers 300 covering the organic substrate 100 to form a spaced arrangement of organic, inorganic, organic, inorganic and organic materials, so that the transparent conductive layer 400 has strong adhesion , it is not easy to fall off when the photoresist is stripped.

实施例4Example 4

图6绘示本揭露的第四实施例的接触区结构的示意图。实施例4与实施例3的差异在于,无机导电层200在搭接区域110的剖面图中,呈现蜂巢状结构。在局部剖面图中与图5相似,无机导电层200的两侧为有机粘着层300覆盖于有机基板100,形成有机、无机、有机、无机、有机材质的间隔排列,使得透明导电层400附着力强,不易因光阻剥膜时而会造成脱落。FIG. 6 is a schematic diagram illustrating a contact area structure according to a fourth embodiment of the present disclosure. The difference between Example 4 and Example 3 is that the inorganic conductive layer 200 in the cross-sectional view of the overlapping region 110 has a honeycomb-like structure. Similar to FIG. 5 in the partial cross-sectional view, the organic adhesive layers 300 on both sides of the inorganic conductive layer 200 cover the organic substrate 100 to form an interval arrangement of organic, inorganic, organic, inorganic, and organic materials, so that the transparent conductive layer 400 has an adhesive force. Strong, not easy to fall off due to photoresist stripping.

通过同为有机材质的有机粘着层300与有机基板100彼此间以化学键键结,比无机材质的无机导电层200与有机材质的有机基板100以凡德瓦力键结具有更强的附着力。因此,本揭露的一实施方式中,显著增强透明导电层400附着于无机导电层200的力道,避免因光阻剥膜时而会造成脱落。The organic adhesive layer 300 which is also an organic material and the organic substrate 100 are chemically bonded to each other, which has stronger adhesion than the bonding between the inorganic conductive layer 200 of an inorganic material and the organic substrate 100 of an organic material by Van der Waals force. Therefore, in an embodiment of the present disclosure, the strength of the transparent conductive layer 400 to adhere to the inorganic conductive layer 200 is significantly enhanced, so as to avoid peeling off when the photoresist is peeled off.

本揭露的一实施方式为将传统一整片连续的纳米银与金属层于搭接区域切分小块异型接点,位于搭接区域的金属层部分镂空后,可让附着力好的纳米银粘着剂粘附于有机基板,同时使附着力差的金属层被两侧的粘着剂粘附。在一些实施方式中,因为纳米银的材料特性,纳米银与位于搭接区域的金属层镂空后不会造成接触面积对电阻等比上升。An embodiment of the present disclosure is to cut a traditional whole continuous piece of nano-silver and metal layer into small pieces of special-shaped joints in the overlapping area. After the metal layer in the overlapping area is partially hollowed out, the nano-silver with good adhesion can be adhered The agent adheres to the organic substrate, while the metal layer with poor adhesion is adhered by the adhesive on both sides. In some embodiments, due to the material properties of the nano-silver, the hollowing of the nano-silver and the metal layer in the overlapping area will not cause a proportional increase in the contact area to the resistance.

虽然本揭露已以实施方式揭露如上,然其并非用以限定本揭露,任何熟悉此技艺者,在不脱离本揭露的精神和范围内,当可作各种的更动与润饰,因此本揭露的保护范围当视所附的权利要求书所界定的范围为准。Although the present disclosure has been disclosed as above in embodiments, it is not intended to limit the present disclosure. Anyone familiar with the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the present disclosure The scope of protection shall be subject to the scope defined by the appended claims.

Claims (10)

1. A contact structure, comprising:
an organic substrate, comprising at least one lap joint area, wherein the lap joint area comprises a first block and a second block adjacent to the first block;
an inorganic conductive layer disposed on the organic substrate, wherein the inorganic conductive layer is partially disposed in the first block, and the second block exposes an upper surface of the organic substrate;
an organic adhesion layer covering the inorganic conductive layer and the upper surface of the organic substrate; and
a transparent conductive layer disposed on the organic adhesion layer.
2. The contact structure of claim 1 wherein the inorganic conductive layer is a metal layer.
3. The contact structure of claim 2 wherein said metal layer is a copper layer.
4. The contact region structure of claim 1, wherein the inorganic conductive layer has a line structure in plan view.
5. The contact region structure of claim 4 wherein the line feature has a width of 10 microns to 50 microns.
6. The contact region structure of claim 4, wherein the inorganic conductive layer has a thickness of 0.1 to 1 μm.
7. The contact structure of claim 1 wherein said inorganic conductive layers are spaced apart in a cross-sectional view of said landing area.
8. The contact region structure of claim 7, wherein the inorganic conductive layer is in a mesh, dendritic, honeycomb, or grid structure.
9. The contact structure of claim 1 wherein the inorganic conductive layer has an area of 10,000 square microns to 1,000,000 square microns.
10. The contact region structure of claim 1, wherein the organic substrate further comprises a plurality of landing regions electrically connected via the inorganic conductive layer.
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