CN114326340A - 纳米压印对准方法及系统 - Google Patents
纳米压印对准方法及系统 Download PDFInfo
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- CN114326340A CN114326340A CN202210044309.5A CN202210044309A CN114326340A CN 114326340 A CN114326340 A CN 114326340A CN 202210044309 A CN202210044309 A CN 202210044309A CN 114326340 A CN114326340 A CN 114326340A
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- grating
- alignment
- imprinting
- reference grating
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- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000010586 diagram Methods 0.000 claims abstract description 15
- 239000012790 adhesive layer Substances 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 25
- 239000003292 glue Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 7
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 6
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 6
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 6
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims 1
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
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CN202210044309.5A CN114326340B (zh) | 2022-01-14 | 2022-01-14 | 纳米压印对准方法及系统 |
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CN202210044309.5A CN114326340B (zh) | 2022-01-14 | 2022-01-14 | 纳米压印对准方法及系统 |
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CN114326340A true CN114326340A (zh) | 2022-04-12 |
CN114326340B CN114326340B (zh) | 2024-04-02 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024120435A1 (zh) * | 2022-12-08 | 2024-06-13 | 光科芯图(北京)科技有限公司 | 一种基于全息光刻的对准方法、系统及设备 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201025489A (en) * | 2008-12-26 | 2010-07-01 | Univ Nat Formosa | Measurement system for alignment and level adjustment of embossing platform |
CN101772733A (zh) * | 2007-07-20 | 2010-07-07 | 分子制模股份有限公司 | 纳米压印工艺中用于衬底的对齐系统和方法 |
US20100195102A1 (en) * | 2009-02-04 | 2010-08-05 | Asml Netherlands B.V. | Imprint lithography |
CN102053509A (zh) * | 2010-12-09 | 2011-05-11 | 西安交通大学 | 一种压印光刻中凸起光栅对准标记的制作方法 |
CN102096348A (zh) * | 2010-12-09 | 2011-06-15 | 西安交通大学 | 提高压印对准过程中莫尔条纹图像质量的数字莫尔条纹方法 |
CN102981380A (zh) * | 2011-09-07 | 2013-03-20 | 上海微电子装备有限公司 | 用于光刻设备的预对准装置及方法 |
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2022
- 2022-01-14 CN CN202210044309.5A patent/CN114326340B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101772733A (zh) * | 2007-07-20 | 2010-07-07 | 分子制模股份有限公司 | 纳米压印工艺中用于衬底的对齐系统和方法 |
TW201025489A (en) * | 2008-12-26 | 2010-07-01 | Univ Nat Formosa | Measurement system for alignment and level adjustment of embossing platform |
US20100195102A1 (en) * | 2009-02-04 | 2010-08-05 | Asml Netherlands B.V. | Imprint lithography |
CN102053509A (zh) * | 2010-12-09 | 2011-05-11 | 西安交通大学 | 一种压印光刻中凸起光栅对准标记的制作方法 |
CN102096348A (zh) * | 2010-12-09 | 2011-06-15 | 西安交通大学 | 提高压印对准过程中莫尔条纹图像质量的数字莫尔条纹方法 |
CN102981380A (zh) * | 2011-09-07 | 2013-03-20 | 上海微电子装备有限公司 | 用于光刻设备的预对准装置及方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024120435A1 (zh) * | 2022-12-08 | 2024-06-13 | 光科芯图(北京)科技有限公司 | 一种基于全息光刻的对准方法、系统及设备 |
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CN114326340B (zh) | 2024-04-02 |
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Effective date of registration: 20220601 Address after: Room 204d, building A7, bio nano Park, No. 218, Xinghu street, Suzhou Industrial Park, Jiangsu 215000 Applicant after: Suzhou Hongxing Weina Technology Co.,Ltd. Address before: 215000 room 1001, building 18, poly jushang community, Guoyuan Road, Wuzhong District, Suzhou City, Jiangsu Province Applicant before: Luo Gang |
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Effective date of registration: 20230404 Address after: Room 430, Building 20, Suzhou Nano City, No. 99 Jinjihu Avenue, Industrial Park, Suzhou City, Jiangsu Province, 215000 Applicant after: Suzhou New Dimension Micro Nano Technology Co.,Ltd. Address before: Room 204d, building A7, bio nano Park, No. 218, Xinghu street, Suzhou Industrial Park, Jiangsu 215000 Applicant before: Suzhou Hongxing Weina Technology Co.,Ltd. |
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