CN114326320B - Control method, device, equipment and storage medium for stepping photoetching - Google Patents
Control method, device, equipment and storage medium for stepping photoetching Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000001259 photo etching Methods 0.000 title claims abstract description 30
- 238000001459 lithography Methods 0.000 claims abstract description 75
- 238000013507 mapping Methods 0.000 claims description 6
- 238000004590 computer program Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
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- 238000003709 image segmentation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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Abstract
The embodiment of the invention discloses a control method, a device, equipment and a storage medium for stepping photoetching. The control method of the step lithography comprises the following steps: acquiring the actual moving distance of the lithography equipment after one step; determining a stepping error of one step according to the actual moving distance and a preset stepping step length; the spot image is adjusted based on the step error to compensate for the exposure image error resulting from the step error. According to the scheme, the specific position of the spot image projection is adjusted, so that on the basis of ensuring the accuracy of the spot image position, the part of the exposure image on the to-be-etched piece, which is free from gaps or overlapping, is realized, the continuity of the exposure image is realized, and the accuracy of the exposure image is improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of photoetching, in particular to a control method, a device, equipment and a storage medium for stepping photoetching.
Background
The step motion is to move the spot from one preset position to another, and usually requires an accurate movement of the spot to the preset position. The working mode of the existing stepping photoetching equipment is as follows: and reading the position of the motion system by using the grating ruler, and controlling a motor of the motion system to decelerate and brake when the grating ruler reads that the motion system is close to a preset position, so that the motion system is stopped at the preset position when the motor stops. But due to the accuracy error Δx of the motion system, the position at which the motion system stops may be within ±Δx from the preset position. Therefore, the step deviation of the exposure image is caused, if the number of steps is more, a gap is generated between two preset positions, the number of steps is less, the two positions are overlapped, and the continuity of the projected image of the light spot on the target surface before and after the steps cannot be ensured.
Disclosure of Invention
The embodiment of the invention provides a control method, a device, equipment and a storage medium for stepping photoetching, which are used for realizing continuity of exposure images and improving the accuracy of the exposure images.
In a first aspect, an embodiment of the present invention provides a control method for step lithography, including:
acquiring the actual moving distance of the lithography equipment after one step;
determining a stepping error of one step according to the actual moving distance and a preset stepping step length;
the spot image is adjusted based on the step error to compensate for the exposure image error resulting from the step error.
Optionally, adjusting the spot image based on the step error includes:
the step error means that when one step is larger than a preset step length, the exposure image is increased by the width of the step error in the step direction, and the distance of the step error of the exposure image after the increase is shifted to the step reverse direction to compensate the exposure image error generated by the step error.
Optionally, adjusting the spot image based on the step error further comprises:
the step error means that when one step is smaller than a preset step length, the exposure image is reduced by the width of the step error in the reverse direction of the step, and the reduced exposure image is displaced by the step error distance in the step direction to compensate the exposure image error generated by the step error.
Optionally, acquiring the actual moving distance of the lithographic apparatus after one step includes:
controlling the lithography equipment to move along the stepping direction according to the preset stepping step length;
the actual movement distance of the movement of the lithographic apparatus is determined from the movement of the positioning device.
Optionally, before acquiring the actual movement distance of the lithographic apparatus after one step, the method includes:
setting parameters of a facula image projected by the photoetching equipment according to the moving precision of the photoetching equipment; and or mapping the image to be exposed according to the parameters of the facula image.
Optionally, the parameters of the spot image projected by the lithographic apparatus include: the projection length of the spot image and the projection width of the spot image;
the projection length of the light spot image is less than or equal to the maximum projection length of the photoetching equipment minus 2 times of the movement precision of the photoetching equipment; the projected width of the spot image is equal to the maximum projected width of the lithographic apparatus.
Optionally, mapping the image to be exposed according to parameters of the spot image includes:
dividing an exposure image into a plurality of stripe images according to the projection length of the light spot image and the moving precision of the lithography equipment, wherein each stripe image comprises a projection area positioned in the middle and compensation areas positioned at two sides;
the width of the projection area is equal to the projection length of the spot image, and the width of the compensation area is larger than the movement precision of the photoetching equipment.
Optionally, the projection areas of the adjacent strips are not overlapped, the compensation areas of the adjacent strips are overlapped with the projection areas of the adjacent strips, and the total length of the adjacent compensation areas is greater than or equal to 2 times of the moving precision of the lithography equipment and less than or equal to 2 times of the projection length of the facula image.
In a second aspect, an embodiment of the present invention further provides a control apparatus for step lithography, including:
the position determining device is used for acquiring the actual moving distance of the lithography equipment after one step;
the error determining device is used for determining a stepping error of one step according to the actual moving distance and a preset stepping step length;
and the facula adjusting device is used for adjusting the facula image based on the stepping error so as to compensate the exposure image error generated by the stepping error.
In a third aspect, an embodiment of the present invention further provides a control apparatus for step lithography, including:
one or more processors;
when the one or more programs are executed by the one or more processors, the one or more processors are caused to implement the control method of step lithography of any one of the above.
In a fourth aspect, an embodiment of the present invention further provides a computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements a control method of any of the above-mentioned stepper lithography.
According to the technical scheme, firstly, the actual moving distance of the lithography equipment after one step is obtained, then the step error of one step is determined according to the actual moving distance and the preset step length, and finally the speckle image is adjusted based on the step error to compensate the exposure image error generated by the step error, so that the accuracy of the projection position of the speckle image is ensured, the part of the exposure image on the to-be-lithography piece, which does not generate gaps or overlaps, is realized, the continuity of the exposure image is realized, and the accuracy of the exposure image is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, a brief description will be given below of the drawings required for the embodiments or the description of the prior art, and it is obvious that although the drawings in the following description are specific embodiments of the present invention, it is obvious to those skilled in the art that the basic concepts of the device structure, the driving method and the manufacturing method, which are disclosed and suggested according to the various embodiments of the present invention, are extended and extended to other structures and drawings, and it is needless to say that these should be within the scope of the claims of the present invention.
FIG. 1 is a schematic flow chart of a control method for step lithography according to an embodiment of the present invention;
FIG. 2 is an exposure image of a lithographic apparatus according to an embodiment of the present invention generated by error-free stepper lithography;
FIG. 3 is a schematic illustration of an exposure image generated by a lithographic apparatus according to an embodiment of the present invention with a first type of step error;
FIG. 4 is a schematic illustration of an exposure image generated by a lithographic apparatus according to an embodiment of the present invention with a second type of step error;
FIG. 5 is an adjusted exposure image of FIG. 4 according to an embodiment of the present invention;
FIG. 6 is an adjusted exposure image of FIG. 3 according to an embodiment of the present invention;
FIG. 7 is a flow chart of another control method for step lithography according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a micromirror array or a laser array according to an embodiment of the invention;
fig. 9 is a schematic structural diagram of a spot image according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a stripe image segmentation according to an embodiment of the present invention;
FIG. 11 is a schematic illustration of a scanning lithographic apparatus according to an embodiment of the invention;
FIG. 12 is a schematic diagram of a control apparatus for stepper lithography according to an embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Fig. 1 is a flow chart of a control method of step lithography according to an embodiment of the present invention, where the embodiment is applicable to a situation where step lithography is required, the method includes:
s110, acquiring the actual moving distance of the lithography equipment after one step.
The photoetching equipment realizes photoetching positioning of different positions of a to-be-photoetched piece through stepping movement, and the accuracy of the actual movement distance of the photoetching equipment after each stepping is closely related to the continuity and accuracy of an exposure image on the to-be-photoetched piece. Therefore, in order to obtain the accuracy of the actual movement distance after each step of the lithographic apparatus, it is necessary to obtain the actual movement distance after one step of the lithographic apparatus. Specifically, the actual moving distance of the lithography equipment after one step needs to be read in real time through the positioning device on the lithography equipment, so that the accuracy of acquiring the actual moving distance of the lithography equipment after one step is ensured. For example, the positioning device on the lithography equipment is a grating ruler and a reading head, and the reading head can obtain the actual moving distance of the lithography equipment after one step according to the reading of the grating ruler.
S120, determining a stepping error of one step according to the actual moving distance and a preset stepping step length.
The lithography equipment performs stepping movement according to the preset stepping step length, and the motion of the lithography equipment is driven by the operation of the motor, so that the accuracy of the stepping distance cannot be ensured when the lithography equipment performs stepping movement according to the preset stepping step length, and the actual moving distance of the lithography equipment after one step is larger than or smaller than the preset stepping step length. In order to ensure the continuity and accuracy of the exposure image on the to-be-etched piece, a stepping error of one step is required to be determined according to the actual moving distance and a preset stepping step length, so that the position of the exposure image is adjusted according to the stepping error of each time of the etching equipment, and the continuity and accuracy of the exposure image are realized.
And S130, adjusting the facula image based on the stepping error to compensate the exposure image error generated by the stepping error.
Wherein the spot image is generated by a lithographic apparatus, which may employ digital light processing techniques (Digital Light Processing, DLP) or laser close-packed techniques to generate the specific spot image. In particular, if the lithographic apparatus employs digital light processing techniques, a digital micromirror device (Digital Micromirror Device, DMD) may be used to produce a spot image of a particular shape. If the lithography apparatus employs a laser close-packed technique, a spot image of a specific shape may be generated using precisely arranged lasers. In summary, the spot image moves along with the movement of the lithographic apparatus, and in addition, the specific position of the spot image can be adjusted and moved by a digital micromirror device or a precisely arranged laser. The adjustment of the spot image based on the step error is a fine adjustment of the spot image position by a digital micromirror device or a precisely arranged laser.
Specifically, the step error includes two types of step errors, the first type of step error being: the actual moving distance of the lithography equipment after one step is smaller than the preset step length, and the generated step error is generated. The second type of step error is: the actual moving distance of the lithography equipment after one step is larger than the preset step length, and the generated step error is generated. Exemplary, fig. 2 is an exposure image generated by a lithographic apparatus according to an embodiment of the present invention under error-free step lithography, fig. 3 is an exposure image generated by a lithographic apparatus according to an embodiment of the present invention under a first type of step error, and fig. 4 is an exposure image generated by a lithographic apparatus according to an embodiment of the present invention under a second type of step error. Comparing fig. 2 and fig. 3, it can be seen that the lithographic apparatus generating the first type of step error does not move to the target position, and at this time, the actual position of the lithographic apparatus after stepping in the stepping direction is relatively behind, and at this time, the spot image needs to be moved to the stepping direction by the digital micromirror device or the precisely arranged laser by the first type of step error to compensate for the exposure image error generated by the step error. Comparing fig. 2 and fig. 4, it can be seen that the lithographic apparatus generating the second type of step error does not move to the target position, and the actual position of the stepping apparatus is relatively advanced after stepping in the stepping direction, so that the spot image needs to be moved to the opposite direction of the stepping by the digital micromirror device or the precisely arranged laser to compensate the exposure image error generated by the step error.
According to the technical scheme, firstly, the actual moving distance of the lithography equipment after one step is obtained, then the step error of one step is determined according to the actual moving distance and the preset step length, and finally the speckle image is adjusted based on the step error to compensate the exposure image error generated by the step error, so that the accuracy of the projection position of the speckle image is ensured, the part of the exposure image on the to-be-lithography piece, which does not generate gaps or overlaps, is realized, the continuity of the exposure image is realized, and the accuracy of the exposure image is improved.
Specifically, adjusting the spot image based on the step error includes: the step error means that when one step is larger than a preset step length, the exposure image is increased by the width of the step error in the step direction, and the distance of the step error of the exposure image after the increase is shifted to the step reverse direction to compensate the exposure image error generated by the step error.
The type of the step error is needed to be judged before the adjustment of the spot image based on the step error, and if the step error indicates that the one-step stepping of the lithography equipment is larger than the preset step length, the actual position of the lithography equipment after stepping is relatively advanced in the stepping direction, so that the spot image is needed to be adjusted and moved through a digital micromirror device or a precisely arranged laser. Specifically, it is first necessary to increase the exposure image by the width of the step error in the step direction to avoid the loss of image information of the step error width after the subsequent movement of the spot image, so as to compensate for the loss of the exposure image caused by the step error. And then the distance of the step error of the increased exposure image is reversely shifted to the step, so that the exposure image after the shift increase is seamlessly connected with the previous exposure image, the continuity of the exposure image is realized, and the accuracy of the exposure image is improved. Fig. 5 is an illustration of an adjusted exposure image of fig. 4 according to an embodiment of the present invention.
Specifically, adjusting the spot image based on the step error further includes: the step error means that when one step is smaller than a preset step length, the exposure image is reduced by the width of the step error in the reverse direction of the step, and the reduced exposure image is displaced by the step error distance in the step direction to compensate the exposure image error generated by the step error.
If the stepping error indicates that one step is smaller than the preset stepping step, the actual position of the stepping device in the stepping direction is relatively behind after the stepping, so that the spot image is adjusted and moved by a digital micromirror device or a precisely arranged laser. Specifically, it is first necessary to reduce the exposure image by the width of the step error in the reverse direction of the step to avoid overlapping of the image information of the step error width after the subsequent movement of the spot image, so as to remove the unnecessary exposure image generated by the step error. And then, shifting the distance of the step error of the reduced exposure image to the step direction, so that the exposure image after the shift reduction is seamlessly connected with the previous exposure image, the continuity of the exposure image is realized, and the accuracy of the exposure image is improved. Fig. 6 is an illustration of an adjusted exposure image of fig. 3 according to an embodiment of the present invention.
Fig. 7 is a flow chart of another control method of step lithography according to an embodiment of the present invention, as shown in fig. 7, the method includes the specific steps of:
s210, setting parameters of a facula image projected by the photoetching equipment according to the movement precision of the photoetching equipment; and or mapping the image to be exposed according to the parameters of the facula image.
The movement precision of the photoetching equipment is the maximum error generated when the photoetching equipment performs stepping movement according to a preset stepping step length. And setting specific parameters of the spot image projected by the lithography equipment according to the maximum error generated during the stepping motion of the lithography equipment. The spot image moves along with the movement of the lithography device, and thus, the error of the spot image along with the stepping movement of the lithography device is less than or equal to the movement precision of the lithography device.
Specifically, parameters of the spot image projected by the lithographic apparatus include: the projection length of the spot image and the projection width of the spot image; the projection length of the light spot image is less than or equal to the maximum projection length of the photoetching equipment minus 2 times of the movement precision of the photoetching equipment; the projected width of the spot image is equal to the maximum projected width of the lithographic apparatus.
Illustratively, if the movement precision θ of the lithographic apparatus is ±40um, the maximum projection length of the lithographic apparatus is 28mm, the projection length T of the spot image is less than or equal to 28mm-2 x 40um, and the projection width of the spot image is equal to the maximum projection width of the lithographic apparatus. According to the moving precision of the photoetching equipment, the projection length of the spot image is reduced, and the position of the spot image can be adjusted through a digital micro-mirror device or a precisely arranged laser. Specifically, a part of the micromirror array or the laser array is always closed, so that the subsequent movement of the spot image by a distance of step error is facilitated by adjusting the opening and closing portions of the micromirror array or the laser array, so as to compensate for the exposure image error generated by the step error.
Fig. 8 is a schematic structural diagram of a micromirror array or a laser array according to an embodiment of the present invention, and fig. 9 is a schematic structural diagram of a spot image according to an embodiment of the present invention, where, as shown in fig. 8 and fig. 9, the length of the micromirror array or the laser array is x+2θ, the width of the micromirror array or the laser array is Y, the length of the spot image 010 is X, and the width of the spot image 010 is Y.
Optionally, mapping the image to be exposed according to parameters of the spot image includes: dividing an exposure image into a plurality of stripe images according to the projection length of the light spot image and the moving precision of the lithography equipment, wherein each stripe image comprises a projection area positioned in the middle and compensation areas positioned at two sides; the width of the projection area is equal to the projection length of the spot image, and the width of the compensation area is larger than the movement precision of the photoetching equipment.
Wherein the width of the projection area is set according to the projection length of the spot image, and the width of the compensation area is set according to the movement accuracy of the lithographic apparatus. Specifically, the width of the projection area is equal to the projection length of the spot image, and the width of the compensation area is larger than the movement precision of the lithography apparatus.
Fig. 10 is a schematic diagram of a stripe image division structure according to an embodiment of the present invention, and as shown in fig. 10, an exposure image is divided into a plurality of stripe images, such as a stripe image 510, a stripe image 520, and a stripe image 530, according to a projection length of a spot image and a movement accuracy of a lithographic apparatus. Each stripe image includes a projection area in the middle and compensation areas on both sides, for example, stripe image 510 includes a projection area 511 (rectangular area outlined by solid line) in the middle and compensation areas 512 (shadow areas) on both sides; the stripe image 520 includes a projection area 521 (rectangular area outlined by solid line) in the middle and compensation areas 522 (hatched areas) on both sides; the banding image 530 includes a projection area 531 in the middle (rectangular area outlined by solid line) and compensation areas 532 on both sides (shaded area).
Optionally, the projection areas of the adjacent strips are not overlapped, the compensation areas of the adjacent strips are overlapped with the projection areas of the adjacent strips, and the total length of the adjacent compensation areas is greater than or equal to 2 times of the moving precision of the lithography equipment and less than or equal to 2 times of the projection length of the facula image.
Illustratively, with continued reference to fig. 10, the projection region 511 of the stripe image 510 and the projection region 521 of the adjacent stripe image 520 do not overlap, the compensation region 512 of the stripe image 510 overlaps the projection region 521 of the adjacent stripe image 520, and the total length of the adjacent compensation region 512 and the compensation region 522 is 2 times or more the movement accuracy of the lithographic apparatus and 2 times or less the projection length of the spot image.
S220, controlling the lithography equipment to move along the stepping direction according to the preset stepping step length.
S230, determining the actual moving distance of the movement of the lithography equipment according to the movement of the positioning device.
The positioning device comprises a grating ruler and a reading head, wherein the reading head of the positioning device moves along with the movement of the photoetching equipment, so that the reading head of the positioning device can determine the actual distance of the movement of the photoetching equipment.
For example, fig. 11 illustrates a scanning lithographic apparatus according to an embodiment of the present invention, as shown in fig. 11, where a grating scale 630 is disposed on each of the stage rail 610 and the beam 620, and a reading head 650 is disposed on the lithographic apparatus 640, where the reading head 650 may move along with the movement of the lithographic apparatus 640, so as to implement reading of the grating scale 630, thereby determining an actual movement distance of the lithographic apparatus.
S240, determining a stepping error of one step according to the actual moving distance and a preset stepping step length.
S250, adjusting the facula image based on the stepping error to compensate the exposure image error generated by the stepping error.
FIG. 12 is a schematic diagram of a control apparatus for step lithography according to an embodiment of the present invention, as shown in FIG. 12, the apparatus includes:
position determining means 710 for acquiring an actual movement distance of the lithographic apparatus after one step;
an error determining device 720 for determining a stepping error of one step according to the actual moving distance and a preset stepping step length;
the flare adjusting device 730 adjusts the flare image based on the step error to compensate for the exposure image error generated by the step error.
According to the technical scheme, the actual moving distance of the lithography equipment after one step is obtained through the position determining device, the error determining device determines the stepping error of one step according to the actual moving distance and the preset stepping step, and finally the light spot adjusting device adjusts the light spot image based on the stepping error to compensate the exposure image error generated by the stepping error, so that the accuracy of the projection position of the light spot image is ensured, the part of the exposure image on the to-be-lithography piece, which cannot generate gaps or overlap, is realized, the continuity of the exposure image is realized, and the accuracy of the exposure image is improved.
The embodiment of the invention also provides a control device for step lithography, which comprises: one or more processors; the one or more programs, when executed by the one or more processors, cause the one or more processors to implement the method of controlling stepper lithography of any of the embodiments described above.
The control device for step lithography provided by the embodiment of the present invention may execute the control method for step lithography provided by any embodiment of the present invention, and has the beneficial effects of the control method for step lithography, which are not described herein.
Embodiments of the present invention also provide a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements a control method of step lithography of any of the above embodiments.
From the above description of embodiments, it will be clear to a person skilled in the art that the present invention may be implemented by means of software and necessary general purpose hardware, but of course also by means of hardware, although in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art in the form of a software product, and the software product of the control of the step lithography may be stored in a readable storage medium, such as a floppy disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a FLASH Memory (FLASH), a hard disk or an optical disk, etc., for causing a control device of the step lithography to perform the method of the above-mentioned embodiments of the present invention.
It should be noted that, in the above embodiment of the control device for step lithography, each included module is only divided according to the functional logic, but not limited to the above division, so long as the corresponding function can be implemented; in addition, the specific names of the functional devices are also only for distinguishing from each other, and are not intended to limit the scope of the present invention.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. A method of controlling a stepper lithography, comprising:
acquiring the actual moving distance of the lithography equipment after one step;
determining a stepping error of one step according to the actual moving distance and a preset stepping step length;
adjusting the facula image based on the stepping error to compensate an exposure image error generated by the stepping error;
the adjusting the spot image based on the step error includes:
when the step error is larger than the preset step length, increasing the exposure image by the width of the step error in the step direction, and reversely displacing the distance of the step error of the increased exposure image to the step to compensate the exposure image error generated by the step error;
and when the step error is smaller than the preset step length, reducing the exposure image by the width of the step error in the reverse direction of the step, and shifting the distance of the step error of the reduced exposure image to the step direction so as to compensate the exposure image error generated by the step error.
2. The method according to claim 1, wherein obtaining the actual movement distance of the lithographic apparatus after one step comprises:
controlling the lithography equipment to move along the stepping direction according to the preset stepping step length;
and determining the actual moving distance of the movement of the lithography equipment according to the movement of the positioning device.
3. The control method of step lithography according to claim 1, characterized by comprising, before acquiring an actual movement distance after one step of the lithographic apparatus:
setting parameters of the facula image projected by the photoetching equipment according to the moving precision of the photoetching equipment; and/or
And mapping the image to be exposed according to the parameters of the facula image.
4. A method of controlling a step lithographic according to claim 3, wherein the parameters of the spot image projected by the lithographic apparatus comprise: the projection length of the light spot image and the projection width of the light spot image;
the projection length of the light spot image is less than or equal to the maximum projection length of the photoetching equipment minus 2 times the movement precision of the photoetching equipment; the projected width of the spot image is equal to the maximum projected width of the lithographic apparatus.
5. The method according to claim 4, wherein mapping the image to be exposed according to the parameters of the spot image comprises:
dividing an exposure image into a plurality of stripe images according to the projection length of the facula image and the moving precision of the lithography equipment, wherein each stripe image comprises a projection area positioned in the middle and compensation areas positioned at two sides;
the width of the projection area is equal to the projection length of the facula image, and the width of the compensation area is larger than the movement precision of the photoetching equipment.
6. The method according to claim 5, wherein the projection areas of the adjacent strips are not overlapped, the compensation areas of the adjacent strips are overlapped with the projection areas of the adjacent strips, and the total length of the adjacent compensation areas is greater than or equal to 2 times the movement accuracy of the lithography apparatus and less than or equal to 2 times the projection length of the spot image.
7. A control apparatus for step lithography, applied to the control method for step lithography as claimed in claim 1, characterized by comprising:
the position determining device is used for acquiring the actual moving distance of the lithography equipment after one step;
the error determining device is used for determining a stepping error of one step according to the actual moving distance and a preset stepping step length;
and the facula adjusting device is used for adjusting the facula image based on the stepping error so as to compensate the exposure image error generated by the stepping error.
8. A control apparatus for step lithography, characterized in that the control apparatus for step lithography comprises:
one or more processors;
the one or more programs, when executed by the one or more processors, cause the one or more processors to implement the method of controlling stepper lithography as claimed in any one of claims 1-6.
9. A computer readable storage medium having stored thereon a computer program, which when executed by a processor, implements a method of controlling stepper lithography as claimed in any one of claims 1-6.
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