CN114326320B - Control method, device, equipment and storage medium for stepper lithography - Google Patents
Control method, device, equipment and storage medium for stepper lithography Download PDFInfo
- Publication number
- CN114326320B CN114326320B CN202111244938.4A CN202111244938A CN114326320B CN 114326320 B CN114326320 B CN 114326320B CN 202111244938 A CN202111244938 A CN 202111244938A CN 114326320 B CN114326320 B CN 114326320B
- Authority
- CN
- China
- Prior art keywords
- error
- lithography
- image
- lithography equipment
- spot image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
本发明实施例公开了一种步进光刻的控制方法、装置、设备及存储介质。该步进光刻的控制方法包括:获取光刻设备一次步进后的实际移动距离;根据实际移动距离和预设步进步长确定一次步进的步进误差;基于步进误差对光斑图像进行调整,以补偿步进误差产生的曝光图像误差。本方案通过调整光斑图像投影的具体位置,从而在保证光斑图像位置的准确性的基础上,实现在待光刻件上曝光图像不会产生缝隙或重叠的部分,实现曝光图像的连续性,提高曝光图像的精确度。
Embodiments of the present invention disclose a control method, device, equipment and storage medium for stepper lithography. The control method of the stepper lithography includes: obtaining the actual moving distance of the lithography equipment after one step; determining the step error of one step based on the actual moving distance and the preset step length; and performing the step error on the spot image based on the step error. Adjust to compensate for exposure image errors caused by step errors. This solution adjusts the specific position of the spot image projection, so as to ensure the accuracy of the spot image position, so that the exposed image will not produce gaps or overlapping parts on the parts to be lithographed, thereby achieving continuity of the exposed image and improving Exposure image accuracy.
Description
技术领域Technical field
本发明实施例涉及光刻技术领域,尤其涉及一种步进光刻的控制方法、装置、设备及存储介质。Embodiments of the present invention relate to the field of photolithography technology, and in particular, to a control method, device, equipment and storage medium for stepper photolithography.
背景技术Background technique
步进运动是将光斑从一个预设位置移动至另一个预设位置,通常需要光斑准确的运动到预设位置上。现有步进光刻设备的工作方式为:利用光栅尺读取运动系统的位置,当光栅尺读取到运动系统接近预设位置时,控制运动系统的电机减速刹车,在电机停止时使运动系统停在预设位置上。但是由于运动系统的精度误差Δx,运动系统停止的位置会是距离预设位置±Δx的范围内。因此会导致曝光图像的步进偏差,若是步进多了则会在两个预设位置之间产生缝隙,步进少了会使两个位置之间发生重叠,无法保证步进前后光斑在目标表面投影图像的连续性。Stepping motion is to move the light spot from one preset position to another. It usually requires the light spot to move accurately to the preset position. The existing stepper lithography equipment works as follows: using a grating ruler to read the position of the motion system. When the grating ruler reads that the motion system is close to the preset position, the motor of the motion system is controlled to decelerate and brake, and the movement is stopped when the motor stops. The system stops at the preset position. However, due to the accuracy error Δx of the motion system, the position where the motion system stops will be within the range of ±Δx from the preset position. This will lead to a step deviation in the exposure image. If there are too many steps, a gap will be generated between the two preset positions. If there are too few steps, there will be an overlap between the two positions. It is impossible to ensure that the light spot before and after the step is on the target. Continuity of surface projected images.
发明内容Contents of the invention
本发明实施例提供一种步进光刻的控制方法、装置、设备及存储介质,以实现曝光图像的连续性,提高曝光图像的精确度。Embodiments of the present invention provide a stepper lithography control method, device, equipment and storage medium to achieve continuity of exposure images and improve the accuracy of exposure images.
第一方面,本发明实施例提供了一种步进光刻的控制方法包括:In a first aspect, an embodiment of the present invention provides a control method for stepper lithography, including:
获取光刻设备一次步进后的实际移动距离;Obtain the actual moving distance of the lithography equipment after one step;
根据实际移动距离和预设步进步长确定一次步进的步进误差;Determine the step error of a step based on the actual moving distance and the preset step length;
基于步进误差对光斑图像进行调整,以补偿步进误差产生的曝光图像误差。The spot image is adjusted based on the step error to compensate for the exposure image error caused by the step error.
可选地,基于步进误差对光斑图像进行调整包括:Optionally, adjusting the spot image based on the step error includes:
步进误差表示一次步进大于预设步进步长的时候,在步进方向以步进误差的宽度增大曝光图像,并向步进反向位移增大后的曝光图像步进误差的距离以补偿步进误差产生的曝光图像误差。The step error means that when a step is greater than the preset step length, the exposure image is increased by the width of the step error in the step direction, and the exposure image is increased by the step error distance in the reverse direction of the step. Compensates for exposure image errors caused by step errors.
可选地,基于步进误差对光斑图像进行调整还包括:Optionally, adjusting the spot image based on the step error also includes:
步进误差表示一次步进小于预设步进步长的时候,在步进反向以步进误差的宽度减小曝光图像,并向步进方向位移减小后的曝光图像步进误差的距离以补偿步进误差产生的曝光图像误差。The step error means that when a step is smaller than the preset step length, the exposure image is reduced by the width of the step error in the step reverse direction, and the exposure image is displaced in the step direction by the distance of the step error. Compensates for exposure image errors caused by step errors.
可选地,获取光刻设备一次步进后的实际移动距离,包括:Optionally, obtain the actual moving distance of the lithography equipment after one step, including:
根据预设步进步长,控制光刻设备沿步进方向移动;Control the lithography equipment to move in the step direction according to the preset step length;
根据定位装置的移动确定光刻设备移动的实际移动距离。The actual movement distance of the lithography equipment is determined based on the movement of the positioning device.
可选地,在获取光刻设备一次步进后的实际移动距离之前,包括:Optionally, before obtaining the actual moving distance of the lithography equipment after one step, include:
根据光刻设备的移动精度,设置光刻设备投影的光斑图像的参数;和或根据光斑图像的参数对待曝光图像分图。According to the movement accuracy of the lithography equipment, set the parameters of the spot image projected by the lithography equipment; and or divide the image to be exposed according to the parameters of the spot image.
可选地,光刻设备投影的光斑图像的参数包括:光斑图像的投影长度和光斑图像的投影宽度;Optionally, the parameters of the spot image projected by the lithography equipment include: the projection length of the spot image and the projection width of the spot image;
其中,光斑图像的投影长度小于等于光刻设备的最大投影长度减去2倍的光刻设备的移动精度;光斑图像的投影宽度等于光刻设备的最大投影宽度。Among them, the projection length of the spot image is less than or equal to the maximum projection length of the lithography equipment minus 2 times the movement accuracy of the lithography equipment; the projection width of the spot image is equal to the maximum projection width of the lithography equipment.
可选地,根据光斑图像的参数对待曝光图像分图,包括:Optionally, divide the image to be exposed according to the parameters of the spot image, including:
依据光斑图像的投影长度和光刻设备的移动精度将曝光图像分为多个条带图像,每个条带图像包括位于中间的投影区域和两侧的补偿区域;The exposure image is divided into multiple strip images based on the projection length of the spot image and the movement accuracy of the lithography equipment. Each strip image includes a projection area in the middle and compensation areas on both sides;
投影区域的宽度等于光斑图像的投影长度,补偿区域的宽度大于光刻设备的移动精度。The width of the projection area is equal to the projection length of the spot image, and the width of the compensation area is greater than the movement accuracy of the lithography equipment.
可选地,相邻条带的投影区域不重叠设置,相邻条带的补偿区域与相邻条带的投影区域重叠设置,相邻补偿区域的总长度大于等于2倍的光刻设备的移动精度,小于等于2倍的光斑图像的投影长度。Optionally, the projection areas of adjacent strips do not overlap, the compensation areas of adjacent strips overlap with the projection areas of adjacent strips, and the total length of adjacent compensation areas is greater than or equal to 2 times the movement of the lithography equipment. Precision, less than or equal to 2 times the projection length of the spot image.
第二方面,本发明实施例还提供了一种步进光刻的控制装置包括:In a second aspect, embodiments of the present invention also provide a control device for stepper lithography, including:
位置确定装置,用于获取光刻设备一次步进后的实际移动距离;A position determination device used to obtain the actual moving distance of the lithography equipment after one step;
误差确定装置,根据实际移动距离和预设步进步长确定一次步进的步进误差;The error determination device determines the step error of a step based on the actual moving distance and the preset step length;
光斑调整装置,基于步进误差对光斑图像进行调整,以补偿步进误差产生的曝光图像误差。The spot adjustment device adjusts the spot image based on the step error to compensate for the exposure image error caused by the step error.
第三方面,本发明实施例还提供了一种步进光刻的控制设备,该步进光刻的控制设备包括:In a third aspect, embodiments of the present invention also provide a control device for stepper lithography. The control device for stepper lithography includes:
一个或多个处理器;one or more processors;
当一个或多个程序被一个或多个处理器执行,使得一个或多个处理器实现上述任一的步进光刻的控制方法。When one or more programs are executed by one or more processors, the one or more processors implement any of the above stepper lithography control methods.
第四方面,本发明实施例还提供了一种计算机可读存储介质,其上存储有计算机程序,该程序被处理器执行时实现上述任一的步进光刻的控制方法。In a fourth aspect, embodiments of the present invention also provide a computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, any one of the above stepper lithography control methods is implemented.
本实施例的技术方案,首先通过获取光刻设备一次步进后的实际移动距离,然后根据实际移动距离和预设步进步长确定一次步进的步进误差,最后基于步进误差对光斑图像进行调整,以补偿步进误差产生的曝光图像误差,从而保证光斑图像投影位置的准确性,进而实现在待光刻件上曝光图像不会产生缝隙或重叠的部分,实现曝光图像的连续性,提高曝光图像的精确度。The technical solution of this embodiment is to first obtain the actual moving distance of the lithography equipment after one step, then determine the step error of one step based on the actual moving distance and the preset step length, and finally calculate the spot image based on the step error. Adjustment is made to compensate for the exposure image error caused by the step error, thereby ensuring the accuracy of the spot image projection position, thereby achieving no gaps or overlapping parts of the exposed image on the part to be lithographed, and achieving continuity of the exposure image. Improve the accuracy of exposed images.
附图说明Description of the drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图做一简单地介绍,显而易见地,下面描述中的附图虽然是本发明的一些具体的实施例,对于本领域的技术人员来说,可以根据本发明的各种实施例所揭示和提示的器件结构,驱动方法和制造方法的基本概念,拓展和延伸到其它的结构和附图,毋庸置疑这些都应该是在本发明的权利要求范围之内。In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, a brief introduction will be made below to the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description Although these are some specific embodiments of the present invention, those skilled in the art can expand and extend the basic concepts of the device structure, driving method and manufacturing method according to the various embodiments of the present invention. Other structures and drawings are undoubtedly within the scope of the claims of the present invention.
图1为本发明实施例提供的一种步进光刻的控制方法的流程示意图;Figure 1 is a schematic flow chart of a stepper lithography control method provided by an embodiment of the present invention;
图2为本发明实施例提供的一种光刻设备在无误差步进光刻下产生的曝光图像;Figure 2 is an exposure image produced by a lithography equipment provided by an embodiment of the present invention under error-free step lithography;
图3为本发明实施例提供的一种光刻设备在第一种类型的步进误差下产生的曝光图像;Figure 3 is an exposure image produced by a lithography equipment provided by an embodiment of the present invention under the first type of step error;
图4为本发明实施例提供的一种光刻设备在第二种类型的步进误差下产生的曝光图像;Figure 4 is an exposure image produced by a lithography equipment provided by an embodiment of the present invention under the second type of step error;
图5为本发明实施例提供的一种图4调整后的曝光图像;Figure 5 is an adjusted exposure image of Figure 4 provided by an embodiment of the present invention;
图6为本发明实施例提供的一种图3调整后的曝光图像;Figure 6 is an adjusted exposure image of Figure 3 provided by an embodiment of the present invention;
图7为本发明实施例提供的另一种步进光刻的控制方法的流程示意图;Figure 7 is a schematic flow chart of another stepper lithography control method provided by an embodiment of the present invention;
图8为本发明实施例提供的一种微镜阵列或激光器阵列的结构示意图;Figure 8 is a schematic structural diagram of a micromirror array or laser array provided by an embodiment of the present invention;
图9为本发明实施例提供的一种光斑图像的结构示意图;Figure 9 is a schematic structural diagram of a light spot image provided by an embodiment of the present invention;
图10为本发明实施例提供的一种条带图像分割的结构示意图;Figure 10 is a schematic structural diagram of a strip image segmentation provided by an embodiment of the present invention;
图11为本发明实施例提供的一种扫描光刻设备;Figure 11 is a scanning lithography equipment provided by an embodiment of the present invention;
图12为本发明实施例提供的一种步进光刻的控制装置。Figure 12 is a control device for stepper lithography provided by an embodiment of the present invention.
具体实施方式Detailed ways
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present invention.
图1为本发明实施例提供的一种步进光刻的控制方法的流程示意图,本实施例可适用于需要步进光刻的情况,该方法包括:Figure 1 is a schematic flowchart of a stepper lithography control method provided by an embodiment of the present invention. This embodiment can be applied to situations where stepper lithography is required. The method includes:
S110、获取光刻设备一次步进后的实际移动距离。S110. Obtain the actual moving distance of the lithography equipment after one step.
其中,光刻设备通过步进移动实现对待光刻件的不同位置进行光刻定位,光刻设备每一次步进后的实际移动距离的精确度,与在待光刻件上曝光图像的连续性和精确度密切相关。因此为了获取光刻设备每一次步进后的实际移动距离的精确度,从而需要获取光刻设备一次步进后的实际移动距离。具体地,光刻设备一次步进后的实际移动距离需要通过光刻设备上的定位装置进行位置的实时读取,保证对光刻设备一次步进后的实际移动距离获取的准确性。例如,光刻设备上的定位装置为光栅尺和读数头,读数头根据对光栅尺的读数即可得到光刻设备一次步进后的实际移动距离。Among them, the lithography equipment realizes photolithography positioning at different positions of the parts to be lithographed through step-by-step movement. The accuracy of the actual moving distance of the lithography equipment after each step is consistent with the continuity of the exposed image on the parts to be lithographed. closely related to accuracy. Therefore, in order to obtain the accuracy of the actual movement distance of the lithography equipment after each step, it is necessary to obtain the actual movement distance of the lithography equipment after one step. Specifically, the actual moving distance of the lithography equipment after one step needs to be read in real time through the positioning device on the lithography equipment to ensure the accuracy of obtaining the actual moving distance of the lithography equipment after one step. For example, the positioning device on the lithography equipment is a grating ruler and a reading head. The reading head can obtain the actual moving distance of the lithography equipment after one step based on the reading of the grating ruler.
S120、根据实际移动距离和预设步进步长确定一次步进的步进误差。S120. Determine the step error of one step according to the actual moving distance and the preset step length.
其中,光刻设备根据预设步进步长进行步进移动,由于光刻设备的运动是由电机的运转带动的,由此光刻设备根据预设步进步长进行步进移动时无法保证步进距离的精确性,从而导致光刻设备一次步进后的实际移动距离大于或小于预设步进步长。为了保证在待光刻件上曝光图像的连续性和精确度,需要根据实际移动距离和预设步进步长确定一次步进的步进误差,从而根据光刻设备每次的步进误差调整曝光图像的位置,从而实现曝光图像的连续性和精确度。Among them, the lithography equipment moves step by step according to the preset step length. Since the movement of the lithography equipment is driven by the operation of the motor, the step movement of the lithography equipment cannot be guaranteed when it moves according to the preset step length. The accuracy of the distance causes the actual moving distance of the lithography equipment after one step to be greater or less than the preset step length. In order to ensure the continuity and accuracy of the exposed image on the part to be lithographed, the step error of one step needs to be determined based on the actual movement distance and the preset step length, so that the exposure can be adjusted according to the step error of the lithography equipment. The position of the image, thereby achieving continuity and accuracy of the exposed image.
S130、基于步进误差对光斑图像进行调整,以补偿步进误差产生的曝光图像误差。S130. Adjust the spot image based on the step error to compensate for the exposure image error caused by the step error.
其中,光斑图像是由光刻设备产生的,光刻设备可以采用数字光处理技术(Digital Light Processing,DLP)或激光器密排技术生成的特定的光斑图像。具体地,若光刻设备采用数字光处理技术,则可以利用数字微镜器件(Digital Micromirror Device,DMD)产生特定形状的光斑图像。若光刻设备采用激光器密排技术,则可以利用精密排布的激光器产生特定形状的光斑图像。综上可知,光斑图像会随着光刻设备的移动而移动,此外光斑图像的具体位置还可以通过数字微镜器件或精密排布的激光器进行调整移动。基于步进误差对光斑图像进行调整是通过数字微镜器件或精密排布的激光器对光斑图像位置的微调整。Among them, the spot image is generated by lithography equipment. The lithography equipment can use digital light processing technology (Digital Light Processing, DLP) or laser close-packing technology to generate a specific spot image. Specifically, if the lithography equipment adopts digital light processing technology, a digital micromirror device (DMD) can be used to generate a spot image of a specific shape. If the lithography equipment adopts laser close-packing technology, precisely arranged lasers can be used to produce spot images of specific shapes. In summary, it can be seen that the spot image will move with the movement of the lithography equipment. In addition, the specific position of the spot image can also be adjusted and moved through digital micromirror devices or precisely arranged lasers. The adjustment of the spot image based on the step error is a micro-adjustment of the position of the spot image through a digital micromirror device or a precisely arranged laser.
具体地,步进误差包括两种类型的步进误差,第一种类型的步进误差为:光刻设备一次步进后的实际移动距离小于预设步进步长,产生的步进误差。第二种类型的步进误差为:光刻设备一次步进后的实际移动距离大于预设步进步长,产生的步进误差。示例性地,图2为本发明实施例提供的一种光刻设备在无误差步进光刻下产生的曝光图像,图3为本发明实施例提供的一种光刻设备在第一种类型的步进误差下产生的曝光图像,图4为本发明实施例提供的一种光刻设备在第二种类型的步进误差下产生的曝光图像。对比图2和图3,可知产生第一种类型的步进误差的光刻设备并未移动到目标位置,此时在步进方向光刻设备步进后的实际位置相对落后,此时需通过数字微镜器件或精密排布的激光器将光斑图像向步进方向移动第一种类型的步进误差,以补偿步进误差产生的曝光图像误差。对比图2和图4,可知产生第二种类型的步进误差的光刻设备并未移动到目标位置,此时在步进方向步进设备步进后的实际位置相对超前,由此需通过数字微镜器件或精密排布的激光器将光斑图像向步进的反方向移动第二种类型的步进误差,以补偿步进误差产生的曝光图像误差。Specifically, the step error includes two types of step errors. The first type of step error is the step error generated when the actual moving distance of the lithography equipment after one step is less than the preset step length. The second type of step error is the step error caused by the actual movement distance of the lithography equipment after one step being greater than the preset step length. Exemplarily, Figure 2 is an exposure image produced by a lithography equipment provided by an embodiment of the present invention under error-free step lithography. Figure 3 is a first type of lithography equipment provided by an embodiment of the present invention. The exposure image generated under the second type of step error. FIG. 4 is an exposure image generated under the second type of step error by a lithography equipment provided by an embodiment of the present invention. Comparing Figure 2 and Figure 3, it can be seen that the lithography equipment that generates the first type of step error has not moved to the target position. At this time, the actual position of the lithography equipment after stepping in the stepping direction is relatively behind. At this time, it is necessary to pass Digital micromirror devices or precisely arranged lasers move the spot image in the step direction to compensate for the exposure image error caused by the step error. Comparing Figure 2 and Figure 4, it can be seen that the lithography equipment that generates the second type of stepping error has not moved to the target position. At this time, the actual position of the stepping equipment after stepping in the stepping direction is relatively advanced. Therefore, it is necessary to pass The second type of step error occurs when a digital micromirror device or a precisely arranged laser moves the spot image in the opposite direction of the step to compensate for the exposure image error caused by the step error.
本实施例的技术方案,首先通过获取光刻设备一次步进后的实际移动距离,然后根据实际移动距离和预设步进步长确定一次步进的步进误差,最后基于步进误差对光斑图像进行调整,以补偿步进误差产生的曝光图像误差,从而保证光斑图像投影位置的准确性,进而实现在待光刻件上曝光图像不会产生缝隙或重叠的部分,实现曝光图像的连续性,提高曝光图像的精确度。The technical solution of this embodiment is to first obtain the actual moving distance of the lithography equipment after one step, then determine the step error of one step based on the actual moving distance and the preset step length, and finally calculate the spot image based on the step error. Adjustment is made to compensate for the exposure image error caused by the step error, thereby ensuring the accuracy of the spot image projection position, thereby achieving no gaps or overlapping parts of the exposed image on the part to be lithographed, and achieving continuity of the exposure image. Improve the accuracy of exposed images.
具体地,基于步进误差对光斑图像进行调整包括:步进误差表示一次步进大于预设步进步长的时候,在步进方向以步进误差的宽度增大曝光图像,并向步进反向位移增大后的曝光图像步进误差的距离以补偿步进误差产生的曝光图像误差。Specifically, adjusting the spot image based on the step error includes: the step error indicates that when a step is greater than the preset step length, the exposure image is increased by the width of the step error in the step direction, and the step direction is reversed. The distance to the step error of the exposure image after the displacement is increased to compensate for the exposure image error caused by the step error.
其中,在基于步进误差对光斑图像进行调整前需要对步进误差的类型进行判断,若步进误差表示光刻设备一次步进大于预设步进步长时,在步进方向光刻设备步进后的实际位置相对超前,由此需通过数字微镜器件或精密排布的激光器对光斑图像进行调整移动。具体地,首先需要在步进方向以步进误差的宽度增大曝光图像,以避免后续对光斑图像移动后出现步进误差宽度的图像信息的缺失,以补偿步进误差产生的曝光图像缺失。然后向步进反向位移增大后的曝光图像步进误差的距离,从而使位移增大后的曝光图像与上一曝光图像无缝连接,实现曝光图像的连续性,提高曝光图像的精确度。示例性的,图5为本发明实施例提供的一种图4调整后的曝光图像。Among them, before adjusting the spot image based on the step error, the type of the step error needs to be judged. If the step error indicates that one step of the lithography equipment is greater than the preset step length, the lithography equipment steps in the step direction. The actual position is relatively advanced, so the spot image needs to be adjusted and moved through digital micromirror devices or precisely arranged lasers. Specifically, it is first necessary to increase the exposure image by the width of the step error in the step direction to avoid the loss of image information of the step error width after subsequent movement of the spot image, and to compensate for the loss of the exposure image caused by the step error. Then the step error distance of the increased exposure image is shifted in the reverse direction, so that the exposure image after the increase in displacement is seamlessly connected to the previous exposure image, achieving continuity of the exposure image and improving the accuracy of the exposure image. . For example, FIG. 5 is an adjusted exposure image of FIG. 4 provided by an embodiment of the present invention.
具体地,基于步进误差对光斑图像进行调整还包括:步进误差表示一次步进小于预设步进步长的时候,在步进反向以步进误差的宽度减小曝光图像,并向步进方向位移减小后的曝光图像步进误差的距离以补偿步进误差产生的曝光图像误差。Specifically, adjusting the spot image based on the step error also includes: when the step error indicates that a step is smaller than the preset step length, the exposure image is reduced by the width of the step error in the step reverse direction, and the step error is adjusted to the step error. The distance of the exposure image step error after the forward direction displacement is reduced to compensate for the exposure image error caused by the step error.
其中,若步进误差表示一次步进小于预设步进步长时,在步进方向步进设备步进后的实际位置相对落后,由此需通过数字微镜器件或精密排布的激光器对光斑图像进行调整移动。具体地,首先需要在步进反向以步进误差的宽度减小曝光图像,以避免后续对光斑图像移动后出现步进误差宽度的图像信息的重叠,以去除步进误差产生的多余曝光图像。然后向步进方向位移减小后的曝光图像步进误差的距离,从而使位移减小后的曝光图像与上一曝光图像无缝连接,实现曝光图像的连续性,提高曝光图像的精确度。示例性的,图6为本发明实施例提供的一种图3调整后的曝光图像。Among them, if the step error indicates that one step is smaller than the preset step length, the actual position of the stepping device after stepping in the step direction is relatively lagging behind. Therefore, it is necessary to use a digital micromirror device or a precisely arranged laser to adjust the light spot. The image is adjusted and moved. Specifically, it is first necessary to reduce the exposure image by the width of the step error in the step reverse direction to avoid the overlap of image information of the step error width after subsequent movement of the spot image, and to remove the redundant exposure image generated by the step error. . The reduced exposure image is then displaced in the step direction by the distance of the step error, so that the reduced exposure image is seamlessly connected to the previous exposure image, achieving continuity of the exposure image and improving the accuracy of the exposure image. For example, FIG. 6 is an adjusted exposure image of FIG. 3 provided by an embodiment of the present invention.
图7为本发明实施例提供的另一种步进光刻的控制方法的流程示意图,如图7所示,该方法的具体步骤包括:Figure 7 is a schematic flow chart of another stepper lithography control method provided by an embodiment of the present invention. As shown in Figure 7, the specific steps of the method include:
S210、根据光刻设备的移动精度,设置光刻设备投影的光斑图像的参数;和或根据光斑图像的参数对待曝光图像分图。S210. Set the parameters of the spot image projected by the lithography equipment according to the movement accuracy of the lithography equipment; and or divide the image to be exposed according to the parameters of the spot image.
其中,光刻设备的移动精度为光刻设备根据预设步进步长进行步进移动时产生的最大误差。根据光刻设备步进运动时产生的最大误差,设置光刻设备投影的光斑图像的具体参数。光斑图像会随着光刻设备的移动而移动,由此,光斑图像随着光刻设备进行步进运动的误差小于等于光刻设备的移动精度。Among them, the movement accuracy of the lithography equipment is the maximum error generated when the lithography equipment moves stepwise according to the preset step length. According to the maximum error generated during the step movement of the lithography equipment, set the specific parameters of the spot image projected by the lithography equipment. The spot image will move with the movement of the lithography equipment. Therefore, the error of the step movement of the spot image as the lithography equipment moves is less than or equal to the movement accuracy of the lithography equipment.
具体地,光刻设备投影的光斑图像的参数包括:光斑图像的投影长度和光斑图像的投影宽度;其中,光斑图像的投影长度小于等于光刻设备的最大投影长度减去2倍的光刻设备的移动精度;光斑图像的投影宽度等于光刻设备的最大投影宽度。Specifically, the parameters of the spot image projected by the lithography equipment include: the projection length of the spot image and the projection width of the spot image; wherein the projection length of the spot image is less than or equal to the maximum projection length of the lithography equipment minus 2 times the lithography equipment Movement accuracy; the projection width of the spot image is equal to the maximum projection width of the lithography equipment.
示例性地,若光刻设备的移动精度θ为±40um,光刻设备的最大投影长度为28mm,光斑图像的投影长度T≤28mm-2*40um,光斑图像的投影宽度等于光刻设备的最大投影宽度。根据光刻设备的移动精度,减小光斑图像的投影长度,可以通过数字微镜器件或精密排布的激光器对光斑图像位置进行调整。具体地,微镜阵列或激光器阵列的一部分始终处于关闭,如此便于后续通过调节微镜阵列或激光阵列的打开部分和关闭部分,实现将光斑图像移动步进误差的距离,以补偿因步进误差产生的曝光图像误差。For example, if the movement accuracy θ of the lithography equipment is ±40um, the maximum projection length of the lithography equipment is 28mm, the projection length of the spot image is T≤28mm-2*40um, the projection width of the spot image is equal to the maximum projection length of the lithography equipment. Projection width. According to the movement accuracy of the lithography equipment, the projection length of the spot image is reduced, and the position of the spot image can be adjusted through a digital micromirror device or a precisely arranged laser. Specifically, a part of the micromirror array or the laser array is always closed, so that the spot image can be moved by a distance of the step error by adjusting the opening and closing parts of the micromirror array or the laser array to compensate for the step error. The resulting exposure image error.
示例性地,图8为本发明实施例提供的一种微镜阵列或激光器阵列的结构示意图,图9为本发明实施例提供的一种光斑图像的结构示意图,如图8和图9所示,微镜阵列或激光器阵列的长度为X+2θ,微镜阵列或激光器阵列的宽度为Y,光斑图像010的长度为X,光斑图像010的宽度为Y。Exemplarily, Figure 8 is a schematic structural diagram of a micromirror array or laser array provided by an embodiment of the present invention, and Figure 9 is a schematic structural diagram of a spot image provided by an embodiment of the present invention, as shown in Figures 8 and 9 , the length of the micromirror array or laser array is X+2θ, the width of the micromirror array or laser array is Y, the length of the spot image 010 is X, and the width of the spot image 010 is Y.
可选地,根据光斑图像的参数对待曝光图像分图,包括:依据光斑图像的投影长度和光刻设备的移动精度将曝光图像分为多个条带图像,每个条带图像包括位于中间的投影区域和两侧的补偿区域;投影区域的宽度等于光斑图像的投影长度,补偿区域的宽度大于光刻设备的移动精度。Optionally, dividing the image to be exposed according to the parameters of the spot image includes: dividing the exposure image into multiple strip images according to the projection length of the spot image and the movement accuracy of the lithography equipment, each strip image including a The projection area and the compensation areas on both sides; the width of the projection area is equal to the projection length of the spot image, and the width of the compensation area is greater than the movement accuracy of the lithography equipment.
其中,投影区域的宽度是根据光斑图像的投影长度设置的,补偿区域的宽度是根据光刻设备的移动精度设置的。具体地,投影区域的宽度等于光斑图像的投影长度,补偿区域的宽度大于光刻设备的移动精度。Among them, the width of the projection area is set according to the projection length of the spot image, and the width of the compensation area is set according to the movement accuracy of the lithography equipment. Specifically, the width of the projection area is equal to the projection length of the spot image, and the width of the compensation area is greater than the movement accuracy of the lithography equipment.
示例性地,图10为本发明实施例提供的一种条带图像分割的结构示意图,如图10所示,依据光斑图像的投影长度和光刻设备的移动精度将曝光图像分为多个条带图像,例如条带图像510、条带图像520以及条带图像530。每个条带图像包括位于中间的投影区域和两侧的补偿区域,例如条带图像510包括位于中间的投影区域511(实线框出的矩形区域)和两侧的补偿区域512(阴影区域);条带图像520包括位于中间的投影区域521(实线框出的矩形区域)和两侧的补偿区域522(阴影区域);条带图像530包括位于中间的投影区域531(实线框出的矩形区域)和两侧的补偿区域532(阴影区域)。Exemplarily, Figure 10 is a schematic structural diagram of strip image segmentation provided by an embodiment of the present invention. As shown in Figure 10, the exposure image is divided into multiple strips according to the projection length of the spot image and the movement accuracy of the lithography equipment. Strip images, such as strip image 510, strip image 520, and strip image 530. Each strip image includes a projection area in the middle and compensation areas on both sides. For example, the strip image 510 includes a projection area 511 in the middle (rectangular area framed by solid lines) and compensation areas 512 (shaded areas) on both sides. ; The strip image 520 includes a projection area 521 in the middle (rectangular area framed by solid lines) and compensation areas 522 (shaded areas) on both sides; the strip image 530 includes a projection area 531 (rectangular area framed by solid lines) in the middle. rectangular area) and compensation areas 532 on both sides (shaded areas).
可选地,相邻条带的投影区域不重叠设置,相邻条带的补偿区域与相邻条带的投影区域重叠设置,相邻补偿区域的总长度大于等于2倍的光刻设备的移动精度,小于等于2倍的光斑图像的投影长度。Optionally, the projection areas of adjacent strips do not overlap, the compensation areas of adjacent strips overlap with the projection areas of adjacent strips, and the total length of adjacent compensation areas is greater than or equal to 2 times the movement of the lithography equipment. Precision, less than or equal to 2 times the projection length of the spot image.
示例性地,继续参考图10,条带图像510的投影区域511和相邻的条带图像520的投影区域521不重叠,条带图像510的补偿区域512与相邻的条带图像520的投影区域521重叠,相邻的补偿区域512和补偿区域522的总长度大于等于2倍的光刻设备的移动精度,小于等于2倍的光斑图像的投影长度。For example, continuing to refer to FIG. 10 , the projection area 511 of the strip image 510 and the projection area 521 of the adjacent strip image 520 do not overlap, and the compensation area 512 of the strip image 510 does not overlap with the projection area of the adjacent strip image 520 . The areas 521 overlap, and the total length of the adjacent compensation area 512 and the compensation area 522 is greater than or equal to 2 times the movement accuracy of the lithography equipment, and is less than or equal to 2 times the projection length of the spot image.
S220、根据预设步进步长,控制光刻设备沿步进方向移动。S220. Control the lithography equipment to move in the step direction according to the preset step length.
S230、根据定位装置的移动确定光刻设备移动的实际移动距离。S230. Determine the actual movement distance of the lithography equipment according to the movement of the positioning device.
其中,定位装置包括光栅尺和读数头,定位装置的读数头是随着光刻设备的移动而移动,由此定位装置的读数头可以确定光刻设备移动的实际距离。Wherein, the positioning device includes a grating ruler and a reading head. The reading head of the positioning device moves with the movement of the lithography equipment. Therefore, the reading head of the positioning device can determine the actual distance moved by the lithography equipment.
示例性的,图11为本发明实施例提供的一种扫描光刻设备,如图11所示,其中载台轨道610和梁架620上均设置有光栅尺630,在光刻设备640上设置有读数头650,读数头650可以随着光刻设备640的移动而移动,实现对光栅尺630的读数,从而确定光刻设备移动的实际移动距离。Illustratively, Figure 11 shows a scanning lithography equipment provided by an embodiment of the present invention. As shown in Figure 11, a grating ruler 630 is provided on both the stage rail 610 and the beam frame 620, and a grating ruler 630 is provided on the lithography equipment 640. There is a reading head 650. The reading head 650 can move with the movement of the lithography equipment 640 to read the grating scale 630, thereby determining the actual movement distance of the lithography equipment.
S240、根据实际移动距离和预设步进步长确定一次步进的步进误差。S240. Determine the step error of one step according to the actual moving distance and the preset step length.
S250、基于步进误差对光斑图像进行调整,以补偿步进误差产生的曝光图像误差。S250: Adjust the spot image based on the step error to compensate for the exposure image error caused by the step error.
图12为本发明实施例提供的一种步进光刻的控制装置,如图12,该装置包括:Figure 12 is a control device for stepper lithography provided by an embodiment of the present invention. As shown in Figure 12, the device includes:
位置确定装置710,用于获取光刻设备一次步进后的实际移动距离;Position determining device 710 is used to obtain the actual moving distance of the lithography equipment after one step;
误差确定装置720,根据实际移动距离和预设步进步长确定一次步进的步进误差;The error determination device 720 determines the step error of a step based on the actual movement distance and the preset step length;
光斑调整装置730,基于步进误差对光斑图像进行调整,以补偿步进误差产生的曝光图像误差。The light spot adjustment device 730 adjusts the light spot image based on the step error to compensate for the exposure image error caused by the step error.
本实施例的技术方案,首先通过位置确定装置获取光刻设备一次步进后的实际移动距离,然后误差确定装置根据实际移动距离和预设步进步长确定一次步进的步进误差,最后光斑调整装置基于步进误差对光斑图像进行调整,以补偿步进误差产生的曝光图像误差,从而保证光斑图像投影位置的准确性,进而实现在待光刻件上曝光图像不会产生缝隙或重叠的部分,实现曝光图像的连续性,提高曝光图像的精确度。The technical solution of this embodiment is to first obtain the actual moving distance of the lithography equipment after one step through the position determining device, then the error determining device determines the step error of one step based on the actual moving distance and the preset step length, and finally the light spot The adjustment device adjusts the spot image based on the step error to compensate for the exposure image error caused by the step error, thereby ensuring the accuracy of the spot image projection position, thereby ensuring that the exposed image on the part to be lithographed will not produce gaps or overlaps. part, to achieve the continuity of the exposed image and improve the accuracy of the exposed image.
本发明实施例还提供一种步进光刻的控制设备,该步进光刻的控制设备包括:一个或多个处理器;当一个或多个程序被一个或多个处理器执行,使得一个或多个处理器实现上述实施例任一的步进光刻的控制方法。Embodiments of the present invention also provide a control device for stepper lithography. The control device for stepper lithography includes: one or more processors; when one or more programs are executed by one or more processors, a Or multiple processors implement the stepper lithography control method in any of the above embodiments.
本发明实施例提供的步进光刻的控制设备,可执行本发明任一实施例所提供的步进光刻的控制方法,具备步进光刻的控制方法的有益效果,此处不再赘述。The stepper lithography control device provided by the embodiment of the present invention can execute the stepper lithography control method provided by any embodiment of the present invention, and has the beneficial effects of the stepper lithography control method, which will not be described again here. .
本发明实施例还提供一种计算机可读存储介质,其上存储有计算机程序,该程序被处理器执行时实现上述实施例任一的步进光刻的控制方法。Embodiments of the present invention also provide a computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, the stepper lithography control method of any of the above embodiments is implemented.
通过以上关于实施方式的描述,所属领域的技术人员可以清楚地了解到,本发明可借助软件及必需的通用硬件来实现,当然也可以通过硬件实现,但很多情况下前者是更佳的实施方式。基于这样的理解,本发明的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来,该步进光刻的控制的软件产品可以存储在可读存储介质中,如软盘、只读存储器(Read-Only Memory,ROM)、随机存取存储器(Random AccessMemory,RAM)、闪存(FLASH)、硬盘或光盘等,用以使得步进光刻的控制设备执行本发明上述实施例的方法。Through the above description of the implementation, those skilled in the art can clearly understand that the present invention can be implemented with the help of software and necessary general hardware. Of course, it can also be implemented with hardware, but in many cases the former is a better implementation. . Based on this understanding, the technical solution of the present invention can be embodied in the form of a software product in essence or that contributes to the existing technology. The software product for controlling stepper lithography can be stored in a readable storage medium. , such as floppy disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), flash memory (FLASH), hard disk or optical disk, etc., to make the stepper lithography control device execute the present invention Methods of the above embodiments.
值得注意的是,上述步进光刻的控制装置的实施例中,所包括的各个模块只是按照功能逻辑进行划分的,但并不局限于上述的划分,只要能够实现相应的功能即可;另外,各功能装置的具体名称也只是为了便于相互区分,并不用于限制本发明的保护范围。It is worth noting that in the above-mentioned embodiment of the stepper lithography control device, the various modules included are only divided according to functional logic, but are not limited to the above-mentioned divisions, as long as the corresponding functions can be realized; in addition, , the specific names of each functional device are only for the convenience of distinguishing each other, and are not used to limit the protection scope of the present invention.
最后应说明的是:以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that it can still be used Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent substitutions are made to some of the technical features; however, these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111244938.4A CN114326320B (en) | 2021-10-26 | 2021-10-26 | Control method, device, equipment and storage medium for stepper lithography |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111244938.4A CN114326320B (en) | 2021-10-26 | 2021-10-26 | Control method, device, equipment and storage medium for stepper lithography |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114326320A CN114326320A (en) | 2022-04-12 |
CN114326320B true CN114326320B (en) | 2023-11-07 |
Family
ID=81045846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111244938.4A Active CN114326320B (en) | 2021-10-26 | 2021-10-26 | Control method, device, equipment and storage medium for stepper lithography |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114326320B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115236952B (en) * | 2022-09-23 | 2022-11-29 | 深圳市先地图像科技有限公司 | Image data processing method, system and related equipment for laser imaging |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5798528A (en) * | 1997-03-11 | 1998-08-25 | International Business Machines Corporation | Correction of pattern dependent position errors in electron beam lithography |
US6883158B1 (en) * | 1999-05-20 | 2005-04-19 | Micronic Laser Systems Ab | Method for error reduction in lithography |
CN102955368A (en) * | 2011-08-22 | 2013-03-06 | 上海微电子装备有限公司 | Stepper lithography device and lithography exposure method |
CN103207531A (en) * | 2013-04-21 | 2013-07-17 | 中国科学院光电技术研究所 | Synchronous error correction system for scanning motion of mask stage and silicon wafer stage of step scanning projection photoetching machine |
CN111796488A (en) * | 2020-07-03 | 2020-10-20 | 北京华卓精科科技股份有限公司 | Stepping exposure method based on UV-LED photoetching light source |
CN112748644A (en) * | 2020-12-31 | 2021-05-04 | 合肥芯碁微电子装备股份有限公司 | Lens distortion compensation method, storage medium and direct-writing photoetching machine |
CN112764324A (en) * | 2021-01-07 | 2021-05-07 | 江苏迪盛智能科技有限公司 | Scanning method of photoetching system and photoetching system |
CN113129324A (en) * | 2021-04-28 | 2021-07-16 | 江苏迪盛智能科技有限公司 | Optical processing device system, light spot adjusting device and method, computer device and storage medium |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10037243C2 (en) * | 2000-07-31 | 2002-06-20 | Infineon Technologies Ag | Control system for photolithographic processes |
US7202939B2 (en) * | 2004-12-22 | 2007-04-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
NL1036108A1 (en) * | 2007-11-09 | 2009-05-12 | Asml Netherlands Bv | Device Manufacturing Method and Lithographic Device, and Computer Program Product. |
CN116009361A (en) * | 2021-10-22 | 2023-04-25 | 江苏迪盛智能科技有限公司 | Exposure method and exposure equipment |
-
2021
- 2021-10-26 CN CN202111244938.4A patent/CN114326320B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5798528A (en) * | 1997-03-11 | 1998-08-25 | International Business Machines Corporation | Correction of pattern dependent position errors in electron beam lithography |
US6883158B1 (en) * | 1999-05-20 | 2005-04-19 | Micronic Laser Systems Ab | Method for error reduction in lithography |
CN102955368A (en) * | 2011-08-22 | 2013-03-06 | 上海微电子装备有限公司 | Stepper lithography device and lithography exposure method |
CN103207531A (en) * | 2013-04-21 | 2013-07-17 | 中国科学院光电技术研究所 | Synchronous error correction system for scanning motion of mask stage and silicon wafer stage of step scanning projection photoetching machine |
CN111796488A (en) * | 2020-07-03 | 2020-10-20 | 北京华卓精科科技股份有限公司 | Stepping exposure method based on UV-LED photoetching light source |
CN112748644A (en) * | 2020-12-31 | 2021-05-04 | 合肥芯碁微电子装备股份有限公司 | Lens distortion compensation method, storage medium and direct-writing photoetching machine |
CN112764324A (en) * | 2021-01-07 | 2021-05-07 | 江苏迪盛智能科技有限公司 | Scanning method of photoetching system and photoetching system |
CN113129324A (en) * | 2021-04-28 | 2021-07-16 | 江苏迪盛智能科技有限公司 | Optical processing device system, light spot adjusting device and method, computer device and storage medium |
Also Published As
Publication number | Publication date |
---|---|
CN114326320A (en) | 2022-04-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6745380B2 (en) | Method for optimizing and method for producing a layout for a mask, preferably for use in semiconductor production, and computer program therefor | |
JP4126096B2 (en) | Method and apparatus for fabricating structures by focused laser radiation on a substrate having a photosensitive coating | |
US7670541B2 (en) | Optical shaping apparatus and optical shaping method | |
US20060177744A1 (en) | Method for producing a mask layout avoiding imaging errors for a mask | |
US20100209833A1 (en) | Charged particle beam writing method and charged particle beam writing apparatus | |
JP2705312B2 (en) | Projection exposure method | |
CN114326320B (en) | Control method, device, equipment and storage medium for stepper lithography | |
JP5133841B2 (en) | Slice image generation method and modeling apparatus | |
CN111361147B (en) | Gradually-spliced multi-exposure large-format 3D printing system and using method | |
KR20120100297A (en) | Flare correction method and method for fabricating euv(extreme ultra violet) mask | |
US9460892B2 (en) | Charged particle beam writing method, computer-readable recording medium, and charged particle beam writing apparatus | |
KR20120027131A (en) | Optical imaging system | |
CN111694222B (en) | Exposure machine adjusting method and device | |
CN108062005A (en) | A kind of splicing ameliorative way of write-through screen printing system | |
US10154238B2 (en) | Projection system and modeling machine | |
CN115268229B (en) | Automatic focusing exposure method | |
KR20130126481A (en) | Exposure apparatus, exposure method, method of manufacturing device, and aperture plate | |
CN116009361A (en) | Exposure method and exposure equipment | |
CN113892060B (en) | System and method for exposing material with an image | |
US20090073511A1 (en) | Method of and system for drawing | |
CN114114848A (en) | Control method, device, device and storage medium for scanning lithography | |
JPS63196038A (en) | Device and method of energy beam lithography | |
JP2019053177A (en) | Exposure apparatus and method | |
JP2006147760A (en) | Exposure system and exposure method | |
JP2006173470A (en) | Method and apparatus for automatic correction |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: Building 16, 1st Floor, Changzhou Science and Education City, No. 18-67 Changwu Middle Road, Wujin District, Changzhou City, Jiangsu Province 213000 Patentee after: Dishengwei (Jiangsu) Equipment Technology Co.,Ltd. Country or region after: China Address before: 430056 Standard Factory Building B, 2nd Floor, Zones 2-67, Export Processing Zone, 8MC Plot (69 Checheng South Road), Wuhan Economic and Technological Development Zone, Wuhan City, Hubei Province, China Patentee before: Disheng (Wuhan) Microelectronics Technology Co.,Ltd. Country or region before: China Address after: 430056 Standard Factory Building B, 2nd Floor, Zones 2-67, Export Processing Zone, 8MC Plot (69 Checheng South Road), Wuhan Economic and Technological Development Zone, Wuhan City, Hubei Province, China Patentee after: Disheng (Wuhan) Microelectronics Technology Co.,Ltd. Country or region after: China Address before: 215100 floor 2, building 2, Ruijing building, No. 868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: Jiangsu Desheng Intelligent Technology Co.,Ltd. Country or region before: China |
|
CP03 | Change of name, title or address |