CN114325170A - Dynamic microstrip device, measurement system, determination method, device, and storage medium - Google Patents
Dynamic microstrip device, measurement system, determination method, device, and storage medium Download PDFInfo
- Publication number
- CN114325170A CN114325170A CN202111466686.XA CN202111466686A CN114325170A CN 114325170 A CN114325170 A CN 114325170A CN 202111466686 A CN202111466686 A CN 202111466686A CN 114325170 A CN114325170 A CN 114325170A
- Authority
- CN
- China
- Prior art keywords
- dynamic
- conductor strip
- microstrip
- calibration factor
- vector network
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000005259 measurement Methods 0.000 title claims abstract description 24
- 239000004020 conductor Substances 0.000 claims abstract description 112
- 239000000523 sample Substances 0.000 claims abstract description 83
- 230000005684 electric field Effects 0.000 claims abstract description 34
- 230000005540 biological transmission Effects 0.000 claims abstract description 27
- 238000001228 spectrum Methods 0.000 claims description 22
- 238000004590 computer program Methods 0.000 claims description 20
- 238000007667 floating Methods 0.000 claims description 13
- 241000209094 Oryza Species 0.000 claims description 7
- 235000007164 Oryza sativa Nutrition 0.000 claims description 7
- 235000009566 rice Nutrition 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 125000003003 spiro group Chemical group 0.000 claims description 2
- 230000008878 coupling Effects 0.000 abstract description 3
- 238000010168 coupling process Methods 0.000 abstract description 3
- 238000005859 coupling reaction Methods 0.000 abstract description 3
- 238000012512 characterization method Methods 0.000 abstract description 2
- 230000006870 function Effects 0.000 description 33
- 230000008569 process Effects 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000005284 excitation Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003012 network analysis Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Abstract
The application relates to a dynamic microstrip device, a measurement system, a determination method, a device and a storage medium. The dynamic microstrip device includes: a conductor strip; the base is also provided with support columns arranged at intervals, and the support columns arranged at intervals are used for supporting two ends of the conductor strip respectively; and the air core plate is arranged between the support columns, is positioned below the conductor strip, has a distance with the conductor strip, and is suitable for moving up and down relative to the base so as to adjust the distance with the conductor strip. A gap is formed between a conductor strip and a base of the dynamic microstrip device, so that the transmission mode of the dynamic microstrip device is an ideal TEM mode; meanwhile, the impedance of the dynamic microstrip device can be changed by adjusting the distance between the air core print and the conductor strip, so that the dynamic impedance matching with a signal source can be realized conveniently, the probe can carry out accurate electric field coupling characterization, and an accurate calibration factor can be obtained.
Description
Technical Field
The present application relates to the field of probe calibration technologies, and in particular, to a dynamic microstrip device, a measurement system, a determination method, a determination device, and a storage medium.
Background
At present, electromagnetic compatibility test is mainly carried out through a probe, and when the probe is used for measurement, the probe is required to obtain a calibration factor in a certain frequency band no matter the probe is applied in a time domain or a frequency domain. The conventional method is to use microstrip line method to obtain the calibration factor.
However, since the impedance of the microstrip line is fixed, the impedance of the microstrip line may not match the impedance of the signal source, so that the signal is reflected at the port with mismatched impedance, i.e., at the connection between the signal source and the microstrip line, which causes the difference between the signal detected by the probe and the signal output by the signal source, and it is difficult to obtain an accurate calibration factor.
Disclosure of Invention
In view of the above, it is necessary to provide a dynamic microstrip apparatus, a measurement system, a determination method, an apparatus, and a storage medium capable of obtaining an accurate calibration factor.
A dynamic microstrip apparatus comprising:
a conductor strip;
the base is also provided with support columns arranged at intervals, and the support columns arranged at intervals are used for supporting two ends of the conductor strip respectively;
and the air core plate is arranged between the support columns, is positioned below the conductor strip, has a distance with the conductor strip, and is suitable for moving up and down relative to the base so as to adjust the distance with the conductor strip.
A gap is formed between the conductor strip and the base of the dynamic microstrip device, so that the media above and below the conductor strip are all air, the transmission speed of signals around the conductor strip is the same, and the transmission mode of the dynamic microstrip device is an ideal TEM mode; meanwhile, the impedance of the dynamic microstrip device can be changed by adjusting the distance between the air core seat and the conductor strip, so that the dynamic impedance matching with a signal source can be realized conveniently. Therefore, the dynamic microstrip device replaces a microstrip line to obtain the calibration factor, so that the signal detected by the probe is the same as the signal output by the signal source, and the probe can carry out accurate electric field coupling representation, thereby obtaining the accurate calibration factor.
In one embodiment, the air core plate comprises: the movable seat is arranged between the support columns, a first concave hole corresponding to the shape of the floating plate is formed in the upper surface of the movable seat, a second concave hole corresponding to the shape of the machine rice part and penetrating through the movable seat is formed below the first concave hole, and the first concave hole is communicated with the second concave hole; the floating plate is suitable for being arranged in the first concave hole and is fixedly connected with the movable seat; the cross section of the machine-rice part is T-shaped, external threads are arranged at the bottom of the machine-rice part, a flat hole is formed in the bottom surface of the machine-rice part, and when the machine-rice part is arranged in the first concave hole, the bottom of the machine-rice part penetrates through the movable seat; still be equipped with on the base and run through the screw hole of base, the position of screw hole with the position of first shrinkage pool corresponds, the bottom of machine rice part is suitable for the spiro union in the screw hole.
In one embodiment, two ends of the movable seat are respectively provided with a groove which penetrates through the movable seat from top to bottom, and the supporting columns are respectively positioned in the grooves at the two ends of the movable seat so as to guide the movable seat to move up and down.
In one embodiment, the method further comprises the following steps: the connectors are respectively arranged at two ends of the conductor strip, and the conductor strip is connected to the supporting column through the connectors.
A measuring system comprises a vector network analyzer, a near-field probe, an electronic load and the dynamic microstrip device, wherein an output port of the vector network analyzer is electrically connected with one end of a conductor strip of the dynamic microstrip device, the vector network analyzer is used for outputting a radio-frequency signal, the other end of the conductor strip is electrically connected with the electronic load, the near-field probe is arranged right opposite to the conductor strip of the dynamic microstrip device, the near-field probe is electrically connected with an input port of the vector network analyzer, the near-field probe generates an induced electric field signal after the vector network analyzer outputs the radio-frequency signal, and the vector network analyzer is further used for measuring a forward transmission coefficient.
The method comprises the steps of sending out a radio frequency signal through a vector network analyzer, applying source excitation to a dynamic micro-strip device, enabling the signal not to be reflected at the connection position of the vector network analyzer and the dynamic micro-strip device because the transmission mode of the dynamic micro-strip device is an ideal TEM mode and impedance adjustment is carried out on the dynamic micro-strip device in advance, enabling the signal to be transmitted to the dynamic micro-strip device completely and enabling the TEM wave to be transmitted through the dynamic micro-strip device.
In one embodiment, the method further comprises the following steps: a displacement device for adjusting the position of the near field probe to adjust the height of the near field probe relative to the conductor strip.
A calibration factor determination method, performed based on a measurement system as described above, comprising:
after the vector network analyzer sends out a radio frequency signal, acquiring a forward transmission coefficient measured by the vector network analyzer;
obtaining the impedance of the dynamic microstrip device and a structure function of the dynamic microstrip device;
a calibration factor is determined based on the acquired data.
In one embodiment, the obtaining the structural function of the dynamic microstrip apparatus includes:
acquiring a first distance between the conductor strip and the base, a second distance between the conductor strip and the near-field probe and the thickness of the conductor strip;
obtaining a structural function of the dynamic microstrip device based on the first pitch, the second pitch, and the thickness of the conductor strip.
A calibration factor determination apparatus, comprising:
the system comprises a first acquisition module, a second acquisition module and a control module, wherein the first acquisition module is used for acquiring a forward transmission coefficient measured by a vector network analyzer after the vector network analyzer sends out a radio frequency signal;
the second acquisition module is used for acquiring the impedance of the dynamic microstrip device and a structural function of the dynamic microstrip device;
a determination module determines a magnetic field strength calibration factor based on the acquired data.
A computer device comprising a memory and a processor, the memory storing a computer program, the processor implementing the following steps when executing the computer program:
after the vector network analyzer sends out a radio frequency signal, acquiring a forward transmission coefficient measured by the vector network analyzer;
obtaining the impedance of the dynamic microstrip device and a structure function of the dynamic microstrip device;
a calibration factor is determined based on the acquired data.
A computer-readable storage medium, on which a computer program is stored which, when executed by a processor, carries out the steps of:
after the vector network analyzer sends out a radio frequency signal, acquiring a forward transmission coefficient measured by the vector network analyzer;
obtaining the impedance of the dynamic microstrip device and a structure function of the dynamic microstrip device;
a calibration factor is determined based on the acquired data.
The advantages of the calibration factor determination method, the calibration factor determination apparatus, the computer device and the storage medium over the prior art are the same as the advantages of the measurement system over the prior art, and are not described herein again.
The utility model provides a measuring system, includes signal source, spectrum analyzer, near field probe, electronic load and as above dynamic microstrip device, the signal source with the one end electricity of dynamic microstrip device's conductor strip is connected, the signal source is used for exporting radio frequency signal, the other end of conductor strip with electronic load electricity is connected, near field probe is just right dynamic microstrip device's conductor strip sets up, near field probe is in the signal source output generate induced electric field signal behind the radio frequency signal, near field probe with the spectrum analyzer electricity is connected, the spectrum analyzer is used for measuring induced electric field signal.
The signal source sends out radio frequency signals to apply source excitation to the dynamic micro-strip device, the transmission mode of the dynamic micro-strip device is an ideal TEM mode, and after impedance adjustment is performed on the dynamic micro-strip device in advance, the impedance of the dynamic micro-strip device is matched with that of the signal source, so the signals cannot be reflected at the joint of the signal source and the dynamic micro-strip device, the signals are completely transmitted to the dynamic micro-strip device, TEM waves are transmitted in the dynamic micro-strip device, and because the near-field probe is right opposite to the conductor strip, the TEM waves have no electric field and magnetic field components in the transmission direction, induced electric field signals generated by the near-field probe completely correspond to output signals, and after the induced electric field signals are input into the spectrum analyzer, accurate calibration factors can be obtained based on signal parameters and measurement parameters output by the signal source.
In one embodiment, the method further comprises the following steps: a displacement device for adjusting the position of the near field probe to adjust the height of the near field probe relative to the conductor strip.
A calibration factor determination method, performed based on a measurement system as described above, comprising:
after the signal source outputs a radio frequency signal, acquiring an induced electric field signal value of the near field probe measured by the spectrum analyzer;
obtaining the impedance of the dynamic microstrip device and a structure function of the dynamic microstrip device;
a calibration factor is determined based on the acquired data.
In one embodiment, the obtaining the structural function of the dynamic microstrip apparatus includes:
acquiring a first distance between the conductor strip and the base, a second distance between the conductor strip and the near-field probe and the thickness of the conductor strip;
obtaining a structural function of the dynamic microstrip device based on the first pitch, the second pitch, and the thickness of the conductor strip.
A calibration factor determination apparatus, comprising:
the first acquisition module is used for acquiring an induced electric field signal value of the near-field probe measured by the spectrum analyzer after the signal source is used for outputting a radio frequency signal;
the second acquisition module is used for acquiring the impedance of the dynamic microstrip device and a structural function of the dynamic microstrip device;
a determination module to determine a magnetic field strength calibration factor based on the acquired data.
A computer device comprising a memory and a processor, the memory storing a computer program, the processor implementing the following steps when executing the computer program:
after the signal source outputs a radio frequency signal, acquiring an induced electric field signal value of the near field probe measured by the spectrum analyzer;
obtaining the impedance of the dynamic microstrip device and a structure function of the dynamic microstrip device;
a calibration factor is determined based on the acquired data.
A computer-readable storage medium, on which a computer program is stored which, when executed by a processor, carries out the steps of:
after the signal source outputs a radio frequency signal, acquiring an induced electric field signal value of the near field probe measured by the spectrum analyzer;
obtaining the impedance of the dynamic microstrip device and a structure function of the dynamic microstrip device;
a calibration factor is determined based on the acquired data.
The advantages of the calibration factor determination method, the calibration factor determination apparatus, the computer device and the storage medium over the prior art are the same as the advantages of the measurement system over the prior art, and are not described herein again.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a dynamic microstrip arrangement according to an embodiment;
FIG. 2 is an exploded view of a dynamic microstrip arrangement in one embodiment;
FIG. 3 is a block diagram of a measurement system in one embodiment;
FIG. 4 is a block diagram showing the structure of a measuring system in another embodiment;
FIG. 5 is a flow chart illustrating a method for determining calibration factors in one embodiment;
FIG. 6 is a schematic flow chart diagram illustrating a calibration factor determination method in accordance with another embodiment;
fig. 7 is a block diagram showing the configuration of the calibration factor determination device in one embodiment.
Description of reference numerals:
1-conductor strip, 2-base, 21-support column, 22-threaded hole, 3-air core plate, 31-floating plate, 32-machine meter part, 33-movable seat, 34-first concave hole and 35-second concave hole.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another.
Spatial relational terms, such as "under," "below," "under," "over," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. Further, "connection" in the following embodiments is understood to mean "electrical connection", "communication connection", or the like, if there is a transfer of electrical signals or data between the connected objects.
As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.
In one embodiment, as shown in fig. 1, there is provided a dynamic microstrip apparatus 302 comprising:
a conductor strip 1;
the base 2 is further provided with support columns 21 arranged at intervals, and the support columns 21 arranged at intervals are used for supporting two ends of the conductor strip 1 respectively;
and the air core plate 3 is arranged between the support columns 21 and below the conductor strip 1, has a distance with the conductor strip 1, and is suitable for moving up and down relative to the base 2 so as to adjust the distance with the conductor strip 1.
In the dynamic microstrip device 302, a gap is formed between the conductor strip 1 and the base 2 of the dynamic microstrip device 302, so that the media above and below the conductor strip 1 are all air, the transmission speed of signals around the conductor strip 1 is the same, and the transmission mode of the dynamic microstrip device 302 is an ideal TEM mode; meanwhile, the impedance of the dynamic microstrip device 302 can be changed by adjusting the distance between the air core print and the conductor strip 1, so that the dynamic impedance matching with a signal source can be realized conveniently. Therefore, the dynamic microstrip device 302 replaces a microstrip line to obtain a calibration factor, so that the signal detected by the probe is the same as the signal output by the signal source, and the probe can perform accurate electric field coupling characterization, thereby obtaining an accurate calibration factor.
In addition, the air core plate 3 is adjusted to move up and down relative to the base 2 to adjust the distance between the air core plate and the conductor strip 1 instead of adjusting the conductor strip 1, so that the conductor strip 1 is always kept in a stable state in the adjustment process, and the stability of the signal transmission process is ensured in the impedance adjustment process.
In application, the upper surface of the air core plate 3 is parallel to the lower surface of the conductor strip 1, so that the thickness of the air medium layer between the air core plate 3 and the conductor strip 1 is uniform.
In one embodiment, as shown in fig. 2, the air core plate 3 comprises: the movable seat 33 is arranged between the support columns 21, a first concave hole 34 corresponding to the shape of the floating plate 31 is formed in the upper surface of the movable seat 33, a second concave hole 35 corresponding to the shape of the machine rice part 32 and penetrating through the movable seat 33 is formed below the first concave hole 34, and the first concave hole 34 is communicated with the second concave hole 35; the floating plate 31 is suitable for being arranged in the first concave hole 34 and is fixedly connected with the movable seat 33; the cross section of the machine-rice part 32 is T-shaped, the bottom of the machine-rice part 32 is provided with an external thread, the bottom surface of the machine-rice part 32 is provided with a flat hole, and when the machine-rice part 32 is arranged in the first concave hole 34, the bottom of the machine-rice part 32 penetrates through the movable seat 33; the base 2 is further provided with a threaded hole 22 penetrating through the base 2, the position of the threaded hole 22 corresponds to the position of the first concave hole 34, and the bottom of the machine rice component 32 is suitable for being screwed in the threaded hole 22.
Wherein the machine rice part 32 is adapted to rotate within the first recess 34. The flat hole refers to a hole which is not circular in shape and can be an elliptical hole, a polygonal hole or an irregular hole. The floating plate 31 is connected to the movable base 33 by bolts so that the meter unit 32 and the floating plate 31 can be detached from the movable base 33.
Specifically, by providing a flat hole on the bottom surface of the machine-rice part 32, the machine-rice part 32 can be driven to rotate by an "L" shaped wrench with the end portion thereof being in clearance fit with the flat hole. Illustratively, the flat hole formed in the bottom surface of the machine-rice part 32 is a regular hexagonal hole, and then one end of an internal hexagonal wrench is inserted into the flat hole, and the internal hexagonal wrench is rotated to drive the machine-rice part 32 to rotate in the first concave hole 34. Because the bottom of the machine and meter part 32 is screwed in the threaded hole 22, the rotation of the machine and meter part 32 can cause the machine and meter part 32 to move up and down, when the machine and meter part 32 moves up, the top of the machine and meter part 32 can apply upward thrust to the floating plate 31, because the floating plate 31 is fixedly connected with the movable seat 33, the floating plate 31 and the movable seat 33 can integrally move up to realize the upward movement of the air core plate 3, and when the machine and meter part 32 moves down, because the cross section of the machine and meter part 32 is in a T shape, the cross section of the corresponding first concave hole 34 is also in a T shape, when the machine and meter part 32 moves down, the top of the machine and meter part can apply thrust to the movable seat 33 to enable the movable seat 33 to move down, thereby realizing the downward movement of the air core plate 3. Meanwhile, the bottom of the machine-meter part 32 is in threaded connection with the threaded hole 22, so that the machine-meter part 32 is in a stable state when the machine-meter part 32 is not rotated, the whole body formed by the movable seat 33 supported by the machine-meter part 32 and the floating plate 31 is kept stable, after adjustment is completed, the distance between the air core plate 3 and the conductor strip 1 is fixed, and impedance of the dynamic micro-strip device 302 is fixed.
In one embodiment, two ends of the movable seat 33 are respectively provided with a groove penetrating up and down, and the supporting columns 21 are respectively located in the grooves at two ends of the movable seat 33 to guide the movable seat 33 to move up and down.
Specifically, the cross sectional shape of the groove corresponds to the cross sectional shape of the supporting column 21, and when the supporting columns 21 are respectively located in the grooves at the two ends of the movable seat 33, the movable seat 33 cannot move horizontally but only moves vertically under the limitation of the supporting columns 21, so that the movable seat 33 cannot be inclined in the adjusting process.
In one embodiment, the method further comprises the following steps: and a plurality of connectors which are respectively arranged at two ends of the conductor strip 1, and the conductor strip 1 is connected to the supporting column 21 through the connectors.
Specifically, threaded holes 22 are formed in the connector and the supporting column 21, the connector is connected to the supporting column 21 through bolts, the connector is fixedly connected with the conductor strip 1, and the specific connection mode can be welding. By providing connectors at both ends of the conductor strip 1, it is convenient to electrically connect the dynamic microstrip device 302 with an external device.
In one embodiment, as shown in fig. 3, a measurement system 300 is provided, which includes a vector network analyzer 301, a near-field probe 303, an electronic load 304, and a dynamic microstrip device 302 as above, an output port of the vector network analyzer 301 is electrically connected to one end of a conductor strip 1 of the dynamic microstrip device 302, the vector network analyzer 301 is configured to output a radio frequency signal, the other end of the conductor strip 1 is electrically connected to the electronic load 304, the near-field probe 303 is disposed opposite to the conductor strip 1 of the dynamic microstrip device 302, the near-field probe 303 is electrically connected to an input port of the vector network analyzer 301, the near-field probe 303 generates an induced electric field signal after the vector network analyzer 301 outputs the radio frequency signal, and the vector network analyzer 301 is further configured to forward transfer coefficients.
In the measurement system 300, a radio frequency signal is emitted by the vector network analyzer 301 to apply source excitation to the dynamic microstrip device 302, since the transmission mode of the dynamic microstrip device 302 is an ideal TEM mode, and after the impedance of the dynamic microstrip device 302 is adjusted in advance, the impedance of the dynamic microstrip device 302 is matched with that of the vector network analyzer 301, the signal is not reflected at the connection between the vector network analyzer 301 and the dynamic microstrip device 302, so that the signal is completely transmitted to the dynamic microstrip device 302, and the TEM wave is transmitted by the dynamic microstrip device 302, on the basis that the near-field probe 303 is directly opposite to the conductor strip 1, the TEM wave has no electric field and magnetic field components in the transmission direction, so that the induced electric field signal generated by the near-field probe 303 completely corresponds to the output signal of the vector network analyzer 301, and after the induced electric field signal is input into the vector network analyzer 301, an accurate calibration factor may be derived based on the measured parameters.
In one embodiment, the above-mentioned measuring system 300 further comprises: displacement means for adjusting the position of the near field probe 303 to adjust the height of the near field probe 303 relative to the conductor strip 1.
Wherein the displacement device may be a three-dimensional displacement table.
Specifically, the distance between the near field probe 303 and the conductor strip 1 affects the detection effect of the near field probe 303, and the position of the near field probe 303 is adjusted by the displacement device to adjust the distance between the near field probe 303 and the conductor strip 1, so that the distance between the near field probe 303 and the conductor strip 1 is reasonable, and the near field probe 303 has a good detection effect.
In one embodiment, as shown in fig. 5, there is provided a calibration factor determination method, performed based on the measurement system 300 as above, including:
s501: after the vector network analyzer 301 sends out the radio frequency signal, the forward transmission coefficient measured by the vector network analyzer 301 is obtained.
Specifically, the vector network analysis is used for measuring the complex transmission characteristics of the two-port microwave network system composed of the near-field probe 303 and the dynamic microstrip device 302, so as to obtain the calibration factor. The process is that a signal source of the vector network analyzer 301 generates a sinusoidal test signal, a port 1 of the vector network analyzer 301 outputs the signal to the dynamic microstrip device 302, further, a TEM wave is generated on a conductor strip 1 of the dynamic microstrip device 302, the near-field probe 303 induces the TEM wave to generate an induced electric field signal and transmit the induced electric field signal to a port 2 of the vector network analyzer 301, the port 2 receives the induced electric field signal of the near-field probe 303, and a forward transmission coefficient from the port 1 to the port 2 is calculated.
S502: the impedance of the dynamic microstrip device 302 is obtained as well as the structural function of the dynamic microstrip device 302.
In particular, the impedance of the dynamic microstrip arrangement 302 may be derived by a prior measurement, Y1And Y2Is a structural function of the microstrip structure, Y1H is the height of the probe from the microstrip line during measurement, t is the thickness of the microstrip line, and Y is2＝Y1+2D, D is the height of the microstrip line from the ground plane.
S503: a calibration factor is determined based on the acquired data.
Specifically, the process of determining the calibration factor is as follows:
according to faraday's law: probe voltage Vprobe＝SBω，
Wherein S refers to the probe loop area, B refers to the magnetic induction intensity, and omega refers to the angular frequency.
ω＝2πf；
B＝μR(h)Iin；
Wherein, VaIs the input voltage and Z is the impedance.
Where S21 represents the forward transmission coefficient of port 1 to port 2 when port 2 is matched.
Taking the magnetic field intensity as an example,
so the magnetic field strength calibration factor
In one embodiment, obtaining the structural function of the dynamic microstrip apparatus 302 comprises:
s5021: a first pitch of the conductor strip 1 from the base 2, a second pitch of the conductor strip 1 from the near-field probe 303, and a thickness of the conductor strip 1 are obtained.
S5022: the structural function of the dynamic microstrip arrangement 302 is derived on the basis of the first pitch, the second pitch and the thickness of the conductor strip 1.
Wherein, Y1And Y2The included parameters are calculated by SI9000 to guide the design of the dynamic microstrip arrangement 302 such that the impedance of the dynamic microstrip arrangement 302 is a predetermined value, e.g. 50 Ω.
Thus, Y1And Y2The values of the various parameters involved are known and can be directly obtained, as well as the impedance of the dynamic microstrip arrangement 302. Taking the calculation of the calibration factor of the magnetic field strength as an example,
s21 is measured by the vector network analyzer 301 at Y1And Y2The values of the various parameters involved are known,
can be calculated and obtained at the same timeThe impedance of the dynamic microstrip arrangement 302 is known and a magnetic field strength calibration factor can be calculated.
In another embodiment, as shown in fig. 4, a measurement system 400 is provided, which includes a signal source 401, a spectrum analyzer 402, a near-field probe 303, an electronic load 304, and the above dynamic microstrip device 302, where the signal source 401 is electrically connected to one end of a conductor strip 1 of the dynamic microstrip device 302, the signal source 401 is used to output a radio frequency signal, the other end of the conductor strip 1 is electrically connected to the electronic load 304, the near-field probe 303 is disposed opposite to the conductor strip 1 of the dynamic microstrip device 302, the near-field probe 303 generates an induced electric field signal after the signal source 401 outputs the radio frequency signal, the near-field probe 303 is electrically connected to the spectrum analyzer 402, and the spectrum analyzer 402 is used to measure the induced electric field signal.
The signal source 401 sends out a radio frequency signal to apply source excitation to the dynamic microstrip device 302, because the transmission mode of the dynamic microstrip device 302 is an ideal TEM mode, and after impedance adjustment is performed on the dynamic microstrip device 302 in advance, the impedance of the dynamic microstrip device 302 is matched with that of the signal source 401, therefore, the signal cannot be reflected at the connection position of the signal source 401 and the dynamic microstrip device 302, so that the signal is completely transmitted to the dynamic microstrip device 302, and TEM wave is transmitted in the dynamic microstrip device 302, because the near-field probe 303 is over against the conductor strip 1, the TEM wave has no electric field and magnetic field components in the transmission direction, so the induced electric field signal generated by the near-field probe 303 completely corresponds to the output signal, and after the induced electric field signal is input into the spectrum analyzer 402, an accurate calibration factor can be obtained based on the signal parameters and the measurement parameters output by the signal source 401.
In one embodiment, the measurement system 400 further comprises: displacement means for adjusting the position of the near field probe 303 to adjust the height of the near field probe 303 relative to the conductor strip 1.
In one embodiment, as shown in fig. 6, there is provided a calibration factor determination method, performed based on the measurement system 400 as above, comprising:
s601: after the signal source 401 outputs the radio frequency signal, acquiring an induced electric field signal value of the near field probe 303 measured by the spectrum analyzer 402;
s602: acquiring the impedance of the dynamic microstrip device 302 and the structural function of the dynamic microstrip device 302;
s603: a calibration factor is determined based on the acquired data.
In particular, as can be appreciated from the foregoing description, the magnetic field strength calibration factor
In a structural function Y1And Y2In the case where the values of the included parameters are known,
can calculate out thataIs the input voltage, is the voltage of the signal output by the signal source 401, Z is the impedance of the dynamic microstrip arrangement 302, VprobeMeasured by the spectrum analyzer 502, the CF is calculatedmCan be determined, and therefore, CFmCan be calculated.
In one embodiment, obtaining the structural function of the dynamic microstrip apparatus 302 comprises:
s6021: a first pitch of the conductor strip 1 from the base 2, a second pitch of the conductor strip 1 from the near-field probe 303, and a thickness of the conductor strip 1 are obtained.
S6022: the structural function of the dynamic microstrip arrangement 302 is derived on the basis of the first pitch, the second pitch and the thickness of the conductor strip 1.
It should be understood that, although the steps in the flowcharts of fig. 5 and 6 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least some of the steps in fig. 5 and 6 may include multiple steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed in turn or alternately with other steps or at least some of the other steps.
In one embodiment, as shown in fig. 7, there is provided a calibration factor determination apparatus 700, including: a first obtaining module 701, a second obtaining module 702, and a determining module 703, wherein:
the first obtaining module 701 is configured to obtain the forward transmission coefficient measured by the vector network analyzer 301 after the vector network analyzer 301 sends the radio frequency signal;
a second obtaining module 702, configured to obtain an impedance of the dynamic microstrip apparatus 302 and a structural function of the dynamic microstrip apparatus 302;
a determination module 703 determines a magnetic field strength calibration factor based on the acquired data.
In one embodiment, the second obtaining module 702 includes: the device comprises an acquisition unit and a calculation unit, wherein the acquisition unit is used for acquiring a first distance between a conductor strip 1 and a base 2, a second distance between the conductor strip 1 and a near-field probe and the thickness of the conductor strip 1; the calculation unit is configured to obtain a structural function of the dynamic microstrip device 302 based on the first pitch, the second pitch, and the thickness of the conductor strip 1.
In another embodiment, as shown in fig. 7, there is provided a calibration factor determination apparatus 700, including:
the first acquisition module 701 is configured to acquire an induced electric field signal value of the near field probe 303 measured by the spectrum analyzer 402 after the signal source 401 is configured to output a radio frequency signal;
a second obtaining module 702, configured to obtain an impedance of the dynamic microstrip apparatus 302 and a structural function of the dynamic microstrip apparatus 302;
a determining unit 703 for determining a magnetic field strength calibration factor based on the acquired data.
In one embodiment, the second obtaining module 702 includes: the device comprises an acquisition unit and a calculation unit, wherein the acquisition unit is used for acquiring a first distance between a conductor strip 1 and a base 2, a second distance between the conductor strip 1 and a near-field probe and the thickness of the conductor strip 1; the calculation unit is configured to obtain a structural function of the dynamic microstrip device 302 based on the first pitch, the second pitch, and the thickness of the conductor strip 1.
For specific limitations of the calibration factor determining apparatus 700, reference may be made to the limitations of the calibration factor determining method in the above corresponding embodiments, which are not described herein again. The various modules in the calibration factor determination apparatus 700 described above may be implemented in whole or in part by software, hardware, and combinations thereof. The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules. It should be noted that, in the embodiment of the present application, the division of the module is schematic, and is only one logic function division, and there may be another division manner in actual implementation.
In one embodiment, a computer device is provided, comprising a memory and a processor, the memory having a computer program stored therein, the processor implementing the following steps when executing the computer program:
after the vector network analyzer 301 sends out a radio frequency signal, the forward transmission coefficient measured by the vector network analyzer 301 is obtained;
acquiring the impedance of the dynamic microstrip device 302 and the structural function of the dynamic microstrip device 302;
a calibration factor is determined based on the acquired data.
In one embodiment, the processor, when executing the computer program, further performs the steps of:
acquiring a first distance between the conductor strip 1 and the base 2, a second distance between the conductor strip 1 and the near-field probe 303 and the thickness of the conductor strip 1; the structural function of the dynamic microstrip arrangement 302 is derived on the basis of the first pitch, the second pitch and the thickness of the conductor strip 1.
In one embodiment, a computer-readable storage medium is provided, having a computer program stored thereon, which when executed by a processor, performs the steps of:
after the vector network analyzer 301 sends out a radio frequency signal, the forward transmission coefficient measured by the vector network analyzer 301 is obtained;
acquiring the impedance of the dynamic microstrip device 302 and the structural function of the dynamic microstrip device 302;
a calibration factor is determined based on the acquired data.
In one embodiment, the computer program when executed by the processor further performs the steps of:
acquiring a first distance between the conductor strip 1 and the base 2, a second distance between the conductor strip 1 and the near-field probe 303 and the thickness of the conductor strip 1; the structural function of the dynamic microstrip arrangement 302 is derived on the basis of the first pitch, the second pitch and the thickness of the conductor strip 1.
In another embodiment, a computer device is provided, comprising a memory and a processor, the memory having a computer program stored therein, the processor implementing the following steps when executing the computer program:
after the signal source 401 outputs the radio frequency signal, acquiring an induced electric field signal value of the near field probe 303 measured by the spectrum analyzer 402;
acquiring the impedance of the dynamic microstrip device 302 and the structural function of the dynamic microstrip device 302;
a calibration factor is determined based on the acquired data.
In one embodiment, the processor, when executing the computer program, further performs the steps of:
acquiring a first distance between the conductor strip 1 and the base 2, a second distance between the conductor strip 1 and the near-field probe 303 and the thickness of the conductor strip 1; the structural function of the dynamic microstrip arrangement 302 is derived on the basis of the first pitch, the second pitch and the thickness of the conductor strip 1.
In another embodiment, a computer-readable storage medium is provided, on which a computer program is stored, which computer program, when executed by a processor, performs the steps of:
after the signal source 401 outputs the radio frequency signal, acquiring an induced electric field signal value of the near field probe 303 measured by the spectrum analyzer 402;
acquiring the impedance of the dynamic microstrip device 302 and the structural function of the dynamic microstrip device 302;
a calibration factor is determined based on the acquired data.
In one embodiment, the computer program when executed by the processor further performs the steps of:
acquiring a first distance between the conductor strip 1 and the base 2, a second distance between the conductor strip 1 and the near-field probe 303 and the thickness of the conductor strip 1; the structural function of the dynamic microstrip arrangement 302 is derived on the basis of the first pitch, the second pitch and the thickness of the conductor strip 1.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database or other medium used in the embodiments provided herein can include at least one of non-volatile and volatile memory. Non-volatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical storage, or the like. Volatile Memory can include Random Access Memory (RAM) or external cache Memory. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM), among others.
In the description herein, references to the description of "some embodiments," "other embodiments," "desired embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic description of the above terminology may not necessarily refer to the same embodiment or example.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A dynamic microstrip apparatus comprising:
a conductor strip;
the base is also provided with support columns arranged at intervals, and the support columns arranged at intervals are used for supporting two ends of the conductor strip respectively;
and the air core plate is arranged between the support columns, is positioned below the conductor strip, has a distance with the conductor strip, and is suitable for moving up and down relative to the base so as to adjust the distance with the conductor strip.
2. The dynamic microstrip apparatus of claim 1 wherein the air core plate comprises: the movable seat is arranged between the support columns, a first concave hole corresponding to the shape of the floating plate is formed in the upper surface of the movable seat, a second concave hole corresponding to the shape of the machine rice part and penetrating through the movable seat is formed below the first concave hole, and the first concave hole is communicated with the second concave hole; the floating plate is suitable for being arranged in the first concave hole and is fixedly connected with the movable seat; the cross section of the machine-rice part is T-shaped, external threads are arranged at the bottom of the machine-rice part, a flat hole is formed in the bottom surface of the machine-rice part, and when the machine-rice part is arranged in the first concave hole, the bottom of the machine-rice part penetrates through the movable seat; still be equipped with on the base and run through the screw hole of base, the position of screw hole with the position of first shrinkage pool corresponds, the bottom of machine rice part is suitable for the spiro union in the screw hole.
3. A measuring system, comprising a vector network analyzer, a near-field probe, an electronic load and the dynamic microstrip device of any one of claims 1 to 2, wherein an output port of the vector network analyzer is electrically connected to one end of a conductor strip of the dynamic microstrip device, the vector network analyzer is configured to output a radio frequency signal, the other end of the conductor strip is electrically connected to the electronic load, the near-field probe is disposed opposite to the conductor strip of the dynamic microstrip device, the near-field probe is electrically connected to an input port of the vector network analyzer, the near-field probe generates an induced electric field signal after the vector network analyzer outputs the radio frequency signal, and the vector network analyzer is further configured to measure a forward transmission coefficient.
4. A measurement system, comprising a signal source, a spectrum analyzer, a near-field probe, an electronic load, and the dynamic microstrip device of any one of claims 1 to 2, wherein the signal source is electrically connected to one end of a conductor strip of the dynamic microstrip device, the signal source is configured to output a radio frequency signal, the other end of the conductor strip is electrically connected to the electronic load, the near-field probe is disposed opposite to the conductor strip of the dynamic microstrip device, the near-field probe generates an induced electric field signal after the signal source outputs the radio frequency signal, the near-field probe is electrically connected to the spectrum analyzer, and the spectrum analyzer is configured to measure the induced electric field signal.
5. A calibration factor determination method, performed based on the measurement system of claim 3, comprising:
after the vector network analyzer sends out a radio frequency signal, acquiring a forward transmission coefficient measured by the vector network analyzer;
obtaining the impedance of the dynamic microstrip device and a structure function of the dynamic microstrip device;
a calibration factor is determined based on the acquired data.
6. A calibration factor determination method, performed based on the measurement system of claim 4, comprising:
after the signal source outputs a radio frequency signal, acquiring an induced electric field signal value of the near field probe measured by the spectrum analyzer;
obtaining the impedance of the dynamic microstrip device and a structure function of the dynamic microstrip device;
a calibration factor is determined based on the acquired data.
7. A calibration factor determination device, comprising:
the system comprises a first acquisition module, a second acquisition module and a control module, wherein the first acquisition module is used for acquiring a forward transmission coefficient measured by a vector network analyzer after the vector network analyzer sends out a radio frequency signal;
the second acquisition module is used for acquiring the impedance of the dynamic microstrip device and a structural function of the dynamic microstrip device;
a determination module determines a magnetic field strength calibration factor based on the acquired data.
8. A calibration factor determination device, comprising:
the first acquisition module is used for acquiring an induced electric field signal value of the near-field probe measured by the spectrum analyzer after the signal source is used for outputting a radio frequency signal;
the second acquisition module is used for acquiring the impedance of the dynamic microstrip device and a structural function of the dynamic microstrip device;
a determination module to determine a magnetic field strength calibration factor based on the acquired data.
9. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method as claimed in claim 5.
10. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method as claimed in claim 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111466686.XA CN114325170A (en) | 2021-11-30 | 2021-11-30 | Dynamic microstrip device, measurement system, determination method, device, and storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111466686.XA CN114325170A (en) | 2021-11-30 | 2021-11-30 | Dynamic microstrip device, measurement system, determination method, device, and storage medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114325170A true CN114325170A (en) | 2022-04-12 |
Family
ID=81048764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111466686.XA Pending CN114325170A (en) | 2021-11-30 | 2021-11-30 | Dynamic microstrip device, measurement system, determination method, device, and storage medium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114325170A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1289139A2 (en) * | 2001-08-24 | 2003-03-05 | Broadcom Corporation | System and method for coupling load to communications device |
| CN1731626A (en) * | 2005-08-26 | 2006-02-08 | 宁焕生 | Broadband microstrip antenna and its feed matching device and method |
| US20120161803A1 (en) * | 2010-12-22 | 2012-06-28 | Electronics And Telecommunications Research Institute | Apparatus and method for near field scan calibration |
| CN104569888A (en) * | 2014-12-24 | 2015-04-29 | 北京无线电计量测试研究所 | System and method for correcting correction factors of near field probe by utilizing microstrip line method |
| CN107394324A (en) * | 2017-06-23 | 2017-11-24 | 深圳市景程信息科技有限公司 | Adjustable microstrip line signal transmission structure based on graphene |
| CN108152606A (en) * | 2017-12-28 | 2018-06-12 | 中国电子产品可靠性与环境试验研究所 | Electric field passive probe |
| CN111246659A (en) * | 2020-02-24 | 2020-06-05 | 西安易朴通讯技术有限公司 | PCB and electronic equipment |
| CN111682655A (en) * | 2020-05-17 | 2020-09-18 | 上海电机学院 | Dynamic impedance matching system and method for wireless power transmission system |
| CN114325167A (en) * | 2021-11-30 | 2022-04-12 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Microstrip device, measurement system, determination method, device, and storage medium |
-
2021
- 2021-11-30 CN CN202111466686.XA patent/CN114325170A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1289139A2 (en) * | 2001-08-24 | 2003-03-05 | Broadcom Corporation | System and method for coupling load to communications device |
| CN1731626A (en) * | 2005-08-26 | 2006-02-08 | 宁焕生 | Broadband microstrip antenna and its feed matching device and method |
| US20120161803A1 (en) * | 2010-12-22 | 2012-06-28 | Electronics And Telecommunications Research Institute | Apparatus and method for near field scan calibration |
| CN104569888A (en) * | 2014-12-24 | 2015-04-29 | 北京无线电计量测试研究所 | System and method for correcting correction factors of near field probe by utilizing microstrip line method |
| CN107394324A (en) * | 2017-06-23 | 2017-11-24 | 深圳市景程信息科技有限公司 | Adjustable microstrip line signal transmission structure based on graphene |
| CN108152606A (en) * | 2017-12-28 | 2018-06-12 | 中国电子产品可靠性与环境试验研究所 | Electric field passive probe |
| CN111246659A (en) * | 2020-02-24 | 2020-06-05 | 西安易朴通讯技术有限公司 | PCB and electronic equipment |
| CN111682655A (en) * | 2020-05-17 | 2020-09-18 | 上海电机学院 | Dynamic impedance matching system and method for wireless power transmission system |
| CN114325167A (en) * | 2021-11-30 | 2022-04-12 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Microstrip device, measurement system, determination method, device, and storage medium |
Non-Patent Citations (2)
| Title |
|---|
| "微波动率晶体管动态阻抗的测量及其在放大器设计中的应用", 半导体技术, no. 2, 13 April 1976 (1976-04-13) * |
| 张丙伟等: "平行板传输线法校准表面电流探头", 东南大学学报(自然科学版), no. 4, 20 July 2011 (2011-07-20) * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104569888B (en) | A kind of utilization micro-strip collimation method calibrates the system and method for near field probes modifying factor | |
| Meys et al. | Measuring the impedance of balanced antennas by an S-parameter method | |
| CN103353553B (en) | The dielectric coefficient microwave measurement system of dielectric coefficient MMU microwave measurement unit and formation thereof | |
| US9395172B2 (en) | Device for measuring coating thickness | |
| US7898265B2 (en) | Microwave paint thickness sensor | |
| CN107543970A (en) | A kind of dielectric constant measurement method based on data base calibration method | |
| CN107706494B (en) | A kind of adjustable microwave resonant cavity | |
| Li et al. | A three-dimensional model-based inversion algorithm using radial basis functions for microwave data | |
| Gorriti et al. | A new tool for accurate S-parameters measurements and permittivity reconstruction | |
| CN114325170A (en) | Dynamic microstrip device, measurement system, determination method, device, and storage medium | |
| CN114325167A (en) | Microstrip device, measurement system, determination method, device, and storage medium | |
| CN100412531C (en) | Microwave pottery materials fast detection device and method | |
| US2586868A (en) | Thickness-measuring instrument | |
| Wust et al. | Development and testing of SAR-visualizing phantoms for quality control in RF hyperthermia | |
| Hollway | The comparison reflectometer | |
| CA2295520A1 (en) | Device for measuring and/or representing electrical and magnetic material properties and properties directly derivable therefrom | |
| CN109458961A (en) | A kind of portable microwave absorbing coating measurer for thickness and method | |
| CN104131509A (en) | Laser measuring instrument for road surface texture structure and structure depth | |
| CN108760875A (en) | A kind of portable tape clad stress metal pipeline-weld positioning device and localization method | |
| CN110967396B (en) | Giant magneto-impedance effect biomagnetic measuring device based on magnetic bead concentration and simulated lesion body shape | |
| CN106501617A (en) | The calibration steps of dielectric material measuring piece, short-circuit calibrating device, dielectric material measuring method and device | |
| CN111999564A (en) | Method and device for calculating internal dielectric constant value of cable accessory | |
| CN206114780U (en) | Dielectric constant measures anchor clamps | |
| CN105182076B (en) | Two-port network phase shift method for real-timely testing based on vector network analyzer | |
| CN213843497U (en) | Test fixture for thin-film magnetic material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |