CN114323202A - Detection apparatus for pipe flooding liquid level - Google Patents
Detection apparatus for pipe flooding liquid level Download PDFInfo
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- CN114323202A CN114323202A CN202210227947.0A CN202210227947A CN114323202A CN 114323202 A CN114323202 A CN 114323202A CN 202210227947 A CN202210227947 A CN 202210227947A CN 114323202 A CN114323202 A CN 114323202A
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Abstract
The invention relates to a detection device for a circular tube impregnation liquid level, which relates to the field of material forming tests and comprises a die, an electronic balance, a microwave probe, an ultrasonic generator and a cable, wherein the electronic balance is arranged at the bottom of the die; the invention has the advantages of improving the mechanical property and the electrical insulation property of the aramid fiber composite round pipe.
Description
Technical Field
The invention relates to the technical field of material forming tests, in particular to a detection device for a circular tube impregnation liquid level.
Background
The aramid fiber reinforced epoxy resin composite material has the advantages of lighter weight and higher strength than a glass fiber reinforced epoxy resin composite material, and the aramid fiber composite round pipe is widely used as an insulating pull rod for transmitting mechanical actions to connect high and low potentials in high-voltage switch equipment in the power industry and plays a role of a key insulating structural part.
The difficulty of the aramid fiber fabric and epoxy resin impregnation process is determined by the poor interface bonding capability of the aramid fiber and the epoxy resin. For the preparation of the aramid fiber composite round pipe, the dipping effect of the aramid fiber composite round pipe is determined by controlling the dipping speed of the glue solution in a vacuum environment. The patent with publication number CN113866280A discloses an ultrasonic detection device and method for a thin-layer laminated dielectric composite material, which performs non-contact nondestructive detection on the thin-layer laminated dielectric composite material by arranging a digital ultrasonic flaw detector in cooperation with an ultrasonic probe capable of moving with multiple degrees of freedom, realizes transmission and reception of ultrasonic signals by a coupling agent, avoids damage to a sample caused by destructive measurement of defects, avoids influence of contact states and contact pressures on accuracy of measurement results in contact measurement, and achieves omnibearing detection and analysis of information of the sample such as defect positions, aging degrees and the like. Although the detection accuracy of the composite material of the thin layer is higher, the method is not suitable for the dipping detection of the pipeline, in addition, the cost of the adopted equipment is higher, the edited detection program is more complex, so that the hardware cost and the software cost are higher, and the method is not more suitable for being applied to the detection of the dipping defect of the pipeline.
Therefore, in order to overcome the above disadvantages, it is necessary to provide a device for detecting the dipping liquid level of the round tube.
Disclosure of Invention
Technical problem to be solved
The invention aims to solve the technical problem that the existing impregnation detection mode can not detect the impregnation defect of a pipeline and can not make up the impregnation defect.
(II) technical scheme
In order to solve the technical problem, the invention provides a detection device for the dipping liquid level of a circular tube, which comprises a die, an electronic balance, a microwave probe, an ultrasonic generator and a cable, wherein the electronic balance is arranged at the bottom of the die, the ultrasonic generator is placed at the top of the die, the microwave probe penetrates through the ultrasonic generator and extends into the die, and the cable is respectively connected with the microwave probe and the ultrasonic generator so that the microwave probe is electrically connected with a microwave detection system and the ultrasonic generator is electrically connected with an ultrasonic detection system; wherein, one side of the bottom of the mould is fixedly connected with a glue solution dipping pipe, the ultrasonic generator is arranged at the other side of the top of the mould and is provided with an ultrasonic probe, and the ultrasonic probe extends into the mould.
As a further description of the present invention, preferably, the mold comprises an outer mold and an inner mold, the inner mold is embedded in the outer mold, and a tubular cavity is formed between the outer mold and the inner mold; the middle part of the ultrasonic generator is provided with a vibration part, the vibration part extends into the inner die, the outer wall surface of the vibration part is provided with an ultrasonic-driven vibrating piece, and the vibrating piece is abutted to the inner die.
As a further explanation of the present invention, it is preferable that the bottom of the mold is fixedly connected with a disk-shaped bottom plate, the outer diameter of the bottom plate is larger than that of the outer mold, and the bottom plate is placed on a scale pan on the upper part of the electronic balance.
As a further illustration of the present invention, preferably, an annular surrounding ring is fixedly connected to the top of the electronic balance at the periphery of the pan, the inner diameter of the surrounding ring is larger than the outer diameter of the bottom plate, and the length of the surrounding ring is equal to the sum of the thicknesses of the pan and the bottom plate.
As a further description of the present invention, preferably, the periphery of the bottom plate is fixedly connected with four square bumps at intervals in an annular shape, a square groove is formed in the surrounding ring, the width of the square groove is the same as that of the bump, the depth of the square groove is greater than the thickness of the bump, and the bump is embedded in the square groove.
As a further explanation of the present invention, preferably, one side of the bottom of the mold is fixedly connected with a glue solution dipping tube, one end of the glue solution dipping tube is connected with a glue solution storage tank, and glue solution is stored in the glue solution storage tank, so that the glue solution is continuously injected into the cavity through the glue solution dipping tube in three dipping periods.
As a further explanation of the present invention, it is preferable that the liquid level is at the desired immersion height at the initial stage of immersion
(ii) a Wherein the dipping speed of the glue solution is 1-3 g/s; the middle stage of the impregnation is that the liquid level is at the required impregnation height
(ii) a The later stage of impregnation is that the liquid level is at the required impregnation height
To the required height.
As a further explanation of the present invention, it is preferable that the dipping speed of the glue solution is 1 to 3g/s at the initial stage of dipping.
As a further description of the present invention, it is preferable that in the middle stage of impregnation, the impregnation speed of the glue solution satisfies:
wherein
The current glue solution dipping speed;
S is the bottom area of the cavity;
As a further description of the present invention, preferably, in the later stage of impregnation, the impregnation speed of the glue solution satisfies:
wherein
The current glue solution dipping speed;
h is the required impregnation height;
S is the bottom area of the cavity;
(III) advantageous effects
The technical scheme of the invention has the following advantages:
the invention adjusts the dipping speed of the glue solution in time according to the dipping process, and different dipping speeds of the glue solution are required to be selected at the initial stage, the middle stage and the later stage of dipping, so that the defect of dry dipping spots formed by the bale return at the flowing front edge of the glue solution can be avoided, the dipping effect of aramid fiber and epoxy resin is improved, and the mechanical property and the electrical insulation property of the aramid fiber composite round tube are greatly improved.
Drawings
FIG. 1 is a view showing the construction of a detecting unit of the present invention;
FIG. 2 is a cross-sectional view of the collarette of the present invention;
FIG. 3 is a cross-sectional view of the bottom of the mold of the present invention;
FIG. 4 is a diagram showing a position of a vibrating piece according to the present invention;
fig. 5 is a control logic diagram of the present invention.
In the figure: 1. a mold; 11. an outer mold; 12. an inner mold; 13. a cavity; 14. a base plate; 15. a bump; 2. an electronic balance; 21. a pan is weighed; 22. a surrounding ring; 23. a square groove; 3. a microwave probe; 4. an ultrasonic generator; 41. an ultrasonic probe; 42. a vibrating section; 43. a vibrating piece; 5. a cable; 6. and (5) dipping the tube with glue solution.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The utility model provides a detection apparatus of pipe flooding liquid level, combines fig. 1, fig. 4, including mould 1, electronic balance 2, microwave probe 3, supersonic generator 4 and cable 5, electronic balance 2 arranges in mould 1 bottom, and supersonic generator 4 places at mould 1 top, and microwave probe 3 passes supersonic generator 4 and stretches into in the mould 1, and cable 5 connects microwave probe 3 and supersonic generator 4 respectively so that microwave probe 3 and microwave detecting system, supersonic generator 4 and ultrasonic detecting system electric connection.
With reference to fig. 1 and 3, the mold 1 includes an outer mold 11 and an inner mold 12, the outer mold 11 and the inner mold 12 are both in a tubular structure, the inner mold 12 is embedded in the outer mold 11, the axes of the outer mold 11 and the inner mold 12 are coincident, a tubular cavity 13 is formed between the outer mold 11 and the inner mold 12, one side of the bottom of the mold 1 is fixedly connected with a glue solution dipping tube 6, and the glue solution is injected into the cavity 13 through the glue solution dipping tube 6 to form a circular tube. The outside of the mould 1 is connected with a glue storage tank through a glue dipping pipe 6, glue is stored in the glue storage tank, the glue storage tank is connected with a pump body, and the pump body is provided with a pressure controller which is electrically connected with a central processing unit through a cable. The glue solution dipping pipe 6 is connected with a glue solution speed detection system, and the glue solution speed detection system is also electrically connected with the central processing unit. Referring to fig. 2, the bottom of the mold 1 is fixedly connected with a disk-shaped bottom plate 14, four square bumps 15 are fixedly connected to the periphery of the bottom plate 14 at intervals in a ring shape, the outer diameter of the bottom plate 14 is larger than that of the outer mold 11, and the bottom plate 14 is placed on a scale 21 on the upper portion of the electronic balance 2, so that the mold 1 can be placed more stably.
Referring to fig. 2 and 3, an annular surrounding ring 22 is fixedly connected to the top of the electronic balance 2 at the periphery of the pan 21, the inner diameter of the surrounding ring 22 is slightly larger than the outer diameter of the bottom plate 14, and the length of the surrounding ring 22 is equal to the sum of the thicknesses of the pan 21 and the bottom plate 14. The presence of mechanical failure of electronic balance 2 can be determined by observing the top surface of base plate 14 is flush with the top surface of shroud 22 prior to immersion. The enclosing ring 22 is internally provided with a square groove 23, the width of the square groove 23 is the same as that of the lug 15, the depth of the square groove 23 is greater than the thickness of the lug 15, and the lug 15 is embedded into the square groove 23. The square groove 23 and the bump 15 are arranged for limiting rotation and side inclination of the die 1, ensuring that the die 1 is always vertical in length direction, ensuring that the die 1 is supported by the scale 21, and ensuring that the electronic balance 2 can detect mass change of the die 1.
With reference to fig. 3 and 4, the ultrasonic probe 41 is arranged on the side of the ultrasonic generator 4, which is located at the top of the mold 1 and away from the glue solution dipping pipe 6, and the ultrasonic probe 41 extends into the cavity 13 of the mold 1, so that the ultrasonic probe 41 can detect the liquid level height of a lower point, and the dipping height of the glue solution dipping liquid level can be comprehensively judged by matching with the arrangement position of the microwave probe 3. The middle part of the ultrasonic generator 4 is provided with a vibration part 42, the vibration part 42 extends into the inner die 12, an ultrasonic transducer is arranged in the vibration part 42, the outer wall surface of the vibration part 42 is provided with a vibration piece 43, the vibration piece 43 is abutted against the inner die 12, and the vibration piece 43 is connected with the ultrasonic transducer to enable the vibration piece 43 to vibrate. The ultrasonic generator 4 with the ultrasonic probe 41 and the vibrating plate 43 is arranged, so that the ultrasonic generator 4 can measure the liquid level height through ultrasonic waves, the vibrating plate 43 can be used for shaking the mold 1, the glue solution shakes in the dipping process at the moment, excessive adhesion between the glue solution and the mold 1 is avoided, the bubbles are fully extruded by matching with dipping of the glue solution, the glue solution is fully contacted with fibers, dry spots are avoided, and the dipping qualification rate is improved by matching with detection of glue solution dipping and adjustment of dipping speed.
The invention also provides an adjusting method of the circular tube immersion liquid level detection device, which comprises the following steps as shown in figure 1:
i, placing a mold 1 on an electronic balance 2, and continuously conveying an electric signal to a mass detection system by the electronic balance 2 through injecting glue solution into the mold 1; and simultaneously starting a microwave detection system to detect the height of the glue liquid in the mould 1. The electronic balance 2 is electrically connected with the mass detection system through a cable, and the mass detection system is electrically connected with the central processing unit through a cable; the microwave detection system and the ultrasonic detection system are respectively electrically connected with the central processing unit through cables.
Microwave detection system control microwave probe 3 after the work releases the microwave to mould 1, the microwave can take place reflection, transmission and scattering when permeating through mould 1, and can receive the inside geometric characteristics influence of mould 1, microwave detection system can detect the change of basic parameters such as microwave distribution situation and microwave amplitude, phase place, frequency, can roughly judge the position roughly of glue solution liquid level in the mould 1 through detecting microwave basic parameter change, although microwave detection energy consumption is low, the penetrability is strong, nevertheless because microwave detection technology spatial resolution is low, can not accurately judge the liquid level position.
And II, when the quality detection system detects that the quality reaches a set value, transmitting a data signal to the central processing unit, and starting to send a signal to the ultrasonic detection system by the central processing unit. Wherein the set value is 10 g-20 g, and the specific selection value is different according to the properties of the epoxy resin and the structure of the die 1.
And III, after the ultrasonic detection system receives the working signal, automatically smearing the couplant on the die 1, generating ultrasonic waves by the ultrasonic generator 4, then respectively transmitting the ultrasonic waves to the liquid level through the ultrasonic probe 41, and enabling the vibrating piece 43 to vibrate so that the die 1 vibrates.
IV, transmitting ultrasonic waves to the liquid level of the glue solution and the surface of the mold 1 to be reflected and transmitted, and judging the position of the liquid level according to the time of the occurrence of the echo of the liquid level of the glue solution; the ultrasonic detection depth is large, the sensitivity is high, and the position of the liquid level can be accurately captured. After the ultrasonic detection system acquires the liquid level height information, the liquid level height signal is transmitted to the central processing unit, and the central processing unit judges the dipping speed according to a pre-recorded glue solution dipping speed calculation formula. Compared with the direct use of an ultrasonic detection system for full-time detection, the long-time use of the microwave detection system can reduce energy consumption.
And V, in order to avoid the defect that the flowing front edge of the glue solution returns to the bag to form the impregnation dry spot, the impregnation speed of the glue solution needs to be adjusted timely according to the impregnation stroke, and different impregnation speeds of the glue solution need to be selected at different periods of impregnation. Because the dipping resistance is gradually increased along with the increase of the dipping height of the glue solution along the vertical round tube, the balance state of the flowing front edge of the glue solution is broken, the speed of the glue solution needs to be readjusted to form a new balance state of the flowing front edge, and the defect of dry spots during dipping can be avoided. Therefore, the central processor respectively sets three different glue solution dipping speed calculation formulas at the initial stage, the middle stage and the later stage of dipping, changes the pressure applied to the glue solution storage tank through the pressure controller according to the different glue solution dipping speeds, and further adjusts the glue solution speed in the glue solution dipping pipe 6 so as to obtain the aramid fiber composite round pipe product qualified in dipping.
Specifically, the initial stage, the middle stage and the later stage of the dipping are distinguished by the glue liquid height in the mould 1, wherein the dipping is carried outThe liquid level is at the required immersion height at the initial stage
(ii) a The middle stage of the impregnation is that the liquid level is at the required impregnation height
(ii) a The later stage of impregnation is that the liquid level is at the required impregnation height
To the required height. Divide required flooding height equally according to the multiple of 10 for the testing process to the pipe flooding is more meticulous, can not only reduce designer's work load, still reduces central processing unit's data processing degree of difficulty, and still guarantees the promotion of flooding effect, plays many purposes at one stroke.
The three different glue solution impregnation speed calculation formulas are respectively set at the initial stage, the middle stage and the later stage of impregnation:
in the initial stage of impregnation, the impregnation speed of the glue solution is basically 1-3 g/s. If the liquid level height is larger than the expected height due to the fact that bubbles or dry spots are generated in the liquid in the impregnation process due to different properties of the modified epoxy resin, the impregnation speed is properly reduced by adopting a depressurization mode, so that the bubbles can be timely extruded by glue subsequently entering the die 1, the occurrence of the dry spots is avoided, and the qualification rate of the impregnated round tube is ensured. However, since the probability of the above-mentioned occurrence is low in the initial stage of dipping, the dipping speed in the initial stage of dipping is the same as the initial speed, and the glue injection speed can be maintained at a relatively high level, thereby ensuring appropriate processing efficiency.
In the middle stage of impregnation, the glue solution impregnation speed calculation formula meets the following requirements:
wherein
The current glue solution dipping speed;
S is the bottom area of the cavity 13;
After the epoxy resin is immersed in the liquid cement, the immersion of the liquid cement is ensured to be in a dynamic balance through the calculation formula, and the empirical coefficient is introduced for different modified epoxy resin materials, so that the circular tube meeting the requirements of mechanical properties and electrical insulating properties can be ensured to be immersed for different modified epoxy resins. In addition, the middle stage of the immersion is set to a stage in which the liquid level is at a desired immersion height
In the range of (1), the range of the dipping in the middle dipping stage for the round tube can be increased, and the mass data of the electronic balance 2 is not included in the calculation formula of the middle dipping stage, so that the range of the dipping in the round tube can be reducedThe calculation amount of the central processing unit reduces the recording workload of the quality detection system, thereby reducing the design workload of system developers; but also can improve the dipping efficiency, ensure the qualification rate of the round pipe and simultaneously improve the processing efficiency.
And thirdly, in the later impregnation stage, the glue solution impregnation speed calculation formula meets the following requirements:
wherein
The current glue solution dipping speed;
h is the required impregnation height;
S is the bottom area of the cavity 13;
The glue solution speed in the later stage of impregnation can be automatically reduced by the above formula without manual control. In addition, when the later stage of impregnation is reached, the ultrasonic detection system is closed, and the microwave detection system is started to detect the impregnation liquid level of the glue solution; when in use
Then, if
And the glue solution is required to be injected into the mould 1 continuously until the maximum pressure value is reached and the glue solution can not be injected any more. The injection of the glue solution is ensured to be more compact in the later stage of impregnation, the generation of dry spots is further avoided, and meanwhile, the compactness of the combination of the glue solution is improved, so that the subsequent formed round tube material is uniformly and finely distributed, and the mechanical performance and the insulating performance of all parts of the round tube are the same.
In addition, when the central processing unit receives that the numerical value fed back by the glue solution speed detection device is zero and the numerical value of the electronic balance 2 is not changed any more, the pressure controller is closed, after the ultrasonic detection system is started for 30s, if the height numerical value fed back by the ultrasonic detection system is the same as the required dipping height numerical value, which indicates that the dipping of the circular tube is qualified, all the systems are automatically closed, and equipment accidents caused by continuous operation of continuous equipment in an unmanned workshop are avoided. And when the liquid level height is measured by adopting ultrasonic waves, the mould 1 shakes to ensure that excessive adhesion is not generated between the mould 1 and the glue solution, so that the subsequent demoulding is facilitated. And if the fed back height value is different from the required dipping height value, indicating that the round pipe is unqualified in dipping, sending a warning signal to remind a worker to maintain and replace.
In the process of calculating the dipping speed, if the calculated numerical value is different from the measuring speed of the glue solution speed detecting system, the pressure controller is adjusted, and the electric signal sent back by the glue solution speed detecting system is received and processed after 5s, so that the flow speed data obtained by the glue solution speed detecting system is ensured to be the adjusted data, and the judgment precision of the central processing unit is guaranteed. Compared with the conventional automatic adjustment design mode, the invention has low performance requirement on the central processing unit, the processing speed completely meets the experiment or production requirement, and in addition, the performance of the round pipe formed after the glue solution is soaked can be ensured to meet the requirement.
The invention also provides specific experimental sample data: setting the initial speed of the glue solution to be 1.5g/s, dividing the distance from the bottom end of the die 1 to the top end of the die 1 into 10 equal parts of X1, X2 … … X9 and X10 at equal intervals, comparing the data of the aramid fiber composite round pipe prepared by the method with the data of an aramid fiber composite round pipe prepared by a traditional method, and comparing the results to be shown in the following table:
as can be seen from the above table, in the process of dipping the aramid fiber composite round tube glue solution, the dipping resistance is small in the initial stage, and the difference between the difficulty degree of the inside and outside dipping of the preformed tube is not large, so that the dipping speed of the glue solution can be relatively large in order to improve the production efficiency; the dipping resistance is increased along with the dipping of the glue solution to the axial middle position of the round tube, the dipping inside the preforming becomes difficult, and the dipping speed of the glue solution needs to be dynamically adjusted in order to balance the dipping speed of the inner wall and the outer wall of the preforming and the dipping speed of the inside of the preforming; in the latter half of the impregnation, the impregnation resistance is continuously increased, and the impregnation speed of the glue solution needs to be further reduced in order to obtain a good impregnation effect. Therefore, according to the detection of the liquid level height and the dipping weight of the glue solution, the dipping speed of the glue solution is automatically controlled, the dipping effect of aramid fiber and epoxy resin is improved, the mechanical property and the electrical insulation property of the aramid fiber composite round tube are improved, the control cost is reduced through a simpler formula and an automatic adjustment method, the control fault caused by calculation errors can be reduced, the product quality is improved while the cost is reduced, the profit rate of enterprises can be greatly and effectively improved, and the method has extremely high commercial value.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. The utility model provides a detection device of pipe flooding liquid level which characterized in that: the device comprises a mould (1), an electronic balance (2), a microwave probe (3), an ultrasonic generator (4) and a cable (5), wherein the electronic balance (2) is arranged at the bottom of the mould (1), the ultrasonic generator (4) is placed at the top of the mould (1), the microwave probe (3) penetrates through the ultrasonic generator (4) and extends into the mould (1), and the cable (5) is respectively connected with the microwave probe (3) and the ultrasonic generator (4) so that the microwave probe (3) is electrically connected with a microwave detection system and the ultrasonic generator (4) is electrically connected with an ultrasonic detection system; wherein, one side of the bottom of the mould (1) is fixedly connected with a glue solution dipping pipe (6), the ultrasonic generator (4) is arranged at the other side of the top of the mould (1) and is provided with an ultrasonic probe (41), and the ultrasonic probe (41) extends into the mould (1).
2. The apparatus for detecting the immersion liquid level of a round pipe according to claim 1, wherein: the die (1) comprises an outer die (11) and an inner die (12), the inner die (12) is embedded in the outer die (11), and a tubular cavity (13) is formed between the outer die (11) and the inner die (12); the middle part of the ultrasonic generator (4) is provided with a vibration part (42), the vibration part (42) extends into the inner die (12), the outer wall surface of the vibration part (42) is provided with an ultrasonic-driven vibration piece (43), and the vibration piece (43) is abutted against the inner die (12).
3. The apparatus for detecting the immersion liquid level of a round pipe as claimed in claim 2, wherein: the bottom of the die (1) is fixedly connected with a disc-shaped bottom plate (14), the outer diameter of the bottom plate (14) is larger than that of the outer die (11), and the bottom plate (14) is placed on a scale pan (21) at the upper part of the electronic balance (2).
4. The apparatus for detecting the immersion liquid level of a round pipe as claimed in claim 3, wherein: the top of the electronic balance (2) on the periphery of the weighing pan (21) is fixedly connected with an annular surrounding ring (22), the inner diameter of the surrounding ring (22) is larger than the outer diameter of the bottom plate (14), and the length of the surrounding ring (22) is equal to the sum of the thicknesses of the weighing pan (21) and the bottom plate (14).
5. The device for detecting the immersion liquid level of the round pipe as claimed in claim 4, wherein: the periphery of the bottom plate (14) is annularly and fixedly connected with four square lugs (15) at intervals, a square groove (23) is formed in the surrounding ring (22), the width of the square groove (23) is the same as that of the lugs (15), the depth of the square groove (23) is larger than the thickness of the lugs (15), and the lugs (15) are embedded into the square groove (23).
6. The apparatus for detecting the immersion liquid level of a round pipe as claimed in claim 5, wherein: one side of the bottom of the mould (1) is fixedly connected with a glue solution dipping pipe (6), one end of the glue solution dipping pipe (6) is connected with a glue solution storage tank, and glue solution is stored in the glue solution storage tank, so that the glue solution can be continuously injected into the cavity (13) through the glue solution dipping pipe (6) in three dipping periods.
7. The apparatus for detecting the immersion liquid level of a round pipe as claimed in claim 6, wherein: the liquid level is at the required immersion height at the initial stage of immersion
(ii) a Wherein the dipping speed of the glue solution is 1-3 g/s; the middle stage of the impregnation is that the liquid level is at the required impregnation height
(ii) a The later stage of impregnation is that the liquid level is at the required impregnation height
To the required height.
8. The apparatus for detecting the immersion liquid level of a round pipe as claimed in claim 7, wherein: at the initial stage of impregnation, the impregnation speed of the glue solution is 1-3 g/s.
9. The apparatus for detecting the immersion liquid level of a round pipe as claimed in claim 8, wherein: in the middle stage of impregnation, the impregnation speed of the glue solution meets the following requirements:
wherein
The current glue solution dipping speed;
S is the bottom area of the cavity (13);
10. The apparatus for detecting the immersion liquid level of a round pipe as claimed in claim 9, wherein: in the later stage of impregnation, the impregnation speed of the glue solution meets the following requirements:
wherein
The current glue solution dipping speed;
h is the required impregnation height;
S is the bottom area of the cavity (13);
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| CN214401008U (en) * | 2020-12-24 | 2021-10-15 | 中建材科创新技术研究院(山东)有限公司 | Vacuum impregnation forming device for aerogel products |
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