CN114311004B - Non-contact sucking disc anchor clamps - Google Patents
Non-contact sucking disc anchor clamps Download PDFInfo
- Publication number
- CN114311004B CN114311004B CN202111579064.8A CN202111579064A CN114311004B CN 114311004 B CN114311004 B CN 114311004B CN 202111579064 A CN202111579064 A CN 202111579064A CN 114311004 B CN114311004 B CN 114311004B
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- clamping piece
- clamping
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- guide
- lifting
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- 230000007246 mechanism Effects 0.000 claims abstract description 68
- 230000001360 synchronised effect Effects 0.000 claims description 26
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 54
- 239000004065 semiconductor Substances 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 239000012636 effector Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application relates to a non-contact type sucker clamp, which comprises a first clamping mechanism, a second clamping mechanism and a clamping mechanism, wherein the first clamping mechanism comprises a clamping assembly and a non-contact type sucker; the clamping assembly comprises a mounting plate, a first non-rigid clamping piece, a second non-rigid clamping piece and a driving component for driving the first non-rigid clamping piece and the second non-rigid clamping piece to move relatively, wherein the driving component is mounted on the mounting plate and is connected with the first non-rigid clamping piece and the second non-rigid clamping piece; the non-contact sucker is fixed below the mounting plate and is positioned between the first non-rigid clamping piece and the second non-rigid clamping piece. The mechanical non-contact double-station clamp provided by the application replaces manual operation, and effectively solves the problem that workers are scalded; the problem that the wafer is fixed without enough friction force and then falls down to be damaged due to the fact that the sucker is not in direct contact with the wafer is avoided while the front face of the wafer is prevented from being contacted.
Description
Technical Field
The application relates to the technical field of semiconductor wafer production, in particular to a non-contact sucking disc clamp.
Background
In the semiconductor wafer industry, due to the production process requirements, chemical vapor deposition or physical deposition is often required on one surface of a wafer, so that the surface is often required to be inaccessible; when people take and put products, the products often need to be tilted carefully, and the products are sucked from the back for carrying. When the non-contact sucker is used for sucking the wafer, the sucker is not contacted with the wafer, so that the wafer is fixed by insufficient friction force, and the wafer is easy to fall and damage.
Disclosure of Invention
In order to solve the above problems, the present application provides a non-contact chuck clamp, which is limited by the clamp to prevent the wafer from falling during the handling process.
The embodiment of the application is realized by adopting the following scheme: providing a non-contact sucking disc clamp, comprising a first clamping mechanism, wherein the first clamping mechanism comprises a clamping assembly and the non-contact sucking disc; the clamping assembly comprises a mounting plate, a first non-rigid clamping piece, a second non-rigid clamping piece and a driving component for driving the first non-rigid clamping piece and the second non-rigid clamping piece to move relatively, wherein the driving component is mounted on the mounting plate and is connected with the first non-rigid clamping piece and the second non-rigid clamping piece; the non-contact sucker is fixed below the mounting plate and is positioned between the first non-rigid clamping piece and the second non-rigid clamping piece.
In one embodiment of the present application, the driving part includes a first guide rail, a second guide rail, a first moving block and a second moving block; the front part of the mounting plate is provided with a first guide rail, the rear part of the mounting plate is provided with a second guide rail, two ends of the mounting plate are provided with synchronous pulleys, one of the synchronous pulleys is driven by a motor, and a synchronous belt is arranged between the two synchronous pulleys; the first guide rail is provided with the first moving block, the second guide rail is provided with the second moving block, and the first moving block and the second moving block are respectively connected with the synchronous belt; the lower end of the first moving block is provided with the first non-rigid clamping piece, and the lower end of the second moving block is provided with the second non-rigid clamping piece.
In one embodiment of the application, the second non-rigid clamping piece comprises a connecting block, a guide shaft and a clamping block, wherein a through hole parallel to the first guide rail is formed in the connecting block, and a reset spring is arranged on the guide shaft in a penetrating manner; the guide shaft penetrates into the through hole, and the guide shaft is connected with the through hole through the reset spring; one end of the guide shaft, which is far away from the non-contact sucker, is connected with a middle block, and the middle block is connected with the clamping block; the second non-rigid clamping piece is identical to the first non-rigid clamping piece in structure, and the installation directions are mirror symmetry.
In an embodiment of the present application, the first clamping mechanism is installed at a first end of the connecting seat; a second clamping mechanism is arranged at the second end of the connecting seat; the second clamping mechanism has the same structure as the first clamping mechanism.
In an embodiment of the application, the first clamping mechanism is connected with the connecting seat through a first lifting mechanism, the first lifting mechanism comprises a fixed plate and a lifting air cylinder, the fixed plate is fixed at the left end of the connecting seat, the lifting air cylinder is arranged at the top of the fixed plate, the lifting plate is arranged at the left side surface of the fixed plate, and a telescopic rod of the lifting air cylinder is connected with the lifting plate; the first clamping and sucking mechanism is connected with the lifting plate; the second clamping mechanism is connected with the connecting seat through a second lifting mechanism, and the structure of the second lifting mechanism is bilaterally symmetrical with that of the first lifting mechanism.
In an embodiment of the application, two vertical third guide rails are installed on the left side surface of the fixed plate, and the lifting plate is connected with the corresponding third guide rails through sliding blocks.
In an embodiment of the application, the front part and the rear part of the fixed plate are provided with guide blocks, the two guide blocks are provided with guide holes, the front side and the rear side of the lifting plate are provided with guide posts, and the guide posts penetrate into the corresponding guide holes.
The application has the beneficial effects that: compared with the existing manual picking and placing of the semiconductor wafers, the non-contact type suction cup clamp provided by the application can be arranged on various multi-axis displacement mechanisms and used for carrying the semiconductor wafers which cannot contact the front surface, replaces manual operation and effectively avoids the scalding problem of workers; simultaneously, two clamping mechanisms are provided, so that two semiconductor wafers can be clamped simultaneously, and the production efficiency is greatly improved; the side of the semiconductor wafer is clamped by the two non-rigid clamping pieces which are symmetrically arranged while the front surface of the wafer is prevented from being contacted, and the problem that the wafer is not fixed by enough friction force due to the fact that the sucker is not in direct contact with the wafer, so that the wafer is dropped and damaged is avoided.
Drawings
Fig. 1 is a schematic structural view of a non-contact chuck fixture.
Fig. 2 is an enlarged schematic view of a portion of fig. 1 at a.
Fig. 3 is a front view of a non-contact suction cup clamp.
Fig. 4 is a bottom view of a non-contact suction cup clamp.
Fig. 5 is a schematic view of the B-B cross section of fig. 4.
Fig. 6 is an enlarged partial schematic view at C in fig. 5.
Reference numerals
1-connecting seats, 2-first lifting mechanisms, 21-fixing plates, 22-lifting cylinders, 23-lifting plates, 24-third guide rails, 25-guide blocks and 26-guide columns; 3-a first clamping mechanism, 31-a non-contact sucker and 32-a clamping assembly; 321-a mounting plate, 322-a driving part, 3222-a first guide rail, 3223-a synchronous pulley, 3224-a motor, 3225-a first moving block, 3226-a synchronous belt, 3227-a displacement sensor, 3228-a second moving block; 323-first non-rigid clamping piece, 324-second non-rigid clamping piece, 3241-through hole, 3242-return spring, 3243-middle block, 3244-guide shaft, 3245-connecting block, 3246-clamping block; 4-second elevating mechanism, 5-second clamping and sucking mechanism.
Detailed Description
The application is further described below with reference to the accompanying drawings.
Referring to fig. 1 to 6, the present application provides a non-contact suction cup clamp, which comprises a first clamping mechanism 3, wherein the first clamping mechanism comprises a clamping assembly 32 and the non-contact suction cup 31; the clamping assembly 32 comprises a mounting plate 321, a first non-rigid clamping piece 323, a second non-rigid clamping piece 324 and a driving component 322 for driving the first non-rigid clamping piece 323 and the second non-rigid clamping piece 324 to move relatively, wherein the driving component 322 is mounted on the mounting plate 321, and the driving component 3221 is connected with the first non-rigid clamping piece 323 and the second non-rigid clamping piece 324; the non-contact sucker 31 is fixed under the mounting plate 321 and is positioned between the first non-rigid clamping piece 323 and the second non-rigid clamping piece 324; the driving part 322 drives the first non-rigid clamping part 323 and the second non-rigid clamping part 324 to be close to or far away from each other, so that the clamping and releasing of the semiconductor wafer of the non-contact sucker 31 are realized, the first non-rigid clamping part 323 and the second non-rigid clamping part 324 only contact the side surface of the wafer, the wafer is clamped, the sucked wafer is prevented from falling, the front surface of the wafer is prevented from being contacted, the front surface of the wafer is prevented from being damaged, and meanwhile, the first non-rigid clamping part 323 and the second non-rigid clamping part 324 are not rigid parts, and a certain elastic allowance is provided for automatically adjusting the clamping force when the wafer is clamped, so that the wafer is prevented from being deformed due to the fact that the clamping is too tight.
Referring to fig. 1 to 6, in an embodiment of the present application, the driving unit 322 includes a first rail 3222, a second rail (not labeled, which has the same function as the first rail in the present application), a first moving block 3225 and a second moving block 3228; a first guide rail 3222 is arranged at the upper front part of the mounting plate 321, a second guide rail is arranged at the upper rear part of the mounting plate 321, two synchronous pulleys 3223 are arranged at two ends of the mounting plate 321, one synchronous pulley 3223 is driven by a motor 3224, and a synchronous belt is arranged between the two synchronous pulleys 3223; the first guide rail 3222 is provided with the first moving block 3225, the second guide rail is provided with the second moving block 3228, and the first moving block 3225 and the second moving block 3228 are respectively connected with the corresponding positions of the synchronous belt 3226; the first non-rigid clamping member 323 is mounted at the lower end of the first moving block 3225, and the second non-rigid clamping member 324 is mounted at the lower end of the second moving block 3228; the motor 3224 drives the synchronous pulley 3223 to rotate, thereby driving the synchronous belt 3226 to move, and further driving the first moving block 3225 connected with the synchronous belt 3226 to move along the first guide rail 3222, and the second moving block 3228 connected with the synchronous belt 3226 to move along the second guide rail, wherein the moving directions of the first moving block and the second moving block are opposite due to the fact that the two sides connected to the same synchronous belt 3226 are connected, and further driving the first non-rigid piece and the second non-rigid piece to move along opposite directions, so that the wafer clamping and loosening actions can be realized, and the first guide rail and the second guide rail are parallel to each other.
Referring to fig. 1 to 6, in an embodiment of the application, the second non-rigid clamping member 324 includes a connecting block 3245, a guiding shaft 3244 and a clamping block 3246, a through hole 3241 parallel to the first guide rail 3222 is formed in the connecting block 3245, and a return spring 3242 is disposed on the guiding shaft 3244 in a penetrating manner; the guide shaft 3244 penetrates into the through hole, and the guide shaft 3244 is connected with the through hole 3241 through the return spring 3242; one end of the guide shaft 3244, which is far away from the non-contact sucker 31, is connected with a middle block 3243, and the middle block 3243 is connected with the clamping block 3246; the second non-rigid clamping member 324 has the same structure as the first non-rigid clamping member 323, and is symmetrical in installation direction; the through hole 3241 is a two-stage stepped hole, a section with a large inner diameter of the through hole 3241 is close to the non-contact sucker 31, the return spring 3242 is positioned in the section, and the diameter of the section is the same as the outer diameter of the return spring 3242; a limiting disc is fixed at one end of the guide shaft 3244, which is close to the non-contact sucker, the outer diameter of the limiting disc is the same as that of the return spring 3242, the limiting disc plays a role of propping against the return spring 3242 and is matched with the through hole so as to achieve the effect that the return spring 3242 can normally play a role of buffering and resetting; the small section of the through hole 3241 has the same diameter as the guide shaft 3244, and the temperature of the wafer just evaporated is very high, so that flexible articles such as silica gel cannot be used to directly contact the wafer, so that only high-temperature resistant metals can be used to contact the side surface of the wafer, in order to avoid clamping the wafer by rigid contact, when clamping the wafer, the clamping block 3246 is fixed with the middle block 3243, the middle block is connected with the connecting block 3245 through the guide shaft 3244, the guide shaft 3244 can stretch and retract for a certain distance along the direction of the through hole 3241, and the clamping block 3246 is prevented from being too tight with the wafer clamp by virtue of the buffer function of the return spring 3242, so that the wafer is protected.
In another embodiment of the present application, the second non-rigid clamping member 324 includes a connecting block 3245, a guide shaft 3244 and a clamping block 3236; the connecting block is internally provided with a deep hole parallel to the first guide rail, an orifice of the deep hole is arranged on one side close to the non-contact type suction cup, the guide shaft penetrates into the deep hole, a reset spring is arranged between one end, far away from the non-contact type suction cup, of the guide shaft and the end surface, far away from the non-contact type suction cup, of the deep hole, the middle block is fixed at one end, close to the non-contact type suction cup, of the guide shaft, the clamping block is arranged below the middle block, and therefore, when a wafer is clamped, the reset spring can be compressed, the clamping force is not too large, the wafer is prevented from being clamped, and the first non-rigid clamping piece and the second non-rigid clamping piece are identical in structure and are symmetrically arranged.
Referring to fig. 1 to 3, in an embodiment of the present application, displacement sensors 3227 are mounted on the first guide rail 3222 and the second guide rail, and are used for measuring and controlling the displacement conditions of the first moving block and the second moving block, that is, measuring and controlling the distance between the two clamping blocks 3236, so as to ensure that the clamping blocks 3236 accurately clamp the wafer and accurately unclamp the wafer, ensure that the wafer is clamped during suction, and unclamp the wafer during discharge of the wafer, and avoid too large clamping force.
Referring to fig. 1 to 5, in an embodiment of the present application, a first clamping mechanism 3 is installed at a first end of a connecting seat 1, and a second clamping mechanism 5 is installed at a second end of the connecting seat 1; the second clamping and sucking mechanism 5 has the same structure as the first clamping and sucking mechanism 3, and the installation direction is symmetrical; the connecting seat 1 is used for connecting a mechanical arm or a multi-axis shifting mechanism, the first end is the left end of the connecting seat, and the second end is the right end of the connecting seat.
Referring to fig. 1 to 5, in an embodiment of the present application, the first clamping mechanism 3 is connected to the connection base 1 through a first lifting mechanism 2, the first lifting mechanism 2 includes a fixing plate 21 and a lifting cylinder 22, the fixing plate 21 is fixed at the left end of the connection base 1, the lifting cylinder 22 is mounted on the top of the fixing plate 21, the lifting plate 23 is mounted on the left side surface of the fixing plate 21, and a telescopic rod of the lifting cylinder 22 is connected to the lifting plate 23; the first clamping mechanism 3 is connected with the lifting plate 23; the second clamping mechanism 5 is connected with the connecting seat 1 through a second lifting mechanism 4, and the structure of the second lifting mechanism 4 is bilaterally symmetrical with that of the first lifting mechanism 2; the lifting cylinder 22 stretches and contracts to drive the lifting plate 23 to move up and down, so that the first clamping mechanism 3 and the second clamping mechanism 5 are driven to move up and down; the first lifting mechanism 2 drives the first clamping mechanism 3 to lift, and the second lifting mechanism 4 drives the second clamping mechanism 5 to lift, so that the height difference of the left clamp and the right clamp is reached, interference with other equipment parts is avoided, and normal use of equipment is ensured.
Referring to fig. 2 to 3, in an embodiment of the present application, two vertical third rails 24 are installed on the left side surface of the fixing plate 21, and the lifting plate 23 and the corresponding third rails 24 are connected by a sliding block on the third rails 24, so as to ensure that the lifting plate 23 can stably and vertically lift.
Referring to fig. 2 to 3, in an embodiment of the present application, guide blocks 25 are mounted on the front and rear portions of the fixing plate 21, vertical guide holes are formed in both guide blocks 25, guide posts 26 are disposed on the front and rear sides of the lifting plate 23, and the guide posts 26 penetrate into the corresponding guide holes, so as to ensure that the lifting plate 23 stably and accurately operates, and further stably and accurately drive the first clamping mechanism 3 or the second clamping mechanism 5 to lift.
In an embodiment of the present application, the driving unit 322 may further drive the two clamping blocks 3236 to approach or separate from each other by using a bidirectional screw and screw nut, that is, connect the top of the corresponding moving block 3225 with the corresponding screw nut, and the driving manner is a common technical means in the art, so that a detailed description will not be given.
In another embodiment of the present application, the driving unit may further use two electric telescopic cylinders to drive one non-rigid clamping member respectively, so that the two non-rigid clamping members are close to or far away from each other.
The application has the following working principle:
the non-contact sucker 31 is used for sucking the semiconductor wafer, and the non-contact sucker is not in direct contact with the wafer, so that the wafer is not fixed by enough friction force, the semiconductor wafer is easy to fall off when being carried, at the moment, the synchronous pulley 3223 is required to be driven to rotate by a motor, so that the synchronous belt 3226 is driven to rotate, the synchronous belt 3226 rotates to drive the first moving block 3225 and the second moving block 3228 which are connected with the front side and the rear side of the synchronous belt 3226 to move relatively, the first moving block 3225 and the second moving block 3228 respectively move along the directions of the first guide rail 3222 and the second guide rail under the guidance of the first guide rail 3222 and the second guide rail, and the first non-rigid clamping piece 323 and the second non-rigid clamping piece 324 are driven to approach or be far away from the direction so that the clamping blocks clamp or release the wafer, and non-contact transplanting of the wafer is realized; the displacement sensors 3227 are installed on the first guide rail 3222 and the second guide rail, the displacement sensors 3227 send collected data to the upper computer, and the upper computer controls the rotation of the motor 3224 according to the data, so that the distance between the first non-rigid clamping piece 323 and the second non-rigid clamping piece 324 is adjusted, after the non-contact sucker 31 absorbs a wafer, the two clamping blocks 3236 are close to each other and respectively contact with the corresponding positions of the side wall of the wafer (meanwhile, due to the fact that the reset spring of the non-rigid piece plays a role of buffering and damping, clamping force can be adjusted to a certain extent, clamping of the wafer is avoided, and the wafer is clamped to prevent the wafer from falling off in the carrying process). The lifting cylinder 22 of the first lifting mechanism 2 drives the first clamping mechanism 3 to lift, the lifting cylinder 22 of the second lifting mechanism 4 drives the second clamping mechanism 5 to lift, so that the first clamping mechanism 3 and the second clamping mechanism 5 generate height difference, interference with other equipment parts is avoided, use is influenced, the first clamping mechanism 3 and the second clamping mechanism 5 can be used independently or simultaneously, a double-station clamp can be used for sucking two wafers at a time, and work efficiency is improved. The clamp can be installed on different equipment working conditions through the connecting seat 1, the connecting seat 1 has universality, and can be matched with various equipment for use, for example, the clamp is installed on various mechanical arms to be used as an end effector.
The non-contact sucker is a vacuum sucker and is provided with a locator, a pressure sensor and a vibration-proof cover. The positioner can further prevent the wafer from shifting laterally, and the pressure sensor can detect whether there is a wafer pickup. The locator material is NBR and silicon rubber. The vibration-proof cover can reduce noise generated during wafer adsorption.
The points to be described are: first, in the description of the present application, it should be noted that, unless otherwise specified and defined, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be mechanical or electrical, or may be a direct connection between two elements, and "upper," "lower," "left," "right," etc. are merely used to indicate relative positional relationships, which may be changed when the absolute position of the object being described is changed.
Secondly: in the drawings of the disclosed embodiments, only the structures related to the embodiments of the present disclosure are referred to, and other structures can refer to the common design, so that the same embodiment and different embodiments of the present disclosure can be combined with each other under the condition of no conflict;
finally, the above description is only a preferred embodiment of the present application, and the scope of the present application is not limited to the above examples, but all technical solutions belonging to the concept of the present application are within the scope of the present application. It should be noted that modifications and adaptations to the present application may occur to one skilled in the art without departing from the principles of the present application and are intended to be within the scope of the present application.
Claims (5)
1. A non-contact sucking disc anchor clamps, its characterized in that: the clamping mechanism comprises a clamping assembly and a non-contact sucker; the clamping assembly comprises a mounting plate, a first non-rigid clamping piece, a second non-rigid clamping piece and a driving component for driving the first non-rigid clamping piece and the second non-rigid clamping piece to move relatively, wherein the driving component is mounted on the mounting plate and is connected with the first non-rigid clamping piece and the second non-rigid clamping piece; the non-contact sucker is fixed below the mounting plate and is positioned between the first non-rigid clamping piece and the second non-rigid clamping piece; the driving part comprises a first guide rail, a second guide rail, a first moving block and a second moving block; the front part of the mounting plate is provided with a first guide rail, the rear part of the mounting plate is provided with a second guide rail, two ends of the mounting plate are provided with synchronous pulleys, one of the synchronous pulleys is driven by a motor, and a synchronous belt is arranged between the two synchronous pulleys; the first guide rail is provided with the first moving block, the second guide rail is provided with the second moving block, and the first moving block and the second moving block are respectively connected with the synchronous belt; the lower end of the first moving block is provided with the first non-rigid clamping piece, and the lower end of the second moving block is provided with the second non-rigid clamping piece; the second non-rigid clamping piece comprises a connecting block, a guide shaft and a clamping block, a through hole parallel to the first guide rail is formed in the connecting block, and a reset spring is arranged on the guide shaft in a penetrating manner; the guide shaft penetrates into the through hole, and the guide shaft is connected with the through hole through the reset spring; one end of the guide shaft, which is far away from the non-contact sucker, is connected with a middle block, and the middle block is connected with the clamping block; the first non-rigid clamping piece and the second non-rigid clamping piece are identical in structure; the material of the clamping blocks is high-temperature-resistant metal.
2. A non-contact chuck fixture as in claim 1, wherein: the first clamping mechanism is arranged at the first end of the connecting seat; a second clamping mechanism is arranged at the second end of the connecting seat; the second clamping mechanism has the same structure as the first clamping mechanism.
3. A non-contact chuck fixture as in claim 2, wherein: the first clamping mechanism is connected with the connecting seat through a first lifting mechanism, the first lifting mechanism comprises a fixed plate and a lifting air cylinder, the fixed plate is fixed at the left end of the connecting seat, the lifting air cylinder is arranged at the top of the fixed plate, the lifting plate is arranged on the left side surface of the fixed plate, and a telescopic rod of the lifting air cylinder is connected with the lifting plate; the first clamping and sucking mechanism is connected with the lifting plate; the second clamping mechanism is connected with the connecting seat through a second lifting mechanism, and the structure of the second lifting mechanism is bilaterally symmetrical with that of the first lifting mechanism.
4. A non-contact chuck fixture as in claim 3, wherein: two vertical third guide rails are arranged on the left side surface of the fixed plate, and the lifting plate is connected with the corresponding third guide rails through sliding blocks.
5. A non-contact chuck fixture as in claim 4, wherein: guide blocks are arranged at the front part and the rear part of the fixed plate, guide holes are formed in the two guide blocks, guide columns are arranged at the front side and the rear side of the lifting plate, and the guide columns penetrate into the corresponding guide holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111579064.8A CN114311004B (en) | 2021-12-22 | 2021-12-22 | Non-contact sucking disc anchor clamps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111579064.8A CN114311004B (en) | 2021-12-22 | 2021-12-22 | Non-contact sucking disc anchor clamps |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114311004A CN114311004A (en) | 2022-04-12 |
| CN114311004B true CN114311004B (en) | 2023-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111579064.8A Active CN114311004B (en) | 2021-12-22 | 2021-12-22 | Non-contact sucking disc anchor clamps |
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| Country | Link |
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| CN (1) | CN114311004B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108994870A (en) * | 2018-09-30 | 2018-12-14 | 东莞华贝电子科技有限公司 | End effector and manipulator for manipulator |
| CN109461691A (en) * | 2017-09-06 | 2019-03-12 | 富士迈半导体精密工业（上海）有限公司 | Wafer support device |
| CN208882942U (en) * | 2018-09-25 | 2019-05-21 | 苏州柔触机器人科技有限公司 | A kind of flexible grabbing device with sucker |
| US10493618B1 (en) * | 2018-11-20 | 2019-12-03 | Jiangsu Fine Storage Information Technology Co., Ltd. | Multi-axis mechanical gripper with symmetrically fixed pair of racks |
| CN210972996U (en) * | 2019-12-03 | 2020-07-10 | 深圳微智天下科技有限公司 | Material taking device for robot machining |
| CN211940978U (en) * | 2019-12-31 | 2020-11-17 | 深圳威洛博机器人有限公司 | Electric clamping jaw |
-
2021
- 2021-12-22 CN CN202111579064.8A patent/CN114311004B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109461691A (en) * | 2017-09-06 | 2019-03-12 | 富士迈半导体精密工业（上海）有限公司 | Wafer support device |
| CN208882942U (en) * | 2018-09-25 | 2019-05-21 | 苏州柔触机器人科技有限公司 | A kind of flexible grabbing device with sucker |
| CN108994870A (en) * | 2018-09-30 | 2018-12-14 | 东莞华贝电子科技有限公司 | End effector and manipulator for manipulator |
| US10493618B1 (en) * | 2018-11-20 | 2019-12-03 | Jiangsu Fine Storage Information Technology Co., Ltd. | Multi-axis mechanical gripper with symmetrically fixed pair of racks |
| CN210972996U (en) * | 2019-12-03 | 2020-07-10 | 深圳微智天下科技有限公司 | Material taking device for robot machining |
| CN211940978U (en) * | 2019-12-31 | 2020-11-17 | 深圳威洛博机器人有限公司 | Electric clamping jaw |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114311004A (en) | 2022-04-12 |
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