CN114310530B - Automatic loading and unloading ejection structure applied to processing of semiconductor substrate slice - Google Patents
Automatic loading and unloading ejection structure applied to processing of semiconductor substrate slice Download PDFInfo
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- CN114310530B CN114310530B CN202111469456.9A CN202111469456A CN114310530B CN 114310530 B CN114310530 B CN 114310530B CN 202111469456 A CN202111469456 A CN 202111469456A CN 114310530 B CN114310530 B CN 114310530B
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Abstract
The invention discloses an automatic loading and unloading ejection structure applied to processing of a semiconductor substrate slice, which comprises a base, wherein a conveying channel for conveying the silicon carbide substrate slice is arranged on the base, a processing area is arranged on the conveying channel, a silicon carbide substrate slice storage barrel assembly is arranged on one side of the processing area, a pushing assembly for ejecting the silicon carbide substrate slice in the silicon carbide substrate slice storage barrel assembly to the processing area is connected to the conveying channel on one side of the silicon carbide substrate slice storage barrel assembly, clamping assemblies for clamping the silicon carbide substrate slice in the processing area are arranged around the processing area, the clamping devices and the grinding devices automatically give way for the feeding process, the clamping devices automatically clamp after the feeding is finished, the grinding devices automatically feed and grind, and finally, during the next feeding, the ground silicon carbide substrate slice is automatically sent out, and the integrated linkage automatic processing is realized, so that the investment of manpower and material resources is reduced.
Description
Technical Field
The invention relates to semiconductor substrate slice processing equipment, in particular to an automatic loading and unloading ejection structure applied to semiconductor substrate slice processing.
Background
The silicon carbide substrate is formed by cutting a processed and molded silicon carbide substrate block, the cut silicon carbide substrate needs to be manually conveyed to grinding equipment for surface grinding, and the traditional manual loading and unloading results in reduced grinding efficiency, so that the production efficiency of the semiconductor substrate is seriously affected, and a linkage mechanical structure with automatic loading, clamping, automatic feeding, grinding and automatic unloading and ejection needs to be provided.
Accordingly, further improvements are needed in existing semiconductor substrate sheet processing equipment.
Disclosure of Invention
The invention aims to provide an automatic loading and unloading ejection structure applied to processing of semiconductor substrate sheets, which can automatically feed, clamp, automatically feed, grind and automatically discharge and eject.
In order to achieve the above purpose, the present invention adopts the following scheme:
the automatic loading and unloading ejection structure comprises a base, wherein a conveying channel for conveying silicon carbide substrate sheets is arranged on the base, a processing area is arranged on the conveying channel, a silicon carbide substrate sheet storage barrel assembly is arranged on one side of the processing area, a pushing assembly for ejecting the silicon carbide substrate sheets in the silicon carbide substrate sheet storage barrel assembly to the processing area is connected to the conveying channel on one side of the silicon carbide substrate sheet storage barrel assembly, clamping assemblies for clamping the silicon carbide substrate sheets in the processing area are arranged around the processing area, and a lifting grinding assembly is arranged above the conveying channel and connected with the silicon carbide substrate sheet storage barrel assembly; the pushing assembly is connected with a push rod motor assembly capable of driving the pushing assembly to conduct reciprocating pushing action.
A first linkage assembly for driving the lifting grinding assembly to rise when the silicon carbide substrate sheet is pushed out by the pushing assembly is arranged between the pushing assembly and the lifting grinding assembly;
and a second linkage assembly for driving the clamping assembly to automatically open and unlock when the silicon carbide substrate slice is pushed out by the pushing assembly is arranged between the pushing assembly and the clamping assembly.
Further, the conveying channel comprises a support arranged on the base, a conveying plate is arranged on the support, side baffles are arranged on two sides of the conveying plate, and an output channel is arranged on one side of the conveying plate.
Further, the silicon carbide substrate slice storage barrel assembly comprises a storage barrel arranged above the conveying plate, a connecting plate is arranged between the storage barrel and the side wall of the conveying plate, an opening is arranged at the lower end of the storage barrel, and a pushing gap area is arranged between the lower surface of the storage barrel and the upper surface of the conveying plate.
Further, the pushing assembly comprises a guide hole structure arranged on the conveying plate, a guide rod is movably arranged in the guide hole structure, and a pushing plate is arranged at one end, close to the opening, of the guide rod.
Further, the thickness dimension of the push plate is equal to the dimension between the lower surface of the storage tub and the upper surface of the conveying plate;
the push plate is provided with an arc notch near the surface of one side of the opening.
Further, the clamping assembly comprises a plurality of guide rails which are arranged on the conveying plate around the center circumference of the processing area, clamping rods are movably arranged in the guide rails, arc-shaped clamping rods used for clamping the outer wall of the circumference of the silicon carbide substrate sheet are arranged at the inner ends of the clamping rods, and the path extension lines of the guide rails are coincident with the center position of the processing area.
Further, the lifting grinding assembly comprises a transverse plate arranged on the outer wall of the silicon carbide substrate storage barrel assembly, a vertical track is arranged on the upper surface of the transverse plate, a grinding motor mounting seat is movably arranged in the vertical track, a grinding motor with a downward output end is arranged in the grinding motor mounting seat, a grinding wheel is arranged at the output end of the grinding motor, and the grinding wheel is vertically aligned to the upper part of the processing area.
Further, the first linkage assembly comprises a first hinge shaft arranged on the side wall of the grinding motor mounting seat, a second hinge shaft is arranged on the side wall of the guide rod, and a first connecting rod is hinged between the first hinge shaft and the second hinge shaft.
Further, the second linkage assembly comprises a vertical guide shaft arranged on the lower surface of the conveying plate, a vertical guide sleeve is sleeved outside the vertical guide shaft, a first hinging seat is arranged at the outer end of the clamping rod, a second connecting rod is hinged to the first hinging seat, a second hinging seat is hinged to the lower end of the second connecting rod, the second hinging seat is fixedly connected with the surface of the vertical guide sleeve, a third hinging seat is arranged on the outer wall of the vertical guide sleeve, a connecting vertical rod is arranged at the outer end of the guide rod in a downward extending mode, a fourth hinging seat is arranged on the connecting vertical rod, and a third connecting rod is hinged between the third hinging seat and the fourth hinging seat.
In summary, compared with the prior art, the invention has the following beneficial effects:
the invention solves the defects of the existing semiconductor substrate slice processing equipment, and has the advantages that the structure arrangement of the invention has the following advantages that the automatic loading and unloading actions are realized, in the loading process, the clamping device and the grinding device automatically give way for the loading process, the clamping device automatically clamps after the loading is finished, the grinding device automatically feeds and grinds, finally, the grinded silicon carbide substrate slice is automatically sent out when the next loading is finished, the integrated linkage automatic processing is realized, the investment of manpower and material resources is reduced, the grinding efficiency of the silicon carbide substrate slice is improved, the structure arrangement is reasonable, the structure is simple, and the use is convenient.
Drawings
FIG. 1 is one of the perspective views of the present invention;
FIG. 2 is a second perspective view of the present invention;
FIG. 3 is a front view of the present invention;
FIG. 4 is a schematic diagram of the internal structure of the present invention;
FIG. 5 is a cross-sectional view taken along line A-A of FIG. 4;
FIG. 6 is a second schematic view of the internal structure of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to FIGS. 1-6, the present invention provides
The automatic loading and unloading ejection structure comprises a base 1, wherein a conveying channel 2 for conveying silicon carbide substrate sheets is arranged on the base 1, a processing area 3 is arranged on the conveying channel 2, a silicon carbide substrate sheet storage barrel assembly 4 is arranged on one side of the processing area 3, a pushing assembly 5 for ejecting the silicon carbide substrate sheets in the silicon carbide substrate sheet storage barrel assembly 4 to the processing area 3 is connected to the conveying channel 2 on one side of the silicon carbide substrate sheet storage barrel assembly 4, clamping assemblies 6 for clamping the silicon carbide substrate sheets in the processing area 3 are arranged around the processing area 3, and a lifting grinding assembly 7 is arranged above the conveying channel 2 and connected with the silicon carbide substrate sheet storage barrel assembly 4;
a first linkage assembly 8 which drives the lifting grinding assembly 7 to lift when the silicon carbide substrate sheet is pushed out by the pushing assembly 5 is arranged between the pushing assembly 5 and the lifting grinding assembly 7;
a second linkage assembly 9 which drives the clamping assembly 6 to automatically open and unlock when the silicon carbide substrate sheet is pushed out by the pushing assembly 5 is arranged between the pushing assembly 5 and the clamping assembly 6;
structural principle:
before working, stacking cut bulk semiconductor substrate slice silicon carbide substrate slice materials in the silicon carbide substrate slice storage barrel assembly 4 for storage and processing, wherein a push rod motor assembly capable of driving the push assembly 5 to carry out reciprocating push action is connected to the push assembly 5, the push rod motor assembly drives the silicon carbide substrate slice materials at the bottom of the push assembly 5 to be pushed out into the position of the processing area 3, and when the push assembly 5 is reset, the first linkage assembly 8 drives the lifting grinding assembly 7 to carry out grinding work towards the upper surface of the silicon carbide substrate slice materials on the processing area 3, and meanwhile drives the second linkage assembly 9 to drive the clamping assembly 6 to clamp the outer wall of the silicon carbide substrate slice materials on the processing area 3 for grinding;
the pushing component 5 pushes out the silicon carbide substrate sheet which is ground before to be discharged in the process of pushing out the next silicon carbide substrate sheet material.
The conveying channel 2 of the present invention comprises a bracket 201 arranged on the base 1, a conveying plate 202 is arranged on the bracket 201, side baffles 203 are arranged on two sides of the conveying plate 202, and an output channel 204 is arranged on one side of the conveying plate 202.
The silicon carbide substrate storage barrel assembly 4 comprises a storage barrel 401 arranged above a conveying plate 202, a connecting plate 402 is arranged between the storage barrel 401 and the side wall of the conveying plate 202, an opening 403 is arranged at the lower end of the storage barrel 401, and a pushing gap area 404 is arranged between the lower surface of the storage barrel 401 and the upper surface of the conveying plate 202.
The pushing assembly 5 of the present invention includes a guiding hole structure 501 disposed on the conveying plate 202, a guiding rod 502 is movably disposed in the guiding hole structure 501, and a pushing plate 503 is disposed at one end of the guiding rod 502 near the opening 403.
The thickness dimension of the push plate 503 is equal to the dimension between the lower surface of the storage barrel 401 and the upper surface of the conveying plate 202;
the pushing plate 503 is provided with an arc notch 100 near a side surface of the opening 403.
The clamping assembly 6 comprises a plurality of guide rails 601 which are all arranged on the conveying plate 202 around the central circumference of the processing area 3, clamping rods 602 are movably arranged in the guide rails 601, arc-shaped clamping rods 603 for clamping the circumferential outer wall of the silicon carbide substrate sheet are arranged at the inner ends of the clamping rods 602, and the path extension lines of the guide rails 601 are overlapped with the central position of the processing area 3.
The lifting grinding assembly 7 comprises a transverse plate 701 arranged on the outer wall of the silicon carbide substrate storage barrel assembly 4, wherein a vertical track 702 is arranged on the upper surface of the transverse plate 701, a grinding motor mounting seat 703 is movably arranged in the vertical track 702, a grinding motor 704 with a downward output end is arranged in the grinding motor mounting seat 703, a grinding wheel 705 is arranged at the output end of the grinding motor 704, and the grinding wheel 705 is vertically aligned above the processing area 3.
The first linkage assembly 8 of the present invention includes a first hinge shaft 801 provided on a side wall of the grinding motor mount 703, a second hinge shaft 802 provided on a side wall of the guide rod 502, and a first link 803 hinged between the first hinge shaft 801 and the second hinge shaft 802.
The second linkage assembly 9 of the present invention includes a vertical guide shaft 901 disposed on the lower surface of the conveying plate 202, a vertical guide sleeve 909 is sleeved outside the vertical guide shaft 901, a first hinge seat 902 is disposed at the outer end of the clamping rod 602, a second link 903 is hinged on the first hinge seat 902, a second hinge seat 904 is hinged at the lower end of the second link 903, the second hinge seat 904 is fixedly connected with the surface of the vertical guide sleeve 909, a third hinge seat 905 is disposed on the outer wall of the vertical guide sleeve 909, a connecting vertical rod 906 extends downward from the outer end of the guide rod 502, a fourth hinge seat 907 is disposed on the connecting vertical rod 906, and a third link 908 is hinged between the third hinge seat 905 and the fourth hinge seat 907.
While there has been shown and described what is at present considered to be the fundamental principles and the main features of the invention and the advantages thereof, it will be understood by those skilled in the art that the present invention is not limited to the foregoing embodiments, but is described in the foregoing description merely illustrates the principles of the invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention as hereinafter claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (2)
1. The utility model provides an be applied to automatic handling ejection structure of semiconductor substrate slice processing, includes base (1), its characterized in that: the silicon carbide substrate conveying device comprises a base (1), wherein a conveying channel (2) for conveying silicon carbide substrate sheets is arranged on the base (1), a processing area (3) is arranged on the conveying channel (2), a silicon carbide substrate sheet storage barrel assembly (4) is arranged on one side of the processing area (3), a pushing assembly (5) for pushing out the silicon carbide substrate sheets in the silicon carbide substrate sheet storage barrel assembly (4) to the processing area (3) is connected to the conveying channel (2) on one side of the silicon carbide substrate sheet storage barrel assembly (4), clamping assemblies (6) for clamping the silicon carbide substrate sheets in the processing area (3) are arranged around the processing area (3), a lifting grinding assembly (7) is arranged above the conveying channel (2) and connected with the silicon carbide substrate sheet storage barrel assembly (4), and a push rod motor assembly capable of driving the pushing assembly (5) to conduct reciprocating pushing actions is connected to the pushing assembly (5);
a first linkage assembly (8) for driving the lifting grinding assembly (7) to rise when the silicon carbide substrate sheet is pushed out by the pushing assembly (5) is arranged between the pushing assembly (5) and the lifting grinding assembly (7);
a second linkage assembly (9) for driving the clamping assembly (6) to automatically open and unlock when the silicon carbide substrate sheet is pushed out by the pushing assembly (5) is arranged between the pushing assembly (5) and the clamping assembly (6);
the conveying channel (2) comprises a support (201) arranged on the base (1), a conveying plate (202) is arranged on the support (201), side baffles (203) are arranged on two sides of the conveying plate (202), and an output channel (204) is arranged on one side of the conveying plate (202);
the silicon carbide substrate storage barrel assembly (4) comprises a storage barrel (401) arranged above the conveying plate (202), a connecting plate (402) is arranged between the storage barrel (401) and the side wall of the conveying plate (202), an opening (403) is formed in the lower end of the storage barrel (401), and a pushing gap area (404) is formed between the lower surface of the storage barrel (401) and the upper surface of the conveying plate (202);
the pushing assembly (5) comprises a guide hole structure (501) arranged on the conveying plate (202), a guide rod (502) is movably arranged in the guide hole structure (501), and a push plate (503) is arranged at one end, close to the opening (403), of the guide rod (502);
the clamping assembly (6) comprises a plurality of guide rails (601) which are all arranged on the conveying plate (202) around the center circumference of the processing area (3), clamping rods (602) are movably arranged in the guide rails (601), arc-shaped clamping rods (603) used for clamping the outer wall of the circumference of the silicon carbide substrate are arranged at the inner ends of the clamping rods (602), and the path extension lines of the guide rails (601) are overlapped with the center position of the processing area (3);
the lifting grinding assembly (7) comprises a transverse plate (701) arranged on the outer wall of the silicon carbide substrate storage barrel assembly (4), a vertical track (702) is arranged on the upper surface of the transverse plate (701), a grinding motor mounting seat (703) is movably arranged in the vertical track (702), a grinding motor (704) with a downward output end is arranged in the grinding motor mounting seat (703), a grinding wheel (705) is arranged at the output end of the grinding motor (704), and the grinding wheel (705) is vertically aligned above the processing area (3);
the first linkage assembly (8) comprises a first hinge shaft (801) arranged on the side wall of the grinding motor mounting seat (703), a second hinge shaft (802) is arranged on the side wall of the guide rod (502), and a first connecting rod (803) is hinged between the first hinge shaft (801) and the second hinge shaft (802);
the second linkage assembly (9) comprises a vertical guide shaft (901) arranged on the lower surface of the conveying plate (202), a vertical guide sleeve (909) is sleeved outside the vertical guide shaft (901), a first hinging seat (902) is arranged at the outer end of the clamping rod (602), a second connecting rod (903) is hinged to the first hinging seat (902), a second hinging seat (904) is hinged to the lower end of the second connecting rod (903), the second hinging seat (904) is fixedly connected with the surface of the vertical guide sleeve (909), a third hinging seat (905) is arranged on the outer wall of the vertical guide sleeve (909), a connecting vertical rod (906) is arranged at the outer end of the guide rod (502) in a downward extending mode, a fourth hinging seat (907) is arranged on the connecting vertical rod (906), and a third connecting rod (908) is hinged between the third hinging seat (905) and the fourth hinging seat (907).
2. The automatic loading and unloading ejection structure applied to processing of semiconductor substrate sheets according to claim 1, wherein: the thickness dimension of the pushing plate (503) is equal to the dimension between the lower surface of the storage barrel (401) and the upper surface of the conveying plate (202);
an arc-shaped notch (100) is formed in the surface of one side, close to the opening (403), of the push plate (503).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111469456.9A CN114310530B (en) | 2021-12-03 | 2021-12-03 | Automatic loading and unloading ejection structure applied to processing of semiconductor substrate slice |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111469456.9A CN114310530B (en) | 2021-12-03 | 2021-12-03 | Automatic loading and unloading ejection structure applied to processing of semiconductor substrate slice |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114310530A CN114310530A (en) | 2022-04-12 |
| CN114310530B true CN114310530B (en) | 2023-10-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111469456.9A Active CN114310530B (en) | 2021-12-03 | 2021-12-03 | Automatic loading and unloading ejection structure applied to processing of semiconductor substrate slice |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109227235A (en) * | 2018-09-29 | 2019-01-18 | 芜湖威雕自动化设备有限公司 | A kind of automatic grinding machine for carving sharp knife |
| CN210281672U (en) * | 2019-07-23 | 2020-04-10 | 广东盈浩工艺制品有限公司 | Manufacturing device for precise ceramic bearing |
| CN210467793U (en) * | 2019-08-06 | 2020-05-05 | 华侨大学 | Automatic workpiece conveying device |
| CN111299852A (en) * | 2019-12-05 | 2020-06-19 | 黄国强 | Annular part elastic gap automatic processing equipment |
| JP2020157440A (en) * | 2019-03-27 | 2020-10-01 | 株式会社東京精密 | Substrate processing device |
| CN112720032A (en) * | 2020-12-29 | 2021-04-30 | 襄阳鼎超机械制造有限公司 | Automatic feeding device for end face machining |
-
2021
- 2021-12-03 CN CN202111469456.9A patent/CN114310530B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109227235A (en) * | 2018-09-29 | 2019-01-18 | 芜湖威雕自动化设备有限公司 | A kind of automatic grinding machine for carving sharp knife |
| JP2020157440A (en) * | 2019-03-27 | 2020-10-01 | 株式会社東京精密 | Substrate processing device |
| CN210281672U (en) * | 2019-07-23 | 2020-04-10 | 广东盈浩工艺制品有限公司 | Manufacturing device for precise ceramic bearing |
| CN210467793U (en) * | 2019-08-06 | 2020-05-05 | 华侨大学 | Automatic workpiece conveying device |
| CN111299852A (en) * | 2019-12-05 | 2020-06-19 | 黄国强 | Annular part elastic gap automatic processing equipment |
| CN112720032A (en) * | 2020-12-29 | 2021-04-30 | 襄阳鼎超机械制造有限公司 | Automatic feeding device for end face machining |
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| CN114310530A (en) | 2022-04-12 |
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