CN114309954A - Laser spot splicing method and laser equipment - Google Patents
Laser spot splicing method and laser equipment Download PDFInfo
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- CN114309954A CN114309954A CN202111644386.6A CN202111644386A CN114309954A CN 114309954 A CN114309954 A CN 114309954A CN 202111644386 A CN202111644386 A CN 202111644386A CN 114309954 A CN114309954 A CN 114309954A
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Abstract
The invention relates to the technical field of laser processing, in particular to a laser spot splicing method and laser equipment. The laser spot splicing method comprises the following steps: and projecting light spots output by the optical heads respectively connected with the plurality of lasers on a focal plane, and adjusting the positions and/or the optical axis angles of the optical heads to splice the plurality of light spots. The optical heads are combined for use, so that light spots are spliced, the requirements of large-area laser surface modification treatment on high power and large light spots of laser are met under the condition that an internal cooling system and a protection level of the optical head mirror group are not increased, the energy loss caused by multi-scanning lap joint in the single-optical-head large-area laser surface modification treatment is avoided, the energy consumption is reduced, and the processing efficiency and the processing quality are improved. Can be finished at one time without overlapping in the large-area laser surface modification treatment.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a laser spot splicing method and laser equipment.
Background
At present, the myriawatt high-power laser is widely applied to laser surface modification treatment (including laser glazing, laser remelting, laser quenching, laser alloying, laser coating and the like), and taking laser cladding as an example, a laserline semiconductor myriawatt laser is used for optical fiber transmission, the focusing spot is 28 x 3mm, and strip-shaped laser cladding with the width of 28mm can be carried out. In order to further improve the cladding width, a laser with higher power is needed, the output power of the laser is improved due to the special structure of the semiconductor laser stack array, so that the quality of light beams is poor, and the requirement on the energy distribution uniformity of focusing spots in the laser surface modification treatment cannot be met. In addition, the requirement of high-power laser output on an internal cooling system and a protection level of the lens group is higher, the laserline lens group series is specially designed for industrial application, and the maximum laser power which can be borne by the laserline lens group during long-time work is 20000 w.
Disclosure of Invention
The first purpose of the invention is to provide a laser spot splicing method, which can solve the problems in the use process of high power and large spots;
a second object of the present invention is to provide a laser apparatus which performs workpiece processing using the laser spot stitching method as described above.
The invention provides a laser spot splicing method, which comprises the following steps:
and projecting light spots output by the optical heads respectively connected with the plurality of lasers on a focal plane, and adjusting the positions and/or the optical axis angles of the optical heads to splice the plurality of light spots.
Preferably, the splicing of the multiple light spots comprises overlapping, or edge joining of the light spots.
Preferably, the light spot output by the optical head is a rectangular light spot, and a plurality of light spots are spliced along the length direction of the light spot.
Preferably, the light spots output by the optical head are rectangular light spots, and the plurality of light spots are spliced along the width direction of the light spots.
Preferably, the centers of a plurality of the light spots are distributed on the same straight line.
Preferably, the optical heads are mounted on the mounting platform, and among the plurality of optical heads, part of the optical heads are intermediate optical heads;
the middle optical head is vertically arranged with the mounting platform;
the focal plane is perpendicular to the optical axis of the intermediate optical head, and the focal point of the intermediate optical head is located on the focal plane.
Preferably, among the plurality of heads, a part of the heads are side heads;
the side optical heads are distributed on two sides of the spliced light spots, and optical axes of the side optical heads are vertically intersected with the central line of the spliced light spots.
A laser device comprises a plurality of lasers, each laser is connected with an optical head;
the laser equipment processes the workpiece by adopting the laser spot splicing method.
Preferably, the outer contour of the optical head is a cylinder or a square cylinder.
Preferably, the laser apparatus further comprises a mounting platform on which the optical head is disposed.
Has the advantages that:
the optical heads are combined for use, so that light spots are spliced, the requirements of large-area laser surface modification treatment on high power and large light spots of laser are met under the condition that an internal cooling system and a protection level of the optical head mirror group are not increased, the energy loss caused by multi-scanning lap joint in the single-optical-head large-area laser surface modification treatment is avoided, the energy consumption is reduced, and the processing efficiency and the processing quality are improved. Can be finished at one time without overlapping in the large-area laser surface modification treatment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic view (top view) of a mounting position of a spot length splicing optical head according to an embodiment of the present invention;
FIG. 2 is a left side view of an optical head mounting position according to an embodiment of the present invention;
fig. 3 is a schematic view (top view) of a mounting position of a spot width splicing optical head according to an embodiment of the present invention;
fig. 4 is a left side view schematically illustrating an installation position according to an embodiment of the present invention.
Description of reference numerals:
in the figure, a rectangular frame represents a mounting platform, circles with diameters of 80mm are respectively represented by 6 groups of optical heads on the mounting surface, a small circle in a large circle in the figure 1 represents a focusing mirror of the optical heads, H represents focused beams (only two groups of focused beams are drawn, and the rest are omitted), D represents rectangular light spots of the focused beams on a focal plane, and is respectively corresponding to 6 optical heads, and f is a focal length.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. Furthermore, the terms "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1, the present embodiment provides a laser spot splicing method, which includes the following steps:
and projecting light spots output by the optical heads respectively connected with the plurality of lasers on a focal plane, and adjusting the positions and/or the optical axis angles of the optical heads to splice the plurality of light spots.
In the embodiment, the light spots are spliced by combining a plurality of existing optical heads, the requirements of large-area laser surface modification treatment on high power and large light spots of laser are met under the condition that an internal cooling system and a protection level of an optical head lens group are not increased, the energy loss caused by multi-scanning lap joint in single-head large-area laser surface modification treatment is avoided, the energy consumption is reduced, and the processing efficiency and the processing quality are improved. Can be finished at one time without overlapping in the large-area laser surface modification treatment.
Can be finished at one time without overlapping in the large-area laser surface modification treatment. The manufacturing of the linear light spot optical head such as the laser surface modified wear-resisting plate adopts a laser light spot large-width splicing method, so that a surface wear-resisting layer has no overlapping belt, the depths of an alloying layer and a quenching layer are uniform, the thickness of a cladding layer of the laser cladding wear-resisting plate can be improved as much as possible without the overlapping belt, and the defects of inclusion, cracks and the like caused by the overlapping of the cladding layer are avoided. The linear spot optical head improves the width of a single laser processing track, reduces the lapping times, but reduces the power density of the spot due to the increase of the length of the spot, and has limited application range. For example, 10000w laser is matched with two laserlineOTS line light spot optical heads, the focal length is 600mm, the light spot is 135 x 1.0mm, the power density is 74w/mm2 at the maximum, and the light spot width is 1mm, which is not suitable for laser cladding. The invention can be used in the fields of laser surface modification treatment, laser cleaning and the like.
The splicing of the multiple light spots comprises light spot overlapping, lapping or edge connection of the light spots. By spot coincidence is meant that multiple spots are focused at the same location. By overlapping is meant that there is a partial overlap between the spots. The edge connection of the spots refers to the portions where the spots are connected but do not overlap. The light spot splicing mode can meet the requirements of different laser processing on the width of the light spot and the surface power density.
In the present embodiment, two ways of splicing the light spots are provided.
The first method is as follows: the light spots output by the optical head are rectangular light spots, and the plurality of light spots are spliced along the length direction of the light spots. The light spots are spliced along the length direction and are arranged in sequence, and the adjacent light spots are connected but not overlapped.
For example, rectangular light spots output by the optical heads respectively connected with the n lasers are spliced according to the length direction, the total power of the spliced light spots is n times of that of a single optical head, the length of each light spot is n times of that of a single optical head, the width of each light spot is unchanged, and the power density of each light spot is unchanged.
The light spots output by the optical head are rectangular light spots, and the plurality of light spots are spliced along the width direction of the light spots.
For example, linear light spots output by optical heads respectively connected with n lasers are spliced according to the width direction, the total laser power is n times of that of a single laser, the length of the spliced light spots is unchanged, the width is n times of that of the single laser, the linear power density of the light spots is n times of that of the single laser, and the width of the light spots can be adjusted between the width of the single laser and the width of the n times.
In the two light spot splicing methods, the centers of the plurality of light spots are distributed on the same straight line.
The optical heads are mounted on the mounting platform, and among the plurality of optical heads, some of the optical heads are intermediate optical heads. The middle optical head is arranged perpendicular to the mounting platform.
The focal plane is perpendicular to the optical axis of the intermediate optical head, and the focal point of the intermediate optical head is located on the focal plane.
Among the plurality of optical heads, a part of the optical heads are side optical heads.
The side optical heads are distributed on two sides of the spliced light spots, and optical axes of the side optical heads are vertically intersected with the central line of the spliced light spots. In specific application, the plane where the spliced light spots are located can be translated along the normal direction of the focal plane according to defocusing requirements.
The above-mentioned middle optical head and side optical head are only for distinguishing the positions of the optical heads, and are not intended to limit the types, positions, etc. of the optical heads. The mutual interference between the optical heads can be avoided through the arrangement mode of the optical heads.
The method for splicing the multiple light spots can be length splicing, width splicing or a mixed splicing mode of both width splicing and length splicing, for example, two light spots 135 x 2.0mm are obtained by splicing two light spots with two widths, and then the light spots are spliced along the length, and finally the light spots 270 x 2.0mm are obtained.
In this embodiment, there is also provided a laser apparatus including a plurality of lasers, each laser being connected to one optical head.
The laser equipment processes the workpiece by adopting the laser spot splicing method.
The external profile of the optical head is a cylinder or a square cylinder. Of course, the shape of the optical head can be adjusted as desired, or optical heads of different shapes can be used in combination.
The laser apparatus further includes a mounting platform on which the optical head is disposed.
For further description of the laser spot splicing method and the laser device, this embodiment also provides a specific implementation of the splicing method, which is specifically described as follows:
implementation mode one
Taking six groups of laserline10000w semiconductor laser fiber transmission laser head light spot splicing as an example, the diameter of the light head is 70mm, the diameter of the collimated light beam is 35.64mm, the focal length f is 500mm, and the size of the focusing rectangular light spot is 28 x 3 mm. The head positions are arranged as shown in fig. 1. In the figure, a rectangular frame represents an installation platform, circles with diameters of 80mm, namely, circles with diameters of 6 groups of optical heads, namely, circles with diameters of two groups of optical heads, namely, circles with diameters of 80mm, represent positions of the optical heads on an installation surface, small circles with diameters of two groups of optical heads, H represent focused beams (only two groups of focused beams are drawn, and the rest are omitted), D represents rectangular light spots of the focused beams on a focal plane, and the numbers of the rectangular light spots are 1, 2, 3, 4, 5 and 6, and correspond to the 6 optical heads respectively to form L3 mm splicing light spots, wherein L is 28mm and 168 mm. The optical heads at the middle line are perpendicular to the mounting platform, and the optical axes of the optical heads at two sides of the middle line are perpendicular to the central line of the spliced light spot and do not interfere with each other under the size shown in the figure (figure 1 and figure 2).
Second embodiment
2 groups of laser lineOTS-5 semiconductor optical fiber transmission laser head linear light spots are spliced, the focal length f is 500mm, and the linear light spots 135 are 1.0 mm. The head positions are arranged as shown in fig. 3. In the figure, a rectangular frame represents a mounting platform, circles marked with numbers of (i) and (ii) respectively represent the positions of 2 groups of optical heads on the mounting platform, a small circle in a large circle represents a focusing mirror of the optical heads, H represents a focused light beam, D represents a rectangular light spot of the focused light beam at a focal plane, and the numbers of (1) and (2) respectively correspond to the optical heads at the positions of (i) and (ii) to form a 135 x 2.0mm spliced light spot.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A laser spot splicing method is characterized by comprising the following steps:
and projecting light spots output by the optical heads respectively connected with the plurality of lasers on a focal plane, and adjusting the positions and/or the optical axis angles of the optical heads to splice the plurality of light spots.
2. The laser spot splicing method according to claim 1, wherein the splicing of the plurality of spots comprises spot overlapping, lapping, or edge joining of the spots.
3. The laser spot splicing method according to claim 2, wherein the spot output by the optical head is a rectangular spot, and a plurality of spots are spliced along the length direction of the spot.
4. The laser spot splicing method according to claim 2, wherein the spot output by the optical head is a rectangular spot, and a plurality of spots are spliced in the spot width direction.
5. The laser spot splicing method according to claim 3 or 4, wherein centers of the plurality of spots are distributed on the same straight line.
6. The laser spot splicing method according to claim 5, wherein the optical heads are mounted on a mounting platform, and among the plurality of optical heads, some of the optical heads are intermediate optical heads;
the middle optical head is vertically arranged with the mounting platform;
the focal plane is perpendicular to the optical axis of the intermediate optical head, and the focal point of the intermediate optical head is located on the focal plane.
7. The laser spot splicing method according to claim 6, wherein, among the plurality of optical heads, some of the optical heads are side optical heads;
the side optical heads are distributed on two sides of the spliced light spots, and optical axes of the side optical heads are vertically intersected with the central line of the spliced light spots.
8. A laser device is characterized by comprising a plurality of lasers, wherein each laser is connected with an optical head;
the laser device processes a workpiece by using the laser spot splicing method as claimed in any one of claims 1 to 7.
9. Laser device as claimed in claim 8, characterized in that the outer contour of the optical head is a cylinder or a square cylinder.
10. A laser device as claimed in claim 8, characterized in that the laser device further comprises a mounting platform on which the optical head is arranged.
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| CN202111644386.6A CN114309954A (en) | 2021-12-30 | 2021-12-30 | Laser spot splicing method and laser equipment |
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| CN202111644386.6A CN114309954A (en) | 2021-12-30 | 2021-12-30 | Laser spot splicing method and laser equipment |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107065215A (en) * | 2017-04-17 | 2017-08-18 | 西安中科中美激光科技有限公司 | Expansible array fibre output laser |
| US20180019576A1 (en) * | 2016-07-14 | 2018-01-18 | BWT Beijing Ltd. | Laser beam combination apparatus |
| CN109193319A (en) * | 2018-11-22 | 2019-01-11 | 深圳活力激光技术有限公司 | A kind of solid laser pump source and pumping configuration |
| CN208752316U (en) * | 2018-10-11 | 2019-04-16 | 上海高意激光技术有限公司 | Semiconductor laser space beam merging apparatus |
-
2021
- 2021-12-30 CN CN202111644386.6A patent/CN114309954A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180019576A1 (en) * | 2016-07-14 | 2018-01-18 | BWT Beijing Ltd. | Laser beam combination apparatus |
| CN107065215A (en) * | 2017-04-17 | 2017-08-18 | 西安中科中美激光科技有限公司 | Expansible array fibre output laser |
| CN208752316U (en) * | 2018-10-11 | 2019-04-16 | 上海高意激光技术有限公司 | Semiconductor laser space beam merging apparatus |
| CN109193319A (en) * | 2018-11-22 | 2019-01-11 | 深圳活力激光技术有限公司 | A kind of solid laser pump source and pumping configuration |
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