CN114302621A - Heat radiating fin, heat radiating structure and processing method - Google Patents

Abstract

The application provides a radiating fin, a radiating structure and a processing method, wherein a heat pipe groove used for containing a heat conducting pipe is formed in the radiating fin, a plurality of bosses used for riveting the heat conducting pipe are arranged on two sides of the heat pipe groove, and the plurality of bosses comprise a first type boss higher than the upper surface of the radiating fin and a second type boss higher than the lower surface of the radiating fin. The heat pipe grooves are formed in the radiating fins, the bosses are arranged on the two sides of the heat pipe grooves, the heat conducting pipes can be riveted in the radiating fins, and the whole thickness is kept to be the thickness of the radiating fins, so that the whole thickness of the radiating structure is thinner, and meanwhile, the radiating performance is good.

Description

Heat radiating fin, heat radiating structure and processing method

Technical Field

The invention relates to a heat dissipation technology, in particular to a heat dissipation sheet, a heat dissipation structure and a processing method.

Background

With the improvement of living standard and fashion aesthetic standard of people, the product is light, thin, short and small, and becomes the development trend of various scientific and technical products. In this context, the heat sink is thinner and thinner, and the requirement for heat dissipation performance is higher and higher.

At present, the light and thin radiating fins in the market mainly adopt the measures of ultrathin heat conduction pipes, VC liquid cooling radiation and the like, and the VC liquid cooling radiation has complex manufacturing process and high cost. And the welding defect is increased virtually in the welding process of the ultrathin heat conduction pipe and the radiating fin, so that the radiating effect is influenced.

The applicant's prior patent CN202011435953.2 provides a seamless rolling riveting process and assembly structure for a heat sink and a heat conducting pipe, wherein an inner groove is formed on a bottom plate, and cladding structures are arranged on two sides of the inner groove, so that the heat conducting pipe can be clad and attached after rolling, and a good heat conducting effect is achieved. However, the thickness of the heat sink is large, and the heat conducting pipe is difficult to be fixed by the existing heat radiating thin sheet with the structure.

Disclosure of Invention

The invention aims to provide a radiating fin, a radiating structure and a processing method which are simpler in processing technology and thinner in thickness.

The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

According to an aspect of the present invention, a heat sink is provided, in which a heat pipe groove for accommodating a heat pipe is formed, a plurality of bosses for riveting the heat pipe are disposed on two sides of the heat pipe groove, and the plurality of bosses include a first-type boss higher than an upper surface of the heat sink and a second-type boss higher than a lower surface of the heat sink.

In one embodiment, the bosses are symmetrically arranged on two sides of the heat pipe groove.

In one embodiment, the first type of projections and the second type of projections are staggered along the length direction of the groove.

In one embodiment, the boss is formed by stamping.

In one embodiment, the boss is inclined toward the groove.

In one embodiment, the width of the root of the boss is greater than the width of the end of the boss.

According to a second aspect of the present invention, a heat pipe groove for accommodating a heat pipe is formed in the heat sink, a plurality of bosses for riveting the heat pipe are disposed on two sides of the heat pipe groove, and a supporting structure extending toward the center of the heat pipe groove is disposed on a side wall of the heat pipe groove near a lower surface of the heat sink.

In one embodiment, a surface of the supporting structure contacting the heat pipe is a curved surface having a shape close to that of the surface of the heat pipe.

According to a third aspect of the present invention, there is provided a heat dissipation structure comprising the heat sink as described in the first or second aspect, and further comprising a heat pipe embedded in the heat pipe groove, the heat pipe being riveted with the heat sink, the thickness of the heat dissipation structure at the heat pipe being the same as the thickness of the heat sink.

According to a fourth aspect of the present invention, there is provided a method for processing a heat dissipation structure, including: and placing the heat conduction pipe into a heat pipe groove of the radiating fin, rolling the boss on the radiating fin to rivet the heat conduction pipe with the radiating fin, and enabling the thickness of the radiating structure at the heat conduction pipe to be the same as that of the radiating fin.

The embodiment of the invention has the beneficial effects that: the heat pipe grooves are formed in the radiating fins, the bosses are arranged on the two sides of the heat pipe grooves, the heat conducting pipes can be riveted in the radiating fins, and the whole thickness is kept to be the thickness of the radiating fins, so that the whole thickness of the radiating structure is thinner, and meanwhile, the radiating performance is good.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

The above features and advantages of the present disclosure will be better understood upon reading the detailed description of embodiments of the disclosure in conjunction with the following drawings. In the drawings, components are not necessarily drawn to scale, and components having similar relative characteristics or features may have the same or similar reference numerals.

FIG. 1 is a top view of a first embodiment of a heat sink of the present application;

FIG. 2 is a front view of a first embodiment of a heat sink of the present application;

FIG. 3 is a schematic of section A-A of FIG. 1;

FIG. 4 is a schematic of section B-B of FIG. 1;

FIG. 5 is a side view of a first embodiment of a heat sink of the present application;

FIG. 6 is a perspective view of a first embodiment of the heat sink of the present application;

fig. 7 is a perspective view (not riveted) of an embodiment of the heat dissipation structure of the present application;

fig. 8 is a perspective view (after riveting) of an embodiment of the heat dissipation structure of the present application;

fig. 9 is a schematic cross-sectional view (not riveted) of a second embodiment of the heat dissipation structure of the present application;

fig. 10 is a schematic cross-sectional view of a second embodiment of the heat dissipation structure of the present application (after riveting);

FIG. 11 is a first schematic cross-sectional view of a possible embodiment of a heat dissipation structure of the present application;

FIG. 12 is a second schematic cross-sectional view of a possible embodiment of a heat dissipation structure of the present application;

FIG. 13 is a third schematic cross-sectional view of a possible embodiment of a heat dissipation structure of the present application;

FIG. 14 is a fourth schematic cross-sectional view of a possible embodiment of a heat dissipation structure of the present application;

wherein: 11-a heat sink; 12-heat pipe tank; 13-bosses of the first type; 14-a second type of boss; 21-a heat sink; 22-a support structure; 23-a boss; 24-heat conducting pipes.

Detailed Description

The invention is described in detail below with reference to the figures and specific embodiments. It is noted that the aspects described below in connection with the figures and the specific embodiments are only exemplary and should not be construed as imposing any limitation on the scope of the present invention.

Example one

As shown in fig. 1 to 6, in the present embodiment, a heat sink 11 is provided, in which a heat pipe groove 12 for accommodating a heat pipe is formed in the heat sink 11, and a plurality of bosses for caulking the heat pipe are provided on both sides of the heat pipe groove 12. In this application, "staking" refers to the manner in which the bosses wrap around a portion of the area of the heat pipe and secure the heat pipe in the heat pipe slots 12. In the present embodiment, the bosses are divided into first-type bosses 13 higher than the upper surface of the heat sink 11 and second-type bosses 14 higher than the lower surface of the heat sink 11. With this configuration, the heat pipe can be covered from the upper and lower sides after the rolling, and the fixing can be achieved.

Compared with the existing welding processing mode, the radiating fin 11 does not need hot processing and only needs rolling processing, so that the processing technology is simplified, and the defects are reduced. The rolled boss is tightly attached to the heat conduction pipe, and the heat conduction performance is good.

The radiating fins can be made of sheet metal sheets, so that the radiating fins have certain plasticity. The heat pipe grooves 12 can be directly punched and formed, and bosses on two sides can be formed by punching and flanging through holes, so that the whole machining process is cold machining.

In this embodiment, the bosses are symmetrically disposed on both sides of the heat pipe slot 12, so that the heat pipe is stressed symmetrically and deformation is reduced. Of course, the bosses may be asymmetrically provided as long as the fixing of the heat conductive pipes can be achieved and the contact can be ensured.

Referring to fig. 5 and 6, in the present embodiment, in addition to the bosses being symmetrically disposed about the heat pipe groove 12, the first-type bosses 13 and the second-type bosses 14 are alternately disposed in the length direction of the groove. The structure can firmly fix the heat conduction pipe and is convenient for stamping.

Fig. 7 and 8 show a heat dissipating structure formed by using the above heat dissipating fin in cooperation with a heat conductive pipe, in which fig. 7 is a state before roll processing, and a boss is raised above the surface of the heat dissipating fin. Fig. 8 shows a state after the rolling process, in which the bosses are pressed into the heat pipe grooves and riveted to the heat transfer pipes. Before the rolling processing, the thickness of the heat conduction pipe is slightly larger than that of the radiating fin, and after the rolling processing, the thickness of the whole radiating structure is the thickness of the radiating fin, so that the thinnest effect is achieved in the thickness.

When the heat dissipation structure is processed, the heat conduction pipe is firstly placed in a heat pipe groove of the heat dissipation sheet, then the boss on the heat dissipation sheet is rolled by the rolling equipment, the heat conduction pipe is riveted with the heat dissipation sheet, and the thickness of the heat conduction pipe after rolling is the same as that of the heat dissipation sheet. The rolling device can refer to the patent CN202022933916.6 previously applied by the applicant, and the device can be changed to be simultaneously rolled on the upper and lower surfaces to be more suitable for the heat dissipation structure in the present application.

Example two

In addition to the first embodiment, as shown in fig. 9 and 10, a boss 23 may be provided on one side of the heat sink 21, and the heat transfer pipe 24 may be supported by the support structure 22 on the other side. The support structure 22 is disposed on the heat pipe slot side wall near the lower surface of the heat sink 21 and extends toward the heat pipe slot center. Preferably, in order to make the heat sink 21 and the heat transfer pipe 24 contact better, the surface of the support structure 22 that contacts the heat transfer pipe may be formed into a curved surface that is close to the surface shape of the heat transfer pipe 24. The support structure 22 can be machined together with the stamping of the heat pipe channel. The structure can also realize the effect of uniform overall thickness after rolling.

On the basis of the first embodiment and the second embodiment, further modification and optimization can be performed. For example, the bosses can be perpendicular to the fin surface (as shown in fig. 11) or can be designed to be inclined toward the grooves (as shown in fig. 12) to make the bosses easier to roll. In order to make the bosses more closely fit with the heat pipes after rolling, the width of the root of each boss may be designed to be larger than the width of the end of each boss, so that the cross section of each boss is close to a wedge shape (as shown in fig. 13 and 14).

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The above description is only a preferred example of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present application should be included in the scope of the present application.

Claims (10)

1. A heat sink, characterized by: the heat pipe is characterized in that a heat pipe groove used for containing a heat conduction pipe is formed in the heat radiating fin, a plurality of bosses used for riveting the heat conduction pipe are arranged on two sides of the heat pipe groove, and the bosses comprise a first boss higher than the upper surface of the heat radiating fin and a second boss higher than the lower surface of the heat radiating fin.

2. The heat sink as recited in claim 1, wherein: the plurality of bosses are symmetrically arranged on two sides of the heat pipe groove.

3. The heat sink as recited in claim 2, wherein: the first type of bosses and the second type of bosses are arranged in a staggered mode along the length direction of the groove.

4. The heat sink according to any one of claims 1 to 3, wherein: the boss is formed by stamping.

5. The heat sink as recited in claim 1, wherein: the boss is inclined towards the groove.

6. The heat sink as recited in claim 1 or 5, wherein: the width of the root part of the boss is larger than the width of the end part of the boss.

7. A heat sink, characterized by: the heat pipe groove is formed in the radiating fin and used for containing a heat conduction pipe, a plurality of bosses used for riveting the heat conduction pipe are arranged on two sides of the heat pipe groove, and a supporting structure extending towards the center of the heat pipe groove is arranged on the side wall of the heat pipe groove and close to the lower surface of the radiating fin.

8. The heat sink as recited in claim 7, wherein: the surface of the bearing structure, which is used for being in contact with the heat conduction pipe, is a curved surface with the shape close to the surface shape of the heat conduction pipe.

9. A heat radiation structure is characterized in that: the heat sink comprises the heat sink as claimed in any one of claims 1 to 8, further comprising a heat pipe embedded in the heat pipe groove, the heat pipe is riveted with the heat sink, and the thickness of the heat dissipation structure at the heat pipe is the same as that of the heat sink.

10. A method for processing a heat dissipation structure is characterized by comprising the following steps: and placing the heat conduction pipe into a heat pipe groove of the radiating fin, rolling the boss on the radiating fin to rivet the heat conduction pipe with the radiating fin, and enabling the thickness of the radiating structure at the heat conduction pipe to be the same as that of the radiating fin.

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