CN110461130B - Mosaic type heat dissipation structure and manufacturing method thereof - Google Patents
Mosaic type heat dissipation structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN110461130B CN110461130B CN201910732872.XA CN201910732872A CN110461130B CN 110461130 B CN110461130 B CN 110461130B CN 201910732872 A CN201910732872 A CN 201910732872A CN 110461130 B CN110461130 B CN 110461130B
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- groove
- fixing piece
- side wall
- fin
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 50
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000000034 method Methods 0.000 claims abstract description 28
- 230000008569 process Effects 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 230000005855 radiation Effects 0.000 claims abstract description 6
- 238000005452 bending Methods 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 10
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 238000010622 cold drawing Methods 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 9
- 238000009957 hemming Methods 0.000 abstract description 8
- 238000001816 cooling Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 239000000956 alloy Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Abstract
The invention discloses an embedded heat dissipation structure, which comprises a substrate, a fixing piece and fins, wherein the substrate is provided with a plurality of heat dissipation holes; the substrate comprises a protruding part which protrudes upwards; the end face, away from the substrate, of the protruding part is inwards recessed to form a groove, the fixing piece is configured to be inserted into the groove, and the side wall surface of the fixing piece is adhered and fixed with the inner wall surface of the groove; the end face, away from the substrate, of the fixing piece is inwards recessed to form a groove, and the opening direction of the groove faces the direction away from the substrate; the fin is configured to be insertable into the groove of the fixing member, and an end surface of one end of the fin inserted into the groove is fitted and fixed with an inner side wall surface of the groove. The heat radiation structure provided by the invention can effectively avoid complex sheet metal processes such as flanging, hemming and the like for compacting the fixed fins, has high dimensional accuracy of parts and is convenient to control; meanwhile, the tight combination and fixation of parts are ensured, and the heat conduction performance of the heat dissipation structure is prevented from being influenced due to the fact that the combination is not tight.
Description
Technical Field
The invention relates to the technical field of electronic element heat dissipation, in particular to an embedded heat dissipation structure and a manufacturing method thereof.
Background
With the progress and development of electronic technology and the increasing demands of people for electronic products, the working efficiency of current electronic devices is continuously improved, and the integration level of various electronic devices and processing devices is also increased and the power density is increased. With the improvement of the efficiency of electronic components, the heat generated during the operation of the electronic components is also increased, and if the heat cannot be timely discharged, the electronic components are easily caused to fail to work or even burn out. Therefore, a heat dissipation structure with higher heat dissipation efficiency is needed.
The electronic component heat dissipation modes commonly used in the prior art are generally forced air cooling and liquid cooling heat dissipation. The forced air cooling mainly radiates heat through the external fan and the extruded aluminum profile radiator, and the radiating efficiency of the forced air cooling is mainly limited by the heat conductivity coefficient of the aluminum profile, so that the radiating requirement of the high-power electronic module with high heat flux density is difficult to meet. The liquid cooling heat dissipation system needs to be additionally provided with a complex liquid cooling system, and in order to ensure that the radiator fins are tightly combined and fixed with the base, complicated metal plate processes such as flanging and hemming are also needed to be carried out on the radiator fins, so that the complexity of the system and the maintenance cost are increased, and the dimensional accuracy of parts is low and difficult to control.
Therefore, in order to overcome the defects of the prior art, a novel damascene heat dissipation structure and a manufacturing method thereof are needed.
Disclosure of Invention
One of the purposes of the invention is to provide an embedded heat radiation structure, which can effectively avoid complex sheet metal processes such as flanging, hemming and the like for compacting fixed fins, has high dimensional accuracy of parts and is convenient to control; meanwhile, the components can be tightly combined and fixed, and the heat conduction performance of the heat dissipation structure is prevented from being influenced due to the fact that the combination is not tight; the structure is simple, the assembly can be fast carried out, the applicability is strong, and the heat dissipation requirements of high heat flux and high power electronic components can be met.
In order to achieve the above-mentioned purpose, the present invention provides an embedded heat dissipation structure, which includes a substrate, a fixing piece and fins; the substrate comprises a protruding part which protrudes upwards; the end face, away from the substrate, of the protruding part is inwards recessed to form a groove, the fixing piece is configured to be inserted into the groove, and the side wall surface of the fixing piece is adhered and fixed with the inner wall surface of the groove; the end face, away from the substrate, of the fixing piece is inwards recessed to form a groove, and the opening direction of the groove faces the direction away from the substrate; the fin is configured to be insertable into the groove of the fixing member, and an end surface of one end of the fin inserted into the groove is fitted and fixed with an inner side wall surface of the groove.
In addition, preferably, the fin comprises an insertion part positioned in the groove and an extension part formed by extending outwards from one end of the insertion part far away from the groove; in the extending direction of the extending part, the extending part comprises a bending structure.
In addition, preferably, two side edges of the top surface of the fixing piece are located outside the side surfaces of the fins.
In addition, preferably, the fixing member includes a first side wall portion and a second side wall portion extending in a groove side wall direction; the thickness of the first side wall part and the second side wall part are the same or different.
In addition, preferably, the first side wall part comprises a first extension part formed by bending the end part of the first side wall part outwards, and the bottom surface of the first extension part is adhered and fixed with the top end surface of the protruding part.
In addition, preferably, the second side wall portion includes a second extension portion formed by bending an end portion of the second side wall portion outwards, and a bottom surface of the second extension portion is attached and fixed to a top end surface of the protruding portion.
Further, preferably, an end portion of the first side wall portion extends beyond an end surface of the protruding portion, and the end portion is formed with a first step portion.
Further, preferably, an end portion of the second side wall portion extends beyond an end surface of the protruding portion, and the end portion is formed with a second step portion.
Another objective of the present invention is to provide a method for manufacturing the above damascene heat dissipation structure.
In order to achieve the object, the invention provides a manufacturing method of the embedded heat dissipation structure, which comprises the following steps:
s1, processing a fixing piece through standard processing technologies such as an extrusion process or cold drawing and the like, and cutting according to the required length; carrying out appearance processing on the fins; a plurality of grooves are formed in the substrate;
s2, placing the fixing piece in the groove, and inserting the fin into the groove of the fixing piece, or
Firstly, inserting a fin into a groove of a fixing piece, fixing the fixing piece and the fin together to form a fin assembly, and inserting the fin assembly into a groove of a base plate;
s3, extruding the whole fixing piece downwards to enable the fin, the fixing piece and the base plate to be combined and fixed.
The beneficial effects of the invention are as follows:
1. the embedded heat radiation structure provided by the invention can effectively avoid complex sheet metal processes such as flanging, hemming and the like used for compacting the fixed fins in the traditional process, simplifies the manufacturing process, has high dimensional accuracy of parts and is convenient to control; meanwhile, the components can be tightly combined and fixed, and the heat conduction performance of the heat dissipation structure is prevented from being influenced due to the fact that the combination is not tight; the heat dissipation structure is simple, can be assembled fast, has strong applicability, and can meet the heat dissipation requirements of high heat flux and high power electronic components.
2. The fins of the embedded heat radiation structure provided by the invention are provided with the bending structures, so that the fin can play a role in avoiding the assembly equipment, and the assembly equipment can more conveniently extrude and assemble the fixing piece in the assembly process.
3. The edges of the two sides of the top surface of the fixing piece of the embedded heat dissipation structure are positioned on the outer sides of the side surfaces of the fins, so that enough operation space is reserved on the two sides of the fixing piece, and assembly equipment can simultaneously squeeze and assemble the two sides of the fixing piece in the assembly process, so that the fins, the fixing piece and the base plate are further combined and fixed.
4. The thickness of the first side wall part and the thickness of the second side wall part of the embedded heat dissipation structure are the same or different, so that the fin has an avoidance effect on the assembly equipment, and the fin cannot interfere with the operation of the assembly equipment in the assembly process; and meanwhile, the second side wall part can be ensured to have more operation space for the assembling equipment to press and assemble the fixing piece.
5. The embedded heat dissipation structure provided by the invention is also provided with the first extension part and/or the second extension part, so that more operation space can be provided for the assembly equipment to extrude and assemble the fixing piece, and the fins, the fixing piece and the base plate are further combined and fixed.
6. The embedded heat dissipation structure provided by the invention is further provided with the first step part and/or the second step part, so that burrs or falling off caused by the fact that the end part of the fixing piece after forced expansion extends out of the top end of the protruding part can be effectively avoided.
The advantages of the embedded heat dissipation structure and the manufacturing method thereof provided by the invention are the same as those of the prior art, and therefore, the description thereof is omitted herein.
Drawings
The following describes the embodiments of the present invention in further detail with reference to the drawings.
Fig. 1 shows a schematic structural diagram of a preferred embodiment of an embedded heat dissipation structure according to the present invention.
Fig. 2 shows a schematic structural view of a fixing member provided by the invention.
Fig. 3 is a schematic structural diagram of a preferred embodiment of an embedded heat dissipation structure according to the present invention.
Fig. 4 is a schematic structural diagram of a preferred embodiment of an embedded heat dissipation structure according to the present invention.
Fig. 5 shows a schematic structural diagram of a preferred embodiment of an embedded heat dissipation structure according to the present invention.
Fig. 6 shows a schematic structural diagram of a preferred embodiment of the damascene heat dissipation structure provided by the present invention.
Fig. 7 is a schematic structural diagram of a preferred embodiment of an embedded heat dissipation structure according to the present invention.
Fig. 8 is a schematic cross-sectional view of a damascene heat dissipation structure provided by the present invention.
Fig. 9 is a schematic perspective view of a damascene heat dissipation structure provided by the present invention.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details.
In order to more clearly illustrate the present invention, the present invention will be further described with reference to preferred embodiments and the accompanying drawings. Like parts in the drawings are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and that this invention is not limited to the details given herein.
The electronic component heat dissipation modes commonly used in the prior art are generally forced air cooling and liquid cooling heat dissipation. The forced air cooling mainly radiates heat through the external fan and the extruded aluminum profile radiator, and the radiating efficiency of the forced air cooling is mainly limited by the heat conductivity coefficient of the aluminum profile and cannot meet the radiating requirement of the high-power electronic module with high heat flux density. The liquid cooling heat dissipation system needs to be additionally provided with a complex liquid cooling system, and in order to ensure that the radiator fins are tightly combined and fixed with the base, complicated metal plate processes such as flanging and hemming are also needed to be carried out on the radiator fins, so that the complexity of the system and the maintenance cost are increased, and the dimensional accuracy of parts is low and difficult to control.
To overcome the above-mentioned drawbacks, a preferred embodiment of the present invention provides a damascene heat dissipation structure, as shown in fig. 1 to 9, which includes a base plate 10, a fixing member 20 and fins 30; the fixing piece can be a standard piece made of metal or alloy materials, can be processed by a section extrusion process or cold drawing or other standard processing processes similar to rapid and stable forming known to those skilled in the art, is simple to process and low in cost, can realize higher dimensional accuracy, and is convenient to control the assembly stability in the assembly process; in addition, the fins can be plate heat exchangers processed through an inflation process, for example, metal or alloy plates with high heat conductivity coefficients are adopted, self-circulation pipelines are arranged in the fins, and heat-conducting working media are arranged in the self-circulation pipelines so as to realize circulation heat conduction. The substrate 10 includes a protrusion 11 formed to protrude upward; the end surface of the protruding part 11 facing away from the substrate 10 is recessed inwards to form a groove 12, the fixing piece 20 is configured to be inserted into the groove 12, and the side wall surface of the fixing piece 20 is attached and fixed with the inner wall surface of the groove 12; the end surface of the fixing piece 20 facing away from the substrate 10 is inwards recessed to form a groove 21, and the opening direction of the groove 21 faces the direction facing away from the substrate 10; the fin 30 is configured to be insertable into the groove 21 of the fixing member 20, and an end surface of one end of the fin 30 inserted into the groove 21 is fitted and fixed to an inner side wall surface of the groove 21. According to the heat dissipation structure provided by the preferred embodiment of the invention, the fixing piece 20 is pressed downwards through the assembly equipment to expand, so that the fixing piece 20, the base plate 10 and the fins 30 are tightly combined and fixed. Compared with the prior art, the method can effectively avoid complex sheet metal processes such as flanging, hemming and the like used for compacting the fixed fins in the traditional process, simplify the manufacturing process, and has high dimensional precision of parts and is convenient to control; meanwhile, the fixing piece, the base plate and the fins can be tightly combined and fixed, and the heat conduction performance of the heat dissipation structure is prevented from being influenced due to the fact that the combination is not tight; furthermore, the heat dissipation structure of the preferred mode is simple, can be assembled quickly, has strong applicability, and can meet the heat dissipation requirements of high-heat-flux and high-power electronic components.
Further, the fin 30 further includes an insertion portion 31 disposed in the groove 21 and an extension portion 32 formed to extend outwardly from an end of the insertion portion 31 away from the groove 21; in the extending direction of the extending portion 32, the extending portion 32 includes a bending structure 33. As shown in fig. 3, the bending structure 33 is a step structure similar to a "Z" shape, and this structure can make the extension portion of the fin perform an avoidance function on the assembling device, so that the assembling device can more conveniently press-assemble the fixing member during the assembling process, and meanwhile, the fin does not interfere with the operation of the assembling device.
Preferably, in order to ensure that enough operation space is left on both sides of the fixing member, the assembling device can simultaneously press-assemble both sides of the fixing member during the assembling process, so that the fins, the fixing member and the base plate are further combined and fixed. As shown in fig. 4, two side edges of the top surface of the fixing member are located outside the side surfaces of the fins; further, the fixing member 20 may include a first sidewall portion 22 and a second sidewall portion 23 extending along a sidewall direction of the recess 21, and the thicknesses of the first sidewall portion 22 and the second sidewall portion 23 may be the same or different. As shown in fig. 5, the present invention provides a heat dissipation structure with a thickness of a first side wall portion 22 different from a thickness of a second side wall portion 23, wherein in the preferred heat dissipation structure, the thickness of the second side wall portion 23 is greater than that of the first side wall portion 22, and the preferred embodiment can not only enable a fin to have an avoidance effect on an assembling device, but also enable the fin not to interfere with the operation of the assembling device in the assembling process; and meanwhile, the second side wall part can be ensured to have more operation space for the assembling equipment to press and assemble the fixing piece.
For the purpose of the present invention, as shown in fig. 6, the first side wall 22 includes a first extension 221 formed by bending an end of the first side wall 22 outwards, the bottom surface of the first extension 221 is adhered and fixed to the top surface of the protruding portion 11, the first extension 221 may form a structure similar to a "7" shape, and it will be understood by those skilled in the art that the second side wall 23 may also include a second extension 231 formed by bending an end of the second side wall 23 outwards, and the bottom surface of the second extension 231 is adhered and fixed to the top surface of the protruding portion 11, and the first extension 221 and the second extension 231 may together form a T shape. The other preferred embodiment further fixes the fins, the fixing member and the base plate by providing the first and/or second extension portions such that at least one side of the fixing member adds an additional operation space such that the assembling apparatus can more conveniently press-assemble the fixing member.
In addition, in order to avoid that the middle and lower parts of the fixing member are expanded by force during the assembly process, the upper end of the fixing member extends out of the top end of the boss to form burrs or drops, the end of the first sidewall 22 extends out of the end surface of the boss 11 and the end is formed with a first step 222. Also, it is understood that the end portion of the second side wall portion 23 extends beyond the end surface of the boss 11 and the end portion may be formed with a second step portion 232. The first step 222 and the second step 232 form a "convex" shape.
According to another aspect of the present invention, the present invention further provides a method for manufacturing the damascene heat dissipation structure, including the following steps:
s1, processing the fixing piece 20 through standard processing technologies such as extrusion technology or cold drawing technology, and cutting according to the required length; shaping the fins 30; and a plurality of grooves are provided on the boss 11 of the substrate 10; the parts of the fins 30 assembled and fixed with the fixing piece 20 do not need to be subjected to metal plate treatment such as flanging, hemming and the like;
s2, placing the fixing piece 20 in the groove 12 on the base plate 10, inserting the fin 30 into the groove 21 of the fixing piece 20, or
Firstly, inserting the fins 30 into the grooves 21 of the fixing pieces 20, fixing the fixing pieces 20 and the fins 30 together to form fin assemblies, and inserting the fin assemblies into the grooves 12 of the base plate 10;
and S3, the fixing piece 20 is integrally pressed downwards, so that the fin 30, the fixing piece 20 and the base plate 10 are combined and fixed.
By this preferred manufacturing method, the bonding and fixing between the base plate 10, the fixing member 20, and the fin 30 is achieved by adding the fixing member 20 between the base plate 10 and the fin 30 and pressing the fixing member 20 downward by the assembling apparatus, the fixing member 20 is forced to be pressed downward into the groove 12 of the base plate 10, and the middle and lower portions of the fixing member 20 are expanded. The process flow is simple, complicated sheet metal processes such as flanging and hemming are not needed to be additionally carried out on the fins, the manufacturing process is simplified, meanwhile, the fixing piece, the base plate and the fins can be ensured to be tightly combined and fixed, the heat conduction performance of the heat dissipation structure is prevented from being influenced due to the fact that the combination is not tight, and the heat dissipation requirements of high-heat-flow density and high-power electronic elements can be met.
It should be understood that the foregoing examples of the present invention are provided merely for clearly illustrating the present invention and are not intended to limit the embodiments of the present invention, and that various other changes and modifications may be made therein by one skilled in the art without departing from the spirit and scope of the present invention as defined by the appended claims.
Claims (3)
1. A mosaic heat dissipation structure is characterized in that,
the heat dissipation structure comprises a base plate, a fixing piece and fins;
the substrate comprises a protruding part which protrudes upwards;
the end face, away from the substrate, of the protruding part is inwards recessed to form a groove, the fixing piece is configured to be inserted into the groove, and the side wall surface of the fixing piece is adhered and fixed with the inner wall surface of the groove;
the end face, away from the substrate, of the fixing piece is inwards recessed to form a groove, and the opening direction of the groove faces the direction away from the substrate;
the fin is configured to be inserted into the groove of the fixing piece, and the end surface of one end of the fin inserted into the groove is adhered and fixed with the inner side wall surface of the groove;
the fin comprises an insertion part positioned in the groove and an extension part formed by extending outwards from one end of the insertion part far away from the groove;
the extending part comprises a bending structure in the extending direction of the extending part;
two side edges of the top surface of the fixing piece are positioned outside the side surfaces of the fins;
the fixing piece comprises a first side wall part and a second side wall part which extend along the side wall direction of the groove;
the thickness of the first side wall part and the second side wall part are the same or different;
the first side wall part comprises a first extension part formed by outwards bending the end part of the first side wall part, and the bottom surface of the first extension part is adhered and fixed with the top end surface of the protruding part;
the second side wall part comprises a second extension part formed by outwards bending the end part of the second side wall part, and the bottom surface of the second extension part is adhered and fixed with the top end surface of the protruding part;
the manufacturing method of the embedded heat dissipation structure comprises the following steps:
s1, processing a fixing piece through an extrusion process or a cold drawing standard processing process, and cutting according to the required length; carrying out appearance processing on the fins; a plurality of grooves are formed in the substrate;
s2, placing the fixing piece in the groove, and inserting the fin into the groove of the fixing piece, or
Firstly, inserting a fin into a groove of a fixing piece, fixing the fixing piece and the fin together to form a fin assembly, and inserting the fin assembly into a groove of a base plate;
s3, extruding the whole fixing piece downwards to enable the fin, the fixing piece and the base plate to be combined and fixed.
2. The heat radiation structure according to claim 1, wherein an end portion of the first side wall portion extends out of an end face of the boss portion and the end portion is formed with a first step portion.
3. The heat radiation structure according to claim 1, wherein an end portion of the second side wall portion extends beyond an end face of the protruding portion and the end portion is formed with a second step portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910732872.XA CN110461130B (en) | 2019-08-09 | 2019-08-09 | Mosaic type heat dissipation structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910732872.XA CN110461130B (en) | 2019-08-09 | 2019-08-09 | Mosaic type heat dissipation structure and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN110461130A CN110461130A (en) | 2019-11-15 |
| CN110461130B true CN110461130B (en) | 2024-04-05 |
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| CN201910732872.XA Active CN110461130B (en) | 2019-08-09 | 2019-08-09 | Mosaic type heat dissipation structure and manufacturing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030073903A (en) * | 2002-03-13 | 2003-09-19 | (주)테놉스 | Method for manufacturing the heat sink using insert casting of fin and auxiliary plate |
| CN201638805U (en) * | 2010-04-23 | 2010-11-17 | 锘威科技(深圳)有限公司 | Radiator fin set and radiator using the same |
| CN206834296U (en) * | 2017-06-07 | 2018-01-02 | 天津市捷威动力工业有限公司 | A kind of novel power battery heat abstractor |
| CN210725805U (en) * | 2019-08-09 | 2020-06-09 | 河南新科隆电器有限公司 | Embedded heat radiation structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7031163B2 (en) * | 2002-12-30 | 2006-04-18 | Texas Instruments Incorporated | Mechanical cooling fin for interconnects |
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2019
- 2019-08-09 CN CN201910732872.XA patent/CN110461130B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030073903A (en) * | 2002-03-13 | 2003-09-19 | (주)테놉스 | Method for manufacturing the heat sink using insert casting of fin and auxiliary plate |
| CN201638805U (en) * | 2010-04-23 | 2010-11-17 | 锘威科技(深圳)有限公司 | Radiator fin set and radiator using the same |
| CN206834296U (en) * | 2017-06-07 | 2018-01-02 | 天津市捷威动力工业有限公司 | A kind of novel power battery heat abstractor |
| CN210725805U (en) * | 2019-08-09 | 2020-06-09 | 河南新科隆电器有限公司 | Embedded heat radiation structure |
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| CN110461130A (en) | 2019-11-15 |
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