CN114302575A - PCBA board packaging equipment and packaging method - Google Patents

PCBA board packaging equipment and packaging method Download PDF

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Publication number
CN114302575A
CN114302575A CN202111674068.4A CN202111674068A CN114302575A CN 114302575 A CN114302575 A CN 114302575A CN 202111674068 A CN202111674068 A CN 202111674068A CN 114302575 A CN114302575 A CN 114302575A
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China
Prior art keywords
pcba board
pcba
groove
fixed
base
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CN202111674068.4A
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Chinese (zh)
Inventor
易恒伟
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Shenzhen Xinhengtian Electronics Co ltd
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Shenzhen Xinhengtian Electronics Co ltd
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Priority to CN202111674068.4A priority Critical patent/CN114302575A/en
Publication of CN114302575A publication Critical patent/CN114302575A/en
Pending legal-status Critical Current

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Abstract

The application relates to the technical field of PCBA board packaging, in particular to PCBA board packaging equipment and a PCBA board packaging method. The utility model provides a PCBA board encapsulation equipment, includes box, fixed connection and is used for the fixing base of fixed PCBA board, sliding connection be used for on the box inner wall fixed PCBA board positioning mechanism and the hot-blast mechanism of fixed connection on the box inner wall of components and parts on the box. The staff is when carrying out the PCBA board encapsulation, the PCBA board that will scribble the soldering paste is put in the fixed slot, later fall positioning mechanism, make positioning mechanism's bottom butt exert certain pressure on the upper surface of PCBA board and to the PCBA board, thereby with the rigidity of PCBA board, this application has because positioning mechanism has exerted certain pressure to the PCBA board, the position of components and parts can not disturbed by hot-blast on the PCBA board, consequently at the encapsulation in-process, the position of components and parts is more stable, the effect of the precision of encapsulation has been improved.

Description

PCBA board packaging equipment and packaging method
Technical Field
The invention relates to the technical field of PCBA (printed circuit board assembly) board packaging, in particular to PCBA board packaging equipment and a PCBA board packaging method.
Background
PCBA board packaging, namely welding some device pins required by a circuit board on the circuit board, wherein the SMT technology is a paster packaging means which is stated day by day, the main technological process is to attach components such as a sheet capacitor, an inductor and a diode to a position to be welded of the circuit board, a certain amount of soldering paste is extruded on the position to be welded by a screen printing mode before attachment, then the circuit board is placed into a reflow soldering machine for heating and welding, and the main heating means is hot air and infrared heat radiation heating.
With respect to the related art among the above, the inventors consider that there is a defect: although the heating process of the hot air is uniform, the components need to be fixed and connected with the PCBA board through the liquid solder paste before the solder paste is melted and welding spots are not formed, the positions of the components are easily interfered by the hot air, and the packaging precision of the PCBA board is low.
Disclosure of Invention
In order to reduce the interference of hot air to the position of a component when packaging a PCBA board and improve the packaging precision of the PCBA board, the application provides PCBA board packaging equipment and a packaging method.
In a first aspect, the present application provides a PCBA board packaging device, which adopts the following technical solution:
a PCBA board packaging device comprises a box body, a fixed seat fixedly connected to the bottom of the box body and used for fixing a PCBA board, a positioning mechanism connected to the inner wall of the box body in a sliding mode and used for fixing components on the PCBA board, and a hot air mechanism fixedly connected to the inner wall of the box body; the top of box articulates there is the switch door, the fixed slot has been seted up on the upper surface of fixing base, the inside at the fixed slot is placed to the PCBA board, positioning mechanism sets up directly over fixed subassembly, positioning mechanism's bottom butt is on the upper surface of PCBA board.
Through adopting above-mentioned technical scheme, the staff is when carrying out the PCBA board encapsulation, the PCBA board that will scribble the soldering paste is put in the fixed slot, later positioning mechanism descends, make positioning mechanism's bottom butt on the upper surface of PCBA board and exert certain pressure to the PCBA board, thereby fix the position of PCBA board, later hot-blast mechanism work, blow into hot-blastly in the box, hot-blast heating soldering paste, make the soldering paste melt, after the soldering paste melts, because positioning mechanism has applyed certain pressure to the PCBA board, the position of components and parts can not disturbed by hot-blast on the PCBA board, consequently in the packaging process, the position of components and parts is more stable, the precision of encapsulation has been improved.
Optionally, the positioning mechanism includes a lifting assembly arranged on the side wall of the box body and a positioning assembly fixedly connected to the lifting assembly, and the positioning assembly is arranged right above the fixing groove.
Through adopting above-mentioned technical scheme, when fixed PCBA board, the staff changes positioning component's height through lifting unit, makes positioning component butt on the PCBA board, and at the encapsulation in-process, positioning component is with the position of front cover fixed connection circuit board, the position of the fixed components and parts of on the other hand.
Optionally, the lifting assembly comprises a driving portion arranged on the side wall of the box body and a lifting portion connected to the inner side wall of the box body in a sliding mode, the driving portion is in threaded fit with the lifting portion, and the positioning assembly is fixedly connected to the lower surface of the lifting portion.
Through adopting above-mentioned technical scheme, lift portion provides the installation basis for locating component, and the staff can adjust the height of lift portion through drive division simultaneously.
Optionally, set up vertical hidden groove on the lateral wall of box, the inside in hidden groove is installed to the lift portion, the lift portion is including rotating the hand wheel of connecting the connection driving screw and fixed connection on the driving screw tip of hiding inslot portion, the vertical setting of driving screw, the cell wall in hidden groove is passed and is stretched out the box in driving screw's top to driving screw's top, hand wheel fixed connection is at driving screw's top.
Optionally, the lifting portion comprises a lifting plate, the lifting plate is horizontally arranged, a sliding block is fixedly connected to the side face of the lifting plate, the sliding block is in sliding fit with the hidden groove, and the sliding block is in threaded fit with the driving screw.
Through adopting above-mentioned technical scheme, when the staff was at the height of adjustment locating component, rotated the hand wheel that is located the box outside, and the hand wheel drives drive screw and rotates, and when drive screw rotated, under the promotion of screw thread, drive screw passed through the slider drive lifter plate and goes up and down.
Optionally, locating component includes fixed connection and the slide bar of sliding connection on the base on the lifter plate lower surface, the slide bar is provided with a plurality of and equipartition on the lower surface of base, the equal vertical setting of slide bar.
Through adopting above-mentioned technical scheme, when the bottom butt of locating component was on the PCBA board, the components and parts on the PCBA board contacted with the slide bar and promoted the slide bar and slide, and the position that does not set up components and parts on the PCBA board does not contact with the slide bar, after locating the component and put in place, all had the slide bar around components and parts, when components and parts took place the displacement under the hot-blast interference, the slide bar around the components and parts can block components and parts and take place to remove.
Optionally, a preformed groove is formed in the lower surface of the base, the bottom of the base is fixedly connected with the mounting seat, the sliding rod is connected to the mounting seat in a sliding mode, a sliding groove is formed in the mounting seat, and the top of the sliding rod penetrates through the sliding groove and is located inside the preformed groove.
Through adopting above-mentioned technical scheme, the slide bar slides and sets up in the inside of spout, and when the slide bar upwards slided, the top of slide bar got into the inside of reservation groove, and the reservation groove has reserved the space for the slip of slide bar.
Optionally, a spring is arranged inside the preformed groove, and the spring is arranged between the inner wall of the preformed groove and the top of the sliding rod.
Through adopting above-mentioned technical scheme, when components and parts on the PCBA board promoted the slide bar and slided, slide bar compression spring increased the gliding resistance that makes progress of slide bar to increase the pressure between the components and parts on slide bar and the PCBA board, thereby further improved the fixed components and parts's of slide bar ability.
Optionally, the top of slide bar is provided with the stopper, fixedly connected with breather pipe on the base, the breather pipe is connected with the air pump, the gas outlet of breather pipe is located the inside of reservation groove, be provided with sealed the pad between base and the mount pad.
Through adopting above-mentioned technical scheme, the staff lets in the air to the reservation groove through air pump and breather pipe after with locating component's altitude mixture control to improve the air pressure in the reservation groove, utilize high-pressure air to improve the resistance when the slide bar upwards slides.
In a second aspect, the present application provides a method for packaging a PCBA board, which adopts the following technical solution:
a packaging method of a PCBA board comprises the following steps:
a. installing a PCBA board; the worker opens and closes the door, installs the PCBA board in the fixed groove, and closes the door;
b. clamping the PCBA board; a worker rotates the hand wheel to drive the positioning component to descend, so that the bottom of the positioning component is abutted against the supporting column and the PCBA;
packaging the PCBA board; starting a hot air mechanism, wherein the hot air mechanism works to send hot air between the positioning assembly and the fixed seat to melt the soldering paste;
d. taking out the packaged PCBA board; after the PCBA has cooled, the operator turns the hand wheel, raises the locating assembly, and then removes the PCBA.
In summary, the present application includes at least one of the following beneficial technical effects:
1. when a worker packages the PCBA, the PCBA coated with the soldering paste is placed in the fixing groove, then the positioning mechanism is lowered, the bottom of the positioning mechanism abuts against the upper surface of the PCBA and exerts certain pressure on the PCBA, so that the position of the PCBA is fixed, then the hot air mechanism works, hot air is blown into the box body and heats the soldering paste, the soldering paste is melted, and after the soldering paste is melted, the positions of components on the PCBA cannot be interfered by the hot air due to the fact that the positioning mechanism exerts certain pressure on the PCBA, therefore, the positions of the components are stable in the packaging process, and packaging accuracy is improved;
2. when locating component's bottom butt was on the PCBA board, the components and parts on the PCBA board and slide with the sliding rod contact and promotion sliding rod slip, do not set up the position of components and parts on the PCBA board and do not contact with the sliding rod, after locating component targets in place, all have the sliding rod around components and parts, when components and parts take place the displacement under hot-blast interference, the sliding rod around the components and parts can block components and parts and take place the removal.
Drawings
Fig. 1 is a schematic overall structure diagram of an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a lifting assembly in an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a positioning assembly in embodiment 1 of the present application.
Fig. 4 is a schematic structural diagram of a positioning assembly in embodiment 2 of the present application.
Description of reference numerals: 1. a box body; 11. opening and closing the door; 12. hiding the groove; 2. a fixed seat; 21. fixing grooves; 22. a support pillar; 3. a positioning mechanism; 31. a lifting assembly; 311. a drive screw; 312. a hand wheel; 313. a lifting plate; 314. a slider; 32. a positioning assembly; 321. a base; 322. a slide bar; 323. reserving a groove; 324. a mounting seat; 325. a limiting block; 326. a spring; 327. a breather pipe; 328. a gasket; 4. a hot air mechanism.
Detailed Description
The present application is described in further detail below with reference to figures 1-4.
In a first aspect, the present embodiment discloses a package device for a PCBA board.
Example 1
Referring to fig. 1, the PCBA board packaging device comprises a box body 1, a fixed seat 2 welded on the bottom inside the box body 1, a positioning mechanism 3 slidably mounted on the side surface of the box body 1, and a hot air mechanism 4 mounted on the side surface of the box body 1. Articulated at the top of box 1 have switch door 11, and the staff is when encapsulating the PCBA board, will open switch door 11, fixes the PCBA board on fixing base 2.
Positioning mechanism 3 sets up directly over fixing base 2, and the staff can adjust positioning mechanism 3's height, makes positioning mechanism 3's bottom butt at the top of PCBA board, and positioning mechanism 3 exerts certain pressure to the PCBA board, fixes the PCBA board on fixing base 2, and the staff will close switch door 11 afterwards, opens hot-blast mechanism 4, and hot-blast mechanism 4 provides the high temperature draught to 1 inside of box, and the soldering paste on the high temperature draught heating PCBA board makes the soldering paste melt. Because the positioning mechanism 3 applies a certain pressure to the PCBA board, components on the PCBA board are not disturbed by the air flow after the solder paste melts.
Referring to fig. 1, a fixing groove 21 is formed on an upper surface of a fixing base 2, and a worker places a PCBA board inside the fixing groove 21 when fixing the PCBA board. Four vertical support columns 22 are welded at four corners of the fixed seat 2. After the staff put the PCBA board in the inside of fixed slot 21, the circuit board is located the inside of fixed slot 21, and the top of the component that sets up on the circuit board simultaneously is higher than the upper surface of fixing base 2.
When the staff used the fixed PCBA board of positioning mechanism 3, the bottom butt of positioning mechanism 3 was on components and parts and support column 22, but can not contact the circuit board, and certain pressure is applyed to components and parts to positioning mechanism 3 to fixed components and parts and circuit board reduce the possibility that takes place relative displacement between components and parts and the circuit board.
Referring to fig. 1 and 2, the positioning mechanism 3 includes a lifting assembly 31 slidably mounted on an inner wall of the case 1 and a positioning assembly 32 mounted on the lifting assembly 31. Locating component 32 and fixing base 2 parallel arrangement, locating component 32 sets up directly over fixing base 2. The lifting assembly 31 includes a driving part slidably mounted on the inner wall of the case 1 and a lifting part mounted on the driving part.
Referring to fig. 2, a vertical hidden groove 12 is formed on one vertical inner wall of the cabinet 1, and the driving part is installed inside the hidden groove 12. The drive section includes a vertically disposed drive screw 311 and a hand wheel 312 on top of the weld drive screw 311. The bottom of the driving screw 311 is rotatably mounted on the inner wall of the bottom of the hidden groove 12, the top of the driving screw 311 penetrates through the side wall of the top of the hidden groove 12, and the top of the driving screw 311 and the hand wheel 312 are located outside the box body 1. The operator can operate the driving part by rotating the hand wheel 312 outside the case 1.
The elevating part includes an elevating plate 313 horizontally disposed and a slider 314 welded on an upper side of the elevating plate 313. Vertical threaded holes are formed in the sliding block 314, the driving screw 311 penetrates through the threaded holes to be in threaded fit with the sliding block 314, meanwhile, the side face of the sliding block 314 abuts against the inner wall of the hidden groove 12, and the sliding block can slide up and down in the hidden groove 12.
Referring to fig. 3, the positioning assembly 32 includes a base 321 mounted on a lower surface of the lifting plate 313 using bolts, a mounting seat 324 mounted on a lower surface of the base 321 using bolts, and a sliding rod 322 slidably engaged with the mounting seat 324. A groove 323 with a downward opening is formed on the lower surface of the base 321. The sliding rods 322 are provided with a plurality of sliding grooves, a plurality of vertical sliding grooves are uniformly formed in the mounting base 324, the sliding rods 322 are slidably mounted in the sliding grooves, and the tops of the sliding rods 322 penetrate through the sliding grooves and are located in the reserved grooves 323.
The top of the sliding rod 322 is welded with a contact ring, the diameter of the contact ring is larger than the inner diameter of the sliding chute, and the contact ring can prevent the sliding rod 322 from separating from the mounting seat 324. A spring 326 is provided inside the reserve groove 323, the number of the springs 326 is the same as the number of the slide bars 322, one end of the spring 326 abuts on the inner wall of the reserve groove 323, and the other end abuts on the contact ring.
After the operator has secured the PCBA board within the interior of the securing slot 21, the operator rotates the hand wheel 312 to drive the positioning assembly 32 down. The slide bar 322 slides into the interior of the pre-groove 323 after contacting a component on the PCBA board, while contacting the ring compression spring 326. After the lower surface of the mounting plate abuts against the top of the support column 22, a worker stops rotating the hand wheel 312, the height of the positioning assembly 32 is fixed, the sliding rod 322 in contact with the component on the PCBA plate is pushed into the reserved groove 323, the spring 326 applies certain pressure to the component through the sliding rod 322, and meanwhile the sliding rod 322 which is located around the component and is not in contact with the component can further limit the position of the component.
When the staff started hot-blast mechanism 4, hot-blast mechanism 4 was to the inside higher hot-blast of temperature of box 1 delivery, and after hot-blast melting soldering paste, the ability of the fixed components and parts of soldering paste declined, and under locating component 32's effect, the position of components and parts can not disturbed by hot-blast to improve the stability of components and parts.
The implementation principle of PCBA board encapsulation equipment of the embodiment of the application is as follows: when the staff was when the encapsulation PCBA board, place the PCBA board on fixed slot 21, rotate hand wheel 312 afterwards, fix locating component 32 in the assigned position, the staff closes box 1 afterwards, starts hot-blast mechanism 4, and hot-blast mechanism 4 is to the inside high temperature air current that feeds into of box 1, and high temperature air current melts the soldering paste, and under locating component 32's fixed, the probably reduction of relative displacement takes place between components and parts and the circuit board to the quality of encapsulation has been improved.
Example 2
The present embodiment is different from embodiment 1 in that the positioning assembly 32 is arranged in a different manner, and the rest of the components are identical in structure and arrangement.
Referring to fig. 4, the positioning assembly 32 includes a base 321 fixed on a lower surface of the connection elevating plate 313 using bolts, a mounting seat 324 mounted on a lower surface of the base 321 using bolts, and a sliding rod 322 slidably mounted on the mounting seat 324. The lower surface of the base 321 is provided with a reserved groove 323 with a downward opening, the mounting seat 324 is uniformly provided with a plurality of vertical sliding grooves, the top of the sliding rod 322 penetrates through the sliding grooves to be located inside the reserved groove 323, the top of the sliding rod 322 is welded with a limiting ring, the side wall of the base 321 is provided with two connecting holes, the connecting holes are internally provided with air pipes 327, one air pipe 327 is connected with an air pump, the other air pipe 327 serves as an exhaust pipe, the exhaust pipe is provided with a pressure release valve, and meanwhile the base 321 and the mounting seat 324 are provided with sealing gaskets 328.
After the PCBA board is placed in the fixing groove 21, the worker introduces air into the inside of the reserve tank 323 through the air pump and the air pipe 327, and when the air pressure inside the reserve tank 323 is higher than a set value of the pressure release valve, the pressure release valve is opened, so that the internal pressure of the reserve tank 323 is relatively constant. The stopper 325 at the top of the slide rod 322 abuts on the upper surface of the mounting seat 324 by the air inside the reserve groove 323, and when the positioning member 32 is lowered, a part of the slide rod 322 contacts the PCBA plate and slides toward the inside of the reserve groove 323, and the high-pressure air inside the reserve groove 323 corresponds to the spring 326 in embodiment 1.
On the other hand, the embodiment also discloses a PCBA board packaging method.
A packaging method of a PCBA board comprises the following steps:
a. installing a PCBA board; the worker installs the switch door 11 and the PCBA board in the fixed groove 21, and closes the switch door 11;
b. clamping the PCBA board; the worker rotates the hand wheel 312 to drive the positioning component 32 to descend, so that the bottom of the positioning component 32 abuts against the supporting column 22 and the PCBA;
packaging the PCBA board; the hot air mechanism 4 is started, the hot air mechanism 4 works, hot air is sent between the positioning component 32 and the fixed seat 2, and soldering paste is melted;
d. taking out the packaged PCBA board; after the PCBA has cooled, the operator turns the handwheel 312, raises the positioning assembly 32, and then removes the PCBA.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (10)

1. A PCBA board encapsulation equipment which characterized in that: the device comprises a box body (1), a fixed seat (2) fixedly connected to the bottom of the box body (1) and used for fixing a PCBA board, a positioning mechanism (3) slidably connected to the inner wall of the box body (1) and used for fixing components on the PCBA board, and a hot air mechanism (4) fixedly connected to the inner wall of the box body; the top of box (1) articulates there is switch door (11), fixed slot (21) have been seted up on the upper surface of fixing base (2), the inside at fixed slot (21) is placed to the PCBA board, positioning mechanism (3) set up directly over fixed subassembly (2), the bottom butt of positioning mechanism (3) is on the upper surface of PCBA board.
2. A PCBA board packaging apparatus according to claim 1, wherein: the positioning mechanism (3) comprises a lifting component (31) arranged on the side wall of the box body (1) and a positioning component (32) fixedly connected to the lifting component (31), and the positioning component (32) is arranged right above the fixing groove (21).
3. A PCBA board packaging apparatus according to claim 2, wherein: lifting unit (31) is including setting up drive division and the lift portion of sliding connection on box (1) inside wall on box (1) lateral wall, drive division and lift portion screw-thread fit, locating component (32) fixed connection is on the lower surface of lift portion.
4. A PCBA board packaging apparatus according to claim 3, wherein: seted up vertical hidden groove (12) on the lateral wall of box (1), the inside in hidden groove (12) is installed to the lift portion, the lift portion is including rotating connection at connecting drive screw (311) and hand wheel (312) of fixed connection on drive screw (311) tip of hiding groove (12) inside, drive screw (311) vertical setting, the cell wall of hiding groove (12) is passed at the top of drive screw (311) and is stretched out box (1), hand wheel (312) fixed connection is at the top of drive screw (311).
5. A PCBA board packaging apparatus as claimed in claim 4, in which: the lifting part comprises a lifting plate (313), the lifting plate (313) is horizontally arranged, a sliding block (314) is fixedly connected to the side face of the lifting plate (313), the sliding block (314) is in sliding fit with the hidden groove (12), and the sliding block (314) is in threaded fit with the driving screw (311).
6. A PCBA board packaging apparatus as claimed in claim 5, in which: locating component (32) are including base (321) and sliding rod (322) of sliding connection on base (321) of fixed connection on lifter plate (313) lower surface, sliding rod (322) are provided with a plurality ofly and the equipartition on the lower surface of base (321), the equal vertical setting of sliding rod (322).
7. A PCBA board packaging apparatus as claimed in claim 6, in which: reserved groove (323) have been seted up on the lower surface of base (321), the bottom fixedly connected with mount pad (324) of base (321), slide bar (322) sliding connection is on mount pad (324), the spout has been seted up on mount pad (324), the top of slide bar (322) is passed the spout and is located the inside of reserved groove (323).
8. A PCBA board packaging apparatus as claimed in claim 7, in which: a spring (326) is arranged in the reserved groove (323), and the spring (326) is arranged between the inner wall of the reserved groove (323) and the top of the sliding rod (322).
9. A PCBA board packaging apparatus as claimed in claim 7, in which: the top of slide bar (322) is provided with stopper (325), fixedly connected with breather pipe (327) on base (321), breather pipe (327) are connected with the air pump, the gas outlet of breather pipe (327) is located the inside of reservation groove (323), be provided with sealed pad (328) between base (321) and mount pad (324).
10. A packaging method of a PCBA board is characterized in that: the method comprises the following steps:
installing a PCBA board; the worker installs the switch door (11) in the fixed groove (21) by the PCBA and closes the switch door (11);
clamping the PCBA board; a worker rotates the hand wheel (312) to drive the positioning component (32) to descend, so that the bottom of the positioning component (32) abuts against the supporting column (22) and the PCBA;
packaging the PCBA board; the hot air mechanism (4) is started, the hot air mechanism (4) works, hot air is sent between the positioning component (32) and the fixed seat (2), and soldering paste is melted;
taking out the packaged PCBA board; after the PCBA has cooled, the operator turns the hand wheel (312), raises the positioning assembly (32), and then removes the PCBA.
CN202111674068.4A 2021-12-31 2021-12-31 PCBA board packaging equipment and packaging method Pending CN114302575A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111674068.4A CN114302575A (en) 2021-12-31 2021-12-31 PCBA board packaging equipment and packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111674068.4A CN114302575A (en) 2021-12-31 2021-12-31 PCBA board packaging equipment and packaging method

Publications (1)

Publication Number Publication Date
CN114302575A true CN114302575A (en) 2022-04-08

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ID=80975581

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111674068.4A Pending CN114302575A (en) 2021-12-31 2021-12-31 PCBA board packaging equipment and packaging method

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Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114900990A (en) * 2022-05-10 2022-08-12 深圳市创芯智汇电子科技有限公司 Automatic packaging equipment and packaging method for PCBA (printed circuit board assembly)
CN115023065A (en) * 2022-05-31 2022-09-06 深圳市创芯智汇电子科技有限公司 Safe and reliable PCBA board packaging device and packaging method

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Publication number Priority date Publication date Assignee Title
CN207706532U (en) * 2018-01-10 2018-08-07 东莞市诺正电子有限公司 A kind of SMT position-limiting fixtures of set-top box PCBA
CN210817831U (en) * 2019-06-27 2020-06-23 长沙奥斯凯汽车零部件有限公司 Reflow soldering device
CN112692398A (en) * 2021-03-23 2021-04-23 成都市克莱微波科技有限公司 Welding fixture and welding method for solid-state microwave power amplifier assembly
CN214239643U (en) * 2021-01-13 2021-09-21 福建诺诚电子科技有限公司 Clamping device is used in PCBA welding

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207706532U (en) * 2018-01-10 2018-08-07 东莞市诺正电子有限公司 A kind of SMT position-limiting fixtures of set-top box PCBA
CN210817831U (en) * 2019-06-27 2020-06-23 长沙奥斯凯汽车零部件有限公司 Reflow soldering device
CN214239643U (en) * 2021-01-13 2021-09-21 福建诺诚电子科技有限公司 Clamping device is used in PCBA welding
CN112692398A (en) * 2021-03-23 2021-04-23 成都市克莱微波科技有限公司 Welding fixture and welding method for solid-state microwave power amplifier assembly

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114900990A (en) * 2022-05-10 2022-08-12 深圳市创芯智汇电子科技有限公司 Automatic packaging equipment and packaging method for PCBA (printed circuit board assembly)
CN114900990B (en) * 2022-05-10 2023-03-10 深圳市创芯智汇电子科技有限公司 Automatic packaging equipment and packaging method for PCBA (printed circuit board assembly)
CN115023065A (en) * 2022-05-31 2022-09-06 深圳市创芯智汇电子科技有限公司 Safe and reliable PCBA board packaging device and packaging method
CN115023065B (en) * 2022-05-31 2024-05-03 深圳市宏曦睿科技有限公司 Safe and reliable PCBA (printed circuit board assembly) packaging equipment and packaging method

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