CN114300596A - Substrate of deep ultraviolet LED and packaging structure of deep ultraviolet LED - Google Patents
Substrate of deep ultraviolet LED and packaging structure of deep ultraviolet LED Download PDFInfo
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- CN114300596A CN114300596A CN202111500251.2A CN202111500251A CN114300596A CN 114300596 A CN114300596 A CN 114300596A CN 202111500251 A CN202111500251 A CN 202111500251A CN 114300596 A CN114300596 A CN 114300596A
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- 239000000758 substrate Substances 0.000 title claims abstract description 47
- 238000004806 packaging method and process Methods 0.000 title abstract description 23
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- 238000000605 extraction Methods 0.000 abstract description 11
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- 229910002027 silica gel Inorganic materials 0.000 description 1
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Abstract
The invention discloses a substrate of a deep ultraviolet LED, which comprises a bottom plate and a dam, wherein one surface of the bottom plate, which is used for mounting a deep ultraviolet LED chip, is provided with a plurality of hollow bosses used for mounting the deep ultraviolet LED chip; the cavity of the hollow boss is communicated with the outside. The invention also discloses a deep ultraviolet LED packaging structure which comprises the deep ultraviolet LED substrate. The invention improves the light extraction rate of the deep ultraviolet LED and the packaging performance of the deep ultraviolet LED.
Description
Technical Field
The invention relates to the field of deep ultraviolet LEDs, in particular to a substrate of a deep ultraviolet LED and a packaging structure of the deep ultraviolet LED.
Background
For the deep ultraviolet LED, production equipment, material epitaxy, chip manufacturing and packaging are not mature, and in a space where a substrate and a glass cover plate are packaged, due to the fact that the refractive index of materials is poor, light is reflected on interfaces between the chip and air and between the chip and the glass cover plate, and the light effect of the deep ultraviolet LED is reduced to a certain extent. How to change the propagation direction of light by the choice of the package structure and the material to make the light more propagate along the light-emitting surface, thereby increasing the emitted light is a challenge to be solved.
For chips of a conventional packaging structure, the chips are generally arranged on a planar substrate, but a certain distance exists between the chips and a packaging interface and air or silica gel with a low refractive index exists, so that light is dissipated and refracted in the process of transmission, the probability of light transmission from an emergent surface is reduced, and the light extraction rate is reduced. Therefore, how to make more light reach the light-emitting interface through the improvement of the packaging structure is also an issue that is difficult to solve in the industry.
At present, the deep ultraviolet packaging forms include three forms, namely organic packaging, semi-inorganic packaging and full-inorganic packaging. However, since the former two are made of organic materials and are easily decomposed and aged by ultraviolet light, all-inorganic packaging is mostly adopted. The all-inorganic packaging process mainly comprises die bonding, routing and glass cover plate bonding, and the flip chip can reduce the steps of welding wires and reduce the problems of missing welding, insufficient welding and the like. The reliability problem of the package is mainly focused on the bonding of the glass cover plate, and the step needs to metalize the glass cover plate and the substrate dam and connect the glass cover plate and the substrate dam through a bonding process, but the temperature and the bonding material can affect the reliability of the package.
Disclosure of Invention
In order to overcome the above disadvantages and shortcomings of the prior art, the present invention provides a deep ultraviolet LED substrate, which improves the light extraction rate of a deep ultraviolet LED and improves the performance of deep ultraviolet LED packaging.
Another object of the present invention is to provide a deep ultraviolet LED package structure including the substrate of the ultraviolet LED.
The purpose of the invention is realized by the following technical scheme:
a substrate of a deep ultraviolet LED comprises a bottom plate and a dam, wherein a plurality of hollow bosses for mounting the deep ultraviolet LED chip are arranged on one surface of the bottom plate for mounting the deep ultraviolet LED chip; the cavity of the hollow boss is communicated with the outside.
Preferably, the hollow boss is quadrangular.
Preferably, the hollow bosses are arranged in a periodic rectangular array.
A packaging structure of a deep ultraviolet LED comprises a substrate of the deep ultraviolet LED.
Preferably, the bottom plate is square.
Preferably, the glass cover plate is further included; the glass cover plate is installed on the dam in a jogged mode; the glass cover plate and the substrate form a closed structure.
Preferably, the box dam comprises four surfaces, wherein three surfaces are respectively provided with a groove for embedding the glass cover plate, and the other surface is provided with a parallel slit for the glass cover plate to pass through.
Preferably, the dam is further provided with a vertical slit with an opening direction perpendicular to the parallel slits; the parallel seam intersects the vertical seam; a baffle plate for fixing the glass cover plate is arranged on the vertical seam; the baffle is fixed on the base plate through an adhesive filled in the vertical seam.
Preferably, the adhesive is a hot melt adhesive.
Preferably, the bottom plate has a concave surface and a convex surface, and the convex surface is the upper surface of the boss; and the concave surface and the convex surface are both provided with deep ultraviolet LED chips.
Compared with the prior art, the invention has the following advantages and beneficial effects:
(1) according to the substrate of the deep ultraviolet LED, the bottom plate is provided with the plurality of hollow bosses to form a structure with a concave surface and a convex surface, and the concave surface and the convex surface can be used for placing chips. The light emitted by the concave chip is vertically emitted towards the glass cover plate as far as possible due to the reflection and refraction effects of the peripheral bosses, and the uniformity of the light is improved. Because the light emitted by the chip at the bottom and the chip at the top of the hollow boss reach the light-emitting interface with different light-emitting intensities, the light-emitting consistency and uniformity of the packaging body can be realized by controlling the height of the hollow boss.
(2) The lug boss on the substrate of the deep ultraviolet LED can adjust the light-emitting angle through height adjustment, reduce the total reflection of light between the glass cover plate and the air and enhance the light-emitting efficiency.
(3) The lug boss on the substrate of the deep ultraviolet LED ensures that the chips are not completely positioned on the same substrate plane, thereby reducing the mutual influence among the chips.
(4) The cavity below the hollow boss on the substrate of the deep ultraviolet LED is communicated with the outside and is in a periodic rectangular array, so that the transmission path of light emitted by the chip is changed, the light is emitted from the light emitting surface in a concentrated manner, and the light emitting efficiency is improved.
(5) According to the packaging structure of the deep ultraviolet LED, the glass cover plate is embedded, so that the organic adhesive is prevented from being aged and cracked under the action of ultraviolet light, the service life is prolonged, and the reliability is improved; meanwhile, the processes of surface metallization, bonding process (low-temperature welding and local heating technology) and the like in the all-inorganic packaging are reduced, and the complexity and the cost of preparation are greatly reduced.
(6) According to the packaging structure of the deep ultraviolet LED, the embedded glass cover plate is fixed through the baffle and the hot melt adhesive filled in the vertical seam, so that the cover plate is easy to assemble and disassemble, the glass cover plate can be disassembled only by heating the part of the colloid and moving the baffle, and the elements in the glass cover plate can be conveniently replaced; meanwhile, the hot melt adhesive is not irradiated by ultraviolet light, so that the baffle can be stably fixed for a long time, and the reliability is improved.
Drawings
Fig. 1 is a side view of a deep ultraviolet LED package structure of the present invention. In the figure: 1 is a glass cover plate; 2 is a substrate; 3 is a deep ultraviolet LED chip; 4 is a baffle plate; 5 is a hot melt adhesive.
Fig. 2 is a top view of a deep ultraviolet LED substrate of the present invention. In the figure: 2 is a substrate; 3 is a deep ultraviolet LED chip; and 6 is a vertical seam.
Fig. 3 is a graph of light extraction efficiency for TE and TM light modes for an LED packaged with a planar substrate and a substrate (Hollow column) of an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to examples, but the embodiments of the present invention are not limited thereto.
As shown in fig. 1-2, the deep ultraviolet LED package structure of the present embodiment includes a glass cover plate 1, a substrate 2, and a deep ultraviolet LED chip 3 mounted on the substrate 2.
The substrate of the embodiment further comprises a bottom plate and a dam, wherein one surface of the bottom plate, which is used for mounting the deep ultraviolet LED chips, is provided with a plurality of hollow quadrangular prisms used for mounting the deep ultraviolet LED chips; the cavity of the hollow quadrangular prism is communicated with the outside. The plurality of hollow quadrangular prisms of the present embodiment are arranged in a periodic rectangular array.
This embodiment is equipped with a plurality of hollow quadrangular prism on the bottom plate, forms the structure that has concave surface and convex surface, and the chip can all be placed to concave surface and convex surface. The light emitted by the concave chip can be vertically emitted towards the glass cover plate as far as possible due to the reflection and refraction effects of the peripheral quadrangular prism, and the uniformity of the light is improved. Because the light emitted by the chip at the bottom and the chip at the top of the hollow quadrangular prism reaches the light-emitting interface with different light-emitting intensities, the light-emitting consistency and uniformity of the packaging body can be realized by controlling the height of the hollow quadrangular prism. The hollow quadrangular prism can also adjust the light-emitting angle, reduce the total reflection of light between the glass cover plate and the air and enhance the light-emitting efficiency. The hollow quadrangular prism ensures that the chips are not all positioned on the same substrate plane, thereby reducing the mutual influence among the chips. The cavity below the hollow quadrangular prism is communicated with the outside and is in a periodic rectangular array, which is beneficial to changing the transmission path of light emitted by the chip, so that the light is emitted out by concentrating on the light-emitting surface, and the light-emitting efficiency is improved.
In this embodiment, the glass cover plate is installed on the dam in a tabling manner; the glass cover plate and the substrate form a closed structure. The box dam comprises four surfaces, wherein three surfaces are respectively provided with a groove for embedding a glass cover plate, and the other surface is provided with a parallel slit for the glass cover plate to pass through.
In this embodiment, the position perpendicularly intersecting the parallel thin slits is provided with a vertical slit having an opening direction perpendicular to the parallel slits; the parallel thin slits are intersected with the vertical slits; a baffle plate for fixing the glass cover plate is arranged on the vertical seam; the baffle is fixed on the base plate through an adhesive filled in the vertical seam.
The glass cover plate of the embodiment adopts a mosaic type, so that the organic adhesive is prevented from being aged and cracked under the action of ultraviolet light, and the service life and the reliability are prolonged; meanwhile, the processes of surface metallization, bonding process (low-temperature welding and local heating technology) and the like in the all-inorganic packaging are reduced, and the complexity and the cost of preparation are greatly reduced. In addition, the embedded glass cover plate is fixed through the baffle and the hot melt adhesive filled in the vertical seam, so that the cover plate is easy to assemble and disassemble, and the glass cover plate can be disassembled only by heating the part of the colloid and moving the baffle, thereby facilitating the replacement of the elements inside; meanwhile, the hot melt adhesive is not irradiated by ultraviolet light, so that the baffle can be stably fixed for a long time, and the reliability is improved.
The preparation of the deep ultraviolet LED package structure of the embodiment includes the following steps:
(1) processing the ceramic substrate to form a square bottom plate, four dams, a quadrangular prism in the middle, and punching the corresponding part of the quadrangular prism from the bottom of the substrate to form a hollow quadrangular prism; the hollow quadrangular prisms are arranged in a periodic rectangular array mode;
(2) bonding the chip to the surface of the substrate (i.e., the concave surface) and the top of the hollow quadrangular prism (i.e., the convex surface) by a bonding process;
(3) the upper parts of the three adjacent box dams are respectively provided with a substrate groove for embedding the glass cover plate, and the three grooves are positioned on the same horizontal plane;
(4) a parallel thin seam penetrating through the dam is formed in the other dam, and the parallel thin seam and the three grooves are located on the same horizontal plane; a vertical seam perpendicular to the parallel thin seam is formed in the box dam, and the opening direction of the vertical seam is perpendicular to the parallel seam; the parallel thin slits are intersected with the vertical slits; the vertical slits extend vertically until slightly passing through the parallel sipes;
(5) a baffle is arranged in the vertical slot, and the baffle can freely move in the vertical slot; the baffle is used for fixing the glass cover plate;
(6) the upper part of the baffle, namely the upper end of the vertical seam, is filled with fixing glue, the fixing glue can be melted by heating and hardened without heating, and the baffle can be stably fixed for a long time without ultraviolet irradiation, so that the whole glass cover plate is fixed.
Simulation test:
the present embodiment uses finite time domain difference (FDTD) optical simulation software to study the influence of the planar substrate and the substrate of the present embodiment on the light extraction efficiency.
Simulation setting:
(1) simulation dimension: 2D;
(2) a simulation area: 12 x 8 μm;
(3) a power monitor: 0.3 μm above the light emitting side of the device;
(4) boundary conditions: the periphery is provided with a PML perfect absorbing layer;
(5) a dipole light source: 5, the light-emitting wavelength is 360nm, the horizontal spacing is 1.5 mu m, and the distance from the substrate is 0.1 mu m.
Basic parameter settings (size, refractive index, extinction coefficient) of the device structure:
(1) AlN substrate: 10 μm by 1 μm, a wall substrate with 10 μm by 1 μm by 5 μm periphery, 2.18, 0;
(2) a glass cover plate: 8 μm by 0.5 μm, 2.1458, 0;
(3) and (3) packaging structure: a planar substrate and the substrate with the hollow quadrangular prism structure of the present embodiment were used, respectively, wherein the cylinder size of the hollow quadrangular prism structure was 1 μm × 3 μm, the refractive index was 2.18, and the extinction coefficient was 0. The column interior cavity size of 0.4 μm 3.7 μm, filled with air.
Fig. 3 is a graph showing the light extraction efficiency of the TE and TM light modes of the LED packaged with the planar substrate and the hollow quadrangular prism structure of the present invention, and it can be seen that the light extraction efficiency of the TE and TM light modes of the LED packaged with the planar substrate is 51.46% and 7.8%, and after the hollow quadrangular prism structure is added, the light extraction efficiency becomes 56.94% and 11.48%, because of the hollow quadrangular prism structure, some of the chips are raised to a certain height, so that the light can more easily reach the interface of the glass cover plate, and because of the air with a lower refractive index existing in the pillar, the light can more easily be totally reflected, so that the light emitted toward the substrate is reflected back to the emitting surface, so that the light extraction efficiency is increased, and the light extraction efficiency of the TE and TM light modes are respectively increased by 10.64% and 47.18%. Therefore, it can be shown that the hollow quadrangular prism structure can greatly and effectively improve the light extraction efficiency.
The hollow quadrangular prism in the embodiment can also be a hollow boss with other shapes, such as a hollow hexagonal prism, a hollow cylinder, a hollow circular truncated cone and the like.
The hollow quadrangular prism in the present embodiment may also adopt other periodic array arrangement modes, such as a hexagonal array, a rhombic array, and the like.
The bottom plate in the embodiment can also be in other shapes, and the glass cover plate can also be fixed on the dam in other modes.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (10)
1. The substrate of the deep ultraviolet LED comprises a bottom plate and a dam, and is characterized in that one surface of the bottom plate, which is used for mounting deep ultraviolet LED chips, is provided with a plurality of hollow bosses used for mounting the deep ultraviolet LED chips; the cavity of the hollow boss is communicated with the outside.
2. The deep ultraviolet LED submount of claim 1, wherein the hollow bosses are quadrangular.
3. The deep ultraviolet LED substrate according to claim 1 or 2, wherein the plurality of hollow bosses are arranged in a periodic rectangular array.
4. A deep ultraviolet LED package structure, comprising the substrate of the deep ultraviolet LED according to any one of claims 1 to 3.
5. The deep ultraviolet LED package structure of claim 4, wherein the bottom plate is square.
6. The deep ultraviolet LED package structure of claim 5, further comprising a glass cover plate; the glass cover plate is installed on the dam in a jogged mode; the glass cover plate and the substrate form a closed structure.
7. The deep ultraviolet LED package structure of claim 6, wherein the dam comprises four faces, three of the four faces are respectively provided with a groove for embedding the glass cover plate, and the other face is provided with a parallel slit for the glass cover plate to pass through.
8. The deep ultraviolet LED package structure of claim 7, wherein the dam further has a vertical slit with an opening direction perpendicular to the parallel slits; the parallel seam intersects the vertical seam; a baffle plate for fixing the glass cover plate is arranged on the vertical seam; the baffle is fixed on the base plate through an adhesive filled in the vertical seam.
9. The deep ultraviolet LED package structure of claim 8, wherein the adhesive is a hot melt adhesive.
10. The deep ultraviolet LED package structure of claim 5, wherein the bottom plate has a concave surface and a convex surface, the convex surface being an upper surface of the boss; and the concave surface and the convex surface are both provided with deep ultraviolet LED chips.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111500251.2A CN114300596A (en) | 2021-12-09 | 2021-12-09 | Substrate of deep ultraviolet LED and packaging structure of deep ultraviolet LED |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111500251.2A CN114300596A (en) | 2021-12-09 | 2021-12-09 | Substrate of deep ultraviolet LED and packaging structure of deep ultraviolet LED |
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| CN114300596A true CN114300596A (en) | 2022-04-08 |
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2021
- 2021-12-09 CN CN202111500251.2A patent/CN114300596A/en active Pending
Patent Citations (10)
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|---|---|---|---|---|
| US20100244053A1 (en) * | 2009-03-30 | 2010-09-30 | Jing-Jie Dai | Light emitting device having pillar structure with hollow structure and the forming method thereof |
| CN101752354A (en) * | 2009-12-18 | 2010-06-23 | 中山大学 | Packaging substrate structure for LED and production method thereof |
| JP2011159812A (en) * | 2010-02-01 | 2011-08-18 | Panasonic Electric Works Co Ltd | Light emitting device |
| US20120138980A1 (en) * | 2010-12-02 | 2012-06-07 | Epistar Corporation | Optoelectronic device and method for manufacturing the same |
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