CN114290765A - Superconductive aluminum-based copper-clad plate and manufacturing method thereof - Google Patents
Superconductive aluminum-based copper-clad plate and manufacturing method thereof Download PDFInfo
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 88
- 238000004519 manufacturing process Methods 0.000 title claims description 18
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- 239000012790 adhesive layer Substances 0.000 claims abstract description 87
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 27
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 230000008569 process Effects 0.000 claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000011889 copper foil Substances 0.000 claims abstract description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 30
- 238000000576 coating method Methods 0.000 claims description 22
- 238000003825 pressing Methods 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000007745 plasma electrolytic oxidation reaction Methods 0.000 claims description 12
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- 229920000647 polyepoxide Polymers 0.000 claims description 9
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 12
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- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
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Abstract
The invention relates to the field of aluminum-based copper-clad plates, in particular to a superconducting aluminum-based copper-clad plate, which comprises an aluminum substrate and a copper foil compounded on the surface of the aluminum substrate, wherein one surface of the aluminum substrate is provided with an aluminum oxide layer, and a double-layer insulating heat-conducting adhesive layer is compounded between the copper foil and the aluminum substrate; the other surface of the aluminum substrate is polished to form a processed surface, and the processed surface is provided with a porous aluminum oxide layer; the double-layer insulation heat conduction adhesive layer comprises a first insulation heat conduction adhesive layer and a second insulation heat conduction adhesive layer; after the first insulating heat-conducting adhesive layer and the second insulating heat-conducting adhesive layer are overlapped in a double-layer mode, process pinholes generated between the layers can be staggered mutually to form shielding; the thickness of the double-layer insulating heat-conducting adhesive layer is H; wherein the thickness value range is as follows: h is more than or equal to 50 mu m and less than or equal to 70 mu m. The material has low thermal resistance and better heat dissipation under the condition of consistent thermal conductivity coefficient. The withstand voltage can reach more than 3KV DC, and the stability is good. The warping degree of the plate is low and can be controlled within less than or equal to 0.5 mm.
Description
Technical Field
The invention relates to the field of aluminum-based copper-clad plates, in particular to a superconducting aluminum-based copper-clad plate and a manufacturing method thereof.
Background
The existing aluminum-based copper-clad plate on the market generally comprises an aluminum substrate, an insulating layer and a copper foil, in order to improve the heat conduction capability of the insulating layer, fillers with strong heat conductivity such as silicon powder and the like are often added into epoxy resin insulating glue according to a certain proportion, an insulating heat-conducting glue layer is formed through the technological processes of dispersion, curing and the like, and the aluminum-based copper-clad plate bonded by the aluminum substrate, the insulating layer and the copper foil is realized through high-temperature pressing; the quality of the heat conduction effect depends on the shape, size and quantity of the insulating heat conduction filler filled in the epoxy resin adhesive, and the insulation effect depends on the epoxy resin adhesive. Because the thermal conductivity of epoxy resin is poor and the thickness of the layer of glue is generally more than 100 microns in order to achieve a certain insulation resistance; more specifically, the thickness of a single layer of a double-layer laminated insulating layer is 50-70 um in the prior art in the industry; or the single-layer thickness is 110-150 um, and the heat dissipation working principle of the aluminum-based copper-clad plate is as follows: the surface of the power device is attached to the circuit layer, heat generated by the device is conducted to the aluminum-based base layer through the insulating layer and then diffused to the outside of the module through the aluminum-based substrate, and heat dissipation of the device is achieved; the thicker the insulating layer is, the better the insulating effect is, but the radiating effect is poor, so that the volume size of the existing insulating layer for taking into account heat dissipation and insulativity (pressure resistance) and matching the existing electronic product, which cannot be well, is smaller and smaller, the power density is larger and larger, and the heat dissipation performance is higher and higher.
In view of this, the present application is specifically made.
Disclosure of Invention
The first purpose of the invention is to provide a superconductive aluminum-based copper-clad plate, which is characterized in that a processing surface is formed by polishing the other surface of an aluminum substrate, and a porous aluminum oxide layer is arranged on the processing surface; in addition, a double-layer insulation heat conduction adhesive layer structure is introduced, namely, the gap of a glue spreader of a coating machine is controlled during production so as to meet the requirement of a sequential coating process of a first insulation heat conduction adhesive layer and a second insulation heat conduction adhesive layer, wherein process pinholes generated between the layers can be mutually staggered and shielded after the first insulation heat conduction adhesive layer and the second insulation heat conduction adhesive layer form double-layer superposition; so set up, great pinhole, first insulating heat conduction glue film and second insulating heat conduction glue film under the semi-solid state, two-layer setting from top to bottom can be in pressfitting and coating process respectively under pressure and the glue flow effect infiltration each other, can compensate the defect of current individual layer glue technology pinhole, reduce the cavitation effect on double-deck insulating heat conduction glue film, improve off-the-shelf insulating nature, and then improve the resistance to pressure. The thickness of the double-layer insulating heat-conducting adhesive layer is controlled to be more than or equal to 50 mu m and less than or equal to 70 mu m. Under the condition of consistent heat conductivity coefficient of the material, the thermal resistance is low, and the heat dissipation performance is better. The withstand voltage can reach more than 3KV DC, and the stability is good. The warping degree of the plate is low and can be controlled within less than or equal to 0.5 mm.
The second purpose of the invention is to provide a manufacturing method of the superconductive aluminum-based copper-clad plate, which comprises the steps of assembling an aluminum substrate into a clamp, and carrying out micro-arc oxidation on one surface of the aluminum substrate after oil removal and cleaning to prepare an aluminum oxide layer; polishing the other surface of the aluminum alloy by using a 1000-mesh brush roller, and performing micro-arc oxidation to prepare a porous aluminum oxide layer; finally, adopting a nano hole sealing technology, wherein the hole sealing thickness is 4-8 μm; the working temperature in the micro-arc oxidation process is as follows: 5-18 ℃; coating a first insulating heat-conducting adhesive layer on the surface of the copper foil; in order to ensure the preset thickness value of the double-layer insulating heat-conducting adhesive layer; the coating thickness of the first insulating heat-conducting adhesive layer is controlled, and when the first insulating heat-conducting adhesive layer is coated, the second insulating heat-conducting adhesive layer is continuously coated; the process pinholes generated between the layers can be staggered and shielded after the double layers are overlapped; after the two layers of insulating heat-conducting adhesive layers are coated, performing high-temperature curing; and contacting and pressing the double-layer insulating heat-conducting adhesive layer with the porous alumina layer formed on the aluminum substrate to obtain the aluminum-based copper-clad plate.
The embodiment of the invention is realized by the following steps:
a superconductive aluminum-based copper-clad plate comprises: the aluminum substrate and the copper foil compounded on the surface of the aluminum substrate, wherein one surface of the aluminum substrate is provided with an aluminum oxide layer, and a double-layer insulating heat-conducting adhesive layer is compounded between the copper foil and the aluminum substrate;
the other surface of the aluminum substrate is subjected to polishing treatment, and a porous aluminum oxide layer is arranged on the treated surface;
the double-layer insulating heat-conducting adhesive layer comprises a first insulating heat-conducting adhesive layer and a second insulating heat-conducting adhesive layer; after the first insulating heat-conducting adhesive layer and the second insulating heat-conducting adhesive layer are overlapped in a double-layer mode, process pinholes generated between the layers can be staggered mutually to form shielding;
the thickness of the double-layer insulating heat-conducting adhesive layer is H; wherein the thickness value range is as follows: h is more than or equal to 50 mu m and less than or equal to 70 mu m.
Further, the thickness of the first insulating and heat conducting glue layer is A; the thickness of the second insulating heat-conducting adhesive layer is B; wherein the thickness value range is as follows: 26 mu m or less of A or B or less of 40 mu m, and the heat-conducting filler of the double-layer insulating heat-conducting adhesive layer is selected from spherical alumina and alpha alumina; the spherical alumina can partially or completely fill gaps among the alpha alumina.
Further, the thickness of the aluminum substrate is 0.6mm-0.8 mm.
Further, the thickness of the porous alumina layer is 4-8 μm.
Further, a golden yellow coating is electrophoresed on the outer side of the aluminum oxide layer.
A method for manufacturing a superconducting aluminum-based copper-clad plate according to any one of claims 1 to 6, comprising the following steps:
step 2: the surface of the copper foil is coated with the first insulating heat-conducting adhesive layer; in order to ensure the preset thickness value of the double-layer insulating heat-conducting adhesive layer; controlling the coating thickness of the first insulating heat-conducting adhesive layer, and continuously coating the second insulating heat-conducting adhesive layer after the first insulating heat-conducting adhesive layer is coated; the process pinholes generated between the layers can be staggered and shielded after the double layers are overlapped;
and step 3: after the two layers of insulating heat-conducting adhesive layers are coated, performing high-temperature curing; and contacting and pressing the double-layer insulating heat-conducting adhesive layer with the porous alumina layer formed on the aluminum substrate to obtain the aluminum-based copper-clad plate.
Further, the double-layer insulation heat-conducting adhesive layer is prepared from epoxy resin, a toughening agent, a coupling agent, a curing agent and a heat-conducting filler, wherein the content of the heat-conducting filler is 40-80 wt%.
Further, the pressing is vacuum pre-pressing and then vacuum pressing.
Furthermore, the temperature of the vacuum pressing and pressing is 150 ℃ and 250 ℃, and the pressure is 500 psi and 600 psi.
The technical scheme of the embodiment of the invention has the beneficial effects that:
the embodiment of the invention provides a superconductive aluminum-based copper-clad plate in the using process.
In general, according to the superconducting aluminum-based copper-clad plate provided by the embodiment of the invention, the other surface of the aluminum substrate 1 is subjected to polishing treatment, and the treated surface is provided with a porous aluminum oxide layer 5; in addition, a double-layer insulating heat-conducting adhesive layer 4 structure is introduced, namely, the gap of a glue spreader of a coating machine is controlled during production so as to meet the requirement of a sequential coating process of a first insulating heat-conducting adhesive layer 41 and a second insulating heat-conducting adhesive layer 42, wherein process pinholes generated between the layers can be mutually staggered and shielded after the first insulating heat-conducting adhesive layer 41 and the second insulating heat-conducting adhesive layer 42 form double layers; so set up, great pinhole, first insulating heat conduction glue film 41 and second insulating heat conduction glue film 42 are under the semi-solid state, and upper and lower two-layer setting can be in pressfitting and coating process respectively under pressure and the glue flow effect infiltration each other, can compensate the defect of current individual layer glue technology pinhole, reduces the hole effect of double-deck insulating heat conduction glue film 4, improves off-the-shelf insulating nature, and then improves the resistance to pressure. The thickness of the double-layer insulating heat-conducting adhesive layer 4 is controlled to be more than or equal to 50 mu m and less than or equal to 70 mu m. Under the condition of consistent heat conductivity coefficient of the material, the thermal resistance is low, and the heat dissipation performance is better. The withstand voltage can reach 3 KV.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic diagram of the internal structure of a superconductive aluminum-based copper-clad plate provided by the embodiment of the invention;
FIG. 2 is a schematic structural diagram of a cross section of a column of the superconducting aluminum-based copper-clad plate provided by the embodiment of the invention; .
Fig. 3 is a schematic structural diagram of a stirring reaction kettle for producing a double-layer insulating and heat-conducting adhesive layer according to an embodiment of the present invention;
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "parallel," "perpendicular," and the like do not require that the components be absolutely parallel or perpendicular, but may be slightly inclined. For example, "parallel" merely means that the directions are more parallel relative to "perpendicular," and does not mean that the structures are necessarily perfectly parallel, but may be slightly tilted.
The terms "substantially", "essentially", and the like are intended to indicate that the relative terms are not required to be absolutely exact, but may have some deviation. For example: "substantially equal" does not mean absolute equality, but it is difficult to achieve absolute equality in actual production and operation, and some deviation generally exists. Thus, in addition to absolute equality, "substantially equal" also includes the above-described case where there is some deviation. In this case, unless otherwise specified, terms such as "substantially", and the like are used in a similar manner to those described above.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1
Referring to fig. 1 and fig. 2, the present embodiment provides a superconducting aluminum-based copper-clad plate, including: the aluminum base plate 1 and the copper foil 2 compounded on the surface of the aluminum base plate 1, wherein one surface of the aluminum base plate 1 is provided with an aluminum oxide layer 3, and a double-layer insulating heat-conducting glue layer 4 is compounded between the copper foil 2 and the aluminum base plate 1;
a processed surface of the other surface of the aluminum substrate 1 which is polished, the processed surface having a porous alumina layer 5;
the double-layer insulating heat-conducting adhesive layer 4 comprises a first insulating heat-conducting adhesive layer 41 and a second insulating heat-conducting adhesive layer 42; after the first insulating heat-conducting adhesive layer 41 and the second insulating heat-conducting adhesive layer 42 are overlapped in a double-layer mode, process pinholes generated between the layers can be staggered mutually to form shielding; so set up, great pinhole, first insulating heat conduction glue film 41 and second insulating heat conduction glue film 42 are under the semi-solid state, and upper and lower two-layer setting can be in pressfitting and coating process respectively under pressure and the glue flow effect infiltration each other, can compensate the defect of current individual layer glue technology pinhole, reduces the hole effect of double-deck insulating heat conduction glue film 4, improves off-the-shelf insulating nature, and then improves the resistance to pressure. More specifically, the thickness of the double-layer insulating and heat-conducting adhesive layer 4 is H; wherein the thickness value range is as follows: h is more than or equal to 50 mu m and less than or equal to 70 mu m. In this embodiment, the thickness of the first insulating and heat conducting adhesive layer 41 is a; the thickness of the second insulating and heat-conducting adhesive layer 42 is B; wherein the thickness value range is as follows: 26 μm or less of A or B or less of 40 μm. The thickness of the layer of glue is generally more than 100 microns in order to meet the requirements of poor thermal conductivity of the existing epoxy resin and reach a certain insulation resistance value; particularly, the thickness of a single layer is 50-70 um when a double-layer laminated insulating layer is adopted in the prior art in the industry; or the single-layer thickness is 110-150 um, and the heat dissipation working principle of the aluminum-based copper-clad plate is as follows: the surface of the power device is attached to the circuit layer, heat generated by the device is conducted to the aluminum-based base layer through the insulating layer and then diffused to the outside of the module through the aluminum-based substrate, and heat dissipation of the device is achieved; the thicker the insulating layer is, the better the insulating effect is, but the radiating effect is poor, so that the volume size of the existing insulating layer for taking into account heat dissipation and insulativity (pressure resistance) and matching the existing electronic product, which cannot be well, is smaller and smaller, the power density is larger and larger, and the heat dissipation performance is higher and higher.
It should be added that, in the process production of the stirring link of the double-layer insulating and heat-conducting adhesive layer 4, spatial multi-motion mixing and stirring are adopted, and meanwhile, mixing flow can be generated in the radial direction and the axial direction, and in the specific production process, firstly, the glue raw material is added into the stirring reaction kettle 6 to be stirred and mixed according to the existing mature process; a stirring motor 7 is arranged in the stirring reaction kettle 6, the stirring motor 7 drives the rotating shaft 8 and the stirring blades 9 to synchronously rotate, specifically, as shown in fig. 3, the vertical height distance between the bottom of the rotating shaft 8 and the bottom of the stirring reaction kettle 6 is h1, the vertical height distance between the lowest end of the free end of the stirring blade 9 positioned at the bottom of the rotating shaft 8 and the bottom of the stirring reaction kettle 6 is h2, h1 is more than h2, the space of a discharging area is ensured not to be blocked, and meanwhile, the bottom of the stirring reaction kettle 6 is arranged to be in an inverted cone shape; the arrangement is that the stirring blades 9 at the bottom of the rotating shaft 8 and the stirring reaction kettle 6 with the inverted cone-shaped bottom form a diamond-shaped space, as the stirring blades 9 are inclined upwards, the deflection of the shaft end is reduced, and the critical rotating speed of the rotating shaft 8 is increased, the glue close to the stirring reaction kettle 6 with the inverted cone-shaped bottom can be stirred and mixed at a high speed by the stirring blades 9, and generates shear flow, and the glue close to the middle area of the diamond-shaped space, namely the glue close to the bottom end of the rotating shaft 8, and the glue in the middle of the diamond-shaped space continue to participate in mixing and stirring under the action of vortex generated by peripheral high-speed mixing, flow guide and move upwards along the inclined plane with the inverted cone-shaped bottom, and then stir with the glue in the layer formed by the stirring blades 9 at the upper end, and the above-mentioned steps are repeated in such a cycle, so as to ensure uniform mixing and stirring; the viscous glue is ensured to generate convection circulation and turbulent diffusion under the action of the stirring blades 9. Certainly, the bottom glue near the bottom of the stirring reaction kettle 6 is less interfered by the vortex, is less obvious in diversion effect, and can be orderly discharged from the bottom of the stirring reaction kettle 6 through the suction pipe by the rotation of the lower layer area in the middle of the rhombic space; a double-layer filter screen structure is arranged at the discharge port of the suction pipe; specifically, a 150-mesh double-layer filter screen is adopted; because the produced glue film is thin, the impurity content of the glue is required to be lower, and the poor pressure resistance of the finished product is reduced; on the other hand, the stirring reaction kettle 6 with the inverted cone-shaped bottom has a guiding and discharging effect on the glue, the residue of the glue at the bottom of the stirring reaction kettle 6 is reduced, the stirring convection at the bottom is increased, and the effect and the quality of subsequent glue production are further ensured to be improved.
Moreover, the coating production process comprises the following steps: and filtering the glue by adopting a double-layer 150-mesh filter screen before the glue reaches the coating head of the coating machine. Because the produced glue film is thin, the impurity content of the glue is required to be lower, and the poor pressure resistance of the finished product is reduced.
In summary, in the superconducting aluminum-based copper-clad plate provided in this embodiment, the other surface of the aluminum substrate 1 is polished to form a processed surface, and the processed surface has a porous aluminum oxide layer 5; in addition, a double-layer insulating heat-conducting adhesive layer 4 structure is introduced, namely, the gap of a glue spreader of a coating machine is controlled during production so as to meet the requirement of a sequential coating process of a first insulating heat-conducting adhesive layer 41 and a second insulating heat-conducting adhesive layer 42, wherein process pinholes generated between the layers can be mutually staggered and shielded after the first insulating heat-conducting adhesive layer 41 and the second insulating heat-conducting adhesive layer 42 form double layers; so set up, great pinhole, first insulating heat conduction glue film 41 and second insulating heat conduction glue film 42 are under the semi-solid state, and upper and lower two-layer setting can be in pressfitting and coating process respectively under pressure and the glue flow effect infiltration each other, can compensate the defect of current individual layer glue technology pinhole, reduces the hole effect of double-deck insulating heat conduction glue film 4, improves off-the-shelf insulating nature, and then improves the resistance to pressure. The thickness of the double-layer insulating heat-conducting adhesive layer 4 is controlled to be more than or equal to 50 mu m and less than or equal to 66 mu m. Under the condition of consistent heat conductivity coefficient of the material, the thermal resistance is low, and the heat dissipation performance is better. The withstand voltage can reach more than 3KV DC, and the stability is good. The warping degree of the plate is low and can be controlled within less than or equal to 0.5 mm.
The superconducting aluminum-based copper-clad plate prepared in example 1 was tested, and the test results are shown in table 1:
| main performance index | Examples |
| Coefficient of thermal conductivity (W/m.k) | 2.4-2.6 |
| Peel strength (N/mm) | 1.5-2.0 |
| Withstand voltage (kV) | ＞3 |
| Thermal resistance (cm)2K/W) | 0.55 |
In addition, in the present embodiment, the heat conductive filler of the double-layer insulating heat conductive adhesive layer 4 is selected from spherical alumina and α -alumina; the spherical alumina can partially or completely fill gaps among the alpha alumina. Further, in the heat conductive filler in the embodiment, the spherical alumina has a particle size of 3 to 5 um; 20-40% of mass percentage; the grain size of alpha alumina (irregular alumina) is 3-5 um; the mass percentage content is 60-80%; through the proportion, the spherical alumina can partially or completely fill gaps among alpha alumina; thereby improving the fluidity of the glue. By stacking and filling regular and irregular filler particle sizes, the filling rate of small particle sizes can increase the physical contact of the heat-conducting particle pieces, and the interaction between the particles is enhanced, so that a complete heat-conducting insulating passage is formed, and the heat-conducting performance of the double-layer insulating heat-conducting adhesive layer 4 is greatly improved.
In a preferred embodiment, the spherical alumina has a particle size of 3 to 5 um; 20-40% of mass percentage; the grain size of alpha alumina (irregular alumina) is 3-5 um; the mass percentage content is 60-80%; the interaction and the mutual matching of the particles enable the heat conducting particles in the filling system to form effective heat conducting channels, so that the overall heat conducting performance is more excellent. In addition, in the process of matching with the porous alumina layer structure, the epoxy resin insulating glue permeates into the holes under the action of pressure in the pressing process of the aluminum-based copper-clad plate, so that a larger-area aluminum substrate-insulating glue contact interface can be formed at the interface, the contact area and the bonding force of the insulating glue and the aluminum substrate are effectively increased, the bearing capacity to thermal stress can be effectively improved by the contact mode, and the reliability of the aluminum-based copper-clad plate is further improved.
In this embodiment, the aluminum substrate 1 has a thickness of 0.6mm to 0.8 mm. Under the condition of ensuring the overall strength and the thermal conductivity of the aluminum-based copper-clad plate, the thickness of the aluminum substrate 1 is preferably 0.6mm-0.8 mm. So as to simultaneously meet the reliability, pressure resistance and heat conductivity of the aluminum-based copper-clad plate.
In this example, the thickness of the porous alumina layer 5 is 4 μm to 8 μm.
In this embodiment, a golden yellow coating is electrophoresed on the outside of the alumina layer 3. Is convenient to distinguish and plays the role of identification.
A method for manufacturing a superconducting aluminum-based copper-clad plate comprises the following steps:
step 2: the surface of the copper foil 2 is coated with a first insulating heat-conducting adhesive layer 41; in order to ensure the preset thickness value of the double-layer insulating and heat-conducting adhesive layer 4; to control the coating thickness of the first insulating and heat-conducting adhesive layer 41, and when the first insulating and heat-conducting adhesive layer 41 is coated, the second insulating and heat-conducting adhesive layer 42 is continuously coated; the process pinholes generated between the layers can be staggered and shielded after the double layers are overlapped;
and step 3: after the two layers of insulating heat-conducting adhesive layers are coated, performing high-temperature curing; and (3) contacting and pressing the double-layer insulating heat-conducting adhesive layer 4 and the porous alumina layer 5 formed on the aluminum substrate 1 to obtain the aluminum-based copper-clad plate.
In this embodiment, the double-layer insulating and heat-conducting adhesive layer 4 is prepared from epoxy resin, a toughening agent, a coupling agent, a curing agent and a heat-conducting filler, and the content of the heat-conducting filler is 40-80 wt%.
In this embodiment, the pressing is performed by vacuum pre-pressing and then vacuum pressing.
In this embodiment, the temperature of the vacuum pressing is 150-.
The specific operation steps have already been described above, and are not described herein again.
In summary, the above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A superconductive aluminum-based copper-clad plate is characterized by comprising: the aluminum-based panel comprises an aluminum substrate (1) and a copper foil (2) compounded on the surface of the aluminum substrate (1), wherein one surface of the aluminum substrate (1) is provided with an aluminum oxide layer (3), and a double-layer insulating heat-conducting adhesive layer (4) is compounded between the copper foil (2) and the aluminum substrate (1);
the other surface of the aluminum substrate (1) is polished to form a treated surface, and the treated surface is provided with a porous aluminum oxide layer (5);
the double-layer insulating heat-conducting adhesive layer (4) comprises a first insulating heat-conducting adhesive layer (41) and a second insulating heat-conducting adhesive layer (42); after the first insulating heat-conducting adhesive layer (41) and the second insulating heat-conducting adhesive layer (42) form double layers, process pinholes generated between the layers can be staggered mutually to form shielding;
the thickness of the double-layer insulating heat-conducting adhesive layer (4) is H; wherein the thickness value range is as follows: h is more than or equal to 50 mu m and less than or equal to 70 mu m.
2. A superconducting aluminum-based copper-clad plate according to claim 1, wherein the thickness of the first insulating and heat-conducting adhesive layer (41) is a; the thickness of the second insulating heat-conducting adhesive layer (42) is B; wherein the thickness value range is as follows: 26 μm or less of A or B or less of 40 μm.
3. A superconducting aluminum-based copper-clad plate according to claim 1, wherein the heat conductive filler of the double-layer insulating heat conductive adhesive layer (4) is selected from spherical alumina and alpha alumina; the spherical alumina can partially or completely fill gaps among the alpha alumina.
4. A superconducting aluminum-based copper-clad plate according to claim 1, wherein the aluminum substrate (1) has a thickness of 0.6mm to 0.8 mm.
5. A superconducting aluminum-based copper-clad plate according to claim 1, wherein the thickness of said porous alumina layer (5) is 4 μm to 8 μm.
6. A superconducting aluminum-based copper-clad plate according to claim 1, wherein the aluminum oxide layer (3) is electrophoresed on its outside with a gold coating.
7. A method for manufacturing a superconducting aluminum-based copper-clad plate according to any one of claims 1 to 6, which is characterized by comprising the following steps:
step 1, assembling the aluminum substrate (1) into a clamp, and carrying out micro-arc oxidation on one surface of the aluminum substrate after oil removal and cleaning to prepare an aluminum oxide layer; polishing the other surface of the aluminum oxide layer by using a 1000-mesh brush roller, and performing micro-arc oxidation to prepare the porous aluminum oxide layer (5); finally, adopting a nano hole sealing technology, wherein the hole sealing thickness is 4-8 μm; the working temperature of the micro-arc oxidation process is as follows: 5-18 ℃;
step 2: the surface of the copper foil (2) is coated with the first insulating heat-conducting adhesive layer (41); in order to ensure the preset thickness value of the double-layer insulating heat-conducting adhesive layer (4); the coating thickness of the first insulating and heat-conducting adhesive layer (41) is controlled, and the second insulating and heat-conducting adhesive layer (42) is continuously coated after the first insulating and heat-conducting adhesive layer (41) is coated; the process pinholes generated between the layers can be staggered and shielded after the double layers are overlapped;
and step 3: after the two layers of insulating heat-conducting adhesive layers are coated, performing high-temperature curing; and (3) contacting and pressing the double-layer insulating heat-conducting adhesive layer (4) and the porous alumina layer (5) formed on the aluminum substrate (1) to obtain the aluminum-based copper-clad plate.
8. The method for manufacturing the superconducting aluminum-based copper-clad plate according to claim 7, wherein the double-layer insulating heat-conducting adhesive layer (4) is prepared from epoxy resin, a toughening agent, a coupling agent, a curing agent and a heat-conducting filler, and the content of the heat-conducting filler is 40-80 wt%.
9. The method for manufacturing the superconducting aluminum-based copper-clad plate according to claim 7, wherein the pressing is vacuum pre-pressing and then vacuum press-pressing.
10. The method for manufacturing the superconducting aluminum-based copper-clad plate according to claim 9, wherein the temperature of the vacuum lamination pressing is 150-250 ℃, and the pressure is 500-600 psi.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115104940A (en) * | 2022-07-25 | 2022-09-27 | 陕西天柔华创电子科技有限公司 | Heating toilet seat cushion and preparation process thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101589547B1 (en) * | 2014-09-04 | 2016-02-04 | 정병직 | Metal copper clad laminate capable of withstand voltage measurement and method of manufacturing the same |
| CN207057627U (en) * | 2017-06-22 | 2018-03-02 | 格林美股份有限公司 | A kind of stirred autoclave for preparing super-fine cobalt powder |
| CN108215405A (en) * | 2017-12-29 | 2018-06-29 | 新奥石墨烯技术有限公司 | Mobile terminal backboard and preparation method thereof and mobile terminal |
| CN209718197U (en) * | 2019-01-21 | 2019-12-03 | 郑州市友城机器制造有限公司 | A kind of liquid additive storage agitating device |
| CN110591630A (en) * | 2019-09-20 | 2019-12-20 | 昆山市中迪新材料技术有限公司 | Polyurethane adhesive component, bi-component polyurethane adhesive and application method thereof |
| CN111063521A (en) * | 2019-12-30 | 2020-04-24 | 江苏环东电气有限公司 | Flame-retardant heat-conducting dry-type transformer encapsulating method |
| CN212266897U (en) * | 2019-11-28 | 2021-01-01 | 金安国纪科技（珠海）有限公司 | High-voltage-resistant metal-based copper-clad laminate |
| CN112277406A (en) * | 2020-10-29 | 2021-01-29 | 河南省科学院应用物理研究所有限公司 | High-reliability aluminum-based copper-clad plate and preparation method thereof |
| CN112297540A (en) * | 2020-10-29 | 2021-02-02 | 河南省科学院应用物理研究所有限公司 | Aluminum-based copper-clad plate with high thermal conductivity and preparation method thereof |
-
2022
- 2022-01-11 CN CN202210027604.XA patent/CN114290765A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101589547B1 (en) * | 2014-09-04 | 2016-02-04 | 정병직 | Metal copper clad laminate capable of withstand voltage measurement and method of manufacturing the same |
| CN207057627U (en) * | 2017-06-22 | 2018-03-02 | 格林美股份有限公司 | A kind of stirred autoclave for preparing super-fine cobalt powder |
| CN108215405A (en) * | 2017-12-29 | 2018-06-29 | 新奥石墨烯技术有限公司 | Mobile terminal backboard and preparation method thereof and mobile terminal |
| CN209718197U (en) * | 2019-01-21 | 2019-12-03 | 郑州市友城机器制造有限公司 | A kind of liquid additive storage agitating device |
| CN110591630A (en) * | 2019-09-20 | 2019-12-20 | 昆山市中迪新材料技术有限公司 | Polyurethane adhesive component, bi-component polyurethane adhesive and application method thereof |
| CN212266897U (en) * | 2019-11-28 | 2021-01-01 | 金安国纪科技（珠海）有限公司 | High-voltage-resistant metal-based copper-clad laminate |
| CN111063521A (en) * | 2019-12-30 | 2020-04-24 | 江苏环东电气有限公司 | Flame-retardant heat-conducting dry-type transformer encapsulating method |
| CN112277406A (en) * | 2020-10-29 | 2021-01-29 | 河南省科学院应用物理研究所有限公司 | High-reliability aluminum-based copper-clad plate and preparation method thereof |
| CN112297540A (en) * | 2020-10-29 | 2021-02-02 | 河南省科学院应用物理研究所有限公司 | Aluminum-based copper-clad plate with high thermal conductivity and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115104940A (en) * | 2022-07-25 | 2022-09-27 | 陕西天柔华创电子科技有限公司 | Heating toilet seat cushion and preparation process thereof |
| CN115104940B (en) * | 2022-07-25 | 2023-09-01 | 陕西天柔华创电子科技有限公司 | Heating toilet seat cushion and preparation process thereof |
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Application publication date: 20220408 |