CN114286461B

CN114286461B - Heater for heating substrate in vacuum equipment

Info

Publication number: CN114286461B
Application number: CN202210004154.2A
Authority: CN
Inventors: 廖昭亮
Original assignee: University of Science and Technology of China USTC
Current assignee: University of Science and Technology of China USTC
Priority date: 2022-01-04
Filing date: 2022-01-04
Publication date: 2022-10-28
Anticipated expiration: 2042-01-04
Also published as: CN114286461A

Abstract

The invention discloses a heater for heating a substrate in vacuum equipment, which comprises a heating unit, wherein the heating unit comprises a heat conductor, any surface of the heat conductor is set to be a flat surface, the flat surface is used for thermally contacting the heated substrate, the heat conductor is packaged with a heating element through viscose, and the heating element is provided with a pin; the current control unit is connected with the pins and controls the heating power by controlling the current of the heating element; the heating unit and the current control unit are both installed on the fixing unit, the fixing unit comprises a placing plate, the heating unit is arranged on the placing plate, a fixing piece is arranged on the placing plate, and the substrate is installed on the flat surface through the fixing piece. The invention discloses a heater for heating a substrate in vacuum equipment, which is a heater capable of being used in different environmental atmospheres, has lower cost and higher compatibility, and can meet various requirements.

Description

Heater for heating substrate in vacuum equipment

Technical Field

The invention relates to the field of thin film materials and related application science, in particular to a heater for heating a substrate in vacuum equipment.

Background

Thin film materials and related applied sciences are an emerging and rapidly developing field. Nanotechnology is a technology that is being developed in all countries today, and thin film technology is an important and relatively mature branch of nanomaterial technology. Whether in academia or industry, a great deal of effort is being devoted to studying the growth and preparation and properties of thin film materials. The current film preparation methods are many, such as Pulsed Laser Deposition (PLD), magnetron sputtering, thermal evaporation, chemical Vapor Deposition (CVD), and the like. These technical means each have the advantage of being used to prepare films of different needs. The film growth is mostly carried out at a certain substrate temperature, as low as 100 ℃ and as high as 1000 ℃. The gas atmosphere for growth is also related to the thin film to be grown and the control requirement of the stoichiometric ratio, and there are a reducing gas atmosphere, a strong oxidizing gas atmosphere, and a vacuum state. This places stringent requirements on heating the basic heater. The major heating techniques currently used in the industry are laser heating and Pyrolytic Boron Nitride (PBN) heaters. Laser heaters are expensive and are not well compatible with the system, requiring optical path design. PBN heaters are relatively inexpensive, but are not suitable for use in an ozone atmosphere, and may release contaminating gases, causing contamination of the film. Therefore, a new heater for heating a substrate in a vacuum apparatus is needed.

Disclosure of Invention

The present invention is directed to a heater for heating a substrate in a vacuum apparatus, which solves the above problems of the prior art, has low cost and high compatibility, and can be used in different environmental atmospheres.

In order to achieve the purpose, the invention provides the following scheme: the present invention provides a heater for heating a substrate in a vacuum apparatus, comprising:

the heating unit comprises a heat conductor, any surface of the heat conductor is set to be a flat surface, the flat surface is used for thermally contacting a heated substrate, the heat conductor is packaged with a heating element through viscose, and the heating element is provided with a pin;

the current control unit is connected with the pins and controls the heating power by controlling the current of the heating element;

the heating unit and the current control unit are both arranged on the fixing unit, the fixing unit comprises a placing plate, the heating unit is arranged on the placing plate, a fixing piece is arranged on the placing plate, and the substrate is arranged on the flat surface through the fixing piece.

Preferably, the heat conductor comprises at least two heat conduction layers, a gap is formed between every two adjacent heat conduction layers, any one of the heat conduction layers which is located on the outermost layer is provided with the flat surface, the heating element is packaged between the adjacent heat conduction layers through viscose, and the pins extend out of the gap between the heat conduction layers.

Preferably, the heat-conducting layer includes the ceramic plate, the ceramic plate is the rectangular plate structure, the quantity of ceramic plate is two, arbitrary the ceramic plate is provided with the planishing face, another the ceramic plate set up in place on the board.

Preferably, the heating member include the heater strip with set up in the heater strip tip the pin, the heater strip is glued through ceramic and is encapsulated in two between the ceramic plate, the current control unit is through control the electric current of heater strip comes control heating power, the heater strip is provided with a plurality of interconnect's the section of bending, and is a plurality of bend and parallel to each other between the section, it is a plurality of the section of bending is followed the length direction sequence of ceramic plate, and every the length of the section of bending with the width looks adaptation of ceramic plate.

Preferably, the current control unit comprises at least two electrodes, and the pins are electrically connected with the electrodes.

Preferably, the fixing unit further comprises a base, the electrode is arranged between the base and the placing plate, the base is detachably connected to a sample table, an electrode brush is arranged on the sample table, and the electrode brush is used for contacting the electrode.

Preferably, place and run through on the board and seted up logical groove, heating unit set up in logical groove department, just the size that leads to the groove is greater than the ceramic plate size, the edge department that leads to the groove is fixed with the overlap joint platform, does not set up the planishing face the corner overlap joint in the overlap joint bench of ceramic plate.

Preferably, a plurality of studs are arranged around the through groove, the studs sequentially penetrate through the placing plate, the electrode and the base, the fixing part comprises at least two pressing sheets, the pressing sheets press the substrate on the flat surface, the studs penetrate through the pressing sheets, compression nuts are arranged between the studs and the pressing sheets, two compression nuts are arranged on the stud part between the placing plate and the electrode, and the compression nuts are arranged between the electrode and the base.

Preferably, an insulating ceramic gasket is pressed between the compression nut and the electrode.

Preferably, the number of the pressing sheets is two, the two pressing sheets are both positioned above the flat surface, and the two pressing sheets are symmetrically arranged.

The invention discloses the following technical effects: the invention discloses a heater for heating a substrate in vacuum equipment, which comprises a heating unit, a current control unit and a fixing unit, wherein the heating unit and the current control unit are fixed by the fixing unit, the heating unit comprises a heat conductor and a heating element, the heat conductor is provided with a flat surface, the surface of the heat conductor needs to be smooth and flat, the flatness of the flat surface is ensured, the heating element is used for thermally contacting the heated substrate, the heating element is placed in the heat conductor and is packaged by glue, pins extending outside can be used for connecting the current control unit, the current control unit controls the heating power by controlling the current of the heating element, and the temperature of the substrate is controlled. The invention discloses a heater for heating a substrate in vacuum equipment, which is a heater capable of being used in different environmental atmospheres, has lower cost and higher compatibility, and can meet various requirements.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic view of a heating unit according to the present invention;

FIG. 2 is a schematic view of the internal structure of the heating unit according to the present invention;

FIG. 3 is a schematic structural view of a heater for heating a substrate in a vacuum apparatus according to the present invention;

FIG. 4 is a top view of the holding board of the present invention;

FIG. 5 is a schematic view of a heating unit according to a preferred embodiment of the present invention;

wherein, 1 is the pin, 2 is for placing the board, 3 is the ceramic plate, 4 is the heater strip, 5 is ceramic glue, 6 is the electrode, 7 is the base, 8 is logical groove, 9 is the overlap joint platform, 10 is the double-screw bolt, 11 is the preforming, 12 is gland nut, 13 is the insulating ceramic gasket, 14 is the heating film, 15 is the heat conduction cover, 16 is the ceramic package shell, 17 is the louvre, 18 is the strengthening rib, 19 is the wire, 20 is first insulating shrouding, 21 is the insulating shrouding of second.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.

Referring to fig. 1 to 4, the present invention provides a heater for substrate heating in a vacuum apparatus, which can be applied to an ultra-high vacuum system and a heating application in a vacuum apparatus requiring a process gas. In particular, typical applications include basic heat annealing in vacuum and basic heat in thin film fabrication, the specific structure of which includes:

the heating unit comprises a heat conductor, any surface of the heat conductor is set to be a flat surface, the flat surface is used for thermally contacting a heated substrate, the heat conductor is packaged with a heating element through viscose, and the heating element is provided with a pin 1;

the current control unit is connected with the pin 1 and controls the heating power by controlling the current of the heating element so as to control the temperature of the substrate;

the fixing unit, the heating unit and the current control unit are all installed on the fixing unit, the fixing unit comprises a placing plate 2, the heating unit is arranged on the placing plate 2, a fixing piece is arranged on the placing plate 2, and the substrate is installed on the flat surface through the fixing piece.

When the device is used, the heating unit and the current control unit are fixed in position by the fixing unit, wherein the heating unit is arranged on the placing plate 2 and comprises a heat conductor and a heating element, the heat conductor is provided with a surface which is smooth and flat, namely a flat surface, the flatness of the flat surface is ensured, so that the heating element is used for thermally contacting a heated substrate, the heating element is arranged in the heat conductor and is packaged by viscose glue, pins 1 extending outside can be used for connecting the current control unit, the current control unit controls the heating power by controlling the current of the heating element, so that the temperature of the substrate is controlled, the device is used for basically heating a thin film during growth, the material of the heating element can be correspondingly changed according to different requirements to meet the application, for example, for heating at higher temperature (1200 ℃), and the heating element is made of high-melting-point material such as tungsten; for the active gas atmosphere, inert materials can be selected as heating element materials, such as platinum wires, platinum-rhodium alloy wires and the like; during installation, the heating element is only required to be packaged in the heat conductor through the viscose.

Further optimize the scheme, the heat-conducting body includes at least two-layer heat-conducting layer, and be provided with the clearance between the adjacent heat-conducting layer, it is provided with the planarization to be located outmost arbitrary heat-conducting layer, the heating-up member passes through the viscose and encapsulates between adjacent heat-conducting layer, pin 1 stretches out along the clearance between the heat-conducting layer, the heat-conducting layer has two-layerly at least, the number of piles of heat-conducting layer is more, the heating-up member quantity that is located the heat-conducting layer interval department is more, and these heating-up members all connect the current control unit through pin 1, the user can utilize the current of current control unit reasonable adjustment each heating-up member, in order to provide reasonable heating power.

As a preferred embodiment, the heat-conducting layer includes ceramic plate 3, ceramic plate 3 is the rectangular plate structure, the quantity of ceramic plate 3 is two, arbitrary ceramic plate 3 is provided with the level surface, another ceramic plate 3 sets up on placing board 2, the heating member includes heater strip 4 and sets up in pin 1 of 4 tip of heater strip, heater strip 4 is glued 5 through the pottery and is packaged in between two ceramic plates 3, current control unit controls heating power through the electric current of control heater strip 4, heater strip 4 is provided with a plurality of interconnect's the section of bending, a plurality of sections of bending are parallel to each other, a plurality of sections of bending are arranged along the length direction order of ceramic plate 3, and the length of every section of bending and the width looks adaptation of ceramic plate 3. The above structure allows the heating unit to be made by enclosing the heating wire 4 and the flat ceramic plate 3 by means of the liquid ceramic paste 5, wherein one of the ceramic plates 3 has a surface which must be smooth and flat for thermal contact with the substrate to be heated.

In a further optimized scheme, the current control unit comprises at least two electrodes 6, and the pin 1 is electrically connected with the electrodes 6. The pins 1 extending outside can be used for connecting the electrodes 6. The heating power is controlled by controlling the current of the heating wire 4, thereby controlling the substrate temperature.

Further optimize the scheme, fixed unit still includes base 7, and electrode 6 sets up between base 7 and place board 2, and base 7 can be dismantled and connect in the sample bench, is equipped with the electrode brush on the sample bench, and the electrode brush is used for contact electrode 6. The base 7 is used to insert the heater into a sample holder, typically having electrode brushes for contacting the electrodes 6, so that current can be applied to heat the heating element.

Further optimization scheme places and runs through on the board 2 and has seted up logical groove 8, and the heating unit sets up in logical groove 8 department, and leads to the size of groove 8 and be greater than the size of ceramic plate 3, leads to the corner department of groove 8 and is fixed with overlap joint platform 9, does not set up the corner overlap joint on overlap joint platform 9 of the ceramic plate 3 of planishing face. Only four corners of the ceramic plate 3 have small contact with the placing plate 2 (i.e. the connection between the corners of the ceramic plate 3 and the lapping table 9), so that heat exchange between the heating unit and the placing plate 2 can be avoided, on the one hand, the loss of heating power can be reduced, on the other hand, the peripheral parts of the heating unit can be made to handle low temperature conditions, thereby forming local heating, which is very helpful to reduce possible cross contamination in vacuum.

Further optimize the scheme, be provided with a plurality of double-screw bolts 10 all around logical groove 8, double-screw bolt 10 runs through in proper order and places board 2, electrode 6 and base 7, and the mounting includes two at least preforming 11, and preforming 11 is with the substrate pressfitting on the plannar, and double-screw bolt 10 runs through preforming 11, and is equipped with gland nut 12 between double-screw bolt 10 and preforming 11, places the double-screw bolt 10 part between board 2 and the electrode 6 and is provided with two gland nut 12, is provided with gland nut 12 between electrode 6 and the base 7. By screwing each of the compression nuts 12, the pressing piece 11 can be tightly buckled to the substrate, and fastening between the placing plate 2, the electrode 6, and the base 7 can be performed.

In a further optimized scheme, an insulating ceramic gasket 13 is pressed between the compression nut 12 and the electrode 6, so that the electrode 6 and the stud 10 are electrically insulated and isolated by the insulating ceramic gasket 13.

Further optimize the scheme, the quantity of preforming 11 is two, and two preforming 11 all are located the top of planomural, and two preforming 11 symmetries set up, through two preforming 11 with the substrate pressfitting on the surface of ceramic plate 3.

The heating unit is fixed to one metal plate (i.e., the placing plate 2). The pins 1 of the heating wire 4 are fixed to the electrodes 6. The electrode 6 and the four studs 10 of the heating unit are electrically insulated by insulating ceramic spacers 13. The base 7 is used for inserting the heater on a sample platform, there is the electrode brush on the general sample platform, be used for contacting electrode 6, thereby can the electric current of getting through, heat the heating element, and the ceramic plate 3 only has four angles and places the overlap joint platform 9 of the logical groove 8 department of board 2 and have little contact, can avoid the heating element like this and place the heat exchange of board 2, reduce the loss of heating power on the one hand, can let the peripheral part of heating element handle low temperature state on the one hand, thereby form the heating of local, this is very helpful to reducing possible cross contamination in the vacuum. The ceramic glue 5 can be used at high temperature (up to 1400 ℃) after being cured, and does not deflate in vacuum, and the ceramic plate 3 can be made of alumina ceramic which can bear the same high temperature, so the device can be used at high temperature. In the case of using an inert metal, such as platinum, platinum iridium, platinum rhodium, etc., it can be used in some environments requiring an atmosphere, such as oxygen, ozone, etc. In the vacuum environment without atmosphere, the material of the gold hot wire with relative low price such as tungsten or nickel-chromium alloy can be selected.

As a preferred embodiment, referring to fig. 5, the heat conductor of the present invention may be a ceramic package 16, the heating element may be a heating film 14, the heating film 14 is disposed in the ceramic package 16, and a heat conduction sleeve 15 is covered outside the heating film 14, an outer side wall of the heat conduction sleeve 15 is closely attached to an inner side wall of the ceramic package 16, the heating film 14 is erected in the heat conduction sleeve 15 through a plurality of reinforcing ribs 18, the heating film 14 is used as the heating element, the heating efficiency can be reduced by using the design that the heating film 14 is erected in the heat conduction sleeve 15, and interference caused by too fast heat transfer to heating a thin film is avoided, the heat conduction sleeve 15 is provided with a plurality of heat dissipation holes 17, so that the heat transfer efficiency can be improved, and the problem of too slow heat transfer is avoided, openings are formed on the same sides of the ceramic package 16 and the heat conduction sleeve 15, a first insulating sealing plate 20 and a second insulating sealing plate 21 are respectively disposed at the openings, when the materials of the heating film 14 need to be replaced, the first insulating sealing plate 20 and the second insulating sealing plate 21 are opened, the heating film 14 can be taken out, and the materials can be replaced, and the heating film 14 is further, and the current control unit can be connected to the heating element, such as the heating film control unit 6. In addition, the above embodiment is also applicable to the heater wire 4, and when the heater wire 4 is used, the heater wire 4 may be wound into a plurality of bent sections and then bridged in the heat conductive jacket 15 by the reinforcing ribs 18.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description of the present invention, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

The above-described embodiments are merely illustrative of the preferred embodiments of the present invention, and do not limit the scope of the present invention, and various modifications and improvements of the technical solutions of the present invention can be made by those skilled in the art without departing from the spirit of the present invention, and the technical solutions of the present invention are within the scope of the present invention defined by the claims.

Claims

1. A heater for heating a substrate in a vacuum apparatus, comprising:

the heating device comprises a heating unit, wherein the heating unit comprises a heat conductor, any surface of the heat conductor is set to be a flat surface, the flat surface is used for thermally contacting a heated substrate, the heat conductor is packaged with a heating element through glue, and the heating element is provided with a pin (1);

the current control unit is connected with the pin (1), and controls the heating power by controlling the current of the heating element;

the heating unit and the current control unit are mounted on the fixing unit, the fixing unit comprises a placing plate (2), the heating unit is arranged on the placing plate (2), a fixing piece is arranged on the placing plate (2), and the substrate is mounted on the flat surface through the fixing piece;

the heat conductor comprises at least two heat conduction layers, a gap is formed between every two adjacent heat conduction layers, the flat surface is arranged on any one of the heat conduction layers positioned on the outermost layer, the heating element is packaged between the adjacent heat conduction layers through viscose, and the pins (1) extend out along the gap between the heat conduction layers;

the heat conduction layer comprises ceramic plates (3), the ceramic plates (3) are of a rectangular plate structure, the number of the ceramic plates (3) is two, one ceramic plate (3) is provided with the flattening surface, and the other ceramic plate (3) is arranged on the placing plate (2);

the heating element comprises a heating wire (4) and pins (1) arranged at the end parts of the heating wire (4), the heating wire (4) is packaged between two ceramic plates (3) through ceramic glue (5), the current control unit controls the heating power by controlling the current of the heating wire (4), the heating wire (4) is provided with a plurality of mutually connected bending sections, the bending sections are mutually parallel, the bending sections are sequentially arranged along the length direction of the ceramic plates (3), and the length of each bending section is matched with the width of the ceramic plates (3);

the current control unit comprises at least two electrodes (6), and the pin (1) is electrically connected with the electrodes (6);

the fixing unit further comprises a base (7), the electrode (6) is arranged between the base (7) and the placing plate (2), the base (7) is detachably connected to a sample table, and an electrode brush is arranged on the sample table and used for contacting the electrode (6);

place and run through on board (2) and seted up logical groove (8), heating unit set up in lead to groove (8) department, just the size that leads to groove (8) is greater than the size of ceramic plate (3), the edge that leads to groove (8) is fixed with overlap joint platform (9), does not set up the planishing face the corner overlap joint in the ceramic plate (3) on overlap joint platform (9).

2. The heater for heating a substrate in a vacuum apparatus as set forth in claim 1, wherein: the novel electrode is characterized in that a plurality of studs (10) are arranged on the periphery of the through groove (8), the studs (10) sequentially penetrate through the placing plate (2), the electrode (6) and the base (7), the fixing piece comprises at least two pressing sheets (11), the pressing sheets (11) press substrates on the flat surface, the studs (10) penetrate through the pressing sheets (11), compression nuts (12) are arranged between the studs (10) and the pressing sheets (11), two compression nuts (12) are arranged on the stud (10) between the placing plate (2) and the electrode (6), and the compression nuts (12) are arranged between the electrode (6) and the base (7).

3. The heater for heating a substrate in a vacuum apparatus as set forth in claim 2, wherein: an insulating ceramic gasket (13) is pressed between the compression nut (12) and the electrode (6).

4. The heater for heating a substrate in a vacuum apparatus as set forth in claim 2, wherein: the number of the pressing sheets (11) is two, the two pressing sheets (11) are located above the flat surface, and the two pressing sheets (11) are symmetrically arranged.