CN114280736B - Interconnection carrier plate and packaging structure - Google Patents
Interconnection carrier plate and packaging structure Download PDFInfo
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- CN114280736B CN114280736B CN202111636382.3A CN202111636382A CN114280736B CN 114280736 B CN114280736 B CN 114280736B CN 202111636382 A CN202111636382 A CN 202111636382A CN 114280736 B CN114280736 B CN 114280736B
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Abstract
An interconnection carrier and a packaging structure, wherein the interconnection carrier comprises: the optical component carrier plate is provided with a plurality of optical through hole groups which are arranged in an array manner, and each optical through hole group comprises a plurality of discrete optical through holes which penetrate through the optical component carrier plate; the positioning carrier plate is provided with a plurality of optical fiber group accommodating openings penetrating through the positioning carrier plate, the positioning carrier plate is attached to one side surface of the optical assembly carrier plate, and the optical fiber group accommodating openings are correspondingly communicated with the optical through hole groups one by one; the array optical fiber assembly comprises a plurality of discrete optical fiber groups, wherein each optical fiber group comprises a plurality of discrete optical fibers, each optical fiber group is suitable for being inserted into the corresponding accommodating opening of each optical fiber group in a one-to-one correspondence manner, and each optical fiber is suitable for being arranged opposite to the corresponding optical through hole in a one-to-one correspondence manner. The interconnection carrier plate can realize one-time alignment to realize ultra-large-capacity optical interconnection and simple and rapid optical coupling.
Description
Technical Field
The invention relates to the technical field of photoelectric hybrid packaging, in particular to an interconnection carrier plate and a packaging structure.
Background
With the rapid development of the computer industry, the speed and capacity of information processing have become standards for evaluating the quality of the field, especially the improvement of transmission speed, and the chip in the computer host can be matched with the peripheral equipment to continuously expand the functions thereof.
Optical coupling is a critical technical point limiting the efficient resolution of photoelectric conversion. Optical coupling and packaging are opto-electronic integration and the cost composition of the optical module is a relatively large part. In optical coupling, alignment between a multi-core device and an MCF is difficult and coupling efficiency is low, compared with a single-core coupling technique.
Therefore, the structure of the interconnected carrier plates in the prior art needs to be improved.
Disclosure of Invention
The invention aims to solve the technical problems of high alignment difficulty and low coupling efficiency of the interconnected carrier plates in the prior art.
In order to solve the above technical problems, the present invention provides an interconnection carrier board, including: the optical component carrier plate is provided with a plurality of optical through hole groups which are arranged in an array manner, and each optical through hole group comprises a plurality of discrete optical through holes which penetrate through the optical component carrier plate; the positioning carrier plate is provided with a plurality of optical fiber group accommodating openings penetrating through the positioning carrier plate, the positioning carrier plate is attached to one side surface of the optical assembly carrier plate, and the optical fiber group accommodating openings are correspondingly communicated with the optical through hole groups one by one; the array optical fiber assembly comprises a plurality of discrete optical fiber groups, wherein each optical fiber group comprises a plurality of discrete optical fibers, each optical fiber group is suitable for being inserted into the corresponding accommodating opening of each optical fiber group in a one-to-one correspondence manner, and each optical fiber is suitable for being arranged opposite to the corresponding optical through hole in a one-to-one correspondence manner.
Optionally, the positioning carrier plate is further provided with positioning holes located at the side part of the optical fiber group accommodating opening and arranged at intervals with the optical fiber group accommodating opening; the array fiber optic assembly further includes a cladding layer securing adjacent ones of the fiber optic groups; the interconnection carrier plate further comprises: and one end of the first positioning piece is inserted into the coating layer at the side part of the optical fiber group, and the other end of the first positioning piece is suitable for being inserted into the positioning hole.
Optionally, the aperture of the positioning hole is 200um-2000um.
Optionally, the positioning hole is filled with a buffer layer, and the other end of the first positioning piece is inserted into the buffer layer.
Optionally, the material of the buffer layer comprises teflon.
Optionally, the plurality of optical through holes in the optical through hole group are all circumscribed on a characteristic circle, the shape of the optical fiber group accommodating opening is a circular hole, and the diameter of the optical fiber group accommodating opening is larger than that of the characteristic circle.
Optionally, the difference between the diameter of the accommodating opening of the optical fiber set and the diameter of the characteristic circle is 5um-20um.
Optionally, the diameter of the optical through hole is 10um-30um.
Optionally, the light through hole is of a hollow structure; or the optical through hole is filled with a polymer material, and the light transmittance of the polymer material in the wavelength range of 800um-1600um is greater than 90%.
Optionally, the refractive index of the polymeric material is 1.47-1.57.
Optionally, a carrier pad is disposed on a surface of the optical component carrier facing away from the positioning carrier; the optical assembly carrier plate is also provided with an electric connecting piece penetrating through the optical assembly carrier plate, and the electric connecting piece and the optical through hole group are arranged at intervals; the interconnection carrier plate further comprises: the interconnection line is positioned on one side of the partial optical component carrier plate, one end of the interconnection line is connected with the carrier plate bonding pad, and the other end of the interconnection line is connected with the electric connecting piece; the optical chip is positioned on one side of a part of the optical component carrier plate, which is away from the positioning carrier plate, is electrically connected with the carrier plate bonding pad and is arranged opposite to the plurality of discrete optical through hole groups; the electric chip and the positioning carrier plate are positioned on the same side of the optical assembly carrier plate, the electric chip is positioned on the side part of the positioning carrier plate, and the electric chip is electrically connected with the electric connecting piece.
Optionally, the method further comprises: and the solder balls are positioned on the surface of the interconnection line.
The invention also provides a packaging structure, comprising: a master; the exchange chip is positioned on the master plate and is electrically connected with the master plate; a plurality of interconnected carrier plates of the invention positioned on the master plate and around the exchange chip; the interconnection carrier plate is electrically connected with the master plate.
The technical scheme of the invention has the following advantages:
according to the interconnected carrier plate provided by the technical scheme of the invention, the optical component carrier plate is provided with a plurality of optical through hole groups which are arranged in an array manner, each optical through hole group comprises a plurality of discrete optical through holes which penetrate through the optical component carrier plate, the positioning carrier plate is provided with a plurality of optical fiber group accommodating openings which penetrate through the positioning carrier plate, the positioning carrier plate is attached to one side surface of the optical component carrier plate, the optical fiber group accommodating openings are communicated with the optical through hole groups in a one-to-one correspondence manner, each optical fiber group comprises a plurality of discrete optical fibers, the optical fiber groups are suitable for being inserted into the optical fiber group accommodating openings in a one-to-one correspondence manner, the optical fibers are suitable for being arranged opposite to the optical through holes in a one-to-one correspondence manner, and the optical fibers in the optical fiber groups can realize one-time accurate alignment through the positioning carrier plate and the optical through holes in the optical component carrier plate, so that rapid optical coupling can be realized; meanwhile, the optical fiber group comprises a plurality of discrete optical fibers, and the optical component carrier plate is internally provided with a plurality of optical through hole groups which are arrayed, so that ultra-large-capacity optical interconnection can be realized, and the interconnection carrier plate can realize one-time alignment to realize the ultra-large-capacity optical interconnection and simple and rapid optical coupling.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an interconnection carrier provided in an embodiment of the present invention;
FIG. 2 is a schematic diagram of a structure of a light through hole set according to an embodiment of the present invention;
FIG. 3 is a top view of a positioning carrier structure according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a package structure according to another embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
The present invention provides an interconnection carrier plate, referring to fig. 1, comprising:
the optical component carrier plate 1 is provided with a plurality of optical through hole groups 101 which are arranged in an array manner, wherein each optical through hole group 101 comprises a plurality of discrete optical through holes which penetrate through the optical component carrier plate 1;
the positioning carrier plate 2 is provided with a plurality of optical fiber group accommodating openings 201 penetrating through the positioning carrier plate 2, the positioning carrier plate 2 is attached to one side surface of the optical component carrier plate 1, and the optical fiber group accommodating openings 201 are communicated with the optical through hole groups 101 in a one-to-one correspondence manner;
the array optical fiber assembly 3, the array optical fiber assembly 3 comprises a plurality of discrete optical fiber groups 301, the optical fiber groups 301 comprise a plurality of discrete optical fibers, the optical fiber groups 301 are suitable for being inserted into the optical fiber group accommodating openings 201 in a one-to-one correspondence manner, and the optical fibers are suitable for being arranged opposite to the optical through holes in a one-to-one correspondence manner.
In one embodiment, the positioning carrier 2 further has a positioning hole 202 located at a side portion of the optical fiber set accommodating opening 201 and spaced from the optical fiber set accommodating opening 201.
In one embodiment, the aperture of the positioning hole 202 is 200um-2000um; for example 1000um; if the aperture of the positioning hole 202 is smaller than 200um, the bonding strength between the positioning hole 202 and the positioning member 4 is not beneficial to assembly; if the aperture of the positioning hole 202 is larger than 2000um, the difficulty of the process of forming the positioning hole 202 is large, which is also unfavorable for increasing the mechanical strength of the positioning carrier plate 2.
In one embodiment, the array fiber optic assembly 3 further includes a cladding layer 302 securing adjacent ones of the fiber optic groups 301.
In one embodiment, the interconnection carrier further comprises: a first positioning member 4, one end of the first positioning member 4 is inserted into the cladding layer 302 on the side of the optical fiber set 301, and the other end of the first positioning member 4 is adapted to be inserted into the positioning hole 202. The other end of the first positioning member 4 is adapted to be inserted into the positioning hole 202, so that the optical fibers in the optical fiber group and the optical through holes in the optical component carrier plate can be aligned precisely once, and simple and rapid optical coupling is realized.
The first positioning member 4 includes a latch.
In one embodiment, the positioning hole 202 is filled with a buffer layer, and the other end of the first positioning member 4 is inserted into the buffer layer. The buffer layer can enable the first positioning piece 4 to be better embedded in the positioning hole 202, a buffer layer is arranged between the first positioning piece 4 and the side wall of the positioning hole 202, and the buffer layer can better fix the first positioning piece 4.
In one embodiment, the material of the buffer layer comprises teflon; in other embodiments, other non-conductive wear resistant materials may also be included.
In one embodiment, referring to fig. 2, the plurality of optical through holes 103 in the optical through hole group 101 are all circumscribed by the characteristic circle 104, the optical fiber group accommodating opening 201 is a circular hole, and the diameter of the optical fiber group accommodating opening 201 is larger than the diameter of the characteristic circle 104.
In one embodiment, the difference between the diameter of the fiber optic set receiving opening 201 and the diameter of the feature circle 104 is 5um-20um, such as 15um; if the difference between the diameter of the fiber set accommodating opening 201 and the diameter of the feature circle 104 is less than 5um, the difficulty of inserting the array fiber assembly 3 into the optical assembly carrier 1 is great, so that the coupling efficiency of the interconnection carrier is not obviously improved; if the difference between the diameter of the optical fiber set accommodating opening 201 and the diameter of the feature circle 104 is greater than 20um, the alignment accuracy between the center of the optical fiber in the array optical fiber assembly 3 and the light emitting area or the light receiving area of the optical chip in the optical through hole in the optical assembly carrier 1 is reduced.
In one embodiment, the diameter of the optical through hole 103 is 10um-30um, such as 20um; the diameter of the optical through hole 103 is matched with the optical fiber, and the diameter of the optical through hole 103 is 10um-30um, so that the optical through hole 103 is smaller, and therefore, the optical through hole 103 with higher density can be arranged in the optical component carrier plate 1, the integration level of the interconnection carrier plate is improved, and if the diameter of the optical through hole 103 is smaller than 10um, the process difficulty of forming the optical through hole 103 is increased, and the filling of a medium material is also unfavorable; if the diameter of the optical through holes 103 is greater than 30um, the number of the optical through holes 103 arranged in the optical module carrier 1 is too small, which is not beneficial to improving the integration level of the interconnection carrier.
In one embodiment, with continued reference to fig. 2, a second positioning member 105 is further disposed in the optical component carrier 1, the opening of the optical through hole set 101 exposes the second positioning member 105, and the center of the feature circle 104 is located on the second positioning member 105.
In one embodiment, the light through hole 103 is a hollow structure.
In another embodiment, the optical through hole 103 is filled with a polymer material, and the light transmittance of the polymer material in the wavelength range of 800um-1600um is greater than 90%. The polymer material includes photoresist or other polymer material with high light transmittance and easy solidification. The optical through hole 103 is filled with a polymer material, so that transmission loss of optical signals can be reduced.
In one embodiment, the polymeric material has a refractive index of 1.47 to 1.57, for example 1.50; if the refractive index of the polymeric material is less than 1.47, mode field matching between the optical signals in the optical through-holes 103 and the optical signals of the optical fibers in the array fiber optic assembly 3 is not favored; if the refractive index of the polymer material is greater than 1.57, it is disadvantageous to reduce the transmission loss of the optical signal in the polymer.
In one embodiment, referring to fig. 3, a side surface of the positioning carrier plate 2 facing away from the optical component carrier plate 1 has a positioning component 203 disposed around the optical fiber set accommodating opening 201, and the positioning component 203 is located between the optical component carrier plate 1 and the positioning carrier plate 2.
The material of the positioning assembly 203 comprises metal.
The positioning component 203 can improve the alignment accuracy of the optical fiber set 301 and the optical through hole set 101.
In one embodiment, a side surface of the optical component carrier 1 facing away from the positioning carrier 2 is provided with a carrier pad 5; the optical component carrier 1 further has an electrical connector 102 penetrating through the optical component carrier 1, and the electrical connector 102 is spaced from the optical through hole group 101.
In one embodiment, the interconnection carrier further comprises: and the interconnection line 6 is positioned on one side of the partial optical component carrier plate 1, one end of the interconnection line 6 is connected with the carrier plate bonding pad 5, and the other end of the interconnection line 6 is connected with the electric connecting piece 102.
In one embodiment, the interconnection carrier further comprises: the optical chip 7 is located at one side of a part of the optical component carrier plate 1 away from the positioning carrier plate 2, and the optical chip 7 is electrically connected with the carrier plate bonding pad 5 and is arranged opposite to the plurality of discrete optical through hole groups 101.
In one embodiment, the interconnection carrier further comprises: the electric chip 8, the electric chip 8 and the positioning carrier plate 2 are located on the same side of the optical component carrier plate 1, the electric chip 8 is located on the side portion of the positioning carrier plate 2, and the electric chip 8 is electrically connected with the electric connecting piece 102.
In one embodiment, the interconnection carrier further comprises: and the solder balls 9 are positioned on the surface of the interconnection line 6.
Another embodiment of the present invention further provides a package structure, referring to fig. 4, including:
a master plate A;
the exchange chip B is positioned on the master plate and is electrically connected with the master plate A;
the interconnection carrier board C provided by the previous embodiments and located on the master a and around the exchange chip B; and the interconnection carrier plate C is electrically connected with the master plate A.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.
Claims (12)
1. An interconnect carrier plate, comprising:
the optical component carrier plate is provided with a plurality of optical through hole groups which are arranged in an array manner, and each optical through hole group comprises a plurality of discrete optical through holes which penetrate through the optical component carrier plate;
the positioning carrier plate is provided with a plurality of optical fiber group accommodating openings penetrating through the positioning carrier plate, the positioning carrier plate is attached to one side surface of the optical assembly carrier plate, and the optical fiber group accommodating openings are correspondingly communicated with the optical through hole groups one by one;
the array optical fiber assembly comprises a plurality of discrete optical fiber groups and a coating layer for fixing the adjacent optical fiber groups, wherein the optical fiber groups comprise a plurality of discrete optical fibers, the optical fiber groups are suitable for being inserted into the accommodating openings of the optical fiber groups in a one-to-one correspondence manner, and the optical fibers are suitable for being arranged opposite to the optical through holes in a one-to-one correspondence manner;
the positioning carrier plate is also provided with positioning holes which are positioned at the side part of the optical fiber group accommodating opening and are arranged at intervals with the optical fiber group accommodating opening;
the interconnection carrier plate further comprises: and one end of the first positioning piece is inserted into the coating layer at the side part of the optical fiber group, and the other end of the first positioning piece is suitable for being inserted into the positioning hole.
2. The interconnected carrier plate of claim 1, wherein the positioning holes have a pore size of 200um-2000um.
3. The interconnected carrier plate according to claim 1, wherein the positioning holes are filled with a buffer layer, and the other end of the first positioning member is inserted into the buffer layer.
4. The interconnect carrier of claim 3, wherein the material of the buffer layer comprises teflon.
5. The interconnected carrier plate of claim 1, wherein a plurality of the optical through holes in the optical through hole group each circumscribe a characteristic circle, the optical fiber group receiving opening is in the shape of a circular hole, and the diameter of the optical fiber group receiving opening is larger than the diameter of the characteristic circle.
6. The interconnect carrier of claim 5, wherein a difference between a diameter of the fiber bundle receiving opening and a diameter of the feature circle is between 5um and 20um.
7. The interconnect carrier of claim 1, wherein the diameter of the optical through holes is 10um-30um.
8. The interconnected carrier plate of claim 1, wherein the optical through holes are hollow structures; or the optical through hole is filled with a polymer material, and the light transmittance of the polymer material in the wavelength range of 800um-1600um is greater than 90%.
9. The interconnected carrier plate of claim 8, wherein the polymeric material has a refractive index of 1.47-1.57.
10. The interconnected carrier of claim 1, wherein a side surface of the optical component carrier facing away from the positioning carrier is provided with a carrier pad; the optical assembly carrier plate is also provided with an electric connecting piece penetrating through the optical assembly carrier plate, and the electric connecting piece and the optical through hole group are arranged at intervals;
the interconnection carrier plate further comprises: the interconnection line is positioned on one side of the partial optical component carrier plate, one end of the interconnection line is connected with the carrier plate bonding pad, and the other end of the interconnection line is connected with the electric connecting piece; the optical chip is positioned on one side of a part of the optical component carrier plate, which is away from the positioning carrier plate, is electrically connected with the carrier plate bonding pad and is arranged opposite to the plurality of discrete optical through hole groups; the electric chip and the positioning carrier plate are positioned on the same side of the optical assembly carrier plate, the electric chip is positioned on the side part of the positioning carrier plate, and the electric chip is electrically connected with the electric connecting piece.
11. The interconnect carrier of claim 10, further comprising: and the solder balls are positioned on the surface of the interconnection line.
12. A package structure, comprising:
a master;
the exchange chip is positioned on the master plate and is electrically connected with the master plate;
a plurality of interconnected carrier plates according to any one of claims 1 to 11 located on the master and around the switching chip; the interconnection carrier plate is electrically connected with the master plate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111636382.3A CN114280736B (en) | 2021-12-28 | 2021-12-28 | Interconnection carrier plate and packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111636382.3A CN114280736B (en) | 2021-12-28 | 2021-12-28 | Interconnection carrier plate and packaging structure |
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| CN114280736A CN114280736A (en) | 2022-04-05 |
| CN114280736B true CN114280736B (en) | 2023-09-26 |
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| JPH06324237A (en) * | 1993-05-14 | 1994-11-25 | Furukawa Electric Co Ltd:The | Production of optical fiber array |
| JP2000284151A (en) * | 1999-03-30 | 2000-10-13 | Furukawa Electric Co Ltd:The | Surface type light receiving and emitting element module |
| TW201432336A (en) * | 2013-02-04 | 2014-08-16 | Shao-Hsuan Chen | High density optical transceiver module |
| CN110244416A (en) * | 2019-07-05 | 2019-09-17 | 上海先方半导体有限公司 | A kind of optical interconnection module and its assembly device |
| CN110261974A (en) * | 2019-07-05 | 2019-09-20 | 上海先方半导体有限公司 | A kind of optical interconnection module and the system comprising optical interconnection module |
| CN110764196A (en) * | 2019-09-09 | 2020-02-07 | 浙江大学 | Guide pin-free pluggable alignment structure for coupling optical fiber array and planar optical waveguide |
| CN112485868A (en) * | 2020-11-03 | 2021-03-12 | 中航光电科技股份有限公司 | Photoelectric converter and composite photoelectric plate connection coupling structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002350673A (en) * | 2001-05-23 | 2002-12-04 | Nippon Sheet Glass Co Ltd | Optical module and its assembling method |
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2021
- 2021-12-28 CN CN202111636382.3A patent/CN114280736B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06324237A (en) * | 1993-05-14 | 1994-11-25 | Furukawa Electric Co Ltd:The | Production of optical fiber array |
| JP2000284151A (en) * | 1999-03-30 | 2000-10-13 | Furukawa Electric Co Ltd:The | Surface type light receiving and emitting element module |
| TW201432336A (en) * | 2013-02-04 | 2014-08-16 | Shao-Hsuan Chen | High density optical transceiver module |
| CN110244416A (en) * | 2019-07-05 | 2019-09-17 | 上海先方半导体有限公司 | A kind of optical interconnection module and its assembly device |
| CN110261974A (en) * | 2019-07-05 | 2019-09-20 | 上海先方半导体有限公司 | A kind of optical interconnection module and the system comprising optical interconnection module |
| CN110764196A (en) * | 2019-09-09 | 2020-02-07 | 浙江大学 | Guide pin-free pluggable alignment structure for coupling optical fiber array and planar optical waveguide |
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| CN114280736A (en) | 2022-04-05 |
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